Electronic device, spliced electronic equipment and manufacturing method of electronic device
By using the structure of electronic panels, reinforcement plates and adjustment parts in electronic devices, and adjusting the position of the adjustment parts through fixtures, the problem of poor flatness of the electronic device after splicing is solved, and a high-quality display effect is achieved.
Patent Information
- Application Number
- CN202311367876.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2023-10-20
- Publication Date
- 2025-04-22
AI Technical Summary
It is difficult to ensure smoothness after splicing of existing electronic devices, which affects the display quality.
The structure includes an electronic panel, a reinforcement plate and at least three adjustment parts. The adjustment parts are connected to the reinforcement plate through an elastomer, and the position of the adjustment parts is adjusted through a fixture to ensure the consistent distance between the electronic panel and the reinforcement plate.
The spliced electronic devices have good flatness, improve display quality, and reduce the overall tolerance of spliced electronic devices.
Smart Images
Figure CN119865962A_ABST
Abstract
Description
Technical Field
[0001] The present disclosure relates to an electronic device. More specifically, the present disclosure relates to an electronic device having good flatness after splicing. Background Art
[0002] Display panels have been widely used in electronic devices such as mobile phones, televisions, monitors, tablet computers, car displays, wearable devices and desktop computers. With the rapid development of electronic products, the requirements for display quality on electronic products are getting higher and higher, making electronic devices used for display continue to improve towards larger or higher resolution display effects. Summary of the invention
[0003] The present disclosure provides an electronic device, comprising an electronic panel, a reinforcement plate, and at least three adjustment members. The reinforcement plate has a first surface and a second surface opposite to each other, the electronic panel is disposed on the first surface of the reinforcement plate, and the adjustment member is disposed on the second surface. The electronic panel has an upper surface, and a distance is respectively provided between the bottom surface and the upper surface of the adjustment member, and the difference between the aforementioned distances is greater than or equal to 0 and less than or equal to 0.1 mm.
[0004] The present disclosure also provides a spliced electronic device, comprising a support frame and a plurality of the aforementioned electronic devices. The support frame has a support surface, and the electronic devices are arranged on the support surface in a spliced manner.
[0005] The present disclosure further provides a method for manufacturing an electronic device, including providing a carrier having a first area and a second area, placing the aforementioned electronic device on the first area, placing at least three block gauges on the second area, and moving a plane of a fixture relative to the second surface so that the plane contacts and presses down the at least three block gauges and at least three adjustment members. BRIEF DESCRIPTION OF THE DRAWINGS
[0006] In order to make the above-mentioned objects, features and advantages of the present invention more clearly understood, the specific embodiments of the present invention are described in detail below in conjunction with the accompanying drawings, wherein:
[0007] Figure 1A is a schematic diagram of an electronic device according to an embodiment of the present disclosure.
[0008] Figure 1B FIG. 4 is a front view of an electronic device according to an embodiment of the present disclosure.
[0009] Figure 1C It is a partially enlarged view of an electronic device according to an embodiment of the present disclosure.
[0010] Figure 2 It is a schematic diagram showing that an electronic device is disposed on a carrier in one embodiment of the present disclosure.
[0011] Figure 3 It is a schematic diagram showing that an electronic device is moved under a fixture in one embodiment of the present disclosure.
[0012] Figure 4 2 is a schematic diagram showing a jig pressing down and contacting a block gauge and a bump of an electronic device in one embodiment of the present disclosure.
[0013] Figure 5 Yes means Figure 4 A partial enlarged view of .
[0014] Figure 6 Schematic diagram of a support frame in one embodiment of the present disclosure.
[0015] Figure 7 is a schematic diagram showing a spliced electronic device in one embodiment of the present disclosure.
[0016] Figure 1A-7 The reference numerals in the figures are described as follows:
[0017] 100: Reinforcement plate
[0018] 101: Edge
[0019] 110: Side 1
[0020] 120: Side 2
[0021] 121: Storage tank
[0022] 200: Electronic Panel
[0023] 210: Upper surface
[0024] 220: Lower surface
[0025] 300: Adjustment parts
[0026] 310: Elastomer
[0027] 320: Bump
[0028] E: Electronic devices DETAILED DESCRIPTION
[0029] The following describes the electronic device and spliced electronic device of the embodiments of the present disclosure. However, it is easy to understand that the embodiments of the present disclosure provide many suitable disclosure concepts that can be implemented in a wide variety of specific contexts. The specific embodiments disclosed are only used to illustrate the use of the present disclosure in a specific way, and are not used to limit the scope of the present disclosure.
[0030] Certain words are used in this disclosure and the appended claims to refer to specific components. Those skilled in the art will understand that electronic equipment manufacturers may refer to the same components by different names. This document does not intend to distinguish between components that have the same function but different names. In the following description and claims, words such as "including", "having" and the like are open-ended words, and therefore should be interpreted as meaning "including but not limited to..." Therefore, when the terms "including" and / or "having" are used in the description of the present disclosure, they specify the existence of corresponding features, areas, steps, operations and / or components, but do not exclude the existence of one or more corresponding features, areas, steps, operations and / or components.
[0031] In addition, relative terms, such as "below" and "above", may be used in the embodiments to describe the relative relationship of one component to another component in the drawings. It is understood that if the device in the drawings is turned upside down, the component described on the "below" side will become the component on the "above" side.
[0032] When a corresponding component (such as a film layer or region) is referred to as being "on another component", it can be directly on the other component, or other components can exist between the two. On the other hand, when a component is referred to as being "directly on another component", there is no component between the two. In addition, when a component is referred to as being "on another component", the two have a top-down relationship in the top view direction, and the component can be above or below the other component, and this top-down relationship depends on the orientation of the device.
[0033] In some embodiments of the present disclosure, terms related to bonding and connection, such as “connected”, etc., unless otherwise defined, may refer to two structures being in direct contact, or may refer to two structures not being in direct contact and having other structures disposed between the two structures.
[0034] It is understood that although the terms "first", "second", etc. may be used herein to describe various components, layers and / or parts, these components, layers and / or parts should not be limited by these terms, and these terms are only used to distinguish different components, layers and / or parts. Therefore, a first component, layer and / or part discussed below may be referred to as a second component, layer and / or part without departing from the teachings of some embodiments of the present disclosure. In addition, for the sake of brevity, the terms "first", "second", etc. may not be used in the specification to distinguish different components. Without violating the scope defined by the preceding claims, the first component and / or second component recorded in the claims may be interpreted as any component that conforms to the description in the specification.
[0035] Here, the terms "about" and "approximately" generally mean within 15% of a given value or range, such as within 10%, within 5%, within 3%, within 2%, within 1%, or within 0.5%. The quantity given here is an approximate quantity, that is, in the absence of a specific description of "about" or "approximately", the meaning of "about" or "approximately" may still be implied. Unless otherwise defined, all terms used herein (including technical and scientific terms) have the same meanings as those commonly understood by technicians in the field to which this disclosure belongs. It should be noted that these terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning consistent with the background or context of the relevant technology and the present disclosure, and should not be interpreted in an idealized or overly formal manner unless specifically defined herein. In addition, for the sake of concise expression, some components may be appropriately omitted in the drawings of this case.
[0036] First see Figure 1A , an electronic device E of an embodiment of the present disclosure mainly includes a reinforcement plate 100, an electronic panel 200, and a plurality of adjustment members 300. For example, the electronic device E may include a display device, a backlight device, an antenna device, a sensing device, or a combination thereof, but not limited thereto. The display device may be a non-self-luminous display device or a self-luminous display device. The antenna device may be a liquid crystal antenna device or a non-liquid crystal antenna device. The sensing device may be a sensing device for sensing capacitance, light, heat or ultrasound, but not limited thereto. The electronic panel may include a plurality of electronic components, and the electronic components may include passive components and active components, such as capacitors, resistors, inductors, diodes, transistors, etc. The aforementioned diode may include a light-emitting diode or a photodiode. The light-emitting diode may include, for example, an organic light-emitting diode (OLED), a sub-millimeter light-emitting diode (mini LED), a micro light-emitting diode (micro LED) or a quantum dot light-emitting diode (quantum dot LED), but not limited thereto.
[0037] The reinforcing plate 100 includes a material having sufficient rigidity (such as metal or plastic), and has a first surface 110 and a second surface 120 opposite to each other. The electronic panel 200 is disposed on the first surface 110, and an upper surface 210 serving as a display surface of the electronic panel 200 faces away from the first surface 110. In this embodiment, the size (length, width) of the reinforcing plate 100 is substantially the same as the size (length, width) of the electronic panel 200, so that the electronic panel 200 can be fully supported from the lower surface 220 of the electronic panel 200.
[0038] The adjusting member 300 is disposed on the second surface 120 of the reinforcing plate 100. Specifically, the second surface 120 of the reinforcing plate 100 may be formed with a plurality of receiving grooves 121, and the adjusting member 300 may be disposed in the aforementioned receiving grooves 121 one by one. Each adjusting member 300 may include an elastic body 310 and a protrusion 320, and the protrusion 320 is connected to the second surface 120 of the reinforcing plate 100 by the elastic body 310, so that the elastic body 310 will be disposed between the protrusion 320 and the second surface 120 of the reinforcing plate 100. The elastic body 310 may be flexible, so that the protrusion 320 can move relative to the reinforcing plate 100 by deformation of the elastic body 310. For example, the elastic body 310 may include foam or a spring, but is not limited thereto.
[0039] It should be noted that if Figures 1A to 1C As shown, when the protrusion 320 of the adjustment member 300 is located at the desired position relative to the reinforcement plate 100, an adhesive member 330 can be used to fill the receiving groove 121. The adhesive member 330 can be arranged between the protrusion 320 and the side wall of the receiving groove 121 and contact the two to stick the protrusion 320 and the reinforcement plate 100, so that the position of the protrusion 320 can be fixed. At this time, a distance can be formed between the bottom surface 321 of the protrusion 320 facing away from the reinforcement plate 100 and the upper surface 210 of the electronic panel 200, and the difference in the aforementioned distance in each adjustment member 300 is greater than or equal to 0 and less than or equal to 0.1 millimeter (millimeter, mm), or greater than or equal to 0 and less than or equal to 0.05 millimeter. In detail, as Figure 1B As shown, there is a distance DA between the bottom surface 321 of the protrusion 320 in one adjustment member 300A and the upper surface 210 of the electronic panel 200, and there is a distance DB between the bottom surface 321 of the protrusion 320 in the other adjustment member 300B and the upper surface 210 of the electronic panel 200, and the difference between the distance DA and the distance DB is greater than or equal to 0 and less than or equal to 0.1 mm (or 0.05 mm). In addition, there is a distance DC between the bottom surface 321 of the protrusion 320 in the other adjustment member 300C and the upper surface 210 of the electronic panel 200, and the difference between the distance DC and the distance DA is greater than or equal to 0 and less than or equal to 0.1 mm (or 0.05 mm), and the difference between the distance DC and the distance DB is greater than or equal to 0 and less than or equal to 0.1 mm (or 0.05 mm). In other words, the bottom surface 321 of each adjusting member 300 may be spaced substantially the same distance from the upper surface 210 of the electronic panel 200 , and the protrusion 320 may protrude from the second surface 120 of the reinforcing plate 100 .
[0040] In addition, it should be noted that the electronic device E should include at least three adjustment members 300. When the number of the adjustment members 300 is only three, the three adjustment members 300 should avoid being arranged on the same straight line. When the number of the adjustment members 300 is greater than three, the three adjustment members 300 can be arranged on the same straight line. In this embodiment, the receiving groove 121 for accommodating the adjustment member 300 can be arranged along the edge 101 of the reinforcing plate 100 to facilitate filling the adhesive member 330 in the receiving groove 121.
[0041] The following is a description of the manufacturing method of the electronic device E. Figure 2 First, a carrier R may be provided. The carrier R may have a first area R1 and a second area R2, and the first area R1 may be located between the second area R2. The electronic device E (a combination of the reinforcing plate 100, the electronic panel 200, and the adjusting member 300) may be disposed in the first area R1 of the carrier R, and at least three blocks B may be disposed in the second area R2. When the electronic device E is disposed on the carrier R, the electronic panel 200 is located between the reinforcing plate 100 and the carrier R, that is, the adjusting member 300 is exposed from above.
[0042] Secondly, if Figure 3 and Figure 4 As shown, the carrier R can move along the track L to the bottom of the jig C, and the jig C can move toward the electronic device E. The plane C1 of the jig C facing the electronic device E can move relative to the electronic device E toward its second surface 120, contact the bottom surface 321 of the protrusion 320 of the adjustment member 300 and press the protrusion 320 downward. Since the elastic body 310 is flexible and connects the protrusion 320 and the reinforcing plate 100 on the opposite side of the protrusion 320 relative to the jig C, when the jig C presses the protrusion 320 downward, the elastic body 310 can be compressed and deformed, thereby adjusting the relative position of the protrusion 320 and the reinforcing plate 100. When the plane C1 of the jig C contacts and presses down the block gauge B, the jig C will not be able to deform the block gauge B, so the jig C will stop. In this way, the protrusions 320 of each adjusting member 300 will be adjusted to substantially the same height, and the distance between the bottom surface 321 of the protrusion 320 of each adjusting member 300 and the upper surface 210 of the electronic panel 200 is substantially the same as the thickness T of the block gauge B.
[0043] Then, if Figure 5As shown, after the step of moving the plane C1 of the aforementioned jig C relative to the second surface 120, the user can fill the adhesive material A into the receiving groove 121, specifically, it can be set between the protrusion 320 and the side wall of the receiving groove 121 and contact both. Finally, the user can solidify the adhesive material A to form the aforementioned adhesive member 330, so that the adjustment member 300 can be fixed on the reinforcement plate 100, and the position of the protrusion 320 can be fixed by the adhesive member 330. For example, the adhesive material A can be a photocurable colloid, and the user can use ultraviolet light to irradiate the adhesive material A to solidify it, but it is not limited to this. Through the above steps, the manufacture of the electronic device E of the present disclosure can be completed.
[0044] In some embodiments, the adhesive material A may also be applied between the adjustment member 300 and the reinforcing plate 100 before the plane C1 of the jig C moves relative to the second surface 120. In such an embodiment, the adhesive material A is still cured after the step of moving the plane C1 of the jig C relative to the second surface 120.
[0045] See also Figure 6 and Figure 7 When the aforementioned electronic device E is used to manufacture the spliced electronic device P, a support frame F may be provided first, and the support frame F may have a substantially horizontal support surface F1. Next, a plurality of electronic devices E produced using the aforementioned manufacturing method may be provided, and the bottom surface 321 of the protrusion 320 in the electronic device E may contact the support surface F1 of the support frame F. Since the electronic device E is adjusted by the jig C, the distance between the bottom surface 321 of the protrusion 320 in each electronic device E and the upper surface 210 of the electronic panel 200 is substantially the same as the thickness T of the block gauge B, thereby reducing the tolerance between the electronic devices E and improving the overall performance of the spliced electronic device P.
[0046] The features of the aforementioned embodiments may be mixed and matched as desired as long as they do not violate the spirit of the invention or conflict with each other.
[0047] In summary, the present disclosure provides an electronic device, including an electronic panel, a reinforcement plate, and at least three adjustment members. The reinforcement plate has a first surface and a second surface opposite to each other, the electronic panel is disposed on the first surface of the reinforcement plate, and the adjustment member is disposed on the second surface. The electronic panel has an upper surface, and a distance is respectively provided between the bottom surface and the upper surface of the adjustment member, and the difference between the aforementioned distances is greater than or equal to 0 and less than or equal to 0.1 mm.
[0048] The present disclosure also provides a spliced electronic device, comprising a support frame and a plurality of the aforementioned electronic devices. The support frame has a support surface, and the electronic devices are arranged on the support surface in a spliced manner.
[0049] The present disclosure further provides a method for manufacturing an electronic device, including providing a carrier having a first area and a second area, placing the aforementioned electronic device on the first area, placing at least three block gauges on the second area, and moving a plane of a fixture relative to the second surface so that the plane contacts and presses down the at least three block gauges and at least three adjustment members.
[0050] Although the embodiments and advantages of the present disclosure have been disclosed as above, it should be understood that any person skilled in the art may make changes, substitutions and modifications without departing from the spirit and scope of the present disclosure. In addition, the scope of protection of the present disclosure is not limited to the processes, machines, manufactures, material compositions, devices, methods and steps in the specific embodiments described in the specification. Any person skilled in the art may understand the current or future developed processes, machines, manufactures, material compositions, devices, methods and steps from the disclosure of the present disclosure, as long as they can implement substantially the same functions or obtain substantially the same results in the embodiments described herein, they can all be used according to the present disclosure. Therefore, the scope of protection of the present disclosure includes the above-mentioned processes, machines, manufactures, material compositions, devices, methods and steps. In addition, each claim constitutes an individual embodiment, and the scope of protection of the present disclosure also includes the combination of each claim and embodiment.
[0051] Although the present disclosure is disclosed as above with the aforementioned several preferred embodiments, they are not used to limit the present disclosure. Those skilled in the art of the present disclosure may make some changes and modifications without departing from the spirit and scope of the present disclosure. Therefore, the protection scope of the present disclosure shall be determined by the above-attached claims. In addition, each claim constitutes an independent embodiment, and the combination of various claims and embodiments is within the scope of the present disclosure.
Claims
1. An electronic device, characterized in that: include: an electronic panel; A reinforcing plate having a first surface and a second surface opposite to each other, wherein the electronic panel is disposed on the first surface of the reinforcing plate; as well as At least three adjustment members are arranged on the second surface, wherein the electronic panel has an upper surface, and there is a distance between the bottom surfaces of the at least three adjustment members and the upper surface respectively, and the difference between the multiple distances is greater than or equal to 0 and less than or equal to 0.1 mm.
2. The electronic device according to claim 1, wherein: The second surface has at least three accommodating grooves, and the at least three adjusting members are respectively disposed in the at least three accommodating grooves.
3. The electronic device according to claim 2, wherein: The reinforcing plate has an edge, and the at least three accommodating grooves are respectively arranged along the edge.
4. The electronic device as claimed in claim 2, characterized in that: Each of the at least three adjusting members includes an elastic body and a protrusion, and the elastic body is arranged between the protrusion and the reinforcing plate. 5 . The electronic device as claimed in claim 4 , further comprising an adhesive member disposed between the protrusion and the side wall of the receiving groove.
6. A spliced electronic device, characterized in that: include: A support frame having a support surface; as well as A plurality of electronic devices are arranged on the support surface in a splicing manner, wherein each electronic device comprises: an electronic panel; a reinforcing plate having a first surface and a second surface opposite to each other, the electronic panel being disposed on the first surface of the reinforcing plate; and At least three adjustment members are arranged on the second surface, wherein the electronic panel has an upper surface, and there is a distance between the bottom surfaces of the at least three adjustment members and the upper surface respectively, and the difference between the multiple distances is greater than or equal to 0 and less than or equal to 0.1 mm.
7. The spliced electronic device according to claim 6, characterized in that: The bottom surfaces of the at least three adjusting members contact the supporting surface.
8. A method for manufacturing an electronic device, characterized in that: include: Providing a carrier having a first area and a second area; Disposing an electronic device on the first area, wherein the electronic device comprises a reinforcing plate, an electronic panel disposed on a first surface of the reinforcing plate, and at least three adjustment members disposed on a second surface of the reinforcing plate; placing at least three block gauges on the second area; and A plane of a fixture is moved relative to the second surface so that the plane contacts and presses down the at least three block gauges and the at least three adjustment members.
9. The manufacturing method according to claim 8, characterized in that: Before the step of moving the plane of the fixture relative to the second surface, the method further comprises: An adhesive material is applied between the at least three adjustment members and the reinforcing plate.
10. The manufacturing method according to claim 9, characterized in that: After the step of moving the plane of the fixture relative to the second surface, the method further comprises: The adhesive material is cured to fix the at least three adjustment members on the reinforcing plate.