Adsorption device

By designing an adsorption device compatible with substrate glass and FOP, the problems of increasing working hours and reducing bonding accuracy caused by two independent adsorption devices in the prior art are solved, and the effect of improving production efficiency and bonding accuracy is achieved.

CN119852230APending Publication Date: 2025-04-18IRAY IMAGE TECH TAICANG CO LTD
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Patent Information

Application Number
CN202411808661.7
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-12-10
Publication Date
2025-04-18

AI Technical Summary

Technical Problem

After splicing, existing CMOS X-ray detectors need to use two independent adsorption devices to bond the substrate glass and FOP, resulting in increased working hours and reduced bonding accuracy.

Method used

An adsorption device including a first U-shaped adsorption platform, a second U-shaped adsorption platform and a U-shaped platform body is designed. By setting adsorption platforms with different surface heights, it is compatible with adsorption of substrate glass and FOP, and an automatic switching control device can be optionally equipped.

Benefits of technology

This device does not need to be removed and replaced when performing bonding work, which improves production efficiency, ensures fitting accuracy, and reduces product defect rate.

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Abstract

According to the adsorption device, the first U-shaped adsorption platform and the second U-shaped adsorption platform which are different in surface height are arranged to be compatible with substrate glass adsorption and FOP adsorption, compared with two independent adsorption devices in the prior art, the adsorption device does not need to be dismounted and replaced back and forth during attaching work, the production efficiency is improved, and the production cost is reduced. And the laminating precision is ensured.
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Description

Technical Field

[0001] The invention relates to the technical field of ray detectors, and in particular to an adsorption device. Background Art

[0002] CMOS X-ray detector is an X-ray imaging device manufactured using CMOS (complementary metal oxide semiconductor) technology. With its high resolution, high-speed imaging, high sensitivity and wide range of applications, CMOS X-ray detector plays an increasingly important role in modern X-ray imaging technology. The chip of CMOS X-ray detector is generally spliced ​​by chip units. At present, the back of COMS chip needs to be fixed and supported by substrate glass after splicing. After splicing and bonding substrate glass, the front of COMS chip needs to be bonded with FOP (Fiber Optic Panel) to meet the technical requirements of CMOS X-ray detector products. However, the device for adsorbing substrate glass and the device for adsorbing FOP are two independent devices. Each time switching to bond FOP and substrate glass, the two adsorption devices need to be removed and replaced alternately, which seriously affects the product working hours. At the same time, due to the frequent disassembly and installation of screws, it is easy to cause thread slippage and thus affect the bonding accuracy, thus causing CMOS X-ray detector products to be defective. Summary of the invention

[0003] In view of the shortcomings of the prior art mentioned above, the object of the present invention is to provide an adsorption device for solving the problem in the prior art that the device for adsorbing substrate glass and the device for adsorbing FOP are two independent devices. Each time the two adsorption devices need to be removed and replaced when switching between bonding FOP and bonding substrate glass, which seriously affects the product working hours. At the same time, due to the frequent disassembly and installation of screws, it is easy to cause thread slippage, which in turn affects the bonding accuracy, thereby causing defective CMOS X-ray detector products.

[0004] To achieve the above-mentioned purpose and other related purposes, the present invention provides an adsorption device, which comprises: a first U-shaped adsorption platform, a second U-shaped adsorption platform and a U-shaped platform body; wherein,

[0005] The first U-shaped adsorption platform and the second U-shaped adsorption platform are sequentially arranged in the same direction from outside to inside on the inner side of the U-shaped body of the U-shaped platform, and the upper surface of the second U-shaped adsorption platform is lower than the upper surface of the first U-shaped adsorption platform, and the upper surface of the first U-shaped adsorption platform is lower than the upper surface of the U-shaped platform body;

[0006] A plurality of first adsorption blind holes are arranged on the upper surface of the first U-shaped adsorption platform; all the first adsorption blind holes are connected to the first adsorption gas path, and the first adsorption gas path is arranged inside the first U-shaped adsorption platform and the U-shaped platform body and is led out from the outer side of the U-shaped platform body;

[0007] A plurality of second adsorption blind holes are arranged on the upper surface of the second U-shaped adsorption platform; all the second adsorption blind holes are connected to the second adsorption gas path, and the second adsorption gas path passes through the interior of the second U-shaped adsorption platform and is led out from the outer side surface of the second U-shaped adsorption platform.

[0008] Optionally, the first U-shaped adsorption platform is a FOP adsorption platform and the second U-shaped adsorption platform is a substrate glass adsorption platform, or the first U-shaped adsorption platform is the substrate glass adsorption platform and the second U-shaped adsorption platform is the FOP adsorption platform.

[0009] Optionally, the first U-shaped adsorption platform is flush with the end of at least one U-shaped side arm of the U-shaped platform body and exposes a portion of the side wall of the second U-shaped adsorption platform, and the second adsorption gas path is led out from the surface of the exposed portion of the side wall of the second U-shaped adsorption platform.

[0010] Optionally, the adsorption device further includes a control device, and the control device is used to automatically switch the adsorption device to perform adsorption on the first U-shaped adsorption platform or to perform adsorption on the second U-shaped adsorption platform.

[0011] Optionally, the plurality of first adsorption blind holes include a plurality of first side blind holes and a plurality of first bottom blind holes extending from top to bottom, all of the first side blind holes are symmetrically and evenly arranged on the two side arms of the U-shaped arm of the first U-shaped adsorption platform, and all of the first bottom blind holes are evenly arranged on the connecting arm of the U-shaped arm of the first U-shaped adsorption platform; the plurality of second adsorption blind holes are symmetrically and evenly arranged on the two side arms of the U-shaped arm of the second U-shaped adsorption platform.

[0012] Furthermore, the number of the first side blind holes is 6, the number of the first bottom blind holes is 5, and the number of the second adsorption blind holes is 6.

[0013] Optionally, the U-shaped platform body further includes a protruding structure disposed on the outer side of the U-shaped platform body, and the protruding structure is provided with at least one assembly hole penetrating the protruding structure from top to bottom.

[0014] Optionally, a connecting arm of the U-shaped arm of the U-shaped platform body is provided with a plurality of weight-reducing holes penetrating the U-shaped platform body from top to bottom.

[0015] Optionally, an upper surface of the second U-shaped adsorption platform is 1 mm to 3 mm lower than an upper surface of the first U-shaped adsorption platform.

[0016] Optionally, the first U-shaped adsorption platform, the second U-shaped adsorption platform and the U-shaped platform body are an integrally formed structure.

[0017] As described above, the adsorption device of the present invention has the following beneficial effects: the adsorption device of the present invention is compatible with substrate glass adsorption and FOP adsorption by setting a first U-shaped adsorption platform and a second U-shaped adsorption platform with different surface heights. Compared with the two independent adsorption devices in the prior art, the adsorption device of the present invention does not need to be dismantled and replaced back and forth during the bonding work, thereby improving production efficiency and ensuring bonding accuracy. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 Shown is a schematic diagram of the adsorption device of the present invention.

[0019] Component number description

[0020] 10 U-shaped platform body

[0021] 101 Weight-reducing Holes

[0022] 102 Protruding structure

[0023] 103 Mounting holes

[0024] 11 The first U-shaped adsorption platform

[0025] 111 First adsorption blind hole

[0026] 112 First adsorption gas path

[0027] 110 First side blind hole

[0028] 114 First bottom blind hole

[0029] 12 The second U-shaped adsorption platform

[0030] 121 Second adsorption blind hole

[0031] 122 Second adsorption gas path

[0032] 123 Partial side wall DETAILED DESCRIPTION

[0033] The following describes the embodiments of the present invention through specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification. The present invention can also be implemented or applied through other different specific embodiments, and the details in this specification can also be modified or changed in various ways based on different viewpoints and applications without departing from the spirit of the present invention.

[0034] See also Figure 1 It should be noted that the illustrations provided in this embodiment are only used to illustrate the basic concept of the present invention in a schematic manner, and the illustrations only show components related to the present invention rather than being drawn according to the number, shape and size of components in actual implementation. In actual implementation, the type, quantity and proportion of each component may be changed arbitrarily, and the component layout may also be more complicated.

[0035] This embodiment provides an adsorption device, such as Figure 1 As shown, the adsorption device includes: a first U-shaped adsorption platform 11, a second U-shaped adsorption platform 12 and a U-shaped platform body 10; wherein,

[0036] The first U-shaped adsorption platform 11 and the second U-shaped adsorption platform 12 are arranged in the same direction from outside to inside in sequence on the inner side of the U-shaped portion where the U-shaped platform body 10 is located, and the upper surface of the second U-shaped adsorption platform 12 is lower than the upper surface of the first U-shaped adsorption platform 11, and the upper surface of the first U-shaped adsorption platform 11 is lower than the upper surface of the U-shaped platform body 10;

[0037] A plurality of first adsorption blind holes 111 are provided on the upper surface of the first U-shaped adsorption platform 11; all the first adsorption blind holes 111 are connected to the first adsorption gas path 112, and the first adsorption gas path 112 is arranged inside the first U-shaped adsorption platform 11 and the U-shaped platform body 10 and is led out from the outer side of the U-shaped platform body 10;

[0038] A plurality of second adsorption blind holes 121 are provided on the upper surface of the second U-shaped adsorption platform 12 ; all the second adsorption blind holes 121 are connected to the second adsorption gas path 122 , and the second adsorption gas path 122 is penetrated inside the second U-shaped adsorption platform 12 and led out from the outer side surface of the second U-shaped adsorption platform 12 .

[0039] The adsorption device of this embodiment is compatible with substrate glass adsorption and FOP adsorption by setting a first U-shaped adsorption platform and a second U-shaped adsorption platform with different surface heights. Compared with the two independent adsorption devices in the prior art, the adsorption device of this embodiment does not need to be dismantled and replaced back and forth during the bonding work, thereby improving production efficiency and ensuring bonding accuracy.

[0040] As an example, the first U-shaped adsorption platform 11 is a FOP adsorption platform and the second U-shaped adsorption platform 12 is a substrate glass adsorption platform, or the first U-shaped adsorption platform 11 is the substrate glass adsorption platform and the second U-shaped adsorption platform 12 is the FOP adsorption platform. The sizes of the first U-shaped adsorption platform 11 and the second U-shaped adsorption platform 12 can be set according to the actual FOP bonding and substrate glass bonding sizes of the CMOS product wafer, and adsorption platforms of corresponding sizes are selected for adsorption. The sizes and selection of the first U-shaped adsorption platform 11 and the second U-shaped adsorption platform 12 are not overly limited here.

[0041] Specifically, the upper surface of the second U-shaped adsorption platform 12 is set lower than the upper surface of the first U-shaped adsorption platform 11, and the upper surface of the first U-shaped adsorption platform 11 is lower than the upper surface of the U-shaped platform body 10. When the FOP bonding or the substrate glass bonding is performed, the FOP or the substrate glass can be fixedly adsorbed on the upper surface of the first U-shaped adsorption platform 11 or the upper surface of the second U-shaped adsorption platform 12 by the height difference. This embodiment is explained by taking the first U-shaped adsorption platform 11 as the FOP adsorption platform and the second U-shaped adsorption platform 12 as the substrate glass adsorption platform as an example. As an example, the upper surface of the second U-shaped adsorption platform 12 is 1mm to 3mm lower than the upper surface of the first U-shaped adsorption platform 11, so that the upper surface of the substrate glass when the second U-shaped adsorption platform 12 adsorbs the substrate glass is substantially flush with the upper surface of the FOP when the first U-shaped adsorption platform 12 adsorbs the FOP, so as to reduce excessive adjustment of bonding parameters in subsequent bonding steps and improve bonding efficiency and bonding quality. The specific value of the height difference formed by the upper surface of the first U-shaped adsorption platform 11 , the upper surface of the second U-shaped adsorption platform 12 , and the upper surface of the U-shaped platform body 10 is not overly limited here.

[0042] As an example, Figure 1As shown, the first adsorption blind holes 111 include a plurality of first side blind holes 113 and a plurality of first bottom blind holes 114 extending from top to bottom, all the first side blind holes 113 are symmetrically and evenly arranged on the two side arms of the U-shaped arm of the first U-shaped adsorption platform 11, and all the first bottom blind holes 114 are evenly arranged on the connecting arm of the U-shaped arm of the first U-shaped adsorption platform 11; and the second adsorption blind holes 121 are symmetrically and evenly arranged on the two side arms of the U-shaped arm of the second U-shaped adsorption platform 12. The uniform distribution design can ensure uniform distribution of adsorption force, improve adsorption efficiency, and thus ensure that the FOP or the substrate glass is stably adsorbed on the first U-shaped adsorption platform 11 and the second U-shaped adsorption platform 12. The symmetrical distribution design helps to maintain the balance of the overall structure of the adsorption device, avoid tilting or offset, and thus improve the adsorption effect. In addition, the second adsorption blind hole 121 is only arranged on the two side arms of the U-shaped arm of the second U-shaped adsorption platform 12. While ensuring the adsorption effect, the size of the U-shaped arm connecting arm of the second U-shaped adsorption platform 12 can be reduced, the weight of the second U-shaped adsorption platform 12 can be reduced, and the weight of the adsorption device can be reduced, so as to more flexibly control the rotation or movement of the adsorption device, and at the same time, the deformation of the adsorption device due to its heavy weight can be reduced or even avoided, thereby affecting the fitting accuracy.

[0043] As an example, Figure 1 As shown, the number of the first side blind holes 113 is 6, the number of the first bottom blind holes 114 is 5, and the number of the second adsorption blind holes 121 is 6. While ensuring the adsorption effect, the weight of the second U-shaped adsorption platform 12 is reduced. Regarding the number of the first adsorption blind holes 111 and the second adsorption blind holes 121, no excessive restrictions are made here.

[0044] As an example, Figure 1 As shown, the first U-shaped adsorption platform 11 is flush with the end of at least one U-shaped side arm of the U-shaped platform body 10 and exposes a portion of the side wall 123 of the second U-shaped adsorption platform 12, and the second adsorption gas path 122 is led out from the surface of the exposed portion of the side wall 123 of the second U-shaped adsorption platform 12. Through the above design, the overall size of the adsorption device can be kept unchanged, the weight can be reduced, and the space can be saved.

[0045] As an example, Figure 1As shown, the U-shaped platform body 10 further includes a protruding structure 102 disposed on the outer side of the U-shaped platform body 10, and the protruding structure 102 is provided with at least one assembly hole 103 penetrating the protruding structure 102 from top to bottom. When performing the FOP bonding or the substrate glass bonding work, the adsorption device needs to be bolted and installed on the machine platform through the assembly hole 103, and the adsorption device needs to be flexibly controlled to rotate or move to complete the FOP bonding or the substrate glass bonding work.

[0046] As an example, Figure 1 As shown, the connecting arm of the U-shaped arm of the U-shaped platform body 10 is provided with a plurality of weight-reducing holes 101 penetrating the U-shaped platform body 10 from top to bottom, so as to reduce the weight of the adsorption device, so as to more flexibly control the rotation or movement of the adsorption device, and at the same time, can reduce or even avoid the deformation of the adsorption device due to excessive weight, thereby affecting the fitting accuracy.

[0047] As an example, the first U-shaped adsorption platform 11, the second U-shaped adsorption platform 12 and the U-shaped platform body 10 are an integrally formed structure. They can be formed directly from a mold through an integral molding process without any seams or welding points, thereby ensuring the integrity and stability of the adsorption device structure. At the same time, the integrally formed structural design avoids connectors and seams in traditional assembly methods, reduces stress concentration during use, simplifies the manufacturing process, and reduces production costs.

[0048] The first U-shaped adsorption platform 11 and the second U-shaped adsorption platform 12 are two independent adsorption platforms on the adsorption device. As an example, the adsorption device also includes a control device, and the control device is used to automatically switch the adsorption device to perform adsorption on the first U-shaped adsorption platform 11 or the second U-shaped adsorption platform 12. As a specific example, the control device includes a solenoid valve for controlling the opening and closing of the first adsorption gas path 112 and the second adsorption gas path 122, and a PLC (programmable logic controller) program for controlling the operation of the solenoid valve. Compared with the two independent adsorption devices in the prior art, the adsorption device of this embodiment does not need to be dismantled and replaced back and forth during bonding work, thereby improving production efficiency and bonding accuracy.

[0049] In summary, the adsorption device of the present invention is compatible with substrate glass adsorption and FOP adsorption by setting a first U-shaped adsorption platform and a second U-shaped adsorption platform with different surface heights. Compared with the two independent adsorption devices in the prior art, the adsorption device of the present invention does not need to be dismantled and replaced back and forth during the bonding work, thereby improving production efficiency and ensuring bonding accuracy. Therefore, the present invention effectively overcomes various shortcomings in the prior art and has a high industrial utilization value.

[0050] The above embodiments are merely illustrative of the principles and effects of the present invention, and are not intended to limit the present invention. Anyone familiar with the art may modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by a person of ordinary skill in the art without departing from the spirit and technical concept disclosed by the present invention shall still be covered by the claims of the present invention.

Claims

1. An adsorption device, characterized in that: The adsorption device comprises: a first U-shaped adsorption platform, a second U-shaped adsorption platform and a U-shaped platform body; wherein, The first U-shaped adsorption platform and the second U-shaped adsorption platform are sequentially arranged in the same direction from outside to inside on the inner side of the U-shaped body of the U-shaped platform, and the upper surface of the second U-shaped adsorption platform is lower than the upper surface of the first U-shaped adsorption platform, and the upper surface of the first U-shaped adsorption platform is lower than the upper surface of the U-shaped platform body; The upper surface of the first U-shaped adsorption platform is provided with a plurality of first adsorption blind holes; all the first adsorption blind holes are connected to the first adsorption gas path, and the first adsorption gas path is arranged inside the first U-shaped adsorption platform and the U-shaped platform body and is led out from the outer side of the U-shaped platform body; A plurality of second adsorption blind holes are arranged on the upper surface of the second U-shaped adsorption platform; all the second adsorption blind holes are connected to the second adsorption gas path, and the second adsorption gas path passes through the interior of the second U-shaped adsorption platform and is led out from the outer side surface of the second U-shaped adsorption platform.

2. The adsorption device according to claim 1, characterized in that: The first U-shaped adsorption platform is a FOP adsorption platform and the second U-shaped adsorption platform is a substrate glass adsorption platform, or the first U-shaped adsorption platform is the substrate glass adsorption platform and the second U-shaped adsorption platform is the FOP adsorption platform.

3. The adsorption device according to claim 1, characterized in that: The first U-shaped adsorption platform is flush with the end of at least one U-shaped side arm of the U-shaped platform body and exposes a portion of the side wall of the second U-shaped adsorption platform, and the second adsorption gas path is led out from the surface of the exposed portion of the side wall of the second U-shaped adsorption platform.

4. The adsorption device according to claim 1, characterized in that: The adsorption device further comprises a control device, and the control device is used for automatically switching the adsorption device to perform adsorption on the first U-shaped adsorption platform or to perform adsorption on the second U-shaped adsorption platform.

5. The adsorption device according to claim 1, characterized in that: The plurality of first adsorption blind holes include a plurality of first side blind holes and a plurality of first bottom blind holes extending from top to bottom, all of the first side blind holes are symmetrically and evenly arranged on the two side arms of the U-shaped arm of the first U-shaped adsorption platform, and all of the first bottom blind holes are evenly arranged on the connecting arm of the U-shaped arm of the first U-shaped adsorption platform; the plurality of second adsorption blind holes are symmetrically and evenly arranged on the two side arms of the U-shaped arm of the second U-shaped adsorption platform.

6. The adsorption device according to claim 5, characterized in that: The number of the first side blind holes is 6, the number of the first bottom blind holes is 5, and the number of the second adsorption blind holes is 6.

7. The adsorption device according to claim 1, characterized in that: The U-shaped platform body also includes a protruding structure arranged on the outer side of the U-shaped platform body, and at least one assembly hole penetrating the protruding structure from top to bottom is arranged on the protruding structure.

8. The adsorption device according to claim 1, characterized in that: A plurality of weight-reducing holes penetrating the U-shaped platform body from top to bottom are arranged on the connecting arm of the U-shaped arm of the U-shaped platform body.

9. The adsorption device according to claim 1, characterized in that: The upper surface of the second U-shaped adsorption platform is 1 mm to 3 mm lower than the upper surface of the first U-shaped adsorption platform.

10. The adsorption device according to claim 1, characterized in that: The first U-shaped adsorption platform, the second U-shaped adsorption platform and the U-shaped platform body are an integrally formed structure.