A circuit board chip soldering device and soldering method for preventing deviation

Abstract

The present invention discloses a circuit board chip welding device and a welding method for preventing deviation, which relates to the field of chip welding. The device includes a welding workbench, on which a welding robot is installed. A welding positioning groove is formed on the welding workbench, and a hot melting mechanism is arranged on the welding workbench. The hot melting mechanism includes a horizontal sliding seat, a vertical plate and a hot melting plate. The horizontal sliding seat is slidably arranged on the welding workbench, and the sliding direction of the horizontal sliding seat is parallel to the welding positioning groove. The vertical plate is fixed on the horizontal sliding seat, and the hot melting plate is slidably arranged on the vertical plate. A rectangular groove is formed through the middle of the hot melting plate, and a plurality of hot melting wires are arranged on two opposite inner walls of the rectangular groove. The plurality of hot melting wires are arranged at equal intervals in the horizontal direction. First, the welding robot tins the chip welding holes on the circuit board. The hot melting wires are located between two adjacent welding holes and are used to keep the tin in a hot melting state, ensuring that the chip will not move during the welding process, greatly reducing the welding defect rate and improving the welding quality.

Description

Technical Field

[0001] The invention relates to the technical field of chip welding, and in particular to an anti-deviating circuit board chip welding device and a welding method. Background Art

[0002] In the production of integrated circuits, the chip needs to be welded on the circuit board. During the welding process of the chip, the welding quality of the chip directly affects whether the integrated circuit can run smoothly. During welding, the chip pins need to correspond to the chip welding holes on the circuit board, and the welding accuracy requirements are high. Although the traditional manual welding can ensure the welding quality, the labor cost is high and the production efficiency is low. With the rapid development of automated production, the emergence of welding robots has replaced manual welding, greatly improving the welding production efficiency. However, in the welding of the chip, the pins need to be welded on the welding holes of the circuit board in a circle around the chip. Therefore, the welding operation range of the welding robot is large. In order to avoid interference, after the chip is loaded, the limiting mechanism, negative pressure mechanism, etc. need to be removed. At this time, the chip is placed on the welding hole of the circuit board without restriction for welding. During the welding process, the welding gun of the welding robot will contact the pins of the chip and weld the pins on the circuit board by pushing back and forth. Since the chip is not limited, the welding robot is easy to push the chip to move during the welding process, causing the chip to shift, causing the pins to be out of the welding hole, resulting in defective welding products. Summary of the invention

[0003] The purpose of the present invention is to overcome the deficiencies of the prior art and to provide an anti-drift circuit board chip welding device and welding method to solve the deficiencies of the prior art.

[0004] The objective of the present invention is achieved through the following technical solutions: an anti-deviating circuit board chip welding device, comprising a welding workbench, a welding robot is installed on the welding workbench, a welding positioning groove is provided on the welding workbench, the outer dimensions of the welding positioning groove match the outer dimensions of the circuit board, a hot melt mechanism is provided on the welding workbench, the hot melt mechanism comprises a horizontal slide, a vertical plate and a hot melt plate, the horizontal slide is slidably arranged on the welding workbench, the sliding direction of the horizontal slide is parallel to the welding positioning groove, the vertical plate is fixed on the horizontal slide, the hot melt plate is slidably arranged on the vertical plate, the moving direction of the vertical plate is perpendicular to one end direction of the horizontal slide on the water surface, a rectangular groove is provided through the middle part of the hot melt plate, a plurality of hot fuses are arranged on two opposite inner walls of the rectangular groove, and the plurality of hot fuses are arranged at equal intervals in the horizontal direction, the chip welding hole of the circuit board is first tinned by the welding robot, and the hot fuse is located between two adjacent welding holes to make the tin in a hot melt state.

[0005] Further, a strip-shaped groove is formed in the top surface of the welding workbench. A first lead screw is rotatably arranged in the strip-shaped groove. The horizontal sliding seat is slidably fitted in the strip-shaped groove, and the horizontal sliding seat is threadedly sleeved on the first lead screw. A pushing cylinder is installed on the vertical plate. The telescopic shaft of the pushing cylinder is connected with a connecting rod. One end of the connecting rod away from the pushing cylinder is provided with a thread. The connecting rod is threadedly connected with the hot melting plate. The hot melting wire is in a downwardly convex arc shape.

[0006] Further, the vertical plate includes a fixed body and a lifting body. The fixed body is connected to the horizontal sliding seat. A control cavity is arranged in the fixed body. The lifting body is located directly above the fixed body. A sliding strip is fixed to the bottom of the lifting body. The sliding strip slidably penetrates through the fixed body. An electromagnet is installed in the control cavity. One end of the sliding strip extends into the control cavity and is connected with a permanent magnet. The electromagnet is energized to generate a magnetic pole opposite to that of the permanent magnet. A spring is arranged between the electromagnet and the permanent magnet. The top of the fixed body is threadedly connected with a limiting screw rod. A distance measuring sensor is installed at the bottom of the lifting body. The limiting screw rod is located on the detection path of the distance measuring sensor.

[0007] Further, a feeding mechanism is further included. The feeding mechanism includes a circuit board feeding box, a chip feeding column and a multi-directional conveying mechanism. The circuit board feeding box and the chip feeding column are respectively arranged at two ends of the welding workbench. A circuit board storage groove is formed in the top of the circuit board feeding box. Circuit boards are stacked horizontally in the circuit board feeding box, and the circuit boards are arranged vertically. A storage groove is axially penetrated through the top of the chip feeding column. A pin groove is formed in the side wall of the storage groove. The pin groove extends to the top of the chip feeding column. Chips are stacked axially in the storage groove, and the pins of the chips are located in the pin groove.

[0008] Further, a pushing conveyor belt is arranged at the bottom of the circuit board feeding box. The circuit board feeding box is bolted to the conveying frame of the pushing conveyor belt. A pushing plate is fixed on the conveying plane of the pushing conveyor belt. A pushing window is formed through the side wall of the circuit board feeding box and extends to the bottom of the circuit board feeding box. A material blocking cylinder is installed on the side wall of the circuit board feeding box. The telescopic shaft of the material blocking cylinder movably penetrates into the circuit board feeding box and is connected with a material blocking plate. The material blocking plate and the pushing plate are arranged oppositely. A feeding shaft is rotatably arranged at one end of the material blocking plate close to the pushing plate.

[0009] Further, the chip loading column is mounted on the loading platform. A linear driving module is vertically arranged on one side of the chip loading column. A top plate is arranged inside the chip loading column. An avoidance groove is formed in the side wall of the chip loading column and extends to the bottom of the chip loading column. A horizontal connecting rod is connected to the slide of the linear driving module, and the horizontal connecting rod passes through the avoidance groove and is connected to the top plate.

[0010] Further, the multi-directional conveying mechanism includes a U-shaped bracket, a chip loading component and a circuit board loading component. The chip loading component and the circuit board loading component are arranged vertically and staggeredly. The chip loading component includes a chip cross beam, a chip slide plate and a chip lifting seat. The chip cross beam is slidably mounted on the U-shaped bracket. The chip slide plate is slidably arranged on the chip cross beam. The moving direction of the chip slide plate is perpendicular to the moving direction of the chip cross beam on the horizontal plane. A chip loading cylinder is vertically mounted on the chip slide plate. The chip lifting seat is mounted on the telescopic shaft of the chip loading cylinder. A negative pressure loading pipe is mounted at the bottom of the chip lifting seat. The circuit board loading component includes a circuit board cross beam, a circuit board slide plate, a circuit board lifting seat and a turning plate. The circuit board cross beam is slidably arranged on the U-shaped bracket. The circuit board slide plate is slidably arranged on the circuit board cross beam. The moving direction of the circuit board cross beam is perpendicular to the moving direction of the circuit board slide plate on the horizontal plane. A circuit board loading cylinder is vertically mounted on the circuit board slide plate. The circuit board lifting seat is mounted on the telescopic shaft of the circuit board loading cylinder. The turning plate is rotatably mounted at the bottom of the circuit board lifting seat. A negative pressure suction cup is mounted on the circuit board lifting seat. An avoidance window is formed in the side wall of the circuit board loading box close to the circuit board loading component and extends to the top of the circuit board loading box. The negative pressure suction cup enters through the avoidance window for loading the circuit board.

[0011] Further, a first lead screw groove is horizontally formed in the U-shaped bracket. A second lead screw is rotatably arranged in the first lead screw groove. One end of the chip cross beam is threadedly sleeved on the second lead screw. A second lead screw groove is formed in the bottom of the chip cross beam. A third lead screw is rotatably arranged in the second lead screw groove. A first lead screw slider is threadedly sleeved on the third lead screw. The chip slide plate is connected to the first lead screw slider. A first motor is mounted on the U-shaped bracket. The output shaft of the first motor is drivingly connected to the second lead screw. A second motor is mounted at one end of the chip cross beam. The output shaft of the second motor is drivingly connected to the third lead screw.

[0012] Further, a third lead screw groove is horizontally formed in the U-shaped bracket. The third lead screw groove is located below the first lead screw groove. A fourth lead screw is rotatably arranged in the third lead screw groove. The circuit board cross beam is threadedly sleeved on the fourth lead screw. A third motor is installed on the U-shaped bracket. The output shaft of the third motor is drivingly connected to the fourth lead screw. A fourth lead screw groove is formed at the bottom of the circuit board cross beam. A fifth lead screw is rotatably arranged in the fourth lead screw groove. A second lead screw slider is threadedly sleeved on the fifth lead screw. The circuit board slide plate is connected to the second lead screw slider. A fourth motor is installed at one end of the circuit board cross beam. The output shaft of the fourth motor is drivingly connected to the fifth lead screw. An installation notch is formed at the bottom of the circuit board lifting seat. A rotating main shaft is rotatably arranged in the installation notch. The shape of the turning plate is an inverted T shape. The turning plate is fixedly sleeved on the rotating main shaft. A fifth motor is installed on the side wall of the circuit board lifting seat. The output shaft of the fifth motor is drivingly connected to the rotating main shaft.

[0013] A method for welding a circuit board chip to prevent deviation, using the above welding device, includes the following steps:

[0014] S1. Feeding the circuit board; feeding the circuit board into the welding positioning groove so that the upper surface of the circuit board is completely exposed;

[0015] S2. Tinning the chip welding holes; plating a layer of tin on the chip welding holes through a welding robot;

[0016] S3. Heating the tin on the welding holes through the heating wires on the hot melt plate so that the tin layer is in a hot melt state;

[0017] S4. Feeding the chip onto the circuit board through the rectangular groove, then resetting the hot melt mechanism, and positioning the chip in advance by tinning;

[0018] S5. Finally, performing full welding on the chip through a welding robot to complete the welding operation of the chip.

[0019] The beneficial effects of the present invention are:

[0020] First, a layer of solder is pre-applied to the chip welding area of the circuit board. The heating wires of the hot melt plate contact the solder, and the heat generated by the heating wires keeps the solder in a molten state all the time. Then, the chip is fed onto the circuit board so that the pins of the circuit board correspond to the welding holes on the circuit board. Then, the hot melt plate is removed, and the solder liquid cools and fixes the pins of the circuit board, so that the position of the chip can be positioned and restricted before welding. Finally, full welding is performed on the chip through a welding robot, which can ensure that the chip will not move during the welding process, greatly reducing the welding defect rate and improving the welding quality.

[0021] DESCRIPTION OF THE DRAWINGS BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 Partial structural schematic of a circuit board chip welding device for preventing deviation in the present invention Figure 1 ;

[0023] Figure 2 is Figure 1 The enlarged view at position B in

[0024] Figure 3 Partial structural schematic of a circuit board chip welding device for preventing deviation in the present invention Figure 2 ;

[0025] Figure 4 Partial structural schematic of a circuit board chip welding device for preventing deviation in the present invention Figure 3 ;

[0026] Figure 5 Partial structural schematic of a circuit board chip welding device for preventing deviation in the present invention Figure 4 ;

[0027] Figure 6 Schematic diagram of the structure of the vertical plate in a circuit board chip welding device for preventing deviation in the present invention;

[0028] Figure 7 Partial structural schematic of a circuit board chip welding device for preventing deviation in the present invention Figure 5 ;

[0029] Figure 8 is Figure 7 The enlarged view at position A in

[0030] Figure 9 Schematic diagram of the structure of a circuit board chip welding device for preventing deviation in the present invention;

[0031] In the figure, 1 - welding workbench, 2 - welding robot, 3 - welding positioning groove, 4 - horizontal slide, 5 - vertical plate, 6 - hot melt plate, 7 - rectangular groove, 8 - hot melt wire, 9 - strip groove, 10 - first lead screw, 11 - pushing cylinder, 12 - connecting rod, 13 - fixed body, 14 - lifting body, 15 - control cavity, 16 - slide bar, 17 - electromagnet, 18 - permanent magnet, 19 - spring, 20 - limit screw, 21 - distance measuring sensor, 22 - circuit board loading box, 23 - chip loading column, 24 - storage groove, 25 - pin slot, 26 - pushing conveyor belt, 27 - pushing plate, 28 - pushing window, 29 - material pressing cylinder, 30 - material pressing plate, 31 - loading shaft, 32 - loading platform, 33 - linear drive module, 34 - ejecting plate, 35 - avoidance groove, 36 - horizontal connecting rod, 37 - U-shaped bracket, 38 - chip cross beam, 39 - chip slide plate, 40 - chip lifting seat, 41 - chip loading cylinder, 42 - negative pressure loading pipe, 43 - circuit board cross beam, 44 - circuit board slide plate, 45 - circuit board lifting seat, 46 - turning plate, 47 - circuit board loading cylinder, 48 - negative pressure suction cup, 49 - avoidance window, 50 - first lead screw groove, 51 - second lead screw, 52 - second lead screw groove, 53 - third lead screw, 54 - first motor, 55 - second motor, 56 - third lead screw groove, 57 - fourth lead screw, 58 - third motor, 59 - fourth lead screw groove, 60 - fifth lead screw, 61 - installation notch, 62 - rotating main shaft, 63 - fourth motor, 64 - fifth motor. Specific embodiments

[0032] The technical solutions of the present invention will be further described in detail below with reference to the accompanying drawings, but the protection scope of the present invention is not limited to the following.

[0033] Example 1:

[0034] As Figures 1 to 9As shown in the figure, an anti-offset circuit board chip soldering device includes a soldering workbench 1, on which a soldering robot 2 is installed. A soldering positioning groove 3 is provided on the soldering workbench 1, and the outer dimensions of the soldering positioning groove 3 match the outer dimensions of the circuit board. A hot melting mechanism is arranged on the soldering workbench 1. The hot melting mechanism includes a horizontal sliding seat 4, a vertical plate 5 and a hot melting plate 6. The horizontal sliding seat 4 is slidably arranged on the soldering workbench 1, and the sliding direction of the horizontal sliding seat 4 is parallel to the soldering positioning groove 3. The vertical plate 5 is fixed on the horizontal sliding seat 4, and the hot melting plate 6 is slidably arranged on the vertical plate 5. The moving direction of the vertical plate 5 is perpendicular to one end direction of the horizontal sliding seat 4 on the water surface. A rectangular groove 7 is formed through the middle of the hot melting plate 6, and a number of hot melting wires 8 are arranged on the two opposite inner walls of the rectangular groove 7. The number of hot melting wires 8 is arranged at equal intervals in the horizontal direction. First, the soldering robot 2 tins the chip welding holes on the circuit board. The hot melting wires 8 are located between adjacent two welding holes and are used to keep the tin in a hot melting state. It also includes a feeding mechanism, which is used to feed the circuit board into the soldering positioning groove 3 and at the same time can also feed the chip onto the circuit board. During soldering, the feeding mechanism first places the circuit board in the soldering positioning groove 3, and the circuit board is limited by the soldering positioning groove 3 to prevent offset during soldering. Then, the soldering robot 2 first coats a layer of solder on the chip soldering area of the circuit board. Generally, for a rectangular soldering area, only any two side welding holes need to be coated. After the solder coating is completed, the hot melting plate 6 moves to the chip soldering area of the circuit board, so that the hot melting wires 8 are inserted into the solder, and the heat generated by the hot melting wires 8 melts the solder, keeping the solder in a liquid state all the time. Then, the feeding mechanism feeds the chip onto the circuit board. The chip passes through the rectangular groove 7 and is positioned and fed into the chip soldering area, so that the pins of the chip correspond to the chip welding holes on the circuit board. At the same time, the solder in a liquid state does not limit the position of the chip, and the chip can be finely adjusted on the circuit board to make the pins correspond to the chip welding holes one by one. When the chip feeding is completed, the hot melting plate 6 moves away from the circuit board. At this time, the solder quickly cools and solidifies, thus limiting the position of the chip. Finally, the soldering robot 2 solders the chip, which can ensure that the chip will not move during the soldering process, greatly reducing the soldering defect rate and improving the soldering quality. The movement of the horizontal sliding seat 4 can adjust the X-axis position of the hot melting plate 6, and the movement of the hot melting plate 6 can adjust the Y-axis position, so as to be able to adjust the working position of the hot melting plate 6, make the hot melting wires 8 located between adjacent two welding holes, and make the chip not interfere with the hot melting plate 6 when being fed onto the circuit board without removing the hot melting plate 6.

[0035] According to the above, a corresponding anti-offset soldering method is provided, including the following steps:

[0036] S1. Circuit board feeding: Feed the circuit board into the soldering positioning groove 3 to make the upper surface of the circuit board completely exposed;

[0037] S2. Tin plating on the chip soldering holes; A layer of tin is plated on the chip soldering holes by the soldering robot 2;

[0038] S3. Heat the tin on the soldering holes through the heating wire on the hot melt plate 6 to make the tin layer in a hot melt state;

[0039] S4. Feed the chip onto the circuit board through the rectangular groove 7, then reset the hot melt mechanism, and position the chip by pre-plating tin;

[0040] S5. Finally, the chip is fully soldered by the soldering robot 2 to complete the soldering operation of the chip.

[0041] Embodiment 2:

[0042] On the basis of Embodiment 1, as Figures 1 to 6As shown in the figure, a strip-shaped groove 9 is formed on the top surface of the welding workbench 1. A first lead screw 10 is rotatably arranged in the strip-shaped groove 9. A horizontal slide seat 4 is slidably fitted in the strip-shaped groove 9, and the horizontal slide seat 4 is threadedly sleeved on the first lead screw 10. A pushing cylinder 11 is installed on the vertical plate 5. The telescopic shaft of the pushing cylinder 11 is connected with a connecting rod 12. One end of the connecting rod 12 away from the pushing cylinder 11 is provided with a thread, and the connecting rod 12 is threadedly connected with a hot melt plate 6. The hot melt wire 8 is in a downwardly convex arc shape. The first lead screw 10 is driven by a motor installed on the welding workbench 1. When the first lead screw 10 rotates, the horizontal slide seat 4 on it moves horizontally. The hot melt plate 6 is driven to move by the telescopic movement of the pushing cylinder 11, so that the position of the hot melt plate 6 can be adjusted to make the hot melt plate 6 correspond to the chip welding area on the circuit board. The vertical plate 5 includes a fixed body 13 and a lifting body 14. The fixed body 13 is connected to the horizontal slide seat 4. A control cavity 15 is arranged in the fixed body 13. The lifting body 14 is located directly above the fixed body 13. A slide bar 16 is fixed to the bottom of the lifting body 14. The slide bar 16 slidably penetrates through the fixed body 13. An electromagnet 17 is installed in the control cavity 15. One end of the slide bar 16 extends into the control cavity 15 and is connected with a permanent magnet 18. When the electromagnet 17 is energized, it generates a magnetic pole opposite to that of the permanent magnet 18. A spring 19 is arranged between the electromagnet 17 and the permanent magnet 18. The top of the fixed body 13 is threadedly connected with a limit screw 20. A distance measuring sensor 21 is installed at the bottom of the lifting body 14. The limit screw 20 is located on the detection path of the distance measuring sensor 21. When the hot melt mechanism works, first, the position of the horizontal slide seat 4 is adjusted corresponding to the installation position of the chip, so that the X-axis position of the hot melt plate 6 corresponds to the welding position of the chip. For subsequent circuit boards in batch production, there is no need to reposition the horizontal slide seat 4. The pushing cylinder 11 drives the hot melt plate 6 to move to directly above the chip welding area. Then, the electromagnet 17 is energized, and the electromagnet 17 attracts the permanent magnet 18 to make the lifting body 14 squeeze the spring 19 and move downward, so that the hot melt plate 6 contacts the circuit board. And the bottom of the hot melt wire 8 is located above the bottom of the hot melt plate 6. After the hot melt plate 6 contacts the circuit board, the hot melt wire 8 does not contact the circuit board, and the hot melt wire 8 is inserted into the solder. The hot melt wire 8 is energized to heat the hot melt wire 8, so that the solder remains in a liquid state. When the chip feeding is completed, the electromagnet 17 is powered off, and the lifting body 14 moves upward under the reaction force of the spring 19, so that the hot melt plate 6 is located above the chip. Finally, the pushing cylinder 11 contracts to drive the hot melt plate 6 to reset, so as not to affect the welding operation of the welding robot 2;It should be noted that since the thicknesses of different circuit boards are different, for different circuit boards, the descending position of the lifting body 14 needs to be adjusted correspondingly so that the hot melt plate 6 can smoothly contact the circuit board without interference with the circuit board. For this purpose, a limit screw 20 is provided to control the descending position of the lifting body 14. When the lifting body 14 contacts the limit screw 20, the lifting body 14 cannot continue to move downward. By rotating the limit screw 20, the limit height can be adjusted, and the ranging sensor 21 can accurately reflect the descending height of the lifting body 14, so that the position of the limit screw 20 can be adjusted correspondingly according to the thickness of the circuit board, and then the descending position of the lifting body 14 can be adjusted to make the hot melt plate 6 accurately contact the circuit board.

[0043] Embodiment Three:

[0044] On the basis of Embodiment Two, as Figures 1 to 8 shown, the feeding mechanism includes a circuit board feeding box 22, a chip feeding column 23 and a multi-directional conveying mechanism. The circuit board feeding box 22 and the chip feeding column 23 are respectively arranged at both ends of the welding workbench 1. The top of the circuit board feeding box 22 is provided with a circuit board storage groove. The circuit boards are stacked horizontally in the circuit board feeding box 22 and are arranged vertically. The top of the chip feeding column 23 is axially penetrated with a storage groove 24. The side wall of the storage groove 24 is provided with a pin groove 25, and the pin groove 25 extends to the top of the chip feeding column 23. The chips are stacked axially along the chip feeding column 23 in the storage groove 24, and the pins of the chips are located in the pin groove 25. The circuit boards are stacked in the circuit board feeding box 22, and the circuit boards are positioned by the circuit board feeding box 22. The circuit boards are stacked vertically in the circuit board feeding box 22 so that the circuit boards will not be damaged by mutual extrusion. The chips are light in weight and small in volume, and are directly stacked in the storage groove 24 of the chip feeding column 23, and the chips will not be damaged by extrusion either. First, the multi-directional conveying mechanism places the circuit boards in the circuit board feeding box 22 into the welding positioning groove 3, and then the hot melt mechanism moves to the chip welding area. At the same time, the multi-directional conveying mechanism feeds the chips to the chip welding area to complete the preliminary welding positioning of the chips. Finally, the hot melt mechanism and the multi-directional conveying mechanism are reset, and the welding robot 2 performs the final welding operation on the chips.

[0045] Embodiment Four:

[0046] On the basis of Embodiment Three, as Figures 1 to 8As shown, the chip loading column 23 is installed on the loading platform 32. A linear drive module 33 is vertically arranged on one side of the chip loading column 23. A top plate 34 is arranged inside the chip loading column 23. An avoidance groove 35 is formed in the side wall of the chip loading column 23, and the avoidance groove 35 extends to the bottom of the chip loading column 23. A horizontal connecting rod 36 is connected to the sliding seat of the linear drive module 33, and the horizontal connecting rod 36 passes through the avoidance groove 35 and is connected to the top plate 34. By driving the top plate 34 to move upward by the linear drive module 33, each time the top plate 34 moves upward by the thickness of one chip, so as to push out the chips from the storage groove 24 in sequence, keeping the feeding position of each chip unchanged and ensuring the accuracy of feeding. Secondly, the side wall of the chip loading column 23 is connected to the loading platform 32 by bolts. After the chips in the chip loading column 23 are loaded, the chip loading column 23 full of chips is removed and replaced. The multi-directional conveying mechanism includes a U-shaped bracket 37, a chip loading component and a circuit board loading component. The chip loading component and the circuit board loading component are arranged in a vertical and staggered manner. The chip loading component includes a chip cross beam 38, a chip slide plate 39 and a chip lifting seat 40. The chip cross beam 38 is slidably installed on the U-shaped bracket 37. The chip slide plate 39 is slidably arranged on the chip cross beam 38. The moving direction of the chip slide plate 39 is perpendicular to the moving direction of the chip cross beam 38 on the horizontal plane. A chip loading cylinder 41 is vertically installed on the chip slide plate 39. The chip lifting seat 40 is installed on the telescopic shaft of the chip loading cylinder 41. A negative pressure feeding pipe 42 is installed at the bottom of the chip lifting seat 40. A first lead screw groove 50 is horizontally formed in the U-shaped bracket 37. A second lead screw 51 is rotatably arranged in the first lead screw groove 50. One end of the chip cross beam 38 is threadedly sleeved on the second lead screw 51. A second lead screw groove 52 is formed at the bottom of the chip cross beam 38. A third lead screw 53 is rotatably arranged in the second lead screw groove 52. A first lead screw slider is threadedly sleeved on the third lead screw 53. The chip slide plate 39 is connected to the first lead screw slider. A first motor 54 is installed on the U-shaped bracket 37. The output shaft of the first motor 54 is drivingly connected to the second lead screw 51. A second motor 55 is installed at one end of the chip cross beam 38. The output shaft of the second motor 55 is drivingly connected to the third lead screw 53. The specific chip loading process is as follows: the first motor 54 drives the second lead screw 51 to rotate, so that the chip cross beam 38 makes a linear movement along the axial direction of the second lead screw 51, giving the negative pressure feeding pipe 42 the freedom to move in the Y-axis direction. The second motor 55 drives the third lead screw 53 to rotate, so that the first lead screw slider drives the chip slide plate 39 to move along the axial direction of the third lead screw 53, giving the negative pressure feeding pipe 42 the freedom to move in the X-axis direction. The chip loading cylinder 41 drives the chip lifting seat 40 to move up and down, giving the negative pressure feeding pipe 42 the freedom to move in the Z-axis direction. Thus, the negative pressure feeding pipe 42 has the freedom to move in three directions in the space coordinate system. After the chip is adsorbed by the negative pressure of the negative pressure feeding pipe 42, the chip can be accurately loaded into the welding area of the circuit board.

[0047] Embodiment Five:

[0048] Based on the fourth embodiment, Figures 1 to 8 As shown, a push conveyor belt 26 is provided at the bottom of the circuit board loading box 22, and the circuit board loading box 22 is connected to the conveying frame of the push conveyor belt 26 by bolts. A push plate 27 is fixed on the conveying plane of the push conveyor belt 26. A push window 28 is opened through the side wall of the circuit board loading box 22, and the push window 28 extends to the bottom of the circuit board loading box 22. A material-repelling cylinder 29 is installed on the side wall of the circuit board loading box 22. The telescopic shaft of the material-repelling cylinder 29 movably penetrates into the circuit board loading box 22 and is connected to a material-repelling plate 30. The material-repelling plate 30 is arranged opposite to the push plate 27, and the material-repelling plate 30 is close to the push plate 27. A loading shaft 31 is rotatably provided at one end. In order to ensure that the loading position of the circuit board remains unchanged each time, a pushing conveyor belt 26 is provided. In the initial state, the abutting plate 30 contacts the inner wall of the circuit board loading box 22, so that the circuit board loading box 22 has the largest storage space, and the circuit boards are neatly stacked in the circuit board loading box 22. Then, the circuit board loading box 22 is installed on the conveying frame of the pushing conveyor belt 26. Then, the pushing conveyor belt 26 drives the pushing plate 27 to move. The pushing plate 27 enters the circuit board loading box 22 through the pushing window 28 to contact the circuit board. The two ends of the stacked circuit boards are loaded in sequence from the end close to the welding workbench 1. The circuit boards are moved upward and out of the circuit board loading box 22. In the process of the circuit boards moving upward, the loading shaft 31 is in rolling contact with the circuit boards, which will not cause friction damage to the circuit boards. When the loaded circuit boards are separated from the loading shaft 31 and the loaded circuit boards are not completely moved out of the circuit board loading box 22, the abutting cylinder 29 drives the abutting plate 30 to move close to the next circuit board, so that the loading shaft 31 abuts on the next circuit board to complete the limit. Since the loaded circuit boards are not completely moved out of the circuit board loading box 22, the loading cylinder 29 drives the abutting plate 30 to move close to the next circuit board, so that the loading shaft 31 abuts on the next circuit board to complete the limit. The circuit board still partially contacts the next circuit board, and can limit the position of the next circuit board. After the loading shaft 31 contacts the next circuit board, the loaded circuit board is completely moved out of the circuit board loading box 22, which can ensure that the subsequent circuit boards will not be offset due to the gaps during the loading process. After the loaded circuit board moves out of the circuit board loading box 22, the material-receiving cylinder 29 drives the material-receiving plate 30 to reset. At the same time, the pushing conveyor belt 26 drives the pushing plate 27 to move the thickness of a circuit board, so that the next circuit board is in a loading state, thereby ensuring that the loading position of the circuit board is consistent each time, and ensuring the accuracy of the loading.

[0049] Embodiment six:

[0050] Based on Example 5, Figures 1 to 5As shown, the circuit board loading component includes a circuit board cross beam 43, a circuit board slide plate 44, a circuit board lifting seat 45, and a turning plate 46. The circuit board cross beam 43 is slidably arranged on the U-shaped bracket 37. The circuit board slide plate 44 is slidably arranged on the circuit board cross beam 43. The moving direction of the circuit board cross beam 43 is perpendicular to the moving direction of the circuit board slide plate 44 on the horizontal plane. A circuit board loading cylinder 47 is vertically installed on the circuit board slide plate 44. The circuit board lifting seat 45 is installed on the telescopic shaft of the circuit board loading cylinder 47. The turning plate 46 is rotatably installed at the bottom of the circuit board lifting seat 45. A negative pressure suction cup 48 is installed on the circuit board lifting seat 45. An avoidance window 49 is opened on the side wall of the circuit board loading box 22 close to the circuit board loading component. The avoidance window 49 extends to the top of the circuit board loading box 22. The negative pressure suction cup 48 enters through the avoidance window 49 for loading the circuit board. A third lead screw groove 56 is horizontally opened on the U-shaped bracket 37. The third lead screw groove 56 is located below the first lead screw groove 50. A fourth lead screw 57 is rotatably arranged in the third lead screw groove 56. The circuit board cross beam 43 is threadedly sleeved on the fourth lead screw 57. A third motor 58 is installed on the U-shaped bracket 37. The output shaft of the third motor 58 is drivingly connected to the fourth lead screw 57. A fourth lead screw groove 59 is opened at the bottom of the circuit board cross beam 43. A fifth lead screw 60 is rotatably arranged in the fourth lead screw groove 59. A second lead screw slider is threadedly sleeved on the fifth lead screw 60. The circuit board slide plate 44 is connected to the second lead screw slider. A fourth motor 63 is installed at one end of the circuit board cross beam 43. The output shaft of the fourth motor 63 is drivingly connected to the fifth lead screw 60. An installation notch 61 is opened at the bottom of the circuit board lifting seat 45. A rotating main shaft 62 is rotatably arranged in the installation notch 61. The turning plate 46 is in the shape of an inverted T and is fixedly sleeved on the rotating main shaft 62. A fifth motor 64 is installed on the side wall of the circuit board lifting seat 45. The output shaft of the fifth motor 64 is drivingly connected to the rotating main shaft 62. In the initial state, the negative pressure suction cup 48 is perpendicular to the circuit board. The third motor 58 drives the fourth lead screw 57 to rotate, so that the circuit board cross beam 43 makes a linear movement along the axial direction of the fourth lead screw 57, enabling the negative pressure suction cup 48 to have a degree of freedom of movement in the Y-axis direction. The fourth motor 63 drives the fifth lead screw 60 to rotate, so that the circuit board slide plate 44 makes a linear movement along the axial direction of the fifth lead screw 60, enabling the negative pressure suction cup 48 to have a degree of freedom of movement in the X-axis direction. The telescopic movement of the circuit board loading cylinder 47 drives the circuit board lifting seat 45 to move up and down, enabling the negative pressure suction cup 48 to have a degree of freedom of movement in the Z-axis direction. Thus, the negative pressure suction cup 48 has degrees of freedom of movement in three directions in the space coordinate system, enabling the negative pressure suction cup 48 to move from the avoidance window 49 into the circuit board loading box 22 to adsorb the circuit board, then lift the circuit board out of the circuit board loading box 22, and then drive the rotating main shaft 62 to rotate through the fifth motor 64, so that the circuit board rotates downward by 90°, making the circuit board in a horizontal state. Finally, place the circuit board in the welding positioning groove 3 to complete the circuit board loading operation.

Claims

1. A circuit board chip welding device with anti-deviating function, comprising a welding workbench (1), characterized in that: A welding robot (2) is installed on the welding workbench (1); a welding positioning groove (3) is provided on the welding workbench (1); the outer dimensions of the welding positioning groove (3) match the outer dimensions of the circuit board so that the upper surface of the circuit board is completely exposed; a hot melt mechanism is provided on the welding workbench (1); the hot melt mechanism comprises a horizontal slide seat (4), a vertical plate (5) and a hot melt plate (6); the horizontal slide seat (4) is slidably arranged on the welding workbench (1); the sliding direction of the horizontal slide seat (4) is parallel to the welding positioning groove (3); the vertical plate (5) is fixed on the horizontal slide seat (4); and the hot melt plate (6) is slidably arranged on the vertical plate (5); The moving direction of the vertical plate (5) is perpendicular to the direction of one end of the horizontal slide seat (4) on the water surface. A rectangular groove (7) is formed through the middle of the hot melt plate (6). Two opposite inner walls of the rectangular groove (7) are provided with a plurality of hot fuses (8). The hot fuses (8) are arranged at equal intervals in the horizontal direction. First, the chip soldering hole of the circuit board is tinned by the welding robot (2). The hot fuse (8) is located between two adjacent soldering holes and is used to make the tin in a hot melt state. The chip is loaded onto the circuit board through the rectangular groove (7). Then, the hot melt mechanism is reset. The position of the chip is positioned by tinning in advance. Finally, the chip is fully soldered by the welding robot (2) to complete the chip soldering operation. The top surface of the welding workbench (1) is provided with a strip groove (9), a first screw rod (10) is rotatably arranged in the strip groove (9), the horizontal slide seat (4) is slidably adapted to the strip groove (9), and the horizontal slide seat (4) is threadedly sleeved on the first screw rod (10), a pushing cylinder (11) is installed on the vertical plate (5), the telescopic shaft of the pushing cylinder (11) is connected to a connecting rod (12), the connecting rod (12) is provided with a thread at one end away from the pushing cylinder (11), the connecting rod (12) is threadedly connected to the hot melt plate (6), and the hot melt wire (8) is in the shape of a downwardly convex arc; The vertical plate (5) comprises a fixed body (13) and a lifting body (14); the fixed body (13) is connected to the horizontal slide seat (4); a control chamber (15) is arranged in the fixed body (13); the lifting body (14) is located directly above the fixed body (13); a slide bar (16) is fixed at the bottom of the lifting body (14); the slide bar (16) is slidably arranged on the fixed body (13); an electromagnet (17) is installed in the control chamber (15); the slide bar (16) ) is extended from one end of the control cavity (15) and connected to a permanent magnet (18); the electromagnet (17) generates a magnetic pole having a different magnetic property from that of the permanent magnet (18) when energized; a spring (19) is provided between the electromagnet (17) and the permanent magnet (18); a limit screw (20) is threadedly connected to the top of the fixed body (13); a distance sensor (21) is installed at the bottom of the lifting body (14); and the limit screw (20) is located on a detection path of the distance sensor (21).

2. The circuit board chip welding device for preventing deviation according to claim 1, characterized in that: The invention also comprises a loading mechanism, the loading mechanism comprising a circuit board loading box (22), a chip loading column (23) and a multi-directional conveying mechanism, the circuit board loading box (22) and the chip loading column (23) are respectively arranged at two ends of the welding workbench (1), the top of the circuit board loading box (22) is provided with a circuit board storage slot, the circuit boards are stacked in the circuit board loading box (22) along a horizontal direction, and the circuit boards are arranged in a vertical state, the top of the chip loading column (23) is provided with a storage slot (24) penetrating along its own axial direction, the side wall of the storage slot (24) is provided with a pin slot (25), the pin slot (25) extends to the top of the chip loading column (23), the chip is stacked in the storage slot (24) along the axial direction of the chip loading column (23), and the pins of the chip are located in the pin slot (25).

3. The circuit board chip welding device for preventing deviation according to claim 2, characterized in that: A pushing conveyor belt (26) is arranged at the bottom of the circuit board loading box (22), and the circuit board loading box (22) is connected to the conveying frame of the pushing conveyor belt (26) by bolts. A pushing plate (27) is fixed on the conveying plane of the pushing conveyor belt (26). A pushing window (28) is opened through the side wall of the circuit board loading box (22), and the pushing window (28) extends to the bottom of the circuit board loading box (22). A material-repelling cylinder (29) is installed on the side wall of the circuit board loading box (22), and the telescopic shaft of the material-repelling cylinder (29) is movably inserted into the circuit board loading box (22) and connected to a material-repelling plate (30). The material-repelling plate (30) is arranged opposite to the pushing plate (27), and a loading shaft (31) is rotatably arranged at one end of the material-repelling plate (30) close to the pushing plate (27).

4. The circuit board chip welding device for preventing deviation according to claim 2, characterized in that: The chip loading column (23) is installed on the loading platform (32), a linear drive module (33) is vertically arranged on one side of the chip loading column (23), a top plate (34) is arranged in the chip loading column (23), a side wall of the chip loading column (23) is provided with an avoidance groove (35), the avoidance groove (35) extends to the bottom of the chip loading column (23), the slide seat of the linear drive module (33) is connected to a horizontal connecting rod (36), and the horizontal connecting rod (36) passes through the avoidance groove (35) to connect the top plate (34).

5. The circuit board chip welding device for preventing deviation according to any one of claims 3 or 4, characterized in that: The multi-directional conveying mechanism comprises a U-shaped bracket (37), a chip loading assembly and a circuit board loading assembly. The chip loading assembly and the circuit board loading assembly are arranged alternately up and down. The chip loading assembly comprises a chip beam (38), a chip slide plate (39) and a chip lifting seat (40). The chip beam (38) is slidably mounted on the U-shaped bracket (37). The chip slide plate (39) is slidably arranged on the chip beam (38). The moving direction of the chip slide plate (39) is perpendicular to the moving direction of the chip beam (38) on a horizontal plane. A chip loading cylinder (41) is vertically mounted on the chip slide plate (39). The chip lifting seat (40) is mounted on the telescopic shaft of the chip loading cylinder (41). A negative pressure loading pipe (42) is installed at the bottom of the chip lifting seat (40). The circuit board loading assembly comprises a circuit board beam (43), a circuit board slide plate (44), a circuit board lifting seat (45) and a flip plate. (46), the circuit board crossbeam (43) is slidably arranged on the U-shaped bracket (37), the circuit board slide (44) is slidably arranged on the circuit board crossbeam (43), the moving direction of the circuit board crossbeam (43) is perpendicular to the moving direction of the circuit board slide (44) on a horizontal plane, a circuit board loading cylinder (47) is vertically installed on the circuit board slide (44), the circuit board lifting seat (45) is installed on the telescopic shaft of the circuit board loading cylinder (47), the flip plate (46) is rotatably installed on the bottom of the circuit board lifting seat (45), a negative pressure suction cup (48) is installed on the circuit board lifting seat (45), and a side wall of the circuit board loading box (22) close to the circuit board loading assembly is provided with an avoidance window (49), the avoidance window (49) extends to the top of the circuit board loading box (22), and the negative pressure suction cup (48) enters from the avoidance window (49) to load the circuit board.

6. The circuit board chip welding device for preventing deviation according to claim 5, characterized in that: A first lead screw groove (50) is horizontally formed in the U-shaped bracket (37). A second lead screw (51) is rotatably arranged in the first lead screw groove (50). One end of the chip cross beam (38) is threadedly sleeved on the second lead screw (51). A second lead screw groove (52) is formed at the bottom of the chip cross beam (38). A third lead screw (53) is rotatably arranged in the second lead screw groove (52). A first lead screw slider is threadedly sleeved on the third lead screw (53). The chip slide plate (39) is connected to the first lead screw slider. A first motor (54) is installed on the U-shaped bracket (37). The output shaft of the first motor (54) is drivingly connected to the second lead screw (51). A second motor (55) is installed at one end of the chip cross beam (38). The output shaft of the second motor (55) is drivingly connected to the third lead screw (53).

7. The circuit board chip welding device for preventing deviation according to claim 6, characterized in that: A third lead screw groove (56) is horizontally formed in the U-shaped bracket (37). The third lead screw groove (56) is located below the first lead screw groove (50). A fourth lead screw (57) is rotatably arranged in the third lead screw groove (56). The circuit board cross beam (43) is threadedly sleeved on the fourth lead screw (57). A third motor (58) is installed on the U-shaped bracket (37). The output shaft of the third motor (58) is drivingly connected to the fourth lead screw (57). A fourth lead screw groove (59) is formed at the bottom of the circuit board cross beam (43). A fifth lead screw (60) is rotatably arranged in the fourth lead screw groove (59). A second lead screw slider is threadedly sleeved on the fifth lead screw (60). The circuit board slide plate (44) is connected to the second lead screw slider. A fourth motor (63) is installed at one end of the circuit board cross beam (43). The output shaft of the fourth motor (63) is drivingly connected to the fifth lead screw (60). An installation notch (61) is formed at the bottom of the circuit board lifting seat (45). A rotating main shaft (62) is rotatably arranged in the installation notch (61). The shape of the turning plate (46) is an inverted T shape. The turning plate (46) is fixedly sleeved on the rotating main shaft (62). A fifth motor (64) is installed on the side wall of the circuit board lifting seat (45). The output shaft of the fifth motor (64) is drivingly connected to the rotating main shaft (62).

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