Bearing device for temperature imaging test and temperature imaging test method
By using adjustable heating modules and sample fixing modules in temperature imaging tests, the problem of inconsistent heat dissipation conditions in the prior art is solved, and the accuracy of temperature imaging tests is significantly improved.
Patent Information
- Application Number
- CN202510292171.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-12
- Publication Date
- 2025-04-25
AI Technical Summary
The heat dissipation conditions in the prior art are inconsistent with the actual work during the temperature test, resulting in inaccurate temperature test results.
A load bearing device for temperature imaging testing is provided, including an adjustable heating module and a sample fixing module. The heating module can adjust the temperature and fit or separate the sample through a lifting rack and a temperature control platform; the sample fixing module ensures the sample's position stable during the test process by rotating the disc and screw nuts.
By adjusting the contact state between the heating module and the sample, ensuring that the temperature test conditions are close to the actual working conditions, significantly improving the accuracy of the temperature imaging test.
Smart Images
Figure CN119880159A_ABST
Abstract
Description
Technical Field
[0001] The invention belongs to the field of temperature testing, and relates to a bearing device for temperature imaging testing and a temperature imaging testing method. Background Art
[0002] As the power of electronic component products continues to increase, the operating temperature of key electronic components and chips continues to rise, affecting the life and reliability of the products. Therefore, accurate operating temperature test data is of great guiding significance for helping R&D personnel optimize product design. Existing temperature tests mainly use the infrared radiation of key electronic components and chips in electronic component products, or perform temperature imaging detection on the reflection characteristics of light waves. However, this method usually requires the electronic component products to be placed on the carrier of the test equipment for testing. The heat dissipation capacity of the carrier is much higher than the actual working conditions, which results in the test temperature data being significantly lower than the actual working temperature, resulting in inaccurate temperature test results. Summary of the invention
[0003] The purpose of the present invention is to provide a bearing device and a temperature imaging test method for temperature imaging testing, which can effectively solve the problem in the prior art that the heat dissipation conditions during the temperature test are inconsistent with the actual work, resulting in inaccurate temperature test results, and greatly improve the accuracy of thermal imaging testing.
[0004] In order to achieve the above-mentioned object, one aspect of the present invention provides a carrying device for temperature imaging test, comprising a fixed bottom plate, a heating module and a sample fixing module, wherein the heating module and the sample fixing module are arranged on the fixed bottom plate, the heating module is used to provide the required temperature conditions for the sample to be tested, and the sample fixing module is used to support and fix the sample to be tested; The heating module includes a lifting frame and a temperature control platform arranged on the lifting frame. The lifting frame can be adjusted in height to drive the temperature control platform to be in close contact with or separated from the bottom of the sample to be tested fixed on the sample fixing module. The temperature control platform is used to transfer heat to the sample to be tested when in close contact with the bottom of the sample to be tested, so as to provide the required temperature conditions for the sample to be tested. The temperature control platform is externally connected to a liquid cooling system for controlling the temperature of the temperature control platform. The sample fixing module includes four metal pillars of the same height, four rotating disks, four groups of first screws and nuts, and four groups of second screws and nuts. The four metal pillars are arranged around the heating module. The bottoms of the four metal pillars are respectively fixed on the four rotating disks. The four groups of first screws and nuts are respectively arranged at the centers of the four rotating disks. The rotating disk can be fixed on the fixed bottom plate or rotate around the first screw nuts on the fixed bottom plate by the first screw nuts, so that the position of the metal pillars can be fixed or moved by the first screw nuts. The samples to be tested are fixed on the tops of the four metal pillars by the second screw nuts.
[0005] Preferably, the lifting frame comprises a base with slotted tracks, a loading platform with slotted tracks, a hydraulic rod, two fixed metal rods, and eight cross-support frames; The upper and lower parts of the hydraulic rod are respectively fixed on the base and the loading platform and connected to the cross support frame. The cross support frames are fixedly connected by pins and are respectively fixedly connected to the upper and lower fixed metal rods. The two fixed metal rods are respectively embedded in the slotted tracks of the base and the loading platform; the height adjustment of the lifting frame is achieved by the telescopic height of the hydraulic rod, the lifting angle of the cross support frame and the sliding of the metal fixed rod in the slotted track.
[0006] Preferably, the sample fixing module further comprises four gaskets, which are respectively arranged between the four second screw nuts and the sample to be tested.
[0007] Another aspect of the present invention provides a temperature imaging test method, which uses the above-mentioned carrying device to perform a temperature imaging test, including: A sample loading step, using a sample fixing module to fix the surface position of the sample to be tested; Temperature calibration step: evenly apply a thin layer of thermal conductive silicone grease on the surface of the temperature control platform, adjust the height of the lifting frame so that the temperature control platform fits tightly with the bottom of the sample to be tested, heat the sample to be tested to one or more specific temperatures, and use thermal imaging equipment to obtain the infrared radiation characteristics or reflection characteristics of the test area of the sample to be tested under one or more specific temperature conditions; The temperature test step is to separate the temperature control platform from the bottom of the sample to be tested by adjusting the height of the lifting frame, load the electrical signal required for the sample to be tested, and use the thermal imaging device to obtain the infrared radiation characteristics of the area to be tested or the reflection characteristics of the light wave after the temperature of the sample to be tested reaches stability; The analysis and processing step is to obtain the temperature value of the area to be tested and perform temperature imaging by comparing and analyzing the infrared radiation characteristics or reflection characteristics of the light wave of the area to be tested obtained in the temperature testing step with the infrared radiation characteristics or reflection characteristics of the light wave of the area to be tested under one or more specific temperature conditions obtained in the temperature calibration step.
[0008] Preferably, the temperature imaging test includes an infrared imaging test and a reflectivity imaging test. In the case of the infrared imaging test, the temperature calibration step and the temperature testing step obtain the infrared radiation characteristics of the area to be tested, and in the case of the reflectivity imaging test, the reflection characteristics of the area to be tested to light waves are obtained.
[0009] Preferably, the temperature imaging test is a reflectivity imaging test; In the temperature calibration step, when no power is applied to the sample to be tested, the reflectivity of all positions in the test area at two temperature points, high and low, is tested respectively, and the thermal reflection calibration coefficient is calculated; In the temperature test step, power is applied to put the sample to be tested in a working state, and the reflectivity of all positions in the area to be tested is tested; In the analysis and processing step, based on the test results of the thermal reflection calibration coefficient and the reflectivity, the temperature at different positions of the sample to be tested is calculated, and the temperature data are combined to form a temperature distribution.
[0010] The carrier device and temperature imaging test method for temperature imaging test according to the above aspects of the present invention can effectively solve the problem in the prior art that the heat dissipation conditions during the temperature test are inconsistent with the actual work, resulting in inaccurate temperature test results, and greatly improve the accuracy of thermal imaging testing. BRIEF DESCRIPTION OF THE DRAWINGS
[0011] In order to more clearly illustrate the technical solution of the present invention, the following briefly introduces the drawings used in the description of the embodiments of the present invention. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative work: Figure 1 is a front view of a carrying device for temperature imaging testing according to an embodiment of the present invention; Figure 2 is a top view of a carrying device for temperature imaging testing according to an embodiment of the present invention; Figure 3 is a side view of a carrying device for temperature imaging testing according to an embodiment of the present invention; Figure 4 is a schematic structural diagram of a lifting frame according to an embodiment of the present invention; Figure 5 Schematic diagram of the loading step of the sample to be tested according to the embodiment of the present invention, wherein (a) is a front view; (b) is a side view; Figure 6 Schematic diagram of the loading process of the temperature calibration step according to the embodiment of the present invention, wherein (a) is a front view and (b) is a side view. DETAILED DESCRIPTION
[0012] In order to make the purpose, technical solution and advantages of the present invention clearer, the technical solution of the present invention will be clearly and completely described below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.
[0013] In view of the problem that the heat dissipation conditions of the temperature test process in the prior art are inconsistent with the actual work, resulting in inaccurate temperature test results, an embodiment of the present invention provides a bearing device for temperature imaging testing, such as Figure 1-3 As shown, the supporting device of the embodiment of the present invention includes a fixed base plate 1, an adjustable heating module and an adjustable sample fixing module, the heating module and the sample fixing module are arranged on the fixed base plate 1, the heating module is used to provide the required temperature conditions for the sample to be tested, and the sample fixing module is used to support and fix the sample to be tested.
[0014] The heating module includes a lifting frame 2 and a temperature control platform 3 arranged on the lifting frame 2. The lifting frame 2 can realize precise height control through a knob arranged on the fixed bottom plate 1, driving the temperature control platform 3 to be in close contact with or separated from the bottom of the sample to be tested fixed on the sample fixing module. The temperature control platform 3 is used to transfer heat to the sample to be tested while being in close contact with the bottom of the sample to be tested, so as to provide the required temperature conditions for the sample to be tested. The temperature control platform 3 is provided with a water inlet and outlet for connecting to an external liquid cooling system to control the temperature of the temperature control platform 3. Figure 3 and Figure 4 As shown, the lifting frame 2 includes a base 21 with a slotted track, a loading platform 22 with a slotted track, a hydraulic rod 23, two fixed metal rods 24, and eight cross support frames 25.
[0015] The hydraulic rod 23 may be a T-shaped hydraulic rod, the upper and lower parts of which are respectively fixed on the base 21 and the loading platform 22 and connected to the cross support frame 25, which are fixedly connected by a pin and respectively fixedly connected to the upper and lower fixed metal rods 24, which are respectively embedded in the slotted tracks of the base 21 and the loading platform 22 to form a scissor-type lifting mechanism. The telescopic height of the hydraulic rod 23 is controlled by the knob on the fixed bottom plate 1, and the lifting angle of the cross support frame 25 and the sliding of the fixed metal rod 24 in the slotted track are coordinated to form a stable and efficient height adjustment system to achieve the height adjustment of the lifting frame 2.
[0016] The temperature control platform 3 is located on the loading platform 22 of the lifting frame 2, and is mainly used to carry the samples to be tested and control the temperature. The temperature control platform 3 is made of metal thermal conductive material, which has good thermal conductivity and can quickly and evenly transfer heat to the samples to be tested. The temperature control platform 3 is connected to the external liquid cooling system through the water inlet and outlet, and can accurately adjust the temperature of the platform through the circulating coolant with the help of the liquid cooling system. The liquid cooling system ensures the stability of the temperature through the continuous flow of coolant, so that the platform can continuously provide accurate temperature conditions for the samples to be tested.
[0017] In some embodiments, the hydraulic rod 23 can be replaced by a gas rod, and the gas pressure can be adjusted by a knob or an electronic control panel to control the extension and retraction degree of the gas rod, which is suitable for occasions requiring fast response and lower load.
[0018] In some embodiments, the hydraulic rod 23 can be used in combination with an electric drive device. The hydraulic rod 23 itself is controlled by an electric motor. The flow and pressure of the hydraulic system are adjusted by the electric system to achieve more precise height adjustment.
[0019] In some embodiments, the lifting frame 2 can be a hydraulic lifting system, a spiral lifting system, a magnetic drive lifting system, etc., so as to further meet various requirements for height adjustment, stability, load-bearing capacity and precise control in the laboratory.
[0020] The main function of the adjustable sample fixing module is to support and fix the surface position of the sample to be tested, to ensure that the sample does not move or tilt during the entire experiment, and to avoid experimental errors caused by unstable sample position. The adjustable sample fixing module includes four metal pillars 41 of the same height, four rotating discs 42, four sets of first screws and nuts 43, and four sets of second screws and nuts 44. The bottom of the metal pillar 41 can be moved by the rotating disc 42, the position of the metal pillar 41 is fixed by the first screw nut 43 at the center of the rotating disc 42, and the top of the metal pillar 41 is fixed by the second screw nut 44 on the surface position of the sample to be tested.
[0021] Four metal pillars 41 of the same height and made of high-strength materials are arranged around the heating module, and the bottoms of the four metal pillars 41 are respectively fixed on the four rotating disks 42 by welding or other methods, and four sets of first screw nuts 43 are respectively arranged at the center of the four rotating disks 42. The rotating disk 42 is fixed to the fixed base plate 1 by tightening the first screw nuts 43 or rotates around the first screw nuts 43 on the fixed base plate 1 by loosening the first screw nuts 43, so that the position of the metal pillars 41 can be fixed or moved by the first screw nuts 43. The top of the metal pillar 41 is fixed to the sample to be tested by the second screw nuts 44. The sample fixing module can also include four gaskets, which are respectively arranged between the four second screw nuts 44 and the sample to be tested to achieve effective fixed support for the sample to be tested. The sample fixing module can ensure that the position of samples of different shapes and sizes in the carrier is accurately fixed and horizontal, and can be reasonably configured according to the different needs of the samples to adapt to a variety of experimental scenarios.
[0022] In some embodiments, the height and angle of the metal support 41 can be adjusted by built-in springs and slots, allowing the user to quickly adjust the support according to experimental requirements to better adapt to samples of different shapes and sizes.
[0023] In some embodiments, the rotating disk 42 may be equipped with a precision electric drive device, allowing the user to precisely control the rotation angle of the rotating disk 42 through a remote control or a touch screen.
[0024] An embodiment of the present invention further provides a temperature imaging test method, which uses the above-mentioned carrying device to perform a temperature imaging test, including four steps: loading a sample to be tested, temperature calibration, temperature testing, and data processing.
[0025] In the step of loading the sample to be tested, the sample to be tested is fixed by the sample fixing module. According to the structure and size of the sample to be tested, the rotating disk 42 is adjusted to move the position of the metal pillar 41. The bottom of the four metal pillars 41 of the sample fixing module is moved by the rotating disk 42, and the position of the pillar is fixed by the first screw nut 43 at the center of the metal pillar 41. The top of the metal pillar 41 is fixed by the second screw nut 44 on the surface of the sample to be tested. Figure 5 shown.
[0026] In the temperature calibration step, a thin layer of thermal conductive silicone grease is evenly applied to the surface of the temperature control platform 3 to ensure good heat dissipation contact between the sample to be tested and the carrier device. The height of the lifting frame 2 is precisely adjusted by the knob on the fixed bottom plate 1, so that the temperature control platform 3 and the bottom of the sample to be tested fit closely. Figure 6 shown.
[0027] The temperature control platform 3 is temperature-controlled by an external liquid cooling system connected to the water inlet and outlet. The temperature platform is heated by the external liquid cooling system (no power is applied to the sample to be tested at this time), and then the sample to be tested is heated to one or more specific temperatures. The thermal imaging device obtains the infrared radiation characteristics or reflection characteristics of the test area under one or more specific temperature conditions.
[0028] In the temperature imaging test method of the embodiment of the present invention, the temperature imaging test includes an infrared imaging test and a reflectivity imaging test. In the case of the infrared imaging test, the temperature calibration step and the temperature testing step obtain the infrared radiation characteristics of the area to be tested, and in the case of the reflectivity imaging test, the reflection characteristics of the area to be tested to the light waves are obtained.
[0029] The temperature calibration process of the reflectivity imaging test (also known as the thermal reflectance calibration coefficient C th Taking the test process as an example, the thermal reflection calibration coefficient C is tested by testing the reflectivity of the two temperature points, high temperature H and low temperature L, under the incident light source. th , the calculation formula is as follows:
[0030] In the formula, and Divided into low temperature and high temperature, and are the reflectivity at low and high temperatures, respectively.
[0031] The specific implementation steps are as follows: Adjust the surface temperature of the temperature control platform 3 to When the temperature reaches a stable state, obtain the reflectivity of all positions in the test area. ; Adjust the surface temperature of the temperature control platform 3 to When the temperature reaches a stable state, obtain the reflectivity of all positions in the test area. ; Based on obtaining the reflectivity of all locations in the area to be tested and , combined with formula (1), the thermal reflection calibration coefficient C of all positions in the test area can be obtained th .
[0032] In the temperature test step, after the temperature calibration process is completed, the height of the lifting frame 2 is precisely adjusted by the knob to separate the temperature control platform 3 from the bottom of the sample to be tested, keeping the heat dissipation conditions closer to the actual working conditions, and then perform the temperature test. The positions of the four pillars of the sample fixing module remain fixed and unchanged, specifically restored to the following: Figure 5 shown.
[0033] It is the electrical signal required for the sample to be tested to load the work. After the temperature of the sample to be tested reaches stability, the thermal imaging device again obtains the infrared radiation characteristics of the area to be tested or the reflection characteristics of the light wave to complete the temperature test process.
[0034] Taking the temperature test process of reflectivity imaging test as an example, after the temperature control platform 3 and the bottom of the sample to be tested are separated by the lifting frame 2, the power is applied to put the sample to be tested in a working state. When the temperature reaches a stable state, the reflectivity of all positions in the test area is tested. .
[0035] In the analysis and processing step, by comparing and analyzing the infrared radiation characteristics or reflection characteristics of the area to be tested obtained in the temperature testing step with the infrared radiation characteristics or reflection characteristics of the area to be tested under one or more specific temperature conditions obtained in the temperature calibration step, the temperature value of the area to be tested is obtained and temperature imaging is performed.
[0036] Taking the reflectivity imaging test as an example, the temperature at different locations in the test area The specific calculation method is as follows:
[0037] Based on the thermal reflection calibration coefficient and reflectivity test results, the temperature at different positions of the sample to be tested can be obtained using formula (2): , and the temperature data can be combined to form a temperature distribution.
[0038] According to the carrying device and temperature imaging test method for temperature imaging test of the above-mentioned embodiment of the present invention, the carrying device has an adjustable heating module and a sample fixing module; during the temperature calibration process, the sample to be tested is kept fixed by the sample fixing module, and the heating module is adjusted to fit with the bottom of the sample to be tested to achieve sample heating; during the temperature test process, the heating module is adjusted to separate from the bottom of the sample to be tested, the heat dissipation conditions are kept closer to the actual working conditions, and the temperature test is performed, thereby effectively solving the problem that the heat dissipation conditions during the temperature test of the prior art solution are inconsistent with the actual working conditions, resulting in inaccurate temperature test results, greatly improving the accuracy of thermal imaging tests, and effectively supporting the thermal design work of electronic component products, electronic components and products in the field of integrated circuits, with huge economic and social benefits.
[0039] The above description is only by way of illustration of certain exemplary embodiments of the present invention. It is undoubted that those skilled in the art can modify the described embodiments in various ways without departing from the spirit and scope of the present invention. Therefore, the above drawings and descriptions are illustrative in nature and should not be construed as limiting the scope of protection of the claims of the present invention.
Claims
1. A carrying device for temperature imaging test, characterized in that: It includes a fixed bottom plate, a heating module and a sample fixing module, wherein the heating module and the sample fixing module are arranged on the fixed bottom plate, the heating module is used to provide the required temperature conditions for the sample to be tested, and the sample fixing module is used to support and fix the sample to be tested; The heating module includes a lifting frame and a temperature control platform arranged on the lifting frame. The lifting frame can be adjusted in height to drive the temperature control platform to be in close contact with or separated from the bottom of the sample to be tested fixed on the sample fixing module. The temperature control platform is used to transfer heat to the sample to be tested when in close contact with the bottom of the sample to be tested, so as to provide the required temperature conditions for the sample to be tested. The temperature control platform is externally connected to a liquid cooling system for controlling the temperature of the temperature control platform. The sample fixing module includes four metal pillars of the same height, four rotating disks, four groups of first screws and nuts, and four groups of second screws and nuts. The four metal pillars are arranged around the heating module. The bottoms of the four metal pillars are respectively fixed on the four rotating disks. The four groups of first screws and nuts are respectively arranged at the centers of the four rotating disks. The rotating disk can be fixed on the fixed bottom plate or rotate around the first screw nuts on the fixed bottom plate by the first screw nuts, so that the position of the metal pillars can be fixed or moved by the first screw nuts. The samples to be tested are fixed on the tops of the four metal pillars by the second screw nuts.
2. The carrying device according to claim 1, characterized in that: The lifting frame includes a base with slotted tracks, a loading platform with slotted tracks, a hydraulic rod, two fixed metal rods, and eight cross-support frames; The upper and lower parts of the hydraulic rod are respectively fixed on the base and the loading platform and connected to the cross support frame. The cross support frames are fixedly connected by pins and are respectively fixedly connected to the upper and lower fixed metal rods. The two fixed metal rods are respectively embedded in the slotted tracks of the base and the loading platform; the height adjustment of the lifting frame is achieved by the telescopic height of the hydraulic rod, the lifting angle of the cross support frame and the sliding of the metal fixed rod in the slotted track.
3. The carrying device according to claim 1 or 2, characterized in that: The sample fixing module also includes four gaskets, which are respectively arranged between the four second screw nuts and the sample to be tested.
4. A temperature imaging test method, characterized in that: The temperature imaging test is performed using the carrying device according to any one of claims 1 to 3, comprising: A sample loading step, using a sample fixing module to fix the surface position of the sample to be tested; Temperature calibration step: evenly apply a thin layer of thermal conductive silicone grease on the surface of the temperature control platform, adjust the height of the lifting frame so that the temperature control platform fits tightly with the bottom of the sample to be tested, heat the sample to be tested to one or more specific temperatures, and use thermal imaging equipment to obtain the infrared radiation characteristics or reflection characteristics of the test area of the sample to be tested under one or more specific temperature conditions; The temperature test step is to separate the temperature control platform from the bottom of the sample to be tested by adjusting the height of the lifting frame, load the electrical signal required for the sample to be tested, and use the thermal imaging device to obtain the infrared radiation characteristics of the area to be tested or the reflection characteristics of the light wave after the temperature of the sample to be tested reaches stability; The analysis and processing step is to obtain the temperature value of the area to be tested and perform temperature imaging by comparing and analyzing the infrared radiation characteristics or reflection characteristics of the light wave of the area to be tested obtained in the temperature testing step with the infrared radiation characteristics or reflection characteristics of the light wave of the area to be tested under one or more specific temperature conditions obtained in the temperature calibration step.
5. The temperature imaging test method according to claim 4, characterized in that: The temperature imaging test includes an infrared imaging test and a reflectivity imaging test. In the case of the infrared imaging test, the temperature calibration step and the temperature testing step obtain the infrared radiation characteristics of the area to be tested, and in the case of the reflectivity imaging test, the reflection characteristics of the area to be tested to light waves are obtained.
6. The temperature imaging test method according to claim 5, characterized in that: The temperature imaging test is a reflectivity imaging test; In the temperature calibration step, when no power is applied to the sample to be tested, the reflectivity of all positions in the test area at two temperature points, high and low, is tested respectively, and the thermal reflection calibration coefficient is calculated; In the temperature test step, power is applied to put the sample to be tested in a working state, and the reflectivity of all positions in the area to be tested is tested; In the analysis and processing step, based on the test results of the thermal reflection calibration coefficient and the reflectivity, the temperature at different positions of the sample to be tested is calculated, and the temperature data are combined to form a temperature distribution.