Semiconductor manufacturing apparatus and semiconductor device manufacturing method

Abstract

The purpose of the present invention is to provide a technique capable of reducing the man-hour for switching solder forming tools when multiple types of semiconductor devices are produced. The semiconductor manufacturing apparatus includes: a solder wire supply unit that supplies a solder wire onto a heated base material; a solder forming unit having a solder forming tool that forms the molten solder by being in contact with the solder line and the molten solder being in contact with the base material; a first drive mechanism that drives the solder wire supply unit so that the solder wire supply unit can move in the horizontal direction and the vertical direction; a second drive mechanism that drives the solder forming unit so that the solder forming unit can move in the horizontal direction and the vertical direction; and a control unit that controls the first drive mechanism and the second drive mechanism. The control unit controls the second drive mechanism such that the solder forming unit is moved in the horizontal direction after the solder forming tool is brought into contact with the molten solder. The invention also relates to a manufacturing method of the semiconductor device.

Description

Technical Field

[0001] The present invention relates to a semiconductor manufacturing device and a method for manufacturing a semiconductor device. Background Art

[0002] In the manufacture of semiconductor devices, a bonding material is supplied to a base material such as a substrate or a lead frame, and a semiconductor chip is mounted thereon to form a product. When a solder wire is used as the bonding material, the solder wire is melted by contacting the heated base material, and a semiconductor chip is mounted thereon.

[0003] In addition, in order to shape the molten solder into a desired shape, there is the following method:

[0004] That is, a solder forming tool designed in a predetermined shape is pressed from the upper surface of the molten solder to stir it. An example of this is described in Patent Document 1.

[0005] Patent Document 1: Japanese Patent Application Publication No. 2013-207246

[0006] However, the method described in Patent Document 1 requires switching the solder forming tool for each size of semiconductor chip. Therefore, when manufacturing semiconductor devices having semiconductor chips of multiple sizes, the solder forming tool switching operation is required, which is not suitable for high-mix production. Summary of the invention

[0007] Therefore, an object of the present invention is to provide a technology capable of reducing the man-hours required for switching solder forming tools when producing a wide variety of semiconductor devices.

[0008] The semiconductor manufacturing device according to the present invention comprises: a solder wire supply unit having a nozzle, which supplies the solder wire onto a heated base material; a solder forming unit having a solder forming tool, which contacts the molten solder when the solder wire contacts the base material to form the molten solder; a first driving mechanism, which drives the solder wire supply unit in a manner that enables it to move in the horizontal direction and the vertical direction; a second driving mechanism, which drives the solder forming unit in a manner that enables it to move in the horizontal direction and the vertical direction; and a control unit, which controls the first driving mechanism and the second driving mechanism, and the control unit controls the second driving mechanism so that after the solder forming tool contacts the molten solder, the solder forming unit is moved in the horizontal direction in this state.

[0009] Effects of the Invention

[0010] According to the present invention, solder forming of a plurality of sizes can be realized by using one type of solder forming tool, so that when producing a variety of semiconductor devices, the man-hours for switching the solder forming tool can be reduced. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 This is a front view of a portion of a semiconductor manufacturing apparatus for explaining a step of melting a solder wire in the embodiment.

[0012] Figure 2 This is a front view of a portion of a semiconductor manufacturing apparatus for explaining a step of shaping molten solder in the embodiment.

[0013] Figure 3 It is a perspective view showing a driving mechanism included in the semiconductor manufacturing apparatus according to the embodiment.

[0014] Figure 4 This is a plan view of a portion of a semiconductor manufacturing apparatus for explaining a step of shaping molten solder in the embodiment.

[0015] Figure 5 This is a plan view of a portion of a semiconductor manufacturing apparatus for explaining a step of shaping molten solder in the embodiment.

[0016] Figure 6 This is a front view of a portion of a semiconductor manufacturing apparatus for explaining a step of shaping molten solder in Modification 1 of the embodiment.

[0017] Figure 7 This is a plan view of a portion of a semiconductor manufacturing apparatus for explaining a step of shaping molten solder in Modification 2 of the embodiment.

[0018] Figure 8 This is a plan view of a portion of a semiconductor manufacturing apparatus for explaining a step of shaping molten solder in Modification 3 of the embodiment.

[0019] Fig. 9 This is a front view of a semiconductor manufacturing apparatus for explaining a step of shaping molten solder in Modification 4 of the embodiment. DETAILED DESCRIPTION

[0020] <Implementation Method>

[0021] Hereinafter, the embodiments will be described using the drawings. Figure 1 This is a front view of a portion of a semiconductor manufacturing apparatus for explaining a step of melting the solder wire 1 in the embodiment. Figure 2This is a front view of a portion of a semiconductor manufacturing apparatus for explaining a step of shaping molten solder 1 a in the embodiment.

[0022] exist Figure 1 In the figure, the X direction, the Y direction, and the Z direction are orthogonal to each other. The X direction, the Y direction, and the Z direction shown in the following drawings are also orthogonal to each other. Hereinafter, the direction including the X direction and the opposite direction of the X direction, that is, the -X direction, will be referred to as the "X-axis direction". In addition, the direction including the Y direction and the opposite direction of the Y direction, that is, the -Y direction, will be referred to as the "Y-axis direction". In addition, the direction including the Z direction and the opposite direction of the Z direction, that is, the -Z direction, will be referred to as the "Z-axis direction".

[0023] Figure 1 The structure for carrying out a part of the process performed by the semiconductor manufacturing apparatus, that is, the process of melting the solder wire 1 is shown. Figure 2 The structure for implementing the remaining part of the process performed by the semiconductor manufacturing apparatus, that is, the process of shaping the molten solder 1a is shown. Therefore, the overall structure of the semiconductor manufacturing apparatus is Figure 1 The structure shown and Figure 2 Combination of structures shown.

[0024] like Figure 1 and Figure 2 As shown, the semiconductor manufacturing apparatus includes a solder wire supply unit 2 , a solder forming unit 5 , a first drive mechanism 10 , a second drive mechanism 20 , and a control unit 30 .

[0025] First of all, Figure 1 The structure shown is explained. Figure 1 As shown, the solder wire supply unit 2 has a nozzle 2b and a driving portion 2a.

[0026] The nozzle 2b supplies the solder wire 1 onto the base material 3 disposed on the upper surface of the heater 4. The base material 3 is a part of the components constituting the semiconductor device, i.e., a substrate or a lead frame. The driving unit 2a includes, for example, a reel (not shown) on which the solder wire 1 is wound, a roller (not shown), and a motor (not shown). The roller is rotated by the motor to draw out the solder wire 1 from the nozzle 2b. The solder wire 1 drawn out from the nozzle 2b is brought into contact with the base material heated by the heater 4, so that the solder wire 1 is melted to form molten solder 1a.

[0027] The first driving mechanism 10 is connected to the driving portion 2a of the solder wire supply unit 2 to drive the solder wire supply unit 2 so as to be movable in the horizontal direction (X-axis direction and Y-axis direction) and the vertical direction (Z-axis direction).

[0028] Next, Figure 2 The structure shown is explained. Figure 2 As shown, the solder forming unit 5 has a solder forming tool 6, a mounting portion 5a, a heater 5b, and a driving portion 5c.

[0029] The solder forming tool 6 extends in the vertical direction (Z-axis direction), has a rectangular shape when viewed from above, and is mounted on the lower end (-Z-direction end) of the mounting portion 5a. The front end side (-Z-direction) of the solder forming tool 6 is brought into contact with the molten solder 1a to form the molten solder 1a. The heater 5b is provided on the mounting portion 5a, and heats the solder forming tool 6 via the mounting portion 5a. The driving portion 5c has a motor (not shown) and the like, and adjusts the protrusion amount of the solder forming tool 6 from the mounting portion 5a, and operates and stops the heater 5b.

[0030] The second driving mechanism 20 is connected to the driving portion 5 c of the solder forming unit 5 to drive the solder forming unit 5 so as to be movable in the horizontal direction (X-axis direction and Y-axis direction) and the vertical direction (Z-axis direction).

[0031] The control unit 30 includes a processor such as a CPU (Central Processing Unit) (not shown). The control unit 30 controls the first drive mechanism 10 and the second drive mechanism 20 based on a control program related to the process of melting the solder wire 1 and the process of forming the molten solder 1a stored in its own memory. A plurality of control programs are prepared in accordance with the product, and the operator selects a control program to move the solder wire supply unit 2 and the solder forming unit 5 to a specified position.

[0032] Furthermore, the control unit 30 controls the driving unit 2a of the solder wire supply unit 2 and the driving unit 5c of the solder forming unit 5 based on a control program related to the process of melting the solder wire 1 and the process of shaping the molten solder 1a.

[0033] Next, the first driving mechanism 10 will be described. Figure 3 1 is a perspective view showing a drive mechanism of the semiconductor manufacturing apparatus according to the embodiment. The first drive mechanism 10 and the second drive mechanism 20 have the same structure, and therefore only the first drive mechanism 10 will be described here.

[0034] like Figure 3 As shown, the first drive mechanism 10 is a direct-acting mechanism having a ball screw 10a, a linear guide 10b and a motor 10c, and the ball screw 10a is installed on the driving part 2a of the solder wire supply unit 2. As the direct-acting mechanism is a known technology, a detailed description is omitted. In addition, the direct-acting mechanism may also have an actuator and a timing belt to replace the above-mentioned structure.

[0035] Next, the process of melting the solder wire 1 and the process of shaping the molten solder 1 a will be described.

[0036] First, if Figure 1 As shown, the control unit 30 moves the solder wire supply unit 2 downward (-Z direction) to bring the solder wire 1 supplied from the nozzle 2b of the solder wire supply unit 2 into contact with the base material 3 heated by the heater 4. As a result, the solder wire 1 melts to form hemispherical molten solder 1a.

[0037] Next, if Figure 2 As shown in FIG. 1 , the control unit 30 moves the solder forming unit 5 in the horizontal direction (X direction) so that the solder forming tool 6 of the solder forming unit 5 contacts the molten solder 1a, and then moves the solder forming unit 5 in the horizontal direction (X direction) while the solder forming tool 6 contacts the molten solder 1a. As a result, the molten solder 1a is formed into a plate shape. Figure 2 In the figure, reference numeral 1b is the solder after forming.

[0038] Next, use Figure 4 and Figure 5 A method of adjusting the molten solder 1 a to a size corresponding to semiconductor chips of a plurality of sizes will be described. Figure 4 and Figure 5 1 is a top view of a portion of a semiconductor manufacturing apparatus for explaining a process of shaping molten solder 1a in the embodiment. Specifically, Figure 4 1 is a diagram showing a situation where the solder forming unit 5 is moved in the X direction. Figure 5 2 is a diagram showing a situation where the solder forming unit 5 is moved in the Y direction. Figure 4 and Figure 5 The figure shows the view from the solder forming tool 6 toward the lower side (-Z direction).

[0039] When manufacturing a semiconductor device having semiconductor chips of various sizes, it is necessary to make the molten solder 1a into sizes corresponding to the semiconductor chips of various sizes. By adjusting the size of the solder forming tool 6, the moving starting point, and the moving amount in the horizontal direction (X-axis direction and Y-axis direction), the molten solder 1a can be formed into sizes corresponding to the semiconductor chips of various sizes. Figure 4 When the dimension A shown in FIG. 1 is a standard, the movement amount of the solder forming tool 6 in the X direction is adjusted to be larger than that in the case of the dimension A as in the case of the dimension B, thereby adjusting the dimension of the molten solder 1a in the X direction. Figure 5As in the case of the dimension C shown in the figure, by changing the movement start point of the solder forming tool 6 of the dimension A and adjusting the movement amount in the Y direction, the dimension of the molten solder 1a in the Y direction can be adjusted.

[0040] In addition, Figure 4 and Figure 5 In the figure, the case where the solder forming tool 6 is moved in the X direction and the Y direction is shown as an example, so the dimensions in both the X direction and the Y direction need to be considered for the solder forming tool 6. Therefore, the thickness of the solder forming tool 6 becomes thicker, but when the solder forming tool 6 is moved in only one direction of the X direction or the Y direction, the thickness of the solder forming tool 6 can be made thinner.

[0041] Although not shown, by adjusting the gap between the solder forming tool 6 and the base material 3 , the thickness of the molten solder 1 a can be adjusted.

[0042] As described above, the semiconductor manufacturing apparatus according to the embodiment includes: a solder wire supply unit 2 having a nozzle 2b that supplies a solder wire 1 onto a heated base material 3; a solder forming unit 5 having a solder forming tool 6 that contacts the solder 1a melted by the solder wire 1 contacting the base material 3, thereby forming the melted solder 1a; a first drive mechanism 10 that drives the solder wire supply unit 2 so as to be movable in the horizontal direction (X-axis direction and Y-axis direction) and the vertical direction (Z-axis direction); a second drive mechanism 20 that drives the solder forming unit 5 so as to be movable in the horizontal direction (X-axis direction and Y-axis direction) and the vertical direction (Z-axis direction); and a control unit 30 that controls the first drive mechanism 10 and the second drive mechanism 20. The control unit 30 controls the second drive mechanism 20 so as to move the solder forming unit 5 in the horizontal direction in this state after the solder forming tool 6 contacts the melted solder 1a.

[0043] Therefore, solder forming of a plurality of sizes can be realized by one type of solder forming tool 6 , so that when a variety of semiconductor devices are produced, the number of steps for switching the solder forming tool 6 can be reduced.

[0044] <Modification of Implementation>

[0045] Next, modifications of the embodiment will be described. Figure 6 This is a front view of a portion of a semiconductor manufacturing apparatus for explaining a step of shaping molten solder 1 a in Modification 1 of the embodiment. Figure 7This is a plan view of a portion of a semiconductor manufacturing apparatus for explaining a step of shaping molten solder 1 a in Modification 2 of the embodiment. Figure 8 This is a plan view of a portion of a semiconductor manufacturing apparatus for explaining a step of shaping molten solder 1 a in Modification 3 of the embodiment. Fig. 9 This is a front view of a semiconductor manufacturing apparatus for explaining a process of shaping molten solder 1a in Modification 4 of the embodiment. Figure 7 and Figure 8 The figure shows the view from the solder forming tool 8 toward the lower side (-Z direction).

[0046] like Figure 6 As shown, the solder forming unit 5 may also include a solder forming tool 7 instead of the solder forming tool 6. The portion of the solder forming tool 7 that contacts the molten solder 1a is formed in a tapered shape. More specifically, the entire portion of the solder forming tool 7 in the X direction is formed in a tapered shape. As a result, the flow of the molten solder 1a can be promoted, so the molten solder 1a can be formed more stably.

[0047] In addition, if Figure 7 As shown, the solder forming unit 5 may also include a solder forming tool 8 instead of the solder forming tool 6. A notch 8a is provided at a portion of the solder forming tool 8 that contacts the molten solder 1a. More specifically, two notches 8a are provided along the Y-axis direction at a portion in the X-direction of the solder forming tool 8. Thus, the flow path of the molten solder 1a can be dispersed, so that the molten solder 1a can be formed into more various shapes.

[0048] In addition, if Figure 8 As shown in FIG. 1 , a protrusion 9 may be provided on the outer periphery of the portion of the solder forming tool 8 that contacts the molten solder 1a. More specifically, two protrusions 9 are provided to protrude in the X direction from two outer peripheries of the portion in the X direction of the solder forming tool 8. Thus, it is possible to suppress the molten solder 1a from overflowing from the solder forming tool 8. Figure 8 In the example in which two protrusions 9 are provided on the solder forming tool 8, two protrusions 9 may be provided on the solder forming tool 6 or the solder forming tool 7. In this case, the same Figure 8 The same effect as the situation.

[0049] In addition, the control unit 30 may control the first driving mechanism 10 and the second driving mechanism 20 so that the solder wire supply unit 2 and the solder forming unit 5 move simultaneously and in the same direction. Fig. 9As shown, the solder wire supply unit 2 and the solder forming unit 5 may be integrated, and the second drive mechanism 20 may drive the solder wire supply unit 2 and the solder forming unit 5. Thus, compared with the case where the solder wire supply unit 2 and the solder forming unit 5 are controlled separately, the control becomes simpler, and by setting the drive mechanism as one, the miniaturization of the semiconductor manufacturing apparatus can be achieved. Fig. 9 , an example in which the solder forming unit 5 has a solder forming tool 6 is shown, but the solder forming unit 5 may also have a solder forming tool 7 or a solder forming tool 8, and two protrusions 9 may be provided on the solder forming tool 6, the solder forming tool 7 or the solder forming tool 8.

[0050] In addition, the embodiments can be modified or omitted as appropriate.

[0051] Various aspects of the present invention are summarized and described below as an appendix.

[0052] (Appendix 1)

[0053] A semiconductor manufacturing device comprising:

[0054] A solder wire supply unit having a nozzle for supplying the solder wire onto the heated base material;

[0055] a solder forming unit having a solder forming tool which contacts the solder melted by the solder wire contacting the base material to form the melted solder;

[0056] a first driving mechanism that drives the solder wire supply unit so as to be movable in the horizontal direction and the vertical direction;

[0057] a second driving mechanism that drives the solder forming unit so as to be movable in the horizontal direction and the vertical direction; and

[0058] a control unit that controls the first drive mechanism and the second drive mechanism,

[0059] The control unit controls the second driving mechanism so as to move the solder forming unit in the horizontal direction in the state after the solder forming tool is brought into contact with the molten solder.

[0060] (Appendix 2)

[0061] The semiconductor manufacturing apparatus according to Appendix 1, wherein:

[0062] The control unit controls the first driving mechanism and the second driving mechanism so that the solder wire supply unit and the solder forming unit move simultaneously and in the same direction.

[0063] (Appendix 3)

[0064] The semiconductor manufacturing apparatus according to Appendix 1 or 2, wherein:

[0065] A portion of the solder forming tool that comes into contact with the molten solder is formed in a tapered shape.

[0066] (Appendix 4)

[0067] The semiconductor manufacturing apparatus according to Appendix 1 or 2, wherein:

[0068] A portion of the solder forming tool that comes into contact with the molten solder is provided with a notch.

[0069] (Appendix 5)

[0070] A semiconductor manufacturing device according to any one of Appendix 1 to Appendix 4, wherein:

[0071] A projection is provided on the outer periphery of a portion of the solder forming tool that comes into contact with the molten solder.

[0072] (Appendix 6)

[0073] A method for manufacturing a semiconductor device comprises the following steps:

[0074] bringing the solder wire supplied from the nozzle of the solder wire supply unit into contact with the heated base material to form molten solder; and

[0075] After a solder forming tool of a solder forming unit is brought into contact with the molten solder, the solder forming unit is moved in a horizontal direction in this state.

[0076] Description of the label

[0077] 1 solder wire, 1a molten solder, 2 solder wire supply unit, 2b nozzle, 3 base material, 5 solder forming unit, 6, 7, 8 solder forming tool, 8a incision, 9 protrusion, 10 first drive mechanism, 20 second drive mechanism, 30 control unit.

Claims

1. A semiconductor manufacturing device comprising: A solder wire supply unit having a nozzle for supplying the solder wire onto the heated base material; a solder forming unit having a solder forming tool which contacts the solder melted by the solder wire contacting the base material to form the melted solder; a first driving mechanism that drives the solder wire supply unit so as to be movable in the horizontal direction and the vertical direction; a second driving mechanism that drives the solder forming unit so as to be movable in the horizontal direction and the vertical direction; as well as a control unit that controls the first drive mechanism and the second drive mechanism, The control unit controls the second driving mechanism so as to move the solder forming unit in the horizontal direction in the state after the solder forming tool is brought into contact with the molten solder.

2. The semiconductor manufacturing apparatus according to claim 1, wherein: The control unit controls the first driving mechanism and the second driving mechanism so that the solder wire supply unit and the solder forming unit move simultaneously and in the same direction.

3. The semiconductor manufacturing apparatus according to claim 1 or 2, wherein: A portion of the solder forming tool that comes into contact with the molten solder is formed in a tapered shape.

4. The semiconductor manufacturing apparatus according to claim 1 or 2, wherein: A portion of the solder forming tool that comes into contact with the molten solder is provided with a notch.

5. The semiconductor manufacturing apparatus according to any one of claims 1 to 4, wherein: A projection is provided on the outer periphery of a portion of the solder forming tool that comes into contact with the molten solder.

6. A method for manufacturing a semiconductor device, comprising the following steps: bringing the solder wire supplied from the nozzle of the solder wire supply unit into contact with the heated base material to form molten solder; and After a solder forming tool of a solder forming unit is brought into contact with the molten solder, the solder forming unit is moved in a horizontal direction in this state.

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