Multi-size wafer processing frame

Abstract

Embodiments of the present disclosure herein include apparatuses and methods for processing a substrate. More specifically, embodiments of the present disclosure provide a substrate flipping apparatus including a clamp actuator and a substrate securing assembly. In one embodiment, the substrate fixing assembly includes: an upper structure coupled to the clamp actuator; a lower structure, the lower structure being coupled to the clamping actuator; and a plurality of sets of clamping pads attached to the upper structure and the lower structure, where each set of clamping pads is configured to secure substrates of different sizes.

Description

Technical Field

[0001] Embodiments of the present disclosure relate to a flipping device in a manufacturing system (such as a semiconductor substrate processing system), and in particular, to a substrate flipping device in a manufacturing system. Background Art

[0002] In electronic processing systems, such as semiconductor processing systems, objects such as substrates are processed. In some systems, both the upper and lower surfaces of the objects are processed. In semiconductor processing systems, substrates are transferred by a robot, placed in a processing chamber, and the upper surface of the substrate is processed in the processing chamber. In order to process the lower surface of the substrate, the substrate must be removed from the processing chamber, flipped so that the lower surface of the substrate faces upward, and then placed back into the processing chamber for processing.

[0003] Some conventional systems have separate devices for rotating and / or flipping substrates. These conventional separate devices are large and cannot be used with many semiconductor processing systems, or the semiconductor processing system must be configured to accommodate the large separate devices. Moreover, conventional separate devices typically accommodate only one size of substrate, making the device impractical for many semiconductor processing systems. In addition, conventional systems use electronic controls, which increase the complexity in rotating and / or flipping the substrate to a wide range of orientations, such as vertical, horizontal, and many intermediate diagonal orientations. In some conventional systems, fracturing of substrates, such as ultra-thin wafers and substrates, is a problem.

[0004] There is a need in the art for a substrate turning apparatus that can accommodate substrates of multiple sizes without breaking them. Summary of the invention

[0005] The present disclosure generally includes a substrate flipping device including a clamping actuator and a substrate fixing assembly. The substrate fixing assembly includes an upper structure coupled to the clamping actuator, a lower structure coupled to the clamping actuator, and a plurality of groups of clamping pads attached to the upper structure and the lower structure, wherein each group of clamping pads is configured to fix substrates of different sizes.

[0006] The embodiments of the present disclosure may further provide a substrate flipping device, which includes a clamping actuator and a substrate fixing assembly. The substrate fixing assembly includes: an upper structure, the upper structure includes a first upper section and a second upper section coupled to the clamping actuator; a lower structure, the lower structure includes a first lower section and a second lower section coupled to the clamping actuator; two first clamping pads attached to both ends of the first upper section and the first lower section; a first clamping pad attached to both ends of the second upper section and both ends of the second lower section; and a second clamping pad placed on each end of the main body of the first upper section, the second upper section, the first lower section and the second lower section, each second clamping pad being radially positioned inside each of the first clamping pads.

[0007] Embodiments of the present disclosure may further provide a substrate processing system, comprising: a transfer chamber; a factory interface, the factory interface being disposed between the transfer chamber and a plurality of enclosure systems; and a substrate flipping device, the substrate flipping device being disposed in, on, or in the factory interface, the substrate flipping device being configured to fix substrates of different sizes. The substrate flipping device comprises a clamping actuator and a substrate fixing assembly. The substrate fixing assembly comprises: an upper structure, the upper structure being coupled to the clamping actuator; a lower structure, the lower structure being coupled to the clamping actuator; and a plurality of groups of clamping pads, the plurality of groups of clamping pads being attached to the upper structure and the lower structure, wherein each group of clamping pads is configured to fix substrates of different sizes.

[0008] BRIEF DESCRIPTION OF THE DRAWINGS

[0009] In order to understand the above-mentioned features of the present disclosure in detail, a more specific description of the present disclosure briefly summarized above can be obtained by reference to the embodiments, some of which are illustrated in the accompanying drawings. However, it is noted that the accompanying drawings only illustrate example embodiments and therefore should not be considered as limiting its scope, as the present disclosure may allow other equally effective embodiments.

[0010] Figure 1 A processing system according to certain embodiments is shown.

[0011] Figure 2A -H illustrates a substrate flipping assembly according to certain embodiments.

[0012] Figure 3A -B illustrates a substrate flipping device according to certain embodiments.

[0013] Figure 4 Methods of using a substrate flipping apparatus according to certain embodiments are shown.

[0014] To facilitate understanding, identical reference numerals have been used, where possible, to designate identical elements in the figures. It is contemplated that elements and features of one embodiment may be beneficially incorporated in other embodiments without further recitation.

[0015] To facilitate understanding, identical reference numerals have been used, where possible, to designate identical elements in the figures. It is contemplated that elements and features of one embodiment may be beneficially incorporated in other embodiments without further recitation. DETAILED DESCRIPTION

[0016] The devices, systems and methods disclosed herein provide a substrate flipping device. The substrate flipping device includes a substrate fixing assembly, which includes multiple groups of substrate clamping pads to fix substrates of different sizes. The substrate flipping device can be extended to any number of sizes to fix different substrates of any size. Different groups of clamping pads are configured to fix substrates of different sizes. In one example, a first group of clamping pads includes a first clamping pad for fixing a substrate of a first size, and a second group of clamping pads includes a second clamping pad for fixing a substrate of a second size. In the embodiments described herein, the substrates may have different material compositions. The first clamping pad is configured to fix a substrate of a larger size than the second clamping pad. The first clamping pad is higher than the second clamping pad. These first clamping pads are arranged in a "tooth-like" structure so that they mesh to fix substrates of the first size. These second clamping pads are aligned so that these second clamping pads interlock to fix substrates of the second size while these first clamping pads slide between each other. As described above, the substrate flipping device may also include additional groups of clamping pads to fix additional substrates of different sizes.

[0017] Figure 1 A processing system 100 (e.g., a wafer processing system, a substrate processing system, a semiconductor processing system) is depicted according to certain embodiments. The processing system 100 includes a factory interface 101 and an enclosure system 130. The enclosure system 130 (e.g., a cassette, a front opening wafer transfer box (FOUP), a processing accessory enclosure system, or the like) is configured to transfer wafers and / or other substrates into and out of the processing system 100. In some embodiments, one or more of the enclosure systems 130 include (e.g., completely contain, at least partially contain) a substrate flipping device 105. In some embodiments, as shown, the substrate flipping device 105 is disposed in or mounted to the factory interface 101. Alternatively or additionally, the substrate flipping device 105 is disposed in or mounted to the transfer chamber 106 (as shown). In some embodiments, the enclosure system 130 is a system having shelves for aligning carriers and / or processing accessory rings.

[0018] In some embodiments, the closed system 130 (e.g., a process kit closed system) includes one or more contents (e.g., one or more of the following: a process kit ring, an empty process kit ring carrier, a process kit ring disposed on a process kit ring carrier, a placement verification wafer, a substrate, etc.). In some examples, the closed system 130 is coupled to the factory interface 101 to enable the process kit ring on the process kit ring carrier to be automatically transferred to the processing system 100 to replace the used process kit ring.

[0019] In some embodiments, the processing chamber 108 is an etch chamber, a deposition chamber (which includes atomic layer deposition, chemical vapor deposition, physical vapor deposition, or plasma enhanced versions thereof), an annealing chamber, or the like.

[0020] The factory interface 101 includes a factory interface robot 112. The factory interface robot 112 includes a robotic arm, such as a Selective Compliance Assembly Robot Arm (SCARA) robot. Examples of SCARA robots include a 2-link SCARA robot, a 3-link SCARA robot, a 4-link SCARA robot, etc. The factory interface robot 112 includes an end effector on one end of the robotic arm. The end effector is configured to pick up and handle specific objects such as wafers. Alternatively or additionally, the end effector is configured to carry objects such as carriers and / or processing accessory rings (edge ​​rings). The robotic arm has one or more links or members (such as wrist members, upper arm members, forearm members, etc.), which are configured to move the end effector in different orientations and to different positions. The factory interface robot 112 is configured to transfer objects between a closed system 130 (such as a box, FOUP) and a transfer chamber 106.

[0021] The transfer chamber 106 includes a chamber robot 110. The chamber robot 110 includes a robotic arm with an end effector at one end of the robotic arm. The end effector is configured to carry a specific object such as a wafer. In some embodiments, the chamber robot 110 is a SCARA robot, but in some embodiments has fewer links and / or fewer degrees of freedom than the factory interface robot 112.

[0022] The controller 102 controls various aspects of the processing system 100. In some embodiments, the controller 102 includes one or more controllers. The controller 102 is a computing device (such as a personal computer, a server computer, a programmable logic controller (PLC), a microcontroller, etc.) and / or includes a computing device. The controller 102 includes one or more processing devices, and in some embodiments, the processing device is a general-purpose processing device (such as a microprocessor, a central processing unit, or the like). More specifically, in some embodiments, the processing device is a complex instruction set computing (CISC) microprocessor, a reduced instruction set computing (RISC) microprocessor, a very long instruction word (VLIW) microprocessor, or a processor that implements other instruction sets or a processor that implements a combination of instruction sets. In some embodiments, the processing device is one or more special-purpose processing devices, such as an application-specific integrated circuit (ASIC), a field programmable gate array (FPGA), a digital signal processor (DSP), a network processor, or the like. In some embodiments, the controller 102 includes a data storage device (such as one or more disk drives and / or solid-state drives), a main memory, a static memory, a network interface, and / or other components. In some embodiments, the controller 102 executes instructions to perform any one or more of the methods or processes described herein. The instructions are stored on a computer readable storage medium, which (during the execution of the instructions) includes one or more of the following: main memory, static memory, auxiliary storage and / or processing device. In some embodiments, the controller 102 receives signals from the factory interface robot 112 and the chamber robot 110 and sends control to the factory interface robot 112 and the chamber robot 110.

[0023] According to one aspect of the present disclosure, contents are removed from the closed systems 130 via the factory interface robot 112 located in the factory interface 101. The chamber robot 110 located in the transfer chamber 106 removes the contents from one of the closed systems 130. The chamber robot 110 moves the contents into the transfer chamber 106. The chamber robot moves the contents from the transfer chamber 106 to the processing chamber 108. Although not shown in the figure for clarity, the contents are removed from the closed system 130 by the factory interface robot 112 located in the factory interface 101. Figure 1 , but the transfer of the contents 110 includes transferring a process kit ring disposed on a process kit ring carrier, transferring a substrate disposed on a substrate carrier, transferring a placement verification wafer, etc. In some embodiments, the substrate may be removed from the substrate carrier, and then the substrate flipping device 105 may flip the substrate. The substrate may then be placed back on the substrate carrier.

[0024] In some examples, it is contemplated that the closed system 130 is coupled to the transfer chamber 106 via a load port coupled to the transfer chamber 106. The contents are transferred from the closed system 130 to the transfer chamber 106 by the chamber robot 110. The chamber robot 110 can then transfer the contents to the processing chamber 108. Additionally, in some embodiments, the contents are loaded into a substrate support pedestal (SSP). In some embodiments, an additional SSP is positioned to communicate with the factory interface 101 opposite the SSP shown. The processed contents (e.g., used processing accessory rings) are removed from the processing system 100 in a manner opposite to any of the manners described herein. When multiple closed systems 130 or a combination of closed systems 130 and SSPs are utilized, in some embodiments, one SSP or closed system 130 is used for unprocessed contents (e.g., new processing accessory rings) and another SSP or closed system 130 is used to receive processed contents (e.g., used processing accessory rings).

[0025] The processing system 100 includes chambers, such as a factory interface 101 (e.g., an equipment front end module (EFEM)), a transfer chamber 106, and adjacent chambers (e.g., a closed system 130 or the like) adjacent to the factory interface 101 and / or the transfer chamber 106. Typically, the transfer chamber 106 is sealed. In some embodiments, an inert gas (e.g., one or more of nitrogen, argon, neon, helium, krypton, or xenon) is provided to one or more chambers (e.g., the factory interface 101 or the transfer chamber 106) to provide one or more inert environments. In some examples, the factory interface 101 is an inert EFEM that maintains an inert environment (e.g., an inert EFEM minienvironment) within the factory interface 101 so that a user does not need to enter the factory interface 101 (e.g., the processing system 100 is configured to eliminate the need for manual entry within the factory interface 101).

[0026] In some embodiments, a gas flow (e.g., providing an inert gas, providing nitrogen, exhausting gas to provide a vacuum environment, etc.) is provided to one or more chambers of the processing system 100 (e.g., the factory interface 101 or the transfer chamber 106) or provided from one or more chambers of the processing system 100.

[0027] In some embodiments, the airflow is greater than the leakage through the one or more chambers to maintain a positive pressure within the one or more chambers. In some embodiments, the exhaust airflow is greater than the leakage through the one or more chambers to maintain a negative pressure within the one or more chambers.

[0028] In some embodiments, the inert gas within the factory interface 101 is recirculated. In some embodiments, a portion of the inert gas is exhausted. In some embodiments, the airflow of non-recirculated gas entering one or more chambers is greater than the exhaust airflow and gas leakage to maintain a positive pressure of the inert gas in the one or more chambers. In some embodiments, the exhaust airflow out of the one or more chambers is greater than the gas leakage (such as and airflow) entering the one or more chambers to maintain a negative pressure (such as a vacuum environment) in the one or more chambers.

[0029] In some embodiments, one or more chambers are coupled to one or more valves and / or pumps to provide gas flow into and / or out of the one or more chambers. A processing device (e.g., controller 102) controls the gas flow into and out of the one or more chambers. In some embodiments, the processing device receives sensor data from one or more sensors (e.g., oxygen sensors, humidity sensors, motion sensors, door actuation sensors, temperature sensors, pressure sensors, etc.), and determines the flow rate of the inert gas into the one or more chambers and / or the flow rate of the gas out of the one or more chambers based on the sensor data.

[0030] In some embodiments, the chamber (e.g., closed system 130, FOUP, etc.) housing the substrate flipping apparatus 105 is configured to provide gas flow into or out of the chamber. In some examples, gas is exhausted from the chamber housing the substrate flipping apparatus 105 to draw inert gas from the factory interface 101 into the chamber without contaminating the factory interface 101.

[0031] Figure 2A -H shows a substrate turning device 200 according to some embodiments. Figure 2A 1 is a cross-sectional side view of a substrate inverting device 200 for fixing a substrate of a first size. Figure 2B 2 is a cross-sectional side view of the substrate inverting device 200 for fixing a substrate of the second size. Figure 2C is a top view of the substrate turning apparatus 200 in a first configuration and holding a substrate of a first size. Figure 2D is a top view of the substrate turning apparatus 200 in a second configuration and holding a substrate of a second size. Figure 2E is an isometric view of a substrate holding assembly of a substrate turning device. Figure 2F 1 is an enlarged cross-sectional side view of the substrate inverting device 200 for fixing a substrate of a first size. Figure 2G is an isometric view of a first pad of a substrate flipping apparatus 200 configured to hold a substrate of a first size. Figure 2H is an isometric view of a second pad of the substrate turning apparatus 200 configured to hold a substrate of a second size.

[0032] The substrate flipping device 200 includes a clamping actuator 210, a rotary actuator 222, and a substrate fixing assembly 230. The substrate flipping device 200 includes a base structure 250, a backside structure 252, and a clamping bracket 212 (e.g., the clamping actuator 210 is at least partially disposed in the clamping bracket 212). The clamping bracket 212 can also be used as a pneumatic distribution block with various (assorted) channels drilled into the material. In some embodiments, the pneumatic manifold 222 has a pressurized gas inlet and the clamping bracket 212 has a pressurized gas outlet. In some embodiments, one or more parts of the substrate flipping device 200 (such as the rotary actuator 222) have a damper (such as a hydraulic damper (not shown)). In some embodiments, the clamp bracket 212 has one or more mechanical gaskets (e.g., one or more O-rings (not shown)) to seal a passage (e.g., a pneumatic feedthrough (not shown), a passage (not shown) from the rotary actuator 222 through the clamp bracket 212 to the clamp actuator 210). In some embodiments, the clamp bracket 212 has one or more openings (e.g., bores (not shown)) to fluidly couple the pressurized gas outlet to one or more passages (e.g., pneumatic feedthroughs (not shown)) in the clamp bracket 212.

[0033] The substrate fixing assembly 230 is configured to fix substrates of different sizes in-situ. One or more components of the substrate fixing assembly 230 may be rigid to reduce frame droop. In order to prevent substrate fracture, a pressure regulator (not shown) located in the control mechanism (controls) of the substrate flipping device 200 may be used to adjust the clamping force of the clamping actuator 210 to prevent the substrate from fracture. In one embodiment, one or more components of the substrate fixing assembly 230 may be flexible (for example, the upper bracket 234A and the lower bracket 234B may be elastic clamping brackets that deflect to protect the substrate from fracture). The substrate fixing assembly 230 includes an upper portion 232A and a lower portion 232B, and the upper portion 232A and the lower portion 232B are configured in an open position and a plurality of closed positions, each closed position corresponding to fixing substrates of different sizes. In one example, the upper portion 232A and the lower portion 232B are configured (but not limited to) to be in a first closed position and a second closed position, wherein the first closed position holds a substrate of a first size ( Figure 2A ), a substrate of a second size is fixed in a second closed position ( Figure 2B). The substrate of the first size is larger than the substrate of the second size. The upper portion 232A and / or the lower portion 232B are actuated by the clamping actuator 210 to be in any of these closed positions, and actuated by the clamping actuator 210 to be in the open position. Embodiments may include four or more positions to handle three or more substrate sizes. The upper portion 232A includes an upper bracket 234A and an upper structure 240A, the upper bracket 234A is coupled to the clamping actuator 210, and the upper structure 240A is attached to the upper bracket 234A.

[0034] In some embodiments, the upper portion 232A includes a teaching feature 236A (e.g., a feature having a flat upper surface, a cylindrical feature, a feature having a trapezoidal perimeter, etc.). In some embodiments, the teaching feature 236A is disposed on (e.g., attached to, integrated with) the upper bracket 234A. The teaching feature 236A enables the substrate flipping device 200 to have an auto-teach capability. In some embodiments, the end effector of the robot arm determines the position of the teaching feature 236A. In some examples, the end effector determines the position of the teaching feature 236A by disconnecting the optical transmission path (e.g., a light beam, a light beam trigger path) between the first optical path opening of the end effector (e.g., a fiber optic transmitter coupled to a light source) and the second optical path opening of the end effector (e.g., a fiber optic receiver coupled to a light receiver). In response to determining the position of the teaching feature 236A, the robot determines the position of placing and retrieving the substrate (e.g., on the clamping pads 246 and 247). In some embodiments, the teach feature 236 is located at one or more other locations on the substrate turning apparatus 200 (eg, on the lower bracket 234B, etc.).

[0035] The lower portion 232B includes a lower bracket 234B coupled to the clamp actuator 210 and a lower structure 240B attached to the lower bracket 234B. The lower portion 232B and each of its components may be identical to the upper portion 232A.

[0036] Multiple groups of clamping pads are attached to the upper structure 240A and the lower structure 240B. Each group of clamping pads is configured to fix substrates of different sizes in corresponding closed positions. The number of these groups of clamping pads is equal to the number of different sized substrates that can be fixed. In one example, a first group of first clamping pads 246 and a second group of second clamping pads 247 are attached to the structure, thereby allowing two substrates of different sizes to be fixed by the substrate fixing assembly 230.

[0037] The first clamping pad 246 is configured to fix a first substrate 260 of a first size. The second clamping pad 247 is configured to fix a second substrate 261 of a second size (see, e.g. Figure 2B). The first dimension is greater than the second dimension. The first clamping pad 246 is located on the ends of the upper structure 240A and the lower structure 240B. The second clamping pads 247 are positioned on the inner side of the first clamping pads 246. In other words, these second clamping pads 247 are closer to the center of the upper structure 240A and the lower structure 240B than these first clamping pads 246. Therefore, there is space between the first clamping pad 246 and the second clamping pad 247 to accommodate substrates of different sizes.

[0038] Although two groups of clamping pads arranged radially are shown, it is contemplated that more than two groups of clamping pads may be arranged radially relative to each other. Each subsequent group of clamping pads positioned radially closer to the center of the structure (e.g., closer to the center of the upper structure 240A and the center of the lower structure 240B) is vertically shorter than the clamping pads positioned radially farther from the center of the structure to accommodate smaller substrates without interference. For example, the first clamping pad 246 is taller than the second clamping pad 247. The closer each subsequent group of clamping pads is to the center of the structure, the smaller the size of the substrate fixed by each group of clamping pads. For example, the first clamping pad 246 fixes a larger substrate (first substrate 260) than the substrate (second substrate 261) fixed by the second clamping pad 247. The third group of clamping pads positioned closer to the center of the structure than the second clamping pad 247 will be shorter in the vertical direction than the second clamping pad 247, and fix a third substrate that is smaller than the second substrate, and so on.

[0039] In some embodiments, the upper structure 240A and the lower structure 240B are "x" shaped (e.g., both structures have four corners). There are unequal numbers of first clamping pads 246 on the vertically aligned corners of the structures. For example, on the first side 203 of the substrate fixing assembly 230, the upper structure 240A includes two first clamping pads 246, and the lower structure 240B includes one first clamping pad 246. These first clamping pads 246 on the upper structure 240A are horizontally separated by a space between them. The first clamping pad 246 on the lower structure 240B is aligned with the space between the two first clamping pads 246 on the corresponding corners of the upper structure 240A. The lower portion 232B can be oriented so that the top surfaces of the first clamping pad 246 and the second clamping pad 247 attached to the lower structure 240B face the top surfaces of the first clamping pad 246 and the second clamping pad 247 attached to the upper structure 240A.

[0040] In addition, on the second side 205 of the substrate holding assembly 230, the upper structure 240A includes one first clamping pad 246, and the lower structure 240B includes two first clamping pads 246. The first clamping pads 246 on the lower structure 240B are horizontally separated with a space between them. The first clamping pad 246 on the upper structure 240A is aligned with the space between the two first clamping pads 246 on the vertically aligned corners of the lower structure 240B. This forms a tooth-like structure that allows the first clamping pads 246 to mesh (i.e., pass through) each other without contacting each other.

[0041] The first clamping pad 246 is higher than the second clamping pad 247. The height difference allows the first substrate 260 to be fixed in the first closed position and the second substrate 261 (see, for example, Figure 2B ) is fixed in the second closed position. The distance 208 between the upper structure 240A and the lower structure 240B is greater in the first closed position than in the second closed position.

[0042] The rotary actuator 222 is configured to receive pressurized gas to control the clamping actuator 210. The bracket 212 forms a channel (not shown) to provide pressurized gas from the rotary actuator 222 to the clamping actuator 210 (eg, without routing pneumatic lines).

[0043] In some embodiments, the substrate turning device 200 includes one or more speed control valves (not shown) configured to control the rotation speed of the rotation actuator 222 and minimize vibration of the substrate turning device 200 (e.g., reduce the potential of inducing substrate vibration). In some embodiments, the substrate turning device 200 includes a pressure regulator (not shown) configured to adjust the system pressure (e.g., reduce the received gas pressure to a predetermined operating pressure) to control the rotation speed of the rotation actuator 222 and the clamping force of the clamping actuator 210 (e.g., the rotation actuator 222 and the clamping actuator 210 are both operated at the same set pressure).

[0044] In some embodiments, the substrate flipping device 200 includes one or more first sensors (e.g., two sensors (not shown)), the first sensor is coupled to the rotary actuator 222, and the first sensor is configured to provide first sensor data indicating a first position of the rotary actuator 222 (e.g., flipped position, non-flipped position). In some embodiments, the substrate flipping device 200 includes one or more second sensors (e.g., two sensors (not shown)), the second sensor is coupled to the clamping actuator 210 and is configured to provide second sensor data indicating a second position of the clamping actuator 210 (e.g., closed position, open position, etc.). In some embodiments, the substrate flipping device 200 includes a substrate presence sensor 254 (e.g., ultrasonic sensor, optical sensor), and the substrate presence sensor 254 is configured to provide third sensor data indicating the presence of the substrate and the flipping state of the substrate. In addition, the substrate flipping device 200 may include at least two additional sensors (not shown) coupled to the rotary actuator 222 to indicate whether the flipping operation has been completed, and if completed, whether the substrate flipping device 200 is in an upward flipping or downward flipping orientation.

[0045] The substrate flipping device 200 is configured to receive one or more substrates of different sizes (e.g., 200mm and 150mm). In some embodiments, the substrate includes one or more of the following: a glass wafer, a silicon wafer, etc. In some embodiments, the substrate flipping device 200 receives the substrate from a robot (e.g., an atmospheric robot blade) and flips the substrate 180 degrees (e.g., the bottom side becomes the top side). In some embodiments, the rotation occurs along the X-axis or Y-axis and takes into account the robot entry and substrate placement. In some embodiments, the substrate thickness can be 0.3mm to 2.5mm or greater. In some embodiments, the robot substrate hand-off is along the substrate rotation axis or perpendicular to the rotation axis. In some embodiments, there are no moving parts (e.g., wires, tubes, manual adjusters, etc.) above and below the substrate plane. In some embodiments, the pneumatic actuator exhausts away from the substrate plane (e.g., below or behind the barrier of the closed system).

[0046] In some embodiments, the clamping actuator 210 receives pneumatic pressure as input and outputs clamping and opening motions (e.g., open position and closed position). The control of the clamping actuator 210 is pressure and exhaust flow control. In some embodiments, the rotary actuator 222 receives pneumatic pressure as input and outputs rotational motions (e.g., flip position and non-flip position, 0 degree position and 180 degree position, etc.). The control of the rotary actuator 222 is pressure, exhaust flow control, damper, and terminal position.

[0047] The sensor 254 (e.g., an ultrasonic sensor) receives an input of voltage and outputs on or off. The control of the sensor 254 is to teach the distance. The clamp may include two or more magnetic switches (not shown), such as reed switches (e.g., of the clamp actuator 210). The number of magnetic switches depends on the number of groups of clamping pads. The number of magnetic switches is equal to the number of possible positions of the substrate fixing assembly 230. In other words, the number of magnetic switches is equal to the number of groups of clamping pads (i.e., the number of closed positions) plus the number of open positions, one. For example, two groups of clamping pads require three magnetic switches.

[0048] The magnetic switch has a voltage input and an on and off output. The magnetic switch is configured to confirm that the substrate fixing assembly 230 is in a proper closed position. For example, the first magnetic switch is configured to be off when the substrate fixing assembly 230 is open, and to be on when the substrate fixing assembly 230 fixes the first substrate 260 in the first clamping pad 246 (i.e., Figure 2A Similarly, the output of the second magnetic switch is configured to be closed when the substrate fixing assembly 230 is opened, and to be closed when the second clamping pad fixes the second substrate 261 (i.e., Figure 2B The second closed position in the embodiment is opened.

[0049] like Figure 2A As shown, in one embodiment, when the first clamping pads 246 fix the first substrate 260, the substrate fixing assembly 230 is in the first closed position. The first substrate 260 is a substrate of the maximum size that the substrate flipping device 200 can fix. When fixing a substrate of the maximum size, once the first substrate 260 is fixed between the first clamping pads 246, the substrate fixing assembly will stop (stall out). Since the number of first clamping pads 246 on each vertically aligned corner of the upper structure 240A and the lower structure 240B is not equal, these first clamping pads 246 fix the first substrate 260 without interlocking.

[0050] refer to Figure 2B, the second clamping pads 247 secure the second substrate 261 in the second closed position. Due to their positioning, these first clamping pads 246 engage (pass between each other) when the substrate fixing assembly 230 exceeds the first closed position. This allows the shorter second clamping pads 247 to interlock and secure the second substrate 261. The second clamping pads 247 secure the second substrate 261 in the second closed position. The distance 208 between the upper structure 240A and the lower structure 240B is less in the second closed position than in the first closed position. As described above, it is conceivable that more than two groups of clamping pads can be arranged radially with respect to each other. In an example using more than two groups of clamping pads, each group of clamping pads other than the clamping pad closest to the center of the structure (e.g., closest to the center of the upper structure 240A and the center of the lower structure 240B) is positioned in the toothed structure in the same manner as the first clamping pad 246 and is configured to engage. For example, if the third set of clamping pads were positioned closer to the center of the structure than the second clamping pads 247 , the second clamping pads would be positioned and configured to engage in the same manner as the first clamping pads 246 .

[0051] refer to Figure 2C to Figure 2D In some embodiments, the first substrate 260 is secured between each of the first clamping pads 246 attached to both the upper structure 240A and the lower structure 240B (see, for example, Figure 2C ). In addition, each of the second clamping pads 247 attached to both the upper structure 240A and the lower structure 240B is configured to fix the second substrate 261 (see, for example, Figure 2D In some examples, the first substrate 260 has a diameter of 200 mm or 300 mm, and the second substrate 261 has a diameter of 150 mm or 200 mm.

[0052] Figure 2E The substrate fixing assembly 230 of the substrate turning device 200 is shown. The substrate fixing assembly 230 is configured to fix substrates of different sizes in place. One or more components of the substrate fixing assembly 230 are elastic to protect the substrate from cracking.

[0053] The upper structure 240A includes a first upper section 242A and a second upper section 244A that intersect, and a plurality of first clamping pads 246 and a plurality of second clamping pads 247 attached to the upper structure 240A. The first upper section 242A of the upper structure 240A has a capital "I" shape. The first upper section 242A of the upper structure 240 includes two first clamping pads 246 attached to the ends of the capital "I" shape. The second upper section 244A of the upper structure 240A is a straight line shape and includes a single first clamping pad 246 on each end. Therefore, adjacent corners of the upper structure 240A alternate between including one first clamping pad 246 and two first clamping pads 246.

[0054] The second clamping pads 247 are positioned inside the first clamping pads 246. In other words, the second clamping pads 247 are closer to the center of the upper structure 240A than the first clamping pads 246. The first clamping pads 246 and the second clamping pads 247 are oriented in opposite directions.

[0055] In some embodiments, two first clamping pads 246 located at the same corner of the upper structure 240A are horizontally spaced apart. The horizontal space 241 between the two first clamping pads 246 is configured to allow a first clamping pad 246 positioned at a vertically aligned corner of the lower structure 240B to pass between the two first clamping pads 246. In the corner of the upper structure 240A including the two first clamping pads 246, the second clamping pad 247 is aligned with the center of the horizontal space 241 between the two first clamping pads 246. In the corner of the upper structure 240A having one first clamping pad 246, the second clamping pad 247 is aligned with the center of the first clamping pad 246. As described above, the first clamping pad 246 is higher than the second clamping pad 247.

[0056] The lower structure 240B includes a first lower section 242B and a second lower section 244B, and a plurality of first clamping pads 246 and a plurality of second clamping pads 247 attached to the lower structure 240B.

[0057] The first lower section 242B of the lower structure 240B has a capital "I" shape. The first lower section 242B of the lower structure 240B includes two first clamping pads 246 attached to the ends of the capital "I" shape. The second lower section 244B of the lower structure 240B is a straight line shape and includes a single first clamping pad 246 on each end. The second clamping pads 247 are positioned inside these first clamping pads 246. In other words, each second clamping pad 247 is closer to the center of the lower structure 240B than these first clamping pads 246.

[0058] Thus, adjacent corners of the lower structure 240B alternate between including one first clamping pad 246 and two first clamping pads 246. For example, a corner of the lower structure 240B that is vertically aligned with a corner of the upper structure 240A having two first clamping pads 246 includes one first clamping pad 246 (or vice versa).

[0059] The first upper section 242A of the upper structure 240A and the second lower section 244B of the lower structure 240B are positioned in directions parallel to each other. Likewise, the second upper section 244A of the upper structure 240A and the first lower section 242B of the lower structure 240B are positioned in directions parallel to each other. The horizontal space 241 between the two first clamping pads 246 of the array on the upper structure 240A is aligned with the single first clamping pads 246 on the lower structure 240B. The horizontal space 241 between the array of first clamping pads 246 on the lower structure 240B is aligned with the single first clamping pads 246 on the upper structure 240A. The second clamping pads 247 on the upper structure 240A and the second clamping pads 247 on the lower structure 240B are each aligned with each other.

[0060] In some embodiments, the first clamping pads 246 and the second clamping pads 247 have different heights. The height 243 of the second clamping pads 247 is configured to allow them to receive a substrate from a robot blade. The height 243 of the second clamping pads 247 takes into account the thickness of the robot blade, the minimum clearance required above and below the blade, and the maximum possible substrate sag. Therefore, the height 243 of the second clamping pads 247 is between 12 and 16 mm, such as 14 mm.

[0061] The height of the first clamping pads 246 is configured based on the height 243 of the second clamping pads 247 and the maximum substrate sag. Therefore, there is a minimum height difference 249 of at least 2.4 mm between the substrate drop-off surface of the first clamping pads 246 and the top surface of the second clamping pads 247.

[0062] In some embodiments, the upper structure 240A is attached to both the first clamping pad 246 and the second clamping pad 247 via fasteners 256 (e.g., such as bolts, screws, etc.). In some embodiments, the fasteners 256 extend through the upper structure 240A and a portion of the first clamping pad 246 and a portion of the second clamping pad 247. The fasteners 256 extend into a helicoil mounted on the bottom surface of the first clamping pad 246 and the second clamping pad 247. In addition, the upper bracket 234A is attached to the upper structure 240A via a similar attachment means.

[0063] The lower structure 240B is attached to the first clamping pad 246 and the second clamping pad 247 via fasteners 256 (e.g., bolts, screws, etc.). In some embodiments, the fasteners 256 extend through the lower structure 240B and a portion of the first clamping pad 246 and the second clamping pad 247. The fasteners 256 extend into a spiral coil mounted on the bottom surface of the first and second clamping pads 246-247. In addition, the lower bracket 234B is attached to the lower structure 240B via a similar attachment method.

[0064] In some embodiments, the upper bracket 234A and the upper structure 240A are attached to each other in a specific configuration, and the lower bracket 234B and the lower structure 240B are attached to each other in the same configuration, so that a robot arm (such as a blade) approaches the substrate holding assembly 230 from one or more corresponding directions. In some embodiments, the specific configuration provides larger openings on the left and right sides of the substrate holding assembly 230, so that the robot arm approaches the substrate holding assembly 230 from the left and / or right sides to place and remove substrates.

[0065] In one example, the upper structure 240A and the lower structure 240B are constructed such that the angle θ between the front / back of their respective sections, combined with the positioning of the second clamping pad 247, allows at least 5 mm of clearance for a robot arm to approach from the left or right to place a substrate in the substrate holding assembly 230. The angle θ between the respective structure portions may be between about 30 degrees and about 90 degrees.

[0066] In some embodiments, the substrate holding assembly 230 is controlled (e.g., placed in an open position, a closed position, a flip position, a non-flip position) via a pneumatic control device (e.g., providing pressurized gas to the rotation actuator 222 and / or the clamping actuator 210). The use of a pneumatic control device simplifies operation by allowing (e.g., only allowing) two positions, a flip position and a non-flip position (e.g., because no intermediate position is required). In some embodiments, the substrate holding assembly 230 is controlled (e.g., placed in an open position, a closed position, a flip position, a non-flip position) via an electronic control device (e.g., a servo control).

[0067] Figure 2F An enlarged view of the substrate fixing assembly 230 is shown fixing the first substrate 260 between the first clamping pads 246. As described above, the first clamping pads 246 on the vertically aligned corners of the upper structure 240A and the lower structure 240B are not aligned with each other. Therefore, these first clamping pads 246 fix the first substrate 260 by each contacting the first substrate 260 at different points without contacting each other. In other words, these first clamping pads 246 do not interlock with each other.

[0068] Figure 2GAn isometric view of a first clamping pad 246 is depicted. The first clamping pad 246 includes a body 269 and a lip 272, the lip 272 separating a first upper surface 270 from a second upper surface 274. The second upper surface 274 is located above the first upper surface 270. The first substrate 260 rests on the first upper surface 270 of the first clamping pad 246 on the lower structure 240B. The first upper surface 270 is tapered by the lip 272 to contact only a small surface of the first substrate 260. Alternatively, the lip 272 can be an entire platform capable of supporting the first substrate 260. The lip 272 can have a width between 0.5 mm and the diameter of the first substrate 260.

[0069] The first substrate 260 is secured by closing the substrate securing assembly 230 until the first upper surface 270 of each first clamping pad 246 on the upper structure 240A contacts (e.g., secures) the first substrate 260. The first substrate 260 is secured between the first upper surfaces 270 of each first clamping pad 246 and held in place by the lip 272 of each first clamping pad 246.

[0070] The body 269 of the first clamping pad 246 also includes a pin slot 276. The pin slot 276 may have a width between 2 mm and 5 mm. The pin slot 276 is configured to accommodate a pin. The pin solves the alignment problem of the first clamping pad 246 by limiting the rotational freedom of the first clamping pad 246.

[0071] Figure 2H 2 is an isometric view of a second clamping pad 247. The second clamping pad 247 includes a body 279, a first upper surface 282, a second upper surface 285, a third upper surface 284, and a lip 287. The lip 287 may have a width between 0.8 mm and 1.2 mm. The front face 283 of the body 279 may be trimmed to allow clearance for a robot arm (e.g., a blade) configured to place a substrate in the substrate holding assembly 230.

[0072] like Figure 2HAs shown, there is an empty space 286 between the first upper surface 282, the second upper surface 285 and the third upper surface 284. The second substrate 261 rests on the second upper surface 285 of each of these second clamping pads 247 attached to the lower structure 240B. In one embodiment, the second upper surface 285 is beveled by a lip 287 to contact a small surface of the second substrate 261. The second substrate 261 is fixed by closing the substrate fixing assembly 230 until the third upper surface 284 of each of the second clamping pads 247 attached to the upper structure 240A is interlocked via the empty space 286 of the lower structure 240B (or vice versa). This "half tooth" shape allows the second substrate 261 to be fixed between each second upper surface 285 of each of these interlocking second clamping pads 247. This design also enables the same parts to be used for the upper and lower clamping pads.

[0073] The body 279 of the second clamping pad 247 also includes a pin slot 288. The width of the pin slot 288 may be between about 2 mm and 5 mm. The pin slot 288 is configured to receive a pin that is used to limit the rotational freedom of the second clamping pad 247.

[0074] Figure 3A-3B A system 300 including the substrate flipping device 200 is shown. Figure 1 processing system 100).

[0075] In some embodiments, the inverting device 200 can be mounted on the frame 370 to dock with the factory interface 101 at the load port location. In other embodiments, the inverting device 200 can be mounted elsewhere within the factory interface 101 or the transfer chamber 106.

[0076] In some embodiments, the opening 374 of the panel 377 is configured to be sealed to maintain a sealed environment in the system (such as the factory interface 101 or the transfer chamber 106). In some embodiments, the sealed environment includes one or more of the following: compressed dry air, an inert gas (such as nitrogen), a vacuum (such as negative pressure), a positive pressure, etc. In some embodiments, gas is exhausted from the closed system containing the substrate flipping device 200 to the outside of the system to draw gas from the sealed environment of the system 300 (such as the factory interface 101 or the transfer chamber 106) into the closed system and exhaust contaminants from the closed system to the system 300.

[0077] In some embodiments, the pressurized gas used by the substrate flipping apparatus 200 is selected based on the type of gas in the sealed environment. In some examples, for a sealed environment using air such as clean dry air (CDA), the substrate flipping apparatus 200 uses pressurized air such as CDA.

[0078] In some embodiments, the controller 380 is disposed near the substrate turning device 200. In some embodiments, the controller 380 is disposed on the panel 377. In some embodiments, a cover is placed above the controller 380.

[0079] In some embodiments, the controller 380 provides control of pneumatic actuators (eg, the clamping actuator 210 and the rotary actuator 222 of FIG. 2 ), as well as receiving sensor data from the rotary actuator 222 and the clamping actuator 210 via magnetic switches.

[0080] In some embodiments, one or more portions of the substrate turning apparatus 200 (eg, the rotation actuator 222 and the clamping actuator 210 ) are located within a housing (eg, in addition to the closed system 130 surrounding the substrate turning apparatus 200 ) to capture any contaminants (eg, particles).

[0081] Alternatively, the substrate turning device 200 may be separate from the system 300. For example, the substrate turning device may be installed within a tool front end module, and the panel 377 would not be present and the controller 380 would be provided in an alternative location (not shown).

[0082] Figure 3B An enlarged view of a magnetic switch 385 is shown, such as a reed switch included in the clamp actuator 210. The magnetic switch 385 is configured to detect whether an error has occurred in the substrate holding assembly 230. In one example, the clamp actuator 210 may include three magnetic switches.

[0083] The controller 380 can utilize the magnetic switches 385 to ensure that the substrate holding assembly 230 holds the substrate of the correct size. For example, the first magnetic switch 390 is configured to detect when the substrate holding assembly 230 is in a fully open position, the second magnetic switch 395 is configured to detect when the substrate holding assembly 230 is in a first closed position, and the third magnetic switch 397 is configured to detect when the substrate holding assembly 230 is in a second closed position.

[0084] For example, the substrate fixing assembly 230 should fix the first substrate 260 in the first clamping pad 246 (i.e., the larger substrate) after closing a known time period. Therefore, when fixing the first substrate 260, after closing the first preprogrammed time period, the controller 380 can check whether the second magnetic switch 395 has been activated. If the second magnetic switch 395 is not activated, the controller 380 can determine that there is an error and refrain from flipping the substrate fixing assembly 230. Similarly, the substrate fixing assembly 230 should fix the second substrate 261 in the second clamping pad 247 (i.e., the smaller substrate) after closing the second preprogrammed time period (longer than the first time period). Therefore, when fixing the second substrate 261, the controller 380 can check whether the third magnetic switch 397 is activated after closing the second preprogrammed time period. If the third magnetic switch 397 is not activated, the controller 380 can determine that there is an error and refrain from flipping the substrate fixing assembly 230.

[0085] Additionally, if a magnetic switch engages for an unexpected wafer size or gripper state, such as engaging the second magnetic switch 395 when the third magnetic switch 397 should be engaged (or vice versa), the controller 380 determines that there is an error and restricts flipping of the substrate holding assembly 230 .

[0086] In other embodiments of the substrate holding assembly 230, an electric motor or other actuation mechanism is used to open, close, and / or flip the upper portion 232A and / or the lower portion 232B.

[0087] Figure 4 A method 400 for using the substrate flipping device 200 is shown according to some embodiments. The method 400 is performed by processing logic, which includes hardware (e.g., circuits, dedicated logic, programmable logic, microcode, processing devices, etc.), software (e.g., instructions running on a processing device, a general-purpose computer system, or a dedicated machine), firmware, microcode, or a combination thereof. In some embodiments, the method 400 is performed in part by a controller device (e.g., Figure 1 In some embodiments, the non-transitory storage medium stores instructions that, when executed by a processing device (eg, controller 102, controller 380, etc.), cause the device to perform method 400.

[0088] For ease of explanation, method 400 is depicted and described as a series of operations. However, operations according to the present disclosure may occur in various orders and / or simultaneously, and may occur with other operations not presented and described herein. In addition, in some embodiments, not all operations shown are performed to implement method 400 according to the disclosed subject matter. In addition, those skilled in the art will understand and appreciate that method 400 may alternatively be represented as a series of interrelated states via a state diagram or event. As described herein, a substrate is placed in substrate fixing assembly 230. Then, clamping actuator 210 moves substrate fixing assembly 230 to a closed position to fix the substrate between a set of clamping pads (e.g., first clamping pad 246 or second clamping pad 247) based on the size of the substrate, and a magnetic switch confirms that substrate fixing assembly 230 is in a correct closed position corresponding to the size of the fixed substrate. Then, substrate fixing assembly 230 is flipped via rotary actuator 222, clamping actuator 210 returns substrate fixing assembly to an open position, and substrate is retrieved from substrate fixing assembly 230.

[0089] At block 402 of the method 400, the substrate fixing assembly 230 and the substrate turning device 200 are in an open position to receive a substrate. In one embodiment, the processing logic pneumatically causes the substrate fixing assembly 230 of the substrate turning device 200 to be in an open position to receive a substrate via the clamping actuator 210 of the substrate turning device 200 (e.g., by sending a first signal to the substrate turning device). The end effector (e.g., blade) of the robot arm can place the substrate on the first clamping pad 246 on the lower structure 240B or on the second clamping pad 247 of the lower structure in a first orientation based on the size of the substrate. In other embodiments, one or more electric motors or other actuation mechanisms cause the clamping actuator 210 of the substrate turning device 200 to be in an open position to receive a substrate.

[0090] At block 404, the processing logic pneumatically causes the substrate fixing assembly 230 to be in a closed position via the clamping actuator 210 (e.g., by sending a second signal to the substrate flipping device 200) to fix the substrate. As described above, based on the size / placement of the substrate, the substrate fixing assembly 230 may stop at a first closed position or continue to a second closed position. In addition, as described above, the substrate fixing assembly 230 is not limited to fixing only two sizes of substrates. The substrate fixing assembly 230 may continue to a further closed position beyond the second closed position to fix additional substrates of different sizes. In other embodiments, one or more electric motors or other actuating mechanisms cause the clamping actuator 210 of the substrate flipping device 200 to be in a closed position to fix the substrate.

[0091] The substrate holding assembly 230 is configured to stop (e.g., stall) at the first closed position when the first substrate 260 is held between the first clamping pads 246. The substrate holding assembly is configured to continue through the first closed position, causing the first clamping pads 246 to engage, and continue to the second closed position to hold the second substrate 261 between the interlocking second clamping pads 247.

[0092] At block 406, the processing logic pneumatically causes the substrate fixing assembly 230 to reach the flipped position via the rotary actuator 222 of the substrate flipping device (e.g., by sending a third signal to the substrate flipping device). As described above, before flipping the substrate fixing assembly, the controller 380 determines whether the substrate fixing assembly is in an error state based on the magnetic switch in the clamping actuator 210. In other embodiments, one or more electric motors or other actuation mechanisms cause the rotary actuator 222 of the substrate flipping device 200 to reach the flipped position to fix the substrate.

[0093] In some embodiments, the system pressure is manually controlled via a pressure regulator of the substrate turning device 200 to adjust the rotation speed of the rotary actuator 222 and the clamping force of the clamping actuator 210. In some embodiments, the processing logic enables the rotary actuator 222 of the substrate turning device 200 to receive pressurized gas to control the clamping actuator 210. In some embodiments, the rotary actuator 222 and the clamping actuator are controllers that are turned on or off (ON or OFF) based on pneumatic flow, and their rotation speeds are preconfigured.

[0094] While the foregoing is directed to embodiments of the present disclosure, other and further embodiments of the disclosure may be devised without departing from the basic scope thereof and the scope of the disclosure is determined by the following claims.

Claims

1. A substrate turning device, comprising: Clamping actuator; and The base plate fixing assembly comprises: an upper structure coupled to the clamping actuator; a lower structure coupled to the clamping actuator; and A plurality of sets of clamping pads are attached to the upper structure and the lower structure, wherein each set of clamping pads is configured to secure substrates of different sizes.

2. The substrate turning apparatus of claim 1, wherein the plurality of groups of clamping pads are spaced radially inward from one another, and wherein the clamping pads of the radially inward group are configured to hold smaller substrates than the clamping pads of the radially outward group.

3. A substrate flipping device as described in claim 1, wherein the multiple groups of clamping pads include a first group of clamping pads and a second group of clamping pads, the first group of clamping pads is configured to fix a first substrate of a first size, and the second group of clamping pads is configured to fix a second substrate of a second size, and the first size is different from the second size.

4. The substrate flipping device according to claim 3, wherein the first set of clamping pads comprises: two first clamping pads attached to both ends of the first upper section of the superstructure; a first clamping pad attached to both ends of the second upper section of the superstructure; two first clamping pads attached to ends of a first lower section of the substructure; and A first clamping pad attached to an end of a second lower section of the lower structure, wherein the first upper section of the upper structure and the second lower section of the lower structure extend in directions parallel to each other, and the second upper section of the upper structure and the first lower section of the lower structure extend in directions parallel to each other.

5. The substrate turning device according to claim 4, wherein: the two first clamping pads attached to the ends of the first upper section of the superstructure are separated by a first horizontal space; and The two first clamping pads attached to the end of the first lower section of the lower structure are separated by a second horizontal space, and the first horizontal distance and the second horizontal distance are equal.

6. The substrate turning device according to claim 5, wherein: the one first clamping pad attached to the end of the second lower section of the lower structure is aligned with the center of the first horizontal space; and The one first clamping pad attached to the end of the second upper section of the superstructure is aligned with the center of the second horizontal space. 7 . The substrate turning device according to claim 3 , wherein the first size is 300 mm or 200 mm in diameter, and the second size is 200 mm or 150 mm in diameter.

8. The substrate turning device of claim 3, wherein the first group of clamping pads and the second group of clamping pads have different heights.

9. A substrate turning device, comprising: Clamping actuator; and The base plate fixing assembly comprises: an upper structure comprising a first upper section and a second upper section coupled to the clamp actuator; a lower structure comprising a first lower section and a second lower section coupled to the clamp actuator; two first clamping pads attached to both ends of the first upper section and the first lower section; a first clamping pad attached to both ends of the second upper section and both ends of the second lower section; and A second clamping pad is placed on each end of the body of the first upper section, the second upper section, the first lower section, and the second lower section, each second clamping pad being positioned radially inward of each of the first clamping pads.

10. The substrate turning device according to claim 9, wherein: The first upper section and the second lower section extend in directions parallel to each other; and The second upper section and the first lower section extend in directions parallel to each other.

11. The substrate turning device according to claim 9, wherein: the two first clamping pads attached to the ends of the first upper section are separated by a first horizontal space; the two first clamping pads attached to the end of the first lower section are separated by a second horizontal space; the one first clamping pad attached to the end of the second lower section is aligned with the center of the first horizontal space; and The one first clamping pad attached to the end of the second upper section is aligned with the center of the second horizontal space.

12. A substrate flipping device as described in claim 9, wherein the first clamping pad is configured to fix a first substrate of a first size, and the second clamping pad is configured to fix a second substrate of a second size, the first size is different from the second size, and wherein the first size is 300 mm or 200 mm in diameter, and the second size is 200 mm or 150 mm in diameter.

13. The substrate turning device of claim 9, wherein the first clamping pad is higher than the second clamping pad. 14 . The substrate turning device of claim 9 , wherein the second clamping pad is positioned closer to centers of both the upper structure and the lower structure than the first clamping pad.

15. A substrate processing system, comprising: transfer chamber; A factory interface, the factory interface being disposed between the transfer chamber and the plurality of closed systems; and A substrate flipping device, the substrate flipping device is arranged in the factory interface, on the factory interface or in the transfer chamber, the substrate flipping device is configured to fix substrates of different sizes, and the substrate flipping device comprises: Clamping actuator; and The base plate fixing assembly comprises: an upper structure coupled to the clamping actuator; a lower structure coupled to the clamping actuator; and A plurality of sets of clamping pads are attached to the upper structure and the lower structure, wherein each set of clamping pads is configured to secure substrates of different sizes.

16. A substrate processing system as described in claim 15, wherein the multiple groups of clamping pads include a first group of clamping pads and a second group of clamping pads, the first group of clamping pads is configured to fix a first substrate of a first size, and the second group of clamping pads is configured to fix a second substrate of a second size, the first size is different from the second size, and wherein the first size is 300 mm or 200 mm in diameter, and the second size is 200 mm or 150 mm in diameter.

17. The substrate processing system of claim 16, further comprising: Controller; and A memory for storing a program to be executed in the controller, the program comprising instructions which, when executed, cause the controller to perform the following steps: placing the substrate holding assembly in a first closed position to clamp a first substrate of a first size between the first set of clamping pads via actuation of the clamping actuator; and The substrate holding assembly is placed in a second closed position via actuation of the clamping actuator to clamp a second substrate of a second size between the second set of clamping pads.

18. The substrate processing system of claim 16, wherein the first set of clamping pads are taller than the second set of clamping pads.

19. The substrate processing system of claim 17, wherein the controller is further configured to flip the substrate fixing assembly via actuation or rotation of an actuator after fixing the first substrate or the second substrate.

20. The substrate processing system of claim 15, wherein the plurality of groups of clamping pads are spaced radially inward from one another, and wherein the clamping pads of the radially inward group are configured to secure smaller substrates than the clamping pads of the radially outward group.

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