Circuit board outer layer etching process and outer layer etching spraying system

Abstract

The invention relates to the field of circuit board outer layer etching, in particular to a circuit board outer layer etching process and an outer layer etching spraying system which comprise a three-way electromagnetic valve and the like. According to the spraying system for etching the outer layer of the circuit board, the large spraying nozzle directly performs spraying and etching treatment on a large-area continuous etching part in the circuit board in a large-range spraying manner, and the plurality of small spraying nozzles perform spraying and etching treatment on a long and narrow circuit etching part of the circuit board in a partitioned concentrated spraying manner; on the basis of saving the usage amount of the etching liquid, the exchange rate of the etching liquid at the etching part of the long and narrow circuit of the circuit board is improved; the defect that a large amount of etching liquid is wasted due to the fact that the working efficiency is low when the etching liquid is used for spraying and etching the etching part of the long and narrow circuit of the circuit board, and the spraying pressure of the etching liquid needs to be additionally increased to improve the exchange rate of the etching liquid is overcome.

Description

Technical Field

[0001] The invention relates to the field of circuit board outer layer etching, in particular to a circuit board outer layer etching process and an outer layer etching spray system. Background Art

[0002] In the step of spraying etching liquid on the circuit board for outer layer etching, if there are many narrow and long line etching structures with narrow areas in the circuit board, after the etching liquid enters the etching part of the narrow and long line structure in the circuit board, the etching liquid cannot be discharged from the outside in time, resulting in that the subsequent etching liquid is not easy to enter the narrow and long line etching part to exchange the original etching liquid, that is, the exchange rate of the etching liquid in the narrow and long line etching part is low, affecting the etching efficiency of the etching liquid on the narrow and long line etching part. Therefore, compared with the working efficiency of the etching liquid spraying etching treatment on the large-area continuous etching part in the circuit board, the working efficiency of the etching liquid spraying etching treatment on the narrow and long line etching part of the circuit board is low. At this time, it is necessary to increase the spray flow rate of the etching liquid in the area, so that the sprayed etching liquid rushes into the narrow and long line etching part at a high flow rate, so as to improve the exchange rate of the etching liquid in the narrow and long line etching part of the circuit board, thereby improving the overall etching uniformity of the circuit board, and using the efficient exchange efficiency of the etching liquid to take away the impurities generated on the surface of the circuit board in the etching step. This treatment method will lead to a large amount of etching liquid waste. Summary of the invention

[0003] In order to overcome the disadvantage that the working efficiency of spray etching treatment of narrow and long circuit etching parts of a circuit board with etching liquid is low, it is necessary to increase the spray pressure of the etching liquid to improve the exchange rate of the etching liquid, resulting in a large amount of etching liquid being wasted, the present invention provides a circuit board outer layer etching process and an outer layer etching spray system.

[0004] A circuit board outer layer etching process of the present invention comprises the following steps: Step 1: The circuit board is conveyed through the conveyor bed to the bottom of the spraying area corresponding to each three-way solenoid valve, and the circuit board is spray-etched; Step 2: During the operation in step 1, the three-way solenoid valve uses a large spray nozzle to spray in a wide range, and cooperates with the rear spray pipe to directly spray and etch a large area of ​​continuous etching parts in the circuit board; Step 3: During the operation in step 1, the three-way solenoid valve utilizes a plurality of small spray nozzles on the transverse pipe to perform spray etching treatment on the narrow and long line etching parts of the circuit board in a high impact spray state in a partitioned manner; Step 4: During the operation of step 1, the waste liquid from the spraying is recovered by utilizing the waste liquid reflux system in the conveyor bed.

[0005] Preferably, the spray angle of the small spray nozzle on the transverse pipe is adjusted so that the small spray nozzle is directly aligned with the position of the narrow and long line structure etching part in the spray area to perform spray etching processing.

[0006] The invention discloses a circuit board outer layer etching spray system, comprising a conveying bed, a mounting frame, a main pipeline, an upper pipeline, a branch pipeline, a three-way solenoid valve, a mounting plate, a fixing frame, a transverse pipeline, a small spray nozzle and a large spray nozzle; at least two mounting frames are fixedly connected to the conveying bed; a main pipeline is fixedly connected inside the conveying bed; an upper pipeline is fixedly connected to the mounting frame; the upper pipeline is connected to the main pipeline; a plurality of branch pipelines are connected to the upper pipeline; a three-way solenoid valve is connected to the branch pipeline; a mounting plate is connected to the three-way solenoid valve; a fixing frame is fixedly connected to the mounting plate; a transverse pipeline is fixedly connected to the fixing frame; the transverse pipeline is connected to the first outlet end of the corresponding three-way solenoid valve; a plurality of small spray nozzles are connected to each of the transverse pipelines; a large spray nozzle is connected to the second outlet end of the three-way solenoid valve.

[0007] Preferably, the small spray nozzle and the large spray nozzle are both configured as conical flat nozzle structures.

[0008] Preferably, a plurality of parallel plates are provided at the outlet end of the large spray nozzle.

[0009] Preferably, the mounting disk is rotatably connected to the corresponding three-way solenoid valve; a first spur gear is fixedly connected to the mounting disk; a first motor is mounted on the three-way solenoid valve; a second spur gear is fixedly connected to the output shaft of the first motor; and the first spur gear is meshed with the corresponding second spur gear.

[0010] Preferably, the upper pipeline is connected to a plurality of rear spray pipes, and the rear spray pipes and the branch pipelines are arranged alternately.

[0011] Preferably, the rear spray pipe is connected to a rear spray nozzle, and the rear spray nozzle is set to a conical flat nozzle structure.

[0012] Preferably, the mounting frame is fixedly connected with a fixing rod corresponding to the rear spray pipe; a second motor is installed at the lower end of the fixing rod; a ball valve is provided in the rear spray nozzle; and a first through hole structure is opened in the ball valve.

[0013] Preferably, a second through hole structure is provided in the ball valve, and the aperture of the second through hole is larger than the aperture of the first through hole.

[0014] The invention discloses a circuit board outer layer etching spray system, wherein a plurality of small spray nozzles are arranged on a three-way solenoid valve through a mounting plate and a transverse pipe, and a large spray nozzle is directly connected to the three-way solenoid valve, and a large-area continuous etching part in the circuit board is directly subjected to spray etching treatment in a wide-range spraying manner through the large spray nozzle, and a narrow and long line etching part of the circuit board is subjected to spray etching treatment in a partitioned concentrated spraying manner through a plurality of small spray nozzles, and the small spray nozzle can increase the spray impact pressure of the etching liquid under the same etching liquid spray flow rate, thereby increasing the exchange rate of the etching liquid in the narrow and long line etching part of the circuit board on the basis of saving the usage amount of the etching liquid; in addition, the first motor controls the deflection direction and angle of the transverse pipe on the mounting plate, so that the etching liquid sprayed from the small spray nozzle can perform efficient spray etching work on the narrow and long line etching concentrated part concentrated on one side of the spraying area, and at the same time, the etching liquid sprayed from the rear spray nozzle timely provides sufficient etching liquid to the other side of the spraying area; The circuit board outer layer etching spray system of the present invention effectively overcomes the disadvantages that the working efficiency of the etching liquid spraying etching treatment on the narrow and long circuit etching parts of the circuit board is low, and the etching liquid spray pressure needs to be additionally increased to improve the etching liquid exchange rate, resulting in a large amount of etching liquid waste. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 A schematic diagram of the structure of the present invention is described according to an embodiment; Figure 2 A schematic diagram of the main pipeline and upper pipeline structure of the present invention is described according to an embodiment; Figure 3 A schematic diagram of the structure of a three-way solenoid valve according to an embodiment of the present invention is described; Figure 4 A schematic diagram of the three-dimensional structure of a small spray nozzle according to an embodiment of the present invention is described; Figure 5 A cross-sectional view of the rear spray nozzle structure of the present invention is described according to an embodiment; Figure 6 The figure is a cross-sectional view of the ball valve structure according to the embodiment of the present invention.

[0016] Markings in the accompanying drawings: 1-transfer bed, 2-mounting frame, 31-main pipeline, 32-upper pipeline, 33-branch pipeline, 4-three-way solenoid valve, 41-mounting plate, 42-fixing frame, 43-transverse pipeline, 44-small spray nozzle, 45-large spray nozzle, 451-parallel plate, 46-first spur gear, 47-first motor, 48-second spur gear, 51-rear spray pipe, 52-rear spray nozzle, 53-fixing rod, 54-second motor, 55-ball valve, 5501-first through hole, 5502-second through hole. DETAILED DESCRIPTION

[0017] Hereinafter, embodiments of the present invention will be described with reference to the drawings.

[0018] Example 1 A circuit board outer layer etching spray system, such as Figure 1-Figure 5 As shown, it includes a conveying bed 1, a mounting frame 2, a main pipeline 31, an upper pipeline 32, a branch pipeline 33, a three-way solenoid valve 4, a mounting plate 41, a fixing frame 42, a transverse pipeline 43, a small spray nozzle 44, and a large spray nozzle 45; two mounting frames 2 are fixedly connected to the conveying bed 1; two main pipelines 31 are fixedly connected inside the conveying bed 1; an upper pipeline 32 is fixedly connected to each mounting frame 2; the left end and the right end of the upper pipeline 32 are respectively connected to the two main pipelines 31; each upper pipeline 32 is connected to a plurality of branch pipelines 33; each branch pipeline 33 is connected to a three-way solenoid valve 4; each three-way solenoid valve 4 is rotatably connected to a mounting plate 41; each mounting plate 41 is fixedly connected to a fixing frame 42; each fixing frame 42 is fixedly connected to a transverse pipeline 43; each transverse pipeline 43 is respectively connected to the first outlet end of the corresponding three-way solenoid valve 4; each transverse pipeline 43 is connected with a plurality of small spray nozzles 44; the second outlet end of each three-way solenoid valve 4 is connected with a large spray nozzle 45; the liquid inlet end of the three-way solenoid valve 4 is initially connected with the second outlet end; each small spray nozzle 44 and the large spray nozzle 45 are configured as a tapered flat nozzle structure that widens downward toward the left and right directions; the outlet end of each large spray nozzle 45 is provided with a plurality of parallel plates 451 arranged in the left and right directions, and the etching liquid sprayed from the outlet end of the large spray nozzle 45 will fall vertically evenly under the limiting and guiding action of each parallel plate 451, so that the spray range of the etching liquid is concentrated; each mounting plate 41 is fixedly connected with a first spur gear 46; each three-way solenoid valve 4 is installed with a first motor 47; the output shaft of each first motor 47 is fixedly connected with a second spur gear 48; each first spur gear 46 is respectively meshed with the corresponding second spur gear 48.

[0019] like Figure 2 , Figure 3 and Figure 5 As shown, the rear sides of the two upper pipes 32 are respectively connected to a plurality of rear spray pipes 51, and the rear spray pipes 51 and the branch pipes 33 are alternately arranged in the left and right directions of the same upper pipe 32; the lower ends of the rear spray pipes 51 are connected to the rear spray nozzles 52, and the rear spray nozzles 52 are configured as a tapered flat nozzle structure that is downward and widens in the left and right directions. The etching liquid flowing out of the first through hole 5501 of the ball valve 55 is sprayed and etched along the diffusion range limited by the shape of the rear spray nozzles 52, and the diffusion range of the etching liquid sprayed downward from the rear spray nozzles 52 toward the front and rear sides is limited, so that the etching liquid can only diffuse toward the left and right sides.

[0020] The following are the steps of spray etching treatment of a circuit board outer layer etching spray system of the present invention: Before etching the circuit board, the circuit structure information of the circuit board is input into the control system, so that the control system can cooperate with an external image recognition camera to actively identify the distribution of large-area continuous etching areas and narrow and long circuit structure etching areas in the circuit board, so as to perform corresponding treatment on the two etching areas respectively.

[0021] The two main pipelines 31 are connected to the etching liquid conveying equipment. A waste liquid reflux system is installed in the conveyor bed 1. The etching liquid conveying equipment conveys the etching liquid to the branch pipelines 33 of each upper pipeline 32 through the main pipeline 31. After most of the etching liquid enters the inlet end of the three-way solenoid valve 4 from the branch pipeline 33, the etching liquid is directly sprayed downward from the large spray nozzle 45 through the second outlet end of the three-way solenoid valve 4. The sprayed etching liquid is continuously exchanged in the large-area continuous etching parts of the circuit board to perform etching work. Each three-way solenoid valve 4 corresponds to a spray area of ​​the circuit board, and each large spray nozzle 45 concentrates on spraying and etching the etching part in the middle of the corresponding spray area. At the same time, another part of the etching liquid is sprayed downwardly to the adjacent part between two adjacent spray areas through the rear spray pipe 51, and the corresponding spray etching treatment is performed on the adjacent part between the two adjacent spray areas, so that the large spray nozzle 45 can spray in a large range, and cooperate with the rear spray pipe 51 to directly spray and etch the large-area continuous etching part in the circuit board. At this time, the etching liquid sprayed in a large-area spray manner can efficiently flow through various areas of the large-area continuous etching part in the circuit board, thereby improving the utilization rate of the etching liquid and greatly reducing the total usage of the etching liquid. The exchanged etching liquid is discharged into the waste liquid reflux system in the conveyor bed 1 in the form of waste liquid.

[0022] When there is a narrow and long circuit structure etching part in a certain spray area of ​​the circuit board, the three-way solenoid valve 4 corresponding to the spray area is switched to the inlet end connected to the first outlet end. At this time, after most of the etching liquid enters the inlet end of the three-way solenoid valve 4 from the branch pipe 33, the etching liquid passes through the second outlet end of the three-way solenoid valve 4 and the transverse pipe 43 in turn, and is sprayed downward from each small spray nozzle 44. The spray range of the etching liquid sprayed from the small spray nozzle 44 is reduced, but the impact pressure of the etching liquid sprayed from the small spray nozzle 44 is greatly increased. At the same time, the first motor 47 drives the second spur gear 48 to rotate, the second spur gear 48 engages with the first spur gear 46 to drive the mounting plate 41 to rotate, and the mounting plate 41 drives the transverse pipe 43 on the fixing frame 42. The transverse pipe 43 and the small spray nozzles 44 are deflected at a small angle, so that the etching liquid sprayed from the small spray nozzles 44 are aimed at the position of the narrow and long line structure etching part in the spray area, and all the small spray nozzles 44 on the transverse pipe 43 are gathered in the deflection direction, and the spray density of all the small spray nozzles 44 on the transverse pipe 43 to the side part of the spray area is increased by reducing the lateral distribution space of the small spray nozzles 44. At this time, the etching liquid sprayed from the small spray nozzles 44 is divided into high-impact spray states and rushed into the narrow and long line structure etching part, thereby achieving the improvement of the exchange rate of the etching liquid in the narrow and long line etching part of the circuit board on the basis of saving the usage of the etching liquid, and ensuring the efficient completion of the spray etching treatment work on the narrow and long line etching part of the circuit board.

[0023] When multiple narrow and long circuit structure etching parts in a certain spray area in the circuit board are concentrated on the same side, the first motor 47 drives the second spur gear 48 to rotate, so that the mounting plate 41 drives the transverse pipe 43 and the small spray nozzle 44 on the fixed frame 42 to deflect at a large angle to the concentrated side of the spray area where multiple narrow and long circuit structure etching parts are located, so that multiple small spray nozzles 44 are concentrated above this side of the spray area, and efficient spray etching treatment is concentrated on each narrow and long circuit structure etching part.

[0024] Example 2 On the basis of Example 1, Figure 1-Figure 6 As shown, a plurality of fixing rods 53 corresponding to the rear spray pipes 51 are fixedly connected to the rear sides of the two mounting frames 2; a second motor 54 is installed at the lower end of each fixing rod 53; a ball valve 55 is provided in each rear spray nozzle 52; a first through hole 5501 is provided in each ball valve 55, and the rear spray pipe 51 is initially connected to the rear spray nozzle 52 through the first through hole 5501.

[0025] In this embodiment, Figure 3As shown, in the spray area jointly responsible for the small spray nozzle 44, the large spray nozzle 45 and the rear spray nozzle 52, when the transverse pipe 43 on the three-way solenoid valve 4 deflects to the right, the spray etching work is concentrated on the narrow and long line etching concentrated part on the right side of the spray area, and under the working condition that there are also a small number of etching parts on the left side of the spray area, the second motor 54 corresponding to the rear spray pipe 51 on the left side of the three-way solenoid valve 4 drives the ball valve 55 connected thereto to rotate, so that the outlet end of the first through hole 5501 of the ball valve 55 deflects to the right, and at this time, more etching liquid flowing out of the first through hole 5501 of the ball valve 55 is sprayed toward the right side of the rear spray nozzle 52, and more etching liquid is sprayed from the rear spray nozzle 52 to the left side of the spray area, so that the etching part on the left side of the spray area can also be sufficiently sprayed with etching liquid, and the corresponding spray etching work is efficiently completed on the basis of saving the amount of etching liquid used.

[0026] Example 3 On the basis of Example 2, Figure 1-Figure 5 As shown, a second through hole 5502 is provided in the ball valve 55 , and the second through hole 5502 and the first through hole 5501 in the same ball valve 55 are in a cross state with each other, and the aperture of the second through hole 5502 is larger than the aperture of the first through hole 5501 .

[0027] In this embodiment, the transverse pipe 43 on a certain three-way solenoid valve 4 deflects to the right, and the spray etching work is concentrated on the narrow and long line etching concentrated part on the right side of the spray area, and there is a small amount of etching part on the left side of the spray area. At the same time, the transverse pipe 43 on the three-way solenoid valve 4 on the left side of the three-way solenoid valve 4 deflects to the left, and the spray etching work is concentrated on the narrow and long line etching concentrated part on the left side of another spray area, and there is also a small amount of etching part on the right side of the spray area. Under the working conditions, the adjacent parts between the two adjacent spray areas can only be sprayed and etched by the etching liquid sprayed from the rear spray nozzle 52. Therefore, the ball valve 55 in the rear spray nozzle 52 cannot be deflected to any side to In order to provide more etching liquid, the second motor 54 needs to drive the ball valve 55 connected thereto to rotate, so that the second through hole 5502 replaces the first through hole 5501 to connect the rear spray pipe 51 with the rear spray nozzle 52. At this time, the amount of etching liquid sprayed from the second through hole 5502 of the ball valve 55 at the same time is much greater than the amount of etching liquid sprayed from the first through hole 5501 of the ball valve 55, and the etching liquid sprayed from the second through hole 5502 of the ball valve 55 will diffuse along the rear spray nozzle 52 to the adjacent part between the above-mentioned two adjacent spray areas with a larger flow rate, thereby providing sufficient etching liquid spray treatment to the adjacent part between the two adjacent spray areas, and efficiently completing the corresponding spray etching work.

[0028] Those skilled in the art should understand that the above embodiments do not limit the present invention in any form, and any technical solutions obtained by equivalent replacement or equivalent transformation shall fall within the protection scope of the present invention.

Claims

1. A circuit board outer layer etching process, characterized in that: The following steps are involved: Step 1: conveying the circuit board through the conveyor bed (1) to the bottom of the spraying area corresponding to each three-way solenoid valve (4), and performing spray etching on the circuit board; Step 2: During the operation of step 1, the three-way solenoid valve (4) uses a large spray nozzle (45) to spray over a large area in cooperation with the rear spray pipe (51) to directly perform spray etching on a large area of ​​continuous etching parts in the circuit board; Step 3: During the operation of step 1, the three-way solenoid valve (4) uses a plurality of small spray nozzles (44) on the transverse pipe (43) to spray and etch the narrow and long circuit etching parts of the circuit board in a high-impact spray state in a zoned manner; Step 4: During the operation of step 1, the waste liquid reflow system in the conveyor bed (1) is used to recycle the spray waste liquid.

2. A circuit board outer layer etching process according to claim 1, characterized in that: The spraying angle of the small spray nozzle (44) on the transverse pipe (43) is adjusted so that the small spray nozzle (44) is directly aligned with the position of the narrow and long line structure etching part in the spraying area to perform spray etching processing.

3. A circuit board outer layer etching spray system, the system using a circuit board outer layer etching process according to claim 1 or 2, comprising: a conveyor bed (1); at least two mounting frames (2) are fixedly connected to the conveyor bed (1); a main pipeline (31) is fixedly connected inside the conveyor bed (1); an upper pipeline (32) is fixedly connected to the mounting frame (2); the upper pipeline (32) is connected to the main pipeline (31); a plurality of branch pipelines (33) are connected to the upper pipeline (32); Features: It also includes a three-way solenoid valve (4); the branch pipe (33) is connected to the three-way solenoid valve (4); the three-way solenoid valve (4) is connected to a mounting plate (41); the mounting plate (41) is fixedly connected to a fixing frame (42); the fixing frame (42) is fixedly connected to a transverse pipe (43); the transverse pipe (43) is connected to a first outlet end of a corresponding three-way solenoid valve (4); each of the transverse pipes (43) is connected to a plurality of small spray nozzles (44); and the second outlet end of the three-way solenoid valve (4) is connected to a large spray nozzle (45).

4. A circuit board outer layer etching spray system according to claim 3, characterized in that: The small spray nozzle (44) and the large spray nozzle (45) are both configured as conical flat nozzle structures.

5. A circuit board outer layer etching spray system according to claim 4, characterized in that: A plurality of parallel plates (451) are provided at the outlet end of the large spray nozzle (45).

6. A circuit board outer layer etching spray system according to claim 5, characterized in that: The mounting plate (41) is rotatably connected to the corresponding three-way solenoid valve (4); a first spur gear (46) is fixedly connected to the mounting plate (41); a first motor (47) is mounted on the three-way solenoid valve (4); an output shaft of the first motor (47) is fixedly connected to a second spur gear (48); and the first spur gear (46) is meshed with the corresponding second spur gear (48).

7. A circuit board outer layer etching spray system according to claim 5, characterized in that: The upper pipeline (32) is connected to a plurality of rear spray pipes (51), and the rear spray pipes (51) and the branch pipelines (33) are arranged alternately.

8. A circuit board outer layer etching spray system according to claim 7, characterized in that: The rear spray pipe (51) is connected to a rear spray nozzle (52), and the rear spray nozzle (52) is configured as a conical flat nozzle structure.

9. A circuit board outer layer etching spray system according to claim 8, characterized in that: The mounting frame (2) is fixedly connected with a fixing rod (53) corresponding to the rear spray pipe (51); a second motor (54) is installed at the lower end of the fixing rod (53); a ball valve (55) is provided in the rear spray nozzle (52); and a first through hole (5501) structure is provided in the ball valve (55).

10. A circuit board outer layer etching spray system according to claim 9, characterized in that: A second through hole (5502) structure is provided in the ball valve (55), and the diameter of the second through hole (5502) is larger than the diameter of the first through hole (5501).

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