Mass transfer device and transfer method

Abstract

The invention belongs to the technical field of semiconductor manufacturing, and particularly relates to a huge transfer device and method, an operation table is provided with a material taking station and a material placing station, the material taking station is used for placing a wafer disc, and the material placing station is used for placing a circuit substrate; the rotating transfer mechanism is arranged above the operation table, the rotating piece is movably arranged on the side wall of the mounting base, the driving piece is used for driving the rotating piece to move around the mounting base, and the multiple sets of transfer assemblies are mounted on the rotating piece at intervals; when one set of transfer assembly is located above the material taking station, the other set of transfer assembly is located above the material placing station, and the two sets of transfer assemblies carry out material taking and material placing at the same time. By designing the rotary transfer mechanism, material taking and discharging operations can be simultaneously completed in a one-time rotation process, and the time required by an adsorption device to move back and forth between a wafer and a circuit substrate for multiple times in the prior art is remarkably shortened by the parallel operation mode, so that the overall efficiency of mass transfer is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor manufacturing, and in particular to a mass transfer device and a transfer method. Background Art

[0002] Mass transfer is another difficulty brought about by pixelation, especially in applications involving Mini / Micro LED, where the chip size is extremely small and the number is huge. It takes a lot of time to transfer LED chips to the circuit substrate in batches and the yield is difficult to control, which has become a major obstacle to commercial production and application.

[0003] At present, mass transfer technology usually uses an adsorption device to absorb the chip above the wafer, and then the adsorption device is transferred to the circuit substrate to release the chip. Finally, the adsorption device returns to the top of the wafer for a second chip adsorption. This process has a long time cycle and low transfer efficiency. Summary of the invention

[0004] In view of the problems raised by the background technology, the purpose of the present invention is to propose a mass transfer device and a transfer method to solve the problem of low transfer efficiency in the prior art.

[0005] To achieve this object, the present invention adopts the following technical solutions:

[0006] A mass transfer device comprises an operating table and a rotary transfer mechanism;

[0007] The operating table is provided with a material taking station and a material placing station, the material taking station is used to place the wafer disc, and the material placing station is used to place the circuit substrate;

[0008] The rotary transfer mechanism is arranged above the operating table, and comprises a mounting seat, a rotating member, a driving member and a plurality of transfer components, wherein the driving member is mounted on the mounting seat, the rotating member is movably arranged on the side wall of the mounting seat, the driving member is used to drive the rotating member to move around the mounting seat, and a plurality of transfer components are installed on the rotating member at intervals;

[0009] When one group of the transfer components is located above the material taking station, another group of the transfer components is located above the material discharging station, and the two groups of the transfer components perform material taking and discharging simultaneously.

[0010] Preferably, the rotating member comprises a first part, a second part, a third part and a fourth part which are connected in sequence;

[0011] The left, right, front and back areas of the rotary transfer mechanism are respectively used as a material taking area, a material discharging area, a material to be discharged area and a material to be taken area. When the rotary member moves, the first part, the second part, the third part and the fourth part can be respectively located in the material taking area, the material discharging area, the material to be discharged area and the material to be taken area.

[0012] There are four groups of transfer components, which are respectively arranged on the first part, the second part, the third part and the fourth part. The driving member drives the rotating member to drive the four groups of rotating components to circulate through the material taking area, the material discharge area, the material discharge area and the material taking area in sequence;

[0013] When one group of the transfer components is located in the material taking area, the other three groups of the transfer components are respectively located in the area to be discharged, the discharge area and the area to be taken; when the transfer components located in the material taking area implement material taking, the transfer components located in the discharge area implement material discharge.

[0014] Preferably, the rotating member is a transmission belt, the driving member includes two transmission rollers and a driver, the transmission rollers are mounted on the mounting seat, the central axes of the two transmission rollers are parallel to each other, the transmission belt is sleeved on the outside of the two transmission rollers, and the driver drives the transmission belt to rotate by driving the transmission rollers to rotate;

[0015] Four groups of the transfer components are installed at intervals on the outer side of the transmission belt.

[0016] Preferably, the transfer assembly includes a limiter, a first elastic member and a plurality of transfer heads;

[0017] The two limiting members are installed on the transmission belt in a front-to-back manner, two ends of the first elastic member are respectively connected to the two limiting members, and a plurality of transfer heads are installed on the first elastic member at intervals.

[0018] Preferably, the rotation transfer mechanism further comprises two sets of limit assemblies, and the limit assemblies are mounted on the mounting seat via a mounting frame;

[0019] One of the limit components is located above the material taking area, and the limit component is used to limit the transfer component to the material taking area. The other limit component is located above the material discharge area, and the limit component is used to limit the transfer component to the material discharge area.

[0020] Preferably, the limiting component includes two electromagnetic adsorption sub-components, the two electromagnetic adsorption sub-components are arranged front and back oppositely, and the distance between the two electromagnetic adsorption sub-components is equal to the length of the transfer component;

[0021] The electromagnetic adsorption subassembly comprises an electromagnet, a second elastic member and a limiting iron block, wherein the electromagnet is mounted on the mounting frame, and the limiting iron block is disposed below the electromagnet through the second elastic member;

[0022] When the electromagnet is energized, it absorbs the limiting iron block, and the limiting iron block does not interfere with the transfer assembly; when the electromagnet is de-energized, it does not absorb the limiting iron block, and the front and rear limiting iron blocks are respectively located on the front and rear sides of the two limiting parts.

[0023] Preferably, the limiting iron block includes a fixed sleeve and a sliding block;

[0024] The fixed sleeve is fixedly arranged at the bottom of the electromagnet, and the upper part of the sliding block is slidably arranged inside the fixed sleeve;

[0025] The second elastic member is located inside the fixed sleeve, the upper end of the second elastic member is connected to the electromagnet, and the lower end of the second elastic member is connected to the slider;

[0026] The lower part of the sliding block is in an inverted cone shape.

[0027] Preferably, the transfer assembly further comprises an elastic top plate;

[0028] The two ends of the elastic top plate are respectively connected to the two limiting members, and the elastic top plate is located above the first elastic member;

[0029] The top of the elastic top plate is flat, and when the transfer component moves relative to the limiting component, the bottom of the sliding block abuts against the top of the elastic top plate.

[0030] Preferably, the material taking station and the material placing station are respectively provided with a three-way movable carrier, the three-way movable carrier located at the material taking station is used to install the wafer plate, and the three-way movable carrier located at the material placing station is used to install the circuit substrate;

[0031] The material discharging station is provided with a physical field component, and the physical field component is used to generate a physical field to cause the first elastic member to deform.

[0032] A transfer method using the above-mentioned mass transfer device comprises the following steps:

[0033] S100, start the rotary transfer mechanism, and calibrate the four transfer components to be located in the material taking area, the material discharging area, the material discharging area and the material taking area respectively;

[0034] S200, placing the wafer tray on the material taking station, placing the circuit substrate to be mounted on the material discharging station; aligning the wafer tray with the transfer component on the material taking area, and aligning the circuit substrate with the transfer component on the material discharging area;

[0035] S300, the transfer assembly located in the material taking area performs material taking, the transfer assembly located in the material discharging area performs material discharging, and the transfer assembly located in the material discharging area and the material taking area performs waiting;

[0036] S400, the rotating part is powered on, and the four transfer components start to rotate synchronously; after the transfer components are transferred to the next area respectively, the rotating part is powered off and stops rotating;

[0037] S500: Repeat S300 and S400 to achieve mass transfer.

[0038] Compared with the prior art, one of the above technical solutions has the following beneficial effects:

[0039] 1. By designing a rotating transfer mechanism, the material picking and unloading operations can be completed simultaneously during one rotation. When one set of transfer components is located above the material picking station to adsorb and pick up chips, another set of transfer components can be located above the unloading station to unload and mount chips. This parallel operation method significantly reduces the time required for the adsorption device to go back and forth between the wafer and the circuit substrate in traditional technology, thereby improving the overall efficiency of mass transfer;

[0040] 2. By using the rotating parts and the limit assembly to simultaneously control the stop position of the transfer assembly, that is, using the electrical system and the mechanical assembly for synchronous control, the precise position of the transfer assembly in the material picking area and the material discharging area is ensured, thereby ensuring the accuracy of material picking and discharging. BRIEF DESCRIPTION OF THE DRAWINGS

[0041] Figure 1 It is a structural schematic diagram of an embodiment of the present invention;

[0042] Figure 2 is a top view of the rotation transfer mechanism of the present invention;

[0043] Figure 3 is a side view of the rotation transfer mechanism of the present invention;

[0044] Figure 4 It is a schematic diagram of the structure of the electromagnetic adsorption subassembly of the present invention.

[0045] Among them: material taking area 01, material discharge area 02, material waiting to be discharged area 03, material waiting to be taken area 04, material taking station 11, three-way movable carrier 110, material discharge station 12, rotary transfer mechanism 20, rotating part 22, transmission belt 221, transfer assembly 23, limiting part 231, first elastic part 232, transfer head 233, elastic top plate 234, limiting assembly 24, electromagnet 241, second elastic part 242, limiting iron block 243, fixed sleeve 2431, slider 2432, driving part 25 and transmission roller 251. DETAILED DESCRIPTION

[0046] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0047] In the description of the present invention, it is necessary to understand that the terms "upper", "lower", "front", "back", "left", "right", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0048] In addition, the terms "first", "second" and "third" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, features defined as "first", "second" and "third" may explicitly or implicitly include one or more of the features.

[0049] It should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected" and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0050] The following is combined with Figures 1 to 4 The technical solution of the present invention is further illustrated by specific implementation methods.

[0051] A mass transfer device, comprising an operating table and a rotary transfer mechanism 20;

[0052] The operating table is provided with a material taking station 11 and a material placing station 12, wherein the material taking station 11 is used to place a wafer disc, and the material placing station 12 is used to place a circuit substrate;

[0053] The rotary transfer mechanism 20 is arranged above the operating table, and comprises a mounting seat, a rotating member 22, a driving member 25 and a plurality of transfer components 23. The driving member 25 is mounted on the mounting seat, and the rotating member 22 is movably arranged on the side wall of the mounting seat. The driving member 25 is used to drive the rotating member 22 to move around the mounting seat, and a plurality of transfer components 23 are installed on the rotating member 22 at intervals.

[0054] When one group of the transfer components 23 is located above the material taking station 11, another group of the transfer components 23 is located above the material discharging station 12, and the two groups of the transfer components 23 implement material taking and discharging at the same time.

[0055] By designing the rotating transfer mechanism 20, the device can simultaneously complete the material picking and unloading operations during one rotation process. Specifically, when one set of transfer components 23 is located above the material picking station 11 to adsorb and pick up chips, another set of transfer components 23 can be located above the unloading station 12 to unload and mount chips. This parallel operation method significantly reduces the time required for the adsorption device to go back and forth between the wafer and the circuit substrate multiple times in the traditional technology, thereby improving the overall efficiency of mass transfer.

[0056] Due to the design of the rotating transfer mechanism 20, the moving path of the transfer assembly 23 during the material picking and unloading process is relatively fixed, reducing the cumulative error that may be caused by multiple round trips and positioning adjustments. By accurately controlling the movement and rotation of the rotating member 22, it is possible to further ensure the precise alignment of each transfer assembly 23 during material picking and unloading, thereby improving the accuracy and yield of mass transfer.

[0057] The transfer device of the present invention realizes the automation and continuous operation of material picking and unloading through the integrated rotating transfer mechanism 20, simplifying the cumbersome operation steps in the traditional mass transfer technology. This not only reduces the difficulty of operation and labor costs, but also helps to improve the stability and reliability of the production line. The transfer device is suitable for application scenarios where the chip size is extremely small and the number is large, such as Mini / MicroLED, and can meet the needs of commercial production and application for efficient and high-precision mass transfer technology. By adjusting the number and layout of the transfer components 23, multiple groups of transfer components 23 can be implemented respectively for picking and unloading of materials in addition to the two groups of transfer components 23 corresponding to the material picking station 11 and the material unloading station 12, so that other multiple groups of transfer components 23 can be in a state of adsorbing chips and waiting to be transferred to the material unloading station 12 for unloading; and in an empty state, waiting to be transferred to the material picking station 11 for picking.

[0058] Further, the rotating member 22 includes a first portion, a second portion, a third portion and a fourth portion which are connected in sequence;

[0059] The left, right, front and back areas of the rotary transfer mechanism 20 are respectively used as the material taking area 01, the material discharging area 02, the material discharging area 03 and the material taking area 04. When the rotary member 22 moves, the first part, the second part, the third part and the fourth part can be respectively located in the material taking area 01, the material discharging area 02, the material discharging area 03 and the material taking area 04.

[0060] There are four groups of transfer assemblies 23, which are respectively arranged at the first part, the second part, the third part and the fourth part. The driving member 25 drives the rotating member 22 to drive the four groups of rotating assemblies 23 to circulate through the material taking area 01, the material discharge area 03, the material discharge area 02 and the material taking area 04 in sequence;

[0061] When one group of the transfer components 23 is located in the material picking area 01, the other three groups of the transfer components 23 are respectively located in the waiting material discharge area 03, the discharge area 02 and the waiting material picking area 04; when the transfer components 23 located in the material picking area 01 implement material picking, the transfer components 23 located in the discharge area 02 implement material discharge.

[0062] The material taking station 11 and the material placing station 12 on the operating table are used to place the wafer disc and the circuit substrate respectively, while the rotary transfer mechanism 20 is located above the operating table. This layout helps to optimize space utilization, making the entire device more compact and easy to operate.

[0063] By designing the rotating member 22 with an elliptical rotating path (including the first part, the second part, the third part and the fourth part), the path is divided into four areas (material collection area 01, material discharge area 03, material discharge area 02 and material collection area 04), and the four groups of transfer components 23 are alternately transferred in the four areas in turn, when one group of transfer components 23 is transferred to the material collection area 01, another group of transfer components 23 is located in the material discharge area 02, and the two groups of transfer components 23 implement material collection and discharge in the corresponding operation area. At the same time, the other two groups of transfer components 23 are respectively located in the material discharge area 03 and the material collection area 04 and are in a waiting state. Among the two groups of transfer components 23 in waiting, one group of transfer components 23 has chips adsorbed in the material discharging area 03, waiting to be transferred to the material discharging area 02 for the next material discharging; the other group of transfer components 23 is in an empty state in the material picking area 04, and this group of transfer components 23 transfers to the material picking area 04 after completing the material discharging, and waits to be transferred to the material picking area 01 for the next material picking. Such a design makes the entire transfer process more compact and efficient.

[0064] To further illustrate, since the material picking area 01, the material discharge area 03, the material discharge area 02 and the material discharge area 04 correspond to four consecutive positions (the first part, the second part, the third part and the fourth part) of the elliptical ring-shaped rotating part 22, assuming that the four groups of transfer components 23 located in the material picking area 01, the material discharge area 03, the material discharge area 02 and the material discharge area 04 at a certain moment are the first transfer component, the second transfer component, the third transfer component and the fourth transfer component, then the first transfer component is performing material picking in the material picking area 01 while the third transfer component is performing material discharge and mounting in the material discharge area 02; and the second transfer component has chips adsorbed and is waiting in the material discharge area 03, and the fourth transfer component is in an unloaded state and is waiting in the material discharge area 04. After the rotating part 22 rotates, the second transfer component with the chip adsorbed is transferred to the discharge area 02 and discharges and mounts the chip, the first transfer component with the chip adsorbed is transferred to the discharge area 03 to wait, the unloaded third transfer component that has completed discharge and mounting in the last operation is transferred to the pick-up area 04 to wait, and the unloaded fourth transfer component is transferred to the pick-up area 01 to pick up the material, thereby realizing cyclic picking and discharging.

[0065] Compared with traditional adsorption devices that require multiple round trips between the wafer disk and the circuit substrate, the transfer device of the present invention sets an elliptical ring-shaped transmission path, and sets four groups of transfer components 23 on the rotating part 22 to cyclically pass through the material picking area 01, the material discharge area 03, the material discharge area 02 and the material collection area 04. The transfer components 23 in the material picking area 01 and the material discharge area 02 synchronously implement material picking and discharging, and additional material discharge areas 03 and 04 are provided to solve the problem of long waiting and transfer time and low efficiency in the process of switching and implementing material picking and discharging between the material picking area and the material discharge area in the prior art. The transfer device of the present invention realizes synchronous and uninterrupted transfer of material picking and discharging, improves the transfer efficiency, and realizes continuous, cyclic, and efficient mass transfer operations.

[0066] Furthermore, the rotating member 22 is a transmission belt 221, and the driving member 25 includes two transmission rollers 251 and a driver. The transmission rollers 251 are mounted on the mounting seat, and the central axes of the two transmission rollers 251 are parallel to each other. The transmission belt 221 is sleeved on the outside of the two transmission rollers 251, and the driver drives the transmission belt 221 to rotate by driving the transmission rollers 251 to rotate.

[0067] The four groups of transfer components 23 are installed at intervals on the outer side of the transmission belt 221 .

[0068] The transmission belt 221 circulates on two parallel transmission rollers 251 to ensure the smooth operation of the rotating member 22. The driver drives the transmission belt 221 to rotate by driving any one of the transmission rollers 251. Therefore, the speed of the transmission belt can be controlled by adjusting the output speed of the driver, thereby adjusting the moving speed of the transfer assembly 23. This makes the device more flexible and can be quickly adjusted according to production needs.

[0069] Furthermore, the transfer assembly 23 includes a limiter 231, a first elastic member 232 and a plurality of transfer heads 233;

[0070] The two limiting members 231 are installed on the transmission belt 221 in a front-to-rear manner, two ends of the first elastic member 232 are respectively connected to the two limiting members 231 , and a plurality of transfer heads 233 are installed on the first elastic member 232 at intervals.

[0071] The structure of the transfer assembly 23 is relatively simple, mainly consisting of a stopper 231, a first elastic member 232 and a transfer head 233, and is easy to disassemble and replace. This design helps to reduce maintenance costs and improve the maintainability and service life of the equipment. By installing a plurality of transfer heads 233 at intervals, the same group of transfer assemblies 23 can simultaneously transfer multiple chips during a transfer process, thereby improving the transfer efficiency. At the same time, the design of the stopper 231 and the first elastic member 232 also helps to ensure that each transfer head 233 can accurately align with the chip position, reducing repeated operations and time waste caused by inaccurate alignment.

[0072] To further illustrate, multiple transfer heads 233 are installed at intervals on the first elastic member 232. The introduction of the first elastic member 232 can, on the one hand, absorb and buffer the impact force caused by mechanical vibration or improper operation to a certain extent, protect the transfer head 233 and the sucked tiny chips, and improve the transfer accuracy; on the other hand, under the action of the physical field (including magnetic field, thermal field, electric field, etc.) of the discharge area 02, the first elastic member 232 can be adjusted to adapt to the distance between each transfer head 233, so that it can adapt to the mounting requirements of the circuit substrate at the discharge station 12.

[0073] Furthermore, the rotation transfer mechanism 20 further includes two sets of limit assemblies 24, and the limit assemblies 24 are mounted on the mounting seat through a mounting frame;

[0074] One of the limit components 24 is located above the material taking area 01, and the limit component 24 is used to limit the transfer component 23 to the material taking area 01. The other limit component 24 is located above the material discharge area 02, and the limit component 24 is used to limit the transfer component 23 to the material discharge area 02.

[0075] The limiting component 24 can accurately position the transfer component 23 in the material picking area 01 and the material placing area 02, ensuring that the transfer component 23 is accurately aligned with the target position of the chip on the wafer and the circuit substrate. This helps to reduce the failure of picking or placing due to inaccurate positioning and improve the success rate and efficiency of transfer.

[0076] Specifically, when the rotating member 22 drives the transfer assembly 23 to switch between the four areas, if the transfer assembly 23 deviates from the specific operating area (material picking area or material discharge area) due to errors or inertia, the limit assembly 24 can promptly stop it from moving further to prevent the existence of errors and avoid multiple superpositions of errors, which would lead to a reduction in the yield of the transfer operation.

[0077] Furthermore, the limiting component 24 includes two electromagnetic adsorption sub-components, the two electromagnetic adsorption sub-components are arranged front and back oppositely, and the distance between the two electromagnetic adsorption sub-components is equal to the length of the transfer component 23;

[0078] The electromagnetic adsorption subassembly includes an electromagnet 241, a second elastic member 242 and a limiting iron block 243. The electromagnet 241 is installed on the mounting frame, and the limiting iron block 243 is arranged below the electromagnet 241 through the second elastic member 242.

[0079] When the electromagnet 241 is powered on, the electromagnet 241 absorbs the limiting iron block 243, and the limiting iron block 243 does not interfere with the transfer component 23; when the electromagnet 241 is powered off, the electromagnet 241 does not absorb the limiting iron block 243, and the front and rear limiting iron blocks 243 are respectively located on the front and rear sides of the two limiting members 231.

[0080] Through the power-on and power-off states of the electromagnet 241, the adsorption and release of the limiting iron block 243 can be precisely controlled, thereby realizing precise positioning of the transfer assembly 23. When the electromagnet 241 is powered on, the limiting iron block 243 is adsorbed, does not interfere with the transfer assembly 23, and allows it to move freely. Since the second elastic member 242 is used to connect the electromagnet 241 and the limiting iron block 243, when the electromagnet 241 adsorbs the limiting iron block 243, the second elastic member 242 is in a compressed state. When the electromagnet 241 is powered off, the limiting iron block 243 pops up downward under the action of the second elastic member 242, and the limiting iron blocks 243 of the electromagnetic adsorption subassemblies arranged relatively front and back are both in a pop-up state, acting on the front and back sides of the transfer assembly 23 entering the material taking area 01 (material discharge area 02) respectively, to realize the positioning function.

[0081] The design of the electromagnetic adsorption subassembly allows the limiting function of the limiting assembly 24 to be turned on or off as needed, thereby improving the flexibility of the device. Specifically, when the rotating member 22 rotates, when the four groups of transfer assemblies 23 need to change the working area, the limiting assembly 24 needs to implement avoidance, then by energizing the electromagnet 241, the electromagnet 241 will adsorb the limiting iron block 243 upward, so that the limiting iron block 243 leaves the moving path of the transfer assembly 23, allowing the transfer assembly 23 to move freely. When the transfer assembly 23 completes the transfer of the area, the electromagnet 241 is powered off, the electromagnet 241 does not adsorb the limiting iron block 243, and the limiting iron block 243 pops up downward.

[0082] Further explanation, the on-off state of the electromagnet of the limit assembly can be associated with the on-off state of the rotating member 22. When the rotating member 22 is powered on to drive the transmission belt 221 to drive the four groups of transfer assemblies 23 to rotate, the electromagnet is also powered on; before the rotating member 22 is powered off and stops rotating, the electromagnet is powered off before the rotating member 22, so that the power-on time of the electromagnet is shorter than the power-on time of the rotating member 22, so as to ensure that the limit assembly effectively limits the transfer assembly 23. By setting the rotating member 22 and the limit assembly 24 to synchronously control the precise position of the transfer assembly 23, that is, using the electrical system and the mechanical assembly for synchronous control, it is only necessary to align the wafer disc of the material picking station 11 and the circuit substrate of the material discharging station 12 respectively, so as to ensure the accurate position of the transfer assembly 23 in the material picking area 01 and the material discharging area 02; at the same time, each transfer of the transfer assembly 23 in the operation area has a limited operation, there is no error superposition, and the mass transfer accuracy is improved.

[0083] Furthermore, the limiting iron block 243 includes a fixing sleeve 2431 and a sliding block 2432;

[0084] The fixed sleeve 2431 is fixedly disposed at the bottom of the electromagnet 241 , and the upper portion of the slider 2432 is slidably disposed inside the fixed sleeve 2431 ;

[0085] The second elastic member 242 is located inside the fixed sleeve 2431 , the upper end of the second elastic member 242 is connected to the electromagnet 241 , and the lower end of the second elastic member 242 is connected to the slider 2432 ;

[0086] The lower portion of the sliding block 2432 is in an inverted cone shape.

[0087] By designing the limiting iron block 243 as a two-part structure including a fixed sleeve 2431 and a slider 2432, the entire device can be more flexibly operated under the action of the electromagnet 241. The upper part of the slider 2432 slides inside the fixed sleeve 2431, and the fixed sleeve 2431 provides a guide for the slider 2432 to move up and down and a stable support, which can effectively prevent the transfer component 23 from impacting the limiting component 24 due to inertia during the rapid rotation transfer process.

[0088] The two ends of the second elastic member 242 are connected to the electromagnet 241 and the slider 2432 respectively, and the second elastic member 242 is always inside the fixed sleeve 2431, which can more effectively utilize the space and prevent the second elastic member 242 from being disturbed by the external environment after being exposed. At the same time, this arrangement also enables the elastic member to better play its role, providing a stable reset force for the slider 2432, ensuring that the device can quickly return to the initial position when the power is off or the magnetism is lost.

[0089] The lower part of the slider 2432 is designed to be inverted cone shape. This shape makes it easier for the slider to adapt and adjust to each other when contacting the limiter 231 of the transfer assembly 23, thereby realizing the limit function. The inverted cone design increases the contact area between the slider 2432 and the limiter 231, thereby improving the stability and reliability of the limit. In addition, the inverted cone slope transition design also helps to reduce the rigid collision and wear between the slider 2432 and the limiter 231, thereby extending the service life of the device.

[0090] Furthermore, the transfer assembly 23 also includes an elastic top plate 234;

[0091] Both ends of the elastic top plate 234 are connected to the two limiting members 231 respectively, and the elastic top plate 234 is located above the first elastic member 232;

[0092] The top of the elastic top plate is flat, and when the transfer component moves relative to the limiting component, the bottom of the sliding block abuts against the top of the elastic top plate.

[0093] When the electromagnet 241 absorbs the limiting iron block 243 , the bottom of the sliding block 2432 is at a height higher than the top of the elastic top plate 234 .

[0094] A more stable structure can be formed by adding an elastic top plate 234 to the transfer assembly 23 and connecting it to the two stoppers 231. The elastic top plate 234 needs to have a deformable property to adapt the transfer assembly 23 to the material discharge area 03 and the material collection area 04 located in the second and fourth parts.

[0095] When the electromagnet 241 attracts the limiting iron block 243, the bottom of the slider 2432 is at a height higher than the top of the elastic top plate 234. Specifically, when the transfer assembly 23 rotates with the rotating member 22, the top of the elastic top plate 234 of the transfer assembly 23 abuts against the bottom of the slider 2432 or the bottom of the slider 2432 is higher than the top of the elastic top plate 234. This arrangement allows the transfer assembly 23 to pass smoothly during the transfer process without being blocked by the limiting assembly. In addition, since the electromagnet of the limiting assembly responds quickly to power on and off, the top of the transfer assembly 23 (elastic top plate 234) with a flat top is against the bottom of the slider 2432 during the transfer process. When the electromagnet is powered off before the rotating part 22, the slider 2432 pops up downward, and the inclined surface of the inverted cone bottom of the slider 2432 acts on the transfer assembly 23 that stops rotating after power is turned off, and limits and adjusts the position of the transfer assembly 23, so that the transfer assembly 23 stops accurately in the material picking area 01 / material discharge area 02.

[0096] Furthermore, the material taking station and the material placing station are respectively provided with a three-way movable carrier, the three-way movable carrier located at the material taking station is used to install the wafer tray, and the three-way movable carrier located at the material placing station is used to install the circuit substrate;

[0097] The unloading station 12 is provided with a physical field component, and the physical field component is used to generate a physical field to cause the first elastic member 232 to deform.

[0098] The three-way movable carrier 110 can realize free movement in three directions (such as X-axis, Y-axis and Z-axis), which makes the installation process of the wafer or circuit substrate more flexible and convenient. By accurately controlling the movement of the three-way movable carrier 110, it can be ensured that the wafer or circuit substrate is accurately placed at the predetermined position at the material picking station 11 or the material placing station 12, thereby improving the accuracy and efficiency of mass transfer. Figure 1 Only the three-way movable carrier set up at the material-retrieving station is shown, and the three-way movable carrier at the material-discharging station is not shown)

[0099] By setting a physical field component at the discharge station 12 to generate a physical field (such as an electromagnetic field, an electrostatic field, etc.), thereby indirectly acting on the transfer component located in the discharge area 02, precise control of the deformation of the first elastic member 232 is achieved, thereby adjusting the distance between each transfer head 233 of the transfer component located in the discharge area 02 to achieve chip mounting requirements for different circuit substrates.

[0100] A transfer method using the above-mentioned mass transfer device comprises the following steps:

[0101] S100, start the rotary transfer mechanism 20, and calibrate the four transfer components 23 to be located at the material taking area 01, the material discharging area 03, the material discharging area 02 and the material taking area 04 respectively;

[0102] S200, before the transfer, a positioning operation is performed, a wafer disk is installed at the three-way movable carrier 110 of the material taking station 11, and the three-way movable carrier 110 is adjusted so that the chip on the wafer disk is aligned with the transfer component 23 on the material taking area of ​​the rotating transfer mechanism 20; a circuit substrate to be mounted is placed at the material discharging station 12, and the three-way movable carrier is adjusted so that the empty position to be mounted on the circuit substrate to be mounted is aligned with the transfer component 23 on the material discharging area 02;

[0103] S300, the transfer assembly 23 located in the material picking area 01 picks the chips on the wafer disc of the material picking station 11; the transfer assembly 23 located in the material discharging area 03 discharges and mounts the circuit substrate to be mounted in the material discharging station 12, and the transfer assemblies 23 located in the material discharging area 03 and the material picking area 04 wait. Specifically, when the machine is turned on for the first time, since the four groups of transfer assemblies 23 are all in an unloaded state, when the two groups of transfer assemblies 23 located in the material picking area 01 and the material discharging area 02 synchronously pick and discharge, the transfer assembly 23 in the material discharging area 02 does not actually mount the circuit substrate, which does not affect subsequent operations.

[0104] S400, after synchronously completing one material picking and unloading, the rotating member 22 is powered on, and the four transfer components 23 arranged on the transmission belt 221 are synchronously and unidirectionally transferred to the next area; at the same time, the wafer plate and the circuit substrate are respectively moved under the action of the three-way movable carrier 110, the wafer plate moves to the next material picking position, waiting for the next group of transfer components 23 to pick up, and the circuit substrate moves to the next unloading position, waiting for the next group of transfer components 23 to unload;

[0105] After the four groups of transfer components 23 are in place, the rotating member 22 is powered off and stops rotating. This is equivalent to the transfer components 23 that have completed the material collection in step S300 being transferred to the material discharging area 03; similarly, the transfer components 23 in the material discharging area 03 are transferred to the material discharging area 02 to discharge the material; the transfer components 23 in the material discharging area 02 are transferred to the material discharging area 04 to wait; the transfer components 23 in the material discharging area 04 are transferred to the material discharging area 01 to pick up the material.

[0106] S500, after the rotating part 22 drives the four groups of transfer components 23 to move positions, step S300 is repeated to make the transfer components 23 located in the material taking area 01 and the material discharge area 02 synchronously take and discharge materials. After the synchronous taking and discharge is completed, step S400 is repeated, and the transfer components 23 are driven by the rotating part 22 to transfer.

[0107] By using the rotating part 22 and the limiting component 24 to simultaneously control the start and stop positions of the transfer component 23, that is, using the electrical system and the mechanical component for synchronous control, the position of the transfer component 23 in the material picking area 01 and the material discharge area 02 is guaranteed to remain unchanged. Only the wafer disc and the circuit substrate at the bottom of the material picking area 01 and the material discharge area 02 need to be aligned once respectively, so that each transfer component 23 does not need to be aligned again after it is in place, and there is no superposition of alignment errors, thereby improving the alignment accuracy. By starting the rotating part 22, each group of transfer components 23 can be circulated in sequence between the four areas of the material picking area 01, the material discharge area 03, the material discharge area 02 and the material picking area 04. This cyclic movement mechanism ensures that the transfer component can continuously and efficiently perform material picking and mounting operations, thereby improving the overall transfer efficiency.

[0108] Further, in step S400, it also includes S410, the limit component 24 implements a limit operation, the power-on time of the electromagnet 241 of the limit component 24 is shorter than the power-on time of the rotating part 22, and after the electromagnet 241 is powered off, the limit iron block 243 pops out, and the two limit iron blocks 243 limit the transfer component 23 to the material picking area 01 or the material discharge area 02.

[0109] By introducing the limit assembly 24, when the rotating member 22 drives the transfer assembly 23 to transfer position, the electromagnet 241 is energized, and the limit iron block 243 is adsorbed so that the limit assembly 24 and the transfer assembly 23 do not interfere with each other; when the electromagnet 241 is powered off, the electromagnet 241 does not adsorb the limit iron block 243, and the limit iron block 243 pops up downward to the transfer path of the transfer assembly 23, thereby physically limiting the movement of the transfer assembly 23. This can ensure that the transfer assembly 23 can accurately stay at the predetermined position (such as the material picking area 01 or the material discharge area 02) after each movement, avoiding material picking or discharge errors caused by position deviation.

[0110] The power-on time of the electromagnet 241 is shorter than the power-on time of the rotating member 22 to ensure that the power-off of the limiting assembly is prior to the stopping of the transmission belt 221 , so that the limiting assembly can effectively mechanically limit the transfer assembly 23 .

[0111] The technical principle of the present invention is described above in conjunction with specific embodiments. These descriptions are only for explaining the principle of the present invention and cannot be interpreted as limiting the scope of protection of the present invention in any way. Based on the explanations herein, those skilled in the art can associate other specific implementations of the present invention without paying creative labor, and these methods will fall within the scope of protection of the present invention.

Claims

1. A mass transfer device, characterized in that: Includes an operating table and a rotating transfer mechanism; The operating table is provided with a material taking station and a material placing station, the material taking station is used to place the wafer disc, and the material placing station is used to place the circuit substrate; The rotary transfer mechanism is arranged above the operating table, and comprises a mounting seat, a rotating member, a driving member and a plurality of transfer components, wherein the driving member is mounted on the mounting seat, the rotating member is movably arranged on the side wall of the mounting seat, the driving member is used to drive the rotating member to move around the mounting seat, and a plurality of transfer components are installed on the rotating member at intervals; When one group of the transfer components is located above the material taking station, another group of the transfer components is located above the material discharging station, and the two groups of the transfer components perform material taking and discharging simultaneously.

2. A mass transfer device according to claim 1, characterized in that: The rotating member comprises a first part, a second part, a third part and a fourth part which are connected in sequence; The left, right, front and back areas of the rotary transfer mechanism are respectively used as a material taking area, a material discharging area, a material to be discharged area and a material to be taken area. When the rotary member moves, the first part, the second part, the third part and the fourth part can be respectively located in the material taking area, the material discharging area, the material to be discharged area and the material to be taken area. There are four groups of transfer components, which are respectively arranged on the first part, the second part, the third part and the fourth part. The driving member drives the rotating member to drive the four groups of rotating components to circulate through the material taking area, the material discharge area, the material discharge area and the material taking area in sequence; When one group of the transfer components is located in the material taking area, the other three groups of the transfer components are respectively located in the area to be discharged, the discharge area and the area to be taken; when the transfer components located in the material taking area implement material taking, the transfer components located in the discharge area implement material discharge.

3. A mass transfer device according to claim 2, characterized in that: The rotating member is a transmission belt, and the driving member includes two transmission rollers and a driver. The transmission rollers are mounted on the mounting seat, and the central axes of the two transmission rollers are parallel to each other. The transmission belt is sleeved on the outside of the two transmission rollers, and the driver drives the transmission belt to rotate by driving the transmission rollers to rotate; Four groups of the transfer components are installed at intervals on the outer side of the transmission belt.

4. A mass transfer device according to claim 3, characterized in that: The transfer assembly includes a limiter, a first elastic member and a plurality of transfer heads; The two limiting members are installed on the transmission belt in a front-to-back manner, two ends of the first elastic member are respectively connected to the two limiting members, and a plurality of transfer heads are installed on the first elastic member at intervals.

5. A mass transfer device according to claim 4, characterized in that: The rotation transfer mechanism further comprises two sets of limit assemblies, and the limit assemblies are mounted on the mounting seat via a mounting frame; One of the limit components is located above the material taking area, and the limit component is used to limit the transfer component to the material taking area. The other limit component is located above the material discharge area, and the limit component is used to limit the transfer component to the material discharge area.

6. A mass transfer device according to claim 5, characterized in that: The limit assembly includes two electromagnetic adsorption subassemblies, the two electromagnetic adsorption subassemblies are arranged front and back oppositely, and the distance between the two electromagnetic adsorption subassemblies is equal to the length of the transfer assembly; The electromagnetic adsorption subassembly comprises an electromagnet, a second elastic member and a limiting iron block, wherein the electromagnet is mounted on the mounting frame, and the limiting iron block is disposed below the electromagnet through the second elastic member; When the electromagnet is energized, it absorbs the limiting iron block, and the limiting iron block does not interfere with the transfer assembly; when the electromagnet is de-energized, it does not absorb the limiting iron block, and the front and rear limiting iron blocks are respectively located on the front and rear sides of the two limiting parts.

7. A mass transfer device according to claim 6, characterized in that: The limiting iron block includes a fixed sleeve and a sliding block; The fixed sleeve is fixedly arranged at the bottom of the electromagnet, and the upper part of the sliding block is slidably arranged inside the fixed sleeve; The second elastic member is located inside the fixed sleeve, the upper end of the second elastic member is connected to the electromagnet, and the lower end of the second elastic member is connected to the slider; The lower part of the sliding block is in an inverted cone shape.

8. The mass transfer device according to claim 7, characterized in that: The transfer assembly also includes an elastic top plate; The two ends of the elastic top plate are respectively connected to the two limiting members, and the elastic top plate is located above the first elastic member; The top of the elastic top plate is flat, and when the transfer component moves relative to the limiting component, the bottom of the sliding block abuts against the top of the elastic top plate.

9. The mass transfer device according to claim 8, characterized in that: The material taking station and the material placing station are respectively provided with a three-way movable carrier, the three-way movable carrier located at the material taking station is used to install the wafer plate, and the three-way movable carrier located at the material placing station is used to install the circuit substrate; The material discharging station is provided with a physical field component, and the physical field component is used to generate a physical field to cause the first elastic member to deform.

10. A transfer method using the mass transfer device according to any one of claims 1 to 9, characterized in that: The following steps are involved: S100, start the rotary transfer mechanism, and calibrate the four transfer components to be located in the material taking area, the material discharging area, the material discharging area and the material taking area respectively; S200, placing the wafer tray on the material taking station, placing the circuit substrate to be mounted on the material discharging station; aligning the wafer tray with the transfer component on the material taking area, and aligning the circuit substrate with the transfer component on the material discharging area; S300, the transfer assembly located in the material taking area performs material taking, the transfer assembly located in the material discharging area performs material discharging, and the transfer assembly located in the material discharging area and the material taking area performs waiting; S400, the rotating part is powered on, and the four transfer components start to rotate synchronously; after the transfer components are transferred to the next area respectively, the rotating part is powered off and stops rotating; S500: Repeat S300 and S400 to achieve mass transfer.

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