Mixed acid spraying etching machine

Abstract

The invention discloses a mixed acid spray etching machine, which relates to the technical field of wafer spray etching and comprises an outer basket and an inner basket which are placed in a spray tank, and a rotating rod and an elastic roller which are rotatably mounted below the spray tank. The rotating rod is rotatably mounted at the bottom of the spraying groove, and the elastic roller is fixedly sleeved on the rotating rod, so that when a wafer is placed in the spraying groove through the outer basket and the inner basket for spraying and etching, the wafer can be driven to continuously rotate in the process that the rotating rod drives the elastic roller to rotate by virtue of contact between the outer surface of the elastic roller and the bottom of the wafer, and the wafer can be uniformly sprayed and etched. The contact position of the wafer and the clamping groove is continuously changed, spraying etching operation without dead angles is achieved, the comprehensiveness and stability of the device in the spraying machining process are improved to a certain degree, and waste caused by uneven etching of the edge position after wafer spraying etching can be effectively avoided.

Description

Technical Field

[0001] The invention relates to the technical field of wafer spray etching, in particular to a mixed acid spray etching machine. Background Art

[0002] In the field of semiconductor manufacturing, the wafer etching process is crucial. Its accuracy and uniformity directly determine the performance and yield of the chip. As semiconductor technology continues to develop towards smaller size and higher integration, the requirements for wafer etching processing are becoming increasingly stringent. In the existing technology, mixed acid spray etching devices are commonly used equipment in wafer etching processing.

[0003] During the wafer spray etching process, in order to ensure that each wafer maintains a stable separation state and avoid the wafers sticking to each other and affecting the effect of spray etching, a basket is usually used to carry the wafers in the spray etching device. During the spray etching process, the mixed acid solution is sprayed from top to bottom onto the wafer surface through the nozzle, and the chemical reaction between the mixed acid and the wafer material is used to remove the unnecessary parts to complete the etching process of the wafer. During the spraying process, when the wafer is inserted into the basket, there is a contact point between the edge of the wafer and the basket, which will inevitably form a spray dead angle at the contact position. The wafers in these dead angles cannot fully contact the sprayed mixed acid solution, resulting in incomplete etching, thereby resulting in uneven etching at the edge of the wafer. After the etching is completed, it is difficult to meet the use requirements, resulting in waste of edge positions.

[0004] Therefore, a mixed acid spray etching machine is proposed to solve some problems existing in the above-mentioned prior art. Summary of the invention

[0005] The purpose of the present invention is to solve the problem that during the spray etching process of the wafer, due to the contact between the edge of the wafer and the basket, there is a spray dead angle at the contact position, which affects the etching uniformity at the contact position after spraying and easily causes waste of the edge area of ​​the wafer. A mixed acid spray etcher is proposed.

[0006] In order to solve the problems existing in the prior art, the present invention adopts the following technical solutions: A mixed acid spray etching machine comprises a main body, wherein a pure water spray area and a weak acid spray area are sequentially arranged in the main body from left to right, spray troughs are fixedly installed in the areas corresponding to the pure water spray area and the weak acid spray area, an electric conveyor belt is installed in the main body and is located on the left side of the pure water spray area, a gantry manipulator is installed in the main body and is located above the pure water spray area, the weak acid spray area and the electric conveyor belt, an outer basket is placed in the spray trough, and the outer basket comprises a symmetrically arranged first side plate, round rods are fixedly connected at the four corners between the two first side plates, a symmetrically arranged first bracket is fixedly connected between the two first side plates, a plurality of inner baskets are mounted on the symmetrically arranged two first brackets, and the inner basket comprises a symmetrically arranged second side plate, a plurality of second brackets are fixedly connected between the two second side plates, and a plurality of evenly distributed card slots are opened on the side of the second bracket close to the center position of the second side plate, a rotating rod located below the middle position of the second side plate is rotatably installed inside the spray trough, and an elastic roller is fixedly installed on the rotating rod.

[0007] Preferably, a surrounding annular groove is fixedly installed above the spray groove, and a symmetrically arranged groove surface is rotatably installed in the annular groove, the groove surface covers the top of the spray groove, a spray pipe located in the spray groove is fixedly installed at the bottom of the spray groove, and a large number of evenly distributed spray heads are fixedly connected to the bottom of the spray pipe.

[0008] Preferably, a pad block corresponding to the bottom of the first side plate is fixedly mounted on the bottom of the spray tank, and an inclined guide plate is fixedly mounted on the inner end walls corresponding to the four corners of the bottom of the spray tank.

[0009] Preferably, a rangefinder corresponding to the center position of the second side plate is fixedly mounted on the inner end wall of the spray tank, a first through slot corresponding to the rangefinder is opened on the first side plate, and a second through slot corresponding to the rangefinder is opened on the second side plate.

[0010] Preferably, the gantry manipulator includes a laterally sliding moving platform, a laterally arranged first rack is fixedly installed at the upper position of the main body, a first motor is fixedly installed on the moving platform, and a first gear meshing with the first rack is fixedly installed on the driving shaft of the first motor, a vertically arranged main arm is slidably installed on the moving platform, and a lifting platform is fixedly installed on the bottom end of the main arm, a vertically arranged second rack is fixedly installed on the main arm, a second motor is fixedly installed on the moving platform, and a second gear meshing with the second rack is fixedly installed on the driving shaft of the second motor, symmetrically arranged hooks are slidably installed on the lifting platform, an electric push rod is fixedly installed on the lifting platform, and the telescopic end of the electric push rod is fixedly connected to the hook.

[0011] Preferably, a first linear rail parallel to the first rack is fixedly installed at the upper position inside the main body, the mobile platform is slidably installed on the first linear rail through a slider, a second linear rail parallel to the first rack is fixedly installed on the main arm, a slider adapted to the second linear rail is fixed on the mobile platform, a third linear rail arranged horizontally is fixed on the lifting platform, and the hook is slidably installed on the third linear rail through a slider.

[0012] Preferably, the elastic roller is provided with a hollow structure, an air flow channel connected to the hollow structure in the elastic roller is opened in the rotating rod, an adapter rotatably connected to the air flow channel is fixedly installed on the outer end wall of the spray trough, and an air pressure sensor is installed in the hollow structure in the elastic roller.

[0013] Preferably, an air supply channel is opened in the pad block, a first interface connected to the air supply channel is opened at the bottom of the first side panel, a second interface connected to the first interface is opened at the top of the first bracket, a third interface connected to the second interface is opened on the second side panel, and spray holes connected to the third interface are opened on the symmetrical inner end walls on both sides of the slot.

[0014] Preferably, valve components are installed at the positions where the air supply channel and the first interface, the second interface and the third interface are connected to each other. The valve components include a valve body, and a vertically arranged through pipe and an air connecting channel connected to the inner end wall of the through pipe are opened in the valve body. A valve block for blocking the connecting air channel is slidably installed in the port of the through pipe, and a spring for elastically supporting the valve block is fixedly installed in the through pipe. The valve blocks in the two valve components connected up and down repel each other magnetically.

[0015] Preferably, a heater is provided on the outside of the main body, and a heating water tank is installed in the heater, an electric heating unit is fixedly installed at the bottom of the heating water tank, a circulation pipeline is constructed between the bottom of the spray tank located in the weak acid spray area and the heating water tank, and a water pump is installed on the circulation pipeline.

[0016] Compared with the prior art, the present invention has the following beneficial effects: 1. In the present invention, the rotating rod is rotatably installed at the bottom of the spray tank, and the elastic roller is fixedly sleeved on the rotating rod, so that when the wafer is placed in the spray tank through the outer basket and the inner basket for spray etching, the outer surface of the elastic roller is in contact with the bottom of the wafer, so that the rotating rod drives the elastic roller to rotate, and the wafer can be driven to rotate continuously, and the contact position between the wafer and the card slot is continuously changed, so as to realize the spray etching operation without dead angles, and to a certain extent improve the comprehensiveness and stability of the device during spray processing, and can effectively avoid the waste of the edge position due to uneven etching after the wafer is sprayed and etched; 2. In the present invention, by fixing the rangefinder on the inner end wall of the spray tank, and opening the first through slot corresponding to the rangefinder on the first side plate, and opening the second through slot corresponding to the rangefinder on the second side plate, the rangefinder can directly irradiate the first wafer during the spraying process, measure the distance between the first wafer and the rangefinder in real time, monitor the thickness of the wafer, and calculate the thinning amount, so that the mixed acid spray etching operation can be stopped in time after the thinning is in place, thereby improving the processing accuracy of the device to a certain extent; 3. In the present invention, the elastic roller is set as an inflatable and deflated hollow structure, and an airflow channel connected to the hollow structure in the elastic roller is opened in the rotating rod. By means of the rotational connection between the adapter on the outer end wall of the spray tank and the airflow channel, the device can inflate and deflate the elastic roller through an air pump. The contact tightness between the outer surface of the elastic roller and the wafer can be strengthened by inflation and expansion, and the smoothness and stability of the wafer driven to rotate by the elastic roller during the spraying process can be improved to a certain extent. At the same time, by installing an air pressure sensor in the elastic roller and calculating the inflation amount in the elastic roller, the compressive strength of the outer surface of the elastic roller can be detected, thereby determining the contact degree between the outer surface of the elastic roller and the wafer, which is conducive to improving the convenience of operation of the device. 4. In the present invention, by opening the spray holes on two symmetrical inner end walls on the inner side of the card slot, with the help of the air supply channel, the first interface, the third interface, the third interface and the spray holes, high-pressure airflow can be sprayed out through the spray holes, acting on the end walls on both sides of the wafer contact position. With the help of airflow, the contact area of ​​the wafer inserted in the card slot can be greatly reduced, which can not only effectively improve the smoothness of the wafer rotation driven by the elastic roller during the spraying process, but also reduce the wear of the edge position of the outer surface of the wafer when it contacts the inner wall of the card slot during the rotation, which is beneficial to improving the quality of the wafer after spraying. At the same time, by arranging valve parts at each end position, with the help of the elastic support of the spring, the port of the through pipe can be blocked by the valve block when not in use to prevent foreign matter from entering, which is beneficial to ensure the stability of the device during long-term use. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The drawings described herein are used to provide a further understanding of the present invention and constitute a part of this application. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation of the present invention. In the drawings: Figure 1 A top view of the present invention; Figure 2 For the present invention Figure 1 Sectional view at AA in the middle; Figure 3 For the present invention Figure 1 Sectional view at the middle BB; Figure 4 A perspective view of the present invention; Figure 5 A three-dimensional diagram of the outer basket of the present invention placed in the spray tank; Figure 6 A three-dimensional diagram of the interior of the spray tank of the present invention; Figure 7 It is a cross-sectional view of the internal structure of the spray tank of the present invention; Figure 8 For the present invention Figure 7 Enlarged view of point C in the middle; Fig. 9 A three-dimensional diagram of the inner basket of the present invention placed in the outer basket; Fig.10 is a three-dimensional diagram of the inner basket of the present invention; Fig.11 For the present invention Figure 5 Top view of the middle structure after removing the groove surface; Fig.12 For the present invention Fig.11 Sectional view at DD in the middle; Fig.13 For the present invention Fig.11 Cross-sectional view at EE in the middle.

[0018] Serial number in the picture: 1. Main body; 101. Pure water spraying area; 102. Weak acid spraying area; 2. Spraying trough; 201. Ring groove; 202. Groove surface; 203. Spraying pipe; 204. Spraying head; 205. Pad; 206. Guide plate; 207. Distance meter; 3. Electric conveyor belt; 4. Gantry manipulator; 401. Moving platform; 402. First rack; 403. First motor; 404. First gear; 405. Main arm; 406. Lifting platform; 407. Second rack; 408. Second motor; 409. Second gear; 410. Hook; 411. Electric push rod; 412. First linear rail; 413. Second linear rail; 414. Third linear rail; 5. outer basket; 501. first side plate; 502. round rod; 503. first bracket; 504. limit rod; 505. first through slot; 6. inner basket; 601. second side plate; 602. second bracket; 603. slot; 604. second through slot; 7. Rotating rod; 701. Elastic roller; 702. Air flow channel; 703. Adapter; 8. Air supply channel; 801. First interface; 802. Second interface; 803. Third interface; 804. Spray hole; 805. Valve member; 8051. Valve body; 8052. Through pipe; 8053. Air connection channel; 8054. Valve block; 8055. Spring; 9. Heating machine; 901. Heating water tank. DETAILED DESCRIPTION

[0019] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0020] Embodiment: This embodiment provides a mixed acid spray etching machine, see Figure 1 - Fig.13 Specifically, it includes a main body 1, in which a pure water spray area 101 and a weak acid spray area 102 are arranged from left to right in sequence, and spray tanks 2 are fixedly installed in the areas corresponding to the pure water spray area 101 and the weak acid spray area 102, and a surrounding annular groove 201 is fixedly installed above the spray tank 2, and a symmetrically arranged groove surface 202 is rotatably installed in the annular groove 201, and the groove surface 202 covers the top of the spray tank 2, and a spray pipe 203 located in the spray tank 2 is fixedly installed at the bottom of the spray tank 2, and a plurality of evenly distributed spray heads 204 are fixedly connected to the bottom of the spray pipe 203.

[0021] The main body 1 is provided with an electric conveyor belt 3 located on the left side of the pure water spraying area 101, and the main body 1 is provided with a gantry manipulator 4 located above the pure water spraying area 101, the weak acid spraying area 102 and the electric conveyor belt 3. The gantry manipulator 4 includes a laterally sliding moving platform 401, a laterally arranged first rack 402 is fixedly installed at the upper position of the main body 1, a first motor 403 is fixedly installed on the moving platform 401, and a first gear 404 meshing with the first rack 402 is fixed on the driving shaft of the first motor 403, and the moving platform 401 slides upward. A vertically arranged main arm 405 is dynamically installed, and a lifting platform 406 is fixedly installed at the bottom end of the main arm 405, a vertically arranged second rack 407 is fixedly installed on the main arm 405, a second motor 408 is fixedly installed on the moving platform 401, and a second gear 409 meshing with the second rack 407 is fixedly installed on the driving shaft of the second motor 408, a symmetrically arranged hook 410 is slidably installed on the lifting platform 406, an electric push rod 411 is fixedly installed on the lifting platform 406, and the telescopic end of the electric push rod 411 is fixedly connected to the hook 410.

[0022] A first linear rail 412 parallel to the first rack 402 is fixedly installed at the upper position inside the main body 1, the mobile platform 401 is slidably installed on the first linear rail 412 through a slider, a second linear rail 413 parallel to the first rack 402 is fixedly installed on the main arm 405, a slider adapted to the second linear rail 413 is fixed on the mobile platform 401, a third linear rail 414 arranged horizontally is fixed on the lifting platform 406, and the hook 410 is slidably installed on the third linear rail 414 through a slider.

[0023] An outer basket 5 is placed in the spray tank 2, and the outer basket 5 includes a symmetrically arranged first side plate 501, a round rod 502 is fixedly connected at the four corners between the two first side plates 501, a symmetrically arranged first bracket 503 is fixedly connected between the two first side plates 501, and a limit rod 504 symmetrically arranged on the outside of the two first brackets 503 is fixedly connected between the two first side plates 501. A plurality of inner baskets 6 are mounted on the two symmetrically arranged first brackets 503, and the inner basket 6 includes a symmetrically arranged second side plate 601, a plurality of second brackets 602 are fixedly connected between the two second side plates 601, and a plurality of evenly distributed card slots 603 are opened on one side of the second bracket 602 close to the center position of the second side plate 601, and a rotating rod 7 located below the middle position of the second side plate 601 is rotatably installed inside the spray tank 2, and an elastic roller 701 is fixedly installed on the rotating rod 7, and the elastic roller 701 is made of thermoplastic polyurethane material, which makes it have good chemical corrosion resistance and can resist the erosion of various acids, alkalis and solvents.

[0024] During the operation of the device, the wafers to be sprayed are placed in the inner basket 6 in sequence, and the wafers are inserted into the corresponding slots 603 on the plurality of second brackets 602, so that the plurality of wafers are erected in the inner basket 6, and then the staff places the inner basket 6 loaded with wafers in the outer basket 5, and stably sets the plurality of inner baskets 6 in the outer basket 5 through the first brackets 503 symmetrically arranged in the outer basket 5, and then the staff places the outer basket 5 on the electric conveyor belt 3, ready to be transported to the main body 1 for spray etching of the wafers, and the outer basket 5 enters the main body 1 under the transportation of the electric conveyor belt 3, and then the gantry manipulator 4 arranged above the main body 1 performs hoisting and grabbing operations on the outer basket 5, and according to the operation requirements of the wafers, the outer basket 5 is placed in the spray tank 2 at the corresponding position of the pure water spray area 101, or in the spray tank 2 at the corresponding position of the weak acid spray area 102.

[0025] When the gantry manipulator 4 is used to lift the outer basket 5, the first motor 403 is powered on and started, driving the first gear 404 fixedly mounted on its driving shaft to rotate. With the help of the meshing of the teeth between the first gear 404 and the first rack 402, the moving platform 401 can be driven to slide laterally along the first linear rail 412. When the moving platform 401 drives the lifting platform 406 to move to the outer basket 5 placed above the right end of the electric conveyor belt 3, the second motor 408 is powered on and started, which can drive the second gear 409 fixedly connected to its driving shaft to rotate. With the help of the meshing of the second gear 409 and the second rack 407, the main arm 405 is driven to slide up and down along the second linear rail 413, thereby controlling the lifting platform 406 to move up and down. In the process of the lifting platform 406 driving the hook 410 to move down to the position above the outer basket 5, under the power-on control of the electric push rods 411 on the left and right sides, the left and right sides are The hooks 410 on the side move synchronously to the middle position of the lifting platform 406. After the lower end of the hook 410 is driven by the lifting platform 406 to drop to between the left and right round rods 502 in the upper position of the outer basket 5, the electric push rod 411 is started in the reverse direction, so that the hooks 410 on the left and right sides are hooked on the left and right round rods 502, and then the lifting platform 406 is controlled to drive the outer basket 5 to move up, lift the outer basket 5, and the moving platform 401 moves to the right under the drive of the first motor 403. At this time, the groove surface 202 symmetrically arranged on the upper end of the spray tank 2 to be used is turned over and opened under the drive of the pneumatic push rod, and the gantry manipulator 4 hoisted the outer basket 5 and then moved to accurately place the outer basket 5 into the spray tank 2 to be used, and then the hook 410 releases the hook connection with the round rod 502, and the lifting platform 406 rises and exits the spray tank 2, preparing for subsequent hoisting operations of other outer baskets 5.

[0026] In the process of using the gantry manipulator 4 to hoist the mobile outer basket 5, the tooth meshing between the first gear 404 and the first rack 402, and the tooth meshing between the second gear 409 and the second rack 407 are used for driving, so that the movement accuracy of the gantry manipulator 4 in the process of hoisting the outer basket 5 can be effectively improved. By using the first linear rail 412 as the track for the lateral movement of the moving platform 401, using the second linear rail 413 as the track for the up and down movement of the lifting platform 406, and using the third linear rail 414 as the track for the lateral movement of the hook 410, the bearing capacity of the gantry manipulator 4 in the process of hoisting the outer basket 5 can be effectively improved, and the operation process is more stable and accurate.

[0027] When the outer basket 5 is hoisted into the spray tank 2, the limit rods 504 symmetrically arranged on the left and right can limit the outer basket 5, so that the outer basket 5 is more accurately located in the spray tank 2. During the activation of the spray tank 2, the groove surfaces 202 symmetrically arranged in the ring groove 201 at the upper port of the spray tank 2 are flipped and closed under the drive of the pneumatic push rod, tightly covering the upper port of the spray tank 2. When the outer basket 5 is in the spray tank 2 at the corresponding position of the pure water spray area 101, the device can perform pure water spray cleaning on the numerous wafers mounted in the inner basket 6 in the outer basket 5. When the outer basket 5 is in the spray tank 2 at the corresponding position of the weak acid spray area 102, the device can perform mixed acid spray etching on the numerous wafers mounted in the inner basket 6 in the outer basket 5.

[0028] The spray tank 2 at the corresponding position of the pure water spray area 101 is made of 15mmNPP plate welded by Roechling, and its effective size is about 1365mm*2170mm*865mm. It is made of NPP plate welding and has an external NPP reinforcement plate design. A pipe drainage is provided at the bottom of the corresponding spray tank 2, and the waste liquid can be directly discharged into the sewage tank. When pure water spraying, two pure water storage tanks are provided corresponding to the spray tank 2 at the pure water spray area 101. The capacity of each pure water storage tank is 1000L, one of which is used for self-circulating spray reflux, and the other is used for pure water spraying. The spray pump used for self-circulating spray reflux in the spray tank 2 at the pure water spray area 101 adopts Wannan Chemical Pump with a power of 5.5kW, which is controlled by a frequency converter and the flow rate is adjusted by a frequency converter. The spray pump used for pure water spraying in the spray tank 2 adopts SUS316 Southern pump with a power of 5.5kW and is controlled by a frequency converter. During operation, driven by the pure water spray pump, pure water in a pure water storage tank is transported to the spray pipe 203 fixed at the bottom of the upper groove surface 202 in the spray tank 2 in the pure water spray area 101, and sprayed downward through the spray head 204. Pure water is sprayed from top to bottom, and the numerous wafers set up in the inner basket 6 can be fully covered and sprayed without dead ends. The water from the pure water spray flows back to the self-circulating liquid storage tank, and the excess overflow is made of PPH material and is equipped with an acid-resistant diaphragm valve. It can be manually drained. After switching to pure water, gravity discharge is adopted to discharge the wastewater into the wastewater pool. The diaphragm valve is manually controlled, so that the operator can flexibly adjust according to production needs and the operation is convenient.

[0029] The spray tank 2 at the corresponding position of the weak acid spray area 102 is made of 10mm PVDF plate welded by Rolling, and its effective size is about 1365mm*2170mm*865mm. It is made of PVDF plate welding and has an external PVDF reinforcement plate design. A pipe drainage is provided at the bottom of the corresponding spray tank 2, and the waste liquid can be directly discharged into the sewage tank. When the mixed acid spray is carried out, a mixed acid storage tank is provided corresponding to the spray tank 2 at the weak acid spray area 102. The mixed acid is mixed with HF, HCL, H2SO4 and pure water. An acid detection system is provided in the mixed acid storage tank, which can automatically replenish various acid components according to the system prompts. The acid replenishment pump is an Iwaki metering pump. The mixed acid storage tank adopts Rolling 1 2T, PVDF plate welding, its capacity can reach 3000L, the spray pump used for mixed acid spraying adopts Wannan Pump Industry Chemical Pump, the power is 5.5kW, the pipeline is made of PTFE material, in the mixed acid spraying process, through the pumping of the mixed acid spray pump, the mixed acid liquid in the mixed acid storage tank is transported to the spray pipe 203 fixed at the bottom of the upper groove surface 202 of the spray tank 2 in the weak acid spray area 102, and then sprayed out through the spray head 204, the mixed acid liquid is sprayed from top to bottom, and the wafers set up in the inner basket 6 can be fully covered and sprayed without dead angles. Etching operation, when the mixed acid liquid is used for a certain period of time, the mixed acid liquid in the spray tank 2 in the weak acid spray area 102 is pumped to the waste liquid tank for treatment by a magnetic pump.

[0030] When the wafer is placed in the spray tank 2 through the inner basket 6 and the outer basket 5, the wafer stands upright on the elastic roller 701 under the support of the inner basket 6, and the bottom of the wafer contacts the upper surface of the elastic roller 701. The outer surface of the elastic roller 701 is provided with anti-slip wear patterns, which can effectively improve the friction between the outer surface of the elastic roller 701 and the wafer during contact. When spraying is in progress, the rotating rod 7 is driven to rotate by an external servo motor, thereby driving the elastic roller 701 to continuously rotate at the lower position in the spray tank 2. With the help of the contact friction between the elastic roller 701 and the wafer, the wafer can be driven to rotate in the inner basket 6, and the wafer is continuously rotated and thrown, so that the posture of the wafer continues to change during the spraying process. The wafer is driven to rotate 10 times per minute, which can ensure that the contact point between the wafer and the inner basket 6 continues to change, realizing a spraying operation without dead ends, and to a certain extent improving the comprehensiveness and stability of the device during spraying processing.

[0031] An air supply device is provided above each spray tank 2, and an exhaust mechanism is provided in the tank. An exhaust port is provided on the top of the main body 1. The exhaust port is connected through a pipeline via an exhaust fan to extract the volatile reagents in the device to the workshop exhaust duct or outdoors to avoid the diffusion of harmful gases into the room. This is conducive to ensuring that the external environment of the device complies with the relevant standards of labor protection to ensure the health of equipment operators and surrounding staff. The inner diameter of the exhaust port flange is 200mm, and the exhaust volume is 3000m³ per hour. It can be connected to the exhaust gas treatment device, and the gas directly discharged to the outdoors needs to meet environmental protection requirements.

[0032] In the specific implementation process, Figure 6 - Figure 7 and Fig.12 - Fig.13 As shown, a pad 205 corresponding to the bottom of the first side plate 501 is fixedly installed at the bottom of the spray tank 2, and an inclined guide plate 206 is fixedly installed on the inner end wall corresponding to the four corners of the bottom of the spray tank 2. During the operation of the device, the pad 205 corresponding to the first side plate 501 is fixed at the bottom of the spray tank 2, so that the outer basket 5 can be raised after being placed in the spray tank 2, thereby providing sufficient installation space for the rotating rod 7 and the elastic roller 701 at the bottom of the spray tank 2, which is beneficial to ensure the stability of the device during operation to a certain extent. By fixing the inclined guide plate 206 at the four corners of the bottom of the spray tank 2, with the help of the inclined guidance of the guide plate 206, the outer basket 5 is hoisted and placed into the spray tank 2 by the gantry manipulator 4. The position of the outer basket 5 is accurate and constant, which is beneficial to ensure that the subsequent air supply channel 8 and the first interface 801 are conveniently and accurately docked, and the convenience of the device operation process can be improved to a certain extent.

[0033] In the specific implementation process, Figure 3 , Figure 6 and Fig. 9 - Fig.12As shown, a rangefinder 207 corresponding to the center position of the second side plate 601 is fixedly installed on the inner end wall of the spray tank 2, a first through slot 505 corresponding to the rangefinder 207 is provided on the first side plate 501, and a second through slot 604 corresponding to the rangefinder 207 is provided on the second side plate 601. During the operation of the device and the spray processing, the rangefinder 207 can directly irradiate the first wafer through the first through slot 505 provided on the first side plate 501 and the second through slot 604 provided on the second side plate 601, and measure the distance between the first wafer and the rangefinder 207. The rangefinder 207 has a built-in automatic focusing module, which can track the position of the wafer as it shakes during the wafer mixed acid spray etching thinning process, automatically focus, monitor the thickness of the wafer in real time, and calculate the thinning amount, so as to stop the mixed acid spray etching operation in time after the thinning is in place, thereby improving the processing accuracy of the device to a certain extent.

[0034] In the specific implementation process, Figure 2 , Figure 3 and Figure 7 As shown, the elastic roller 701 is provided with a hollow structure, the rotating rod 7 is provided with an air flow channel 702 connected with the hollow structure in the elastic roller 701, an adapter 703 connected with the air flow channel 702 for rotation is fixedly mounted on the outer end wall of the spray tank 2, and an air pressure sensor is installed in the hollow structure in the elastic roller 701. During the operation of the device, the adapter 703 is connected with an air pump, and the air pump can perform air filling and deflating operations in the elastic roller 701 through the connection between the adapter 703 and the air flow channel 702. When the wafer is placed in the spray tank 2 through the outer basket 5 and the inner basket 6, the staff can The air pump is started to inflate the elastic roller 701. Through inflation, the contact tightness between the outer surface of the elastic roller 701 and the wafer can be strengthened, thereby improving the contact friction between the elastic roller 701 and the wafer, and improving the smoothness and stability of the wafer driven by the elastic roller 701 to rotate during spraying. By installing an air pressure sensor in the elastic roller 701 and calculating the inflation amount in the elastic roller 701, the compressive strength of the outer surface of the elastic roller 701 can be detected, thereby determining the degree of contact between the outer surface of the elastic roller 701 and the wafer, which is convenient for the staff to make flexible adjustments.

[0035] In the specific implementation process, Figure 6 - Figure 8 and Fig.10As shown, a gas supply channel 8 is provided in the cushion block 205, a first interface 801 connected to the gas supply channel 8 is provided at the bottom of the first side plate 501, a second interface 802 connected to the first interface 801 is provided on the top of the first bracket 503, a third interface 803 connected to the second interface 802 is provided on the second side plate 601, and spray holes 804 connected to the third interface 803 are provided on the inner end walls on both sides symmetrically in the card slot 603. During the operation of the device, the gas supply channel 8 is connected to an external air pump. When the wafer is placed in the spray tank 2 for spraying, the air pump is started, and the gas supply channel 8 is connected to the first interface 801 through the connection, and the second interface 802 and the third interface 803 are connected. The airflow is delivered to the spray hole 804 for spraying out. Since the spray holes 804 are provided on the symmetrical inner end walls on both sides in each slot 603, the airflow in the slot 603 will be sprayed on the end walls on both sides of the wafer inserted in the slot 603 at the same time. The airflow impact and push can keep the wafer in the middle position in the slot 603 for a long time, which can greatly reduce the contact area between the wafer inserted in the slot 603 and the wafer, which can not only effectively improve the smoothness of the rotation driven by the elastic roller 701 during the wafer spraying process, but also reduce the wear of the edge position of the outer surface of the wafer when it contacts the inner wall of the slot 603 during the rotation, which is beneficial to improving the quality of the wafer after spraying.

[0036] In the specific implementation process, Fig.12 and Fig.13 As shown, valve components 805 are installed at the positions where the air supply channel 8 and the first interface 801, the second interface 802 and the third interface 803 are connected to each other. The valve component 805 includes a valve body 8051, and a vertically arranged through pipe 8052 and an air connecting channel 8053 connected to the inner end wall of the through pipe 8052 are opened in the valve body 8051. A valve block 8054 for blocking the connecting air channel 8053 is slidably installed in the port of the through pipe 8052, and a spring 8055 for elastically supporting the valve block 8054 is fixedly installed in the through pipe 8052, and the valve blocks 8054 in the two valve components 805 connected up and down repel each other magnetically.

[0037] During the operation of the device, by installing the valve member 805 at the end positions of the air supply channel 8, the first interface 801, the second interface 802 and the third interface 803, with the help of the elastic support of the spring 8055 in the valve member 805, when the air supply channel 8 and the first interface 801, the second interface 802 and the third interface 803 are not connected, the valve block 8054 is blocked in the port of the valve body 8051, which can prevent foreign matter from entering the air supply channel 8, the first interface 801, the second interface 802 and the third interface 803. During normal use, when the air supply channel 8 and the first interface 801, the second interface 802 and the third interface 803 are connected, the valve block 8054 is blocked in the port of the valve body 8051. After docking, due to the magnetic repulsion between the valve blocks 8054 in the two valve components 805 that are adapted to each other at the docking position, under the influence of the magnetic repulsion, the valve blocks 8054 in the two valve components 805 at the docking position respectively overcome the elastic support of the corresponding springs 8055 and move away from each other, so that the connection between the through pipe 8052 and the air receiving channel 8053 is connected. In this state, the high-pressure airflow provided by the air pump can flow smoothly in the air supply channel 8, the first interface 801, the second interface 802 and the third interface 803, and finally be ejected through the spray hole 804. By providing the valve component 805, the stability of the device during long-term use can be effectively improved.

[0038] In the specific implementation process, Figure 1 and Figure 4As shown, a heater 9 is provided on the outside of the main body 1, and a heating water tank 901 is installed in the heater 9, and an electric heating unit is fixedly installed at the bottom of the heating water tank 901. A circulation pipeline is constructed between the bottom of the spray tank 2 located at the weak acid spray area 102 and the heating water tank 901, and a water pump is installed on the circulation pipeline. During the operation of the device, when the mixed acid is sprayed, in order to improve the effect of the mixed acid spray etching, a heat exchange heating method is also used to heat the spray tank 2 at the weak acid spray area 102. The water pump installed on the circulation pipeline is a Teflon diaphragm pump. The acid-water mixture in the spray tank 2 at the weak acid spray area 102 is pumped to the coil in the heating water tank 901 through the Teflon diaphragm pump. The acid-water mixture in the coil is heated in the heating water tank 901 and then transported to the spray tank 2 at the weak acid spray area 102. The heating water tank 901 is made of SUS316L steel plate The production is provided with four 6kW stainless steel heating tubes, and the heating water tank 901 is provided with high and low liquid level protection. The water replenishment operation is automatically stopped when the liquid level is high, and the work can be automatically stopped when the liquid level is low to prevent the situation of dry burning without water. The heating water tank 901 is provided with an Omron digital display temperature controller, and the error of temperature control fluctuates within the range of ±2°C. The spray tank 2 at the weak acid spray area 102 is also provided with a digital display temperature controller. When the temperature in the tank body reaches the set temperature, the water pump stops working. The spray tank 2 at the weak acid spray area 102 is provided with a self-circulating pump. The digital display temperature controller is provided with 3 temperature measuring points in the spray tank 2 at the weak acid spray area 102, and it is ensured that a temperature measuring point is installed in the spray pipe 203, which can ensure the temperature balance in the spray tank 2 at the weak acid spray area 102 during mixed acid spray etching, which is beneficial to improve the stability and efficiency of the device for mixed acid spraying of wafers.

[0039] Specifically, the working principle and operation method of the present invention are as follows: The wafers to be sprayed are inserted into the card slots 603 in the inner basket 6 one by one, and then the inner basket 6 filled with wafers is placed on the first bracket 503 symmetrically arranged in the outer basket 5, and the outer basket 5 filled with the inner basket 6 is placed on the electric conveyor belt 3, and is transported to the main body 1 by the electric conveyor belt 3, and then the gantry manipulator 4 installed at the upper position in the main body 1 is started, and according to the processing requirements, the outer basket 5 is hoisted into the spray tank 2 corresponding to the pure water spray area 101 or the weak acid spray area 102, and the wafers are sprayed with pure water in the spray tank 2 at the pure water spray area 101, and the wafers are sprayed with mixed acid in the spray tank 2 at the weak acid spray area 102. During the spraying process, the relevant spray liquid enters the spray pipe 203 through the pumping of the spray pump, and is sprayed downward through the spray head 204, and the wafers are sprayed from top to bottom. The rangefinder 207 on the inner end wall can irradiate the first wafer through the first through slot 505 and the second through slot 604, and monitor the thickness of the wafer in real time. During the spraying process, the air pump inflates the elastic roller 701 through the connection between the adapter 703 and the air flow channel 702, so that the elastic roller 701 is inflated and expanded to strengthen the contact tightness with the upper wafer. Synchronously, another air pump connected to the air supply channel 8 is started, and the air flow is connected through the air supply channel 8, the first interface 801, the second interface 802 and the third interface 803, and is ejected through the nozzle 804, acting on the edge positions of the outer surfaces of both sides of the wafer inserted in the card slot 603. With the help of the air flow, the contact area between the wafer and the card slot 603 is reduced, and then the rotating rod 7 is driven to rotate by the servo motor, driving the elastic roller 701 to rotate, driving the wafer to rotate continuously during the spraying process, and realizing a dead angle spraying operation on the wafer.

[0040] The above are only preferred specific implementation modes of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical solutions and inventive concepts of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A mixed acid spray etching machine, comprising a main body (1), characterized in that: A pure water spraying area (101) and a weak acid spraying area (102) are sequentially arranged in the main body (1) from left to right, and spray troughs (2) are fixedly installed in the areas corresponding to the pure water spraying area (101) and the weak acid spraying area (102). An electric conveyor belt (3) is installed in the main body (1) and is located on the left side of the pure water spraying area (101). A gantry manipulator (4) is installed in the main body (1) and is located above the pure water spraying area (101), the weak acid spraying area (102) and the electric conveyor belt (3). An outer basket (5) is placed in the spray trough (2), and the outer basket (5) includes symmetrically arranged first side panels (501), and the four corners between the two first side panels (501) are fixedly connected. A round rod (502) is connected, a symmetrically arranged first bracket (503) is fixedly connected between the two first side plates (501), a plurality of inner baskets (6) are mounted on the two symmetrically arranged first brackets (503), and the inner baskets (6) include symmetrically arranged second side plates (601), a plurality of second brackets (602) are fixedly connected between the two second side plates (601), and a plurality of evenly distributed slots (603) are provided on one side of the second bracket (602) close to the center of the second side plate (601), and a rotating rod (7) located below the middle position of the second side plate (601) is rotatably installed inside the spray tank (2), and an elastic roller (701) is fixedly installed on the rotating rod (7).

2. The mixed acid spray etching machine according to claim 1, characterized in that: A surrounding annular groove (201) is fixedly mounted above the spray groove (2), and a symmetrically arranged groove surface (202) is rotatably mounted in the annular groove (201), the groove surface (202) covers the top of the spray groove (2), a spray pipe (203) located in the spray groove (2) is fixedly mounted at the bottom of the spray groove (2), and a plurality of evenly distributed spray heads (204) are fixedly connected to the bottom of the spray pipe (203).

3. The mixed acid spray etching machine according to claim 1, characterized in that: A cushion block (205) arranged corresponding to the bottom of the first side plate (501) is fixedly mounted on the bottom of the spray trough (2), and an inclined guide plate (206) is fixedly mounted on the inner end walls corresponding to the four corners of the bottom of the spray trough (2).

4. The mixed acid spray etching machine according to claim 1, characterized in that: A distance meter (207) arranged corresponding to the center position of the second side plate (601) is fixedly mounted on the inner end wall of the spray tank (2); a first through slot (505) arranged corresponding to the distance meter (207) is formed on the first side plate (501); and a second through slot (604) arranged corresponding to the distance meter (207) is formed on the second side plate (601).

5. The mixed acid spray etching machine according to claim 1, characterized in that: The gantry manipulator (4) comprises a transversely sliding mobile platform (401), a transversely arranged first rack (402) is fixedly installed at an upper position in the main body (1), a first motor (403) is fixedly installed on the mobile platform (401), and a first gear (404) meshing with the first rack (402) is fixed on the driving shaft of the first motor (403), a vertically arranged main arm (405) is slidably installed on the mobile platform (401), and a lifting platform (406) is fixedly installed at the bottom end of the main arm (405), A second rack (407) arranged vertically is fixedly mounted on the main arm (405), a second motor (408) is fixedly mounted on the moving platform (401), and a second gear (409) meshing with the second rack (407) is fixedly mounted on the driving shaft of the second motor (408), a symmetrically arranged hook (410) is slidably mounted on the lifting platform (406), an electric push rod (411) is fixedly mounted on the lifting platform (406), and the telescopic end of the electric push rod (411) is fixedly connected to the hook (410).

6. The mixed acid spray etching machine according to claim 5, characterized in that: A first linear rail (412) arranged parallel to the first rack (402) is fixedly installed at an upper position inside the main body (1); the movable platform (401) is slidably installed on the first linear rail (412) via a slider; a second linear rail (413) arranged parallel to the first linear rail (412) is fixedly installed on the main arm (405); a slider adapted to the second linear rail (413) is fixedly installed on the movable platform (401); a third linear rail (414) arranged transversely is fixedly installed on the lifting platform (406); and the hook (410) is slidably installed on the third linear rail (414) via a slider.

7. The mixed acid spray etching machine according to claim 1, characterized in that: The elastic roller (701) is provided with a hollow structure, the rotating rod (7) is provided with an air flow channel (702) connected to the hollow structure in the elastic roller (701), an adapter (703) is fixedly mounted on the outer end wall of the spray trough (2) and is rotatably connected to the air flow channel (702), and an air pressure sensor is installed in the hollow structure in the elastic roller (701).

8. The mixed acid spray etching machine according to claim 3, characterized in that: An air supply channel (8) is provided in the cushion block (205); a first interface (801) connected to the air supply channel (8) is provided at the bottom of the first side plate (501); a second interface (802) connected to the first interface (801) is provided at the top of the first bracket (503); a third interface (803) connected to the second interface (802) is provided on the second side plate (601); and spray holes (804) connected to the third interface (803) are provided on the symmetrical inner end walls on both sides of the slot (603).

9. The mixed acid spray etching machine according to claim 8, characterized in that: A valve component (805) is installed at the positions where the air supply channel (8) and the first interface (801), the second interface (802) and the third interface (803) are connected to each other. The valve component (805) comprises a valve body (8051), and a vertically arranged through pipe (8052) and an air receiving channel (8053) connected to the inner end wall of the through pipe (8052) are opened in the valve body (8051). A valve block (8054) for blocking the connecting air channel (8053) is slidably installed in the port of the through pipe (8052), and a spring (8055) for elastically supporting the valve block (8054) is fixedly installed in the through pipe (8052). The valve blocks (8054) in the two valve components (805) connected to each other magnetically repel each other.

10. The mixed acid spray etching machine according to claim 1, characterized in that: A heater (9) is arranged outside the main body (1), and a heating water tank (901) is installed inside the heater (9); an electric heating unit is fixedly installed at the bottom of the heating water tank (901); a circulation pipeline is constructed between the bottom of the spray tank (2) located at the weak acid spraying area (102) and the heating water tank (901), and a water pump is installed on the circulation pipeline.

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