Metal oxide semiconductor (MOS) chip etching equipment

Abstract

The invention discloses MOS (Metal Oxide Semiconductor) chip etching equipment, which relates to the technical field of MOS chip etching and is characterized in that an inlet and an outlet are respectively formed in two ends of an etching machine main body, an electrostatic adsorption table is fixedly connected to the bottom end of the etching machine main body, and a control assembly is slidably connected to the top end of the inner wall of the etching machine main body; the spraying heads are distributed in the length direction of the control assembly at equal intervals, the spraying heads are fixedly connected with the control assembly, the driver is arranged at the side end of the etching machine body, the driver is slidably connected with a guide rod, and the side end of the guide rod is fixedly connected with a clamping assembly; and then the control assembly controls the plurality of spraying heads to spray the corrosive liquid on the MOS chips, so that the targeted etching of the plurality of MOS chips is realized, each MOS chip can be ensured to obtain sufficient corrosive liquid, the sufficient etching effect of the MOS chips is realized, the clamping assembly can position and place the MOS chips through the driver and the guide rod, and the clamping assembly can clamp the MOS chips through the driver and the guide rod. Therefore, the effect of keeping the MOS chips at intervals is achieved.

Description

Technical Field

[0001] The invention relates to the technical field of MOS chip etching, and in particular to a MOS chip etching device. Background Art

[0002] MOS chip, the full name of which is metal oxide semiconductor chip, is a semiconductor device widely used in digital and analog circuits. MOS technology is one of the most common technologies in modern electronic devices. It includes devices such as metal oxide semiconductor field effect transistors.

[0003] In the prior art, MOS chips are often etched using an etcher. A large number of MOS chips are placed on the etcher. The electrostatic chuck on the etcher directly adsorbs the MOS chips, and then the spray head on the etcher sprays the corrosive liquid onto the MOS chips, thereby etching the MOS chips.

[0004] However, when etching a large number of MOS chips, when the shower head sprays the etching liquid to multiple chips, the multiple chips are concentrated together for spraying, which may cause uneven etching liquid spraying, thereby affecting the etching accuracy of the MOS chips. Summary of the invention

[0005] The purpose of the present invention is to provide a MOS chip etching device to solve the technical problem in the prior art that when a large number of MOS chips are etched, when a spray head sprays corrosive liquid to multiple chips, the multiple chips are sprayed together, which easily leads to uneven etching of the corrosive liquid, thereby affecting the etching accuracy of the MOS chips.

[0006] The technical problem to be solved by the present invention can be achieved by the following technical solutions:

[0007] A MOS chip etching device, comprising:

[0008] The etching machine body has an inlet and an outlet at both ends, the bottom of the etching machine body is fixedly connected to an electrostatic adsorption platform, and the top of the inner wall of the etching machine body is slidably connected to a control component;

[0009] Sprinkler heads, which are provided in several groups and are equidistantly distributed along the length direction of the control assembly, and the sprinkler heads are fixedly connected to the control assembly;

[0010] The driver is arranged at the side end of the etching machine body, the driver is slidably connected to a guide rod, and the side end of the guide rod is fixedly connected to a clamping assembly.

[0011] As a further solution of the present invention: the control component includes: a controller and a control board, the top end of the controller is slidably connected to the etching machine body, the bottom end of the controller is fixedly connected to the control board, and the control board is fixedly connected to a plurality of spray heads.

[0012] As a further solution of the present invention: slide grooves are respectively provided inside the two ends of the etching machine body, and the inner walls of the slide grooves are slidably connected with blocking doors.

[0013] As a further solution of the present invention: the blocking door is connected to the inner wall of the sliding groove by clamping.

[0014] As a further solution of the present invention: a conveyor is provided at the bottom of the guide rod, and the conveyor is provided with two groups and is respectively fixedly connected to both sides of the etching machine body, the side end of the conveyor is fixedly connected to the driver, the clamping assembly is located at the top of the conveyor, and the driver is fixedly connected to a support plate at the bottom of the end away from the clamping assembly.

[0015] As a further solution of the present invention: the clamping assembly includes: a clamp and a clamping plate, the side end of the clamp is fixedly connected to the guide rod, and the clamping plate is provided with two groups and is respectively slidably connected to the bottom of the clamp.

[0016] As a further solution of the present invention: a positioner is fixedly connected to the side end of the clamp.

[0017] As a further solution of the present invention: a removal plate is slidably connected to the top of the electrostatic adsorption table, a recovery groove is opened at the side end of the electrostatic adsorption table, and a debris absorber is provided at the side end of the electrostatic adsorption table, and the debris absorber is fixedly connected to one end of the etching machine body away from the clamping assembly.

[0018] As a further solution of the present invention: the side end of the removal plate is fixedly connected with a telescopic rod, the etching machine body is provided with a positioning hole, the telescopic rod is slidably connected to the inner wall of the etching machine body, the side end of the telescopic rod is fixedly connected with a telescope, and the telescope is fixedly connected to the side end of the etching machine body.

[0019] As a further solution of the present invention: a discharge pipe is provided at the side end of the recovery tank, a connecting hole is penetrated through the side end of the electrostatic adsorption platform, the discharge pipe is fixedly connected to the side end of the electrostatic adsorption platform, and both ends of the connecting hole are respectively connected to the recovery tank and the discharge pipe.

[0020] Beneficial effects of the present invention:

[0021] 1. When a large number of MOS chips need to be etched, the driver controls the guide rod to move telescopically, and the guide rod moves with the clamping assembly. The clamping assembly clamps the MOS chips through the inlet and outlet, and the clamping assembly places the MOS chips one by one on the electrostatic adsorption table, and the MOS chips are kept equidistant. At this time, the electrostatic adsorption table is running, and the electrostatic adsorption table adsorbs the MOS chips. Then the control component controls multiple spray heads to spray corrosive liquid on the MOS chips, thereby realizing targeted etching of multiple MOS chips, ensuring that each MOS chip can get sufficient corrosive liquid, thereby achieving the effect of sufficient etching of the MOS chips.

[0022] 2. Each MOS chip is evenly distributed on the electrostatic adsorption table, thereby avoiding the phenomenon of MOS chips being concentrated together. Among them, the clamping component can clamp and load the MOS chip. At the same time, the clamping component can position and place the MOS chip through the driver and the guide rod, thereby achieving the effect of keeping the MOS chip placed at intervals. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] The present invention will be further described below in conjunction with the accompanying drawings.

[0024] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0025] Figure 2 For the present invention Figure 1 A schematic diagram of the structure at A;

[0026] Figure 3 It is a top view of the overall structure of the present invention;

[0027] Figure 4 It is the AA cross-sectional view of the overall structure of the present invention;

[0028] Figure 5 It is a cross-sectional view of the overall structure BB of the present invention;

[0029] Figure 6 It is a schematic diagram of the control component structure of the present invention;

[0030] Figure 7 It is a schematic diagram of the structure of the removal plate of the present invention.

[0031] In the figure: 1. Etching machine body; 2. Conveyor; 3. Driver; 4. Support plate; 5. Guide rod; 6. Telescopic device; 7. Blocking door; 8. Slide; 9. Positioner; 10. Clamp; 11. Clamping plate; 12. Inlet and outlet; 13. Discharge pipe; 14. Electrostatic adsorption table; 15. Telescopic rod; 16. Removal plate; 17. Positioning hole; 18. Recovery tank; 19. Connection hole; 20. Controller; 21. Control panel; 22. Sprinkler head; 23. Absorber. DETAILED DESCRIPTION

[0032] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0033] like Figure 1-Figure 7 As shown, a MOS chip etching device includes: an etching machine body 1, a shower head 22 and a driver 3,

[0034] The two ends of the etching machine body 1 are respectively provided with an inlet and outlet 12, the bottom end of the etching machine body 1 is fixedly connected with an electrostatic adsorption platform 14, the top of the inner wall of the etching machine body 1 is slidably connected with a control component, the spray head 22 is provided with a plurality of groups and is equidistantly distributed along the length direction of the control component, the spray head 22 is fixedly connected with the control component, the driver 3 is arranged at the side end of the etching machine body 1, the driver 3 is slidably connected with a guide rod 5, the side end of the guide rod 5 is fixedly connected with a clamping component, when a large number of MOS chips need to be etched, the driver 3 controls the guide rod 5 to telescopically move, the guide rod 5 moves with the clamping component, the clamping component clamps the MOS chip through the inlet and outlet 12, the clamping component places the MOS chips one by one on the electrostatic adsorption platform 14, and the MOS chips are kept equidistant, at this time, the electrostatic adsorption platform 14 is running, the electrostatic adsorption platform 14 adsorbs the MOS chip, and then the control component controls the multiple spray heads 22 to spray the corrosive liquid on the MOS chip, thereby realizing the targeted etching of the multiple MOS chips, ensuring that each MOS chip can obtain sufficient corrosive liquid, thereby achieving the effect of sufficient etching of the MOS chip;

[0035] Each MOS chip is evenly distributed on the electrostatic adsorption platform 14, thereby avoiding the phenomenon of MOS chips being concentrated together. The clamping component can clamp and load the MOS chip. At the same time, the clamping component can position and place the MOS chip through the driver 3 and the guide rod 5, thereby achieving the effect of keeping the MOS chips placed at intervals.

[0036] In some specific embodiments, the control component includes: a controller 20 and a control board 21, the top of the controller 20 is slidably connected to the etching machine body 1, and the bottom of the controller 20 is fixedly connected to the control board 21, and the control board 21 is fixedly connected to a plurality of spray heads 22. When the control component is running, the controller 20 moves on the top inner wall of the etching machine body 1, and the controller 20 drives the multiple spray heads 22 to move through the control board 21, and the spray heads 22 fully spray the corrosive liquid to the MOS chip, wherein the multiple spray heads 22 spray the MOS chips placed at corresponding positions, and the controller 20 can synchronously operate the multiple spray heads 22 through the control board 21.

[0037] In some specific embodiments, slide grooves 8 are respectively opened inside the two ends of the etching machine body 1, and the inner wall of the slide groove 8 is slidably connected with a blocking door 7. In order to ensure that the MOS chip is in a closed environment during etching, when the MOS chip is placed on the electrostatic adsorption table 14, the etching machine body 1 controls the blocking door 7 to slide along the inner wall of the slide groove 8. When the bottom end of the blocking door 7 moves to the electrostatic adsorption table 14, the blocking door 7 blocks the inlet and outlet 12, thereby providing a sealed environment for the MOS chip in the etching machine body 1, thereby preventing the corrosive liquid sprayed by the spray head 22 from splashing out from the inlet and outlet 12.

[0038] In some specific embodiments, the blocking door 7 is connected to the inner wall of the slide groove 8 by a clamping connection. The clamping connection between the inner wall of the slide groove 8 and the blocking door 7 can provide a limiting support for the blocking door 7 to prevent the blocking door 7 from shifting or shaking when the blocking door 7 blocks the splashing corrosive liquid. Sealing gaskets can be fixed at both ends of the blocking door 7, and the sealing gaskets can further seal the gap between the blocking door 7 and the slide groove 8.

[0039] In some specific embodiments, a conveyor 2 is provided at the bottom of the guide rod 5, and the conveyor 2 is provided with two groups and respectively fixedly connected to the two sides of the etching machine body 1, the side end of the conveyor 2 is fixedly connected to the driver 3, the clamping assembly is located at the top of the conveyor 2, and the driver 3 is fixedly connected with a support plate 4 at the bottom of the end away from the clamping assembly. The MOS chip can be conveyed by the conveyor 2. When the MOS chip moves to the bottom of the clamping assembly through the conveyor 2, the conveyor 2 stops running, and the clamping assembly clamps the MOS chip to move. When the etching of the MOS chip is completed, the clamping assembly clamps the MOS chip and moves it to another group of conveyors 2 for unloading. The conveyor 2 realizes the effect of automatically loading and unloading the MOS chip, wherein the support plate 4 can provide support for the side end of the driver 3.

[0040] In some specific embodiments, the clamping assembly includes: a clamper 10 and a clamping plate 11, the side end of the clamper 10 is fixedly connected to the guide rod 5, and the clamping plate 11 is provided with two groups and is respectively slidably connected to the bottom of the clamper 10. When the clamping assembly is running, the clamper 10 runs, and the clamper 10 controls the clamping plate 11 to clamp the MOS chip, and the clamping plate 11 clamps both ends of the MOS chip, and then the clamper 10 controls the clamping plate 11 to move the MOS chip to the electrostatic adsorption platform 14 for placement.

[0041] In some specific embodiments, the side end of the clamp 10 is fixedly connected to a positioner 9, and the positioner 9 fixed on the side end of the clamp 10 can position the moving position of the clamping assembly, thereby ensuring that the clamping assembly moves the MOS chip to the corresponding position of the electrostatic adsorption platform 14 through the movement of the guide rod 5.

[0042] In some specific embodiments, a removal plate 16 is slidably connected to the top of the electrostatic adsorption platform 14, a recovery groove 18 is provided at the side end of the electrostatic adsorption platform 14, and a debris absorber 23 is provided at the side end of the electrostatic adsorption platform 14. The debris absorber 23 is fixedly connected to one end of the etching machine body 1 away from the clamping component. When the etching of the MOS chip is completed, the clamping component clamps the MOS chip to unload it from the electrostatic adsorption platform 14. When the MOS chip passes through the inlet and outlet 12, the debris absorber 23 absorbs the corrosive liquid remaining on the MOS chip to prevent the MOS chip from bringing the remaining corrosive liquid to the external environment, thereby affecting the external environment. When the MOS chip is completely unloaded from the electrostatic adsorption platform 14, the removal plate 16 can slide along the surface of the electrostatic adsorption platform 14, and the removal plate 16 pushes the corrosive liquid remaining on the surface of the electrostatic adsorption platform 14, and the removal plate 16 pushes the corrosive liquid into the recovery groove 18, and the recovery groove 18 recycles the corrosive liquid, thereby preventing the corrosive liquid remaining on the surface of the electrostatic adsorption platform 14 from corroding the bottom of the subsequent MOS chip.

[0043] In some specific embodiments, the side end of the removal plate 16 is fixedly connected to a telescopic rod 15, the etching machine body 1 is provided with a positioning hole 17, the telescopic rod 15 is slidably connected to the inner wall of the etching machine body 1, the side end of the telescopic rod 15 is fixedly connected to a telescope 6, the telescope 6 is fixedly connected to the side end of the etching machine body 1, when the removal plate 16 needs to be moved, the telescope 6 runs, the telescope 6 drives the telescopic rod 15 to move, the telescopic rod 15 slides along the inner wall of the positioning hole 17, the telescopic rod 15 pushes the removal plate 16 and slides along the top of the electrostatic adsorption platform 14, the two ends of the removal plate 16 can be bent toward the direction of the recovery tank 18, when the removal plate 16 pushes the corrosive liquid, the corrosive liquid will flow to both sides along the surface of the removal plate 16, the two ends of the removal plate 16 can limit the corrosive liquid, and at the same time, the removal plate 16 can collect the corrosive liquid.

[0044] In some specific embodiments, a discharge pipe 13 is provided at the side end of the recovery tank 18, and a connecting hole 19 is opened through the side end of the electrostatic adsorption platform 14. The discharge pipe 13 is fixedly connected to the side end of the electrostatic adsorption platform 14, and both ends of the connecting hole 19 are respectively connected to the recovery tank 18 and the discharge pipe 13. When the recovery tank 18 collects the corrosive liquid, the corrosive liquid can pass through the connecting hole 19 and then enter the discharge pipe 13, so that the discharge pipe 13 recovers the corrosive liquid.

[0045] In order to facilitate the understanding of the embodiments of this solution by those skilled in the art, the working principle of this solution is briefly described in combination with specific application scenarios:

[0046] The MOS chip can be conveyed by the conveyor 2. When the MOS chip moves to the bottom of the clamping assembly through the conveyor 2, the conveyor 2 stops running, the clamping assembly clamps the MOS chip to move, the driver 3 controls the guide rod 5 to telescopically move, the guide rod 5 moves with the clamping assembly, the clamping assembly clamps the MOS chip through the inlet and outlet 12, the clamping assembly places the MOS chips one by one on the electrostatic adsorption platform 14, and the MOS chips are kept equidistant. At this time, the electrostatic adsorption platform 14 is running, the electrostatic adsorption platform 14 adsorbs the MOS chip, and then the control component controls multiple spray heads 22 to spray the corrosive liquid on the MOS chip. When the etching of the MOS chip is completed, the clamping assembly unloads the MOS chip, the telescope 6 is running, the telescope 6 drives the telescopic rod 15 to move, the telescopic rod 15 slides along the inner wall of the positioning hole 17, the telescopic rod 15 abuts against the removal plate 16 to slide along the top of the electrostatic adsorption platform 14, the removal plate 16 pushes the corrosive liquid into the recovery tank 18, and the recovery tank 18 recovers the corrosive liquid;

[0047] Each MOS chip is evenly distributed on the electrostatic adsorption platform 14, thereby avoiding the phenomenon of MOS chips being concentrated together. The clamping component can clamp and load the MOS chip. At the same time, the clamping component can position and place the MOS chip through the driver 3 and the guide rod 5, thereby achieving the effect of keeping the MOS chip placed at intervals. Multiple spray heads 22 spray corrosion liquid on the MOS chip, thereby achieving targeted etching of multiple MOS chips, ensuring that each MOS chip can obtain sufficient corrosion liquid, thereby achieving the effect of sufficient etching of the MOS chip.

[0048] Several embodiments of the present invention are described in detail above, but the embodiments of the present invention are not limited thereto and cannot be considered to limit the scope of implementation of the present invention. All equivalent changes and improvements made within the scope of the present invention should still fall within the scope of the patent coverage of the present invention.

Claims

1. A MOS chip etching device, characterized in that: include: An etching machine body (1), wherein both ends of the etching machine body (1) are respectively provided with an inlet and an outlet (12), the bottom end of the etching machine body (1) is fixedly connected to an electrostatic adsorption platform (14), and the top end of the inner wall of the etching machine body (1) is slidably connected to a control component; A spray head (22), wherein the spray heads (22) are provided in a plurality of groups and are equidistantly distributed along the length direction of the control assembly, and the spray heads (22) are fixedly connected to the control assembly; A driver (3) is arranged at the side end of the etching machine body (1), the driver (3) is slidably connected to a guide rod (5), and the side end of the guide rod (5) is fixedly connected to a clamping assembly.

2. A MOS chip etching device according to claim 1, characterized in that: The control component comprises: a controller (20) and a control panel (21); the top end of the controller (20) is slidably connected to the etching machine body (1); the bottom end of the controller (20) is fixedly connected to the control panel (21); and the control panel (21) is fixedly connected to a plurality of shower heads (22).

3. A MOS chip etching device according to claim 1, characterized in that: Slide grooves (8) are respectively provided inside the two ends of the etching machine body (1), and the inner wall of the slide groove (8) is slidably connected to a blocking door (7).

4. A MOS chip etching device according to claim 3, characterized in that: The blocking door (7) is connected to the inner wall of the sliding groove (8) by clamping.

5. A MOS chip etching device according to claim 1, characterized in that: A conveyor (2) is provided at the bottom of the guide rod (5), and the conveyor (2) is provided with two groups and is respectively fixedly connected to the two sides of the etching machine body (1), the side end of the conveyor (2) is fixedly connected to the driver (3), the clamping assembly is located at the top of the conveyor (2), and the driver (3) is fixedly connected to a support plate (4) at the bottom of the end away from the clamping assembly.

6. A MOS chip etching device according to claim 5, characterized in that: The clamping assembly comprises: a clamp (10) and a clamping plate (11); the side end of the clamp (10) is fixedly connected to the guide rod (5); and the clamping plate (11) is provided with two groups and is respectively slidably connected to the bottom of the clamp (10).

7. A MOS chip etching device according to claim 6, characterized in that: The side end of the clamp (10) is fixedly connected with a positioner (9).

8. A MOS chip etching device according to claim 1, characterized in that: The top of the electrostatic adsorption platform (14) is slidably connected to a removal plate (16), a side end of the electrostatic adsorption platform (14) is provided with a recovery groove (18), and a side end of the electrostatic adsorption platform (14) is provided with a debris absorber (23), and the debris absorber (23) is fixedly connected to one end of the etching machine body (1) away from the clamping assembly.

9. A MOS chip etching device according to claim 8, characterized in that: The side end of the removal plate (16) is fixedly connected to a telescopic rod (15), the etching machine body (1) is provided with a positioning hole (17), the telescopic rod (15) is slidably connected to the inner wall of the etching machine body (1), the side end of the telescopic rod (15) is fixedly connected to a telescope (6), and the telescope (6) is fixedly connected to the side end of the etching machine body (1).

10. The MOS chip etching equipment according to claim 8, characterized in that: A discharge pipe (13) is provided at the side end of the recovery tank (18), and a connection hole (19) is provided through the side end of the electrostatic adsorption platform (14). The discharge pipe (13) is fixedly connected to the side end of the electrostatic adsorption platform (14), and both ends of the connection hole (19) are respectively connected to the recovery tank (18) and the discharge pipe (13).

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