Display module and electronic equipment

Abstract

The invention discloses a display module and electronic equipment, and belongs to the field of electronic equipment, the display module comprises a substrate layer, a display layer and a protection circuit, the display layer is arranged on the substrate layer, the display layer comprises a transition area and a coverage area, the transition area is bendable, the coverage area is of a planar structure, and the protection circuit is arranged on the transition area. The coverage area and the transition area are distributed along a first direction, and the first direction is perpendicular to the thickness direction of the substrate layer; the protection circuit is installed on the substrate layer, the coverage area covers the protection circuit, and a partition gap is formed between the first edge, close to the transition area, of the coverage area and the transition area.

Description

Technical Field

[0001] The present application belongs to the technical field of electronic equipment, and specifically relates to a display module and an electronic equipment. Background Art

[0002] Due to the convenience they bring to users, mobile phones and other electronic devices have become indispensable devices in people's work and life, and the display screen is an extremely important component of electronic devices, and its service life is directly related to the overall life of the electronic device. As the functions of electronic devices continue to improve, the replacement cycle of electronic devices is also increasing, which also puts higher requirements on the working life of components such as display screens.

[0003] Generally speaking, the service life of organic light-emitting semiconductor OLED can exceed 10 years, but its service life is also closely related to the working environment. The applicant has found that the failure rate of the display screen of current electronic devices will increase significantly after three to four years of use. Among them, for the display screen of electronic devices used in a relatively humid environment, its service life is not only relatively shorter, but also the problem of vertical line defects is more serious, which seriously affects the user experience of the product. Summary of the invention

[0004] The purpose of the embodiments of the present application is to provide a display module and an electronic device to solve the problem that the current display module not only has a relatively shorter service life when working in a relatively humid environment, but is also prone to vertical line defects.

[0005] In a first aspect, an embodiment of the present application discloses a display module, which includes a substrate layer, a display layer and a protection circuit, wherein: The display layer is arranged on the substrate layer, the display layer comprises a transition area and a covering area, the transition area is bendable, the covering area is a planar structure, the covering area and the transition area are distributed along a first direction, and the first direction is perpendicular to the thickness direction of the substrate layer; The protection circuit is installed on the substrate layer, the covering area covers the outside of the protection circuit, and a partition gap is provided between the first edge of the covering area close to the transition area and the transition area.

[0006] In a second aspect, an embodiment of the present application discloses an electronic device, which includes a housing and the above-mentioned display module.

[0007] The embodiment of the present application discloses a display module, wherein a display layer is arranged on a substrate layer, and the display layer includes a transition area and a covering area, wherein the transition area is bendable, the covering area is a planar structure, and the covering area and the transition area are distributed along a first direction perpendicular to the thickness direction of the substrate layer. In this case, by making the covering area cover the outside of the protection circuit installed on the substrate layer, the covering area can provide protection for the protection circuit; at the same time, by providing a partition gap between the first edge of the covering area close to the transition area and the transition area, the transition area and the covering area are separated as a whole. In this case, even if fine cracks are generated on the surface of the transition area after bending, due to the partition gap provided between the covering area and the transition area, it is difficult for water vapor and oxygen entering the display layer from the transition area to be transmitted into the covering area through the same layer, thereby preventing water vapor and oxygen from corroding the protection circuit, ensuring that the protection circuit is not easily damaged, thereby making it difficult for the display module to have a vertical line defect problem, and the service life of the display module can be improved as a whole, thereby improving the user experience of electronic devices using the display module. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] The drawings described herein are used to provide a further understanding of the present application and constitute a part of the present application. The illustrative embodiments of the present application and their descriptions are used to explain the present application and do not constitute an improper limitation on the present application. In the drawings: Figure 1 A cross-sectional schematic diagram of a display module disclosed in an embodiment of the present application; Figure 2 for Figure 1 A top view of the structure shown; Figure 3 A schematic cross-sectional view of a partial structure including a display layer in a display module disclosed in an embodiment of the present application; Figure 4 for Figure 3 A top view of the structure is shown.

[0009] Reference numerals: 100-substrate layer, 200-display layer, 201-partition gap, 210-transition area, 220-covering area, 230-connecting area, 300-touch layer, 310-touch inorganic layer, 320-touch organic layer, 400-protection circuit, 500-chip, 600-soldering pad, 700-conductive adhesive, 800-S / D circuit. DETAILED DESCRIPTION

[0010] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0011] The terms "first", "second", etc. in the specification and claims of the present application are used to distinguish similar objects, and are not used to describe a specific order or sequence. It should be understood that the data used in this way can be interchangeable under appropriate circumstances, so that the embodiments of the present application can be implemented in an order other than those illustrated or described here, and the objects distinguished by "first", "second", etc. are generally of one type, and the number of objects is not limited. For example, the first object can be one or more. In addition, "and / or" in the specification and claims represents at least one of the connected objects, and the character " / " generally indicates that the objects associated with each other are in an "or" relationship.

[0012] like Figure 1-Figure 4 As shown, the embodiment of the present application discloses a display module to solve the problem that the current display module is more likely to have vertical line defects when working in a relatively humid environment, thereby greatly improving the overall life of the display module.

[0013] In view of the fact that the service life of the display screen is relatively shorter in a humid operating environment and it is more prone to the problem of poor vertical lines, the inventor found after troubleshooting the faulty products that the direct cause of the above problems is that the protection circuit in the display module is damaged and the vias in its circuit area are corroded, which in turn causes the film layer in the circuit area to peel off, causing the S / D circuit to be open and the signal to be unable to be written normally, which in turn causes the switch tube circuit to be in a normally open state, the current to increase, the corresponding display bar to be always on, and the problem of poor vertical lines to occur.

[0014] In order to further explore the root cause of the damage to the protection circuit in the display module, after proposing a variety of creative hypotheses and conducting targeted verification of the various hypotheses, the inventor creatively discovered that the reason why the current display screen has the above-mentioned problems is that in order to reduce the size of the black border of the display screen, manufacturers usually further reduce the bending radius of the flexible display screen, which leads to an increase in the stress in the bending area of ​​the display screen, thereby causing fine cracks on the bent surface of the display layer. As the use time increases, water vapor and oxygen can easily enter the display layer through the cracks and invade the protection circuit buried in the display layer. When power is on, an electrochemical reaction will occur at the protection circuit, which will cause the vias in the circuit area to be corroded, ultimately causing the switch tube circuit to be normally open, resulting in poor vertical line phenomenon.

[0015] Based on the above creative findings, the inventors have improved the structure of the display module to alleviate or even solve the above problems. Figure 1 As shown, the display module disclosed in the embodiment of the present application includes a substrate layer 100, a display layer 200 and a protection circuit 400. Of course, the display module may also generally include other devices such as an S / D circuit 800, a touch layer 300 and a chip 500.

[0016] Among them, the substrate layer 100 is the basic structure of the display module, and other devices in the display module can be directly or indirectly formed or arranged on the substrate layer 100. Generally, the substrate layer 100 can be formed of materials such as glass. In the display module disclosed in the embodiment of the present application, the substrate layer 100 can be formed of flexible materials, and specifically can be formed of inorganic materials. Correspondingly, structures such as the display layer 200 and the touch layer 300 are also formed of deformable materials to ensure that the entire display module has the ability to be deformed, so that the edge of the display module can be bent to reduce the size of the black border of the part of the display module directly exposed to the surface of the electronic device, thereby increasing the visible area of ​​the exposed part of the display module.

[0017] In detail, the display layer 200 is arranged on the substrate layer 100. Of course, the display layer 200 may also include a plurality of layer structures so that the display layer 200 has the ability to emit light, thereby enabling the display layer 200 to provide a display function in the display module. It should be noted that when the display module disclosed in the embodiment of the present application is in a working state, not all parts of the display layer 200 are necessarily exposed outside the electronic device. In detail, part of the structure at the edge of the display layer 200 can form a double-layer structure of the display layer 200 after bending, that is, other parts of the display layer 200 also exist on the back of the exposed part of the display layer 200, and correspondingly, the chip 500 and the protection circuit 400 can be installed on the non-exposed part of the display layer 200.

[0018] In more detail, the display layer 200 includes a transition area 210 and a covering area 220, wherein the covering area 220 is a non-exposed portion of the display layer 200, and the covering area 220 is located on one side of the transition area 210, wherein the transition area 210 is bendable, that is, the transition area 210 has the ability to bend, and usually, after the processing of the display module is completed, the transition area 210 is in a bent shape; and for the covering area 220, it is a planar structure, but this does not mean that the covering area 220 does not have the ability to bend, but means that after the processing of the display module is completed, the covering area 220 is usually still a planar structure.

[0019] Furthermore, in the embodiment of the present application, the covering area 220 and the transition area 210 are distributed along a first direction, wherein the first direction is perpendicular to the thickness direction of the substrate layer 100. More intuitively, the first direction is Figure 1 The direction X in the substrate layer 100 is the thickness direction of Figure 1 The second direction mentioned below is the direction perpendicular to the paper surface. Of course, before the display module is bent, that is, when the transition area 210 is still a planar structure, the side of the transition area 210 away from the covering area 220 is also provided with a partial structure of the display layer 200 (referred to as the display area). This partial structure (i.e., the aforementioned display area) is the part of the display layer 200 that is directly used to provide a display function. In other words, after the display module is assembled in the electronic device, this part is exposed and serves as the display surface of the display module.

[0020] As described above, the substrate layer 100 is disposed below the display layer 200. Correspondingly, since the cover area 220 does not provide a display function, the portion of the substrate layer 100 corresponding to the cover area 220 can be used to install electronic devices. Of course, the portion of the substrate layer 100 located between the transition area 210 and the cover area 220 can also be used to install electronic devices, and even at least the portion of the substrate layer 100 corresponding to the transition area 210 can also serve as a base for installing electronic devices. Based on this, in the embodiment of the present application, the protection circuit 400 is installed on the substrate layer 100, and in order to provide protection for the protection circuit 400, such as Figure 1 As shown, the cover area 220 may be covered outside the protection circuit 400 .

[0021] As described above, the transition zone 210 of the display layer 200 is bent after the display module is processed. Furthermore, in the process of bending the portion of the display module where the transition zone 210 is located, small cracks inevitably appear on the surface of the transition zone 210. Furthermore, in order to prevent water vapor and oxygen from entering the transition zone 210 through the cracks in the transition zone 210 and invading the covering zone 220, causing an electrochemical reaction in the protection circuit 400 when powered on, in an embodiment of the present application, a partition gap 201 is provided between the first edge of the covering zone 220 close to the transition zone 210 and the transition zone 210, so as to utilize the partition gap 201 to separate the covering zone 220 and the transition zone 210. In this case, water vapor and oxygen can be prevented from being continuously transmitted in the same layer structure (i.e., the display layer 200) to damage the protection circuit 400. Specifically, in the thickness direction of the substrate layer 100 , the partition gap 201 extends to the substrate layer 100 , and in the first direction, the size of the partition gap 201 can be flexibly determined according to actual conditions, and is not limited herein.

[0022] The embodiment of the present application discloses a display module, wherein a display layer 200 is arranged on a substrate layer 100, and the display layer 200 includes a transition area 210 and a covering area 220, wherein the transition area 210 is bendable, the covering area 220 is a planar structure, and the covering area 220 and the transition area 210 are distributed along a first direction perpendicular to the thickness direction of the substrate layer 100. In this case, by making the covering area 220 cover the outside of the protection circuit 400 installed on the substrate layer 100, the covering area 220 can provide protection for the protection circuit 400; at the same time, by setting a partition gap between the first edge of the covering area 220 close to the transition area 210 and the transition area 210 The opening 201 makes the transition area 210 and the covering area 220 separated as a whole. In this case, even if fine cracks are generated on the surface of the transition area 210 after being bent, since the partition opening 201 is provided between the covering area 220 and the transition area 210, it is difficult for water vapor and oxygen entering the display layer 200 from the transition area 210 to be transmitted through the same layer into the covering area 220, thereby preventing water vapor and oxygen from corroding the protection circuit 400, ensuring that the protection circuit 400 is not easily damaged, thereby making it less likely for the display module to have a vertical line defect, and the service life of the display module can be improved as a whole, thereby improving the user experience of electronic devices using the display module.

[0023] As described above, a partition notch 201 is provided between the first edge of the cover area 220 and the transition area 210. In order to ensure that the protection circuit 400 can be protected by the partition notch 201 as a whole, in the second direction, the opposite ends of the partition notch 201 can be arranged flush with the opposite side edges of the protection circuit 400, wherein the second direction is perpendicular to the first direction and the thickness direction of the substrate layer 100. Generally, in order to ensure that the protection circuit 400 can be processed normally, in the second direction, the opposite side edges of the protection circuit 400 are spaced correspondingly with the opposite side edges of the substrate layer 100, that is, the protection circuit 400 does not extend to the edge of the substrate layer 100. Furthermore, in the embodiment of the present application, in the second direction, the opposite ends of the partition notch 201 can also not extend to the edge of the substrate layer 100. In other words, in the embodiment of the present application, the cover area 220 and the transition area 210 are not completely disconnected.

[0024] In order to further enhance the protection effect of the protection circuit 400, in another embodiment of the present application, Figure 3 and Figure 4As shown, in the second direction, the opposite ends of the partition gap 201 can be extended to the opposite side edges of the substrate layer 100, respectively, so that the cover area 220 and the transition area 210 are completely disconnected, thereby maximally preventing the water vapor and oxygen that invade the transition area 210 from entering the cover area 220 through the same layer transmission, thereby corroding the protection circuit 400 in the cover area 220. In addition, when the technical solution disclosed in the embodiment of the present application is adopted, the processing difficulty of the partition gap 201 can also be reduced. More specifically, during the processing of the display module, the partition gap 201 can be formed by etching.

[0025] As described above, in the display module disclosed in the embodiment of the present application, the display layer 200 includes a transition area 210 and a covering area 220, and the covering area 220 and the transition area 210 are distributed along the first direction. Optionally, the partition gap 201 is directly sandwiched between the transition area 210 and the covering area 220. In order to facilitate the formation of the partition gap 201 and improve the connection reliability between the transition area 210 and the substrate layer 100, in another embodiment of the present application, the display layer 200 also includes a connection area 230, and the connection area 230 is also a planar structure. The surface of the connection area 230 facing the substrate layer 100 is coplanar with the surface of the covering area 220 facing the substrate layer 100. The connection area 230 is connected to the transition area 210, and the partition gap 201 is sandwiched between the connection area 230 and the covering area 220.

[0026] In this case, a connection area 230 is further provided between the cover area 220 and the transition area 210 which is easily invaded by water vapor and oxygen, so that the connection area 230 can not only improve the connection reliability between the transition area 210 and the substrate layer 100, but also further prevent water vapor and oxygen from invading the cover area 220 through the transition area 210. In addition, when the connection area 230 is provided between the transition area 210 and the cover area 220, the connection area 230 can also be used to provide protection for the corresponding devices on the substrate layer 100. Specifically, the substrate layer 100 is provided with an S / D circuit 800, and the connection area 230 covers the S / D circuit 800.

[0027] As described above, in addition to the display layer 200 and the substrate layer 100, the display module generally includes a touch layer 300. More specifically, the touch layer 300 is disposed on the side of the display layer away from the substrate layer 100. At the same time, in the process of forming the touch layer 300, the portion of the touch layer 300 opposite to the partition gap 201 can be arranged in contact with the substrate layer 100. That is, a portion of the touch layer 300 is filled in the isolation gap, so that the transition area 210 and the cover area 220 are isolated by using the physical structure of the touch layer 300, thereby further limiting the water vapor and oxygen in the transition area 210 from passing through the touch layer 300 and entering the cover area 220, thereby improving the service life of the protection circuit 400.

[0028] Specifically, the touch layer 300 can be formed on the surface of the display layer 200 facing away from the substrate layer 100 by evaporation, and during the formation of the touch layer 300, the portion of the touch layer 300 opposite to the isolation gap can be directly embedded in the isolation gap and bonded to the substrate layer 100 to reduce the difficulty of forming the touch layer 300.

[0029] More specifically, the touch layer 300 may include a touch inorganic layer 310, and a portion of the touch inorganic layer 310 covers the surface of the transition area 210 and the cover area 220 on the side away from the substrate layer 100. Further, the touch layer 300 also includes a touch organic layer 320, and a portion of the touch organic layer 320 also covers the surface of the transition area 210 and the cover area 220 on the side away from the substrate layer 100. Of course, the touch organic layer 320 covers the side of the touch inorganic layer 310 away from the substrate layer 100. At the same time, in the embodiment of the present application, the portions of the touch inorganic layer 310 and the touch organic layer 320 that are opposite to the partition notch 201 are both embedded in the partition notch 201, and the touch inorganic layer 310 is arranged in contact with the portion of the substrate layer 100 that is opposite to the partition notch 201, which can further improve the isolation effect, reliability and sustainability between the cover area 220 and the transition area 210.

[0030] In addition, the display module further includes a chip 500. Specifically, the substrate layer 100 is provided with a pad 600, which serves as an electrical connection device for the chip 500. At the same time, the second edge of the cover area 220 away from the transition area 210 is spaced from the pad 600 to prevent the two from forming an electrical connection relationship and hindering the normal operation of the display layer 200. That is, in the first direction, the cover area 220 is sandwiched between the transition area 210 and the pad 600, and a partition notch 201 is provided between the first edge of the cover area 220 close to the transition area 210 and the transition area 210, and a gap of a certain size is also provided between the second edge of the cover area 220 away from the transition area 210 and the pad 600.

[0031] In more detail, the chip 500 is connected to the pad 600 through the conductive glue 700. In order to insulate the conductive glue 700 from the display layer 200, the touch inorganic layer 310 can cover the portion of the display layer 200 adjacent to the conductive glue 700. In detail, the touch inorganic layer 310 is disposed on the side of the display layer 200 away from the substrate layer 100, and the touch inorganic layer 310 extends to a position covering the second edge of the cover area 220. In this case, the conductive glue 700 between the cover area 220 and the pad 600 can be insulated from the cover area 220 through the touch inorganic layer 310, so that the chip 500 and the pad 600 can both maintain an insulation relationship with the display layer 200 while the chip 500 and the pad 600 are electrically connected. Specifically, the conductive adhesive 700 is anisotropic conductive adhesive 700 to further prevent the devices distributed around the conductive adhesive 700 in a thickness direction perpendicular to the substrate layer 100 from forming an electrical connection relationship through the conductive adhesive 700.

[0032] As described above, the chip 500 is electrically connected to the pad 600 through the conductive adhesive 700. Therefore, in the process of assembling the chip 500, it is usually necessary to apply a certain downward pressure to the chip 500 so that a relatively reliable bonding and electrical connection is formed between the chip 500 and the conductive adhesive 700, and between the conductive adhesive 700 and the pad 600. Furthermore, when assembling the chip 500, if the conductive adhesive 700 is directly connected to the relatively hard touch inorganic layer 310, the downward pressure will be applied to the display layer 200 due to process fluctuations, which will cause fine cracks to appear in the covering area 220 adjacent to the conductive adhesive 700, especially the second edge of the covering area 220, which is easily invaded by external water vapor and oxygen, thereby corroding the protection circuit 400 in the covering area 220.

[0033] To this end, in a specific embodiment of the present application, in the first direction, the chip 500 can be located on the side of the second edge of the cover area 220 away from the transition area 210, and spaced from the cover area 220. That is, in the embodiment of the present application, in a plane perpendicular to the thickness direction of the substrate layer 100, the projection of the chip 500 is located on the side of the projection of the cover area 220 away from the transition area 210, and the projection of the chip 500 and the projection of the cover area 220 are spaced from each other. In this case, when the chip 500 is assembled, since the second edge of the cover area 220 is no longer located directly below the chip 500, the downward pressure applied by assembling the chip 500 will basically not directly act on the second edge of the cover area 220, thereby greatly reducing the probability of cracks in the cover area 220. More intuitively, in the embodiment of the present application, along the first direction, the size of the spacing between the second edge of the cover area 220 and the pad 600 can be between 48um and 64um.

[0034] In order to further prevent cracks from forming in the cover area 220, in another embodiment of the present application, the display module may further include a touch control organic layer 320. As described above, the touch control organic layer 320 is disposed on the side of the touch control inorganic layer 310 away from the display layer 200, and in the embodiment of the present application, the touch control inorganic layer 310 is extended to between the second edge of the cover area 220 and the pad 600. Since the material of the touch control organic layer 320 is softer than that of the touch control inorganic layer 310, the touch control organic layer 320 can provide a buffering effect, so that during the process of assembling the chip 500, the downward pressure applied by the chip 500 can be double buffered by the conductive adhesive 700 and the touch control organic layer 320, which can greatly reduce the probability of the cover area 220 being squeezed and cracked, thereby preventing water vapor and oxygen from directly invading the cover area 220 from the second edge of the cover area 220.

[0035] In order to ensure that the touch organic layer 320 provides a relatively good buffering effect while not having a significant impact on the thickness of the entire display module, in a specific embodiment of the present application, the thickness of the portion of the touch organic layer 320 located between the conductive glue 700 and the touch inorganic layer 310 can be between 2um and 3um. More specifically, the thickness of the aforementioned portion of the touch organic layer 320 can be 2.5um.

[0036] Based on the display module disclosed in any of the above embodiments, the present application also discloses an electronic device, which includes a housing and any of the above display modules, and the display module is connected to the housing. Of course, the electronic device can also generally include other devices such as a battery and a camera module.

[0037] It should be noted that, in this article, the terms "comprise", "include" or any other variant thereof are intended to cover non-exclusive inclusion, so that the process, method, article or device including a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise one..." do not exclude the presence of other identical elements in the process, method, article or device including the element. In addition, it should be pointed out that the scope of the methods and devices in the embodiments of the present application is not limited to performing functions in the order shown or discussed, and may also include performing functions in a substantially simultaneous manner or in reverse order according to the functions involved, for example, the described method may be performed in an order different from that described, and various steps may also be added, omitted, or combined. In addition, the features described with reference to certain examples may be combined in other examples.

[0038] The embodiments of the present application are described above in conjunction with the accompanying drawings, but the present application is not limited to the above-mentioned specific implementation methods. The above-mentioned specific implementation methods are merely illustrative and not restrictive. Under the guidance of the present application, ordinary technicians in this field can also make many forms without departing from the purpose of the present application and the scope of protection of the claims, all of which are within the protection of the present application.

Claims

1. A display module, characterized in that: It comprises a substrate layer (100), a display layer (200) and a protection circuit (400), wherein: The display layer (200) is arranged on the substrate layer (100), the display layer (200) comprises a transition area (210) and a cover area (220), the transition area (210) is bendable, the cover area (220) is a planar structure, the cover area (220) and the transition area (210) are distributed along a first direction, and the first direction is perpendicular to the thickness direction of the substrate layer (100); The protection circuit (400) is installed on the substrate layer (100), the covering area (220) covers the outside of the protection circuit (400), and a partition gap (201) is provided between a first edge of the covering area (220) close to the transition area (210) and the transition area (210).

2. The display module according to claim 1, characterized in that: In a second direction perpendicular to both the first direction and the thickness direction, opposite ends of the partition notch (201) extend to opposite side edges of the substrate layer (100) respectively.

3. The display module according to claim 1, characterized in that: The display layer (200) further comprises a connection area (230), the connection area (230) being a planar structure, and the surface of the connection area (230) facing the substrate layer (100) and the surface of the covering area (220) facing the substrate layer (100) are arranged coplanarly, the connection area (230) is connected to the transition area (210), and the partition notch (201) is sandwiched between the connection area (230) and the covering area (220).

4. The display module according to claim 1, characterized in that: The display module comprises a touch layer (300), the touch layer (300) being arranged on a side of the display layer (200) facing away from the substrate layer (100), and a portion of the touch layer (300) opposite to the partition notch (201) being arranged in contact with the substrate layer (100).

5. The display module according to claim 4, characterized in that: The touch layer (300) comprises a touch inorganic layer (310) and a touch organic layer (320), wherein the touch inorganic layer (310) and the touch organic layer (320) are sequentially arranged on a side of the display layer (200) away from the substrate layer (100), and portions of the touch inorganic layer (310) and the touch organic layer (320) that are opposite to the partition notch (201) are both embedded in the partition notch (201).

6. The display module according to claim 1, characterized in that: The substrate layer (100) is provided with a solder pad (600), the display module comprises a touch-control inorganic layer (310) and a chip (500), and the chip (500) is connected to the solder pad (600) via a conductive adhesive (700); The touch inorganic layer (310) is arranged on a side of the display layer (200) away from the substrate layer (100); a second edge of the covering area (220) away from the transition area (210) is spaced apart from the pad (600); the touch inorganic layer (310) extends to the end face of the second edge covering the covering area (220); and the conductive adhesive (700) is insulated from the covering area (220) through the touch inorganic layer (310).

7. The display module according to claim 6, characterized in that: In the first direction, the chip (500) is located on a side of the second edge of the cover area (220) away from the transition area (210), and is spaced apart from the cover area (220).

8. The display module according to claim 6, characterized in that: The display module comprises a touch organic layer (320), the touch organic layer (320) being arranged on a side of the touch inorganic layer (310) away from the display layer (200), and the touch inorganic layer (310) extending to between a second edge of the cover area (220) and the pad (600).

9. The display module according to claim 8, characterized in that: The thickness of a portion of the touch-control organic layer (320) located between the conductive glue (700) and the touch-control inorganic layer (310) is between 2um and 3um.

10. An electronic device, characterized in that: It comprises a housing and the display module according to any one of claims 1 to 9.

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