Semiconductor element lead welding device and welding method

Abstract

The invention discloses a semiconductor element lead welding device and method, and belongs to the technical field of semiconductor element machining, the semiconductor element lead welding device comprises a mounting box, a driving electric cylinder is arranged in the mounting box, a welding rotating mechanism is arranged at a connecting disc, and the welding rotating mechanism is rotationally connected with the connecting disc; a welding sliding mechanism is arranged on the welding rotating mechanism, a welding wire feeding mechanism is arranged on the welding sliding mechanism, and the welding wire feeding mechanism extends to the position below the automatic welding head. When welding points are adjusted according to welding requirements of semiconductor element welding, a sliding motor works to drive a sliding gear to rotate on a sliding rack, so that a wire feeding frame is driven to move on a rotating gear through two sliding blocks, and the position distance between a welding wire and an automatic welding head is changed; the device can be suitable for welding elements of different sizes, deals with complex welding paths, accurately controls welding drop points and uniformly distributes welding flux.

Description

Technical Field

[0001] The invention belongs to the technical field of semiconductor element processing, and in particular relates to a semiconductor element lead welding device and a welding method. Background Art

[0002] Lead welding is a process of connecting the electrodes on the transistor core with the lead wires (i.e., pins) of the tube socket using metal wires. There are many methods and ways of lead welding, and the most commonly used methods are hot pressing welding, ultrasonic welding, and reverse welding (i.e., knocking welding or flip welding). There are many methods of lead welding, such as ultrasonic bonding, ball welding, etc. In the manufacture of SAW devices, ultrasonic bonding (or ultrasonic spot welding) is generally used because it has the advantages of high connection reliability, simple operation, high welding efficiency, and no need to heat the substrate.

[0003] The existing Chinese patent with publication number CN115194388B discloses a semiconductor lead welding device and a method of using the same, which relates to the technical field of lead welding. The present invention comprises: a connecting tube, a plug-in tube connected by a thread at the bottom of the inner side wall of the connecting tube, an operating groove is provided on the inner side wall of the plug-in tube, and a driving mechanism is rotatably connected to the inner side wall of the operating groove; a clamping mechanism; a pushing mechanism, and the pushing mechanism is installed at the bottom of the plug-in tube; when the present invention is in use, since the outer side wall of the lead is in contact with the driving mechanism, the downward movement of the lead will drive the driving mechanism to work under the action of friction, so that the driving mechanism drives the clamping mechanism to work, until the lead extends out of the bottom of the pushing mechanism to reach a specified position, the clamping mechanism will clamp the lead, thereby effectively limiting the extension length of the lead, preventing the lead extension process from causing the molten ball to be too large, affecting the welding quality, saving resources, and improving resource utilization.

[0004] However, in the process of welding semiconductor components, the above patent cannot adjust the welding position and the size of the welding spot according to the welding requirements of the semiconductor components, which may easily lead to cold welding or wrong welding of the semiconductor components, affecting the welding quality. Summary of the invention

[0005] The embodiment of the present invention provides a semiconductor element lead welding device and a welding method to solve the problems in the prior art.

[0006] The embodiment of the present invention adopts the following technical scheme: a semiconductor component lead welding device, comprising an installation box, a driving electric cylinder is provided in the installation box, an automatic welding head is provided on the telescopic end of the driving electric cylinder, a connecting disk is provided between the automatic welding head and the telescopic end of the driving electric cylinder, a welding rotating mechanism is provided at the connecting disk, the welding rotating mechanism is rotatably connected to the connecting disk, a welding sliding mechanism is provided on the welding rotating mechanism, the welding sliding mechanism and the welding rotating mechanism are slidably matched, a welding wire feeding mechanism is provided on the welding sliding mechanism, and the welding wire feeding mechanism extends to a position below the automatic welding head.

[0007] Furthermore, an external placement disk is provided at the connecting disk, and the external placement disk is concentrically arranged with the connecting disk. A connecting rod is provided on the telescopic end of the driving electric cylinder, and a threaded head is provided at the bottom of the connecting rod. The threaded head is threadedly connected to the center position of the connecting disk, and a wire supply roller is provided at the connecting rod.

[0008] Furthermore, the welding rotating mechanism includes a rotating motor, a rotating gear, a rotating disk and a rotating gear ring arranged on the rotating disk, the rotating disk is rotatably connected to an external placement disk, the rotating motor is located at the top position of the automatic welding head, the rotating gear is connected to the main shaft of the rotating motor, and the rotating gear and the rotating gear ring are meshed with each other.

[0009] Furthermore, a wire feeding rack is provided on the rotating disk, and the wire feeding rack extends to the outside of the external placement disk and extends to a position below the automatic welding head.

[0010] Furthermore, the welding sliding mechanism includes a sliding motor, a sliding gear, a sliding rack and two sliders, the two sliders are symmetrically arranged at the lower position of the wire feeding frame, the wire feeding frame is slidably connected to the rotating disk through the two sliders, the sliding motor is located in the rotating disk, the sliding gear is connected to the main shaft of the sliding motor, the sliding rack is located at the lower position of the wire feeding frame, and the sliding rack is meshed with the sliding gear.

[0011] Furthermore, the welding wire feeding mechanism includes an installation frame, a top conveying wheel, a bottom conveying wheel and a conveying motor. The installation frame is located on the top of the wire feeding frame, the top conveying wheel and the bottom conveying wheel are distributed up and down, and the top conveying wheel and the bottom conveying wheel are rotatably connected to the installation frame. The conveying motor is located on the side wall of the installation frame and is transmission-connected to the bottom conveying wheel. The bottom conveying wheel is provided with a wire threading groove for moving the welding wire.

[0012] Furthermore, the wire feeding frame is provided with a top wire feeding roller and a bottom wire feeding roller, the bottom of the wire feeding frame is provided with an inclined wire plate, and the wire plate is provided with a guide ring.

[0013] A welding method for a semiconductor element lead welding device, the welding method comprising the following steps:

[0014] In the first step, when welding the leads of semiconductor components, the welding wire can be transported to the position of the automatic welding head through the welding wire feeding mechanism, and the distance of each transport is fixed to ensure the accuracy of subsequent welding;

[0015] In the second step, during the welding process, the welding rotating mechanism can realize the circumferential conveying of the welding line to the position below the automatic welding head to ensure the comprehensiveness of the welding;

[0016] The third step is to slide the welding sliding mechanism in the welding rotating mechanism during the welding process, and weld points with different radii can be welded according to the needs of semiconductor component welding to ensure the firmness of semiconductor component welding;

[0017] The fourth step is to weld the semiconductor components through the automatic welding head with the cooperation of the welding rotating mechanism, the welding sliding mechanism and the welding wire feeding mechanism.

[0018] At least one of the above technical solutions adopted in the embodiments of the present invention can achieve the following beneficial effects:

[0019] Firstly, during welding, the present invention drives the rotating gear to rotate by rotating the motor, thereby causing the rotating gear to rotate on the rotating gear ring, thereby driving the rotating disk to rotate on the external placement disk, thereby driving the wire feeding frame to rotate. When welding semiconductor components, the welding wire can be fed evenly. The even wire feeding can ensure the stable supply of solder (welding wire) during the welding process. If the wire feeding is uneven, it may cause excessive solder in certain areas, resulting in solder accumulation. Excessive solder may form a short-circuit bridge, causing adjacent solder joints or component pins to short-circuit, thereby damaging the semiconductor component. Rotating the wire feeding helps to distribute the solder more evenly around the solder joint. When welding multiple solder joints, the shape, size and solder coverage of each solder joint can be basically the same. It helps to distribute the solder more evenly around the solder joint. It can reduce the number of welding interruptions caused by wire feeding problems.

[0020] Secondly, when the present invention adjusts the welding point according to the welding needs of the semiconductor components, the sliding motor drives the sliding gear to rotate on the sliding rack, thereby driving the wire feeding frame to move on the rotating disk through two sliders, thereby changing the position distance between the welding line and the automatic welding head; it can be suitable for the welding of components of different sizes, cope with complex welding paths, accurately control the welding point and evenly distribute solder. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] The drawings described herein are used to provide a further understanding of the present invention and constitute a part of the present invention. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation of the present invention. In the drawings:

[0022] Figure 1 It is a schematic diagram of the three-dimensional structure of the present invention;

[0023] Figure 2 It is a schematic diagram of a partial three-dimensional structure of the present invention;

[0024] Figure 3 It is a partial three-dimensional structure split diagram of the present invention;

[0025] Figure 4 for Figure 3 The enlarged view of point A in the middle;

[0026] Figure 5 It is a three-dimensional structural schematic diagram of the welding sliding mechanism and the wire feeding frame in the present invention;

[0027] Figure 6 It is a three-dimensional structural schematic diagram of the welding wire feeding machine in the present invention;

[0028] Reference numerals:

[0029] Installation box 1, driving electric cylinder 10, automatic welding head 11, connecting disc 12, connecting rod 13, threaded head 14, wire supply roller 15, external placement disc 16, welding rotating mechanism 2, rotating motor 21, rotating gear 22, rotating disc 23, rotating gear ring 24, welding sliding mechanism 3, sliding motor 31, sliding gear 32, sliding rack 33, slider 34, welding wire feeding mechanism 4, installation frame 41, top conveying wheel 42, bottom conveying wheel 43, conveying motor 44, threading groove 45, wire feeding rack 5, top wire feeding roller 51, bottom wire feeding roller 52, guide ring 53. DETAILED DESCRIPTION

[0030] In order to make the purpose, technical solution and advantages of the present invention clearer, the technical solution of the present invention will be clearly and completely described below in conjunction with the specific embodiments of the present invention and the corresponding drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0031] The following describes in detail the technical solutions of a semiconductor element lead welding device and a welding method provided by various embodiments of the present invention in conjunction with the accompanying drawings.

[0032] Reference Figures 1 to 6As shown, an embodiment of the present invention provides a semiconductor element lead welding device, including an installation box 1, wherein a driving electric cylinder 10 is provided in the installation box 1, an automatic welding head 11 is provided on the telescopic end of the driving electric cylinder 10, a connecting disk 12 is provided between the automatic welding head 11 and the telescopic end of the driving electric cylinder 10, a welding rotating mechanism 2 is provided at the connecting disk 12, the welding rotating mechanism 2 is rotatably connected to the connecting disk 12, a welding sliding mechanism 3 is provided on the welding rotating mechanism 2, the welding sliding mechanism 3 is slidably matched with the welding rotating mechanism 2, a welding wire feeding mechanism 4 is provided on the welding sliding mechanism 3, and the welding wire feeding mechanism 4 extends to the lower position of the automatic welding head 11.

[0033] Specifically, an external placement disk 16 is provided at the connecting disk 12, and the external placement disk 16 is concentrically arranged with the connecting disk 12. A connecting rod 13 is provided on the telescopic end of the driving electric cylinder 10, and a threaded head 14 is provided at the bottom of the connecting rod 13. The threaded head 14 is threadedly connected to the center position of the connecting disk 12, and a wire supply roller 15 is provided at the connecting rod 13.

[0034] When welding semiconductor components, the electric cylinder 10 can be driven to move the automatic welding head 11 downward through the connecting rod 13, so as to weld the semiconductor components. The wire supply roller 15 can rotate on the connecting rod 13 to supply wire for subsequent welding. When replacing the wire on the wire supply roller 15, the connecting head can be rotated so that the threaded head 14 rotates on the connecting disc 12, the connecting head can be removed from the connecting disc 12, and the wire supply roller 15 can be replaced. The wire supply roller 15 is provided with welding wire.

[0035] Specifically, the welding rotating mechanism 2 includes a rotating motor 21, a rotating gear 22, a rotating disk 23 and a rotating gear ring 24 arranged on the rotating disk 23. The rotating disk 23 is rotatably connected to the external placement disk 16. The rotating motor 21 is located at the top position of the automatic welding head 11. The rotating gear 22 is connected to the main shaft of the rotating motor 21, and the rotating gear 22 and the rotating gear ring 24 are meshed with each other.

[0036] During welding, the rotating motor 21 drives the rotating gear 22 to rotate, so that the rotating gear 22 rotates on the rotating gear ring 24, thereby driving the rotating disk 23 to rotate on the external placement disk 16, thereby driving the wire feeding frame 5 to rotate. When welding semiconductor components, the welding wire can be fed evenly. Uniform wire feeding can ensure the stable supply of solder welding wire during welding. If the wire feeding is uneven, it may cause excessive solder in certain areas and solder accumulation. Excessive solder may form a short-circuit bridge, causing adjacent solder joints or component pins to short-circuit, thereby damaging the semiconductor component; rotating wire feeding helps to make the solder more evenly distributed around the solder joint. When welding multiple solder joints, the shape, size and solder coverage of each solder joint can be basically the same; it helps to make the solder more evenly distributed around the solder joint; it can reduce the number of welding interruptions caused by wire feeding problems.

[0037] Specifically, a wire feeding rack 5 is disposed on the rotating disk 23 , and the wire feeding rack 5 extends to the outside of the external placement disk 16 and to a position below the automatic welding head 11 .

[0038] Specifically, the welding sliding mechanism 3 includes a sliding motor 31, a sliding gear 32, a sliding rack 33 and two sliders 34. The two sliders 34 are symmetrically arranged at the lower position of the wire feeding frame 5. The wire feeding frame 5 is slidably connected to the rotating disk 23 through the two sliders 34. The sliding motor 31 is located in the rotating disk 23. The sliding gear 32 is connected to the main shaft of the sliding motor 31. The sliding rack 33 is located at the lower position of the wire feeding frame 5, and the sliding rack 33 is meshed with the sliding gear 32.

[0039] When adjusting the welding point according to the welding needs of the semiconductor component welding, the sliding motor 31 works to drive the sliding gear 32 to rotate on the sliding rack 33, thereby driving the wire feeding frame 5 to move on the rotating disk 23 through the two sliders 34, thereby changing the position distance between the welding line and the automatic welding head 11;

[0040] First, it can cope with different component sizes: semiconductor components have various sizes and shapes. When the welding wire can rotate and change the position distance between it and the automatic welding head 11, it can better adapt to components of different sizes. Second, it can cope with complex welding paths: some semiconductor components have complex pin layouts or internal connection structures, and the welding paths may be curved or have multiple levels. The rotatable and position-adjustable characteristics of the welding wire make it easier to weld along these complex paths. Third, the solder landing point can be accurately controlled: by changing the position distance between the welding wire and the automatic welding head 11, the solder landing point can be accurately controlled. When soldering high-precision semiconductor components, the appropriate position distance can enable the solder to accurately fall on the connection between the pin and the pad, avoiding the solder from deviating from the target position and causing short circuits or cold joints. Moreover, the rotation of the welding line can enable the solder to contact the welding part at the best angle and posture, further improving the accuracy of welding. Fourth, evenly distribute the solder: For some situations where the solder needs to be evenly distributed over a large area or between multiple solder joints, a rotatable and position-adjustable welding line is very helpful. By adjusting the position and rotation angle of the welding line, the solder can be evenly spread on the contact surface, improving the heat conduction efficiency, thereby ensuring the performance and reliability of the semiconductor components.

[0041] Specifically, the welding wire feeding mechanism 4 includes a mounting frame 41, a top conveying wheel 42, a bottom conveying wheel 43 and a conveying motor 44. The mounting frame 41 is located at the top of the wire feeding frame 5. The top conveying wheel 42 and the bottom conveying wheel 43 are distributed up and down. The top conveying wheel 42 and the bottom conveying wheel 43 are rotatably connected to the mounting frame 41. The conveying motor 44 is located on the side wall of the mounting frame 41 and is transmission-connected to the bottom conveying wheel 43. The bottom conveying wheel 43 is provided with a threading groove 45 for moving the welding wire.

[0042] When the welding wire is fed, the welding wire is located in the top conveying wheel 42 and the bottom conveying threading groove 45, and then the conveying motor 44 works to drive the bottom conveying wheel 43 to rotate on the mounting frame 41, thereby continuously conveying the welding wire forward, so that the welding wire is conveyed to the position below the automatic welding head 11, thereby realizing the welding work of the semiconductor component.

[0043] Specifically, the wire feeding frame 5 is provided with a top wire feeding roller 51 and a bottom wire feeding roller 52, and the bottom of the wire feeding frame 5 is provided with an inclined wire plate, and the wire plate is provided with a guide ring 53. The welding wire passes through the top wire feeding roller 51 and is transported to the bottom wire feeding roller 52, and then passes through the guide ring 53 and moves to the bottom of the automatic welding head 11 to perform wire feeding work on the semiconductor element welding work.

[0044] A welding method for a semiconductor element lead welding device, the welding method comprising the following steps:

[0045] In the first step, when welding the leads of semiconductor components, the welding wire can be transported to the position of the automatic welding head 11 through the welding wire feeding mechanism 4, and the distance of each transport is fixed to ensure the accuracy of subsequent welding;

[0046] In the second step, during the welding process, the welding rotating mechanism 2 can realize the circumferential conveyance of the welding line to the position below the automatic welding head 11 to ensure the comprehensiveness of the welding;

[0047] The third step is to slide the welding sliding mechanism 3 on the welding rotating mechanism 2 during the welding process, and weld points with different radii can be welded according to the welding needs of the semiconductor components to ensure the firmness of the welding of the semiconductor components;

[0048] In the fourth step, the semiconductor element is welded by the automatic welding head 11 under the cooperation of the welding rotating mechanism 2, the welding sliding mechanism 3 and the welding wire feeding mechanism 4.

[0049] The above description is only an embodiment of the present invention and is not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent substitution, improvement, etc. made within the spirit and principle of the present invention should be included in the scope of the claims of the present invention.

Claims

1. A semiconductor element lead bonding device, characterized in that: The invention comprises an installation box (1), wherein a driving electric cylinder (10) is arranged in the installation box (1), an automatic welding head (11) is arranged on the telescopic end of the driving electric cylinder (10), a connecting disc (12) is arranged between the automatic welding head (11) and the telescopic end of the driving electric cylinder (10), a welding rotating mechanism (2) is arranged at the connecting disc (12), the welding rotating mechanism (2) and the connecting disc (12) are rotatably connected, a welding sliding mechanism (3) is arranged on the welding rotating mechanism (2), the welding sliding mechanism (3) and the welding rotating mechanism (2) are slidably matched, a welding wire feeding mechanism (4) is arranged on the welding sliding mechanism (3), and the welding wire feeding mechanism (4) extends to a position below the automatic welding head (11).

2. A semiconductor element lead bonding device according to claim 1, characterized in that: The connecting disc (12) is provided with an external placement disc (16), and the external placement disc (16) is concentrically arranged with the connecting disc (12). A connecting rod (13) is provided on the telescopic end of the driving electric cylinder (10), and a threaded head (14) is provided at the bottom of the connecting rod (13). The threaded head (14) is threadedly connected to the center position of the connecting disc (12), and a wire supply roller (15) is provided on the connecting rod (13).

3. A semiconductor element lead bonding device according to claim 2, characterized in that: The welding rotating mechanism (2) comprises a rotating motor (21), a rotating gear (22), a rotating disk (23) and a rotating gear ring (24) arranged on the rotating disk (23); the rotating disk (23) is rotatably connected to an external placement disk (16); the rotating motor (21) is located at the top position of the automatic welding head (11); the rotating gear (22) is connected to the main shaft of the rotating motor (21); and the rotating gear (22) and the rotating gear ring (24) are meshed with each other.

4. A semiconductor element lead bonding device according to claim 3, characterized in that: A wire feeding frame (5) is provided on the rotating disk (23), and the wire feeding frame (5) extends to the outside of the external placement disk (16) and extends to a position below the automatic welding head (11).

5. A semiconductor element lead bonding device according to claim 4, characterized in that: The welding sliding mechanism (3) comprises a sliding motor (31), a sliding gear (32), a sliding rack (33) and two sliders (34); the two sliders (34) are symmetrically arranged at positions below the wire feeding frame (5); the wire feeding frame (5) is slidingly connected to the rotating disk (23) via the two sliders (34); the sliding motor (31) is located inside the rotating disk (23); the sliding gear (32) is connected to the main shaft of the sliding motor (31); the sliding rack (33) is located at a position below the wire feeding frame (5); and the sliding rack (33) is meshed with the sliding gear (32).

6. A semiconductor element lead bonding device according to claim 1, characterized in that: The welding wire feeding mechanism (4) comprises a mounting frame (41), a top conveying wheel (42), a bottom conveying wheel (43) and a conveying motor (44); the mounting frame (41) is located at the top of the wire feeding frame (5); the top conveying wheel (42) and the bottom conveying wheel (43) are distributed up and down; the top conveying wheel (42) and the bottom conveying wheel (43) are rotatably connected to the mounting frame (41); the conveying motor (44) is located on the side wall of the mounting frame (41) and is transmission-connected to the bottom conveying wheel (43); and the bottom conveying wheel (43) is provided with a threading groove (45) for moving the welding wire.

7. A semiconductor element lead bonding device according to claim 4, characterized in that: The wire feeding frame (5) is provided with a top wire feeding roller (51) and a bottom wire feeding roller (52), and the bottom of the wire feeding frame (5) is provided with an inclined wire plate, and the wire plate is provided with a guide ring (53).

8. A welding method for a semiconductor element lead welding device according to any one of claims 1 to 7, characterized in that: The welding method comprises the following steps: In the first step, when welding the leads of semiconductor components, the welding wire can be transported to the position of the automatic welding head (11) through the welding wire feeding mechanism (4), and the distance of each transport is fixed to ensure the accuracy of subsequent welding; In the second step, during the welding process, the welding rotating mechanism (2) can realize the circumferential conveyance of the welding line to the position below the automatic welding head (11), thereby ensuring the comprehensiveness of the welding; The third step is to slide the welding sliding mechanism (3) on the welding rotating mechanism (2) during the welding process, so that welding points with different radii can be welded according to the welding requirements of the semiconductor element, thereby ensuring the firmness of the welding of the semiconductor element; In the fourth step, the semiconductor element is welded by the automatic welding head (11) under the cooperation of the welding rotating mechanism (2), the welding sliding mechanism (3) and the welding wire feeding mechanism (4).

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