Mixed acid spray etching machine

Abstract

The present invention discloses a mixed acid spray etching machine, which relates to the technical field of wafer spray etching. It includes an outer basket and an inner basket placed in a spray tank, as well as a rotating rod and an elastic roller rotatably installed below the spray tank. In the present invention, the rotating rod is rotatably installed at the bottom of the spray tank, and the elastic roller is fixedly sleeved on the rotating rod. When the wafer is placed into the spray tank through the outer basket and the inner basket for spray etching, by virtue of the contact between the outer surface of the elastic roller and the bottom of the wafer, during the process of the rotating rod driving the elastic roller to rotate, the wafer can be continuously rotated, and the contact position between the wafer and the card slot is constantly changed, realizing a dead-angle-free spray etching operation. To a certain extent, the comprehensiveness and stability of the device during spray processing are improved, and it can effectively avoid waste caused by uneven etching at the edge position after the wafer is spray etched.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer spray etching, and particularly to a mixed acid spray etching machine. Background Art

[0002] In the field of semiconductor manufacturing, the etching process of wafers is crucial, and its accuracy and uniformity directly determine the performance and yield of chips. As semiconductor technology continues to develop towards smaller sizes and higher integration levels, the requirements for wafer etching processing are becoming increasingly strict. In the prior art, a mixed acid spray etching device is a commonly used equipment in wafer etching processing.

[0003] During the wafer spray etching process, in order to ensure that each wafer maintains a stable separated state and avoid the wafers sticking to each other and affecting the spray etching effect, in the spray etching device, a basket rack is usually used to carry the wafers. During the spray etching process, the mixed acid solution is sprayed onto the wafer surface from top to bottom through a nozzle. By utilizing the chemical reaction between the mixed acid and the wafer material, the unnecessary parts are removed to complete the etching process of the wafer. During the spraying process, when the wafer is inserted into the basket rack, there are contact points between the edge position of the wafer and the basket rack. Inevitably, spray dead zones are formed at these contact positions. The wafers in these dead zone areas cannot fully contact the sprayed mixed acid solution, resulting in incomplete etching, and thus uneven etching at the edge position of the wafer. It is difficult to meet the usage requirements after etching, causing waste of the edge position.

[0004] Therefore, a mixed acid spray etching machine is proposed to solve some problems existing in the above prior art. Summary of the Invention

[0005] The object of the present invention is to solve the disadvantages in the prior art that during the spray etching process of wafer sheets, due to the contact between the edge position of the wafer and the basket rack, spray dead zones are likely to exist at the contact positions, affecting the etching uniformity at the contact positions after spraying, and easily causing waste of the edge area of the wafer, and to propose a mixed acid spray etching machine.

[0006] In order to solve the problems existing in the prior art, the present invention adopts the following technical solutions:

[0007] Mixed acid spray etching machine, including a main body. Inside the main body, a pure water spray area and a weak acid spray area are sequentially arranged from left to right. Spray tanks are fixedly installed in the areas corresponding to the pure water spray area and the weak acid spray area. An electric conveyor belt is installed inside the main body on the left side of the pure water spray area. A gantry manipulator is installed inside the main body above the pure water spray area, the weak acid spray area, and the electric conveyor belt. An outer basket is placed in the spray tank, and the outer basket includes symmetrically arranged first side plates. Round rods are fixedly connected at the four corners between the two first side plates. Symmetrically arranged first brackets are fixedly connected between the two first side plates. A plurality of inner baskets are mounted on the symmetrically arranged two first brackets. The inner basket includes symmetrically arranged second side plates. A plurality of second brackets are fixedly connected between the two second side plates. A large number of uniformly distributed card slots are opened on one side of the second bracket close to the center position of the second side plate. A rotating rod is rotatably installed inside the spray tank below the middle position of the second side plate, and an elastic roller is fixedly installed on the rotating rod.

[0008] Preferably, a surrounding ring groove is fixedly installed above the spray tank, and symmetrically arranged grooved surfaces are rotatably installed in the ring groove. The grooved surfaces cover above the spray tank. A spray pipe is fixedly installed at the bottom of the spray tank inside the spray tank, and a large number of uniformly distributed spray heads are fixedly connected below the spray pipe.

[0009] Preferably, pads corresponding to the bottoms of the first side plates are fixedly installed at the bottom of the spray tank, and inclined guide plates are fixedly installed on the inner end walls corresponding to the four corners at the bottom of the spray tank.

[0010] Preferably, a distance measuring instrument corresponding to the center position of the second side plate is fixedly installed on the inner end wall of the spray tank. A first through groove corresponding to the distance measuring instrument is opened on the first side plate, and a second through groove corresponding to the distance measuring instrument is opened on the second side plate.

[0011] Preferably, the gantry manipulator includes a moving table that slides horizontally. A horizontally arranged first rack is fixedly installed above the main body inside the machine. A first motor is fixedly installed on the moving table, and a first gear meshing with the first rack is fixed on the driving shaft of the first motor. A vertically arranged main arm is slidably installed on the moving table, and a lifting table is fixedly installed at the bottom end of the main arm. A vertically arranged second rack is fixedly installed on the main arm. A second motor is fixedly installed on the moving table, and a second gear meshing with the second rack is fixedly installed on the driving shaft of the second motor. Symmetrically arranged hooks are slidably installed on the lifting table. An electric push rod is fixedly installed on the lifting table, and the telescopic end of the electric push rod is fixedly connected to the hook.

[0012] Preferably, a first linear rail parallel to the first rack is fixedly installed at the upper position inside the main body, the mobile platform is slidably installed on the first linear rail through a slider, a second linear rail parallel to the first rack is fixedly installed on the main arm, a slider adapted to the second linear rail is fixed on the mobile platform, a third linear rail arranged horizontally is fixed on the lifting platform, and the hook is slidably installed on the third linear rail through a slider.

[0013] Preferably, the elastic roller is provided with a hollow structure, an air flow channel connected to the hollow structure in the elastic roller is opened in the rotating rod, an adapter rotatably connected to the air flow channel is fixedly installed on the outer end wall of the spray trough, and an air pressure sensor is installed in the hollow structure in the elastic roller.

[0014] Preferably, an air supply channel is opened in the pad block, a first interface connected to the air supply channel is opened at the bottom of the first side panel, a second interface connected to the first interface is opened at the top of the first bracket, a third interface connected to the second interface is opened on the second side panel, and spray holes connected to the third interface are opened on the symmetrical inner end walls on both sides of the slot.

[0015] Preferably, valve components are installed at the positions where the air supply channel and the first interface, the second interface and the third interface are connected to each other. The valve components include a valve body, and a vertically arranged through pipe and an air connecting channel connected to the inner end wall of the through pipe are opened in the valve body. A valve block for blocking the connecting air channel is slidably installed in the port of the through pipe, and a spring for elastically supporting the valve block is fixedly installed in the through pipe. The valve blocks in the two valve components connected up and down repel each other magnetically.

[0016] Preferably, a heater is provided on the outside of the main body, and a heating water tank is installed in the heater, an electric heating unit is fixedly installed at the bottom of the heating water tank, a circulation pipeline is constructed between the bottom of the spray tank located in the weak acid spray area and the heating water tank, and a water pump is installed on the circulation pipeline.

[0017] Compared with the prior art, the present invention has the following beneficial effects:

[0018] 1. In the present invention, the rotating rod is rotatably installed at the bottom of the spray tank, and the elastic roller is fixedly sleeved on the rotating rod, so that when the wafer is placed in the spray tank through the outer basket and the inner basket for spray etching, the outer surface of the elastic roller is in contact with the bottom of the wafer, so that the rotating rod drives the elastic roller to rotate, and the wafer can be driven to rotate continuously, and the contact position between the wafer and the card slot is continuously changed, so as to realize the spray etching operation without dead angles, and to a certain extent improve the comprehensiveness and stability of the device during spray processing, and can effectively avoid the waste of the edge position due to uneven etching after the wafer is sprayed and etched;

[0019] 2. In the present invention, by fixing the rangefinder on the inner end wall of the spray tank, and opening the first through slot corresponding to the rangefinder on the first side plate, and opening the second through slot corresponding to the rangefinder on the second side plate, the rangefinder can directly irradiate the first wafer during the spraying process, measure the distance between the first wafer and the rangefinder in real time, monitor the thickness of the wafer, and calculate the thinning amount, so that the mixed acid spray etching operation can be stopped in time after the thinning is in place, thereby improving the processing accuracy of the device to a certain extent;

[0020] 3. In the present invention, the elastic roller is set as an inflatable and deflated hollow structure, and an airflow channel connected to the hollow structure in the elastic roller is opened in the rotating rod. By means of the rotational connection between the adapter on the outer end wall of the spray tank and the airflow channel, the device can inflate and deflate the elastic roller through an air pump. The contact tightness between the outer surface of the elastic roller and the wafer can be strengthened by inflation and expansion, and the smoothness and stability of the wafer driven to rotate by the elastic roller during the spraying process can be improved to a certain extent. At the same time, by installing an air pressure sensor in the elastic roller and calculating the inflation amount in the elastic roller, the compressive strength of the outer surface of the elastic roller can be detected, thereby determining the contact degree between the outer surface of the elastic roller and the wafer, which is conducive to improving the convenience of operation of the device.

[0021] 4. In the present invention, by opening the spray holes on two symmetrical inner end walls on the inner side of the card slot, with the help of the air supply channel, the first interface, the third interface, the third interface and the spray holes, high-pressure airflow can be sprayed out through the spray holes, acting on the end walls on both sides of the wafer contact position. With the help of airflow, the contact area of ​​the wafer inserted in the card slot can be greatly reduced, which can not only effectively improve the smoothness of the wafer rotation driven by the elastic roller during the spraying process, but also reduce the wear of the edge position of the outer surface of the wafer when it contacts the inner wall of the card slot during the rotation, which is beneficial to improving the quality of the wafer after spraying. At the same time, by arranging valve parts at each end position, with the help of the elastic support of the spring, the port of the through pipe can be blocked by the valve block when not in use to prevent foreign matter from entering, which is beneficial to ensure the stability of the device during long-term use. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] The drawings described herein are used to provide a further understanding of the present invention and constitute a part of this application. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation of the present invention. In the drawings:

[0023] Figure 1 A top view of the present invention;

[0024] Figure 2 For the present invention Figure 1 Sectional view at AA in the middle;

[0025] Figure 3For the present invention Figure 1 Cross-sectional view taken along line B-B in the present invention;

[0026] Figure 4 Isometric view of the present invention;

[0027] Figure 5 Isometric view of the outer basket of the present invention placed in the spray tank;

[0028] Figure 6 Isometric view of the interior of the spray tank of the present invention;

[0029] Figure 7 Cross-sectional view of the internal structure of the spray tank of the present invention;

[0030] Figure 8 For the present invention Figure 7 Enlarged view at position C in the present invention;

[0031] Figure 9 Isometric view of the inner basket of the present invention placed in the outer basket;

[0032] Figure 10 Isometric view of the inner basket of the present invention;

[0033] Figure 11 For the present invention Figure 5 Top view of the present invention with the groove surface removed from the structure;

[0034] Figure 12 For the present invention Figure 11 Cross-sectional view taken along line D-D in the present invention;

[0035] Figure 13 For the present invention Figure 11 Cross-sectional view taken along line E-E in the present invention.

[0036] Reference numerals in the figure:

[0037] 1. Main body; 101. Pure water spray area; 102. Weak acid spray area;

[0038] 2. Spray tank; 201. Ring groove; 202. Groove surface; 203. Spray pipe; 204. Spray head; 205. Spacer block; 206. Guide plate; 207. Rangefinder;

[0039] 3. Electric conveyor belt;

[0040] 4. Gantry manipulator; 401. Moving table; 402. First rack; 403. First motor; 404. First gear; 405. Main arm; 406. Lifting table; 407. Second rack; 408. Second motor; 409. Second gear; 410. Hook; 411. Electric push rod; 412. First linear guide; 413. Second linear guide; 414. Third linear guide;

[0041] 5. Outer basket; 501. First side plate; 502. Round rod; 503. First bracket; 504. Limit rod; 505. First through groove;

[0042] 6. Inner basket; 601. Second side plate; 602. Second bracket; 603. Card slot; 604. Second through groove;

[0043] 7. Rotating rod; 701. Elastic roller; 702. Air flow channel; 703. Adapter;

[0044] 8. Air supply channel; 801. First interface; 802. Second interface; 803. Third interface; 804. Spray hole; 805. Valve member; 8051. Valve body; 8052. Through pipe; 8053. Air connection channel; 8054. Valve block; 8055. Spring;

[0045] 9. Heating machine; 901. Heating water tank. Detailed implementation mode

[0046] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments.

[0047] Embodiment: This embodiment provides a mixed acid spray etching machine. Refer to Figure 1 - Figure 13 , specifically, it includes a main body 1. Inside the main body 1, a pure water spray area 101 and a weak acid spray area 102 are sequentially arranged from left to right. Spray tanks 2 are fixedly installed in the corresponding areas of the pure water spray area 101 and the weak acid spray area 102. A surrounding ring groove 201 is fixedly installed above the spray tank 2, and symmetrically arranged groove surfaces 202 are rotatably installed in the ring groove 201. The groove surfaces 202 cover above the spray tank 2. A spray pipe 203 located inside the spray tank 2 is fixedly installed at the bottom of the spray tank 2, and a large number of uniformly distributed spray heads 204 are fixedly connected below the spray pipe 203.

[0048] An electric conveyor belt 3 is installed inside the main body 1 on the left side of the pure water spraying area 101. A gantry manipulator 4 is installed inside the main body 1 above the pure water spraying area 101, the weak acid spraying area 102, and the electric conveyor belt 3. The gantry manipulator 4 includes a moving platform 401 that slides horizontally. A first rack 402 arranged horizontally is fixedly installed at the upper position inside the main body 1. A first motor 403 is fixedly installed on the moving platform 401, and a first gear 404 meshing with the first rack 402 is fixed on the driving shaft of the first motor 403. A main arm 405 arranged vertically is slidably installed on the moving platform 401, and a lifting platform 406 is fixedly installed at the bottom end of the main arm 405. A second rack 407 arranged vertically is fixedly installed on the main arm 405. A second motor 408 is fixedly installed on the moving platform 401, and a second gear 409 meshing with the second rack 407 is fixedly installed on the driving shaft of the second motor 408. Symmetrically arranged hooks 410 are slidably installed on the lifting platform 406. An electric push rod 411 is fixedly installed on the lifting platform 406, and the telescopic end of the electric push rod 411 is fixedly connected to the hook 410.

[0049] A first linear guide rail 412 parallel to the first rack 402 is fixedly installed at the upper position inside the main body 1. The moving platform 401 is slidably installed on the first linear guide rail 412 through a slider. A second linear guide rail 413 parallel to it is fixedly installed on the main arm 405. A slider adapted to the second linear guide rail 413 is fixed on the moving platform 401. A third linear guide rail 414 arranged horizontally is fixed on the lifting platform 406. The hook 410 is slidably installed on the third linear guide rail 414 through a slider.

[0050] An outer basket 5 is placed inside the spraying tank 2. The outer basket 5 includes symmetrically arranged first side plates 501. Round rods 502 are fixedly connected at the four corners between the two first side plates 501. Symmetrically arranged first brackets 503 are fixedly connected between the two first side plates 501. Limiting rods 504 symmetrically arranged outside the two first brackets 503 are fixedly connected between the two first side plates 501. A plurality of inner baskets 6 are placed on the symmetrically arranged two first brackets 503. The inner basket 6 includes symmetrically arranged second side plates 601. A plurality of second brackets 602 are fixedly connected between the two second side plates 601. A large number of uniformly distributed card slots 603 are opened on one side of the second bracket 602 close to the center position of the second side plate 601. A rotating rod 7 is rotatably installed inside the spraying tank 2 below the middle position of the second side plate 601, and an elastic roller 701 is fixedly installed on the rotating rod 7. The elastic roller 701 is made of thermoplastic polyurethane material, which gives it good chemical corrosion resistance and can resist the erosion of various acids, alkalis, and solvents.

[0051] During the operation of the device, the wafers to be sprayed are placed in the inner basket 6 in sequence, and the wafers are inserted into the corresponding slots 603 on the plurality of second brackets 602, so that the plurality of wafers are erected in the inner basket 6, and then the staff places the inner basket 6 loaded with wafers in the outer basket 5, and stably sets the plurality of inner baskets 6 in the outer basket 5 through the first brackets 503 symmetrically arranged in the outer basket 5, and then the staff places the outer basket 5 on the electric conveyor belt 3, ready to be transported to the main body 1 for spray etching of the wafers, and the outer basket 5 enters the main body 1 under the transportation of the electric conveyor belt 3, and then the gantry manipulator 4 arranged above the main body 1 performs hoisting and grabbing operations on the outer basket 5, and according to the operation requirements of the wafers, the outer basket 5 is placed in the spray tank 2 at the corresponding position of the pure water spray area 101, or in the spray tank 2 at the corresponding position of the weak acid spray area 102.

[0052] When the gantry manipulator 4 is used to lift the outer basket 5, the first motor 403 is powered on and started, driving the first gear 404 fixedly mounted on its driving shaft to rotate. With the help of the meshing of the teeth between the first gear 404 and the first rack 402, the moving platform 401 can be driven to slide laterally along the first linear rail 412. When the moving platform 401 drives the lifting platform 406 to move to the outer basket 5 placed above the right end of the electric conveyor belt 3, the second motor 408 is powered on and started, which can drive the second gear 409 fixedly connected to its driving shaft to rotate. With the help of the meshing of the second gear 409 and the second rack 407, the main arm 405 is driven to slide up and down along the second linear rail 413, thereby controlling the lifting platform 406 to move up and down. In the process of the lifting platform 406 driving the hook 410 to move down to the position above the outer basket 5, under the power-on control of the electric push rods 411 on the left and right sides, the left and right sides are The hooks 410 on the side move synchronously to the middle position of the lifting platform 406. After the lower end of the hook 410 is driven by the lifting platform 406 to drop to between the left and right round rods 502 in the upper position of the outer basket 5, the electric push rod 411 is started in the reverse direction, so that the hooks 410 on the left and right sides are hooked on the left and right round rods 502, and then the lifting platform 406 is controlled to drive the outer basket 5 to move up, lift the outer basket 5, and the moving platform 401 moves to the right under the drive of the first motor 403. At this time, the groove surface 202 symmetrically arranged on the upper end of the spray tank 2 to be used is turned over and opened under the drive of the pneumatic push rod, and the gantry manipulator 4 hoisted the outer basket 5 and then moved to accurately place the outer basket 5 into the spray tank 2 to be used, and then the hook 410 releases the hook connection with the round rod 502, and the lifting platform 406 rises and exits the spray tank 2, preparing for subsequent hoisting operations of other outer baskets 5.

[0053] During the process of using the gantry manipulator 4 to hoist and move the outer basket 5, by using the tooth engagement between the first gear 404 and the first rack 402, and the tooth engagement between the second gear 409 and the second rack 407 for driving, the moving accuracy during the process of the gantry manipulator 4 hoisting the outer basket 5 can be effectively improved. By using the first linear guide 412 as the track for the lateral movement of the moving table 401, the second linear guide 413 as the track for the up and down movement of the lifting table 406, and the third linear guide 414 as the track for the lateral movement of the hook 410, the bearing capacity during the movement of the gantry manipulator 4 hoisting the outer basket 5 can be effectively improved, and the operation process is more stable and accurate.

[0054] After the outer basket 5 is hoisted into the spray tank 2, the symmetrically arranged limit rods 504 on the left and right can restrict the outer basket 5, making the outer basket 5 more accurately positioned inside the spray tank 2. During the activation of the spray tank 2, the symmetrically arranged groove surfaces 202 in the upper port ring groove 201 of the spray tank 2 are flipped and closed under the drive of the pneumatic push rod, tightly covering the upper port of the spray tank 2. When the outer basket 5 is inside the spray tank 2 at the corresponding position of the pure water spray area 101, the device can perform pure water spray cleaning on the numerous wafers placed in the inner basket 6 inside the outer basket 5. When the outer basket 5 is inside the spray tank 2 at the corresponding position of the weak acid spray area 102, the device can perform mixed acid spray etching on the numerous wafer chips placed in the inner basket 6 inside the outer basket 5.

[0055] The spray tank 2 at the corresponding position of the pure water spray area 101 is made of Röchling 15mm NPP board by welding. Its effective size is approximately 1365mm * 2170mm * 865mm. It is made by welding NPP boards and designed with external NPP reinforcement plates. A pipe for draining liquid is provided at the bottom of the corresponding spray tank 2, and the waste liquid can be directly discharged into the sewage pool. When performing pure water spraying, two pure water storage tanks are correspondingly arranged at the spray tank 2 in the pure water spray area 101. The capacity of each pure water storage tank is 1000L. One pure water storage tank is used for self-circulating spray reflux, and the other pure water storage tank is used for pure water spraying. The spray pump for self-circulating spray reflux in the spray tank 2 in the pure water spray area 101 uses a pump from Wannan Chemical Industry, with a power of 5.5kW, controlled by a frequency converter, and the flow rate is adjusted by the frequency converter. The spray pump for pure water spraying in the spray tank 2 in the pure water spray area 101 uses a SUS316 pump from the South, with a power of 5.5kW, controlled by a frequency converter. During operation, driven by the pure water spray pump, the pure water in one pure water storage tank is transported to the spray pipe 203 fixed at the bottom of the upper tank surface 202 in the spray tank 2 in the pure water spray area 101, and is sprayed downward through the spray head 204. The pure water is sprayed from top to bottom, and can perform a full-coverage and dead-angle-free spraying operation on the numerous wafers placed in the inner basket 6. The water from the pure water spray flows back into the self-circulating storage tank, and the excess overflows. The pipeline is made of PPH material, and an acid-resistant diaphragm valve is provided, and the liquid can be drained manually. After switching to pure water, it is discharged to the waste water pool by gravity, and the diaphragm valve is manually controlled, enabling the operator to flexibly adjust according to production requirements, and the operation is convenient.

[0056] The spray tank 2 at the corresponding position of the weak acid spraying area 102 is made by welding Röchling 10mm PVDF plates. Its effective size is approximately 1365mm * 2170mm * 865mm. It is made by welding PVDF plates with an external PVDF reinforcement plate design. There is a pipe for draining liquid at the bottom of the corresponding spray tank 2, which can directly discharge the waste liquid into the sewage pool. When performing mixed acid spraying, a mixed acid storage tank is correspondingly arranged at the spray tank 2 in the weak acid spraying area 102. The mixed acid is composed of HF, HCL, H2SO4 and pure water. An acid liquid detection system is arranged in the mixed acid storage tank, which can automatically supplement various acid liquid components according to the system prompt. The acid liquid supplement pump is an Iwaki metering pump. The mixed acid storage tank is made of Röchling 12T PVDF plates welded together, and its capacity can reach 3000L. The spray pump used for mixed acid spraying is a chemical pump from Wannan Pump Industry, with a power of 5.5kW. The pipeline is made of PTFE material. During the process of mixed acid spraying, through the pumping of the mixed acid spray pump, the mixed acid liquid in the mixed acid storage tank is transported to the spray pipe 203 fixed at the bottom of the upper surface 202 of the spray tank 2 in the weak acid spraying area 102, and then sprayed out through the spray head 204. The mixed acid liquid is sprayed from top to bottom, which can perform a full-coverage and non-blind-spot spray etching operation on the wafers placed in the inner basket 6. When the mixed acid liquid is used for a certain period of time, the mixed acid liquid in the spray tank 2 in the weak acid spraying area 102 is pumped into the waste liquid tank for treatment by a magnetic pump.

[0057] After the wafers are placed in the spray tank 2 through the inner basket 6 and the outer basket 5, the wafers stand upright on the elastic rollers 701 under the erection of the inner basket 6, and the bottom of the wafers contacts the upper surface of the elastic rollers 701. The outer surface of the elastic rollers 701 is provided with anti-slip abrasive patterns, which can effectively improve the friction force between the outer surface of the elastic rollers 701 and the wafers when they come into contact. During spraying, the rotating rod 7 is driven to rotate by an externally connected servo motor, and then drives the elastic rollers 701 to continuously rotate at the lower position in the spray tank 2. With the contact friction force between the elastic rollers 701 and the wafers, the wafers can be driven to rotate in the inner basket 6, continuously rotating and tossing the wafers, so that the posture of the wafers continuously changes during the spraying process. The wafers are driven to rotate 10 circles per minute, which can ensure that the contact points between the wafers and the inner basket 6 continuously change, realizing a non-blind-spot spray operation, and improving the comprehensiveness and stability of the spraying process of the device to a certain extent.

[0058] Above each spray tank 2, a air supply device is provided, and an air extraction mechanism is provided inside the tank. An air extraction port is provided at the top of the main body 1. The air extraction port is connected through a pipeline by an air extraction fan to extract the volatilized reagent in the device to the workshop air extraction pipeline or outdoors, avoiding the diffusion of harmful gases into the room, which is beneficial to ensuring that the external environment of the device meets the relevant standards of labor protection, so as to ensure the physical health of the equipment operators and the surrounding staff. The inner diameter of the exhaust port flange is 200 mm, and the exhaust volume is 3000 m³ per hour. It can be connected to the tail gas treatment device, and the gas directly discharged to the outdoors needs to meet the environmental protection requirements.

[0059] In the specific implementation process, such as Figure 6 - Figure 7 and Figure 12 - Figure 13 As shown, a cushion block 205 corresponding to the bottom of the first side plate 501 is fixedly installed at the bottom of the spray tank 2. Inclined guide plates 206 are fixedly installed on the inner end walls corresponding to the four corners of the bottom of the spray tank 2. During the operation of the device, by fixing a cushion block 205 corresponding to the first side plate 501 at the bottom of the spray tank 2, after the outer basket 5 is placed in the spray tank 2, it can be lifted, so that sufficient installation space can be provided for the rotating rod 7 and the elastic roller 701 below the spray tank 2, which is beneficial to ensuring the stability of the device during operation to a certain extent. By fixedly installing the inclined guide plates 206 at the four corners of the inner bottom of the spray tank 2, with the help of the inclined guidance of the guide plates 206, after the outer basket 5 is hoisted and placed into the spray tank 2 by the gantry manipulator 4, the position of the outer basket 5 is accurately constant, which is beneficial to ensuring the convenient and accurate docking of the subsequent air supply channel 8 and the first interface 801, and can improve the convenience during the operation of the device to a certain extent.

[0060] In the specific implementation process, such as Figure 3 、 Figure 6 and Figure 9 - Figure 12As shown, a rangefinder 207 corresponding to the center position of the second side plate 601 is fixedly installed on the inner end wall of the spray tank 2, a first through slot 505 corresponding to the rangefinder 207 is provided on the first side plate 501, and a second through slot 604 corresponding to the rangefinder 207 is provided on the second side plate 601. During the operation of the device and the spray processing, the rangefinder 207 can directly irradiate the first wafer through the first through slot 505 provided on the first side plate 501 and the second through slot 604 provided on the second side plate 601, and measure the distance between the first wafer and the rangefinder 207. The rangefinder 207 has a built-in automatic focusing module, which can track the position of the wafer as it shakes during the wafer mixed acid spray etching thinning process, automatically focus, monitor the thickness of the wafer in real time, and calculate the thinning amount, so as to stop the mixed acid spray etching operation in time after the thinning is in place, thereby improving the processing accuracy of the device to a certain extent.

[0061] In the specific implementation process, Figure 2 , Figure 3 and Figure 7 As shown, the elastic roller 701 is provided with a hollow structure, the rotating rod 7 is provided with an air flow channel 702 connected with the hollow structure in the elastic roller 701, an adapter 703 connected with the air flow channel 702 for rotation is fixedly mounted on the outer end wall of the spray tank 2, and an air pressure sensor is installed in the hollow structure in the elastic roller 701. During the operation of the device, the adapter 703 is connected with an air pump, and the air pump can perform air filling and deflating operations in the elastic roller 701 through the connection between the adapter 703 and the air flow channel 702. When the wafer is placed in the spray tank 2 through the outer basket 5 and the inner basket 6, the staff can The air pump is started to inflate the elastic roller 701. Through inflation, the contact tightness between the outer surface of the elastic roller 701 and the wafer can be strengthened, thereby improving the contact friction between the elastic roller 701 and the wafer, and improving the smoothness and stability of the wafer driven by the elastic roller 701 to rotate during spraying. By installing an air pressure sensor in the elastic roller 701 and calculating the inflation amount in the elastic roller 701, the compressive strength of the outer surface of the elastic roller 701 can be detected, thereby determining the degree of contact between the outer surface of the elastic roller 701 and the wafer, which is convenient for the staff to make flexible adjustments.

[0062] In the specific implementation process, Figure 6 - Figure 8 and Figure 10As shown, an air supply channel 8 is provided in the spacer block 205. A first interface 801 communicating with the air supply channel 8 is provided at the bottom of the first side plate 501. A second interface 802 communicating with the first interface 801 is provided at the top of the first bracket 503. A third interface 803 communicating with the second interface 802 is provided on the second side plate 601. Spray holes 804 communicating with the third interface 803 are provided on the inner end walls of the two symmetric sides in the card slot 603. During the operation of the device, the air supply channel 8 is externally connected to an air pump. When the wafer is placed in the spray tank 2 and being sprayed, the air pump is started. Through the docking of the air supply channel 8 and the first interface 801, and the docking of the second interface 802 and the third interface 803, the air flow is transported to the spray holes 804 and ejected. Since the spray holes 804 are provided on the inner end walls of the two symmetric sides in each card slot 603, the air flow will be ejected onto the two side walls of the wafer inserted in the card slot 603 at the same time in the card slot 603. Through the impact and pushing of the air flow, the wafer can be kept in the middle position in the card slot 603 for a long time, which can greatly reduce the contact area between the wafer inserted in the card slot 603 and it. It can not only effectively improve the smoothness of the wafer being driven to rotate by the elastic roller 701 during the spraying process, but also reduce the wear when the edge position of the outer surface of the wafer contacts the inner wall of the card slot 603 during the rotation process, which is beneficial to improving the quality of the wafer after spraying and processing.

[0063] In the specific implementation process, as Figure 12 and Figure 13 shown, valve parts 805 are installed at the docking positions of the air supply channel 8 and the first interface 801, the second interface 802 and the third interface 803. The valve part 805 includes a valve body 8051, and a vertically arranged through pipe 8052 is provided in the valve body 8051, and an air receiving channel 8053 communicating with the inner end wall of the through pipe 8052. A valve block 8054 for blocking the air channel 8053 is slidably installed in the port of the through pipe 8052. A spring 8055 for elastically supporting the valve block 8054 is fixedly installed in the through pipe 8052. The valve blocks 8054 in the two vertically docked valve parts 805 repel each other magnetically.

[0064] During the operation of the device, by installing the valve member 805 at the end positions of the air supply passage 8, the first interface 801, the second interface 802, and the third interface 803, with the elastic support of the spring 8055 inside the valve member 805, when the air supply passage 8 is not docked with the first interface 801, the second interface 802, and the third interface 803, the valve block 8054 blocks the port of the valve body 8051, which can prevent foreign objects from entering the air supply passage 8, the first interface 801, the second interface 802, and the third interface 803. During normal use, when the air supply passage 8 is docked with the first interface 801, the second interface 802, and the third interface 803, due to the magnetic repulsion between the valve blocks 8054 in the two valve members 805 with mutually adapted docking positions, under the influence of magnetic repulsion, the valve blocks 8054 in the two valve members 805 at the docking position respectively overcome the elastic support of the corresponding springs 8055 and move away from each other, making the connection between the through pipe 8052 and the air intake passage 8053 communicate. In this state, the high-pressure air flow provided by the air pump can flow smoothly in the air supply passage 8, the first interface 801, the second interface 802, and the third interface 803, and finally be ejected through the spray holes 804. By setting the valve member 805, the stability of the device during long-term use can be effectively improved.

[0065] In the specific implementation process, such as Figure 1 and Figure 4As shown in the figure, a heating machine 9 is arranged on the outer side of the main body 1, and a heating water tank 901 is installed in the heating machine 9. An electric heating unit is fixedly installed at the bottom of the heating water tank 901. A circulation pipeline is constructed between the bottom of the spray tank 2 located at the weak acid spray area 102 and the heating water tank 901, and a water pump is installed on the circulation pipeline. During the operation of the device, when spraying mixed acid, in order to improve the effect of mixed acid spray etching, a heat exchange heating method is also adopted to heat the acid water mixture in the spray tank 2 at the weak acid spray area 102. The water pump installed on the circulation pipeline is a Teflon diaphragm pump. The acid water mixture in the spray tank 2 at the weak acid spray area 102 is pumped into the coil in the heating water tank 901 through the Teflon diaphragm pump. The acid water mixture in the coil is heated in the heating water tank 901 and then transported back to the spray tank 2 at the weak acid spray area 102. The heating water tank 901 is made of SUS316L steel plate, and four 6kW stainless steel heating tubes are arranged inside it. A high and low liquid level protection is set in the heating water tank 901. When the liquid level is high, the water replenishment operation automatically stops, and when the liquid level is low, the work can automatically stop to prevent dry burning without water. An Omron digital display temperature controller is set in the heating water tank 901, and the temperature control error fluctuates within the range of ±2°C. A digital display temperature controller is also set in the spray tank 2 at the weak acid spray area 102. When the temperature in the tank reaches the set temperature, the water pump stops working. A self-circulation pump is set in the spray tank 2 at the weak acid spray area 102. The digital display temperature controller sets 3 temperature measurement points in the spray tank 2 at the weak acid spray area 102, and ensures that there is one temperature measurement point installed in the spray pipe 203, which can ensure the temperature balance during the mixed acid spray etching in the spray tank 2 at the weak acid spray area 102, and is beneficial to improving the stability and efficiency of the device for mixed acid spraying on the wafer.

[0066] Specifically, the working principle and operation method of the present invention are as follows:

[0067] The wafers to be processed by spraying are inserted one by one into the card slots 603 in the inner basket 6. Then, the inner basket 6 filled with wafers is placed on the first bracket 503 symmetrically arranged in the outer basket 5. The outer basket 5 filled with the inner basket 6 is then placed on the electric conveyor belt 3 and transported to the main body 1 through the electric conveyor belt 3. Then, the gantry robot 4 installed at the upper position in the main body 1 is activated. According to the processing requirements, the outer basket 5 is hoisted into the spray tank 2 at the corresponding position in the pure water spray area 101 or the weak acid spray area 102. The wafers are subjected to pure water spraying in the spray tank 2 in the pure water spray area 101, and the wafers are subjected to mixed acid spray etching in the spray tank 2 in the weak acid spray area 102. During the spraying process, through the pumping of the spray pump, the relevant spray liquid enters the spray pipe 203 and is sprayed downward through the spray head 204 to perform the spraying operation on the wafers from top to bottom. During the spraying process, the rangefinder 207 installed on the inner end wall of the spray tank 2 can irradiate the first wafer through the first through groove 505 and the second through groove 604 to monitor the thickness of the wafer in real time. During the spraying process, the air pump inflates the elastic roller 701 through the connection of the adapter 703 and the air flow channel 702, so that the elastic roller 701 expands after inflation to strengthen the contact tightness with the upper wafer. Synchronously, another air pump connected to the air supply channel 8 is activated. The air flow passes through the connection of the air supply channel 8, the first interface 801, the second interface 802, and the third interface 803 and is ejected through the spray holes 804, acting on the edge positions of the outer surfaces on both sides of the wafers inserted in the card slots 603. With the help of the air flow pushing, the contact area between the wafers and the card slots 603 is weakened. Then, the rotating rod 7 is driven to rotate by the servo motor, driving the elastic roller 701 to rotate, and driving the wafers to continuously rotate during the spraying process, realizing the dead-angle-free spraying operation on the wafers.

[0068] The above is only the preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present invention, according to the technical solution and inventive concept of the present invention, makes equivalent substitutions or changes, and all should be covered within the protection scope of the present invention.

Claims

1. A mixed acid spray etching machine, comprising a main body (1), characterized in that: A pure water spraying area (101) and a weak acid spraying area (102) are sequentially arranged in the main body (1) from left to right, and spray troughs (2) are fixedly installed in the areas corresponding to the pure water spraying area (101) and the weak acid spraying area (102). An electric conveyor belt (3) is installed in the main body (1) and is located on the left side of the pure water spraying area (101). A gantry manipulator (4) is installed in the main body (1) and is located above the pure water spraying area (101), the weak acid spraying area (102) and the electric conveyor belt (3). An outer basket (5) is placed in the spray trough (2), and the outer basket (5) includes symmetrically arranged first side panels (501), and the four corners between the two first side panels (501) are fixedly connected. A round rod (502) is connected, a symmetrically arranged first bracket (503) is fixedly connected between the two first side plates (501), a plurality of inner baskets (6) are mounted on the two symmetrically arranged first brackets (503), and the inner baskets (6) include symmetrically arranged second side plates (601), a plurality of second brackets (602) are fixedly connected between the two second side plates (601), and a plurality of evenly distributed slots (603) are provided on one side of the second bracket (602) close to the center of the second side plate (601), and a rotating rod (7) located below the middle position of the second side plate (601) is rotatably installed inside the spray tank (2), and an elastic roller (701) is fixedly installed on the rotating rod (7); A cushion block (205) arranged corresponding to the bottom of the first side plate (501) is fixedly mounted on the bottom of the spray trough (2), and an inclined guide plate (206) is fixedly mounted on the inner end walls corresponding to the four corners of the bottom of the spray trough (2); The elastic roller (701) is provided with a hollow structure, the rotating rod (7) is provided with an air flow channel (702) connected to the hollow structure in the elastic roller (701), an adapter (703) is fixedly mounted on the outer end wall of the spray tank (2) and is rotatably connected to the air flow channel (702), and an air pressure sensor is installed in the hollow structure in the elastic roller (701); An air supply channel (8) is provided in the cushion block (205); a first interface (801) connected to the air supply channel (8) is provided at the bottom of the first side plate (501); a second interface (802) connected to the first interface (801) is provided at the top of the first bracket (503); a third interface (803) connected to the second interface (802) is provided on the second side plate (601); and spray holes (804) connected to the third interface (803) are provided on the symmetrical inner end walls on both sides of the slot (603); A valve component (805) is installed at the positions where the air supply channel (8) and the first interface (801), the second interface (802) and the third interface (803) are connected to each other. The valve component (805) comprises a valve body (8051), and a vertically arranged through pipe (8052) and an air receiving channel (8053) connected to the inner end wall of the through pipe (8052) are opened in the valve body (8051). A valve block (8054) for blocking the connecting air channel (8053) is slidably installed in the port of the through pipe (8052), and a spring (8055) for elastically supporting the valve block (8054) is fixedly installed in the through pipe (8052). The valve blocks (8054) in the two valve components (805) connected to each other magnetically repel each other.

2. The mixed acid spray etching machine according to claim 1, characterized in that: A surrounding annular groove (201) is fixedly mounted above the spray groove (2), and a symmetrically arranged groove surface (202) is rotatably mounted in the annular groove (201), the groove surface (202) covers the top of the spray groove (2), a spray pipe (203) located in the spray groove (2) is fixedly mounted at the bottom of the spray groove (2), and a plurality of evenly distributed spray heads (204) are fixedly connected to the bottom of the spray pipe (203).

3. The mixed acid spray etching machine according to claim 1, characterized in that: A distance meter (207) arranged corresponding to the center position of the second side plate (601) is fixedly mounted on the inner end wall of the spray tank (2); a first through slot (505) arranged corresponding to the distance meter (207) is formed on the first side plate (501); and a second through slot (604) arranged corresponding to the distance meter (207) is formed on the second side plate (601).

4. The mixed acid spray etching machine according to claim 1, characterized in that: The gantry manipulator (4) comprises a transversely sliding mobile platform (401), a transversely arranged first rack (402) is fixedly installed at an upper position in the main body (1), a first motor (403) is fixedly installed on the mobile platform (401), and a first gear (404) meshing with the first rack (402) is fixed on the driving shaft of the first motor (403), a vertically arranged main arm (405) is slidably installed on the mobile platform (401), and a lifting platform (406) is fixedly installed at the bottom end of the main arm (405), A second rack (407) arranged vertically is fixedly mounted on the main arm (405), a second motor (408) is fixedly mounted on the moving platform (401), and a second gear (409) meshing with the second rack (407) is fixedly mounted on the driving shaft of the second motor (408), a symmetrically arranged hook (410) is slidably mounted on the lifting platform (406), an electric push rod (411) is fixedly mounted on the lifting platform (406), and the telescopic end of the electric push rod (411) is fixedly connected to the hook (410).

5. The mixed acid spray etching machine according to claim 4, characterized in that: A first linear rail (412) arranged parallel to the first rack (402) is fixedly installed at an upper position inside the main body (1); the movable platform (401) is slidably installed on the first linear rail (412) via a slider; a second linear rail (413) arranged parallel to the first linear rail (412) is fixedly installed on the main arm (405); a slider adapted to the second linear rail (413) is fixedly installed on the movable platform (401); a third linear rail (414) arranged transversely is fixedly installed on the lifting platform (406); and the hook (410) is slidably installed on the third linear rail (414) via a slider.

6. The mixed acid spray etching machine according to claim 1, characterized in that: A heater (9) is arranged outside the main body (1), and a heating water tank (901) is installed inside the heater (9); an electric heating unit is fixedly installed at the bottom of the heating water tank (901); a circulation pipeline is constructed between the bottom of the spray tank (2) located at the weak acid spraying area (102) and the heating water tank (901), and a water pump is installed on the circulation pipeline.

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