Electronic component
By providing a second through-hole conductor in the electronic component, the non-functional pad is electrically connected to the inner electrode and forming a nail-type structure, the problems of low welding and adhesion of the suspended end pad are solved, and the welding stability and electrical yield are improved.
Patent Information
- Application Number
- CN202411821065.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-11
- Publication Date
- 2025-04-25
AI Technical Summary
The welding properties and adhesion of the suspended end pads in existing electronic components are low, resulting in low plating efficiency and thin coating, which affects the welding properties and electrical yield.
By providing a second through-hole conductor inside the base body, the non-functional pad is electrically connected to the first inner electrode, and embedded into the base body through the second through-hole conductor, forming a nail-type structure to improve the adhesion of the non-functional pad.
It improves the welding property and adhesion of the suspended end pads, enhances the welding stability of the pads and PCB boards, and improves the overall performance of electronic components.
Smart Images
Figure CN119893832A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the field of electronic components, and in particular to an electronic component. Background Art
[0002] With the increasing demand for high-reliability electronic components in harsh application environments such as vehicles and base stations, improving product reliability and yield is the key to market competitiveness.
[0003] like Figures 1 to 3 As shown, in the electronic components packaged with bottom pads, due to the influence of factors such as design space and designers, the surface pad structure design in the device will have a suspended end design in which some pads are not connected to other pads. This pad is usually called a suspended end pad 11. It is easy for the device to be electroplated with nickel tin. The probability of the suspended end pad 11 contacting the charge is small. Therefore, the plating efficiency of the suspended end pad 11 is low and the plating layer is thinner than that of the non-suspended end pad (such as the ground pad 12, the input pad 13, and the output pad 14), which affects the weldability of the product. The uneven pad causes the device to have poor contact with the PCB when sorting the electrical properties, resulting in a decrease in the electrical yield. In addition, the suspended end pad 11 is not connected to the internal electrode 15, and it is easy for the adhesion performance of the suspended end pad 11 to be worse than that of the non-suspended end pad, which affects the overall adhesion of the product.
[0004] In addition, there is also an electronic component in which the two ends of the internal electrode usually extend to the side wall of the substrate, and the functional pad on the bottom wall of the substrate is electrically connected to the end of the internal electrode by silvering the surface of the substrate. This not only complicates the manufacturing process, but also the electrical connection stability between the functional pad and the internal electrode is poor, and it is easy to cause waste of materials. Summary of the invention
[0005] A first object of the present invention is to provide an electronic component capable of improving the solderability and adhesion of a suspended end.
[0006] A second object of the present invention is to provide another electronic component capable of improving the solderability and adhesion of the suspended end.
[0007] To achieve the above-mentioned first purpose, the present invention provides an electronic component, including a substrate, a first internal electrode, a first through-hole conductor, a functional pad and a non-functional pad; the first internal electrode is located in the substrate, and the functional pad and the non-functional pad are both located outside the substrate; the first internal electrode and the functional pad are electrically connected through the first through-hole conductor; the electronic component also includes a second through-hole conductor, which extends from the inside of the substrate to the surface of the substrate and then is connected to the non-functional pad; the non-functional pad and the first internal electrode are electrically connected through the second through-hole conductor.
[0008] As can be seen from the above scheme, the electronic component of the present invention electrically connects the non-functional pad to the first internal electrode through the second through-hole conductor to conduct the non-functional pad to the functional pad, thereby improving the plating efficiency and solving the problem of low weldability and adhesion caused by the suspended end pad in the existing electronic components. At the same time, since the second through-hole conductor is connected to the non-functional pad, the second through-hole conductor is embedded in the substrate, so that the second through-hole conductor and the non-functional pad form a nail-like structure together, further improving the adhesion of the non-functional pad and ensuring the stability of the pad of the electronic component and the PCB board. At the same time, the second through-hole conductor is located inside the substrate to avoid affecting the overall appearance of the electronic component.
[0009] A preferred solution is that the functional pad is a ground pad.
[0010] It can be seen that the functional pad is a ground pad, the first inner electrode is a ground electrode, and the non-functional pad is electrically connected to the ground electrode.
[0011] A preferred solution is that the height of the second through-hole conductor is equal to that of the first through-hole conductor; and / or the second through-hole conductor and the first through-hole conductor have the same shape and the same cross-sectional area as that of the first through-hole conductor.
[0012] It can be seen that the structure of the second through-hole conductor is completely the same as that of the first through-hole conductor, which can simplify the manufacturing process.
[0013] In a preferred solution, the height of the second through-hole conductor is in the range of 5 um to 200 um.
[0014] It can be seen from this that a suitable height of the second through-hole conductor can be selected according to the distance between the first internal electrode and the non-functional pad to ensure a stable connection between the two.
[0015] A preferred solution is that the cross-sectional area of the second through-hole conductor is smaller than the area of the corresponding non-functional pad.
[0016] It can be seen that the second through-hole conductor only needs to realize the electrical connection between the non-functional pad and the first internal electrode, and the size does not need to be set too large, which can reduce the material consumption and reduce the cost.
[0017] In a preferred solution, the second through-hole conductor is cylindrical, and the diameter of the second through-hole conductor is in the range of 25 um to 200 um.
[0018] A preferred solution is that the electronic component further includes a second internal electrode, an input pad and an output pad; the second internal electrode is located in the substrate, and the input pad and the output pad are both electrically connected to the second internal electrode.
[0019] A preferred solution is that the number of non-functional pads is more than two, the number of second through-hole conductors is equal to the number of non-functional pads, and one second through-hole conductor is provided corresponding to one non-functional pad.
[0020] It can be seen that each non-functional pad can be electrically connected to the first internal electrode through the second through-hole conductor, thereby ensuring the overall solderability of the electronic component.
[0021] A preferred solution is that the extension direction of the second through-hole conductor is parallel to the extension direction of the first through-hole conductor.
[0022] It can be seen that each through-hole conductor is arranged inside the substrate, which can ensure the stability of the electrical connection between the inner electrode and the corresponding pad.
[0023] To achieve the above-mentioned second purpose, the present invention provides an electronic component, including a substrate, a first internal electrode, a first through-hole conductor, a non-functional pad and a functional pad; the first internal electrode is located in the substrate, and the non-functional pad and the functional pad are both located outside the substrate; the first internal electrode and the functional pad are electrically connected through the first through-hole conductor; the electronic component also includes a second through-hole conductor, which extends outward from the inside of the substrate to the surface of the substrate and then is connected to the non-functional pad, and the extension direction of the second through-hole conductor is parallel to the extension direction of the first through-hole conductor.
[0024] As can be seen from the above scheme, by arranging the second through-hole conductor connected to the non-functional pad inside the substrate, the second through-hole conductor is embedded in the substrate, so that the second through-hole conductor and the non-functional pad together form a nail-like structure, which improves the adhesion of the non-functional pad and ensures the stability of the soldering of the pad of the electronic component to the PCB board. At the same time, the second through-hole conductor is located inside the substrate to avoid affecting the overall appearance of the electronic component. In addition, each through-hole conductor is arranged inside the substrate, which can ensure the stability of the electrical connection between the inner electrode and the corresponding pad. BRIEF DESCRIPTION OF THE DRAWINGS
[0025] Figure 1 It is a perspective view of an existing electronic component from a first stereoscopic perspective.
[0026] Figure 2 It is a perspective view of an existing electronic component from a second stereoscopic perspective.
[0027] Figure 3 It is a perspective view of an existing electronic component from a top-down perspective.
[0028] Figure 4 It is a perspective view of the first embodiment of the electronic component of the present invention from a first stereoscopic viewing angle.
[0029] Figure 5It is a perspective view of the first embodiment of the electronic component of the present invention from a second stereoscopic viewing angle.
[0030] Figure 6 It is a perspective view from a top view of a first embodiment of an electronic component of the present invention.
[0031] Figure 7 It is a perspective view from the main viewing angle of the first embodiment of the electronic component of the present invention.
[0032] The present invention is further described below in conjunction with the accompanying drawings and embodiments. DETAILED DESCRIPTION
[0033] The first embodiment of electronic components:
[0034] See also Figures 4 to 7 The electronic component of this embodiment includes a substrate 21, a first internal electrode 22, a second internal electrode 23, a first through-hole conductor 24, a second through-hole conductor 25, a functional pad 26, a non-functional pad 27, an input pad 28 as an input port, and an output pad 29 as an output port. The electronic component of this embodiment is a filter or a coupler. The functional pad 26 of this embodiment is a ground pad.
[0035] The first inner electrode 22, the second inner electrode 23, the first through-hole conductor 24 and the second through-hole conductor 25 are all located inside the substrate 21, the functional pad 26, the non-functional pad 27, the input pad 28 and the output pad 29 are all located outside the substrate 21, the first inner electrode 22 is electrically connected to the functional pad 26 through the first through-hole conductor 24, the non-functional pad 27 is electrically connected to the first inner electrode 22 through the second through-hole conductor 25, the second through-hole conductor 25 extends from the inside of the substrate 21 to the surface of the substrate 21 and then connects to the suspended end pad. The input pad 28 and the output pad 29 are both electrically connected to the second inner electrode 23 through the third through-hole conductor 20.
[0036] The extension direction of the second through-hole conductor 25 and the extension direction of the third through-hole conductor 20 are both parallel to the extension direction of the first through-hole conductor 24. The height of the first through-hole conductor 24 and the height of the second through-hole conductor 25 are both within the range of 5um to 200um, and the height of the second through-hole conductor 25 is equal to the height of the first through-hole conductor 24. The second through-hole conductor 25 and the third through-hole conductor 20 have the same shape as the first through-hole conductor 24, and the cross-sectional area of the second through-hole conductor 25 and the cross-sectional area of the third through-hole conductor 20 are equal to the cross-sectional area of the first through-hole conductor 24. The structure of the second through-hole conductor 25 and the structure of the third through-hole conductor 20 are completely the same as the structure of the first through-hole conductor 24, which can simplify the manufacturing process.
[0037] In this embodiment, the second through-hole conductor 25 is cylindrical, and the diameter of the second through-hole conductor 25 is in the range of 25um to 200um. The cross-sectional area of the second through-hole conductor 25 is smaller than the area of the corresponding non-functional pad 27. The second through-hole conductor 25 only needs to realize the electrical connection between the non-functional pad 27 and the first internal electrode 22, and the size does not need to be set too large, which can reduce material usage and reduce costs.
[0038] In this embodiment, the number of non-functional pads 27 and the number of second through-hole conductors 25 are both two, and one second through-hole conductor 25 is provided corresponding to one non-functional pad 27. In other embodiments, the number of non-functional pads 27 may be one or more than two, the number of second through-hole conductors 25 is equal to the number of non-functional pads 27, and one second through-hole conductor 25 is provided corresponding to one non-functional pad 27, that is, each non-functional pad 27 can be electrically connected to the first internal electrode 22 through the second through-hole conductor 25, thereby ensuring the overall weldability of the electronic component.
[0039] As can be seen from the above, the electronic component of the present invention electrically connects the non-functional pad to the first internal electrode through the second through-hole conductor to conduct the non-functional pad to the functional pad, thereby improving the plating efficiency and solving the problem of low weldability and adhesion caused by the suspended end pad in the existing electronic components. At the same time, since the second through-hole conductor is connected to the non-functional pad, the second through-hole conductor is embedded in the substrate, so that the second through-hole conductor and the non-functional pad form a nail-like structure together, further improving the adhesion of the non-functional pad and ensuring the stability of the pad of the electronic component and the PCB board. At the same time, the second through-hole conductor is located inside the substrate to avoid affecting the overall appearance of the electronic component. Each through-hole conductor is arranged inside the substrate, which can ensure the stability of the electrical connection between the internal electrode and the corresponding pad.
[0040] The second embodiment of electronic components:
[0041] As an explanation of the second embodiment of the electronic component of the present invention, only the differences from the first embodiment of the electronic component described above are explained below.
[0042] In the electronic component of this embodiment, the height of the second through-hole conductor is smaller than that of the first through-hole conductor, and the upper end of the second through-hole conductor is not connected to the first internal electrode, that is, the second through-hole conductor does not electrically connect the non-functional pad to the first internal electrode.
[0043] As can be seen from the above, by arranging a second through-hole conductor connected to the non-functional pad inside the substrate, the second through-hole conductor is embedded in the substrate, so that the second through-hole conductor and the non-functional pad together form a nail-like structure, thereby improving the adhesion of the non-functional pad and ensuring the stability of welding between the pad of the electronic component and the PCB board.
[0044] In addition, the shapes, sizes, positions and materials of the first through-hole conductor, the second through-hole conductor and the third through-hole conductor can be changed as needed. For example, the cross-section of the through-hole conductor can also be rectangular, elliptical, polygonal or irregular, and the material of the through-hole conductor can be made of silver paste, copper foil or other metal materials. The shape, size and material of the second through-hole conductor can also be different from those of the first through-hole conductor and the third through-hole conductor. The above changes can also achieve the purpose of the present invention.
[0045] Finally, it should be emphasized that the above are only preferred embodiments of the present invention and are not intended to limit the present invention. For those skilled in the art, the present invention may have various changes and modifications. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.
Claims
1. An electronic component comprising a substrate, a first inner electrode, a first through-hole conductor, a functional pad and a non-functional pad; The first internal electrode is located inside the substrate, and the functional pad and the non-functional pad are both located outside the substrate; The first inner electrode is electrically connected to the functional pad through the first through-hole conductor; Features: The electronic component further includes a second through-hole conductor, which extends from the inside of the substrate to the surface of the substrate and then connects to the non-functional part; The non-functional pad is electrically connected to the first internal electrode through the second through-hole conductor.
2. The electronic component according to claim 1, characterized in that: The functional pad is a ground pad.
3. The electronic component according to claim 1, characterized in that: The height of the second through-hole conductor is equal to the height of the first through-hole conductor; and / or The second through-hole conductor has the same shape as the first through-hole conductor, and a cross-sectional area of the second through-hole conductor is equal to a cross-sectional area of the first through-hole conductor.
4. The electronic component according to any one of claims 1 to 3, characterized in that: The height of the second through-hole conductor is in the range of 5 um to 200 um.
5. The electronic component according to any one of claims 1 to 3, characterized in that: A cross-sectional area of the second through-hole conductor is smaller than an area of the corresponding non-functional pad.
6. The electronic component according to any one of claims 1 to 3, characterized in that: The second through-hole conductor is cylindrical, and a diameter of the second through-hole conductor is in a range of 25 um to 200 um.
7. The electronic component according to any one of claims 1 to 3, characterized in that: The electronic component also includes a second internal electrode, an input pad and an output pad; The second internal electrode is located in the substrate, and the input pad and the output pad are both electrically connected to the second internal electrode.
8. The electronic component according to any one of claims 1 to 3, characterized in that: The number of the non-functional pads is more than two, the number of the second through-hole conductors is equal to the number of the non-functional pads, and one second through-hole conductor is provided corresponding to one non-functional pad.
9. The electronic component according to any one of claims 1 to 3, characterized in that: An extending direction of the second through-hole conductor is parallel to an extending direction of the first through-hole conductor.
10. An electronic component comprising a substrate, a first internal electrode, a first through-hole conductor, a non-functional pad and a functional pad; The first internal electrode is located inside the substrate, and the non-functional pad and the functional pad are both located outside the substrate; The first inner electrode is electrically connected to the functional pad through the first through-hole conductor; Features: The electronic component further includes a second through-hole conductor, which extends outward from the inside of the substrate to the surface of the substrate and then connects to the non-functional pad. The extension direction of the second through-hole conductor is parallel to the extension direction of the first through-hole conductor.