Temperature and humidity feedback module, manufacturing method and system application

Abstract

The invention relates to the technical field of temperature and humidity sensing, in particular to a temperature and humidity feedback module, a manufacturing method and system application, and the temperature and humidity feedback module is characterized in that a temperature wireless switch and a humidity wireless switch form a loop which is controlled by a flexible temperature and humidity sensing part through a conductive circuit and a power supply; the flexible temperature and humidity sensing piece at least has three different forms including an initial form, an over-temperature form and an over-humidity form; when in the overtemperature state, the temperature wireless switch is in contact with and electrically communicated with the first contact circuit, the power supply supplies power to the temperature wireless switch, and related cooling equipment is started; when the humidity wireless switch is in the super-wet state, the humidity wireless switch is in contact with and electrically communicated with the second contact circuit, and the power supply supplies power to the humidity wireless switch to start related dehumidification equipment; the flexible temperature and humidity sensing piece and the conductive circuit are both made of flexible non-metal conductive films. The problems that a traditional temperature and humidity control system or sensor cannot adapt to the high-humidity environment of plant cultivation and plant growth form changes, is not environmentally friendly and cannot be applied in a large scale are solved.

Description

Technical Field

[0001] The present invention relates to the field of temperature and humidity sensing technology, and in particular to a temperature and humidity feedback module, a manufacturing method and a system application. Background Art

[0002] Temperature and humidity control plays an important role in scenarios such as industrial workshops, agricultural greenhouses and smart home devices. Especially in the process of plant cultivation, plants will show growth stagnation or quality decline under high temperature or high humidity conditions, which will affect the efficiency and growth quality of plant cultivation. Therefore, temperature and humidity control plays a decisive role in the healthy growth and cultivation of plants.

[0003] Traditional temperature and humidity control systems mainly rely on electronic sensors to monitor the temperature and humidity changes in the environment in real time. They mostly use metal oxide sensors or polymer sensors, and control related equipment (such as dehumidifiers, air conditioners, etc.) through circuit feedback mechanisms to adjust the temperature and humidity of the environment.

[0004] However, in agricultural application scenarios, traditional temperature and humidity control systems have the following defects:

[0005] (1) Due to the high humidity in the plant cultivation environment, leakage or short circuit faults are prone to occur. In addition, metal materials and PCB boards in ordinary circuits may oxidize, corrode or age in this environment, causing the performance of the temperature and humidity control system to degrade or even fail, especially the electronic sensors (equivalent to the temperature and humidity feedback module) installed near the plants to monitor the temperature and humidity.

[0006] (2) Traditional temperature and humidity control systems are usually designed as circuit boards, which cannot be bent. When the sensor or circuit board is installed on the plant, it cannot adapt to the changes in the growth shape of the plant and may fall off, causing errors in temperature and humidity detection; or because the circuit board or sensor is heavy, it puts pressure on the plant, resulting in restricted plant growth, which is not conducive to fitting the plant to achieve one-to-one monitoring.

[0007] (3) Conventional temperature and humidity control systems and their sensors usually require continuous power supply to work. Long-term monitoring consumes a lot of power and requires frequent battery replacement. In addition, the circuit boards and sensors are complex and difficult to manufacture, resulting in high costs. This does not meet the requirements of energy conservation and environmental protection and the needs of large-scale applications. Summary of the invention

[0008] In view of the above-mentioned defects, the purpose of the present invention is to propose a temperature and humidity feedback module, a manufacturing method and a system application, which solve the problems that traditional temperature and humidity control systems or sensors cannot adapt to the high humidity environment of plant cultivation, plant growth morphology changes, are not environmentally friendly and cannot be applied on a large scale.

[0009] To achieve this object, the present invention adopts the following technical solutions:

[0010] A temperature and humidity feedback module, comprising a flexible temperature and humidity sensing element, a conductive circuit, a temperature wireless switch, a humidity wireless switch and a power supply;

[0011] The flexible temperature and humidity sensing element has at least three different forms, namely, an initial form, an over-temperature form and an over-humidity form. The three different forms are deformed and switched under the influence of the current temperature and the current external humidity. When the temperature / humidity sensed by the flexible temperature and humidity sensing element is within the range of the trigger temperature / trigger humidity, the flexible temperature and humidity sensing element is in the initial form. When the temperature sensed by the flexible temperature and humidity sensing element exceeds the trigger temperature, the flexible temperature and humidity sensing element is deformed into the over-temperature form. When the humidity sensed by the flexible temperature and humidity sensing element exceeds the trigger humidity, the flexible temperature and humidity sensing element is deformed into the over-humidity form.

[0012] One end of the temperature wireless switch and one end of the humidity wireless switch are both electrically connected to one end of the power supply, the other end of the power supply is electrically connected to one end of the flexible temperature and humidity sensing element, the other end of the temperature wireless switch leads to a first contact line, and the other end of the humidity wireless switch leads to a second contact line;

[0013] When the flexible temperature and humidity sensing element is in an over-temperature state, the flexible temperature and humidity sensing element contacts and is electrically connected to the first contact line, and the power supply supplies power to the temperature wireless switch; the temperature wireless switch is used to start the cooling device;

[0014] When the flexible temperature and humidity sensing element is in the super-humid state, the flexible temperature and humidity sensing element contacts and is electrically connected to the second contact line, and the power supply supplies power to the humidity wireless switch; the humidity wireless switch is used to start the dehumidification device;

[0015] When the flexible temperature and humidity sensing element is in an initial state, the flexible temperature and humidity sensing element is not in contact with the first contact line and the second contact line;

[0016] The first contact circuit, the second contact circuit and the electrical connection all use the conductive circuit; the conductive circuit is a flexible non-metallic conductive film.

[0017] Furthermore, the flexible temperature and humidity sensing element comprises a humidity sensitive layer, a sensing transition layer and a temperature sensitive conductive layer; the flexible temperature and humidity sensing element is formed by stacking the humidity sensitive layer, the sensing transition layer and the temperature sensitive conductive layer from top to bottom, the humidity sensitive layer faces the first contact line, and the temperature sensitive conductive layer faces the second contact line;

[0018] The thermal expansion coefficient of the temperature-sensitive conductive layer is greater than that of the humidity-sensitive layer and the inductive transition layer;

[0019] When the temperature sensed by the temperature-sensitive conductive layer exceeds the trigger temperature, the temperature-sensitive conductive layer expands and stretches in a positive correlation with the sensed temperature, driving the inductive transition layer and the humidity-sensitive layer to curl toward the humidity-sensitive layer; when the temperature-sensitive conductive layer is in electrical contact with the first contact line, the power supply supplies power to the temperature wireless switch;

[0020] After the humidity sensed by the humidity sensitive layer exceeds the trigger humidity, the humidity sensitive layer expands and stretches in a positive correlation with the sensed humidity, driving the inductive transition layer and the temperature sensitive conductive layer to curl toward the temperature sensitive conductive layer; when the temperature sensitive conductive layer is in electrical contact with the second contact line, the power supply supplies power to the humidity wireless switch.

[0021] Furthermore, the conductive circuit includes a circuit base layer and a conductive layer; the conductive circuit is formed by stacking the circuit base layer and the conductive layer, the humidity sensitive layer and the inductive transition layer are both connected to the circuit base layer, and the temperature sensitive conductive layer is electrically connected to the conductive layer.

[0022] Furthermore, the humidity sensitive layer contains hydrophilic groups, and the humidity sensitive layer expands and stretches itself by combining with water molecules through the hydrophilic groups.

[0023] Furthermore, the humidity sensitive layer is made of a flexible hydrophilic material, the inductive transition layer and the circuit base layer are both made of flexible materials, and the temperature sensitive conductive layer and the conductive layer are both made of flexible conductive materials;

[0024] The flexible hydrophilic material and the flexible conductive material are both transformed from the flexible material;

[0025] The other end of the power supply is electrically connected to one end of the flexible temperature and humidity sensing element and is integrally formed.

[0026] Furthermore, the other end of the temperature wireless switch leads the first contact line to the top of the temperature and humidity sensing element; the distance between the first contact line and the flexible temperature and humidity sensing element is positively correlated with the triggering temperature of the temperature wireless switch;

[0027] The other end of the humidity wireless switch leads the second contact line to the bottom of the temperature and humidity sensing element; the distance between the second contact line and the flexible temperature and humidity sensing element is positively correlated with the triggering humidity of the humidity wireless switch;

[0028] The temperature and humidity sensing element, the first contact circuit and the second contact circuit are installed on the same substrate.

[0029] A method for manufacturing a temperature and humidity feedback module, used to manufacture the above-mentioned temperature and humidity feedback module; comprising the following steps:

[0030] A1: According to the circuit path of the temperature and humidity feedback module circuit diagram and the preset shape of the flexible temperature and humidity sensing element, the flexible non-metallic conductive film is cut to obtain a circuit layout in which the flexible temperature and humidity sensing element and the conductive circuit are integrally formed;

[0031] A2: In the circuit layout, the lower surface of the flexible non-metallic conductive film is transformed so that the flexible non-metallic conductive film is layered into upper and lower layers to form a conductive circuit; the upper layer is used as the circuit base layer, and the lower layer is used as the conductive layer;

[0032] A3: In the circuit layout, the molecular bonds on the upper surface of the flexible non-metallic conductive film located at the flexible temperature and humidity sensing element are destroyed, so that the flexible non-metallic conductive film is divided into upper, middle and lower layers to form a flexible temperature and humidity sensing element; the upper layer is used as a humidity sensitive layer, the middle layer is used as a sensing transition layer, and the lower layer is used as a temperature sensitive conductive layer;

[0033] A4: Connect the temperature wireless switch, humidity wireless switch and power supply to the corresponding positions in the circuit diagram.

[0034] Furthermore, in the step A1: cutting the flexible non-metallic conductive film using a laser device;

[0035] In the step A2: a laser device is used to irradiate the lower surface of the flexible non-metallic conductive film for conversion processing.

[0036] Furthermore, in the step A3: a strong alkaline solution is used to destroy the molecular bonds on the upper surface of the flexible non-metallic conductive film located at the flexible temperature and humidity sensing element.

[0037] A plant growth environment control system comprises at least one of the above-mentioned temperature and humidity feedback modules; and also comprises a central controller, at least one dehumidification device and at least one cooling device;

[0038] The temperature and humidity feedback module is wirelessly connected to the central controller, and the dehumidification device and the cooling device are both electrically connected to the central controller;

[0039] One of the temperature and humidity feedback modules establishes a trigger association with at least one of the dehumidification devices and one of the cooling devices;

[0040] The central controller is used to start the cooling device, or start the cooling device corresponding to the plant cultivation when receiving the feedback signal of the temperature wireless switch; and is also used to start the dehumidification device, or start the dehumidification device corresponding to the plant cultivation when receiving the feedback signal of the humidity wireless switch.

[0041] The technical solution provided by the present invention may include the following beneficial effects: the flexible temperature and humidity sensing elements and conductive circuits in the circuit construction based on the temperature and humidity feedback module are all sampled from flexible non-metallic conductive films, making the entire circuit lightweight and flexible, and the temperature and humidity feedback module can be installed one-to-one with the plant and adapt to the growth morphological changes of the plant (specifically, the flexible non-metallic conductive film reserves some length / curvature during installation to adapt to the growth morphological changes of the plant, such as when the branches are thin, the circuit is arched, and as the branches become thicker, the circuit flexibly flattens), thereby improving the accuracy of temperature and humidity monitoring.

[0042] Because the flexible temperature and humidity sensors and conductive circuits are made of non-metallic materials, they are not afraid of high humidity environments. Only simple waterproof protection is required for small components such as temperature wireless switches, humidity wireless switches and power supplies (such as button batteries) (or they themselves have waterproof properties and do not need protection) to resist the impact of the high humidity environment of plant cultivation on the circuit, greatly extending the service life of the temperature and humidity feedback module.

[0043] More importantly, the temperature feedback and humidity feedback of the temperature and humidity feedback module are both triggered by the deformation of the flexible temperature and humidity sensing component. Only when the trigger temperature or the trigger humidity is reached, the flexible temperature and humidity sensing component will contact the first contact line or the second contact line and be energized to supply power to the temperature wireless switch or the humidity wireless switch, so that it sends a feedback signal to the relevant systems and equipment, directly or indirectly starting the relevant cooling equipment or the relevant dehumidification equipment; the flexible temperature and humidity sensing component will restore its initial shape to disconnect the contact when the temperature or the trigger humidity is lower than the trigger temperature; thus, the temperature and humidity feedback module consumes less power and does not need to frequently replace the power supply. In addition, the circuit structure of the temperature and humidity feedback module is simple, which greatly reduces the manufacturing difficulty and cost, and meets the requirements of energy saving and environmental protection and the needs of large-scale applications. BRIEF DESCRIPTION OF THE DRAWINGS

[0044] Figure 1 It is a schematic diagram of a temperature and humidity feedback module according to one embodiment of the present invention.

[0045] Figure 2 Yes Figure 1 The schematic diagram of the flexible temperature and humidity sensing element shown.

[0046] Figure 3 Yes Figure 2 Schematic diagram of the expansion and stretching of the temperature-sensitive conductive layer.

[0047] Figure 4 Yes Figure 2 Schematic diagram of the expansion and extension of the humidity sensitive layer.

[0048] Figure 5 Yes Figure 1 Schematic diagram of the conductive circuit shown.

[0049] Figure 6 The present invention is a flow chart of a method for manufacturing a temperature and humidity feedback module according to one embodiment of the present invention.

[0050] Figure 7 Yes Figure 6 A schematic diagram of the circuit layout in step A1 is shown.

[0051] Figure 8 It is a schematic diagram of a plant growth environment control system according to one embodiment of the present invention.

[0052] Wherein: flexible temperature and humidity sensing element 1, conductive circuit 2, temperature wireless switch 3, humidity wireless switch 4, power supply 5, humidity sensitive layer 11, sensing transition layer 12, temperature sensitive conductive layer 13, circuit base layer 21, conductive layer 22;

[0053] Temperature and humidity feedback module 10, central controller 20, dehumidification equipment 30, cooling equipment 40. DETAILED DESCRIPTION

[0054] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0055] In the description of the present invention, it is necessary to understand that the terms "longitudinal", "transverse", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention. In addition, features defined as "first" or "second" may explicitly or implicitly include one or more of the features, and are used to distinguish and describe features, without distinction of order or importance.

[0056] In the description of the present invention, unless otherwise specified, "plurality" means two or more.

[0057] In the description of the embodiments of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected or indirectly connected through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the embodiments of the present invention can be understood according to specific circumstances.

[0058] Combine the following Figures 1 to 8 , describing a temperature and humidity feedback module, manufacturing method and system application of an embodiment of the present invention.

[0059] A temperature and humidity feedback module, comprising a flexible temperature and humidity sensing element 1, a conductive circuit 2, a temperature wireless switch 3, a humidity wireless switch 4 and a power supply 5;

[0060] The flexible temperature and humidity sensing element 1 has at least three different forms, namely, an initial form, an over-temperature form and an over-humidity form. The three different forms are deformed and switched under the influence of the current temperature and the current external humidity. When the temperature / humidity sensed by the flexible temperature and humidity sensing element 1 is within the range of the trigger temperature / trigger humidity, the flexible temperature and humidity sensing element 1 is in the initial form. When the temperature sensed by the flexible temperature and humidity sensing element 1 exceeds the trigger temperature, the flexible temperature and humidity sensing element 1 is deformed and is in the over-temperature form. When the humidity sensed by the flexible temperature and humidity sensing element 1 exceeds the trigger humidity, the flexible temperature and humidity sensing element 1 is deformed and is in the over-humidity form.

[0061] One end of the temperature wireless switch 3 and one end of the humidity wireless switch 4 are both electrically connected to one end of the power supply 5, the other end of the power supply 5 is electrically connected to one end of the flexible temperature and humidity sensing element 1, the other end of the temperature wireless switch 3 leads to a first contact line, and the other end of the humidity wireless switch 4 leads to a second contact line;

[0062] When the flexible temperature and humidity sensing element 1 is in an over-temperature state, the flexible temperature and humidity sensing element 1 contacts and is electrically connected to the first contact line, and the power supply 5 supplies power to the temperature wireless switch 3; the temperature wireless switch 3 is used to start the cooling device;

[0063] When the flexible temperature and humidity sensing element 1 is in the super-humid state, the flexible temperature and humidity sensing element 1 contacts and is electrically connected to the second contact line, and the power supply 5 supplies power to the humidity wireless switch 4; the humidity wireless switch 4 is used to start the dehumidification device;

[0064] When the flexible temperature and humidity sensing element 1 is in the initial state, the flexible temperature and humidity sensing element 1 is not in contact with the first contact line and the second contact line;

[0065] The first contact circuit, the second contact circuit and the electrical connection all use a conductive circuit 2; the conductive circuit 2 is a flexible non-metallic conductive film.

[0066] The present invention proposes a temperature and humidity feedback module, a manufacturing method and a preferred embodiment of the system application, such as Figure 1 As shown, the flexible temperature and humidity sensing element 1 and the conductive circuit 2 in the circuit construction based on the temperature and humidity feedback module are both made of flexible non-metallic conductive film, so that the entire circuit is lightweight and flexible. The temperature and humidity feedback module can be installed one-to-one with the plant and adapt to the growth morphological changes of the plant (specifically, the flexible non-metallic conductive film reserves some length / curvature during installation to adapt to the growth morphological changes of the plant, such as when the branches are thin, the circuit is arched, and as the branches become thicker, the circuit is flexibly flattened), thereby improving the accuracy of temperature and humidity monitoring.

[0067] Because the flexible temperature and humidity sensing element 1 and the conductive circuit 2 are both made of non-metallic materials and are not afraid of high humidity environments, it is only necessary to provide simple waterproof protection for small components such as the temperature wireless switch 3, the humidity wireless switch 4 and the power supply 5 (such as a button battery) (or they themselves have waterproof properties and do not need protection) to resist the impact of the high humidity environment of plant cultivation on the circuit, thereby greatly extending the service life of the temperature and humidity feedback module.

[0068] More importantly, the temperature feedback and humidity feedback of the temperature and humidity feedback module are both triggered by the deformation of the flexible temperature and humidity sensing component 1. Only after reaching the trigger temperature or the trigger humidity, the flexible temperature and humidity sensing component 1 will contact the first contact line or the second contact line and be energized to supply power to the temperature wireless switch 3 or the humidity wireless switch 4, so that it sends a feedback signal to the relevant system and equipment, directly or indirectly starting the relevant cooling equipment or the relevant dehumidification equipment; the flexible temperature and humidity sensing component 1 returns to its initial shape to disconnect the contact when it is lower than the trigger temperature or the trigger humidity; thus, the temperature and humidity feedback module consumes less power and does not need to frequently replace the power supply 5. In addition, the circuit structure of the temperature and humidity feedback module is simple, which greatly reduces the manufacturing difficulty and cost, and meets the requirements of energy saving and environmental protection and the needs of large-scale applications.

[0069] Specifically, the deformation switching relationship of the three different forms can be: the other end of the temperature wireless switch 3 leads out the first contact line to the top of the temperature and humidity sensing component 1, and the other end of the humidity wireless switch 4 leads out the second contact line to the bottom of the temperature and humidity sensing component 1; when the temperature sensed by the flexible temperature and humidity sensing component 1 exceeds the deformation temperature, the temperature and humidity sensing component 1 is positively correlated with the sensed temperature and curls upward to switch to the over-temperature form, the upward curling of the flexible temperature and humidity sensing component 1 makes the flexible temperature and humidity sensing component 1 contact and electrically connected with the first contact line, and the power supply 5 supplies power to the temperature wireless switch 3; when the humidity sensed by the flexible temperature and humidity sensing component 1 exceeds the deformation humidity, the temperature and humidity sensing component 1 is positively correlated with the sensed humidity and curls downward to switch to the over-humidity form, the flexible temperature and humidity sensing component 1 is contact and electrically connected with the first contact line, and the power supply 5 supplies power to the temperature wireless switch 3.

[0070] Furthermore, the flexible temperature and humidity sensing element 1 includes a humidity sensitive layer 11, a sensing transition layer 12 and a temperature sensitive conductive layer 13; the flexible temperature and humidity sensing element 1 is formed by stacking the humidity sensitive layer 11, the sensing transition layer 12 and the temperature sensitive conductive layer 13 from top to bottom, the humidity sensitive layer 11 faces the first contact line, and the temperature sensitive conductive layer 13 faces the second contact line;

[0071] The thermal expansion coefficient of the temperature sensitive conductive layer 13 is greater than that of the humidity sensitive layer 11 and the inductive transition layer 12;

[0072] When the temperature sensed by the temperature-sensitive conductive layer 13 exceeds the trigger temperature, the temperature-sensitive conductive layer 13 expands and stretches in a positive correlation with the sensed temperature, driving the inductive transition layer 12 and the humidity-sensitive layer 11 to curl toward the humidity-sensitive layer 11; when the temperature-sensitive conductive layer 13 is in electrical contact with the first contact line, the power source 5 supplies power to the temperature wireless switch 3;

[0073] When the humidity sensed by the humidity sensitive layer 11 exceeds the trigger humidity, the humidity sensitive layer 11 expands and stretches in a positive correlation with the sensed humidity, driving the inductive transition layer 12 and the temperature sensitive conductive layer 13 to curl toward the temperature sensitive conductive layer 13; when the temperature sensitive conductive layer 13 is in electrical contact with the second contact line, the power supply 5 supplies power to the humidity wireless switch 4.

[0074] In this embodiment, Figure 2 As shown, in order to realize the deformation switching relationship of three different forms, the flexible temperature and humidity sensing element 1 needs to be composed of a humidity sensitive layer 11, a sensing transition layer 12 and a temperature sensitive conductive layer 13, wherein the temperature sensitive conductive layer 13 is used for conducting when the first contact line or the second contact line is released, and based on the fact that the temperature sensitive conductive layer 13 has the largest expansion coefficient among the three layers, when the temperature is sensed, the thermal expansion and stretching are the most intense, and the three layers curl toward the humidity sensitive layer 11 under the internal stress generated by the difference in thermal expansion coefficients, that is, switching from the initial form to the over-temperature form (such as Figure 3 As shown), it finally contacts the first contact line to realize the electrical connection of the temperature wireless switch 3; and the humidity sensitive layer 11 drives (or forces) the inductive transition layer 12 and the temperature sensitive conductive layer 13 to curl toward the temperature sensitive conductive layer 13 through the expansion and stretching of the humidity sensitive material, that is, it switches from the initial state to the super-humid state (as shown). Figure 4 As shown), it finally contacts with the second contact line to realize the electrical connection of the humidity wireless switch 4; thereby enabling the flexible temperature and humidity sensing element 1 to have the ability to detect temperature and humidity.

[0075] Furthermore, the conductive circuit 2 includes a circuit base layer 21 and a conductive layer 22; the conductive circuit 2 is formed by stacking the circuit base layer 21 and the conductive layer 22, the humidity sensitive layer 11 and the inductive transition layer 12 are both connected to the circuit base layer 21, and the temperature sensitive conductive layer 13 is electrically connected to the conductive layer 22.

[0076] In this embodiment, Figure 5 As shown, the conductive circuit 2 is composed of a circuit base layer 21 and a conductive layer 22, wherein the conductive layer 22 is used to provide an electric energy conduction path when forming a loop, and conducts the electric energy of the power supply 5 to the temperature wireless switch 3 or the humidity wireless switch 4; and the circuit base layer 21 mainly plays a protective role for the conductive layer 22, preventing the conductive layer 22 from breaking and opening the circuit due to insufficient toughness.

[0077] Furthermore, the humidity sensitive layer 11 contains hydrophilic groups, and the humidity sensitive layer 11 expands and stretches itself by combining with water molecules through the hydrophilic groups.

[0078] In this embodiment, the humidity-sensitive property of the humidity-sensitive layer 11 is preferably achieved by containing hydrophilic groups such as hydroxyl groups or carboxyl groups, so that the layer is simple to manufacture, and the hydrophilic groups can be obtained by destroying the molecular bonds of a specific material (such as polyimide); thus, based on the fact that the hydrophilic groups can easily combine with water molecules through hydrogen bonds, the humidity-sensitive layer 11 deforms more violently as the number of water molecules increases, thereby achieving its own expansion and stretching.

[0079] Furthermore, the humidity sensitive layer 11 is made of a flexible hydrophilic material, the sensing transition layer 12 and the circuit base layer 21 are both made of flexible materials, and the temperature sensitive conductive layer 13 and the conductive layer 22 are both made of flexible conductive materials;

[0080] Both flexible hydrophilic materials and flexible conductive materials are transformed from flexible materials;

[0081] The other end of the power source 5 is electrically connected to one end of the flexible temperature and humidity sensing element 1 to form an integral body.

[0082] In this embodiment, the flexible temperature and humidity sensing element 1 and the conductive circuit 2 both adopt flexible non-metallic conductive films, and the inductive transition layer 12 and the circuit base layer 21 both play a protective role on the conductive layer, and the temperature sensitive conductive layer 13 and the conductive layer 22 both play a conductive role, so the flexible temperature and humidity sensing element 1 and the conductive circuit 2 have a basis for integral molding; therefore, the humidity sensitive layer 11 is preferably polyimide acid (flexible hydrophilic material), the inductive transition layer 12 and the circuit base layer 21 are preferably polyimide (flexible material), the temperature sensitive conductive layer 13 and the conductive layer 22 are preferably graphene (flexible conductive material), and polyimide acid (flexible hydrophilic material) and graphene (flexible conductive material) can be converted from polyimide (flexible material), so that the other end of the power supply 5 and one end of the flexible temperature and humidity sensing element 1 can be electrically connected and integrally molded, so that the electrical connection relationship between the other end of the power supply 5 and the flexible temperature and humidity sensing element 1 is stable. After being installed on the plant, the plant can be used for growth based on the flexible characteristics, and will not be stretched and broken due to the existence of the connection point.

[0083] The specific one-piece molding method is that when the flexible non-metallic conductive film is a polyimide film, graphene is obtained by converting the lower surface of the polyimide film to form a conductive circuit 2; then the molecular bonds of the upper surface of the polyimide film in the area of ​​the flexible temperature and humidity sensing component 1 are destroyed to obtain polyimide acid (containing hydrophilic groups) to form a flexible temperature and humidity sensing component 1, and finally the electrical connection and one-piece molding are realized.

[0084] Furthermore, the other end of the temperature wireless switch 3 leads out a first contact line to the top of the temperature and humidity sensing element 1; the distance between the first contact line and the flexible temperature and humidity sensing element 1 is positively correlated with the triggering temperature of the temperature wireless switch 3;

[0085] The other end of the humidity wireless switch 4 leads to a second contact line to the bottom of the temperature and humidity sensing element 1; the distance between the second contact line and the flexible temperature and humidity sensing element 1 is positively correlated with the triggering humidity of the humidity wireless switch 4;

[0086] The temperature and humidity sensing element 1, the first contact circuit and the second contact circuit are installed on the same substrate.

[0087] In this embodiment, in order to facilitate the use of the deformation of the temperature and humidity sensing element 1 to connect the temperature wireless switch 3 and the humidity wireless switch 4, the first contact line and the second contact line are respectively arranged above and below the temperature and humidity sensing element 1, and the purpose of adjusting the trigger temperature / humidity can be achieved by adjusting the distance.

[0088] Specifically, based on the fact that the sensitivity of the flexible temperature and humidity sensing element 1 to temperature and humidity remains unchanged (i.e., the thickness of the humidity sensitive layer 11 and the temperature sensitive conductive layer 13 remain unchanged), within a certain range, the triggering thresholds (i.e., the triggering temperature and the triggering humidity) of the temperature wireless switch 3 and the humidity wireless switch 4 can be adjusted by adjusting the distance between the flexible temperature and humidity sensing element 1 and the first contact line and the second contact line respectively; if the distance is small, the flexible temperature and humidity sensing element 1 can contact the first contact line or the second contact line with a small curling degree to power on the switch, which means that the triggering threshold is small, that is, a positive correlation is formed.

[0089] Similarly, the thickness of the temperature-sensitive conductive layer 13 is negatively correlated with the triggering temperature of the temperature wireless switch 3, and the thickness of the humidity-sensitive layer 11 is negatively correlated with the triggering humidity of the humidity wireless switch 4. Based on the fact that the distances between the temperature and humidity sensing element flexible temperature and humidity sensing element 1 and the first contact line and the second contact line remain unchanged, within a certain range, the triggering thresholds (i.e., the triggering temperature and the triggering humidity) of the temperature wireless switch 3 and the humidity wireless switch 4 can be adjusted by adjusting the sensitivity of the temperature and humidity sensing element flexible temperature and humidity sensing element 1 to temperature and humidity sensitivity (i.e., the thickness of the humidity-sensitive layer 11 and the temperature-sensitive conductive layer 13); if the thickness is large, the temperature and humidity sensing element flexible temperature and humidity sensing element 1 is more likely to curl and deform, which can accelerate the contact with the first contact line or the second contact line to energize the switch, which means that the triggering threshold is small, i.e., a negative correlation is formed.

[0090] It should be noted that the relative relationship between the temperature and humidity sensing element 1, the first contact line and the second contact line will affect the triggering temperature / triggering humidity, so the temperature and humidity sensing element 1, the first contact line and the second contact line are installed on the same substrate (which can be a flexible substrate or a hard board) to prevent relative position displacement. It is preferred to use a flexible substrate with a semicircular arc in the initial state, cover the trunk of the plant with the center of the flexible substrate and the trunk midline fixedly connected (can be nailed); in this way, as the trunk grows, the flexible substrate fits the trunk more and more, and after the trunk diameter is larger than the diameter of the flexible substrate in the semicircular arc state (i.e., the initial state), the flexible substrate will be unfolded as the trunk grows (i.e., non-initial state), and the temperature and humidity sensing element 1, the first contact line and the second contact line will shrink in length during the unfolding process, but the relative position relationship will remain unchanged, thereby ensuring the stability of the triggering temperature / humidity.

[0091] A method for manufacturing a temperature and humidity feedback module, used to manufacture the above-mentioned temperature and humidity feedback module; comprising the following steps:

[0092] A1: According to the circuit path of the temperature and humidity feedback module circuit diagram and the preset shape of the flexible temperature and humidity sensing element 1, the flexible non-metallic conductive film is cut to obtain a circuit layout in which the flexible temperature and humidity sensing element 1 and the conductive circuit 2 are integrally formed;

[0093] A2: In the circuit layout, the lower surface of the flexible non-metallic conductive film is transformed so that the flexible non-metallic conductive film is divided into upper and lower layers to form a conductive circuit 2; wherein the upper layer is used as a circuit base layer 21, and the lower layer is used as a conductive layer 22;

[0094] A3: In the circuit layout, the molecular bonds on the upper surface of the flexible non-metallic conductive film located at the flexible temperature and humidity sensing element 1 are destroyed, so that the flexible non-metallic conductive film is divided into upper, middle and lower layers to form the flexible temperature and humidity sensing element 1; wherein the upper layer is used as the humidity sensitive layer 11, the middle layer is used as the sensing transition layer 12, and the lower layer is used as the temperature sensitive conductive layer 13;

[0095] A4: Connect the temperature wireless switch 3, humidity wireless switch 4 and power supply 5 to the corresponding positions in the circuit diagram.

[0096] In this embodiment, a preferred embodiment of a method for manufacturing a temperature and humidity feedback module is also proposed. Figure 6 As shown, in order to simplify the manufacturing method, a flexible non-metallic conductive film (such as a polyimide film) that can be processed to obtain a flexible temperature and humidity sensor 1 and a conductive circuit 2 is selected, and the flexible temperature and humidity sensor 1 and the conductive circuit 2 are cut to obtain a circuit layout (such as Figure 7 The solid line schematic part) simplifies various processes such as copper deposition, circuit transfer, and circuit etching in traditional circuit manufacturing; then, the lower surface of the flexible non-metallic conductive film is converted, such as chemical oxidation-reduction method, thermal decomposition method or plasma stripping method, to convert polyimide into graphene that can conduct electricity, thereby obtaining a conductive circuit 2, wherein the upper layer is used as a circuit base layer 21 (polyimide), and the lower layer is used as a conductive layer 22 (graphene); then, the upper surface of the flexible non-metallic conductive film (which has been layered into polyimide and graphene at the upper and lower layers) located at the flexible temperature and humidity sensing element 1 is molecularly broken, so that the upper surface contains hydrophilic groups, so that the flexible non-metallic conductive film is layered into upper, middle and lower layers to form a flexible temperature and humidity sensing element 1, wherein the upper layer is used as a humidity sensitive layer 11 (polyimide acid), the middle layer is used as a sensing transition layer 12 (polyimide), and the lower layer is used as a temperature sensitive conductive layer 13 (graphene); finally, the temperature wireless switch 3, the humidity wireless switch 4 and the power supply 5 are connected to the corresponding positions in the circuit layout to complete the manufacturing.

[0097] It should be noted that the electrical connection between the temperature wireless switch 3, the humidity wireless switch 4 and the power supply 5 and the corresponding conductive circuit 2 can be achieved by welding, plugging or crimping the pins and the conductive layer 22 (graphene).

[0098] Further, in step A1: using a laser device to cut the flexible non-metallic conductive film;

[0099] In step A2: a laser device is used to irradiate the lower surface of the flexible non-metallic conductive film for conversion processing.

[0100] In this embodiment, based on the laser wavelength, scanning speed, laser power and other parameters of the laser device, the laser device is used for cutting and conversion processing in both steps A1 and A2. The small diameter of the laser spot can be used to reduce the laser influence area as much as possible, improve the processing accuracy, and accurately cut out the circuit layout of the temperature and humidity feedback module; at the same time, the resistance value of the graphene generated on the surface of the polyimide can be accurately controlled by selecting the laser parameters (such as controlling it to be below 0-20 square resistance, so as to achieve a good conductive function, and the thickness of the graphene layer can also be accurately controlled to achieve the thickness adjustment of the temperature sensitive conductive layer 13.

[0101] It should be noted that the laser device irradiates the surface of polyimide with laser, and uses photochemical and photothermal reactions to change the structure and properties of the polyimide surface, so that its molecules are decomposed into multiple carbon ions, which are finally deposited to form graphene.

[0102] Furthermore, in step A3: a strong alkaline solution is used to destroy the molecular bonds on the upper surface of the flexible non-metallic conductive film located at the flexible temperature and humidity sensing element 1 .

[0103] In this embodiment, in step A3, a strong alkaline solution is preferably used to destroy the molecular bonds on the upper surface of the flexible non-metallic conductive film. The thickness of the humidity sensitive layer 11 (or the degree of destruction of the molecular bonds) can be controlled by using strong alkaline solutions of different concentrations, thereby adjusting the sensitivity of the humidity sensitive layer 11 to humidity (or water molecules).

[0104] Specifically, a method for manufacturing a temperature and humidity feedback module has the following parameter schemes:

[0105] Example 1

[0106] A1: Select a polyimide film with a thickness of 25 μm, cut the polyimide film with a laser scanning speed of 100 m / s and a power of 2.867 W to obtain a circuit layout;

[0107] A2: Use ultraviolet picosecond laser to process the lower surface of the circuit layout, with a laser scanning speed of 200m / s, a power of 2.867W, and a defocus of 5mm to generate graphene;

[0108] A3: The upper surface of the polyimide film that has not been processed into graphene is treated with a solution of KOH with a concentration of 1 g / L, so that the concentration per unit area of ​​the film surface is 1:1.5 (cm 2 / 10 -5 g), obtaining a flexible temperature and humidity sensing element 1;

[0109] A4: The pins of the temperature wireless switch 3, the humidity wireless switch 4 and the power supply 5 are respectively connected to the corresponding graphene through conductive silver paste.

[0110] Example 2

[0111] A1: Select a polyimide film with a thickness of 35 μm, cut the polyimide film with a laser scanning speed of 100 m / s and a power of 2.867 W to obtain a circuit layout;

[0112] A2: Use ultraviolet picosecond laser to process the lower surface of the circuit layout, with a laser scanning speed of 200m / s, a power of 2.867W, and a defocus of 5mm to generate graphene;

[0113] A3: The upper surface of the polyimide film that has not been processed into graphene is treated with a solution of KOH with a concentration of 1 g / L, so that the concentration per unit area of ​​the film surface is 1:1.2 (cm 2 / 10 -5 g), obtaining a flexible temperature and humidity sensing element 1;

[0114] A4: The pins of the temperature wireless switch 3, the humidity wireless switch 4 and the power supply 5 are respectively connected to the corresponding graphene through conductive silver paste.

[0115] Example 3

[0116] A1: Select a polyimide film with a thickness of 55 μm, cut the polyimide film with a laser scanning speed of 100 m / s and a power of 2.867 W to obtain a circuit layout;

[0117] A2: Use ultraviolet picosecond laser to process the lower surface of the circuit layout, with a laser scanning speed of 200m / s, a power of 2.867W, and a defocus of 5mm to generate graphene;

[0118] A3: The upper surface of the polyimide film that has not been processed into graphene is treated with a solution of KOH with a concentration of 1 g / L, so that the concentration per unit area of ​​the film surface is 1:1.5 (cm 2 / 10 -5 g), obtaining a flexible temperature and humidity sensing element 1;

[0119] A4: The pins of the temperature wireless switch 3, the humidity wireless switch 4 and the power supply 5 are respectively connected to the corresponding graphene through conductive silver paste.

[0120] A plant growth environment control system includes at least one of the above-mentioned temperature and humidity feedback modules 10; and also includes a central controller 20, at least one dehumidification device 30 and at least one cooling device 40;

[0121] The temperature and humidity feedback module 10 is wirelessly connected to the central controller 20, and the dehumidification device 30 and the cooling device 40 are both electrically connected to the central controller 20;

[0122] A temperature and humidity feedback module 10 establishes a trigger association with at least one dehumidification device and one cooling device;

[0123] The central controller 20 is used to start the cooling device 40, or start the cooling device 40 corresponding to the plant cultivation when receiving the feedback signal of the temperature wireless switch 3; it is also used to start the dehumidification device 30, or start the dehumidification device 30 corresponding to the plant cultivation when receiving the feedback signal of the humidity wireless switch 4.

[0124] In this embodiment, a preferred embodiment of a plant growth environment control system is also proposed, such as Figure 8 As shown, based on the flexibility, light weight, environmental protection and low cost of the temperature and humidity feedback module, a plant growth environment control system can be built to perform cluster temperature and humidity control on all cultivated plants in the same cultivation space (such as a cultivation room), providing the best growth environment for cultivated plants.

[0125] Specifically, the following application methods are available:

[0126] (1) In the same cultivation space, each cultivated plant is installed with a corresponding temperature and humidity feedback module 10, the dehumidification equipment 30 is evenly distributed in the cultivation space according to the dehumidification range, and the cooling equipment 40 is evenly distributed in the cultivation space according to the cooling range; at this time, one temperature and humidity feedback module 10 corresponds to at least one dehumidification equipment 30 and one cooling equipment 40 around it, and the temperature and humidity feedback module 10 triggers the start / shutdown of the corresponding cooling equipment 40 and dehumidification equipment 30 according to the sensing information (determining whether the trigger temperature or trigger humidity is reached), so as to cool down or dehumidify the surrounding environment of the cultivated plant where the temperature and humidity feedback module 10 is installed, so that the cultivated plant is in the best growth state.

[0127] (2) In the same cultivation space, each cultivated plant is installed with a temperature and humidity feedback module 10 and is specially configured with at least one dehumidification device 30 and one cooling device 40; the temperature and humidity feedback module 10 triggers the start / shutdown of these cooling devices 40 and dehumidification devices 30 according to the sensing information (determining whether the trigger temperature or trigger humidity is reached), and specifically cools or dehumidifies the cultivated plants installed with the temperature and humidity feedback module 10, so that the cultivated plants are in the best growth state.

[0128] A temperature and humidity feedback module, a manufacturing method, other components of system application, and operations according to the embodiments of the present invention are well known to those skilled in the art and will not be described in detail here.

[0129] In the description of this specification, the description with reference to the terms "embodiment", "example", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0130] Although the embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the claims and their equivalents.

Claims

1. A temperature and humidity feedback module, characterized in that: It includes a flexible temperature and humidity sensor, a conductive circuit, a temperature wireless switch, a humidity wireless switch and a power supply; The flexible temperature and humidity sensing element has at least three different forms, namely, an initial form, an over-temperature form and an over-humidity form. The three different forms are deformed and switched under the influence of the current temperature and the current external humidity. When the temperature / humidity sensed by the flexible temperature and humidity sensing element is within the range of the trigger temperature / trigger humidity, the flexible temperature and humidity sensing element is in the initial form. When the temperature sensed by the flexible temperature and humidity sensing element exceeds the trigger temperature, the flexible temperature and humidity sensing element is deformed into the over-temperature form. When the humidity sensed by the flexible temperature and humidity sensing element exceeds the trigger humidity, the flexible temperature and humidity sensing element is deformed into the over-humidity form. One end of the temperature wireless switch and one end of the humidity wireless switch are both electrically connected to one end of the power supply, the other end of the power supply is electrically connected to one end of the flexible temperature and humidity sensing element, the other end of the temperature wireless switch leads to a first contact line, and the other end of the humidity wireless switch leads to a second contact line; When the flexible temperature and humidity sensing element is in an over-temperature state, the flexible temperature and humidity sensing element contacts and is electrically connected to the first contact line, and the power supply supplies power to the temperature wireless switch; The temperature wireless switch is used to start the cooling device; When the flexible temperature and humidity sensing element is in the super-humid state, the flexible temperature and humidity sensing element contacts and is electrically connected to the second contact line, and the power supply supplies power to the humidity wireless switch; The humidity wireless switch is used to start the dehumidification equipment; When the flexible temperature and humidity sensing element is in an initial state, the flexible temperature and humidity sensing element is not in contact with the first contact line and the second contact line; The first contact circuit, the second contact circuit and the electrical connection all use the conductive circuit; The conductive circuit is a flexible non-metallic conductive film.

2. A temperature and humidity feedback module according to claim 1, characterized in that: The flexible temperature and humidity sensing element comprises a humidity sensitive layer, a sensing transition layer and a temperature sensitive conductive layer; the flexible temperature and humidity sensing element is formed by stacking the humidity sensitive layer, the sensing transition layer and the temperature sensitive conductive layer from top to bottom, the humidity sensitive layer faces the first contact line, and the temperature sensitive conductive layer faces the second contact line; The thermal expansion coefficient of the temperature-sensitive conductive layer is greater than that of the humidity-sensitive layer and the inductive transition layer; When the temperature sensed by the temperature-sensitive conductive layer exceeds the trigger temperature, the temperature-sensitive conductive layer expands and stretches in a positive correlation with the sensed temperature, driving the inductive transition layer and the humidity-sensitive layer to curl toward the humidity-sensitive layer; when the temperature-sensitive conductive layer is in electrical contact with the first contact line, the power supply supplies power to the temperature wireless switch; After the humidity sensed by the humidity sensitive layer exceeds the trigger humidity, the humidity sensitive layer expands and stretches in a positive correlation with the sensed humidity, driving the inductive transition layer and the temperature sensitive conductive layer to curl toward the temperature sensitive conductive layer; when the temperature sensitive conductive layer is in electrical contact with the second contact line, the power supply supplies power to the humidity wireless switch.

3. A temperature and humidity feedback module according to claim 2, characterized in that: The conductive circuit includes a circuit base layer and a conductive layer; the conductive circuit is formed by stacking the circuit base layer and the conductive layer, the humidity sensitive layer and the inductive transition layer are both connected to the circuit base layer, and the temperature sensitive conductive layer is electrically connected to the conductive layer.

4. A temperature and humidity feedback module according to claim 2, characterized in that: The humidity sensitive layer contains a hydrophilic group, and the humidity sensitive layer swells and stretches itself by bonding with water molecules through the hydrophilic group.

5. A temperature and humidity feedback module according to claim 3, characterized in that: The humidity sensitive layer is made of a flexible hydrophilic material, the inductive transition layer and the circuit base layer are both made of flexible materials, and the temperature sensitive conductive layer and the conductive layer are both made of flexible conductive materials; The flexible hydrophilic material and the flexible conductive material are both transformed from the flexible material; The other end of the power supply is electrically connected to one end of the flexible temperature and humidity sensing element and is integrally formed.

6. A temperature and humidity feedback module according to claim 1, characterized in that: The other end of the temperature wireless switch leads the first contact line to the top of the temperature and humidity sensing element; the distance between the first contact line and the flexible temperature and humidity sensing element is positively correlated with the triggering temperature of the temperature wireless switch; The other end of the humidity wireless switch leads the second contact line to the bottom of the temperature and humidity sensing element; the distance between the second contact line and the flexible temperature and humidity sensing element is positively correlated with the triggering humidity of the humidity wireless switch; The temperature and humidity sensing element, the first contact circuit and the second contact circuit are installed on the same substrate.

7. A method for manufacturing a temperature and humidity feedback module, characterized in that: Used to manufacture the temperature and humidity feedback module according to claim 3; comprising the following steps: A1: According to the circuit path of the temperature and humidity feedback module circuit diagram and the preset shape of the flexible temperature and humidity sensing element, the flexible non-metallic conductive film is cut to obtain a circuit layout in which the flexible temperature and humidity sensing element and the conductive circuit are integrally formed; A2: In the circuit layout, the lower surface of the flexible non-metallic conductive film is transformed so that the flexible non-metallic conductive film is layered into upper and lower layers to form a conductive circuit; the upper layer is used as the circuit base layer, and the lower layer is used as the conductive layer; A3: In the circuit layout, the molecular bonds on the upper surface of the flexible non-metallic conductive film located at the flexible temperature and humidity sensing element are destroyed, so that the flexible non-metallic conductive film is divided into upper, middle and lower layers to form a flexible temperature and humidity sensing element; the upper layer is used as a humidity sensitive layer, the middle layer is used as a sensing transition layer, and the lower layer is used as a temperature sensitive conductive layer; A4: Connect the temperature wireless switch, humidity wireless switch and power supply to the corresponding positions in the circuit diagram.

8. The method for manufacturing a temperature and humidity feedback module according to claim 7, characterized in that: In the step A1: using a laser device to cut the flexible non-metallic conductive film; In the step A2: a laser device is used to irradiate the lower surface of the flexible non-metallic conductive film for conversion processing.

9. The method for manufacturing a temperature and humidity feedback module according to claim 7, characterized in that: In the step A3: a strong alkaline solution is used to destroy the molecular bonds on the upper surface of the flexible non-metallic conductive film located at the flexible temperature and humidity sensing element.

10. A plant growth environment control system, characterized in that: It comprises at least one temperature and humidity feedback module according to any one of claims 1 to 4; it also comprises a central controller, at least one dehumidification device and at least one cooling device; The temperature and humidity feedback module is wirelessly connected to the central controller, and the dehumidification device and the cooling device are both electrically connected to the central controller; One of the temperature and humidity feedback modules establishes a trigger association with at least one of the dehumidification devices and one of the cooling devices; The central controller is used to start the cooling device, or start the cooling device corresponding to the plant cultivation, when receiving the feedback signal from the temperature wireless switch; It is also used to start the dehumidification device, or start the dehumidification device corresponding to the plant cultivation, when receiving the feedback signal of the humidity wireless switch.

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