Circuit board assembly and bonding method thereof
By using electrical connection structures of conductive posts, convex branches and conducting torches in circuit board components, the problem of insufficient mechanical performance of radio frequency connectors is solved, and more stable signal transmission and reduced production costs are achieved.
Patent Information
- Application Number
- CN202311394241.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2023-10-25
- Publication Date
- 2025-04-25
AI Technical Summary
The connection between existing RF antennas or circuit boards and motherboards depends on the mechanical properties of the RF connectors, which are prone to damage due to collision or fall, affecting the signal transmission effect and increasing production costs.
An electrical connection structure is adopted that includes a conductive post, a convex branch and a conducting torch. The conductive post is inserted in the conducting torch. The convex branch moves in the channel to achieve a tight connection, and a conductive material and insulating glue are used to enhance the connection stability.
Improves the bonding between circuit board components, enhances resistance to collisions and falls, reduces failure rate and signal transmission impacts, and reduces production costs.
Smart Images
Figure CN119893831A_ABST
Abstract
Description
Technical Field
[0001] The present disclosure relates to a circuit board assembly and a method for joining the same. Background Art
[0002] In current consumer electronic products, the connection between the RF antenna (or circuit board) and the motherboard mostly uses a RF connector (Radio Frequency Connector) and a transmission line (Transmission Line), and the mechanical connection between the RF connectors is used to perform bidirectional / unidirectional signal transmission between the RF antenna (or circuit board) and the motherboard. However, this connection method relies on the mechanical properties of the RF connectors (for example, the number of plug-in and unplug times, the contact reliability of the connection, etc.). If the consumer electronic product is hit or dropped during use, the RF connector may become loose or damaged, affecting the contact reliability of the connection, thereby affecting the signal transmission effect between the RF antenna (or circuit board) and the motherboard. In addition, the additional RF connectors and transmission lines also increase the overall production cost. Summary of the invention
[0003] Therefore, the present application is to provide a circuit board assembly, which includes: a first circuit board, a second circuit board and an electrical connection structure. The second circuit board includes a solder pad. The electrical connection structure is used to electrically connect the first circuit board and the second circuit board, and includes: a conductive column, at least one protrusion and a conductive tube. The conductive column is arranged on the first circuit board and has an end face and a side surface connecting the end face. At least one protrusion is arranged on the side surface. The conductive tube is arranged on the second circuit board and surrounds the solder pad, wherein the conductive tube includes at least one groove. After the electrical connection structure electrically connects the first circuit board and the second circuit board, the conductive column is inserted into the conductive tube, the protrusion is located in the groove, and the end face faces the solder pad.
[0004] According to the circuit board assembly of the present application, the conductive tube does not contact the solder pad, the conductive column is electrically connected to the solder pad and does not contact the conductive tube, and a conductive material is included between the conductive column and the solder pad, and the conductive material includes conductive glue and solder paste.
[0005] According to the circuit board assembly of the present application, the number of protrusions is greater than or equal to the number of slots, and when the electrical connection structure electrically connects the first circuit board and the second circuit board, the protrusion moves along the slot to insert the conductive column into the conductive tube.
[0006] According to the circuit board assembly of the present application, the conductive tube has an annular end face. After the electrical connection structure electrically connects the first circuit board and the second circuit board, the annular end face faces the first circuit board, wherein each of the grooves includes a groove opening located on the annular end face, so that the protrusion enters the groove from the groove opening.
[0007] The circuit board assembly according to the present application further includes insulating glue, wherein the insulating glue covers the conductive column and is distributed in the conductive cylinder.
[0008] According to the circuit board assembly of the present application, the channel includes: at least one straight channel and at least one curved channel. The at least one straight channel extends in a direction parallel to the axis of the conductive tube. The at least one curved channel is connected to the straight channel, wherein each of the curved channels has an end, and after the electrical connection structure electrically connects the first circuit board and the second circuit board, the protrusion contacts the end.
[0009] According to the circuit board assembly of the present application, the channel further includes: a movable opening communicating with the straight channel and the curved channel.
[0010] The present application provides a method for joining a circuit board assembly, which comprises: forming a conductive column on a first circuit board; setting at least one protrusion on the side of the conductive column; forming a conductive tube on a second circuit board, wherein the conductive tube surrounds a solder pad of the second circuit board and comprises at least one groove; and inserting the conductive column into the conductive tube; wherein during the process of inserting the conductive column into the conductive tube, the protrusion is moved from a groove opening of the groove into the groove and moves along the groove to at least one end of the groove.
[0011] The bonding method of the circuit board assembly according to the present application also includes: forming a conductive material between the solder pad and the conductive column; and coating an insulating glue on the side of the second conductive column to tightly bond the conductive column to the conductive tube.
[0012] According to the bonding method of the circuit board assembly of the present application, forming a channel includes: forming at least one straight channel on the side of the conductive tube, wherein the straight channel extends in a direction parallel to the axis of the conductive tube; and forming at least one curved channel on the side of the conductive tube, wherein the curved channel connects to the straight channel. BRIEF DESCRIPTION OF THE DRAWINGS
[0013] In order to make the above features, advantages and embodiments of the present application more understandable, the attached drawings are described as follows:
[0014] Figure 1 is a side view of a circuit board assembly according to some embodiments of the present application;
[0015] Figure 2A and Figure 2B They are respectively a schematic diagram and a top view of a conductive column according to some embodiments of the present application;
[0016] Figure 3A and Figure 3B They are respectively a side view and a top view of a conductive tube and a second circuit board according to some embodiments of the present application;
[0017] Figure 4A and Figure 4B are schematic diagrams of electrical connection structures according to other embodiments of the present application; and
[0018] FIG. 5A to FIG. 5H The present invention is a flow chart of a method for bonding a circuit board assembly according to some embodiments of the present application. DETAILED DESCRIPTION
[0019] The following application provides many different embodiments or examples for realizing different features of the provided subject matter. Specific examples of components and configurations are described below to simplify the present application. Of course, the examples are merely examples and are not intended to be limiting. For example, in the following description, a first feature is formed on or above a second feature, which may include an embodiment in which the first feature and the second feature are directly in contact with each other, and may also include an embodiment in which an additional feature can be formed between the first feature and the second feature so that the first feature and the second feature are not in direct contact with each other. In addition, the present application may repeat reference numbers and / or text in various examples. This repetition is for the purpose of simplicity and clarity and does not itself limit the relationship between the various embodiments and / or components discussed.
[0020] Secondly, in order to clearly present the technical features of this case, the dimensions (such as length, width, thickness and depth) of the elements (such as layers, films, substrates and regions, etc.) in the drawings are not drawn in proportion. Therefore, the description and explanation of the embodiments below are not limited to the dimensions and shapes presented by the elements in the drawings, but should cover the dimensions, shapes and deviations thereof caused by actual processes and / or tolerances. For example, the flat surfaces shown in the drawings may have rough and / or nonlinear features, while the acute angles shown in the drawings may be rounded. Therefore, the elements presented in the drawings of this case are mainly for illustration, and are not intended to accurately depict the actual shapes of the elements, nor are they intended to limit the claims of this case.
[0021] Please refer to Figure 1 , Figure 1 FIG. 1 is a schematic diagram of a circuit board assembly 100 according to some embodiments of the present application. The circuit board assembly 100 includes a first circuit board 110, a second circuit board 120, and an electrical connection structure 130. The second circuit board 120 includes a solder pad 121. The electrical connection structure 130 includes a conductive column 131 disposed on the first circuit board 110, a conductive cylinder 132 disposed on the second circuit board 120, and at least one protrusion 133. Figure 1As shown, when the electrical connection between the first circuit board 110 and the second circuit board 120 is realized, the conductive column 131 is inserted into the conductive cylinder 132, and the conductive column 131 and the conductive cylinder 132 contain an insulating glue 140. The insulating glue 140 covers the conductive column 131 and is distributed in the conductive cylinder 132. A plurality of protrusions 133 are located in the groove 132a of the conductive cylinder 132, and the end surface 132b of the conductive column 131 facing the second circuit board 120 is electrically connected to the pad 121.
[0022] Please refer to Figure 2A and Figure 2B , Figure 2A and Figure 2B The following further illustrates a schematic diagram and a top view of a conductive column 131 according to some embodiments of the present application. The conductive column 131 has two end surfaces 131b and a side surface 131c connecting the two end surfaces 131b. In this embodiment, the conductive column 131 may be in the shape of a cylinder, so the side surface 131c may be a cylindrical surface. The protrusions 133 are disposed on the side surface 131c of the conductive column 131, and the number of the protrusions 133 is not limited to Figure 2A and Figure 2B The quantity shown in .
[0023] Please refer to Figure 3A and Figure 3B , Figure 3A and Figure 3B Further depicted are side views and top views of the conductive tube 132 and the second circuit board 120 according to some embodiments of the present application. The conductive tube 132 includes a groove 132a and an annular end surface 132b. The groove 132a extends along the inner side wall of the conductive tube 132 to the outer side wall of the conductive tube 132. The groove 132a includes a groove opening 132c, three straight channels 132d, two curved channels 132e and a movable opening 132g.
[0024] The straight channel 132d extends in a direction parallel to the axis O-O' of the conductive cylinder 132. The curved channel 132e is connected to the straight channel 132d and extends along the directrix on the side wall of the conductive cylinder 132. Since the conductive column 131 is in the shape of a cylinder, the directrix may be an arc and perpendicular to the axis O-O'. The curved channel 132e and the movable opening 132g have corresponding ends 132f. In some embodiments, the number of protrusions 133 may be greater than or equal to the number of grooves 132a. The movable opening 132g is connected to the straight channel 132d and the curved channel 132e, and provides additional movement space for the protrusion 133 in the groove 132a during the process of the protrusion 133 moving along the groove 132a to the final position (e.g., the end 132f).
[0025] In some embodiments, more or fewer slots 132a, straight channels 132d, curved channels 132e, and movable openings 132g may be included, and the present application is not limited thereto. In some embodiments, the diameter of the conductive post 131 is smaller than the inner diameter of the conductive tube 132, so that a clearance fit can be formed between the conductive post 131 and the conductive tube 132. In this way, even if the slot 132a of the conductive tube 132 does not have a slot opening 132c, the conductive post 131 can still be placed in the conductive tube 132. Afterwards, the conductive post 131 or the conductive tube 132 is moved so that the conductive post 131 and the conductive tube 132 can move relative to each other, so that the protrusion 133 can be inserted into the slot 132a and moved to the final position (for example, the end 132f).
[0026] Please refer to Figure 4A and Figure 4B , Figure 4A and Figure 4B Further schematic diagrams of the electrical connection structure 130 according to some other embodiments of the present application are shown, wherein Figure 4A is a schematic diagram of a conductive column 131, Figure 4B 1 is a side view of the conductive tube 132. The electrical connection structure 130 includes a conductive column 131, a conductive tube 132 and two protrusions 133. The two protrusions 133 are disposed on the side 131c of the conductive column 131. The cylindrical side of the conductive tube 132 has two grooves 132a. When the conductive column 131 is inserted into the conductive tube 132, the four protrusions 133 enter the groove 132a from the corresponding groove openings 132c and move along the straight channel 132d and the curved channel 132e. Finally, the protrusions 133 move to the corresponding ends 132f of the curved channel 132e, so that the conductive column 131 can be inserted into the conductive tube 132.
[0027] It should be understood that any number and shape of protrusions 133 and grooves 132a are within the scope of the present application. In some embodiments, the diameter of the conductive column 131 is smaller than the inner diameter of the conductive tube 132, so that the conductive column 131 and the conductive tube 132 are formed to form a clearance fit. Therefore, the groove 132a of the conductive tube 132 may not have a groove opening 132c, and the conductive column 131 can still be placed in the conductive tube 132 first, and then the protrusion 133 is moved along the groove 132a to the final position (for example, the end 132f).
[0028] Based on the above description of each component in the circuit board assembly 100, after the electrical connection structure 130 electrically connects the first circuit board 110 and the second circuit board 120, the conductive pillar 131 will be inserted into the conductive cylinder 132, and the protruding branch 133 will be located at the corresponding end 132f in the groove 132a, and the end surface 132b of the conductive pillar 131 facing the second circuit board 120 will be electrically connected to the pad 121 on the second circuit board 120. In the process of the electrical connection structure 130 electrically connecting the first circuit board 110 and the second circuit board 120, the protruding branch 133 enters the groove 132a from the groove opening 132c and moves along the straight channel 132d and the curved channel 132e, and finally the protruding branch 133 moves to the corresponding end 132f of the curved channel 132e, so that the conductive pillar 131 can be inserted into the conductive cylinder 132.
[0029] Please refer to FIG. 5A to FIG. 5H ,based on Figure 2A and Figure 3A The conductive pillar 131 and the conductive cylinder 132 are described in detail in FIG. FIG. 5A to FIG. 5H A flow chart of a method for bonding a circuit board assembly 100 according to some embodiments of the present application is shown. FIG. 5A to FIG. 5H So Figure 1 The electrical connection structure 130 is shown as an example, but Figure 4A and Figure 4B The bonding method between the conductive pillar 131 and the conductive tube 132 is similar to FIG. 5A to FIG. 5H In addition, in order to clearly show the connection between the conductive column 131 and the conductive tube 132, FIG. 5A to FIG. 5H Other components (such as the first circuit board 110 and the second circuit board 120 ) and details connected to the conductive pillar 131 and the conductive cylinder 132 are omitted, and only the composition and connection relationship of each component in the circuit board assembly are described in words below.
[0030] In the bonding method of the circuit board assembly 100, first, a conductive column 131 is formed on the first circuit board 110. The material of the conductive column 131 includes but is not limited to pure metals such as copper, silver, nickel, chromium, or the aforementioned various metal alloys, wherein the conductive column 131 can be formed by electroplating. Alternatively, the conductive column 131 can also be a copper column soldered on the first circuit board 110. Afterwards, at least one protrusion 133 is provided on the side of the conductive column 131. The protrusion 133 is a non-conductive material, i.e., an insulator, which can be formed by 3D printing or mold forming. Alternatively, the protrusion 133 and the conductive column 131 can be completed separately, and then the protrusion 133 is fixed to the side 131c of the conductive column 131 by adhesive.
[0031] Next, a conductive tube 132 is formed on the second circuit board 120, wherein the conductive tube 132 surrounds the solder pad 121 of the second circuit board and does not contact the solder pad 121. The material of the conductive tube 132 includes but is not limited to pure metals such as copper, silver, nickel, chromium, or the aforementioned metal alloys. The conductive tube 132 can be formed by electroplating.
[0032] Then, at least one groove 132a is formed on the cylindrical side of the conductive tube 132. The groove 132a includes a straight channel 132d extending in a direction parallel to the axis of the conductive tube 132, a curved channel 132e connecting the straight channel 132d and extending along the directrix on the side wall of the conductive tube 132, and a movable opening 132g connecting the straight channel 132d and the curved channel 132e. The groove 132a can be formed by laser ablation or wet etching, etc., but the present application is not limited thereto.
[0033] Afterwards, a conductive material is coated, printed or dipped on the bottom end surface 131b of the conductive column 131, so that an electrical connection between the bottom end surface 131b of the conductive column 131 and the pad 121 can be provided in a subsequent step. The conductive material is, for example, conductive glue, solder paste or silver glue. Afterwards, an insulating glue 140, such as epoxy resin, is coated on the surface of the conductive cylinder 132. The insulating glue 140 covers the conductive column 131 and is distributed in the conductive cylinder 132, so that the conductive cylinder 132 and the conductive column 131 can be tightly joined in a subsequent step.
[0034] Please refer to Figure 5A Next, align the conductive pillar 131 on the first circuit board 110 with the conductive tube 132 on the second circuit board 120, align the lowest protrusion 133 of the conductive pillar 131 with the slot opening 132c of the conductive tube 132, and insert the conductive pillar 131 downward until the lowest protrusion 133 passes through the first straight channel 132d and reaches the movable opening 132g.
[0035] Please refer to Figure 5B Then, the conductive post 131 is rotated so that the second protrusion 133 of the conductive post 131 is aligned with the slot opening 132c and enters the slot 132a of the conductive tube 132 from the slot opening 132c. Due to the rotation of the conductive post 131, the lowermost protrusion 133 moves to the rightmost end of the movable opening 132g.
[0036] Please refer to Figure 5C Then, the conductive column 131 is vertically inserted into the conductive tube 132, so that the bottom protrusion 133 of the conductive column 131 contacts the lower right end of the movable opening 132g. At this time, the second protrusion 133 of the conductive column 131 passes through the first linear channel 132d and reaches the movable opening 132g.
[0037] Please refer to Figure 5DThen, the conductive pillar 131 is rotated again so that the lowest protrusion 133 of the conductive pillar 131 is aligned with the second linear channel 132d, and the second protrusion 133 moves to the leftmost position of the movable opening 132g (ie, the end 132f of the movable opening 132g).
[0038] Please refer to Figure 5E Then, the conductive pillar 131 is inserted into the conductive tube 132, so that the lowermost protrusion 133 passes through the second straight channel 132d and reaches the first curved channel 132e. At this time, the second protrusion 133 of the conductive pillar 131 abuts against the lower left end of the movable opening 132g, and the third protrusion 133 of the conductive pillar 131 also abuts against the annular end surface 132b of the conductive tube 132.
[0039] Please refer to Fig. 5F Then, the conductive pillar 131 is rotated again so that the second protrusion 133 of the conductive pillar 131 is aligned with the second linear channel 132d, the third protrusion 133 is aligned with the first linear channel 132d, and the lowest protrusion 133 moves along the first curved channel 132e to the end of the first curved channel 132e.
[0040] Please refer to Figure 5G Then, the conductive pillar 131 is inserted into the conductive tube 132, so that the lowermost protrusion 133 passes through the third straight channel 132d to reach the second curved channel 132e. At this time, the second protrusion 133 of the conductive pillar 131 passes through the second straight channel 132d to reach the first curved channel 132e, and the third protrusion 133 of the conductive pillar 131 passes through the first straight channel 132d to reach the movable opening 132g.
[0041] Please refer to Figure 5H Finally, the conductive pillar 131 is rotated again, so that the bottom protrusion 133 of the conductive pillar 131 abuts against the end 132f of the second curved channel 132e, the second protrusion 133 abuts against the end 132f of the first curved channel 132e, and the third protrusion 133 abuts against the end 132f of the movable opening 132g. At this point, the first circuit board 110 and the second circuit board 120 can be electrically connected to each other through the conductive pillar 131 formed on the first circuit board 110 and the conductive cylinder 132 formed on the second circuit board 120.
[0042] It should be understood that although the above-mentioned embodiment of the present application only discloses the electrical connection between the first circuit board 110 and the second circuit board 120, in fact, more circuit boards may be included, and the electrical connection between them may be realized by using the electrical connection structure 130. In some embodiments, the electrical connection structure 130 may not only be used as a connection medium between the first circuit board 110 and the second circuit board 120, but may also be applied to a coaxial signal transmission line, and transmit signals after the conductive column 131 and the conductive cylinder 132 are tightly connected. In some embodiments, the shape of the groove 132a includes but is not limited to a right angle, a chamfered angle, an arc or a semicircle, etc., all of which are within the protection scope of the present application.
[0043] In summary, the circuit board assembly and the method for joining the same of the present application include an electrical connection structure for realizing electrical connection between circuit boards, wherein in the process of the electrical connection structure electrically connecting the first circuit board and the second circuit board, the protrusion of the conductive column moves along the groove in the conductive tube, so that the conductive column can finally be tightly inserted into the conductive tube. Compared with the existing method of electrically connecting the motherboard using RF connectors and transmission lines, the circuit board assembly of the present application uses a conductive column with protrusions and a conductive tube with grooves, which helps to improve the bonding force when the two are combined, avoiding consumer electronic products from malfunctioning due to collision or affecting the signal transmission effect. In addition, the electrical connection structure can be processed and formed together with the circuit board, omitting the additional RF connector and transmission line, which helps to reduce the overall production cost.
[0044] Although the present invention has been disclosed as above by way of embodiments, it is not intended to limit the present invention. Those skilled in the art may make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the content defined in the claims.
[0045]
Explanation of symbols
[0046] 100: Circuit board assembly
[0047] 110: First circuit board
[0048] 120: Second circuit board
[0049] 121: Solder pad
[0050] 130: Electrical connection structure
[0051] 131: Conductive column
[0052] 131b: End face
[0053] 131c: Side
[0054] 132: Conductive tube
[0055] 132a: Groove
[0056] 132b: End face
[0057] 132c: slot opening
[0058] 132d: Straight channel
[0059] 132e: Curved channel
[0060] 132f: end
[0061] 132g:Active opening
[0062] 133:Protruding branches
[0063] 140: Insulation glue
[0064] O-O': axis line.
Claims
1. A circuit board assembly, characterized in that: Include: a first circuit board; A second circuit board comprising a solder pad; and An electrical connection structure, used to electrically connect the first circuit board and the second circuit board, and comprising: A conductive column, disposed on the first circuit board, and having an end surface and a side surface connected to the end surface; At least one protruding branch is disposed on the side surface; as well as A conductive tube, disposed on the second circuit board and surrounding the solder pad, wherein the conductive tube comprises at least one groove; After the electrical connection structure electrically connects the first circuit board and the second circuit board, the conductive column is inserted into the conductive tube, the protruding branch is located in the groove, and the end surface faces the welding pad.
2. The circuit board assembly according to claim 1, wherein the conductive tube does not contact the soldering pad, the conductive column is electrically connected to the soldering pad and does not contact the conductive tube, and wherein a conductive material is contained between the conductive column and the soldering pad, and the conductive material comprises conductive glue and solder paste.
3. The circuit board assembly according to claim 1, wherein the number of the protrusions is greater than or equal to the number of the grooves, and in the process of the electrical connection structure electrically connecting the first circuit board and the second circuit board, the protrusion moves along the groove in the groove so that the conductive column is inserted into the conductive tube.
4. The circuit board assembly according to claim 1, wherein the conductive tube has an annular end face, and after the electrical connection structure electrically connects the first circuit board and the second circuit board, the annular end face faces the first circuit board, and each of the grooves includes a groove opening located on the annular end face, so that the protrusion enters the groove from the groove opening. 5 . The circuit board assembly according to claim 1 , further comprising insulating glue, wherein the insulating glue covers the conductive column and is distributed in the conductive cylinder.
6. The circuit board assembly of claim 1, wherein the channel comprises: At least one linear channel extending in a direction parallel to the axis of the conductive tube; and At least one curved channel is connected to the linear channel, wherein each of the curved channels has an end, and after the electrical connection structure electrically connects the first circuit board and the second circuit board, the protrusion contacts the end.
7. The circuit board assembly of claim 6, wherein the channel further comprises: The movable opening is communicated with the straight channel and the curved channel.
8. A method for bonding a circuit board assembly, characterized in that: Include: forming a conductive column on a first circuit board; At least one protrusion is disposed on the side surface of the conductive column; forming a conductive tube on a second circuit board, wherein the conductive tube surrounds a solder pad of the second circuit board and comprises at least one groove; and Inserting the conductive column into the conductive cylinder; When the conductive column is inserted into the conductive tube, the protruding branch is moved from the slot opening of the slot into the slot and moves along the slot to at least one end of the slot.
9. The bonding method according to claim 8, further comprising: forming a conductive material between the pad and the conductive column; and Insulating glue is applied to the side surface of the second conductive column to tightly engage the conductive column with the conductive tube.
10. The bonding method according to claim 8, wherein forming the groove comprises: At least one straight channel is formed on the side of the conductive tube, wherein the straight channel extends in a direction parallel to the axis of the conductive tube; and At least one curved channel is formed on the side surface of the conductive tube, wherein the curved channel is connected to the linear channel.