Cooling device and manufacturing method for a battery pack

Abstract

The present invention discloses a cooling device for a battery pack and a manufacturing method, belonging to the field of battery packs. First, mechanical force is applied to the liquid cooling pipe to make it have a certain shape, a heat-conducting adhesive layer is coated on its surface, and then the lightweight composite material is pressed and formed and cut into several substrate structures. Then, adopting the idea of "splicing and forming", after connecting the substrate structure with the liquid cooling pipe, the temperature equalizing layer, the upper substrate and the lower substrate are laid, and glue is injected or mechanically fastened. Then, through the thermal interface material, it is assembled and applied with the battery pack. The cooling device prepared by this method has the characteristics of light weight and high heat dissipation efficiency.

Description

Technical Field

[0001] The present invention belongs to the field of battery packs and relates to a cooling device and manufacturing method for a battery pack. Background Art

[0002] In the heat dissipation systems of modern electronic devices, liquid cooling technology has become an important heat dissipation solution due to its excellent thermal management performance. Liquid cooling plates are widely used in battery pack heat dissipation.

[0003] Traditional battery pack liquid cooling plates are mostly made of metal materials such as aluminum alloy and copper alloy through machining or welding. Although these metal materials have high thermal conductivity and can provide good heat dissipation performance, they are heavy in weight, and the manufacturing process is usually complex. Especially when it comes to welding, machining and other processes, it often requires high process difficulty and cost.

[0004] With the development of electric vehicles, there is an expectation for an efficient and lightweight thermal management system. As an emerging battery pack heat dissipation solution, lightweight liquid cooling plates can meet the lightweight requirements. By adopting advanced materials and processes, lightweight liquid cooling plates can not only provide excellent thermal management performance, but also significantly reduce the weight of the overall device, improving the operation efficiency and reliability of the device. With the continuous development of technology, lightweight liquid cooling plates will play an increasingly important role in future high-performance heat dissipation systems.

[0005] The present invention uses a lightweight thermally conductive composite material to make the matrix structure. The liquid cooling plate produced has a smaller density compared to traditional battery pack metal liquid cooling plates. Moreover, the present invention also lays a temperature equalizing layer, enabling heat to be transferred more evenly inside the liquid cooling plate, with higher heat dissipation efficiency. The present invention provides a manufacturing method for a liquid cooling plate for a battery pack that can be made lightweight, ultra-thin, and have a large heat dissipation area. The method provided by the present invention also has the characteristics of simple process, low cost, energy saving, safety, etc. Summary of the Invention

[0006] The technical problem to be solved by the present invention is to overcome the deficiencies of the prior art. By using a thermally conductive composite material to make the matrix structure and laying a temperature equalizing layer to achieve better temperature equalizing effect, a liquid cooling plate for a battery pack that is lightweight, ultra-thin, and can dissipate heat over a large area is realized.

[0007] The present invention provides a cooling device and manufacturing method for a battery pack. The detailed manufacturing steps are as follows:

[0008] 1. A manufacturing method for a cooling device of a battery pack, characterized in that the main component structure includes: an upper substrate, a temperature equalizing layer, a thermally conductive structure layer, a matrix structure, a liquid cooling tube, a thermally conductive bonding layer, a lower substrate, and a fastening structure. The manufacturing steps include:

[0009] S01, forming the liquid cooling tube: applying mechanical force to the liquid cooling tube to make it deformed to obtain the liquid cooling tube;

[0010] S02, Preparation of composite material: Through a composite process, a heat-conducting material and a resin material are prepared into a heat-conducting composite material;

[0011] S03, Compression molding: The heat-conducting composite material prepared in step S02 is placed in a mold and pressed to obtain a matrix-shaped material;

[0012] S04, Matrix structure preparation: The matrix-shaped material obtained in S03 is cut into several matrix structures according to the design;

[0013] S05, Assembly molding: A heat-conducting adhesive layer is coated on the surface of the liquid-cooling tube, and the matrix structure prepared in S04 is connected to the liquid-cooling tube;

[0014] S06, Isothermal layer laying: A single-sided composite heat-conducting structure layer of an isothermal layer with a transverse thermal conductivity greater than 200 W / (m·K) and a thickness less than 2 mm is used. The isothermal layer contains one or more of metal, silicon carbide, diamond, carbon nanotubes, graphene, graphite nanosheets, graphite, carbon fiber, and ceramic fiber. Then it is laid on the upper and lower surfaces of the structure obtained in S05. When laying, the heat-conducting structure layer side faces the structure obtained in S05;

[0015] S07, Upper and lower substrate laying: The upper substrate and the lower substrate are single-sided composite heat-conducting structure layers, and then they are respectively laid on the upper and lower surfaces of the structure obtained in S06. When laying, the heat-conducting structure layer side faces the structure obtained in S06;

[0016] S08, Pressing: The structure obtained in S07 is placed in a press and hot-pressed to obtain a liquid-cooling plate blank;

[0017] S09, Drilling and fixing: Drilling is carried out on the liquid-cooling plate blank obtained in S08, and a fastening structure is formed by injecting glue or mechanical fastening;

[0018] S10, Shape processing: Cutting and processing the liquid-cooling plate blank to obtain a cooling device for a battery pack;

[0019] S11, Battery pack installation: The structure obtained in S10 is combined and installed with the battery pack through a thermal interface material and applied.

[0020] Further, it is characterized in that the shape of the liquid-cooling tube after mechanical deformation in the S01 step is one or more of S-shaped, W-shaped, fishbone-shaped, straight-shaped, hexagon-shaped, and polygon-shaped; the outer contour shape of the liquid-cooling tube is one or more of rectangular, oval, circular, and polygon-shaped; the wall thickness of the liquid-cooling tube is 0.01 - 6 mm; the maximum outer diameter range of the liquid-cooling tube is 0.1 - 100 mm; the liquid-cooling tube in the S01 step contains one or more of metal, oxide, silicon, boron nitride, aluminum nitride, silicon nitride, silicon carbide, diamond, carbon nanotube, graphene, graphite nanosheet, graphite, glass fiber, carbon fiber, quartz fiber, and ceramic fiber, and the thermal conductivity in the direction perpendicular to the tube wall is greater than 0.5 W / (m·K).

[0021] Further, it is characterized in that the heat-conducting material in the S02 step contains one or more of graphite, graphene, carbon nanotube, graphite nanosheet, carbon fiber, metal, and ceramic; the content of the heat-conducting material in the prepared composite material is 30 wt.% - 95 wt.%; the resin material in the S02 step is one or more of epoxy resin, polyurethane, acrylic resin, polyamide resin, phenolic resin, polyvinyl chloride, polyethylene, polypropylene, polystyrene, polyoxymethylene, polyphenylene ether, polyester resin, polyphenylene sulfide, polyether ether ketone, acrylonitrile-butadiene-styrene copolymer, polymethyl methacrylate, polylactic acid, polybutylene succinate, ethylene-vinyl acetate copolymer, polycarbonate, silicone resin, fluorosilicone resin, polyimide, and bismaleimide; the composite process is one or more of mixing and stirring, surface coating, and lamination.

[0022] Further, it is characterized in that the pressure range in the S03 step is 0.1 - 10 MPa, the temperature range is 50 - 220 °C; the thickness range of the matrix profile obtained in the S03 step is 0.5 - 8 mm, the transverse thermal conductivity of the profile is greater than 30 W / (m·K), and the longitudinal thermal conductivity is greater than 3 W / (m·K).

[0023] Further, it is characterized in that the cutting method in the S04 step is one or more of laser cutting, wire saw cutting, plasma cutting, water jet cutting, and mechanical cutting.

[0024] Further, it is characterized in that the thermal conductivity of the heat-conducting adhesive layer in the S05 step is 0.5 - 50 W / (m·K); the heat-conducting adhesive layer contains a resin matrix and heat-conducting fillers, the resin matrix includes one or more of epoxy resin, polyurethane, acrylic resin, silicone resin, fluorosilicone resin, bismaleimide, and phenolic resin, and the heat-conducting fillers include one or more of silicon dioxide, aluminum oxide, magnesium oxide, zinc oxide, silicon, boron nitride, aluminum nitride, silicon nitride, silicon carbide, diamond, carbon nanotube, graphene, graphite nanosheet, graphite, and metal particles, and the particle size range of the heat-conducting fillers is 0.01 - 200 μm.

[0025] Further, it is characterized in that the thermal conductivity of the thermal conductive structure layer in the steps S06 and S07 is 0.5 to 100 W / (m·K). The thermal conductive structure layer contains a resin matrix and thermal conductive fillers. The resin matrix includes one or more of epoxy resin, polyurethane, acrylic resin, polyamide resin, phenolic resin, polyvinyl chloride, polyethylene, polypropylene, polystyrene, polyoxymethylene, polyphenylene ether, polyester resin, polyphenylene sulfide, polyether ether ketone, acrylonitrile-butadiene-styrene copolymer, polymethyl methacrylate, polylactic acid, polybutylene succinate, ethylene-vinyl acetate copolymer, polycarbonate, silicone resin, fluorosilicone resin, polyimide, and bismaleimide. The thermal conductive fillers include one or more of silica, alumina, magnesia, zinc oxide, silicon, boron nitride, aluminum nitride, silicon nitride, silicon carbide, diamond, carbon nanotubes, graphene, graphite nanosheets, graphite, and metal particles. The particle size range of the thermal conductive fillers is 0.01 to 200 μm.

[0026] Further, it is characterized in that the thermal conductivity of the upper substrate and the lower substrate in the step S07 is 1 to 1500 W / (m·K). The upper substrate and the lower substrate in the step S07 contain one or more of metal, silicon, boron nitride, aluminum nitride, silicon nitride, silicon carbide, diamond, carbon nanotubes, graphene, graphite nanosheets, graphite, glass fiber, carbon fiber, quartz fiber, and ceramic fiber, and the thickness range is 0.01 mm to 12 mm.

[0027] Further, it is characterized in that in the step S08, the hot pressing temperature is 10 to 300 °C, the pressure is 0.1 to 10 MPa, and the time is 1 to 48 h.

[0028] A cooling device for a battery pack is characterized in that the cooling device is prepared by the method of any one of the above, and its density is less than 2.5 g / cm 3 , the thickness range is 1 to 100 mm, and it has the function of liquid cooling and heat dissipation for the battery pack. Table 1 is a comparison table of the present invention and a common liquid cooling plate for a battery pack. Compared with the prior art, the advantages of the present invention are as follows:

[0029] (1) The cooling device prepared by this method uses a thermally conductive composite material to make the matrix structure, has a small density, and has a good weight reduction effect;

[0030] (2) The cooling device prepared by this method has a temperature equalizing layer inside, and the temperature equalizing effect is better;

[0031] (3) In addition to making the above cooling device, the method provided by the present invention also has the characteristics of simple process and low cost.

[0032] Table 1 Comparison table of the present invention and a common liquid cooling plate for a battery pack

[0033] Brief Description of the Drawings

[0034] Appendix Figure 1 is the overall manufacturing flowchart of the present invention.

[0035] Appendix Figure 2 is the exploded view of the structure of the present invention (excluding the heat-conducting adhesive layer).

[0036] Appendix Figure 3 is the schematic plan view of the present invention in the application scenario, and the lower right corner is a partial enlarged view.

[0037] Appendix Figure 4 is the three-dimensional structure schematic diagram of the present invention in the application scenario.

[0038] Appendix Figure 5 is the structure dimension diagram of the embodiment part (unit: mm). Detailed Description of the Preferred Embodiments

[0039] In the following description, only some exemplary embodiments are simply described. As those skilled in the art can recognize, the described embodiments can be modified in various different ways without departing from the spirit or scope of the present invention. Therefore, the drawings and the description are considered to be exemplary in nature rather than restrictive.

[0040] The following describes the preferred embodiments of the present invention with reference to the accompanying drawings. It should be understood that the preferred embodiments described herein are only for the purpose of illustrating and explaining the present invention, and are not used to limit the present invention.

[0041] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings. They are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation of the present invention. In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of the described features. In the description of the present invention, "a plurality" means two or more, unless otherwise specifically defined.

[0042] The following disclosure provides many different embodiments or examples for implementing the present invention. To simplify the disclosure of the present invention, specific examples are described below. Of course, they are only examples and are not intended to limit the present invention. In addition, the present invention may repeat reference numerals and / or reference letters in different examples. Such repetition is for the purpose of simplification and clarity, and does not itself indicate the relationship between the various embodiments and / or arrangements discussed. In addition, the present invention provides examples of various specific processes and materials, but those of ordinary skill in the art can realize the application of other processes and / or the use of other materials.

[0043] Embodiment

[0044] The described embodiment specifically elaborates on the application of a cooling device for a battery pack and its manufacturing method in battery heat dissipation.

[0045] Refer to the attached Figure 2 With the attached Figure 3 , the cooling device of the battery pack to be manufactured mainly includes the following parts: upper substrate 101, temperature equalizing layer 102, heat conduction structure layer 103, matrix structure 104, liquid cooling pipe 105, heat conduction adhesive layer 106, lower substrate 107, fastening structure 108. In the attached Figure 3 With the attached Figure 4 In the application scenario, there are also thermal interface material 109 and battery pack 110;

[0046] S01, Liquid cooling pipe forming: The liquid cooling pipe 105 is shaped by mechanical force and bent into an S shape. The outer contour is circular, the wall thickness is 0.25 mm, and the outer diameter is 1.5 mm. The liquid cooling pipe is made of aluminum alloy, and its thermal conductivity in the direction perpendicular to the pipe wall is 170 W / (m·K).

[0047] S02, Preparation of composite material: Epoxy resin is coated on the surface of the perforated graphite film. The graphite film content is 90 wt.%, and the resin matrix content is 9.9 wt.%, to obtain a heat-conducting composite material.

[0048] S03, Compression molding: The heat-conducting composite material prepared in step S02 is placed in a mold and kept under pressure at 150 °C and 0.3 MPa for 10 h to obtain a matrix-shaped material with a thickness of 1.5 mm. The transverse thermal conductivity of the prepared matrix-shaped material is 720 W / (m·K), and the longitudinal thermal conductivity is 3.5 W / (m·K).

[0049] S04, Matrix structure preparation: According to the shape of the S-shaped liquid cooling pipe 105, the matrix-shaped material prepared in step S03 is cut into structural blocks of a matching shape using a wire saw. Its thickness is 1.5 mm, and the edges are serrated. For specific dimensions, refer to the attached Figure 5 (unit: mm).

[0050] S05, Assembly Molding: Uniformly coat a heat-conducting adhesive layer 106 on the surface of the liquid-cooling tube 105. The heat-conducting adhesive layer 106 is composed of a silicone resin matrix and diamond fillers. The D50 of the diamond fillers is 5.2 μm, and the thermal conductivity of the heat-conducting adhesive layer is 13 W / (m·K). Bond and fix the cut substrate structure 104 to the liquid-cooling tube 105.

[0051] S06, Isothermal Layer Laying: The isothermal layer 102 is a pyrolytic graphite film with a transverse thermal conductivity of 1200 W / (m·K) and a thickness of 0.1 mm. Single-side composite two pieces of the isothermal layer 102 with the heat-conducting structure layer 103 respectively, and then lay them on the upper surface and the lower surface of the structure obtained in S05 respectively;

[0052] S07, Upper and Lower Substrate Laying: The upper substrate 101 and the lower substrate 107 are both made of high-purity oxygen-free copper, with a thickness of 0.25 mm and a thermal conductivity of 390 W / (m·K). Single-side composite the upper substrate 101 and the lower substrate 107 with the heat-conducting structure layer 103 respectively. The heat-conducting structure layer 103 is composed of an epoxy resin matrix and diamond fillers. The D50 of the diamond fillers is 12.8 μm, and the thermal conductivity of the heat-conducting structure layer 103 is 15 W / (m·K). Lay the composite upper and lower substrates on the upper surface and the lower surface of the structure obtained in step S06 respectively;

[0053] S08, Pressing: Place the structure obtained in step S07 in a press and press it under the conditions of 160 °C and 0.5 MPa, with a holding pressure time of 8 hours to obtain a liquid-cooling plate blank with a thickness of 2.2 mm;

[0054] S09, Drilling and Fixing: Use a CNC device to drill holes at the specified positions on the liquid-cooling plate blank, with a hole diameter of 1.5 mm. Use polyurethane resin for potting. The drilling positions are shown in the appendix Figure 5 (unit: mm);

[0055] S10, Shape Processing: Use a precision cutting device to trim the liquid-cooling plate blank to obtain a cooling device with a density of 2.1 g / cm 3 , with a thickness of 2.2 mm;

[0056] S11, Battery Pack Installation: Combine and install the structure obtained in S10 with the battery pack 110 through the thermal interface material 109 and apply it, as Figure 4 shown. The thermal interface material used is a thermal conductive adhesive with a thermal conductivity of 3 W / (m·K). Install the battery pack on the other side of the thermal conductive adhesive. The battery pack used is a lithium-ion battery.

[0057] The heat generated during the charge and discharge of the battery pack is transferred to the liquid cooling plate through the thermal interface material. The upper and lower substrates and the temperature equalizing layer in the liquid cooling plate have very high thermal conductivities, which can evenly distribute the heat in the plane direction and reduce the temperature difference at each position of the battery pack. Subsequently, the heat is transferred to the liquid cooling tube and then carried away by the medium in the liquid cooling tube. The matrix is composed of a thermally conductive composite material with a relatively high thermal conductivity and can also play a role in heat conduction. The system formed in this way has a small thermal resistance, a high heat transfer efficiency, and obvious advantages in lightweight and thinness.

[0058] Although the present invention has been described with reference to exemplary embodiments, it should be understood that the terms used are illustrative and exemplary, rather than restrictive. Since the present invention can be embodied in many forms without departing from the spirit or essence of the invention, it should be understood that the above embodiments are not limited to any of the foregoing details, but should be broadly construed within the spirit and scope defined by the appended claims. Therefore, all variations and modifications falling within the scope of the claims or their equivalents should be covered by the appended claims.

Claims

1. A method for manufacturing a cooling device for a battery pack, characterized in that: The main components include: upper substrate, temperature balancing layer, heat conductive structure layer, base structure, liquid cooling tube, heat conductive adhesive layer, lower substrate, fastening structure, and the manufacturing steps include: S01, liquid cooling tube forming: applying mechanical force to the liquid cooling tube to deform it, thereby obtaining the liquid cooling tube; S02, preparing a composite material: preparing a thermally conductive composite material from a thermally conductive material and a resin material through a composite process; S03, pressing and molding: placing the thermally conductive composite material prepared in step S02 in a mold and pressing it to obtain a base profile; S04, preparation of the matrix structure: cutting the matrix profile obtained in S03 into a plurality of matrix structures using a mechanical cutting process according to the design; S05, splicing molding: coating a thermally conductive adhesive layer on the surface of the liquid cooling tube, connecting the base structure prepared in S04 with the liquid cooling tube, the thermal conductivity of the thermally conductive adhesive layer is 0.5-50W / (m·K), and it contains a resin matrix and a thermally conductive filler, the resin matrix includes one or more of epoxy resin, polyurethane, acrylic resin, silicone resin, fluorosilicone resin, bismaleimide, and phenolic resin, the thermally conductive filler includes one or more of silicon dioxide, aluminum oxide, magnesium oxide, zinc oxide, silicon, boron nitride, aluminum nitride, silicon nitride, silicon carbide, diamond, carbon nanotubes, graphene, graphite nanosheets, graphite, and metal particles, and the particle size of the thermally conductive filler ranges from 0.01 to 200 μm; S06, laying of the temperature-averaging layer: a single-sided composite heat-conducting structure layer of the temperature-averaging layer with a transverse thermal conductivity greater than 200 W / (m·K) and a thickness less than 2 mm, the temperature-averaging layer containing one or more of metal, silicon carbide, diamond, carbon nanotube, graphene, graphite nanosheet, graphite, carbon fiber, ceramic fiber, is laid on the upper and lower surfaces of the structure obtained in S05, with one side of the heat-conducting structure layer facing the structure obtained in S05 during laying, the heat-conducting structure layer having a thermal conductivity of 0.5 to 100 W / (m·K), containing a resin matrix and a heat-conducting filler, and the resin matrix The lipid matrix includes one or more of epoxy resin, polyurethane, acrylic resin, polyamide resin, phenolic resin, polyvinyl chloride, polyethylene, polypropylene, polystyrene, polycarbonate, silicone resin, fluorosilicone resin, polyimide, and bismaleimide; the thermal conductive filler includes one or more of silicon dioxide, aluminum oxide, magnesium oxide, zinc oxide, silicon, boron nitride, aluminum nitride, silicon nitride, silicon carbide, diamond, carbon nanotubes, graphene, graphite nanosheets, graphite, and metal particles; and the particle size of the thermal conductive filler ranges from 0.01 to 200 μm; S07, laying the upper and lower substrates: compounding the heat-conducting structure layer on one side of the upper substrate and the lower substrate, and then laying them on the upper surface and the lower surface of the structure obtained in S06 respectively, with one side of the heat-conducting structure layer facing the structure obtained in S06; S08, pressing: placing the structure obtained in S07 in a press, performing hot pressing, and obtaining a liquid-cooled plate blank; S09, punching and fixing: punching holes on the liquid cooling plate blank obtained in S08, and forming a fastening structure by glue injection or mechanical fastening; S10, shape processing: cutting and processing the liquid cooling plate blank to obtain a cooling device for a battery pack; S11, battery pack installation: the structure obtained in S10 is combined with the battery pack through the thermal interface material and installed and applied.

2. The manufacturing method according to claim 1, characterized in that: The shape of the liquid cooling tube after mechanical deformation in step S01 is one or more of S-shape, W-shape, fishbone shape, straight shape, H-shape, and polygonal shape; the outer contour of the liquid cooling tube is one or more of rectangular, elliptical, circular, and polygonal shape; the wall thickness of the liquid cooling tube is 0.01 to 6 mm; the maximum outer diameter range of the liquid cooling tube is 0.1 to 100 mm; the liquid cooling tube in step S01 contains one or more of metals, oxides, silicon, boron nitride, aluminum nitride, silicon nitride, silicon carbide, diamond, carbon nanotubes, graphene, graphite nanosheets, graphite, glass fiber, carbon fiber, quartz fiber, and ceramic fiber; and the thermal conductivity perpendicular to the tube wall is greater than 0.5 W / (m·K).

3. The manufacturing method according to claim 1, characterized in that: The thermal conductive material in step S02 contains one or more of graphite, graphene, carbon nanotubes, graphite nanosheets, carbon fibers, metals, and ceramics. The content of the thermal conductive material in the prepared composite material is 30wt.% to 95wt.%. The resin material in step S02 is one or more of epoxy resin, polyurethane, acrylic resin, polyamide resin, phenolic resin, polyvinyl chloride, polyethylene, polypropylene, polystyrene, polyoxymethylene, polyphenylene ether, polyester resin, polyphenylene sulfide, polyetheretherketone, acrylonitrile-butadiene-styrene copolymer, polymethyl methacrylate, polylactic acid, polybutylene succinate, ethylene-vinyl acetate copolymer, polycarbonate, silicone resin, fluorosilicone resin, polyimide, and bismaleimide. The composite process is one or more of surface coating and lamination.

4. The manufacturing method according to claim 1, characterized in that: The pressure range in the S03 step is 0.1 to 10 MPa, the temperature range is 50 to 220° C., the thickness range of the base profile obtained in the S03 step is 0.5 to 8 mm, the transverse thermal conductivity of the profile is greater than 30 W / (m·K), and the longitudinal thermal conductivity is greater than 3 W / (m·K).

5. The manufacturing method according to claim 1, characterized in that: The thermal conductivity of the upper substrate and the lower substrate in step S07 is 1 to 1500 W / (m·K). In step S07, the upper substrate and the lower substrate contain one or more of metal, silicon, boron nitride, aluminum nitride, silicon nitride, silicon carbide, diamond, carbon nanotubes, graphene, graphite nanosheets, graphite, glass fiber, carbon fiber, quartz fiber, and ceramic fiber, and the thickness ranges from 0.01 mm to 12 mm.

6. The manufacturing method according to claim 1, characterized in that: In the step S08, the hot pressing temperature is 10 to 300° C., the pressure is 0.1 to 10 MPa, and the time is 1 to 48 hours.

7. A cooling device for a battery pack, characterized in that: The cooling device is prepared by the method according to any one of claims 1 to 6, has a density less than 2.5 g / cm3, a thickness range of 1 to 100 mm, and has the function of liquid cooling and heat dissipation of the battery pack.

Images