A film pasting device suitable for MEMS devices

Abstract

The application discloses a film pasting device suitable for MEMS devices, which comprises a rack, a conveying mechanism, a feeding mechanism, a positioning mechanism, a first film pasting mechanism, a film tearing mechanism, a detection mechanism and a second film pasting mechanism arranged on the rack. The conveying mechanism can convey a bearing plate bearing a plurality of MEMS devices. The feeding mechanism can transfer the bearing plate into a conveying channel. The positioning mechanism can lift the bearing plate in the conveying channel upward. The first film pasting mechanism pastes a film sheet onto the MEMS device. The film tearing mechanism tears off the residual film sheet. The detection mechanism can detect whether a film sheet body is missed on the MEMS device. The second film pasting mechanism can paste a single film sheet body onto the upper surface of the missed MEMS device. The application integrates the automatic film pasting mode of feeding, film pasting, film tearing, detection and supplementing, improves the film pasting efficiency of the MEMS device, and can supplement the MEMS device, thereby eliminating the missing pasting problem.

Description

Technical Field

[0001] This invention relates to the field of film application equipment technology, and more specifically to a film application equipment suitable for MEMS devices. Background Technology

[0002] MEMS microphones are a type of microelectromechanical system (MEMS). Microphones convert sound into electrical signals and are a type of transducer. Today, microphones are widely used in electronic devices such as mobile phones, iPads, computers, smartwatches, and headphones. MEMS microphones typically have a sound hole. During production, a diaphragm of a special material needs to be attached to the sound hole. This diaphragm is waterproof and stain-resistant. Traditionally, this is done manually. Workers first place a carrier plate containing multiple MEMS devices on a positioning fixture for positioning, then place the entire diaphragm on the MEMS device, press the diaphragm firmly with a pressure plate, and then peel off any remaining diaphragm, leaving the diaphragm on the surface of the MEMS device. However, this manual method is inefficient, and some MEMS devices may be missed during the application process. Summary of the Invention

[0003] This invention addresses the shortcomings of existing technologies by providing a film-applying device suitable for MEMS devices. It integrates an automated film-applying method that includes feeding, applying, peeling, detection, and patching, thereby improving the film-applying efficiency of MEMS devices and enabling patching of MEMS devices to eliminate the problem of missed application.

[0004] To achieve the above objectives, the present invention adopts the following technical solution:

[0005] A film-applying device for MEMS devices includes a frame, and a conveying mechanism, a feeding mechanism, a positioning mechanism, a first film-applying mechanism, a film-peeling mechanism, a detection mechanism, and a second film-applying mechanism disposed on the frame.

[0006] The conveying mechanism has a conveying channel, and a conveyor belt is provided in the conveying channel. The conveyor belt can convey a carrier plate carrying multiple MEMS devices.

[0007] The feeding mechanism can transfer the support plate to the conveying channel;

[0008] The positioning mechanism has a first positioning lifting seat and a second positioning lifting seat arranged sequentially in the conveying channel along the conveying direction of the bearing plate. Both the first positioning lifting seat and the second positioning lifting seat can lift the bearing plate in the conveying channel upward and position the lifted bearing plate.

[0009] The first film-applying mechanism has a first suction head and a first drive module that drives the first suction head to move relative to the first positioning lifting seat. The first suction head can attach the film to the MEMS device, wherein each film body on the film is attached to the upper surface of the corresponding MEMS device.

[0010] The film-tearing mechanism has a first clamping component and a second driving module that drives the first clamping component to move. The first clamping component can tear off the residual film to separate the residual film from the film body attached to the MEMS device.

[0011] The detection mechanism has a CCD camera, which can detect whether a film is missing from the MEMS device.

[0012] The second film-applying mechanism has a second suction head and a third drive module that drives the second suction head to move relative to the second positioning lifting seat. The second suction head can attach a single film to the upper surface of the unapplied MEMS device.

[0013] By incorporating a conveying mechanism, a feeding mechanism, a positioning mechanism, a first film-applying mechanism, a film-removing mechanism, a detection mechanism, and a second film-applying mechanism, this film-applying equipment integrates an automated film-applying method encompassing feeding, film application, film removal, detection, and patching. The conveying mechanism transports a carrier plate carrying multiple MEMS devices. The feeding mechanism transfers the carrier plate into a conveying channel. The positioning mechanism lifts the carrier plate from the conveying channel for positioning. The first film-applying mechanism applies films to the MEMS devices, ensuring each film element is attached to the corresponding upper surface of the MEMS device. The film-removing mechanism removes any remaining films, separating them from the attached film elements. The detection mechanism checks for any missing film elements on the MEMS devices. The second film-applying mechanism then applies individual film elements to the upper surface of any missing MEMS devices. This integrated film-applying equipment improves the efficiency of MEMS device application and allows for patching, eliminating the problem of missing film elements.

[0014] In one embodiment, the feeding mechanism has a first material trough, a material transfer component, and a material pusher component. The material transfer component can transfer the material bin in the first material trough to one side of the conveying channel, and the material pusher component can push the bearing plate in the material bin into the conveying channel.

[0015] In one embodiment, a second material trough is provided above the first material trough, and the second material trough has an opening on the side near the material transfer component for the material supply bin to enter, and the material transfer component can transfer the material bin into the second material trough.

[0016] In one embodiment, the material transfer assembly has a second clamping assembly and a fourth drive module. The second clamping assembly can clamp a hopper, and the fourth drive module can drive the second clamping assembly to move so that the second clamping assembly clamps and removes the hopper from the first material trough.

[0017] In one embodiment, the pushing assembly has a pushing block and a pushing drive unit, the pushing drive unit driving the pushing block to move along the X-axis direction so that the pushing block pushes the support plate in the hopper into the conveying channel.

[0018] In one embodiment, the conveying mechanism has a first baffle and a second baffle spaced apart, forming the conveying channel between the first baffle and the second baffle, and two conveyor belts are provided, which are respectively installed on the first baffle and the second baffle.

[0019] In one embodiment, the first film application mechanism further includes a film unwinding assembly, and the first suction head can pick up the film output from the film unwinding assembly.

[0020] In one embodiment, a third positioning lifting seat is provided between the first positioning lifting seat and the second positioning lifting seat. At least one pressure holding mechanism is provided above the third positioning lifting seat. The pressure holding mechanism can press down on the film attached to the upper surface of the MEMS device. The film tearing mechanism is provided on one side of the pressure holding mechanism.

[0021] In one embodiment, the frame is provided with a waste recycling mechanism, which is located on one side of the film tearing mechanism. The recycling mechanism can recycle the residual film torn off by the first clamping component.

[0022] In one embodiment, a defective product removal robot is provided on one side of the inspection mechanism. The defective product removal robot can remove the carrier plate and the defective MEMS devices attached to the carrier plate from the transport channel.

[0023] Compared with existing technologies, this invention has significant advantages and beneficial effects. Specifically, by setting up a conveying mechanism, a feeding mechanism, a positioning mechanism, a first film-applying mechanism, a film-removing mechanism, a detection mechanism, and a second film-applying mechanism, the conveying mechanism transports a carrier plate carrying multiple MEMS devices. The feeding mechanism transfers the carrier plate into the conveying channel. The positioning mechanism lifts the carrier plate in the conveying channel to position it. The first film-applying mechanism applies films to the MEMS devices, ensuring that each film piece is attached to the upper surface of the corresponding MEMS device. The film-removing mechanism removes any remaining films, separating them from the films attached to the MEMS devices. The detection mechanism detects whether any films are missing from the MEMS devices. The second film-applying mechanism then applies individual films to the upper surface of any missing MEMS devices. Thus, this film-applying equipment integrates an automated film-applying method encompassing feeding, film application, film removal, detection, and patching, improving the film-applying efficiency of MEMS devices and enabling patching of MEMS devices, eliminating the problem of missing films.

[0024] To more clearly illustrate the structural features, technical means, and specific objectives and functions achieved by the present invention, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments: Attached Figure Description

[0025] Figure 1 This is a schematic diagram of the assembly structure according to an embodiment of the present invention;

[0026] Figure 2 This is a top view schematic diagram of an embodiment of the present invention;

[0027] Figure 3 This is a schematic diagram of the feeding mechanism structure according to an embodiment of the present invention;

[0028] Figure 4 This is a schematic diagram of the working state of the first material trough, the second material trough, the material feeding seat, and the material feeding assembly according to an embodiment of the present invention;

[0029] Figure 5 This is a schematic diagram of the feeding seat structure according to an embodiment of the present invention;

[0030] Figure 6 This is a schematic cross-sectional view of the feeding seat according to an embodiment of the present invention;

[0031] Figure 7 This is a side view of the first material transfer assembly in operation according to an embodiment of the present invention;

[0032] Figure 8 This is a schematic diagram of the structure of the first feeding component according to an embodiment of the present invention;

[0033] Figure 9 This is an assembly diagram of the conveying mechanism and the second pushing assembly according to an embodiment of the present invention;

[0034] Figure 10 This is a schematic diagram of the first film-applying mechanism according to an embodiment of the present invention;

[0035] Figure 11 This is a schematic diagram of the diaphragm structure according to an embodiment of the present invention;

[0036] Figure 12 This is a schematic diagram of the working state of the first suction head according to an embodiment of the present invention;

[0037] Figure 13 This is a schematic diagram of the working state of the pressure holding mechanism according to an embodiment of the present invention;

[0038] Figure 14 This is an exploded view of the pressure-holding mechanism according to an embodiment of the present invention;

[0039] Figure 15 This is an assembly diagram of the film-tearing mechanism and the recycling mechanism according to an embodiment of the present invention;

[0040] Figure 16 This is a schematic diagram of the feeding mechanism structure according to an embodiment of the present invention.

[0041] Explanation of reference numerals in the attached diagram:

[0042] 10-Frame, 11-Defective Product Storage Platform, 20-Conveying Mechanism, 21-Conveying Channel, 22-Conveyor Belt, 23-Conveyor Motor, 24-First Baffle, 25-Second Baffle, 26-First Guide Rod, 27-Adjusting Screw, 28-Adjusting Motor, 30-Positioning Mechanism, 31-First Positioning Lifting Seat, 32-Second Positioning Lifting Seat, 33-Third Positioning Lifting Seat, 40-Feeding Mechanism, 41-First Material Tray, 42-First Transfer Assembly, 421-Second Clamping Assembly, 4211-First Gripper, 4212-Second Gripper Gripper, 4213-Clamping drive unit, 4214-Slot, 422-Fourth drive module, 4221-Horizontal drive module, 4222-Lifting drive module, 43-First pusher assembly, 431-First pusher block, 432-First pusher drive unit, 433-Positioning notch, 434-First buffer spring, 44-Second material groove, 45-Pushing assembly, 451-Pushing seat, 4511-Swing arm, 4512-Reset spring, 4513-Rotating shaft, 4514-Pushing surface, 4515-Limiting surface, 4516- 452-Receiving slot, 46-Stop, 47-Position sensor, 50-First film application mechanism, 51-First suction head, 52-First drive module, 521-XYZ axis drive module, 522-Rotation drive module, 53-Film unwinding assembly, 531-Unwinding shaft, 532-Rewinding shaft, 533-Separation plate, 534-Release film, 54-First calibration unit, 55-Second calibration unit, 56-Second film application mechanism, 60-Film peeling mechanism, 61-First clamping assembly, 62-Second drive module 70-Feeding mechanism, 71-Third material trough, 72-Second material transfer assembly, 73-Second material pushing assembly, 74-Fourth material trough, 80-Pressure holding mechanism, 81-Pressure head, 82-Pressure driving unit, 83-Mounting base, 84-Second guide rod, 85-Pressure sensor, 86-Second buffer spring, 90-Recycling mechanism, 91-Pipeline, 911-Input port, 100-Carrier plate, 101-MEMS device, 110-Diaphragm, 111-Diaphragm body, 112-Residual diaphragm, 120-Hopper, 121-Packet. Detailed Implementation

[0043] In the description of this invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the indicated position or element must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0044] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0045] like Figure 1-16 As shown, the present invention discloses a film-applying device suitable for MEMS devices, including a frame 10, and a conveying mechanism 20, a positioning mechanism 30, a feeding mechanism 40, a first film-applying mechanism 50, a film-peeling mechanism 60, a detection mechanism (not shown), a second film-applying mechanism 56, and a unloading mechanism 70 disposed on the frame 10.

[0046] The conveying mechanism 20 has a conveying channel 21, and a conveyor belt 22 is provided in the conveying channel 21. The conveyor belt 22 can convey a carrier plate 100 carrying multiple MEMS devices 101 along the X-axis direction. The conveyor belt 22 is driven to rotate by a conveying motor 23. Three groups of MEMS devices 101 are distributed at intervals along the X-axis direction on the carrier plate 100. Each group of MEMS devices 101 has multiple MEMS devices 101 arranged in an array, and adjacent MEMS devices 101 maintain a distance.

[0047] The feeding mechanism 40 can transfer the carrier plate 100 carrying multiple MEMS devices 101 to the conveying channel 21.

[0048] The positioning mechanism 30 has a first positioning lifting seat 31 and a second positioning lifting seat 32 arranged sequentially in the conveying channel 21 along the conveying direction of the bearing plate 100. Both the first positioning lifting seat 31 and the second positioning lifting seat 32 can lift the bearing plate 100 in the conveying channel 21 upward and position the lifted bearing plate 100.

[0049] The first film-applying mechanism 50 has a first suction head 51 and a first drive module 52 that drives the first suction head 51 to move relative to the first positioning lifting seat 31. The first suction head 51 can attach the film 110 to the MEMS device 101, wherein each film body 111 on the film 110 is attached to the upper surface of the corresponding MEMS device 101.

[0050] The film-tearing mechanism 60 has a first clamping component 61 and a second driving module 62 that drives the first clamping component 61 to move. The first clamping component 61 can tear off the residual film 112 so that the residual film 112 is separated from the film body 111 attached to the MEMS device 101.

[0051] The detection mechanism has a CCD camera (not shown), which can detect whether the film 111 is missing on the MEMS device 101. The CCD camera is located above the second positioning lifting seat 32.

[0052] The second film-applying mechanism 56 has a second suction head (not shown) and a third drive module (not shown) that drives the second suction head to move relative to the second positioning lifting seat 32. The second suction head can attach a single film sheet 111 to the upper surface of the missed MEMS device 101. The second film-applying mechanism 56 is based on the same principle as the first film-applying mechanism 50. The number of second suction heads is one. Each time, the second suction head picks up a single film sheet 111 and attaches it to the upper surface of the missed MEMS device 101. It can be understood that multiple second suction heads can also be arranged side by side, and each second suction head can move independently.

[0053] The unloading mechanism 70 can receive the bearing plate 100 output from the conveying channel 21. The unloading mechanism 70 has the same structure and principle as the loading mechanism 40.

[0054] The feeding mechanism 40 includes a first material trough 41, a first material transfer component 42, and a first material pusher component 43. The first material transfer component 42 can transfer the hopper 120 in the first material trough 41 to one side of the input end of the conveying channel 21. The first material pusher component 43 can push the bearing plate 100 in the hopper 120 into the conveying channel 21 along the X-axis direction. The first material trough 41 extends along the Y-axis direction, and both ends of the first material trough 41 are open to form openings for the hopper 120 to enter and exit. By setting up the feeding mechanism 40 composed of the first material trough 41, the first material transfer component 42, and the first material pusher component 43, the first material transfer component 42 moves the hopper 120 out of the first material trough 41, and then the first material pusher component 43 pushes the bearing plate 100 in the hopper 120 into the conveying channel 21, thereby realizing automatic feeding of the bearing plate 100 with high efficiency.

[0055] A second material trough 44 is provided above the first material trough 41. The second material trough 44 extends along the Y-axis. The side of the second material trough 44 near the first material transfer component 42 has an opening for the material hopper 120 to enter. The first material transfer component 42 can transfer the material hopper 120 into the second material trough 44. By setting the second material trough 44, the empty material hopper 120 can be stacked in the second material trough 44 in a timely manner, which makes it convenient for the first material transfer component 42 to continue to remove the full material hopper from the first material trough 41, shortening the feeding time and improving efficiency.

[0056] The feeding mechanism 40 also includes a feeding assembly 45, which has a feeding seat 451 and a feeding drive unit 452. The feeding seat 451 is movably disposed in the first material groove 41. The feeding seat 451 is provided with a swing arm 4511 and a return spring 4512. The swing arm 4511 is rotatably connected to the feeding seat 451 via a rotating shaft 4513. The axis of the rotating shaft 4513 extends along the X-axis. The return spring 4512 ensures that the end of the swing arm 4511 near the first material transfer assembly 42 always has a rotational position. The shaft 4513 tends to tilt upwards and protrude from the upper surface of the feeding seat 451. The feeding drive unit 452 drives the feeding seat 451 to move along the Y-axis towards the first material transfer component 42, so that the swing arm 4511 pushes the stacked hopper 120 towards the first material transfer component 42. The return spring 4512 can be a compression spring, with its upper end abutting against the swing arm 4511 and its lower end abutting against the feeding seat 451. It can be understood that the return spring 4512 can also be... A tension spring is used; a feeding seat 451 and a feeding drive assembly are set in the first material trough 41. A swing arm 4511 and a return spring 4512 are set on the feeding seat 451. Under the elastic force of the return spring 4512, the end of the swing arm 4511 near the first material transfer assembly 42 tilts upward. When the feeding drive unit 452 drives the feeding seat 451 to move closer to the first material transfer assembly 42, the tilted end of the swing arm 4511 pushes against the stacked hoppers 120 and moves them along the first material trough 41, so that the first material transfer assembly 42 can move the hoppers 120. When the feeding drive unit 452 drives the feeding seat 451 to move away from the first feeding component 42, the upper surface of the hopper 120 abuts against the swing arm 4511, causing the end of the swing arm 4511 near the first feeding component 42 to rotate downward, so that the swing arm 4511 can move smoothly to the side of the hopper 120 away from the first feeding component 42, so that the swing arm 4511 can push the hopper 120 to move. Thus, the full hopper 120 only needs to be stacked in the first trough 41 to wait for subsequent automatic feeding, and the feeding efficiency of the hopper 120 is high.

[0057] The feeding drive unit 452 can be driven by a cylinder or a synchronous belt + servo motor. The servo motor drives the feeding seat 451 to move through the synchronous belt. Alternatively, the feeding drive unit 452 can also be a linear motor.

[0058] Specifically, the feeding seat 451 is slidably connected to the frame 10. The end of the swing arm 4511 near the first material transfer component 42 has a pushing surface 4514 that can push against the material bin 120. The lower end of the swing arm 4511 away from the first material transfer component 42 has a limiting surface 4515 that can abut against the feeding seat 451. The feeding seat 451 has a receiving groove 4516. The swing arm 4511 is located in the receiving groove 4516. The lower end of the return spring 4512 abuts against the inner bottom wall of the receiving groove 4516, and the limiting surface 4515 abuts against the inner bottom wall of the receiving groove 4516 to limit the movement of the swing arm 4511. When the material feeding seat 451 moves toward the direction of the first material transfer component 42, the pushing surface 4514 pushes the material bin 120 to move. When the material feeding seat 451 moves toward the direction of the first material transfer component 42, the material bin 120 abuts against the upper surface of the swing arm 4511, causing the end of the swing arm 4511 near the first material transfer component 42 to rotate downward around the rotating shaft 4513 and be hidden in the receiving groove 4516. By setting the receiving groove 4516, the swing arm 4511 and the return spring 4512 are both set in the receiving groove 4516, so that the assembly structure of the material feeding seat 451, the swing arm 4511, and the return spring 4512 is compact and occupies little space.

[0059] The first material trough 41 is provided with a stop block 46 on both sides near the opening of the first material transfer component 42. The stop block 46 abuts against the material bin 120 to prevent the stop block 46 from falling out of the first material trough 41. The stop block 46 is provided with a position sensor 47 for detecting the position of the material bin 120. When the position sensor 47 detects the material bin 120, the material transfer drive component stops working.

[0060] The first material transfer component 42 has a second clamping component 421 and a fourth drive module 422. The second clamping component 421 can clamp the hopper 120, and the fourth drive module 422 can drive the second clamping component 421 to move along the Y-axis and Z-axis directions, so that the second clamping component 421 clamps and removes the hopper 120 from the first material trough 41.

[0061] Specifically, the second clamping assembly 421 is provided with a first gripper 4211, a second gripper 4212, and a clamping drive unit 4213. The clamping drive unit 4213 can be a slide cylinder. The first gripper 4211 is located above the second gripper 4212. The clamping drive unit 4213 drives the first gripper 4211 to move closer to or further away from the second gripper 4212 along the Z-axis. The second gripper 4212 is provided with an upward-facing slot 4214. The slot 4214 allows the card plate 121 at the lower end of the hopper 120 to extend into it. The cooperation between the slot 4214 and the card plate 121 can restrict the movement of the hopper 120 along the Y-axis. The fourth drive module 422 has a horizontal drive module 4221 and a lifting drive module 4222. Both the horizontal drive module 4221 and the lifting drive module 4222 can be driven by a lead screw and a motor or by a synchronous belt and a motor.

[0062] The first pushing component 43 has a first pushing block 431 and a first pushing driving unit 432. The first pushing driving unit 432 drives the first pushing block 431 to move along the X-axis direction so that the first pushing block 431 pushes the carrier plate 100 in the hopper 120 and the MEMS device 101 on the carrier plate 100 into the conveying channel 21.

[0063] The first pusher block 431 has a positioning notch 433 at one end facing the conveying channel 21. The positioning notch 433 extends along the Y-axis and passes through both sides of the first pusher block 431. The positioning notch 433 has a trumpet-shaped opening (not shown). The width of the trumpet-shaped opening gradually increases towards the conveying channel 21. A first buffer spring 434 is provided between the first pusher block 431 and the driving end of the first pusher drive unit 432. The first buffer spring 434 makes the first pusher block 431 always tend to move towards the conveying channel 21. The first pusher drive unit 432 can be a slide cylinder. By setting the positioning notch 433, one end of the support plate 100 extends into the positioning notch 433 for positioning, thereby making it more stable when pushing the support plate 100 to move. The trumpet-shaped opening facilitates the smooth extension of the support plate 100 into the positioning notch 433.

[0064] It should be noted that the feeding mechanism 40 can also be configured as a material tray + robot arm structure. The material tray can store multiple side-by-side bearing plates 100. After the robot arm takes the bearing plate 100 off the material tray, it directly puts it into the conveying channel 21.

[0065] The conveying mechanism 20 has a first baffle 24 and a second baffle 25 spaced apart, forming the conveying channel 21 between the first baffle 24 and the second baffle 25. There are two conveyor belts 22, which are respectively installed on the first baffle 24 and the second baffle 25. During operation, the two conveyor belts 22 support the carrier plate 100 and drive the carrier plate 100 to move. There are two conveying motors 23, which are respectively installed on the first baffle 24 and the second baffle 25. The two conveying motors 23 drive the corresponding conveyor belts 22 to rotate.

[0066] The first baffle 24 is connected to the frame 10, and the second baffle 25 is movably connected to the first baffle 24 via the first guide rod 26. The first baffle 24 is provided with an adjusting screw 27 and an adjusting motor 28. The adjusting screw 27 is rotatably connected to the second baffle 25. The adjusting motor 28 drives the second baffle 25 to move closer to or further away from the first baffle 24 along the Y-axis direction through the adjusting screw 27, so as to adjust the width of the conveying channel 21.

[0067] The first positioning lifting seat 31 is driven to move up and down by a first lifting drive unit, which is mounted on the frame 10. The second positioning lifting seat 32 is driven to move up and down by a second lifting drive unit. Both the first and second lifting drive units can be cylinders. The first and second positioning seats are provided with several positioning posts (not shown) and several suction holes. The positioning posts can extend upward into the positioning holes (not shown) on the edge of the support plate 100. The suction holes can be used to suction the lower surface of the support plate 100. In addition, a horizontal drive unit can be set to drive the first positioning lifting seat 31 to move along the X-axis, so that the position of the first positioning lifting seat 31 along the X-axis can be finely adjusted so that the positioning posts can be accurately inserted into the positioning holes. The second positioning lifting seat 32 is similar.

[0068] The first film application mechanism 50 also has a film 110 unwinding assembly 53. The first suction head 51 can pick up the film 110 output from the film 110 unwinding assembly 53. Specifically, the film 110 unwinding assembly 53 has an unwinding shaft 531, a take-up shaft 532, and a separating plate 533. The release film 534 output from the unwinding shaft 531 reaches the take-up shaft 532 after passing through the separating plate 533. The separating plate 533 separates the film 110 on the strip from the release film 534 so that the first suction head 51 can pick up the film 110.

[0069] The first drive module 52 has an XYZ axis drive module 521 and a rotary drive module 522. The rotary drive module 522 is located at the drive end of the XYZ axis drive module 521. The first suction head 51 is located at the drive end of the rotary drive module 522. The rotation axis of the rotary drive module 522 extends along the Z-axis. The drive end of the XYZ axis drive module 521 is also provided with a first calibration unit 54. The first calibration unit 54 can detect the position of the diaphragm 110 on the diaphragm 110 unwinding assembly 53. A second calibration unit 55 is provided on one side of the diaphragm 110 unwinding assembly 53. The second calibration unit 55 can detect the position of the diaphragm 110 on the first suction head 51. Both the first calibration unit 54 and the second calibration unit 55 can be CCD cameras.

[0070] The second drive module 62 has the same structure as the first drive module 52. The second drive module 62 can drive the first clamping component 61 to move along the X-axis, Y-axis and Z-axis directions. Specifically, the first clamping component 61 can be a gripper cylinder.

[0071] A third positioning lifting seat 33 is provided between the first positioning lifting seat 31 and the second positioning lifting seat 32. The third positioning lifting seat 33 is driven to move up and down by a third lifting drive unit. The third positioning lifting seat 33 has the same structure as the first positioning lifting seat 31. At least one pressure holding mechanism 80 is provided above the third positioning lifting seat 33. For example, three pressure holding mechanisms 80 are distributed along the X-axis. The pressure holding mechanism 80 can press down on the diaphragm 111 attached to the upper surface of the MEMS device 101. Mechanism 60 is located on one side of pressure holding mechanism 80. Pressure holding mechanism 80 has a pressing head 81 and a pressing drive unit 82 that drives the pressing head 81 to move up and down. The pressing drive unit 82 can be a cylinder. By setting a third positioning lifting seat 33 and pressure holding mechanism 80, the pressure holding mechanism 80 presses the diaphragm 110, thereby making the diaphragm body 111 more tightly and firmly attached to the MEMS device 101. This makes it easier for the film peeling mechanism 60 to separate the residual diaphragm 112 from the diaphragm body 111 when it peels off the residual diaphragm 112, reducing the phenomenon of missed attachment.

[0072] The driving end of the pressure-reducing drive unit 82 is provided with a mounting base 83. The pressure head 81 is slidably mounted on the mounting base 83 via a second guide rod 84. A pressure sensor 85 and several second buffer springs 86 are provided between the mounting base 83 and the pressure head 81. The several second buffer springs 86 surround the outside of the pressure sensor 85. The upper and lower surfaces of the pressure sensor 85 abut against the mounting base 83 and the pressure head 81, respectively. The upper and lower ends of the second buffer springs 86 abut against the mounting base 83 and the pressure head 81, respectively. When the pressure sensor 85 detects that the pressure value reaches the set value, the pressure-reducing drive unit 82 stops operating. By setting the pressure sensor 85 and several second buffer springs 86, excessive pressure from the pressure head 81 is prevented to avoid damaging the MEMS device 101. The several second buffer springs 86 surround the outside of the pressure sensor 85, so that the force between the mounting base 83 and the pressure head 81 is uniform in all directions, so that the pressure value detected by the pressure sensor 85 has a small deviation and a better pressure holding effect.

[0073] The frame 10 is equipped with a waste recycling mechanism 90, which is located on one side of the film tearing mechanism 60. The recycling mechanism 90 can recycle the residual film 112 torn off by the first clamping component 61. Specifically, the recycling device has a pipe 91 and a negative pressure device connected to the pipe 91. The inlet 911 of the pipe 91 is horizontally oriented towards the first clamping component 61. During operation, the pipe 91 can suck away the residual film 110 torn off by the first clamping component 61.

[0074] The inspection mechanism is equipped with a defective product removal robot (not shown) on one side. The defective product removal robot can remove the carrier plate 100 and the MEMS devices 101 with unqualified patches on the carrier plate 100 together out of the transport channel 21. The transport channel 21 is equipped with a defective product storage platform 11 on one side. During operation, the second film-applying mechanism 56 applies patches to the missing MEMS devices 101. The inspection mechanism re-inspects the applied MEMS devices 101. If the patching is unqualified, the defective product removal robot will remove the carrier plate 100 and the MEMS devices 101 with unqualified patches on the carrier plate 100 together out of the transport channel 21.

[0075] The feeding mechanism 70 has a third material trough 71, a second material transfer component 72, and a second material pusher component 73. The second material transfer component 72 can transfer the hopper 120 in the third material trough 71 to one side of the output end of the conveying channel 21. The second material pusher component 73 can completely push the support plate 100 and the MEMS device 101 on the support plate 100 into the hopper 120 along the X-axis direction. A fourth material trough 74 is provided above the third material trough 71. During operation, the conveying channel 21 conveys the support plate 100 and the MEMS device 101 on the support plate 100 into the hopper 120. Due to the limitations of the conveyor belt 22, the support plate 100 does not completely enter the hopper 120. Therefore, it is necessary to use the second material pusher component 73 to completely push the support plate 100 into the hopper 120.

[0076] It should also be noted that the MEMS device 101 can be a MEMS microphone or a MEMS sensor, and the carrier plate 100 can be a PCB board or other board components with carrier function.

[0077] The working principle of this invention is as follows: Workers stack hoppers 120 into the first trough 41. The feeding assembly 45 pushes the stacked hoppers 120 towards the first transferring assembly 42. The first transferring assembly 42 clamps the hoppers 120 and transfers them from the first trough 41 to one side of the input end of the conveying channel 21. The first pushing assembly 43 pushes the support plate 100 in the hopper 120 into the conveying channel 21. The conveyor belt 22 drives the support plate 100 sequentially through the first positioning lifting seat 31, the second positioning lifting seat 32, and the third positioning lifting seat 33. The first positioning lifting seat 31 lifts... The carrier plate 100 is positioned, and the first film-applying mechanism 50 applies the film 110 onto the MEMS device 101 located on the carrier plate 100, so that each film body 111 on the film 110 is attached to the upper surface of the corresponding MEMS device 101. The first positioning lifting seat 31 descends, and the conveyor belt moves the carrier plate 100 above the third positioning lifting seat 33. The third positioning lifting seat 33 lifts the carrier plate 100, and the pressure-holding mechanism 80 presses the film 110 downwards, so that the film body 111 is tightly attached to the MEMS device 101. After the pressure holding is completed, the film-tearing mechanism... The residual diaphragm 112 is peeled off by the tearing mechanism 60, separating it from the diaphragm body 111 attached to the MEMS device 101. When the tearing mechanism 60 transfers the residual diaphragm 112 to the inlet 911 of the pipe 91, the inlet 911 sucks the residual diaphragm 112 away. Then, the third positioning lifting seat 33 descends, and the conveyor belt 22 moves the carrier plate to above the second positioning lifting seat 32. The detection mechanism detects whether there is a missing diaphragm body 111 on the MEMS device 101. If there is a missing diaphragm body 111, the second positioning lifting seat 32 lifts the carrier plate 100, and the second film application mechanism 56 applies the film to the missing diaphragm body 111. After the EMS device 101 is tagged, the testing agency re-inspects the tagged MEMS device 101. If the re-inspection fails, the defective product removal robot will remove the carrier plate 100 and the untagged MEMS device 101 on the carrier plate 100 together to the defective product storage table 11. If there is no missing tagging or the re-inspection is qualified, the conveyor belt 22 will transport the carrier plate 100 to the hopper 120 on the second transfer component 72. The second push component 73 will push the carrier plate 100 completely into the hopper 120. Finally, the second transfer component 72 will transfer the hopper 120 to the fourth trough 74.

[0078] In summary, this invention, by setting up a conveying mechanism 20, a feeding mechanism 40, a positioning mechanism 30, a first film-applying mechanism 50, a film-peeling mechanism 60, a detection mechanism, and a second film-applying mechanism 56, utilizes the conveying mechanism 20 to transport a carrier plate 100 carrying multiple MEMS devices 101, the feeding mechanism 40 to transfer the carrier plate 100 into the conveying channel 21, the positioning mechanism 30 to lift the carrier plate 100 in the conveying channel 21 to position the carrier plate 100, and the first film-applying mechanism 50 to attach films 110 onto the MEMS devices 101, so that each film body 111 on the film 110 is attached to the corresponding MEMS device 101. The residual film 112 is peeled off from the upper surface of the corresponding MEMS device 101 by the film peeling mechanism 60, so that the residual film 112 is separated from the film body 111 attached to the MEMS device 101. The detection mechanism detects whether there is a missing film body 111 on the MEMS device 101. The second film attaching mechanism 56 attaches a single film body 111 to the upper surface of the missing MEMS device 101. Thus, the film attaching equipment integrates the automated film attaching method of feeding, attaching, peeling, detection and attaching, improves the film attaching efficiency of MEMS device 101, and can attach the MEMS device 101 to prevent the problem of missing film attaching.

[0079] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Therefore, any modifications, equivalent substitutions, improvements, etc., made to the above embodiments based on the actual technology of the present invention shall still fall within the scope of the technical solution of the present invention.

Claims

1. A film-applying device suitable for MEMS devices, characterized in that, It includes a frame, and a conveying mechanism, a feeding mechanism, a positioning mechanism, a first film-applying mechanism, a film-tearing mechanism, a testing mechanism, and a second film-applying mechanism mounted on the frame; The conveying mechanism has a conveying channel, and a conveyor belt is provided in the conveying channel. The conveyor belt can convey a carrier plate carrying multiple MEMS devices. The feeding mechanism can transfer the bearing plate into the conveying channel. The feeding mechanism has a first material trough, a material transfer component, and a material pusher component. The material transfer component can transfer the hopper in the first material trough to one side of the conveying channel. The material pusher component can push the bearing plate in the hopper into the conveying channel. A second material trough is provided above the first material trough. The second material trough has an opening for the hopper to enter on the side near the material transfer component. The material transfer component can transfer the hopper into the second material trough. The material transfer component has a second clamping component and a fourth drive module. The second clamping component can clamp the hopper. The fourth drive module can drive the second clamping component to move so that the second clamping component clamps and removes the hopper from the first material trough. The positioning mechanism has a first positioning lifting seat and a second positioning lifting seat arranged sequentially in the conveying channel along the conveying direction of the bearing plate. Both the first positioning lifting seat and the second positioning lifting seat can lift the bearing plate in the conveying channel upward and position the lifted bearing plate. The first film application mechanism has a film unwinding assembly, a first suction head, and a first drive module that drives the first suction head to move relative to the first positioning lifting seat. The first suction head can pick up the film output by the film unwinding assembly and can attach the film to the MEMS device. Each film body on the film is attached to the upper surface of the corresponding MEMS device. The film-tearing mechanism has a first clamping component and a second driving module that drives the first clamping component to move. The first clamping component can tear off the residual film to separate the residual film from the film body attached to the MEMS device. The detection mechanism has a CCD camera, which can detect whether a film is missing from the MEMS device. The second film-applying mechanism has a second suction head and a third drive module that drives the second suction head to move relative to the second positioning lifting seat. The second suction head can attach a single film to the upper surface of the unapplied MEMS device.

2. The film-applying equipment for MEMS devices according to claim 1, characterized in that, The pushing assembly has a pushing block and a pushing drive unit. The pushing drive unit drives the pushing block to move along the X-axis direction so that the pushing block pushes the bearing plate in the hopper into the conveying channel.

3. The film-applying equipment for MEMS devices according to claim 1, characterized in that, The conveying mechanism has a first baffle and a second baffle spaced apart, forming the conveying channel between the first baffle and the second baffle. There are two conveyor belts, which are respectively installed on the first baffle and the second baffle.

4. The film-applying equipment for MEMS devices according to claim 1, characterized in that, A third positioning lifting seat is provided between the first positioning lifting seat and the second positioning lifting seat. At least one pressure holding mechanism is provided above the third positioning lifting seat. The pressure holding mechanism can press down on the film attached to the upper surface of the MEMS device. The film tearing mechanism is provided on one side of the pressure holding mechanism.

5. The film-applying equipment for MEMS devices according to claim 1, characterized in that, The frame is equipped with a waste recycling mechanism, which is located on one side of the film tearing mechanism. The waste recycling mechanism can recycle the residual film torn off by the first clamping component.

6. The film-applying device for MEMS devices according to claim 1, characterized in that, The inspection mechanism is equipped with a defective product removal robot on one side, which can remove the carrier plate and the defective MEMS devices attached to the carrier plate from the transport channel.

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