SIP module, SIP module packaging method and electronic equipment

Abstract

The invention provides an SIP (Session Initiation Protocol) module, an SIP module packaging method and electronic equipment. The SIP module comprises a first IC (Integrated Circuit) carrier plate; a first electronic component and a second electronic component, wherein the first electronic component and the second electronic component are arranged on two opposite sides of the first IC carrier plate; a first packaging part and a second packaging part, the first packaging part is used for packaging the first electronic component, and the second packaging part is used for packaging the second electronic component; the first packaging part comprises a first groove, the first groove is provided with a first optical device, and the first optical device is electrically connected with the first IC carrier plate; the second packaging part comprises a second groove, a second optical device is installed in the second groove, and the second optical device is electrically connected with the first IC carrier plate. The application can better adapt to the miniaturization and microminiaturization requirements of the wearable electronic equipment.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic equipment processing, and more specifically, to a SIP module, a SIP module packaging method and an electronic equipment. Background Art

[0002] In the prior art, the SIP (System in Package) module of wearable electronic devices usually uses PCB (Printed Circuit Board) to integrate multiple electronic components. However, due to the size and structure of PCB, the SIP module using PCB cannot meet the needs of miniaturization and micro-miniaturization of wearable electronic devices.

[0003] Therefore, it is necessary to provide a new technical solution to solve the above technical problems. Summary of the invention

[0004] An object of the present invention is to provide a SIP module, a SIP module packaging method and a new technical solution for electronic equipment.

[0005] According to a first aspect of the present invention, a SIP module is provided, wherein the SIP module comprises:

[0006] The first IC carrier board;

[0007] A first electronic component and a second electronic component, wherein the first electronic component and the second electronic component are arranged on two opposite sides of the first IC carrier;

[0008] A first packaging part and a second packaging part, the first packaging part is used to package the first electronic component, and the second packaging part is used to package the second electronic component; the first packaging part includes a first groove, the first optical device is installed in the first groove, and the first optical device is electrically connected to the first IC carrier; the second packaging part includes a second groove, the second optical device is installed in the second groove, and the second optical device is electrically connected to the first IC carrier.

[0009] Optionally, it further includes a first conductive portion, and the first optical device is electrically connected to the first IC carrier through the first conductive portion.

[0010] Optionally, a second conductive portion is further included, and the second optical device is electrically connected to the first IC carrier via the second conductive portion.

[0011] Optionally, a second IC carrier is further included, and the second IC carrier is arranged between the second conductive part and the second optical device.

[0012] Optionally, a first non-packaging component is further included, wherein the first non-packaging component is arranged on a side of the first IC carrier close to the first packaging portion, and a first gap is formed between the first non-packaging component and the first packaging portion.

[0013] Optionally, a second non-encapsulation component is further included, wherein the second non-encapsulation component is disposed on a side of the first IC carrier close to the second encapsulation portion, and a second gap is provided between the second non-encapsulation component and the second encapsulation portion.

[0014] Optionally, it further includes a first metal plating layer and a second metal plating layer, wherein the first metal plating layer is used to cover the first packaging part, and the second metal plating layer is used to cover the second packaging part.

[0015] According to a second aspect of the present invention, there is provided a SIP module packaging method, which is applied to the SIP module as described in any one of the first aspects, wherein the SIP module packaging method comprises:

[0016] Disposing a first electronic component on a first IC carrier;

[0017] Encapsulating the first electronic component to form a first encapsulation portion on the first IC carrier;

[0018] Opening a first groove on the first packaging part, placing a first optical device in the first groove, and electrically connecting the first optical device to the first IC carrier;

[0019] Arrange a second electronic component on a side of the first IC carrier away from the first electronic component;

[0020] Encapsulating the second electronic component to form a second encapsulation portion on the first IC carrier;

[0021] A second groove is formed on the second packaging portion, a second optical device is disposed in the second groove, and the second optical device is electrically connected to the first IC carrier.

[0022] Optionally, opening a first groove on the first packaging portion, disposing a first optical device in the first groove, and electrically connecting the first optical device to the first IC carrier board comprises:

[0023] A conductive hole is formed on the first groove, and a conductive material is provided in the conductive hole to form a first conductive portion.

[0024] Optionally, after arranging a second electronic component on a side of the first IC carrier away from the first electronic component, before encapsulating the second electronic component to form a second encapsulation portion on the first IC carrier, the method further includes:

[0025] A second conductive portion is disposed on a side of the first IC carrier away from the first electronic component.

[0026] Optionally, after the second conductive portion is provided on a side of the first IC carrier away from the first electronic component, before the second electronic component is encapsulated to form a second encapsulation portion on the first IC carrier, the method further includes:

[0027] A second IC carrier is arranged on a side of the second conductive portion facing away from the first IC carrier.

[0028] Optionally, after a first groove is formed on the first packaging portion, a first optical device is disposed in the first groove, and the first optical device is electrically connected to the first IC carrier, the method further comprises:

[0029] A first non-packaging component is disposed on a side of the first IC carrier close to the first packaging portion.

[0030] Optionally, after a second groove is formed on the second packaging portion, a second optical device is disposed in the second groove, and the second optical device is electrically connected to the first IC carrier, the method further comprises:

[0031] A second non-packaging component is disposed on a side of the first IC carrier close to the second packaging portion.

[0032] Optionally, opening a first groove on the first packaging portion, disposing a first optical device in the first groove, and electrically connecting the first optical device to the first IC carrier board comprises:

[0033] A first metal plating layer is disposed on the first packaging portion.

[0034] Optionally, opening a second groove on the second packaging portion, disposing a second optical device in the second groove, and electrically connecting the second optical device to the first IC carrier board comprises:

[0035] A second metal plating layer is disposed on the second packaging portion.

[0036] According to a third aspect of the present invention, there is provided an electronic device, comprising the SIP module as described in any one of the first aspects.

[0037] The SIP module in the embodiment of the present application replaces the traditional PCB with the first IC carrier board, so that the SIP module has a smaller size, so that it can better meet the needs of miniaturization and micro-miniaturization of wearable electronic devices. In addition, the double-sided plastic sealing of the SIP module is achieved by the first packaging part and the second packaging part, so that the SIP module has higher structural strength and reliability, so that it can better adapt to different application scenarios of wearable electronic devices.

[0038] Other features and advantages of the present invention will become apparent from the following detailed description of exemplary embodiments of the present invention with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate embodiments of the invention and, together with the description, serve to explain the principles of the invention.

[0040] Figure 1 It is a front view of a SIP module in one embodiment of the present invention.

[0041] Figure 2 FIG. 1 is a top view of a SIP module in one embodiment of the present invention.

[0042] Figure 3 FIG. 1 is a bottom view of a SIP module according to an embodiment of the present invention.

[0043] Figure 4 It is a flow chart of a SIP module packaging method in one embodiment of the present invention.

[0044] Figure 5 It is a front view of a SIP module after a first electronic component is arranged on a first IC carrier board in one embodiment of the present invention.

[0045] Figure 6 It is a front view of the SIP module after packaging the first electronic component in one embodiment of the present invention.

[0046] Figure 7 It is a front view of the SIP module after a first groove is formed on the first packaging part in one embodiment of the present invention.

[0047] Figure 8 yes Figure 7 Top view of the .

[0048] Fig. 9 It is a front view of the SIP module after a conductive hole is formed on the first groove in one embodiment of the present invention.

[0049] Fig.10 yes Fig. 9 Top view of the .

[0050] Fig.11It is a front view of the SIP module after a conductive material is disposed in the conductive hole in one embodiment of the present invention.

[0051] Fig.12 yes Fig.11 Top view of the .

[0052] Fig.13 It is a front view of a SIP module after a second electronic component is disposed on a side of a first IC carrier away from a first electronic component in one embodiment of the present invention.

[0053] Fig.14 It is a front view of the SIP module after a second conductive portion is disposed on a side of the first IC carrier away from the first electronic component in one embodiment of the present invention.

[0054] Fig.15 It is a front view of a SIP module after a second IC carrier is arranged on a side of the second conductive portion facing away from the first IC carrier in one embodiment of the present invention.

[0055] Fig.16 It is a front view of the SIP module after packaging the second electronic component, the second conductive part and the second IC carrier in one embodiment of the present invention.

[0056] Fig.17 It is a front view of the SIP module after a second groove is formed on the second packaging part in one embodiment of the present invention.

[0057] Fig.18 yes Fig.17 Bottom view of .

[0058] Fig.19 It is a front view of a SIP module after a first metal plating layer is disposed on a first packaging portion and a second metal plating layer is disposed on a second packaging portion in one embodiment of the present invention.

[0059] Fig. 20 yes Fig.19 Top view of the .

[0060] Fig.21 yes Fig.19 Bottom view of .

[0061] Fig. 22 It is a front view of a SIP module after a first non-packaging component is disposed on a side of a first IC carrier close to a first packaging portion in one embodiment of the present invention.

[0062] Fig.23 It is a front view of a SIP module after a second non-packaging component is disposed on a side of a first IC carrier close to a second packaging portion in one embodiment of the present invention.

[0063] Description of reference numerals:

[0064] 1. First IC carrier; 2. First electronic component; 3. Second electronic component; 4. First packaging part; 401. First groove; 5. Second packaging part; 501. Second groove; 6. First optical device; 7. Second optical device; 8. First conductive part; 9. Second conductive part; 10. Second IC carrier; 11. First non-packaged part; 12. Second non-packaged part; 13. First metal coating; 14. Second metal coating; 15. First gap; 16. Second gap; 17. Conductive hole. DETAILED DESCRIPTION

[0065] Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that the relative arrangement of components and steps, numerical expressions and numerical values ​​set forth in these embodiments do not limit the scope of the present invention unless otherwise specifically stated.

[0066] The embodiments of the present application will be described in detail below, and examples of the embodiments are shown in the accompanying drawings. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and should not be understood as limiting the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without making creative work are within the scope of protection of the present application.

[0067] It should be noted that like reference numerals and letters refer to similar items in the following figures, and therefore, once an item is defined in one figure, it need not be further discussed in subsequent figures.

[0068] According to an embodiment of the present application, a SIP module is provided, the SIP module comprising a first IC (Integrated Circuit) carrier 1, a first electronic component 2, a second electronic component 3, a first packaging part 4 and a second packaging part 5, wherein the first electronic component 2 and the second electronic component 3 are arranged on two opposite sides of the first IC carrier 1; the first packaging part 4 is used to package the first electronic component 2, and the second packaging part 5 is used to package the second electronic component 3; the first packaging part 4 comprises a first groove 401, the first groove 401 is provided with a first optical device 6, and the first optical device 6 is electrically connected to the first IC carrier 1; the second packaging part 5 comprises a second groove 501, the second groove 501 is provided with a second optical device 7, and the second optical device 7 is electrically connected to the first IC carrier 1.

[0069] Specifically, Figures 1 to 3As shown, the SIP module described in the embodiment of the present application can be applied to wearable electronic devices, such as smart watches, smart glasses or smart bracelets, etc. The SIP module is a single standard package that preferentially assembles multiple active electronic components, passive devices, and devices such as MEMS or optical devices with different functions together to achieve certain functions.

[0070] The SIP module includes a first IC carrier board 1, a first electronic component 2 and a second electronic component 3. The first IC carrier board 1 is a circuit board with fine pitch and fine line width, which can effectively improve the wiring density and line width and line spacing accuracy of the SIP module. The first IC carrier board 1 can also be set as a thicker carrier board to effectively reduce the signal transmission path of the SIP module, thereby further improving the working performance of the SIP module; the first electronic component 2 includes passive devices such as integrated circuits, resistors, capacitors and inductors, and can be connected to the first IC carrier board 1 through surface mounting technology, wire bonding, flip-chip or crimping; the second electronic component 3 also includes passive devices such as integrated circuits, resistors, capacitors and inductors, and can also be connected to the side of the first IC carrier board 1 away from the first electronic component 2 through surface mounting technology, wire bonding, flip-chip or crimping. Compared with the SIP module in the prior art that uses PCB to integrate multiple electronic components, the first IC carrier board 1 used in the present application can effectively reduce the size of the SIP module in all directions, thereby better adapting to the needs of miniaturization and micro-miniaturization of wearable electronic devices.

[0071] The SIP module further includes a first packaging part 4 and a second packaging part 5, wherein the first packaging part 4 is used to package the first electronic component 2, and the second packaging part 5 is used to package the second electronic component 3. Therefore, since the first electronic component 2 and the second electronic component 3 are arranged on two opposite sides of the first IC carrier 1, the present application effectively realizes the double-sided plastic packaging of the SIP module through the packaging of the first packaging part 4 and the second packaging part 5, and makes the SIP module have higher structural strength and reliability, so that the wearable electronic device can better adapt to various application scenarios such as swimming pools, hot springs and sea water.

[0072] The first packaging part 4 is also provided with a first groove 401, and the second packaging part 5 is also provided with a second groove 501. Furthermore, since the SIP module also includes a first optical device 6 and a second optical device 7, the present application further reduces the size of the SIP module in all directions by installing the first optical device 6 in the first groove 401, installing the second optical device 7 in the second groove 501, and making the first optical device 6 and the second optical device 7 electrically connected to the first IC carrier 1, so that the SIP module can better adapt to the needs of miniaturization and microminiaturization of wearable electronic devices. Among them, the first optical device 6 and the second optical device 7 can both include optical heart rate sensors, blood oxygen sensors, ambient light and ultraviolet sensors, LED lights and other optical devices.

[0073] In addition, if Figure 2 and Figure 3 As shown, since the first optical device 6 of the present application is arranged in the first groove 401 of the first packaging part 4, and the second optical device 7 is arranged in the second groove 501 of the second packaging part 5, the first packaging part 4 and the second packaging part 5 can also realize electromagnetic shielding of the first optical device 6 and the second optical device 7, thereby further improving the stability and reliability of the use of the first optical device 6 and the second optical device 7.

[0074] In one embodiment, the SIP module further includes a first conductive portion 8 , and the first optical device 6 is electrically connected to the first IC carrier 1 via the first conductive portion 8 .

[0075] Specifically, in the embodiment of the present application, the first packaging part 4 is provided with a conductive hole 17 by a laser process, and the first conductive part 8 can be formed by placing a conductive material such as silver paste or copper in the conductive hole 17. Figure 1 As shown, one end of the first conductive portion 8 is electrically connected to the first IC carrier 1 , and the other end of the first conductive portion 8 extends to the first groove 401 and is electrically connected to the first optical device 6 disposed in the first groove 401 .

[0076] Therefore, the present application not only realizes the electrical connection between the first optical device 6 and the first IC carrier 1 through the provision of the first conductive portion 8, but also effectively ensures the stability and reliability of the electrical connection between the first optical device 6 and the first IC carrier 1.

[0077] In addition, since the conductive hole 17 is located on the first groove 401 of the first packaging part 4, the present application electrically connects the first optical device 6 and the first IC carrier 1 through the first conductive part 8, and also makes the electrical connection line between the first optical device 6 and the first IC carrier 1 always in the first packaging part 4, thereby effectively ensuring that the SIP module has a smaller size.

[0078] In one embodiment, the SIP module further includes a second conductive portion 9 , and the second optical device 7 is electrically connected to the first IC carrier 1 via the second conductive portion 9 .

[0079] Specifically, before packaging the second electronic component 3 to form the second packaging portion 5 , the SIP module described in the embodiment of the present application is further provided with a second conductive portion 9 on a side of the first IC carrier 1 close to the second electronic component 3 .

[0080] like Figure 1 As shown, the second conductive part 9 of the present application is a solder ball, and the solder ball can be electrically connected to the first IC carrier 1 by laser implantation or electroplating. The side of the solder ball facing away from the first IC carrier 1 is electrically connected to the connector, and the connector can be an organic IC carrier or a PCB. The side of the connector facing away from the solder ball is electrically connected to the second optical device 7.

[0081] Therefore, the present application not only realizes the electrical connection between the second optical device 7 and the first IC carrier 1 through the provision of the second conductive portion 9, but also effectively ensures the stability and reliability of the electrical connection between the second optical device 7 and the first IC carrier 1.

[0082] In one embodiment, the SIP module further includes a second IC carrier 10 , and the second IC carrier 10 is disposed between the second conductive portion 9 and the second optical device 7 .

[0083] Specifically, Figure 1 As shown, in the embodiment of the present application, one side of the second IC carrier 10 is electrically connected to the second conductive portion 9, and the other side of the second IC carrier 10 is electrically connected to the second optical device 7, thereby effectively realizing the electrical connection between the second optical device 7 and the first IC carrier 1, and ensuring the stability and reliability of the electrical connection of the second optical device 7.

[0084] Among them, the SIP module described in the present application can use FAM (Foil assist mold) process for plastic sealing when encapsulating the second electronic component 3 to form the second packaging part 5. That is, during plastic sealing, the present application first sets a layer of protective film on the second IC carrier 10, and then fills the plastic sealing material, so that after the plastic sealing is completed, the plastic sealing material on the second IC carrier 10 can be removed through the protective film, and the second IC carrier 10 is exposed.

[0085] In one embodiment, the SIP module further includes a first non-package component 11 , which is disposed on a side of the first IC carrier 1 close to the first package portion 4 , and a first gap 15 is defined between the first non-package component 11 and the first package portion 4 .

[0086] Specifically, Figure 1 and Figure 2 As shown, the first non-packaged component 11 of the embodiment of the present application includes various components or structural parts that are not suitable for plastic packaging, such as springs, connectors, MESM devices, motors, USB connectors, interfaces, etc. The first non-packaged component 11 can be arranged at both ends of the first IC carrier 1 along the first packaging part 4, and a first gap 15 is formed between the first non-packaged component 11 and the first packaging part 4.

[0087] Therefore, the present application effectively avoids electromagnetic interference between the first non-packaged part 11 and the first electronic component 2 by setting the first gap 15, and further ensures the performance of the SIP module.

[0088] In one embodiment, the SIP module further includes a second non-encapsulation component 12 , which is disposed on a side of the first IC carrier 1 close to the second encapsulation portion 5 , and a second gap 16 is defined between the second non-encapsulation component 12 and the second encapsulation portion 5 .

[0089] Specifically, Figure 1 and Figure 3 As shown, the second non-packaged component 12 of the embodiment of the present application includes various components or structural parts that are not suitable for plastic packaging, such as springs, connectors, MESM devices, motors, USB connectors, interfaces, etc. The second non-packaged component 12 can be arranged on the side of the first IC carrier 1 away from the first packaging part 4, and a second gap 16 is formed between the second packaging part 5 and the second non-packaged component 12.

[0090] Therefore, the present application effectively avoids electromagnetic interference between the second non-packaged part 12 and the second electronic component 3 by setting the second gap 16, and further ensures the performance of the SIP module.

[0091] In one embodiment, the SIP module further includes a first metal coating layer 13 and a second metal coating layer 14 , wherein the first metal coating layer 13 is used to cover the first packaging portion 4 , and the second metal coating layer 14 is used to cover the second packaging portion 5 .

[0092] Specifically, Figures 1 to 3 As shown, the material of the first metal plating layer 13 in the embodiment of the present application can be copper, gold, nickel, silver and other metals, or can be nickel-iron, iron-cobalt, nickel-cobalt and copper-tin and other metal alloys. The first metal plating layer 13 can be disposed on the first packaging portion 4 by electroplating, chemical plating or physical vapor deposition, so as to further improve the electromagnetic shielding effect between the first non-packaged part 11 and the first electronic component 2.

[0093] The material of the second metal coating 14 can be copper, gold, nickel, silver or other metals, or can be nickel-iron, iron-cobalt, nickel-cobalt, copper-tin or other metal alloys. The second metal coating 14 can be disposed on the second packaging portion 5 by electroplating, chemical electroplating or physical vapor deposition, so as to further improve the electromagnetic shielding effect between the second non-packaged part 12 and the second electronic component 3.

[0094] According to another embodiment of the present application, a SIP module packaging method is provided, which is applied to the SIP module as described in the embodiment of the present application, wherein: Figure 4 As shown, the SIP module packaging method includes the following steps S101 to S106:

[0095] S101, placing a first electronic component 2 on a first IC carrier 1;

[0096] Here, the first IC substrate 1 of the present application refers to an organic IC substrate, which has the advantages of low dielectric constant, low mass density, simple processing technology, high production efficiency and low cost, and can better meet the needs of miniaturization and micro-miniaturization of wearable electronic devices. The first electronic component 2 refers to passive devices such as integrated circuits, resistors, capacitors or inductors, and is an optional passive device, that is, one or more passive devices can be selected according to actual needs to be fixedly set on the first IC substrate 1, so as to realize various functions of the SIP module.

[0097] S102, packaging the first electronic component 2 to form a first packaging portion 4 on the first IC carrier 1;

[0098] Here, the first electronic component 2 of the present application can be packaged by using a step-by-step plastic packaging process or a selective plastic packaging process, and a first packaging portion 4 for packaging the first electronic component 2 is formed on the first IC carrier 1 .

[0099] S103, opening a first groove 401 on the first packaging portion 4, placing a first optical device 6 in the first groove 401, and electrically connecting the first optical device 6 to the first IC carrier 1;

[0100] Here, the first groove 401 of the present application can be formed on the first packaging part 4 by laser grooving, wet etching or deep silicon etching. The first optical device 6 can be an optical heart rate sensor, a blood oxygen sensor, an ambient light and ultraviolet sensor or an LED lamp.

[0101] It should be noted that, in the present application, the first optical device 6 can be disposed in the first groove 401 after the first groove 401 is formed on the first packaging portion 4. Fig. 22 As shown, the second packaging portion 5 may be provided with the second groove 501 before being provided in the first groove 401 .

[0102] S104, disposing a second electronic component 3 on a side of the first IC carrier 1 away from the first electronic component 2;

[0103] Here, the second electronic component 3 of the present application refers to a passive device such as an integrated circuit, a resistor, a capacitor or an inductor, and is an optional passive device, that is, one or more passive devices can be selected according to actual needs to be fixedly set on the first IC carrier 1, and together with the first electronic component 2, form a double-sided patch of the first IC carrier 1, so as to better realize the various functions of the SIP module.

[0104] S105, packaging the second electronic component 3 to form a second packaging portion 5 on the first IC carrier 1;

[0105] Here, the second electronic component 3 of the present application can be packaged using a step-by-step plastic packaging or a selective plastic packaging process, and a second packaging part 5 for packaging the second electronic component 3 is formed on the side of the first IC carrier 1 away from the first packaging part 4, thereby realizing double-sided plastic packaging of the SIP module together with the first packaging part 4.

[0106] S106 , opening a second groove 501 on the second packaging portion 5 , disposing a second optical device 7 in the second groove 501 , and electrically connecting the second optical device 7 to the first IC carrier 1 .

[0107] Here, the second groove 501 of the present application can be formed on the second packaging part 5 by laser grooving, wet etching or deep silicon etching. The second optical device 7 can be an optical heart rate sensor, a blood oxygen sensor, an ambient light and ultraviolet sensor or an LED lamp.

[0108] In one embodiment, Figures 5 to 23 The present application also provides another SIP module packaging method, the SIP module packaging method comprising:

[0109] S201, placing a first electronic component 2 on a first IC carrier 1;

[0110] like Figure 5 As shown, the first IC substrate 1 of the present application refers to an organic IC substrate, which has the advantages of low dielectric constant, low mass density, simple processing technology, high production efficiency and low cost, and can better meet the needs of miniaturization and micro-miniaturization of wearable electronic devices. The first electronic component 2 refers to passive devices such as integrated circuits, resistors, capacitors or inductors, and is an optional passive device, that is, one or more passive devices can be selected according to actual needs to be fixedly set on the first IC substrate 1, so as to realize various functions of the SIP module.

[0111] S202, packaging the first electronic component 2 to form a first packaging portion 4 on the first IC carrier 1;

[0112] like Figure 6 As shown, the first electronic component 2 of the present application can be packaged by using a step-by-step plastic packaging process or a selective plastic packaging process, and a first packaging portion 4 for packaging the first electronic component 2 is formed on the first IC carrier 1 .

[0113] S203, opening a first groove 401 on the first packaging part 4;

[0114] like Figure 7 and Figure 8 As shown, the first groove 401 of the present application can be formed on the first packaging part 4 by laser grooving, wet etching or deep silicon etching.

[0115] S204, forming a conductive hole 17 on the first groove 401, and providing a conductive material to the conductive hole 17 to form a first conductive portion 8,

[0116] like Figures 9 to 12As shown, the conductive hole 17 of the present application can be formed at the first groove 401 of the first packaging part 4 by a laser process or a TMV (Through Mold Via) process. The conductive hole 17 can be filled with conductive materials such as silver paste and copper to form a first conductive part 8, and the first conductive part 8 is used to electrically connect the first optical device 6 and the first IC carrier 1.

[0117] S205, disposing a second electronic component 3 on a side of the first IC carrier 1 away from the first electronic component 2;

[0118] like Fig.13 As shown, the second electronic component 3 of the present application refers to a passive device such as an integrated circuit, a resistor, a capacitor or an inductor, and is an optional passive device, that is, one or more passive devices can be selected according to actual needs to be fixedly set on the first IC carrier 1, and together with the first electronic component 2, form a double-sided patch of the first IC carrier 1, so as to better realize the various functions of the SIP module.

[0119] S206, disposing a second conductive portion 9 on a side of the first IC carrier 1 away from the first electronic component 2;

[0120] like Fig.14 As shown, the second conductive portion 9 of the present application is disposed on the side of the first IC carrier 1 away from the first electronic component 2 by laser ball implantation or electroplating.

[0121] S207 , disposing a second IC carrier 10 on a side of the second conductive portion 9 facing away from the first IC carrier 1 ;

[0122] like Fig.15 As shown, the second conductive part 9 of the present application is a solder ball, which can be electrically connected to the first IC carrier 1 by laser ball implantation or electroplating. Of course, the second conductive part 9 can also be other conductive structures such as copper wire and silver paste.

[0123] S208, packaging the second electronic component 3 to form a second packaging portion 5 on the first IC carrier 1;

[0124] like Fig.16 As shown, in the present application, the second electronic component 3 can be packaged through the FAM process, and a second packaging part 5 for packaging the second electronic component 3 is formed on the side of the first IC carrier 1 away from the first packaging part 4, thereby realizing double-sided plastic packaging of the SIP module together with the first packaging part 4.

[0125] Among them, the FAM process refers to first setting a protective film on the second IC carrier 10 during plastic packaging, and then filling the plastic packaging material, so that after the plastic packaging is completed, the plastic packaging material on the second IC carrier 10 can be removed through the protective film to expose the second IC carrier 10.

[0126] S209, opening a second groove 501 on the second packaging portion 5;

[0127] like Fig.17 and Fig.18 As shown, in the present application, the second groove 501 can be formed on the second packaging part 5 by laser process, FAM process or TMV process.

[0128] S210, disposing a first metal coating 13 on the first packaging portion 4, and disposing a second metal coating 14 on the second packaging portion 5;

[0129] like Figures 19 to 21 As shown, the material of the first metal coating 13 of the present application can be metals such as copper, gold, nickel and silver, or metal alloys such as nickel-iron, iron-cobalt, nickel-cobalt and copper-tin. The first metal coating 13 can be arranged on the first packaging part 4 by processes such as electroplating, chemical plating or physical vapor deposition. The material of the second metal coating 14 can be metals such as copper, gold, nickel and silver, or metal alloys such as nickel-iron, iron-cobalt, nickel-cobalt and copper-tin. The second metal coating 14 can be arranged on the second packaging part 5 by processes such as electroplating, chemical plating or physical vapor deposition.

[0130] S211, disposing a first non-encapsulation component 11 on a side of the first IC carrier 1 close to the first encapsulation portion 4; disposing a first optical device 6 in the first groove 401, and electrically connecting the first optical device 6 to the first IC carrier 1;

[0131] like Fig. 22 As shown, the first optical device 6 of the present application can be an optical heart rate sensor, a blood oxygen sensor, an ambient light and ultraviolet sensor, or an LED light. The first non-packaged component 11 can be a spring, a connector, a MESM device, a motor, a USB connector or an interface. The first non-packaged component 11 can be arranged at both ends of the first IC carrier 1 along the first package part 4, and a first gap 15 is formed between the first package part 4 and the first non-packaged component 11.

[0132] S212 , disposing a second non-encapsulation component 12 on a side of the first IC carrier 1 close to the second encapsulation portion 5 ; disposing a second optical device 7 in the second groove 501 , and electrically connecting the second optical device 7 to the first IC carrier 1 .

[0133] like Fig.23 As shown, the second optical device 7 of the present application can be an optical heart rate sensor, a blood oxygen sensor, an ambient light and ultraviolet sensor, or an LED light. The second non-packaged component 12 can be a spring, a connector, a MESM device, a motor, a USB connector or an interface. The second non-packaged component 12 can be arranged on the side of the first IC carrier 1 away from the first packaging part 4, and form a second gap 16 with the second packaging part 5.

[0134] It should be noted that the above steps in the embodiment of the present application can be combined or selected according to actual needs. For example, another embodiment of the present application further provides a SIP module packaging method, wherein the SIP module includes a first conductive portion 8. In this case, the SIP module packaging method includes:

[0135] A first electronic component 2 is arranged on the first IC carrier 1;

[0136] Encapsulating the first electronic component 2 to form a first encapsulation portion 4 on the first IC carrier 1;

[0137] A first groove 401 is formed on the first packaging part 4, a conductive hole 17 is formed on the first groove 401, and a conductive material is provided in the conductive hole 17 to form a first conductive part 8, a first optical device 6 is provided in the first groove 401, and the first optical device 6 is electrically connected to the first IC carrier 1;

[0138] A second electronic component 3 is arranged on a side of the first IC carrier 1 away from the first electronic component 2;

[0139] Encapsulating the second electronic component 3 to form a second encapsulation portion 5 on the first IC carrier 1;

[0140] A second groove 501 is opened on the second packaging portion 5 , a second optical device 7 is disposed in the second groove 501 , and the second optical device 7 is electrically connected to the first IC carrier 1 .

[0141] In another embodiment, a SIP module packaging method is also provided, wherein the SIP module includes a second conductive portion 9. In this case, the SIP module packaging method includes:

[0142] A first electronic component 2 is arranged on the first IC carrier 1;

[0143] Encapsulating the first electronic component 2 to form a first encapsulation portion 4 on the first IC carrier 1;

[0144] A first groove 401 is formed on the first packaging portion 4, a first optical device 6 is disposed in the first groove 401, and the first optical device 6 is electrically connected to the first IC carrier 1;

[0145] A second electronic component 3 is arranged on a side of the first IC carrier 1 away from the first electronic component 2;

[0146] A second conductive portion 9 is provided on a side of the first IC carrier 1 away from the first electronic component 2;

[0147] Encapsulating the second electronic component 3 to form a second encapsulation portion 5 on the first IC carrier 1;

[0148] A second groove 501 is opened on the second packaging portion 5 , a second optical device 7 is disposed in the second groove 501 , and the second optical device 7 is electrically connected to the first IC carrier 1 .

[0149] In another embodiment, a SIP module packaging method is provided, wherein the SIP module includes a second conductive portion 9 and a second IC carrier 10. In this case, the SIP module packaging method includes:

[0150] A first electronic component 2 is arranged on the first IC carrier 1;

[0151] Encapsulating the first electronic component 2 to form a first encapsulation portion 4 on the first IC carrier 1;

[0152] A first groove 401 is formed on the first packaging portion 4, a first optical device 6 is disposed in the first groove 401, and the first optical device 6 is electrically connected to the first IC carrier 1;

[0153] A second electronic component 3 is arranged on a side of the first IC carrier 1 away from the first electronic component 2;

[0154] A second conductive portion 9 is provided on a side of the first IC carrier 1 away from the first electronic component 2;

[0155] A second IC carrier 10 is disposed on a side of the second conductive portion 9 facing away from the first IC carrier 1;

[0156] Encapsulating the second electronic component 3 to form a second encapsulation portion 5 on the first IC carrier 1;

[0157] A second groove 501 is opened on the second packaging portion 5 , a second optical device 7 is disposed in the second groove 501 , and the second optical device 7 is electrically connected to the first IC carrier 1 .

[0158] In another embodiment, a SIP module packaging method is provided, wherein the SIP module includes a first non-packaged component 11. In this case, the SIP module packaging method includes:

[0159] A first electronic component 2 is arranged on the first IC carrier 1;

[0160] Encapsulating the first electronic component 2 to form a first encapsulation portion 4 on the first IC carrier 1;

[0161] A first groove 401 is formed on the first packaging portion 4, a first optical device 6 is disposed in the first groove 401, and the first optical device 6 is electrically connected to the first IC carrier 1;

[0162] A first non-encapsulation component 11 is disposed on a side of the first IC carrier 1 close to the first encapsulation portion 4;

[0163] A second electronic component 3 is arranged on a side of the first IC carrier 1 away from the first electronic component 2;

[0164] Encapsulating the second electronic component 3 to form a second encapsulation portion 5 on the first IC carrier 1;

[0165] A second groove 501 is opened on the second packaging portion 5 , a second optical device 7 is disposed in the second groove 501 , and the second optical device 7 is electrically connected to the first IC carrier 1 .

[0166] In another embodiment, a SIP module packaging method is provided, wherein the SIP module includes a second non-packaged component 12. In this case, the SIP module packaging method includes:

[0167] A first electronic component 2 is arranged on the first IC carrier 1;

[0168] Encapsulating the first electronic component 2 to form a first encapsulation portion 4 on the first IC carrier 1;

[0169] A first groove 401 is formed on the first packaging portion 4, a first optical device 6 is disposed in the first groove 401, and the first optical device 6 is electrically connected to the first IC carrier 1;

[0170] A second electronic component 3 is arranged on a side of the first IC carrier 1 away from the first electronic component 2;

[0171] Encapsulating the second electronic component 3 to form a second encapsulation portion 5 on the first IC carrier 1;

[0172] A second groove 501 is formed on the second packaging portion 5, a second optical device 7 is disposed in the second groove 501, and the second optical device 7 is electrically connected to the first IC carrier 1;

[0173] A second non-encapsulation component 12 is disposed on a side of the first IC carrier 1 close to the second encapsulation portion 5 .

[0174] In another embodiment, a SIP module packaging method is provided, wherein the SIP module includes a first metal plating layer 13. In this case, the SIP module packaging method includes:

[0175] A first electronic component 2 is arranged on the first IC carrier 1;

[0176] Encapsulating the first electronic component 2 to form a first encapsulation portion 4 on the first IC carrier 1;

[0177] A first groove 401 is formed on the first packaging part 4, a first metal plating layer 13 is disposed on the first packaging part 4, a first optical device 6 is disposed in the first groove 401, and the first optical device 6 is electrically connected to the first IC carrier 1;

[0178] A second electronic component 3 is arranged on a side of the first IC carrier 1 away from the first electronic component 2;

[0179] Encapsulating the second electronic component 3 to form a second encapsulation portion 5 on the first IC carrier 1;

[0180] A second groove 501 is opened on the second packaging portion 5 , a second optical device 7 is disposed in the second groove 501 , and the second optical device 7 is electrically connected to the first IC carrier 1 .

[0181] In another embodiment, a SIP module packaging method is provided, wherein the SIP module includes a second metal plating layer 14. In this case, the SIP module packaging method includes:

[0182] A first electronic component 2 is arranged on the first IC carrier 1;

[0183] Encapsulating the first electronic component 2 to form a first encapsulation portion 4 on the first IC carrier 1;

[0184] A first groove 401 is formed on the first packaging portion 4, a first optical device 6 is disposed in the first groove 401, and the first optical device 6 is electrically connected to the first IC carrier 1;

[0185] A second electronic component 3 is arranged on a side of the first IC carrier 1 away from the first electronic component 2;

[0186] Encapsulating the second electronic component 3 to form a second encapsulation portion 5 on the first IC carrier 1;

[0187] A second groove 501 is opened on the second packaging part 5 , a second metal plating layer 14 is disposed on the second packaging part 5 , a second optical device 7 is disposed in the second groove 501 , and the second optical device 7 is electrically connected to the first IC carrier 1 .

[0188] According to another embodiment of the present application, an electronic device is provided, and the electronic device includes the SIP module described in the embodiment of the present application.

[0189] Specifically, the SIP module described in this application can be applied to wearable electronic devices such as smart watches, smart glasses or smart bracelets, as well as other electronic devices such as mobile phones, tablet computers, virtual reality terminal devices, augmented reality terminal devices, drones, radars and vehicle-mounted devices. Those skilled in the art can make a choice according to actual needs, and this application does not make any specific restrictions here.

[0190] The above embodiments focus on the differences between the various embodiments. As long as the different optimization features between the various embodiments are not contradictory, they can be combined to form a better embodiment. Considering the simplicity of the text, they will not be repeated here.

[0191] Although some specific embodiments of the present invention have been described in detail by way of example, it will be appreciated by those skilled in the art that the above examples are for illustration only and are not intended to limit the scope of the present invention. It will be appreciated by those skilled in the art that the above embodiments may be modified without departing from the scope and spirit of the present invention. The scope of the present invention is defined by the appended claims.

Claims

1. A SIP module, characterized in that: include: A first IC carrier board (1); A first electronic component (2) and a second electronic component (3), wherein the first electronic component (2) and the second electronic component (3) are arranged on two opposite sides of the first IC carrier (1); A first packaging part (4) and a second packaging part (5), wherein the first packaging part (4) is used to package the first electronic component (2), and the second packaging part (5) is used to package the second electronic component (3); the first packaging part (4) comprises a first groove (401), a first optical device (6) is installed in the first groove (401), and the first optical device (6) is electrically connected to the first IC carrier (1); the second packaging part (5) comprises a second groove (501), a second optical device (7) is installed in the second groove (501), and the second optical device (7) is electrically connected to the first IC carrier (1).

2. The SIP module according to claim 1, characterized in that: It also comprises a first conductive part (8), and the first optical device (6) is electrically connected to the first IC carrier (1) via the first conductive part (8).

3. The SIP module according to claim 1, characterized in that: It also comprises a second conductive part (9), and the second optical device (7) is electrically connected to the first IC carrier (1) via the second conductive part (9).

4. The SIP module according to claim 3, characterized in that: It also includes a second IC carrier (10), wherein the second IC carrier (10) is arranged between the second conductive portion (9) and the second optical device (7).

5. The SIP module according to claim 1, characterized in that: The invention also comprises a first non-packaged component (11), wherein the first non-packaged component (11) is arranged on a side of the first IC carrier (1) close to the first packaged portion (4), and a first gap (15) is provided between the first non-packaged component (11) and the first packaged portion (4).

6. The SIP module according to claim 1, characterized in that: The invention also comprises a second non-encapsulated part (12), wherein the second non-encapsulated part (12) is arranged on a side of the first IC carrier (1) close to the second encapsulated part (5), and a second gap (16) is provided between the second non-encapsulated part (12) and the second encapsulated part (5).

7. The SIP module according to claim 1, characterized in that: It also comprises a first metal coating (13) and a second metal coating (14), wherein the first metal coating (13) is used to cover the first packaging portion (4), and the second metal coating (14) is used to cover the second packaging portion (5).

8. A SIP module packaging method, applied to the SIP module according to any one of claims 1 to 7, characterized in that: The SIP module packaging method comprises: Arranging a first electronic component (2) on a first IC carrier board (1); Encapsulating the first electronic component (2) to form a first encapsulation portion (4) on the first IC carrier (1); A first groove (401) is formed on the first packaging portion (4), a first optical device (6) is arranged in the first groove (401), and the first optical device (6) is electrically connected to the first IC carrier (1); A second electronic component (3) is arranged on a side of the first IC carrier (1) facing away from the first electronic component (2); Encapsulating the second electronic component (3) to form a second encapsulation portion (5) on the first IC carrier (1); A second groove (501) is opened on the second packaging part (5), a second optical device (7) is arranged in the second groove (501), and the second optical device (7) is electrically connected to the first IC carrier (1).

9. The SIP module packaging method according to claim 8, characterized in that: Providing a first groove (401) on the first packaging portion (4), arranging a first optical device (6) in the first groove (401), and electrically connecting the first optical device (6) to the first IC carrier (1) comprises: A conductive hole (17) is formed on the first groove (401), and a conductive material is provided in the conductive hole (17) to form a first conductive portion (8).

10. The SIP module packaging method according to claim 8, characterized in that: After arranging a second electronic component (3) on a side of the first IC carrier (1) facing away from the first electronic component (2), before encapsulating the second electronic component (3) to form a second encapsulation portion (5) on the first IC carrier (1), the method further comprises: A second conductive portion (9) is provided on a side of the first IC carrier (1) facing away from the first electronic component (2).

11. The SIP module packaging method according to claim 10, characterized in that: After the second conductive portion (9) is provided on the side of the first IC carrier (1) facing away from the first electronic component (2), before the second electronic component (3) is encapsulated to form a second encapsulation portion (5) on the first IC carrier (1), the method further comprises: A second IC carrier (10) is arranged on a side of the second conductive portion (9) facing away from the first IC carrier (1).

12. The SIP module packaging method according to claim 8, characterized in that: After a first groove (401) is formed on the first packaging portion (4), a first optical device (6) is arranged in the first groove (401), and the first optical device (6) is electrically connected to the first IC carrier (1), the method further comprises: A first non-encapsulation component (11) is arranged on a side of the first IC carrier (1) close to the first encapsulation portion (4).

13. The SIP module packaging method according to claim 8, characterized in that: After a second groove (501) is formed on the second packaging portion (5), a second optical device (7) is arranged in the second groove (501), and the second optical device (7) is electrically connected to the first IC carrier (1), the method further comprises: A second non-encapsulation component (12) is arranged on a side of the first IC carrier (1) close to the second encapsulation portion (5).

14. The SIP module packaging method according to claim 8, characterized in that: Providing a first groove (401) on the first packaging portion (4), arranging a first optical device (6) in the first groove (401), and electrically connecting the first optical device (6) to the first IC carrier (1) comprises: A first metal plating layer (13) is provided on the first packaging portion (4).

15. The SIP module packaging method according to claim 8, characterized in that: Providing a second groove (501) on the second packaging portion (5), arranging a second optical device (7) in the second groove (501), and electrically connecting the second optical device (7) to the first IC carrier (1) comprises: A second metal coating (14) is provided on the second encapsulation part (5).

16. An electronic device, characterized in that: Comprising the SIP module as described in any one of claims 1-7.

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