Display panel, mask plate and preparation method of display panel

Abstract

Embodiments of the present application provide a display panel, a mask and a preparation method of the display panel, and relate to the technical field of display, which can reduce the risk of scratching the metal wiring layer of the display panel. The display panel comprises: a substrate, the substrate comprising a display area and a non-display area, the non-display area at least partially surrounding the display area; a metal wiring layer located on one side of the substrate, and the metal wiring layer is located in the non-display area; a first encapsulation layer comprising a first encapsulation structure and a second encapsulation structure, the first encapsulation structure being located on the side of the metal wiring layer away from the substrate, the second encapsulation structure being located on the same side of the metal wiring layer as the substrate, and the second encapsulation structure being located in the display area, the first encapsulation structure and the second encapsulation structure being connected, and the first encapsulation structure and the second encapsulation structure being provided in the same layer; wherein the thickness of the first encapsulation structure is less than the thickness of the second encapsulation structure.

Description

Display panel, photomask, and method for fabricating display panel Technical Field

[0001] This application relates to the field of display technology, and in particular to a display panel, a photomask, and a method for preparing the display panel. Background Technology

[0002] With the rapid development of display technology, the requirements for the reliability and stability of display panels are gradually increasing. In traditional display panel manufacturing methods, the first encapsulation layer is usually formed in the display area of ​​the display panel using processes such as chemical vapor deposition based on a photomask.

[0003] However, in actual fabrication processes, to improve efficiency, a grid-like mask is typically used to simultaneously fabricate the first encapsulation layer of multiple display panels. As the number and area of ​​openings on the mask increase, the mask's own weight causes a certain amount of sinking, resulting in some deformation. Therefore, when bonding the mask to the substrate of the display panel, this sinking can cause the mask's edges to come into contact with the metal traces in the non-display areas of the display panel. This can further scratch the metal traces, increasing the risk of short circuits and other display defects, affecting the accuracy of the displayed image, as well as the reliability and stability of the display panel, ultimately impacting the display effect and performance. Summary of the Invention

[0004] Based on this, the present application provides a display panel, a mask, and a method for manufacturing the display panel, which can avoid the mask from scratching the metal traces and avoid short circuits and other poor contact caused by scratches on the metal traces. This can improve the accuracy of the displayed image, as well as the reliability and stability of the display panel, and improve the display effect and display performance of the display panel.

[0005] A first aspect of this application provides a display panel, including:

[0006] A substrate, the substrate including a display area and a non-display area, the non-display area at least partially surrounding the display area;

[0007] A metal trace layer is located on one side of the substrate, and the metal trace layer is located within the non-display area;

[0008] The first encapsulation layer includes a first encapsulation structure and a second encapsulation structure. The first encapsulation structure is located on the side of the metal trace layer away from the substrate. The second encapsulation structure is located on the same side of the substrate as the metal trace layer and is located within the display area. The first encapsulation structure and the second encapsulation structure are connected and are disposed on the same layer.

[0009] The thickness of the first packaging structure is less than the thickness of the second packaging structure.

[0010] In some embodiments, the first encapsulation layer includes an encapsulation opening located within the non-display area, the encapsulation opening exposing the metal trace layer;

[0011] Preferably, the distance between the edge of the encapsulation opening and the edge of the second encapsulation structure is greater than 400 μm.

[0012] In some embodiments, the orthographic projection of the surface of the first packaging structure away from the substrate onto the substrate lies within the orthographic projection of the surface of the first packaging structure near the substrate onto the substrate.

[0013] In some embodiments, the display panel further includes:

[0014] A planarization layer is located between the metal trace layer and the first encapsulation layer;

[0015] The touch trace layer is located on the side of the first encapsulation layer away from the substrate.

[0016] In some embodiments, the display panel further includes:

[0017] The second encapsulation layer is located between the metal trace layer and the first encapsulation layer;

[0018] The third encapsulation layer is located between the second encapsulation layer and the metal trace layer, wherein the first encapsulation layer, the second encapsulation layer and the third encapsulation layer are stacked sequentially along the thickness direction of the substrate;

[0019] Preferably, the first encapsulation layer and the third encapsulation layer comprise inorganic insulating materials, and the second encapsulation layer comprises organic insulating materials.

[0020] In some embodiments, the ratio of the thickness of the first packaging structure to the thickness of the second packaging structure ranges from 20% to 50%.

[0021] Preferably, in the direction from the display area to the non-display area, the size of the first packaging structure is greater than 400 μm;

[0022] Preferably, the surface of the first packaging structure away from the substrate includes a stepped surface and an arc-shaped surface;

[0023] Preferably, the material of the first encapsulation layer includes inorganic materials.

[0024] A second aspect of this application provides a photomask for fabricating a first encapsulation layer of a display panel as described in any of the first aspects above, the photomask comprising:

[0025] The first opening;

[0026] A first groove is connected to the first opening, and the depth of the first groove is less than the depth of the first opening.

[0027] In some embodiments, the photomask further includes:

[0028] The second groove is spaced apart from the first opening, and the depth of the second groove is less than the depth of the first opening;

[0029] Preferably, the first groove is used to form a first encapsulation structure for the display panel.

[0030] A third aspect of this application provides a method for manufacturing a display panel, comprising:

[0031] The display panel is prepared using a mask as described in any of the second aspects above.

[0032] In some embodiments, the method for manufacturing the display panel includes:

[0033] The mask is disposed on one side surface of the substrate of the display panel, such that the opening of the first groove of the mask faces the substrate, wherein the orthographic projection of the first groove of the mask on the substrate overlaps with the orthographic projection of the metal wiring layer of the display panel on the substrate, and the mask and the metal wiring layer are located on the same side of the substrate.

[0034] According to the photomask, a first encapsulation layer is formed on one side of the substrate, wherein the first encapsulation layer and the metal trace layer are located on the same side of the substrate. The first encapsulation layer includes a first encapsulation structure and a second encapsulation structure. The first encapsulation structure is connected to the second encapsulation structure. The first encapsulation structure is formed in a first opening of the photomask, and the second encapsulation structure is formed in a first groove of the photomask.

[0035] Remove the mask;

[0036] Preferably, when the first encapsulation layer includes an encapsulation opening and the mask includes a second groove, the step of disposing of the mask on one side surface of the substrate of the display panel includes:

[0037] The mask is disposed on one side surface of the substrate of the display panel, such that the opening of the second groove faces the substrate.

[0038] This application provides a display panel, a photomask, and a method for manufacturing the display panel. By forming a first encapsulation structure on the side of the metal trace layer away from the substrate, the first encapsulation structure can protect the metal trace layer and reduce the risk of scratches on the metal trace layer. By forming a second encapsulation structure within the display area, external moisture and oxygen can be prevented from entering the interior of the display panel. By connecting the first and second encapsulation structures, the first and second encapsulation structures can be placed on the same layer, facilitating the integrated formation of the first encapsulation layer of the display panel. This also avoids the first encapsulation structure in non-display areas being too high, improving the encapsulation quality within the display area of ​​the display panel. Therefore, in the process of preparing the first encapsulation layer of the display panel using a photomask, the thickness of the first encapsulation structure is less than that of the second encapsulation structure. This allows the first encapsulation structure to protect the metal trace layer even when there is relative displacement between the photomask and the substrate of the display panel, or when the edge of the photomask sinks near the display area during the photomask stretching process. This prevents the photomask from scratching the metal traces and reduces the risk of short circuits and other poor contact caused by scratches on the metal traces. As a result, the accuracy of the displayed image, the reliability and stability of the display panel, the display effect of the image, and the display performance of the display panel can be improved. Attached Figure Description

[0039] To more clearly illustrate the technical solutions in the embodiments of this application or related technologies, the drawings used in the description of the embodiments of this application or related technologies will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0040] Figure 1 is a schematic structural diagram of a display panel provided in an embodiment of this application;

[0041] Figure 2 is a schematic top view of a display panel provided in an embodiment of this application;

[0042] Figure 3 is a schematic structural diagram of another display panel provided in an embodiment of this application;

[0043] Figure 4 is a schematic structural diagram of another display panel provided in an embodiment of this application;

[0044] Figure 5 is a schematic structural diagram of another display panel provided in an embodiment of this application;

[0045] Figure 6 is a schematic structural diagram of a mask provided in an embodiment of this application;

[0046] Figure 7 is a schematic flowchart of a method for manufacturing a display panel according to an embodiment of this application;

[0047] Figure 8 is a schematic structural diagram of the mask setting step in a method for manufacturing a display panel according to an embodiment of this application;

[0048] Figure 9 is a schematic structural diagram of the first encapsulation layer obtained in the manufacturing method of a display panel according to an embodiment of this application;

[0049] Figure 10 is a schematic structural diagram of a display panel obtained by a method for preparing a display panel according to an embodiment of this application.

[0050] Explanation of reference numerals in the attached figures:

[0051] 100, Substrate; 101, Display area; 102, Non-display area; 200, Metal trace layer; 300, First encapsulation layer; 301, Second encapsulation layer; 302, Third encapsulation layer; 310, First encapsulation structure; 320, Second encapsulation structure; 330, Encapsulation opening; 400, Planarization layer; 500, Touch trace layer; 1000, Mask; 1001, First opening; 1002, First groove; 1003, Second groove. Detailed Implementation

[0052] To facilitate understanding of the present invention, a more complete description will be given below with reference to the accompanying drawings. Preferred embodiments of the invention are shown in the drawings. However, the invention can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a thorough and complete understanding of the disclosure of the invention.

[0053] It should be noted that when a component is said to be "fixed to" another component, it can be directly attached to the other component or there may be an intervening component. When a component is said to be "connected to" another component, it can be directly connected to the other component or there may be an intervening component. The terms "vertical," "horizontal," "left," "right," and similar expressions used in this document are for illustrative purposes only.

[0054] In this document, spatial terms such as “upper” and “lower” are defined with reference to the accompanying drawings. Therefore, it will be understood that “upper” and “lower” are used interchangeably. It will be understood that when a layer is referred to as being “on” another layer, it can be formed directly on that other layer, or there may be intermediate layers. Therefore, it will be understood that when a layer is referred to as being “directly” on another layer, no intermediate layer is inserted in between.

[0055] In the accompanying drawings, the dimensions of layers and regions may be exaggerated for clarity. It is understood that when a layer or element is referred to as "on" another layer or substrate, the layer or element may be directly on said other layer or substrate, or there may be intermediate layers. Furthermore, it is understood that when a layer is referred to as "between two layers," the layer may be the only layer between said two layers, or there may be one or more intermediate layers. Additionally, the same reference numerals always denote the same elements.

[0056] In the following text, although terms such as “first” and “second” may be used to describe various components, these components are not necessarily limited to the terms above. The terms above are used only to distinguish one component from another. It will also be understood that expressions used in the singular form include plural expressions unless the singular form has a distinct meaning in the context. Furthermore, in the embodiments below, it will also be understood that the terms “comprising” and / or “having” as used herein indicate the presence of the stated feature or component, but do not exclude the presence or addition of one or more other features or components.

[0057] In the following embodiments, when a layer, region, or element is “connected,” it can be interpreted as the layer, region, or element being connected not only directly but also through other constituent elements placed therebetween. For example, when a layer, region, element, etc., is described as being connected or electrically connected, the layer, region, element, etc., can not only be directly connected or directly electrically connected, but can also be connected or electrically connected through another layer, region, element, etc., placed therebetween.

[0058] In the application documents, the term “and / or” includes any and all combinations of one or more of the related listed items. When a statement such as “at least one of…” follows a list of elements, it modifies the entire list of elements, rather than individual elements within that list.

[0059] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein in the specification of the application is for the purpose of describing particular embodiments only and is not intended to limit the scope of the application. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0060] It should also be understood that the terms “including / comprise” or “have” specify the presence of the stated features, wholes, steps, operations, components, parts, or combinations thereof, but do not preclude the possibility of the presence or addition of one or more other features, wholes, steps, operations, components, parts, or combinations thereof.

[0061] Electronic or electrical devices and / or any other related devices or components (e.g., display devices including a display panel and a display panel driver, wherein the display panel driver further includes a drive controller, a gate driver, a gamma reference voltage generator, a data driver, and a transmit driver) according to embodiments of the inventive concepts described herein can be implemented using any suitable hardware, firmware (e.g., application-specific integrated circuits), software, or a combination of software, firmware, and hardware. For example, various components of these devices may be formed on an integrated circuit (IC) chip or on a separate IC chip. Additionally, various components of these devices may be implemented on a flexible printed circuit film, a tape-on-a-package (TCP), a printed circuit board (PCB), or formed on a substrate. Furthermore, various components of these devices may be processes or threads running on one or more processors in one or more computing devices to execute computer program instructions and interact with other system components to perform the various functions described herein. Computer program instructions are stored in memory, which may be implemented in a computing device using standard storage devices such as random access memory (RAM). Computer program instructions may also be stored in other non-transitory computer-readable media such as CD-ROMs, flash drives, etc. Furthermore, those skilled in the art will recognize that the functions of various computing devices may be combined or integrated into a single computing device, or the functions of a particular computing device may be distributed across one or more other computing devices, without departing from the spirit and scope of exemplary embodiments of the present invention.

[0062] While exemplary embodiments of the display module and the display device including the display module have been specifically described herein, many modifications and variations will be apparent to those skilled in the art. Therefore, it will be understood that the display module and the display device including the display module, constructed according to the principles of the invention, may be implemented in ways other than those specifically described herein. This application is also defined in the claims and their equivalents.

[0063] With the rapid development of display technology, the requirements for the reliability and stability of display panels are gradually increasing. In traditional display panel manufacturing methods, the first encapsulation layer is usually formed in the display area of ​​the display panel using processes such as chemical vapor deposition based on a photomask.

[0064] However, in actual fabrication processes, to improve efficiency, a mesh-like mask is typically used to simultaneously fabricate the first encapsulation layer of multiple display panels. In existing masks, the opening edges usually correspond to the edges of the display area of ​​the display panel. Therefore, as the number and area of ​​openings on the mask increase, during the mask meshing process, the edges of the mask near the display area tend to sink due to gravity. Furthermore, when bonding the mask to the substrate of the display panel, this sinking can cause the edges of the mask to come into contact with metal traces in the non-display area of ​​the display panel, potentially causing scratches on the metal traces. Simultaneously, for the first encapsulation layer grown via chemical vapor deposition, temperature changes occur during deposition. Due to the difference in thermal expansion coefficients and heated areas between the substrate and the mask, relative displacement between the mask and the substrate occurs during deposition. When the mask opening edge shifts relative to the metal traces, the mask can scratch them. Conversely, when it shifts away from the metal traces, they may become exposed. If an organic first encapsulation layer is formed again on the surface of the first encapsulation layer, the organic encapsulation material's scratch resistance is weak, rendering the organic first encapsulation layer ineffective in protecting the metal traces. This increases the risk of scratches on the metal traces in subsequent manufacturing processes. Furthermore, particles falling into the cavity can further exacerbate scratches caused by relative displacement. Therefore, traditional display panels are prone to short circuits and other display defects, affecting the accuracy, reliability, and stability of the displayed image, ultimately impacting the display effect and overall display performance.

[0065] As shown in FIG1, a first aspect of the present application provides a display panel, including: a substrate 100, a metal wiring layer 200, and a first encapsulation layer 300. The substrate 100 includes a display area 101 and a non-display area 102, with the non-display area 102 at least partially surrounding the display area 101. The metal wiring layer 200 is located on one side of the substrate 100 and within the non-display area 102. The first encapsulation layer 300 includes a first encapsulation structure 310 and a second encapsulation structure 320. The first encapsulation structure 310 is located on the side of the metal wiring layer 200 away from the substrate 100, and the second encapsulation structure 320 is located on the same side of the substrate 100 as the metal wiring layer 200, and within the display area 101. The first encapsulation structure 310 and the second encapsulation structure 320 are connected and disposed in the same layer. The thickness of the first encapsulation structure 310 is less than the thickness of the second encapsulation structure 320.

[0066] As shown in Figure 2, the display panel includes a display area 101 and a non-display area 102, with the non-display area 102 surrounding the display area 101, and a metal trace layer 200 surrounding the display area 101. For example, the metal trace layer 200 may include ESD (Electrostatic Discharge) traces.

[0067] The display panel provided in this application embodiment protects the metal wiring layer 200 by forming a first encapsulation structure 310 on the side of the metal wiring layer 200 away from the substrate 100, reducing the risk of scratches on the metal wiring layer 200. Forming a second encapsulation structure 320 within the display area 101 prevents external moisture and oxygen from entering the display panel. Connecting the first encapsulation structure 310 and the second encapsulation structure 320 allows for their co-layer arrangement, facilitating the integrated formation of the first encapsulation layer 300 of the display panel. This also prevents the first encapsulation structure 310 within the non-display area 102 from being too high, improving the encapsulation quality within the display area 101 of the display panel. Therefore, during the fabrication of the first encapsulation layer 300 of the display panel using a photomask, the thickness of the first encapsulation structure 310 is less than the thickness of the second encapsulation structure 320. This allows the first encapsulation structure 310 to protect the metal trace layer 200 even when there is relative displacement between the photomask and the substrate 100 of the display panel, or when the edge of the photomask sinks near the display area 101 during the photomask stretching process. This prevents the photomask from scratching the metal traces and reduces the risk of short circuits and other poor contact caused by scratches on the metal traces. As a result, the accuracy of the displayed image, the reliability and stability of the display panel, the display effect, and the display performance of the display panel can be improved.

[0068] As shown in Figure 1, in some feasible embodiments, the first encapsulation layer 300 includes an encapsulation opening 330, which is located within the non-display area 102 and exposes the metal trace layer 200.

[0069] For example, the encapsulation opening 330 can be fabricated simultaneously with the first encapsulation structure 310 and the second encapsulation structure 320.

[0070] The display panel provided in this application embodiment, by providing an encapsulation opening 330, facilitates the bonding of the exposed metal trace layer 200 with other conductive structures. Simultaneously, it enables the integrated fabrication of the first encapsulation layer 300, avoiding the risk of further scratches to the metal trace layer 200 caused by openings in the first encapsulation layer 300. This reduces the risk of short circuits and other poor contact caused by scratches on the metal traces, thereby improving the accuracy of the displayed image, the reliability and stability of the display panel, and enhancing the display effect and performance of the display panel.

[0071] In some feasible implementations, the distance between the edge of the encapsulation opening 330 and the edge of the second encapsulation structure 320 is greater than 400 μm.

[0072] It should be noted that during the fabrication of the first encapsulation layer 300 using a mask, if the distance between the edge of the encapsulation opening 330 and the edge of the second encapsulation structure 320 is too small, the size of the mask will be too small, resulting in insufficient support strength of the mask between the second encapsulation structure 320 and the encapsulation opening 330. This further increases the probability of the mask edge sinking, leading to an increased risk of scratches on the metal trace layer 200.

[0073] The display panel provided in this application embodiment, by setting the distance between the edge of the encapsulation opening 330 and the edge of the second encapsulation structure 320 to be greater than 400μm, can improve the support strength of the mask, improve the stability during the encapsulation process, and further reduce the risk of poor contact such as short circuits caused by scratches on metal traces. This can improve the accuracy of the displayed image, as well as the reliability and stability of the display panel, and improve the display effect and display performance of the display panel.

[0074] As shown in Figure 3, in some feasible embodiments, the orthographic projection of the surface of the first packaging structure 310 away from the substrate 100 on the substrate 100 is located within the orthographic projection of the surface of the first packaging structure 310 close to the substrate 100 on the substrate 100.

[0075] The display panel provided in this application embodiment can improve the packaging quality of the second packaging structure 320 in the non-display area 102 of the display panel by reducing the surface area of ​​the first packaging structure 310 on the side away from the substrate 100, thereby reducing the manufacturing cost of the first packaging structure 310 and improving the manufacturing efficiency of the first packaging layer 300.

[0076] In some feasible implementations, the orthographic projection of the first package structure 310 on the substrate 100 covers the orthographic projection of the metal trace layer 200 on the substrate 100.

[0077] The display panel provided in this application embodiment completely covers the metal trace layer 200 through the first packaging structure 310, which can further improve the protection capability of the first packaging structure 310 for the metal trace layer 200, further reduce the risk of short circuits and other poor contact caused by scratches on the metal traces, thereby improving the accuracy of the displayed image and the reliability and stability of the display panel, and improving the display effect and display performance of the display panel.

[0078] As shown in Figure 1, in some feasible embodiments, the display panel further includes a planarization layer 400 and a touch trace layer 500. The planarization layer 400 is located between the metal trace layer 200 and the first encapsulation layer 300; the touch trace layer 500 is located on the side of the first encapsulation layer 300 away from the substrate 100.

[0079] The display panel provided in this application embodiment can improve the surface flatness of the display panel by setting a planarization layer 400, thereby improving the packaging quality of the first encapsulation layer 300 and enhancing the packaging effect. Simultaneously, it can protect the metal trace layer 200, further reducing the risk of scratches on the metal trace layer 200. By setting a touch trace layer 500, touch signals on the display panel can be transmitted to sense user touch operations, thereby improving the display performance of the display panel.

[0080] As shown in Figure 4, in some feasible embodiments, the display panel further includes a second encapsulation layer 301 and a third encapsulation layer 302. The second encapsulation layer 301 is located between the metal wiring layer 200 and the first encapsulation layer 300; the third encapsulation layer 302 is located between the second encapsulation layer 301 and the metal wiring layer 200. The first encapsulation layer 300, the second encapsulation layer 301, and the third encapsulation layer 302 are stacked sequentially along the thickness direction of the substrate 100.

[0081] For example, the second encapsulation layer 301 and the third encapsulation layer 302 have the same thickness in both the display area 101 and the non-display area 102.

[0082] The display panel provided in this application embodiment includes multiple sequentially stacked encapsulation layers. By setting the first encapsulation layer 300 with the largest distance from the substrate 100 to have a first encapsulation structure 310 and a second encapsulation structure 320, the thickness difference between the total thickness of the encapsulation layers in the display area 101 and the total thickness of the encapsulation layers in the non-display area 102 can be avoided to be too large, thereby improving the surface flatness of the display panel and improving the encapsulation quality of the display panel.

[0083] In some feasible implementations, the first encapsulation layer 300 and the third encapsulation layer 302 comprise inorganic insulating materials, and the second encapsulation layer 301 comprises organic insulating materials.

[0084] The display panel provided in this application embodiment uses an inorganic insulating material to form a third encapsulation layer 302, which prevents external water and oxygen from entering the interior of the display panel and thus avoids affecting the light-emitting elements, conductive structures, and transistors. An organic insulating material forms a second encapsulation layer 301, creating a flexible encapsulation for the display panel. An inorganic insulating material forms a first encapsulation layer 300, preventing external moisture and oxygen from entering the second encapsulation layer 301. This improves the encapsulation quality of the display panel, enhances its reliability, safety, and stability, and improves the display effect and performance of the displayed image.

[0085] In some feasible implementations, the ratio of the thickness of the first packaging structure 310 to the thickness of the second packaging structure 320 ranges from 20% to 50%.

[0086] It should be noted that if the ratio of the thickness of the first packaging structure 310 to the thickness of the second packaging structure 320 is too large, it will increase the manufacturing cost of the first packaging structure 310, prolong its manufacturing time, and affect the manufacturing efficiency of the first packaging layer 300. If the ratio of the thickness of the first packaging structure 310 to the thickness of the second packaging structure 320 is too small, the mask corresponding to the first packaging structure 310 will be too thick when using a mask to manufacture the first packaging layer 300. This mask is more likely to sink under its own weight, further increasing the risk of scratches on the metal trace layer 200.

[0087] The display panel provided in this application embodiment can reduce the manufacturing cost of the first packaging structure 310, and at the same time reduce the amount of sinking of the mask near the edge of the display area 101 during the mesh stretching process, avoid the mask scratching the metal trace layer 200, and further reduce the risk of short circuits and other poor contact caused by scratches on the metal traces. This can improve the accuracy of the displayed image and the reliability and stability of the display panel, and improve the display effect and display performance of the display panel.

[0088] In some feasible implementations, the size of the first encapsulation structure 310 is greater than 400 μm in the direction from the display area 101 to the non-display area 102.

[0089] It should be noted that during the fabrication of the first encapsulation layer 300 using a mask, if the size of the first encapsulation structure 310 is too small in the direction from the display area 101 to the non-display area 102, the size of the mask corresponding to the first encapsulation structure 310 will be too small, resulting in insufficient clearance space for the metal trace layer 200 and an increased risk of scratches on the metal trace layer 200.

[0090] The display panel provided in this application embodiment can improve the protection capability of the first packaging structure 310 for the metal trace layer 200 by increasing the size of the first packaging structure 310, further reducing the risk of short circuits and other poor contact caused by scratches on the metal traces, thereby improving the accuracy of the displayed image and the reliability and stability of the display panel, and improving the display effect and display performance of the display panel.

[0091] As shown in Figures 4 and 5, in some feasible embodiments, the surface of the first packaging structure 310 on the side away from the substrate 100 includes a stepped surface and an arcuate surface.

[0092] The display panel provided in this application embodiment can reduce the weight of the mask while preventing the mask from shifting and scratching the metal wiring layer 200 through the sidewall of the first packaging structure 310. This reduces the amount of sinking caused by the mask's own weight during the screen stretching process, further suppressing the risk of the mask scratching the metal wiring layer 200. Consequently, the protective effect of the first packaging structure 310 on the metal wiring layer 200 can be improved, avoiding short circuits and other poor contact caused by scratches on the metal wiring. This can improve the accuracy of the displayed image, as well as the reliability and stability of the display panel, thereby enhancing the display effect and display performance of the display panel.

[0093] In some feasible implementations, the material of the first encapsulation layer 300 includes inorganic materials.

[0094] The display panel provided in this application embodiment has an inorganic material forming a first encapsulation layer 300, which can prevent external water and oxygen from entering the interior of the display panel and avoid affecting the light-emitting elements, conductive structures, and transistors of the display panel. This improves the encapsulation quality of the display panel, enhances its reliability, safety, and stability, and improves the display effect and performance of the displayed image.

[0095] As shown in FIG6, a second aspect of the present application provides a mask for fabricating a first encapsulation layer 300 of a display panel as described in any of the first aspects above. The mask 1000 includes a first opening 1001 and a first groove 1002. The first groove 1002 is connected to the first opening 1001, and the depth of the first groove 1002 is less than the depth of the first opening 1001.

[0096] For example, the edge of the first opening 1001 coincides with the edge of the display area 101 of the display panel. The first opening 1001 is used to form the second encapsulation structure 320 of the display panel. The second encapsulation structure 320 and the metal wiring layer 200 of the display panel are located on the same side of the substrate 100 of the display panel, and the second encapsulation structure 320 is located within the display area 101.

[0097] The mask provided in this application embodiment allows for the formation of a second encapsulation structure 320 within the display area 101 through the first opening 1001, preventing external moisture and oxygen from entering the display panel. A first encapsulation structure 310 can be formed on the side of the metal trace layer 200 away from the substrate 100 through the first groove 1002, protecting the metal trace layer 200 and reducing the risk of scratches. By connecting the first encapsulation structure 310 and the second encapsulation structure 320, they can be co-layered, facilitating the integrated formation of the first encapsulation layer 300 of the display panel. This also prevents the first encapsulation structure 310 in the non-display area 102 from being too high, improving the encapsulation quality within the display area 101 of the display panel. Therefore, during the fabrication of the first encapsulation layer 300 of the display panel using the mask 1000, the thickness of the first encapsulation structure 310 is less than the thickness of the second encapsulation structure 320. This allows the first encapsulation structure 310 to protect the metal trace layer 200 in cases where the mask 1000 is relatively displaced from the substrate 100 of the display panel, or where the edge of the mask 1000 sinks near the display area 101 during the meshing process. This prevents the mask 1000 from scratching the metal traces and reduces the risk of short circuits and other poor contact caused by scratches on the metal traces. Consequently, the accuracy of the displayed image, the reliability and stability of the display panel, the display effect, and the display performance of the display panel can be improved.

[0098] As shown in Figure 6, in some feasible embodiments, the mask 1000 further includes a second groove 1003, which is spaced apart from the first opening 1001, and the depth of the second groove 1003 is less than the depth of the first opening 1001. The second groove 1003 is used to form the encapsulation opening 330 of the display panel.

[0099] The mask provided in this embodiment forms a mask on the metal trace layer 200 through the second groove 1003 during the growth of the first encapsulation layer 300. This allows for the direct formation of the encapsulation opening 330 during the integrated fabrication of the first encapsulation layer 300, facilitating the bonding of the exposed metal trace layer 200 with other conductive structures. This further reduces the risk of short circuits and other poor contact caused by scratches on the metal traces, thereby improving the accuracy of the displayed image, the reliability and stability of the display panel, and ultimately enhancing the display effect and performance of the display panel.

[0100] In some feasible implementations, the first recess 1002 is used to form the first encapsulation structure 310 of the display panel.

[0101] The photomask provided in this embodiment can form a first encapsulation structure 310 on the side of the metal wiring layer 200 away from the substrate 100 through the first groove 1002. This allows the first encapsulation structure 310 to protect the metal wiring layer 200 and reduce the risk of scratches on the metal wiring layer 200. Even when the photomask 1000 is relatively displaced from the substrate 100 of the display panel, or when the edge of the photomask 1000 sinks near the display area 101 during the screen-forming process, the first encapsulation structure 310 protects the metal wiring layer 200, preventing the photomask 1000 from scratching the metal wiring and reducing the risk of short circuits and other poor contact caused by scratches. This improves the accuracy of the displayed image, the reliability and stability of the display panel, and enhances the display effect and performance of the display panel.

[0102] A third aspect of this application provides a method for manufacturing a display panel, comprising: manufacturing the display panel using a mask 1000 as described in any of the second aspects above.

[0103] The display panel manufacturing method provided in this application embodiment allows for the formation of a second encapsulation structure 320 within the display area 101 via the first opening 1001, preventing external moisture and oxygen from entering the display panel. A first encapsulation structure 310 can be formed on the side of the metal trace layer 200 away from the substrate 100 via the first groove 1002, protecting the metal trace layer 200 and reducing the risk of scratches. By connecting the first encapsulation structure 310 and the second encapsulation structure 320, they can be co-layered, facilitating the integrated formation of the first encapsulation layer 300 of the display panel. This also prevents the first encapsulation structure 310 within the non-display area 102 from being too high, improving the encapsulation quality within the display area 101 of the display panel. Therefore, during the fabrication of the first encapsulation layer 300 of the display panel using the mask 1000, the thickness of the first encapsulation structure 310 is less than the thickness of the second encapsulation structure 320. This allows the first encapsulation structure 310 to protect the metal trace layer 200 in cases where the mask 1000 is relatively displaced from the substrate 100 of the display panel, or where the edge of the mask 1000 sinks near the display area 101 during the meshing process. This prevents the mask 1000 from scratching the metal traces and reduces the risk of short circuits and other poor contact caused by scratches on the metal traces. Consequently, the accuracy of the displayed image, the reliability and stability of the display panel, the display effect, and the display performance of the display panel can be improved.

[0104] As shown in Figure 7, in some feasible embodiments, the method for manufacturing the display panel includes:

[0105] Step S110: A mask is provided on one side surface of the substrate of the display panel, such that the opening of the first groove of the mask faces the substrate, wherein the edge of the first opening of the mask corresponds to the edge of the display area of ​​the display panel, and the orthographic projection of the first groove of the mask on the substrate overlaps with the orthographic projection of the metal wiring layer of the display panel on the substrate, and the mask and the metal wiring layer are located on the same side of the substrate.

[0106] As shown in Figure 8, the opening of the first groove 1002 of the mask 1000 faces the substrate 100, wherein the edge of the first opening 1001 of the mask 1000 coincides with the edge of the display area 101 of the display panel.

[0107] Step S120: Based on the photomask, a first encapsulation layer is formed on one side of the substrate, wherein the first encapsulation layer and the metal wiring layer are located on the same side of the substrate. The first encapsulation layer includes a first encapsulation structure and a second encapsulation structure. The first encapsulation structure and the second encapsulation structure are connected. The first encapsulation structure is formed in a first opening of the photomask, and the second encapsulation structure is formed in a first groove of the photomask.

[0108] As shown in Figure 9, a second encapsulation structure 320 is formed in the first opening 1001 according to the mask 1000, and a first encapsulation structure 310 is formed in the first groove 1002.

[0109] Step S130: Remove the mask.

[0110] As shown in Figure 10, mask 1000 is removed to obtain the display panel.

[0111] The method for manufacturing a display panel provided in this application embodiment allows the first encapsulation structure 310 formed according to the first groove 1002 to cover the surface of the metal trace layer 200 by oriented the opening of the first groove 1002 toward the substrate. This protects the metal trace layer 200 from scratches by the mask 1000, reducing the risk of short circuits and other poor contact caused by scratches on the metal traces. As a result, the accuracy of the displayed image, the reliability and stability of the display panel, the display effect, and the display performance of the display panel can be improved.

[0112] In some feasible embodiments, when the first encapsulation layer 300 includes an encapsulation opening 330 and the mask 1000 includes a second groove 1003, the mask 1000 is disposed on one side surface of the substrate 100 of the display panel, including: the mask 1000 is disposed on one side surface of the substrate 100 of the display panel such that the opening of the second groove 1003 faces the substrate 100.

[0113] The display panel manufacturing method provided in this application embodiment, by having the opening of the second groove 1003 facing the substrate 100, allows the second groove 1003 to form a mask on the metal wiring layer 200. This allows the encapsulation opening 330 to be directly formed during the integrated manufacturing process of the first encapsulation layer 300, thereby improving the manufacturing efficiency of the display panel, enhancing the accuracy of the displayed image, the reliability and stability of the display panel, and improving the display effect and performance of the display panel.

[0114] It is understood that the display device in the embodiments of this application can be any product or component with display function, such as OLED display device, QLED display device, electronic paper, mobile phone, tablet computer, television, monitor, laptop computer, digital photo frame, navigator, wearable device, Internet of Things device, etc., and the embodiments disclosed in this application do not limit this.

[0115] In the description of this specification, references to terms such as "some embodiments," "other embodiments," and "ideal embodiments" indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the invention. In this specification, the illustrative descriptions of the above terms do not necessarily refer to the same embodiments or examples.

[0116] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features of the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0117] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A display panel, characterized in that, include: A substrate, the substrate including a display area and a non-display area, the non-display area at least partially surrounding the display area; A metal trace layer is located on one side of the substrate and within the non-display area; a first encapsulation layer includes a first encapsulation structure and a second encapsulation structure, wherein the first encapsulation structure is located on the side of the metal trace layer away from the substrate, and the second encapsulation structure is located on the same side of the substrate as the metal trace layer and within the display area; the first encapsulation structure and the second encapsulation structure are connected and disposed on the same layer to integrally form the first encapsulation layer; The first encapsulation layer is formed of an inorganic insulating material; wherein the thickness of the first encapsulation structure is less than the thickness of the second encapsulation structure; the ratio of the thickness of the first encapsulation structure to the thickness of the second encapsulation structure is in the range of 20% to 50%; the surface of the first encapsulation structure away from the substrate includes a stepped surface or an arc-shaped surface.

2. The display panel according to claim 1, characterized in that, The first encapsulation layer includes an encapsulation opening located within the non-display area, and the encapsulation opening exposes the metal trace layer.

3. The display panel according to claim 2, characterized in that, The distance between the edge of the encapsulation opening and the edge of the second encapsulation structure is greater than 400 μm.

4. The display panel according to claim 1, characterized in that, The orthographic projection of the surface of the first packaging structure away from the substrate onto the substrate is located within the orthographic projection of the surface of the first packaging structure close to the substrate onto the substrate.

5. The display panel according to claim 1, characterized in that, Also includes: A planarization layer is located between the metal trace layer and the first encapsulation layer; The touch trace layer is located on the side of the first encapsulation layer away from the substrate.

6. The display panel according to claim 5, characterized in that, Also includes: The second encapsulation layer is located between the metal trace layer and the first encapsulation layer; The third encapsulation layer is located between the second encapsulation layer and the metal trace layer, wherein the first encapsulation layer, the second encapsulation layer and the third encapsulation layer are stacked sequentially along the thickness direction of the substrate.

7. The display panel according to claim 6, characterized in that, The third encapsulation layer comprises an inorganic insulating material, and the second encapsulation layer comprises an organic insulating material.

8. The display panel according to claim 1, characterized in that, In the direction from the display area to the non-display area, the size of the first packaging structure is greater than 400 μm.

9. A method for manufacturing a display panel as described in any one of claims 1-8, characterized in that, include: A display panel is fabricated using a photomask; the photomask includes: a first opening; a first groove communicating with the first opening, wherein the depth of the first groove is less than the depth of the first opening; the first groove is used to form a first encapsulation structure of the display panel.

10. The method for manufacturing a display panel according to claim 9, characterized in that, The mask also includes a second groove, which is spaced apart from the first opening, and the depth of the second groove is less than the depth of the first opening; the second groove does not penetrate the mask; the second groove and the first groove are located on the same side of the mask.

11. The method for manufacturing a display panel according to claim 9, characterized in that, include: A photomask is disposed on one side surface of the substrate of the display panel, such that the opening of the first groove of the photomask faces the substrate, wherein the orthographic projection of the first groove of the photomask on the substrate overlaps with the orthographic projection of the metal wiring layer of the display panel on the substrate, and the photomask and the metal wiring layer are located on the same side of the substrate; a first encapsulation layer is formed on one side of the substrate based on the photomask, wherein the first encapsulation layer and the metal wiring layer are located on the same side of the substrate, the first encapsulation layer includes a first encapsulation structure and a second encapsulation structure, the first encapsulation structure and the second encapsulation structure are connected, the first encapsulation structure is formed in the first opening of the photomask, and the second encapsulation structure is formed in the first groove of the photomask; the photomask is then removed.

12. The method for manufacturing a display panel according to claim 11, characterized in that, In the case where the first encapsulation layer includes an encapsulation opening and the mask includes a second groove, the step of setting the mask on one side surface of the substrate of the display panel includes: setting the mask on one side surface of the substrate of the display panel such that the opening of the second groove faces the substrate.

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