Power electronic unit, vehicle-mounted power supply integrated unit and power inverter

Abstract

The invention discloses a power electronic unit, a vehicle-mounted power supply integrated unit and a power inverter. The power electronic unit comprises a shell, the shell comprises a first layer shell part, and the first layer shell part is provided with a first outer surface; and a second layer shell portion, the second layer shell portion having a second outer surface; at least a first circuit board assembly mounted in the internal cavity; and a bond strap or bond strap section via which the first layer shell portion is assembled to the second layer shell portion to close the cavity, the bond strap or bond strap section having a first elongate region and a second elongate region, wherein at least a portion of the first elongated region overlaps the first outer surface and at least a portion of the second elongated region overlaps the second outer surface. The housing is assembled by incorporating a strap or incorporating a band-shaped section.

Description

Technical Field

[0001] The present application relates to an electronic control unit for a powertrain system of a new energy vehicle, and more specifically to a power electronic unit. The present application also relates to an integrated vehicle power supply unit. The present application also relates to a power inverter. Background Art

[0002] New energy vehicles include three core components, namely the battery assembly, the motor assembly, and the electronic control assembly. The electronic control assembly consists of a battery management system and a control system. It manages the battery pack and controls the energy output of the battery and adjusts the speed of the motor. It is the intermediate carrier connecting the battery and the motor. The electronic control assembly includes an on-board charger (OBC), an on-board DC / DC converter, an electric air conditioner, a PTC, a PDU, and other high-voltage components. Among them, the on-board charger converts the external input AC power into DC power and outputs it to the battery. The on-board charger is controlled by the battery management system, the vehicle control unit, etc. to dynamically adjust the charging current and voltage parameters, and at the same time provide a variety of protection measures during charging. The DC / DC converter is a device that connects the high-voltage power battery with the on-board low-voltage system to power low-voltage electrical appliances. New energy vehicles are equipped with, for example, a 12V low-voltage battery. Low-voltage electrical equipment such as lights, air conditioners, and audio equipment draw power from the low-voltage battery, and the energy stored in the low-voltage battery is also obtained from the high-voltage power battery through the DC / DC converter.

[0003] The so-called on-board power supply is a key electrical component in the electronic control assembly. On-board power supply integrated products are integrated products with on-board chargers and DC / DC converters as the core. Thanks to the advantages of saving space, simplifying layout, improving efficiency, and reducing costs, on-board power supply integrated products have gradually become mainstream products, and tend to integrate more components, such as PDU, electric drive, drive motor, etc., into three-in-one or even multi-in-one on-board power supply system products through shared circuits and structural parts.

[0004] The high-voltage part of the battery DC output in electric vehicles is converted into AC power through a power inverter (PI, power inverter), and the power inverter output controls the operation of the motor. By changing the voltage and frequency through the inverter, the torque and speed of the motor can be changed. The inverter can also convert mechanical energy into electrical energy to charge the battery during energy recovery. In a power inverter system, the DC / DC converter is responsible for boosting the low voltage (usually 12V) to the high voltage required for the inverter to work, the filter is used to smooth the current waveform and reduce noise interference, and the inverter converts the DC power processed by the above two links into AC power and outputs it to the motor for its normal operation. The quality of the AC power output by the inverter determines the driving comfort of new energy vehicles, and the efficiency of the inverter largely determines the overall efficiency of the vehicle.

[0005] The design trends of power inverters include increasing power, maximizing efficiency, increasing voltage, reducing weight and size, etc. A certain number of power devices are set in the power inverter. How to arrange the power devices in a limited space and how to effectively release the radiant heat of the power devices are also difficult problems faced by the inverter in design.

[0006] With the development of technology, both on-board power integrated products and power inverters are being upgraded, and the upgrade content is reflected in all aspects including hardware and software. For example, it poses challenges to the design and manufacturing of the housings of the above-mentioned on-board power products and inverters. Summary of the invention

[0007] One aspect of the present application is to provide a power electronic unit with an improved housing.

[0008] The power electronics unit comprises

[0009] A housing comprising

[0010] a first shell portion having a first outer surface; and

[0011] a second shell portion, the second shell portion having a second outer surface, wherein one of the first shell portion or the second shell portion has a cavity therein;

[0012] at least a first circuit board assembly mounted in the cavity; and

[0013] A bonding tape or a bonding tape-like segment, the first shell portion is assembled to the second shell portion via the bonding tape or the bonding tape-like segment to close the cavity, the bonding tape or the bonding tape-like segment having a longitudinal axis in the extension direction of the tape, a first slender area located on one side of the longitudinal axis, and a second slender area opposite to the first slender area, wherein at least a portion of the first slender area overlaps with the first outer surface, and at least a portion of the second slender area overlaps with the second outer surface.

[0014] In one embodiment of the power electronic unit, the power electronic unit also includes a heat dissipation component, which is integrated on the first shell part or the second shell part, and the bonding strip or the bonding strip segment is made of a thermally conductive material, so that heat away from one of the shell parts of the heat dissipation component is transferred to the heat dissipation component via the other shell part.

[0015] In an embodiment of the power electronic unit, the bonding tape or bonding tape-like sections are metal foils applied to the first outer surface and the second outer surface by laser welding or adhesives applied directly to the first outer surface and the second outer surface.

[0016] In one embodiment of the power electronic unit, the first shell portion has a first inner surface, the second shell portion has a second inner surface, one of the first inner surface and the second inner surface defines a portion of the cavity, and the other of the first inner surface and the second inner surface defines the remaining portion of the cavity, wherein the first circuit board assembly is supported by the second shell portion.

[0017] In an embodiment of the power electronic unit, the power electronic unit further comprises a second circuit board assembly and is carried by the first shell part, the first shell part comprising a first plate forming its body and a cover connected to the first plate to enclose the second circuit board assembly.

[0018] In one embodiment of the power electronic unit, the first board includes a shielding structure having a first board surface substantially parallel to the first circuit board assembly and a second board surface opposite to the first board surface, the first board surface being configured to have one or more covers open toward components of the first circuit board assembly.

[0019] In an embodiment of the power electronic unit, the second board surface is configured to have one or more upright retaining walls for separating components of the second circuit board assembly.

[0020] In one embodiment of the power electronic unit, the shell is constructed to have a flat shape; the first shell portion and the second shell portion have a gap in the height direction of the shell in the assembled state, the first outer surface is located on the side wall of the first shell portion, and the second outer surface is located on the side wall of the second shell portion.

[0021] In an embodiment of the power electronic unit, at least a portion of the first circuit board assembly serves as a power circuit board on which power devices are arranged; and at least a portion of the second circuit board serves as a logic circuit board on which logic devices are arranged.

[0022] In an embodiment of the power electronic unit, the volume of components of the first circuit board assembly carried by the second shell portion is larger than the volume of components of the second circuit board assembly carried by the first shell portion.

[0023] The power electronic unit involved in the present application is assembled into a shell by a bonding tape or a bonding tape-shaped segment. A bonding tape or a bonding tape-shaped segment is attached to the respective outer surfaces of the first shell part and the second shell part to connect the first shell part and the second shell part together, thereby closing the cavity where the circuit board assembly is located. The circuit board assembly, as the main source of electromagnetic waves, can shield electromagnetic radiation when the cavity is closed. In the present application, the bonding tape can be a continuous belt-shaped connection structure attached to the outer surface of the shell, or the bonding tape-shaped segment can be a connection structure composed of multiple small segments attached to the outer surface of the shell and presenting intervals as a whole, that is, the bonding tape-shaped segment is discontinuous. Experiments have shown that when these intervals meet the specified standard dimensions, the overall discontinuous bonding tape-shaped segment can also play a shielding role.

[0024] Compared with the prior art, the present application does not fill the gap between the first shell portion and the second shell portion with the connection material, but manufactures the shell in an attached form, wherein a portion of the bonding tape or the bonding tape-shaped segment overlaps with the first shell portion of the shell, and another portion overlaps with the second shell portion of the shell, similar to a patch structure. The present application does not need to fill the connection material in the gap very accurately, so the manufacturing accuracy is reduced, and since it is performed on the outer surface of the shell, it will not have a negative impact on the circuit board assembly inside the shell, and at the same time, the connection surface between the bonding tape or the bonding tape-shaped segment as an intermediate medium and the shell is increased, and the requirements for the connection material are correspondingly reduced, thereby saving costs.

[0025] The bonding belt or the bonding belt-shaped section is made of a heat-conducting material with a certain thermal conductivity. When the shell is assembled in place, the heat of one shell part is transferred to the other shell part provided with the heat dissipation component through the bonding belt or the bonding belt-shaped section, and then finally transferred to the heat dissipation component, solving the problem of heat release of the shell.

[0026] The bonding tape or bonding tape segment is attached to the outer surface of the shell by welding, so impurities generated during the welding process will not splash into the interior of the shell. Once these impurities fall onto the circuit board at high temperature, they will stick to the circuit board after cooling, affecting the working efficiency of the circuit board.

[0027] The present application is applicable to the case where the housing has no flange at the assembly joint line or has limited flanges and thus cannot be assembled and connected using bolts.

[0028] Another aspect of the present application is to provide an integrated vehicle power supply unit, comprising a power electronic unit as described in any one of the above embodiments, wherein at least an on-board charger and a DC / DC converter are integrated inside the housing.

[0029] Another aspect of the present application is to provide a power inverter, comprising a power electronic unit as described in any one of the above embodiments.

[0030] Other aspects and features of the present application will become apparent from the following detailed description with reference to the accompanying drawings. It should be understood, however, that the drawings are designed for illustrative purposes only and are not intended to limit the scope of the present application, as reference should be made to the appended claims. It should also be understood that the drawings are intended only to conceptually illustrate the structures and processes described herein and, unless otherwise indicated, are not necessarily drawn to scale. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] The present application will be more fully understood by referring to the following detailed description of specific embodiments in conjunction with the accompanying drawings, in which the same reference numerals in the drawings always refer to the same elements in the drawings.

[0032] FIG1( a ) is a schematic diagram of an embodiment of a power electronic unit involved in the present application;

[0033] FIG1( b ) is a schematic diagram of an embodiment of a bonding tape involved in the present application;

[0034] FIG1( c ) is a side view of the power electronic unit in FIG1( a );

[0035] FIG. 1( d ) is a side view of another embodiment of the power unit in FIG. 1( a );

[0036] Figure 2 A schematic diagram of another embodiment of a power electronic unit involved in the present application;

[0037] 3(a)-(c) are schematic diagrams of various embodiments of the housing of the power electronic unit involved in the present application; and

[0038] Figure 4 A schematic diagram of an embodiment of a power inverter involved in the present application. DETAILED DESCRIPTION

[0039] In order to help those skilled in the art to accurately understand the subject matter for which protection is sought in the present application, the specific implementation of the present application is described in detail below in conjunction with the accompanying drawings.

[0040] FIG1(a) is a schematic diagram of an embodiment of a power electronic unit involved in the present application. In order to clearly express the concept of the present application, FIG1(a) schematically shows the general structure of the housing of the power electronic unit, and its size and proportion are not limited by the embodiment shown in the figure. The housing of the power electronic unit includes a first shell portion 12 and a second shell portion 14. The first shell portion 12 includes a first outer surface 16 and a first inner surface 18. The second shell portion 14 includes a second outer surface 20 and a second inner surface 22. Here, the so-called "outer surface" refers to the surface of the corresponding shell portion assembled into the housing in contact with the outside world, and the "inner surface" is located inside the housing after the respective shell portions are assembled. The power electronic unit also includes a first circuit board assembly 26. The first circuit board assembly 26 is installed in a cavity 24 inside the housing. In the illustrated embodiment, the first circuit board assembly 26 is carried by the second shell portion 14, and the second inner surface 22 defines a portion of the cavity 24. The remaining portion of the cavity 24 is defined by the first inner surface 18. The first circuit board assembly 26 includes a first circuit board 28 and components mounted thereon. FIG1( a) shows a first circuit board 28 and components on the first circuit board 28 in the form of a dotted frame. The first shell portion 12 is assembled to the second shell portion 14 via a bonding tape 30. When the first shell portion 12 is assembled to the second shell portion 14, the cavity 24 accommodating the first circuit board assembly 26 is closed, and the cavity 24 can shield the electromagnetic radiation of the first circuit board assembly 26.

[0041] FIG1( b ) is a schematic diagram of an embodiment of a bonding tape. The bonding tape 30 has a longitudinal axis l in its extension direction, such as the center line shown in the figure, and the bonding tape 30 includes a first elongated area 32 and a second elongated area 34. The first elongated area 32 is located above the longitudinal axis l, and the second elongated area 34 is opposite to the first elongated area 32. In the illustrated embodiment, the second elongated area 34 is below the longitudinal axis l. Returning to FIG1( a ), at least a portion of the first elongated area 32 overlaps with the first outer surface 16, and at least a portion of the second elongated area 34 overlaps with the second outer surface 20.

[0042] FIG. 1( c ) shows the bonding tape in a side view. The white lines on the first shell portion 12 and the white lines on the second shell portion 14 are the first elongated area 32 and the second elongated area 34, respectively. The bonding tape shown in FIG. 1( c ) is continuous. In other embodiments, the first shell portion 12 and the second shell portion 14 are assembled via bonding tape segments. The bonding tape segments 31 are discontinuous, as shown in FIG. 1( d ). There is a gap m between adjacent bonding tape segments 31. The size of the gap m is set to meet the specification, such as the gap is set to be no more than 3 mm. In one embodiment, the bonding tape 30 or the bonding tape segment 31 surrounds the first shell portion 12 and the second shell portion 14. In another embodiment, depending on the construction of the shell, the bonding tape 30 or the bonding tape segment 31 does not form a complete circle on the shell, but is attached to most of the circumference of the shell, for example, the terminal is set on one side of the shell, such as the front side of the shell, and the bonding tape 30 or the bonding tape segment 31 is attached to the left side, right side, and rear side of the shell.

[0043] The bonding tape 30 or the bonding tape segment 31 is attached to the first shell portion 12 and the second shell portion 14 via a process. In one embodiment, the bonding tape 30 or the bonding tape segment 31 is attached to the first shell portion 12 and the second shell portion 14 by laser welding. The first shell portion 12 and the second shell portion 14 are heated by a laser and a connecting material is applied, the connecting material and part of the material of the first shell portion 12 and the second shell portion 14 are melted, and after cooling, the connecting material is respectively bonded to the first shell portion 12 and the second shell portion 14 to form the bonding tape 30 on the outer surface of the first shell portion 12 and the second shell portion 14. In another embodiment, the bonding tape 30 or the bonding tape segment 31 is an adhesive directly applied to the first shell portion 12 and the second shell portion 14, for example, the bonding tape 30 or the bonding tape segment 31 is attached to the first shell portion 12 and the second shell portion 14 by coating, spraying, etc.

[0044] Figure 2Schematic diagram of another embodiment of the electronic power unit involved in the present application. The housing includes a first shell portion 36 and a second shell portion 38. The electronic power unit also includes a first circuit board assembly 56 and a second circuit board assembly 58 arranged in layers. The first shell portion 36 carries the second circuit board assembly 58 located in the upper layer, and the second shell portion 38 carries the first circuit board assembly 56 located in the lower layer. The first shell portion 36 includes a first plate 40 forming its main body and a cover 42 connected to the first plate 40 to close a cavity 62 accommodating the second circuit board assembly 58. The first plate 40 includes a first plate surface 44 and a second plate surface 46 opposite to the first plate surface 44. The first plate surface 44 faces the first circuit board assembly 56 and forms a part of the first inner surface 48. The second plate surface 46 is used to form a cavity 62 other than the cavity 60 accommodating the first circuit board assembly 56, which accommodates the second circuit board assembly 58. The second plate surface 46 forms a part of the additional inner surface of the first shell portion 36. The cover 42 includes a third outer surface 52 and a third inner surface 54. The third inner surface 54 faces the second circuit board assembly 58. In the illustrated embodiment, the cover 42 can be connected to the first plate 40 by snapping. The cover 42 can also be assembled with the first plate 40 in other ways.

[0045] The second shell portion 38 includes a second plate 50 forming its main body, and the second plate 50 is assembled to the first plate 40 via a bonding tape or a bonding tape segment 61 (63). In the case of using a multi-layer circuit board assembly, the housing may include more layers of shell portions, and these additional shell portions are assembled to the first shell portion 36 or the second shell portion 38 as shown in the figure via bonding tapes or bonding tape segments 61 (63). For example, the bonding tape or bonding tape segment 61 (63) is additionally attached to the first outer surface 47 of the first plate 40 and the outer surface of the additional shell portion. When the power electronic unit needs to integrate more functions, a third shell portion, a fourth shell portion, etc. are added by stacking the housing to accommodate more layers of circuit board assemblies to expand the space.

[0046] The first board 40 has a shielding structure. The first board surface 44 has one or more covers 64 open to the components of the first circuit board assembly 56. When the first board 40 is assembled with the second board 50, these covers 64 can separate multiple components and cover the space of the separated components to play a shielding role, so that the isolation device designed for the components on the first circuit board can be omitted. The second board surface 46 has one or more upright retaining walls 66 for separating the components of the second circuit board assembly 58. The second circuit board assembly 58 includes multiple circuit boards arranged in a space surrounded by the retaining walls 66. In one embodiment, the cover 64 is concave on the first board surface 44, that is, the cover 64 bulges toward the direction of the second board surface 46. The retaining wall 66 is formed by means of part of the cover 64. The components of the first circuit board assembly 56 are arranged facing the first board surface 44, that is, arranged upward, and the components of the second circuit board assembly 58 are arranged facing the second board surface 46, that is, arranged downward, as shown in the figure, so that the arrangement effect is more compact. In an alternative embodiment, the first circuit board assembly 56 includes multiple circuit boards. In another alternative embodiment, the second outer surface 46 has one or more covers 68 open to the components of the second circuit board assembly 58 , and the covers 68 are recessed on the second board surface 46 .

[0047] The first circuit board assembly 56 and the second circuit board assembly 58 each play different roles and functions. Most of the power devices can be arranged on the first circuit board, so that a part of the first circuit board assembly 56 is used as a power circuit board assembly carrying the power devices; and most of the logic devices can be arranged on the second circuit board, so that a part of the second circuit board assembly 58 is used as a logic circuit board assembly carrying the logic devices. The volume of power devices is generally large, while the volume of logic devices is generally small. Large-volume components are arranged on the first circuit board assembly 56, and small-volume components are arranged on the second circuit board assembly 58.

[0048] The bonding tape or bonding tape segment 61 (63) is made of a heat-conducting material. After the bonding tape or bonding tape segment 61 (63) is attached to the first plate 40 and the second plate 50, the heat of one layer of the shell portion of the housing can be transferred to the other layer of the shell portion via the bonding tape or bonding tape segment 61 (63). In the illustrated embodiment, the second layer of the shell portion 38 is integrated with a heat dissipation component 70, so that the heat from the first layer of the shell portion 36 is transferred to the heat dissipation component 70 via the second layer of the shell portion 38. Whether the first circuit board assembly 56 or the second circuit board assembly 58 generates heat during operation, if the housing cannot transfer the heat in time, it puts high demands on the operating temperature of the components and may have a negative impact on the circuit. If a heat dissipation component is arranged near each heat source, the volume of the power electronic unit will increase. Through the thermal bridge effect of the bonding tape or bonding tape segment 61 (63), the heat away from the heat dissipation component 70 can be transferred to the heat dissipation component 70. In the illustrated embodiment, the heat dissipation component 70 is arranged at the bottom of the second shell portion 38, and heat is released to the surrounding environment outside the shell through the heat dissipation component 70. The heat dissipation component 70 can be a heat exchanger that allows air or refrigerant to pass through, such as a water pipe.

[0049] Here, the thermally conductive material is a material with high thermal conductivity or a certain thermal conductivity, which can be a metal, an alloy, or a composite material. The thermal conductivity can be above 50W / (m*k). In one embodiment, the same material as the shell material is used to perform laser welding with the first shell portion and the second shell portion constituting the shell. For example, the shell is made of AlSi10MgFe, and its thermal conductivity can reach 155W / (m*k). In other embodiments, the composite material is attached to the respective outer surfaces of the first shell portion and the second shell portion by applying a composite material. For example, a bonding tape or a bonding tape-shaped section is formed as a copper tape, and the copper tape is made of a composite material with copper as the base. The composite material includes a combination of copper and an adhesive, and its thermal conductivity ranges from 50-100W / (m*k). The heat conduction effect can be improved by adjusting the width of the copper tape, for example, increasing the width.

[0050] The shell is constructed to have a flat shape. Figures 3(a)-(c) are schematic diagrams of multiple embodiments of the first shell portion and the second shell portion to be assembled. In the embodiment shown in Figure 3(a), the first shell portion 74 and the second shell portion 76 have a gap n in the height direction of the shell 72 in the assembled state, and a bonding tape or a bonding tape-like section 78 is applied to the first shell portion 74 and the second shell portion 76 from the outside and across the gap n. The first outer surface 75 is located on the side wall of the first shell portion 74, and the second outer surface 77 is located on the side wall of the second shell portion 76. In the embodiment shown in Figure 3(b), the first shell portion 74' is formed as a top plate of the shell 72', and in the assembled state, the gap n' exists in the height direction of the shell 72'. Similar to Figure 3(a), the first outer surface 75' and the second outer surface 77' are respectively located on the side / side wall of the corresponding layer shell portion. For example, as Figure 2 Other alternatives to the embodiment shown are that the cover (i.e., the top plate 74' in FIG. 3(b)) and the second plate (i.e., 76' in FIG. 3(b)) are assembled via a bonding strip or a bonding strip-like section 78' to replace Figure 2 Assembly of the first plate 40 and the second plate 50 in the embodiment. In the embodiment shown in FIG. 3(c), the first shell portion 74" is also formed as the top plate of the shell 72". In the assembled state, the gap n" exists in the plane direction where the top plate extends, that is, the gap n" is the periphery of the first shell portion 72". In this embodiment, the first outer surface 75" and the second outer surface 77" are on the upper surface of the corresponding shell portion. Figure 3(b)-3(c) In an alternative embodiment, the second shell portion 76', 76" may be formed as a bottom plate of the housing 72', 72". A gap n', n" exists below the housing 72', 72".

[0051] The present application is applicable to situations where the components of the shell do not have flanges or the flange area is very small. Because when each shell part 74, 74', 74", 76, 76', 76" has a flange with a larger area, these shell parts can be assembled together with the help of bolts. Of course, the connecting strip or the connecting strip section 78, 78', 78" can also be assembled and manufactured together with the bolts. In addition, the shell has a thinner wall thickness. In one embodiment, the first shell part 74, 74', 74" and / or the second shell part 76, 76', 76" have a side wall thickness of no more than 6mm. In a further embodiment, the side wall thickness is between 3-5mm.

[0052] In one embodiment, the shell 72, 72', 72" is made of aluminum alloy. In another embodiment, the bonding tape or the bonding tape-like section 78, 78', 78" is a metal tape, which is made of aluminum, copper, silver, iron, an alloy, or a combination thereof, such as copper foil. The metal tape has a certain thermal conductivity. In yet another embodiment, the bonding tape or the bonding tape-like section 78, 78', 78" is an electromagnetic shielding tape.

[0053] The present application also relates to an on-board power integrated unit, which includes a housing of a power electronic unit as described in any of the aforementioned embodiments, and an on-board charger and a DC / DC converter are integrated inside the housing. This on-board power integrated unit is a typical two-in-one on-board power integrated product. The on-board power integrated unit can also be a three-in-one or even multi-in-one on-board power integrated product. In addition to the on-board charger and DC / DC converter, a drive system or an electric drive system can also be integrated inside the housing.

[0054] The present application also relates to a power inverter, which comprises a housing of the power electronic unit described in any one of the aforementioned embodiments. Figure 4 The schematic diagram of an embodiment of the power inverter involved in the present application shows the general structure of the power inverter in the form of an exploded diagram. The power inverter includes a first shell portion 80, a second shell portion 82, a first circuit board assembly 84, and a second circuit board assembly 86. The first shell portion 80 includes a first plate 88 and a cover 90, and the second circuit board assembly 86 is supported by the first plate 88 and is located between the cover 90 and the first plate 88. The second shell portion 82 includes a second plate 92, and the inner surface of the second plate 92 forms a space 94 that is recessed inwardly, and the first circuit board assembly 84 is supported by the second plate 92 and is located between the first plate 88 and the second plate 92.

[0055] The first plate 88 is assembled with the cover 90 to form a cavity (not shown) that accommodates the second circuit board assembly 86 and can electromagnetically shield it. The components (not shown) of the second circuit board assembly 86 are arranged downward and covered by the cover 98 on the first plate 88. Some components of the first circuit board assembly 84 are arranged upward and covered by the cover 99 on the first plate 88. Other components of the first circuit board assembly (such as the IGBT module 100) are arranged downward. The heat dissipation component 102 is integrated on the second plate 92 and arranged in the internal space 94 of the second plate 92, while facing the bottom of the IGBT module 100 to directly dissipate heat for the IGBT module 100. After the cover 90 is assembled with the first plate 88, the first shell part 80 is first formed. Subsequently, a bonding tape or a bonding tape section (not shown) is applied to the respective outer surfaces of the first shell part 80 and the second shell part 82 (i.e., the second plate 92 whose internal space 94 has been arranged) to assemble the two together to form the final housing of the power inverter.

[0056] Although specific embodiments of the present application have been shown and described in detail to illustrate the principles of the present application, it should be understood that the present application can be implemented in other ways without departing from such principles.

Claims

1. A power electronic unit, characterized in that include A housing comprising a first shell portion (12) having a first outer surface (16); and a second shell portion (14), the second shell portion (14) having a second outer surface (20), wherein one of the first shell portion (12) or the second shell portion (14) has a cavity (24) therein; at least a first circuit board assembly (26), the first circuit board assembly (26) being mounted in the cavity (24); as well as A bonding tape or bonding tape-like segment (30, 31), the first shell part (12) is assembled to the second shell part (14) via the bonding tape or bonding tape-like segment (30, 31) to close the cavity (24), the bonding tape or bonding tape-like segment (30, 31) having a longitudinal axis (1) in the extension direction of the tape, a first slender area (32) located on one side of the longitudinal axis (1), and a second slender area (34) opposite to the first slender area (32), wherein at least a portion of the first slender area (32) overlaps with the first outer surface (16), and at least a portion of the second slender area (34) overlaps with the second outer surface (20).

2. The power electronic unit according to claim 1, characterized in that It also includes a heat dissipation component (70), which is integrated on the first shell part or the second shell part, and the bonding belt or the bonding belt segment is made of a heat-conducting material, so that the heat away from one of the shell parts of the heat dissipation component (70) is transferred to the heat dissipation component (70) via the other shell part.

3. The power electronic unit according to claim 2, characterized in that: The bonding tape or bonding tape-like sections (30, 31) are metal foil applied to the first outer surface (16) and the second outer surface (20) by laser welding or adhesive applied directly to the first outer surface (16) and the second outer surface (20).

4. The power electronic unit according to any one of claims 1 to 3, characterized in that: The first shell portion (12) has a first inner surface (18), and the second shell portion (14) has a second inner surface (22), one of the first inner surface (18) and the second inner surface (22) defines a portion of the cavity (24), and the other of the first inner surface (18) and the second inner surface (22) defines the remaining portion of the cavity (24), wherein the first circuit board assembly (26) is supported by the second shell portion (14).

5. The power electronic unit according to claim 4, characterized in that A second circuit board assembly (58) is also included and is carried by the first shell portion, the first shell portion including a first plate (40) forming a body thereof and a cover (42) connected to the first plate (40) to enclose the second circuit board assembly (58).

6. The power electronic unit according to claim 5, characterized in that: The first board (40) includes a shielding structure having a first board surface (44) substantially parallel to the first circuit board assembly and a second board surface (46) opposite to the first board surface (44), the first board surface (44) being configured to have one or more covers (64) open toward components of the first circuit board assembly, and / or The second board surface (46) is configured to have one or more upright retaining walls (66) for separating components of the second circuit board assembly.

7. The power electronic unit according to claim 4, characterized in that: The shell is constructed to have a flat shape; the first shell part and the second shell part have a gap in the height direction of the shell in the assembled state, the first outer surface is located on the side wall of the first shell part, and the second outer surface is located on the side wall of the second shell part.

8. The power electronic unit according to claim 5, characterized in that: At least a portion of the first circuit board assembly is used as a power circuit board on which power devices are arranged; at least a portion of the second circuit board is used as a logic circuit board on which logic devices are arranged, and / or The volume of components of the first circuit board assembly carried by the second shell portion is larger than the volume of components of the second circuit board assembly carried by the first shell portion.

9. An integrated vehicle power supply unit, characterized in that It comprises a power electronic unit according to any one of claims 1 to 8, wherein at least an on-board charger and a DC / DC converter are integrated inside the housing.

10. A power inverter, characterized in that The method comprises a power electronic unit according to any one of claims 1 to 8.

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