Component-embedded circuit board manufacturing method and component-embedded circuit board

Abstract

The invention relates to a manufacturing method of a circuit board with embedded components and the circuit board with the embedded components. The manufacturing method of the embedded component circuit board comprises the following steps: manufacturing a copper-clad core plate; welding a component used for embedding on the copper-clad core plate; an insulating adhesive film layer meeting preset test conditions is attached to the copper-clad core plate welded with the component, the insulating adhesive film layer is free of windowing and uniform in thickness, the heat resistance of the insulating adhesive film layer is larger than or equal to 200 DEG C, and the coefficient of thermal expansion after stabilization is smaller than or equal to 19 PPM; vacuumizing the space between the insulating adhesive film layer and the copper-clad core plate, and leveling and baking the insulating adhesive film layer; and performing high-temperature pressing on the insulating adhesive film layer and the copper-clad core plate. According to the manufacturing method of the circuit board with the embedded components, the damage rate of the components on the circuit board with the embedded components can be greatly reduced, and therefore the production quality of the circuit board with the embedded components is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit board manufacturing, and in particular to a manufacturing method of a circuit board with embedded components and a circuit board with embedded components. Background Art

[0002] In recent years, my country's status as a major PCB manufacturing country has become increasingly prominent, and my country's PCB industry has also achieved rapid development. Competition in the PCB market is becoming increasingly fierce, and embedded component circuit boards, as a leading product, will occupy a certain dominant position in the future PCB market.

[0003] In the related art, the manufacturing process of embedded component PCB is to first solder the components to the inner layer circuit of the PCB core board, and then fill the components with glue and press them together after positioning and opening windows with semi-cured sheets, and then make the outer layer circuit and post-processing to complete the PCB product. However, there are many defects in the method of positioning and opening windows with semi-cured sheets: first, when the size of the components is small, the size of the window of the semi-cured sheet is small, which makes the slot of the semi-cured sheet difficult to process; second, the pressure is difficult to control when laminating the sheets. When the pressure is high, the components are easily crushed, and when the pressure is low, the glue is insufficient, which leads to a low qualified rate of the PCB product. Summary of the invention

[0004] Based on this, it is necessary to provide a method for manufacturing a circuit board with embedded components and a circuit board with embedded components to address the problem that the manufacturing process of the PCB with embedded components has defects.

[0005] A method for manufacturing a circuit board with embedded components, comprising the following steps: Copper clad core board production; Welding components for embedding onto the copper clad core board; Laminating an insulating film layer that meets preset test conditions on the copper-clad core board with components welded thereon, wherein the insulating film layer is a film layer without openings and with uniform thickness, and the heat resistance of the insulating film layer is ≥200°C, and the thermal expansion coefficient after stabilization is ≤19PPM; Vacuuming between the insulating film layer and the copper clad core board, and leveling and baking the insulating film layer; The insulating adhesive film layer and the copper clad core board are pressed together at high temperature.

[0006] In the above-mentioned method for making a circuit board with embedded components, firstly, a copper clad core board is made, and the components for embedding are welded on the copper clad core board; then, an insulating film layer is attached to the copper clad core board with the components welded thereon; then, a vacuum is drawn between the insulating film layer and the copper clad core board, and the insulating film layer is leveled and baked; finally, the insulating film layer and the copper clad core board are pressed at high temperature, and post-processing is performed. It can be seen that when making a circuit board with embedded components, an insulating film layer without a window is used to replace a semi-cured sheet with a window, thereby eliminating the process of milling grooves, opening windows and stacking plates of the semi-cured sheet, and avoiding the problem of component misalignment caused by irregular slots and poor alignment accuracy of the semi-cured sheet; further, the insulating film has good ductility, filling and insulation properties. After using the insulating film, the force around the components is more uniform and not easy to be misaligned; during the vacuum drawing, leveling and baking process, the relatively low temperature and relatively low The insulating film can be tightly attached to the copper clad core board by pressing. After vacuuming, leveling and baking, the time for high-temperature pressing is significantly shortened, which effectively reduces the damage to components during the high-temperature pressing process, thereby improving the qualified rate of PCB finished products; further, through the control of process parameters such as the heat resistance of the insulating film layer and the thermal expansion coefficient after stabilization, when the vacuum degree is 80kPa, the filling rate of the insulating film layer is ≥99.9, thereby achieving efficient bonding with the copper clad core board, thereby ensuring that the qualified rate of PCB products is at a high level.

[0007] In one of the embodiments, the preset test includes a highly accelerated temperature and humidity stress test, and the resistance of the insulating film layer in the highly accelerated temperature and humidity stress test is ≥10000000Ω; The highly accelerated temperature and humidity stress test has a temperature of ≥130° C., a relative humidity of ≥85%, a test voltage of ≥5V, and a resistance measurement time of ≥96h.

[0008] In one embodiment, the preset test includes a Joule heat test, the insulating film layer has no delamination in the Joule heat test, and the current drop is less than 0.1A; The Joule heat test has a voltage of ≥3V, a current of ≥2.7A, a preheating time of ≥10 seconds, and a test time of ≥8 seconds.

[0009] In one embodiment, the preset test includes a soft-melt soldering heat resistance test, and the insulating adhesive film layer has no delamination or peeling in the soft-melt soldering heat resistance test, and the resistance change rate is less than 10%; The number of reflow soldering in the reflow soldering heat resistance test is 20 times, and the resistance change rate is calculated based on the resistance values ​​of the 8th reflow soldering and the 20th reflow soldering.

[0010] In one embodiment, the preset test condition includes a Handa heat resistance test, and the insulating film layer does not delaminate during the Handa heat resistance test; The Handa heat resistance test is performed by floating the insulating film layer in molten solder at a first preset temperature for a first preset time, then cooling it, and measuring it after a preset number of floating and cooling cycles, wherein the first preset temperature is ≥283°C, the first preset time is ≥10 seconds, and the preset number of times is ≥5 times.

[0011] In one embodiment, the preset test condition includes a boiling half field heat resistance test, and the insulating film layer does not delaminate or peel off in the boiling half field heat resistance test; The boiling half-field heat resistance test is measured by first immersing the insulating film layer in boiling water for a second preset time, and then floating it in molten solder at a second preset temperature for a third preset time, wherein the second preset time is ≥1h, the second preset temperature is ≥260°C, and the third preset time is ≥9 seconds.

[0012] In one of the embodiments, before laminating the insulating film layer that meets the preset test conditions on the copper clad core board on which components are welded, the following steps are also included: Determine the thickness range of the insulating film layer to be bonded; The step of laminating the insulating film layer that meets the preset test conditions on the copper clad core board on which components are welded further comprises: The insulating adhesive film layer meeting the thickness range is adhered to the copper clad core board on which components are welded.

[0013] In one embodiment, determining the thickness range of the insulating film layer to be bonded includes: Determine the device height and solder paste layer thickness corresponding to the highest component on the copper clad core board; Determine the thickness of the copper foil layer and the thickness of the gold immersion layer corresponding to the copper clad core board; Determine a first reference thickness according to the device height, the solder paste layer thickness, the copper foil layer thickness and the immersion gold layer thickness, wherein the first reference thickness=the device height+the solder paste layer thickness+the copper foil layer thickness+the immersion gold layer thickness; The thickness range of the insulating film layer to be bonded is determined according to the first reference thickness, wherein the thickness of the insulating film layer is greater than the first reference thickness.

[0014] In one embodiment, determining the thickness range of the insulating film layer to be bonded according to the first reference thickness includes: Determine the minimum thickness difference and the maximum thickness difference respectively, the maximum thickness difference is the maximum difference between the thickness of the insulating film layer to be bonded and the first reference thickness, the minimum thickness difference is the minimum difference between the thickness of the insulating film layer to be bonded and the first reference thickness, the minimum height difference is 0.01 mm, and the maximum height difference is 0.15 mm; Determine the sum of the first reference thickness and the minimum height difference as the minimum thickness of the insulating film layer to be bonded; Determine the sum of the first reference thickness and the maximum height difference as the maximum thickness of the insulating film layer to be bonded; The thickness range of the insulating film layer to be bonded is determined according to the minimum thickness and the maximum thickness.

[0015] A circuit board with embedded components is manufactured according to the manufacturing method of the circuit board with embedded components.

[0016] By manufacturing the embedded component circuit board according to the above-mentioned method for manufacturing the embedded component circuit board, the production qualification rate of the embedded component circuit board is improved, thereby improving the production efficiency of the embedded component circuit board and reducing the production cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic flow chart of a method for manufacturing a circuit board with embedded components according to the present invention; Figure 2 It is a schematic diagram of the structure of a copper clad core board; Figure 3 for Figure 2 Schematic diagram of the structure after welding components; Figure 4 for Figure 3 Schematic diagram of the structure after the insulating film layer is attached; Figure 5 This is a comparison chart of the thickness of the insulating film layer and the copper-clad core board with components welded on it; Figure 6 for Figure 4 Schematic diagram of the structure after vacuuming, shaping and baking; Figure 7 for Figure 6 Schematic diagram of the structure after high-temperature pressing. DETAILED DESCRIPTION

[0018] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the specific embodiments of the present invention are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present invention. However, the present invention can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present invention, so the present invention is not limited by the specific embodiments disclosed below.

[0019] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may also be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. In contrast, when an element is referred to as being "directly on" another element, there is no intermediate element. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only."

[0020] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art of the present invention. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0021] The invention discloses a method for manufacturing a circuit board with embedded components.

[0022] like Figure 1 As shown, the method for manufacturing a circuit board with embedded components includes steps S01 to S05.

[0023] Step S01: manufacturing a copper clad core board.

[0024] Among them, the production of copper clad core boards includes cutting, baking, inner layer circuit production, inner layer etching, film stripping, inner layer AOI, solder mask and gold immersion.

[0025] like Figure 2As shown, copper clad core board is the basic material for making circuit boards, and has the functions of conductivity, insulation and support. Cutting can be carried out according to the requirements of the circuit board stacking structure and the size and quantity of the engineering MI (Management Information); during the baking process, the baking temperature is 150°C for 2-4 hours; during the inner layer circuit production process, the inner layer roughening method is first used to roughen and clean the copper surface, and then the double-sided dry film of the copper clad core board is applied, and the pattern is transferred by LDI laser imaging according to the inner layer circuit file of the engineering MI, and the inner layer circuit pattern is obtained after development; during the inner layer etching process, according to the core board copper thickness of the engineering MI, the matching parameters are selected for etching, and the copper surface without dry film protection is corroded; in the film stripping process, the dry film on the surface of the copper clad core board can be stripped by a horizontal film stripping machine; in the inner layer AOI process, the protective frame of the copper clad core board is first removed, and then the AOI (Automated Optical The inner layer circuits after etching and film stripping are inspected by an automatic optical inspection (AOI) machine; in the solder mask process, solder mask dams are designed on the pads of the inner layer welding components to prevent the diffusion of solder paste during welding; in the immersion gold process, anti-immersion gold dry film is used to protect the other positions of the inner layer core board, leaving only the pads exposed for immersion gold.

[0026] Step S02: soldering the components to be embedded onto the copper clad core board.

[0027] like Figure 3 As shown, the SMT (Surface Mounted Technology) process can be used to solder the embedded components on the copper clad core board.

[0028] Furthermore, if the thickness of the copper clad core board is less than 0.5mm, a jig auxiliary patch is required. The jig needs to be made of high-temperature resistant and non-deformable materials. When passing through a high-temperature furnace, high-temperature resistant tape is used to fix the copper clad core board on the jig to avoid scrapping due to bending and deformation due to heat during the reflow oven.

[0029] Furthermore, before the embedded components are welded on the copper clad core board, the copper clad core board may be subjected to a browning treatment. The browning treatment of the copper clad core board can prevent the copper clad core board from being oxidized or corroded, and plays a certain protective role on the copper clad core board when welding components.

[0030] Furthermore, after the components for embedding are welded on the copper clad core board, the copper clad core board with the components welded thereon can also be subjected to automatic optical inspection, cleaning and baking, thereby effectively ensuring the welding quality of the components.

[0031] Step S03: Laminating an insulating film layer that meets preset test conditions onto the copper clad core board with components welded thereon, wherein the insulating film layer is a film layer without openings and with uniform thickness, and the heat resistance of the insulating film layer is ≥200°C, and the thermal expansion coefficient after stabilization is ≤19PPM.

[0032] In order to ensure that the insulating film layer and the copper clad core board have a good bonding effect, the insulating film layer needs to be tested, and the insulating film layer that meets the preset test conditions will be used for bonding.

[0033] In an optional method, the preset test includes a high-accelerated temperature and humidity stress test, and the insulating film layer needs to meet the requirement of a resistance ≥ 10000000Ω in the high-accelerated temperature and humidity stress test; wherein, the temperature of the high-accelerated temperature and humidity stress test is ≥ 130°C, the relative humidity is ≥ 85%, the test voltage is ≥ 5V, and the resistance measurement time is ≥ 96h.

[0034] In an optional manner, the preset test includes a Joule heat test, and the insulating film layer is required to meet the Joule heat test without delamination and the current drop is less than 0.1A; wherein, the voltage of the Joule heat test is ≥3V, the current is ≥2.7A, the preheating time is ≥10 seconds, and the test time is ≥8 seconds.

[0035] In an optional manner, the preset test includes a soft-melt soldering heat resistance test, and the insulating adhesive film layer needs to meet the requirements of no delamination or peeling in the soft-melt soldering heat resistance test, and the resistance change rate is less than 10%; wherein, the number of reflow soldering times for the soft-melt soldering heat resistance test is 20 times, and the resistance change rate is calculated based on the resistance values ​​of the 8th reflow soldering and the 20th reflow soldering.

[0036] In an optional manner, the preset test conditions include a Handa heat resistance test, and the insulating film layer needs to meet the requirement of no delamination or peeling in the Handa heat resistance test; wherein, the Handa heat resistance test is performed by floating the insulating film layer in molten solder at a first preset temperature for a first preset time, then cooling it, and measuring it after a preset number of floating and cooling cycles, wherein the first preset temperature is ≥283°C, the first preset time is ≥10 seconds, and the preset number of times is ≥5 times.

[0037] In an optional manner, the preset test conditions include a boiling half-field heat resistance test, and the insulating film layer is required to meet the requirement of no delamination or peeling in the boiling half-field heat resistance test; wherein, the boiling half-field heat resistance test is performed by first immersing the insulating film layer in boiling water for a second preset time, and then floating it in molten solder at a second preset temperature for a third preset time, wherein the second preset time is ≥1h, the second preset temperature is ≥260°C, and the third preset time is ≥9 seconds.

[0038] In an optional method, the preset test conditions include a TCT (Temperature Cycling Test) continuity test, and the insulating film layer is now required to meet the requirement that the resistance change rate after 1000 cycles in the boiling half-field heat resistance test is less than 10%; wherein, the boiling half-field heat resistance test alternately measures the resistance of the insulating film layer at high temperature (150°C) and low temperature (-55°C), and the high temperature and low temperature duration are both 15 minutes.

[0039] In an optional manner, before executing step S03, the step of: determining the thickness range of the insulating film layer to be bonded; when executing step S03, the insulating film layer that meets the preset test conditions and the thickness range conditions can be further bonded to the copper clad core board with components welded thereon, so that the bonding efficiency of the insulating film layer is better.

[0040] Furthermore, determining the thickness range of the insulating film layer to be bonded includes: first determining the device height and solder paste layer thickness corresponding to the highest component on the copper clad core board; then determining the copper foil layer thickness and immersion gold layer thickness corresponding to the copper clad core board; then determining the first reference thickness according to the device height, solder paste layer thickness, copper foil layer thickness and immersion gold layer thickness, wherein the first reference thickness = the device height + the solder paste layer thickness + the copper foil layer thickness + the immersion gold layer thickness; finally determining the thickness range of the insulating film layer to be bonded according to the first reference thickness, wherein the thickness of the insulating film layer is greater than the first reference thickness. By first calculating the first reference thickness and then setting the thickness of the insulating film layer to be greater than the first reference thickness, the insulating film layer can protect the components at all angles during the processing of the embedded component circuit board, avoiding damage to the components due to the insulating film layer being too thin, and avoiding waste due to the insulating film layer being too thick and affecting the processing accuracy of the embedded component circuit board.

[0041] Furthermore, determining the thickness range of the insulating film layer to be bonded according to the first reference thickness includes: first determining the minimum thickness difference and the maximum thickness difference respectively, the maximum thickness difference being the maximum difference between the thickness of the insulating film layer to be bonded and the first reference thickness, and the minimum thickness difference being the minimum difference between the thickness of the insulating film layer to be bonded and the first reference thickness; then determining the sum of the first reference thickness and the minimum height difference as the minimum thickness of the insulating film layer to be bonded; then determining the sum of the first reference thickness and the maximum height difference as the maximum thickness of the insulating film layer to be bonded; finally determining the thickness range of the insulating film layer to be bonded according to the minimum thickness and the maximum thickness. Preferably, the minimum height difference is 0.01mm, and the maximum height difference is 0.15mm. By setting the minimum height difference and the maximum height difference, it is possible to quickly select the insulating film layer during the processing of the embedded component circuit board, and the processed embedded component circuit board can also be made more consistent.

[0042] like Figure 4 As shown, the insulating film can be bonded to the copper-clad core board with components welded thereon by an automatic bonding machine. The insulating film has good insulation properties, and the insulating film may include, for example, NBF film. NBF film is a new high-end RCC (Resin Coated Copper) product with high heat resistance, low thermal expansion coefficient, low elastic modulus, excellent fluidity and good processability. Combined with the carrier copper foil structure, it is suitable for MSAP (Modified Semi-Additive Process) micro-circuit processing.

[0043] Before laminating the insulating film layer on the copper-clad core board with components soldered on it, the thickness of the insulating film layer needs to be controlled. Figure 5 As shown, H1 represents the thickness of the insulating film layer, and H2 represents the sum of the core board copper thickness, immersion gold thickness, solder paste thickness, and component height. In order to ensure efficient bonding between the insulating film layer and the copper-clad core board, it is necessary to ensure that H1>H2, that is, the thickness of the insulating film layer is greater than the sum of the core board copper thickness, immersion gold thickness, solder paste thickness, and component height. The thickness of the insulating film layer is set to be greater than the sum of the core board copper thickness, immersion gold thickness, solder paste thickness, and component height, so that the insulating film layer can achieve a better bonding effect, thereby protecting the soldered components on the copper-clad core board from failure due to extrusion in step S04 and step S05.

[0044] Furthermore, the copper thickness of the core board shall be based on the laminated structure of the engineering MI, the thickness of the immersion gold shall be the maximum value of the thickness range required by the immersion gold design, the thickness of the solder paste shall be affected by the thickness of the steel mesh during the welding process, and will also fluctuate according to the different sizes of devices. It can be determined by slicing analysis after welding, and the height of the components can be determined by the design files of the components.

[0045] Step S04: vacuumizing between the insulating film layer and the copper clad core board, and leveling and baking the insulating film layer.

[0046] Among them, the parameters for vacuuming between the insulating film layer and the copper clad core board include: temperature 100°C, pressure 0.7Mpa, vacuum degree <1.2hpa, time 50s; the parameters for leveling the insulating film layer include: temperature 100°C, pressure 0.7Mpa, time 50s; when baking the insulating film layer, first bake at 100°C for 30 minutes, and then bake at 190°C for 60 minutes. Since the insulating film layer is relatively soft, by vacuuming between the insulating film layer and the copper clad core board, the insulating film layer can be shaped according to the surface contour of the copper clad core board. After leveling the insulating film layer, the insulating film layer is baked so that the insulating film layer is cured and fits tightly to the copper clad core board.

[0047] like Figure 6As shown, by controlling the process parameters when evacuating the space between the insulating film layer and the copper clad core board, when leveling the insulating film layer, and when baking the insulating film layer, close contact between the insulating film layer and the copper clad core board can be achieved.

[0048] Step S05: laminating the insulating adhesive film layer and the copper clad core board at high temperature.

[0049] Among them, before high-temperature pressing, the laminated structure of the engineering MI can be pre-stacked, and then the laminated structure is riveted, and all the encrypted tool holes on the edge of the plate are riveted during riveting.

[0050] Furthermore, the parameters for high-temperature pressing the insulating film layer and the copper-clad core board include high-voltage parameters and high-temperature parameters; the high-voltage parameters include: 11.34Mpa, vacuum degree 40hpa, time 120min, and the high-temperature parameters include: heating rate 2.5℃ / min, high temperature ≥190℃, and holding time 60min.

[0051] like Figure 7 As shown in the figure, the insulating film layer is in close contact with the copper clad core board before high-temperature pressing, so that the insulating film layer can bear pressure evenly, thereby protecting the components. After high-temperature pressing, the board surface is relatively flat, there is almost no glue flow on the edge of the board, the peripheral pressure of the components on the copper clad core board is relatively balanced, the components are not easily damaged during high-temperature pressing, there is no risk of pressure loss and displacement, and the time of high-temperature pressing is also reduced, thereby improving the production efficiency of embedded component circuit boards.

[0052] Furthermore, after executing step S05, post-processing can also be performed. Post-processing includes: drilling, copper deposition, outer layer circuit production, solder resist, surface treatment, testing, molding and finished product inspection. Drilling, copper deposition, outer layer circuit production, solder resist, surface treatment, testing, molding and finished product inspection can all be performed using conventional processes.

[0053] In the above-mentioned method for making a circuit board with embedded components, firstly, a copper clad core board is made, and the components for embedding are welded on the copper clad core board; then, an insulating film layer is attached to the copper clad core board with the components welded thereon; then, a vacuum is drawn between the insulating film layer and the copper clad core board, and the insulating film layer is leveled and baked; finally, the insulating film layer and the copper clad core board are pressed at high temperature, and post-processing is performed. It can be seen that when making a circuit board with embedded components, an insulating film layer without a window is used to replace a semi-cured sheet with a window, thereby eliminating the process of milling grooves, opening windows and stacking plates of the semi-cured sheet, and avoiding the problem of component misalignment caused by irregular slots and poor alignment accuracy of the semi-cured sheet; further, the insulating film has good ductility, filling and insulation properties. After using the insulating film, the force around the components is more uniform and not easy to be misaligned; during the vacuum drawing, leveling and baking process, the relatively low temperature and relatively low The insulating film can be tightly attached to the copper clad core board by pressing. After vacuuming, leveling and baking, the time for high-temperature pressing is significantly shortened, which effectively reduces the damage to components during the high-temperature pressing process, thereby improving the qualified rate of PCB finished products; further, through the control of process parameters such as the heat resistance of the insulating film layer and the thermal expansion coefficient after stabilization, when the vacuum degree is 80kPa, the filling rate of the insulating film layer is ≥99.9, thereby achieving efficient bonding with the copper clad core board, thereby ensuring that the qualified rate of PCB products is at a high level.

[0054] The invention also discloses a circuit board with embedded components.

[0055] The embedded component circuit board is manufactured according to the manufacturing method of the embedded component circuit board. Since the embedded component circuit board is manufactured according to the manufacturing method of the embedded component circuit board, the damage rate of components on the embedded component circuit board is greatly reduced, thereby improving the production quality of the embedded component circuit board and reducing the production cost.

[0056] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0057] The above-mentioned embodiments only express several implementation methods of the present invention, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the attached claims.

Claims

1. A method for manufacturing a circuit board with embedded components, characterized in that: The steps include: Copper clad core board production; Welding components for embedding onto the copper clad core board; Laminating an insulating film layer that meets preset test conditions on the copper-clad core board with components welded thereon, wherein the insulating film layer is a film layer without openings and with uniform thickness, and the heat resistance of the insulating film layer is ≥200°C, and the thermal expansion coefficient after stabilization is ≤19PPM; Vacuuming between the insulating film layer and the copper clad core board, and leveling and baking the insulating film layer; The insulating adhesive film layer and the copper clad core board are pressed together at high temperature.

2. The method for manufacturing a circuit board with embedded components according to claim 1, characterized in that: The preset test includes a highly accelerated temperature and humidity stress test, and the resistance of the insulating film layer in the highly accelerated temperature and humidity stress test is ≥10000000Ω; The highly accelerated temperature and humidity stress test has a temperature of ≥130° C., a relative humidity of ≥85%, a test voltage of ≥5V, and a resistance measurement time of ≥96h.

3. The method for manufacturing a circuit board with embedded components according to claim 1, characterized in that: The preset test includes a Joule heat test, and the insulating film layer has no delamination in the Joule heat test, and the current drop is less than 0.1A; The Joule heat test has a voltage of ≥3V, a current of ≥2.7A, a preheating time of ≥10 seconds, and a test time of ≥8 seconds.

4. The method for manufacturing a circuit board with embedded components according to claim 1, characterized in that: The preset test includes a soft-melt soldering heat resistance test, and the insulating film layer has no delamination or peeling in the soft-melt soldering heat resistance test, and the resistance change rate is less than 10%; The number of reflow soldering in the reflow soldering heat resistance test is 20 times, and the resistance change rate is calculated based on the resistance values ​​of the 8th reflow soldering and the 20th reflow soldering.

5. The method for manufacturing a circuit board with embedded components according to claim 1, characterized in that: The preset test conditions include a Handa heat resistance test, and the insulating film layer does not delaminate during the Handa heat resistance test; The Handa heat resistance test is performed by floating the insulating film layer in molten solder at a first preset temperature for a first preset time, then cooling it, and measuring it after a preset number of floating and cooling cycles, wherein the first preset temperature is ≥283°C, the first preset time is ≥10 seconds, and the preset number of times is ≥5 times.

6. The method for manufacturing a circuit board with embedded components according to claim 1, characterized in that: The preset test conditions include a boiling half field heat resistance test, and the insulating adhesive film layer has no delamination or peeling in the boiling half field heat resistance test; The boiling half-field heat resistance test is measured by first immersing the insulating film layer in boiling water for a second preset time, and then floating it in molten solder at a second preset temperature for a third preset time, wherein the second preset time is ≥1h, the second preset temperature is ≥260°C, and the third preset time is ≥9 seconds.

7. The method for manufacturing a circuit board with embedded components according to claim 1, characterized in that: Before laminating the insulating adhesive film layer that meets the preset test conditions on the copper clad core board on which components are welded, the following steps are also included: Determine the thickness range of the insulating film layer to be bonded; The step of laminating the insulating film layer that meets the preset test conditions on the copper clad core board on which components are welded further comprises: The insulating adhesive film layer meeting the thickness range is adhered to the copper clad core board on which components are welded.

8. The method for manufacturing a circuit board with embedded components according to claim 7, characterized in that: Determining the thickness range of the insulating film layer to be bonded includes: Determine the device height and solder paste layer thickness corresponding to the highest component on the copper clad core board; Determine the thickness of the copper foil layer and the thickness of the gold immersion layer corresponding to the copper clad core board; Determine a first reference thickness according to the device height, the solder paste layer thickness, the copper foil layer thickness and the immersion gold layer thickness, wherein the first reference thickness=the device height+the solder paste layer thickness+the copper foil layer thickness+the immersion gold layer thickness; The thickness range of the insulating film layer to be bonded is determined according to the first reference thickness, wherein the thickness of the insulating film layer is greater than the first reference thickness.

9. The method for manufacturing a circuit board with embedded components according to claim 8, characterized in that: Determining the thickness range of the insulating film layer to be bonded according to the first reference thickness includes: Determine the minimum thickness difference and the maximum thickness difference respectively, the maximum thickness difference is the maximum difference between the thickness of the insulating film layer to be bonded and the first reference thickness, the minimum thickness difference is the minimum difference between the thickness of the insulating film layer to be bonded and the first reference thickness, the minimum height difference is 0.01 mm, and the maximum height difference is 0.15 mm; Determine the sum of the first reference thickness and the minimum height difference as the minimum thickness of the insulating film layer to be bonded; Determine the sum of the first reference thickness and the maximum height difference as the maximum thickness of the insulating film layer to be bonded; The thickness range of the insulating film layer to be bonded is determined according to the minimum thickness and the maximum thickness.

10. A circuit board with embedded components, characterized in that: The embedded component circuit board is manufactured according to the manufacturing method of the embedded component circuit board according to any one of claims 1 to 9.

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