Signal integrity test method, electronic equipment, storage medium and product

Abstract

The invention discloses a signal integrity test method, electronic equipment, a storage medium and a product, and relates to the technical field of computer-aided engineering, and the method comprises the steps: obtaining the power density distribution information of a printed circuit board assembly in the electronic equipment; inputting the power density distribution information into a heat dissipation model of the electronic equipment, and obtaining temperature field data of a printed circuit board assembly when the electronic equipment is in a working state; according to the invention, material parameters in the printed circuit board assembly are determined based on the temperature field data, and quality data of signals transmitted by the electronic equipment through the printed circuit board are determined based on the material parameters, so that the technical problem of inaccurate signal integrity test caused by inaccurate temperature field data is solved; the technical effect of improving the signal integrity test precision of the printed circuit board assembly is achieved.

Description

Technical Field

[0001] The present application relates to the field of computer-aided engineering technology, and in particular to a signal integrity testing method, an electronic device, a storage medium and a product. Background Art

[0002] In the relevant signal integrity test scheme, the increase in temperature will lead to an increase in the signal loss transmitted on the printed circuit board assembly, thereby affecting the quality of the signal. However, when the electronic equipment is in working condition, heat dissipation technologies such as fans and liquid cooling, as well as heat-generating components such as chips, will also affect the internal temperature of the electronic equipment, resulting in inaccurate temperature of the printed circuit board assembly in the electronic equipment, and then leading to inaccurate signal integrity testing in the printed circuit board assembly. Summary of the invention

[0003] The present application provides a signal integrity test method, an electronic device, a storage medium and a product, so as to at least solve the problem of inaccurate signal integrity test in a printed circuit board assembly in the related art.

[0004] The present application provides a signal integrity testing method, comprising: Obtaining power density distribution information of printed circuit board assemblies in electronic devices; Inputting the power density distribution information into the heat dissipation model of the electronic device to obtain the temperature field data of the printed circuit board assembly of the electronic device in the working state; Based on the temperature field data, material parameters in the printed circuit board assembly are determined, and based on the material parameters, quality data of signals transmitted by the electronic device through the printed circuit board is determined.

[0005] The present application also provides a signal integrity testing device, comprising: A first acquisition unit, used to acquire power density distribution information of a printed circuit board assembly in an electronic device; A second acquisition unit is used to input the power density distribution information into a heat dissipation model of the electronic device to obtain temperature field data of the printed circuit board assembly of the electronic device in a working state; The determination unit is used to determine material parameters in the printed circuit board assembly based on the temperature field data, and to determine quality data of signals transmitted by the electronic device through the printed circuit board based on the material parameters.

[0006] The present application also provides an electronic device, comprising: a memory for storing a computer program; and a processor for implementing the steps of any one of the above-mentioned signal integrity testing methods when executing the computer program.

[0007] The present application also provides a computer-readable storage medium, in which a computer program is stored. When the computer program is executed by a processor, the steps of any one of the above-mentioned signal integrity testing methods are implemented.

[0008] The present application also provides a computer program product, including a computer program, which implements the steps of any of the above signal integrity testing methods when executed by a processor.

[0009] Through the present application, power density distribution information of a printed circuit board assembly in an electronic device is obtained; the power density distribution information is input into a heat dissipation model of the electronic device to obtain temperature field data of the printed circuit board assembly of the electronic device in a working state; based on the temperature field data, material parameters in the printed circuit board assembly are determined, and based on the material parameters, quality data of a signal transmitted by the electronic device through the printed circuit board is determined, that is, by incorporating changes in material parameters of the printed circuit board assembly into the evaluation, and by including the influence of heat dissipation and other heat-generating components in the working state of the electronic device, the technical problem of inaccurate signal integrity testing caused by inaccurate temperature field data is solved, and the technical effect of improving the accuracy of signal integrity testing of printed circuit board assemblies is achieved. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] The accompanying drawings are used to better understand the present solution and do not constitute a limitation of the present disclosure. Figure 1 A flow chart of a signal integrity testing method provided in an embodiment of the present application; Figure 2 A schematic diagram of a flow chart of a method for obtaining power density distribution information provided in an embodiment of the present application; Figure 3 A schematic diagram of the structure of a signal integrity testing device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0011] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0012] It should be noted that, in the description of this application, the terms "include", "comprise" or any other variant thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. The terms "first", "second", etc. in this application are used to distinguish similar objects, and are not used to describe a specific order or sequence.

[0013] With the rapid development of electronic equipment technology, high-speed signal transmission technology is undergoing rapid iteration and upgrading, and the signal integrity issues transmitted in printed circuit board assemblies in electronic equipment are becoming more and more complicated. Among them, temperature is an important factor affecting the signal integrity of printed circuit board assemblies. The higher the temperature, the greater the signal loss transmitted on the printed circuit board assembly. Therefore, temperature field data must be introduced in the signal integrity evaluation of printed circuit board assemblies in high-power electronic equipment.

[0014] If the possible local maximum temperature of the PCB assembly is regarded as the global temperature, it will lead to excessive signal transmission design redundancy; and if the Joule heat of the high-power PCB assembly itself is ignored, the degree of signal integrity loss may be underestimated. In addition, the heat dissipation technology of the electronic equipment in the whole state and other heat-generating components such as chips will also affect the temperature field data in the PCB assembly.

[0015] The following briefly introduces several schemes of signal integrity testing methods in related technologies: Scheme A proposes a method of using GPU to accelerate integrated circuit testing, which involves the field of electronic equipment technology, including: by importing the Computer-Aided Design (CAD) file of the integrated circuit design into HFSS and Icepak, a seamless transformation from design drawings to simulation environments is achieved, and simulation models of electromagnetic fields and thermal fields are constructed, reducing the cost and time of physical prototyping and testing. The Compute Unified Device Architecture (CUDA) technology is used to identify the parallel parts of the simulation tasks, and the tasks are decomposed and executed in parallel, thereby speeding up the simulation calculation. A deep learning algorithm is deployed to automatically optimize the simulation parameters, avoiding errors caused by human factors, creating a bidirectional coupling simulation project of the electromagnetic field and thermal field, and executing the calculations of the two fields in real time and in parallel, thereby realizing the close integration of electromagnetic and thermal effects at the simulation level.

[0016] Solution B proposes a PCB thermal design method, system and terminal based on electrothermal coupling iterative simulation, which belongs to the field of printed circuit board (PCB) thermal design. Through SIwave software, excitation conditions are loaded on the PCB traces to perform IR-drop electrical simulation calculations to obtain PCB power distribution; the PCB power distribution is imported into the simulation software ICEPAK for PCB board-level thermal simulation to obtain PCB temperature distribution and complete a joint simulation. Then, multiple iterations are performed according to the same method, and the temperature and power differences of the last two simulations are detected by setting the iterative convergence conditions. If the current cutoff condition is reached, the iterative optimization is stopped, and if not, the iteration is continued, which can improve the efficiency and accuracy of thermal simulation.

[0017] The above solution has the following defects: Solution A only considers the effect of heat on material properties related to signal transmission, and ignores the effect of temperature on electrical properties such as resistance that can change the heat generation power.

[0018] Solution B only considers the heat caused by the DC voltage drop loss of the printed circuit board assembly, and ignores other heat-generating factors such as electromagnetic loss.

[0019] Both Scheme A and Scheme B lack electronic equipment heat dissipation technology and the complex influence of other heat-generating components, resulting in inaccurate temperature field data.

[0020] In order to solve the problems existing in the related solutions, an embodiment of the present application provides a signal integrity testing method, including: obtaining power density distribution information of a printed circuit board assembly in an electronic device; inputting the power density distribution information into a heat dissipation model of the electronic device to obtain temperature field data of the printed circuit board assembly of the electronic device in a working state; based on the temperature field data, determining material parameters in the printed circuit board assembly, and based on the material parameters, determining quality data of a signal transmitted by the electronic device through the printed circuit board, that is, by incorporating changes in material parameters of the printed circuit board assembly into the evaluation, and by including the influence of heat dissipation and other heat-generating components in the working state of the electronic device, the technical problem of inaccurate signal integrity testing caused by inaccurate temperature field data is solved, and the technical effect of improving the accuracy of signal integrity testing of printed circuit board assemblies is achieved.

[0021] The present disclosure provides a signal integrity testing method, which can be applied to data centers, industrial automation, automotive electronics, aerospace and other fields.

[0022] In order to enable those skilled in the art to better understand the present application, the present application is further described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0023] Figure 1A flow chart of a signal integrity testing method provided by an embodiment of the present disclosure.

[0024] like Figure 1 As shown, the method comprises the following steps: Step 101, obtaining power density distribution information of a printed circuit board assembly in an electronic device; In some embodiments, the electronic device may be a server, a mobile device, an industrial control device, etc. In this application, the electronic device takes a server as an example, and the server includes components such as a chassis, a processor, a storage device, a cooling system, a network interface, and a printed circuit board assembly. Among them, the storage device may include a hard disk drive and a solid-state hard disk, the cooling system includes a fan, a heat sink, a liquid cooling system, etc., and the network interface may include an Ethernet card, a fiber channel card, etc.

[0025] In some embodiments, the printed circuit board assembly is typically installed in the server chassis through a fixing device, and the printed circuit board assembly carries the main computing and storage functions of the server, such as the central processing unit performs computing tasks and the memory stores data.

[0026] In some embodiments, the DC voltage drop of the PCB assembly can be determined according to design information of the PCB assembly in the electronic device, and then the power density distribution information of the PCB assembly can be determined according to the DC voltage drop of the PCB assembly.

[0027] In some embodiments, the power density distribution information may be output in the form of a power density distribution data table or in the form of a power density distribution diagram, specifically in the form of a heat map or a cloud map, to intuitively display the power density distribution at various locations on the printed circuit board assembly.

[0028] In some embodiments, the power density distribution information may be exported and saved in a preset data format, such as a .obd data format or a .csv data format.

[0029] Step 102, inputting the power density distribution information into the heat dissipation model of the electronic device to obtain the temperature field data of the printed circuit board assembly of the electronic device in the working state; In some embodiments, the heat dissipation model of the electronic device may include geometric information such as the electronic device chassis, fan, radiator, duct design, air flow path, etc. It may also include material properties of each component in the electronic device, such as thermal conductivity, fan performance curve, inlet and outlet pressure, wind speed, etc. It may also include power information of other heat-generating components such as chips and power modules.

[0030] In some embodiments, the power density value corresponding to each position in the power density distribution information is mapped to the corresponding position in the heat dissipation model of the electronic device. Specifically, the power density distribution information can be mapped to the heat dissipation model of the electronic device through an interface.

[0031] In some embodiments, the whole model of the electronic device can be divided into grid units to ensure that the local temperature changes of the components can be captured. In the printed circuit board component area, more refined grid units can be used to divide the printed circuit board component to improve the mapping of power density distribution information.

[0032] In some embodiments, the temperature field data of the printed circuit board assembly of the electronic device in the working state includes temperature data after taking into account the heat dissipation of fans and liquid cooling pipes in the electronic device and the heat generation of components such as chips and power modules.

[0033] In some embodiments, by inputting the power density distribution information into the heat dissipation model of the electronic device, a more accurate temperature field distribution of the printed circuit board assembly of the electronic device under working condition can be obtained. This method can not only identify potential hot spots, but also improve the reliability of the system.

[0034] Step 103: determining material parameters in the printed circuit board assembly based on the temperature field data, and determining quality data of signals transmitted by the electronic device through the printed circuit board based on the material parameters.

[0035] In some embodiments, the material parameters in the printed circuit board assembly may include material parameters of the board material, material parameters of the signal line, etc., wherein the board material is the base material of the printed circuit board, and the signal line is a conductive path for transmitting electrical signals, usually made of copper.

[0036] In some embodiments, the material parameters in the printed circuit board assembly generally refer to the dielectric constant and loss factor of the board material and the scattering parameters of the signal line, wherein the dielectric constant of the board material affects the characteristic impedance and signal propagation speed of the signal line, the loss factor of the board material reflects the signal loss of the board material under the action of the electric field, and the scattering S parameters of the signal line are used to characterize the transmission characteristics of the signal line.

[0037] In some embodiments, changes in temperature may affect the material properties of the aforementioned plates and signal lines, and changes in the material properties may affect signal transmission performance, where transmission performance refers to the degree of signal loss.

[0038] In some embodiments, by considering the dielectric constant and dissipation factor of the board material and the S parameters of the signal line and adjusting them in combination with the actual temperature field data, the signal integrity of the printed circuit board assembly can be predicted more accurately.

[0039] Through the present application, power density distribution information of a printed circuit board assembly in an electronic device is obtained; the power density distribution information is input into a heat dissipation model of the electronic device to obtain temperature field data of the printed circuit board assembly of the electronic device in a working state; based on the temperature field data, material parameters in the printed circuit board assembly are determined, and based on the material parameters, quality data of a signal transmitted by the electronic device through the printed circuit board is determined, that is, by incorporating changes in material parameters of the printed circuit board assembly into the evaluation, and by including the influence of heat dissipation and other heat-generating components in the working state of the electronic device, the technical problem of inaccurate signal integrity testing caused by inaccurate temperature field data is solved, and the technical effect of improving the accuracy of signal integrity testing of printed circuit board assemblies is achieved.

[0040] In some embodiments, Figure 2 As shown, Figure 2 A schematic flow chart of a method for obtaining power density distribution information provided in an embodiment of the present application, wherein obtaining power density distribution information of a printed circuit board assembly in an electronic device includes: Step 201, dividing the printed circuit board assembly into a plurality of grid units according to design information of the printed circuit board assembly in the electronic device; In some embodiments, the design information of the printed circuit board assembly includes component information and layout information, wherein the component information can be obtained from a data manual of the electronic device, and the layout information can be obtained from a printed circuit board layout file.

[0041] In some embodiments, based on design information of a printed circuit board assembly in an electronic device, components with high power consumption may be determined first, and the printed circuit board assembly may be divided into a plurality of grid units based on the components with high power consumption.

[0042] In some embodiments, the printed circuit board assembly can be divided into multiple grid units based on user needs, component complexity, and calculation accuracy requirements. Specifically, the sizes of the multiple grid units can be different, and the high-power area can be divided into finer grid units, such as dividing the central processing unit into finer grid units, and the lower power consumption area can be divided into coarser grid units to reduce the amount of calculation.

[0043] In some embodiments, a power integrity analysis tool may also be used to divide the printed circuit board assembly into a plurality of grid units. The power integrity analysis tool may be an Ansys SIwave tool.

[0044] Step 202, performing a DC voltage drop simulation calculation on a plurality of grid units to obtain a DC voltage drop of each grid unit on the printed circuit board assembly; In some embodiments, the DC voltage drop is a DC voltage drop of the printed circuit board assembly in a working state, which is calculated after taking into account the influence of temperature on electrical parameters such as material resistance.

[0045] In some embodiments, the aforementioned Ansys SIwave tool can be used to perform DC voltage drop simulation calculations on each of the aforementioned grid units to obtain the DC voltage drop of each grid unit of the power integrity analysis tool. Specifically, the resistance of each conductor segment can be calculated based on the copper foil thickness, trace width and length to obtain the DC voltage drop of each grid unit.

[0046] Step 203: determining power density distribution information of the printed circuit board assembly in the electronic device based on the DC voltage drop of each grid unit on the printed circuit board assembly.

[0047] In some embodiments, based on the DC voltage drop of each grid unit on the printed circuit board assembly and the current distribution on the printed circuit board assembly, the power of each grid unit on the printed circuit board assembly is determined, and then the power density of the printed circuit board assembly is obtained based on the power of each grid unit on the aforementioned printed circuit board assembly and the area of ​​each grid unit. Finally, the power density of the printed circuit board assembly is mapped to the physical coordinates of the printed circuit board assembly to obtain the power density distribution information of the printed circuit board assembly in the electronic device.

[0048] In some embodiments, by determining the power density distribution information of the printed circuit board assembly based on the DC voltage drop of each grid unit on the printed circuit board assembly, high power consumption areas on the printed circuit board assembly, such as the area where the central processing unit (CPU) is located and the area where the graphics processing unit (GPU) is located, can be intuitively identified.

[0049] In some embodiments, determining power density distribution information of a printed circuit board assembly in an electronic device based on a DC voltage drop of each grid unit on the printed circuit board assembly includes: Determine the heating power of each grid unit based on the DC voltage drop of each grid unit and the current corresponding to each grid unit; In some embodiments, the current corresponding to each grid unit can be obtained from the simulation result of the DC voltage drop.

[0050] In some embodiments, the heating power of each grid unit can be obtained by multiplying the DC voltage drop of each grid unit by the current corresponding to each grid unit.

[0051] Based on the heat generation power of each grid unit, power density distribution information of the printed circuit board assembly in the electronic device is determined.

[0052] In some embodiments, based on the heat generation power of each grid unit and the area of ​​each grid unit, the power density of each grid unit is determined, and the power density of each grid unit is mapped to the physical coordinates of the printed circuit board assembly, so as to obtain the power density distribution information of the printed circuit board assembly in the electronic device.

[0053] In some embodiments, according to design information of a printed circuit board assembly in an electronic device, dividing the printed circuit board assembly into a plurality of grid units includes: According to the design information of the printed circuit board assembly in the electronic device, determine the device to be simulated and the network to be simulated in the printed circuit board assembly, the device to be simulated is the physical component installed in the printed circuit board assembly, and the network to be simulated is the electrical connection path in the printed circuit board assembly; In some embodiments, the device to be simulated may be a high-power device, a key signal device, or the like, wherein the high-power device may be a processor, a power management module, and the key signal device may be a clock device.

[0054] In some embodiments, the network to be simulated may be a power supply network, and the power supply network may be a collector circuit voltage network or a ground network.

[0055] The printed circuit board assembly is divided into a plurality of grid cells based on the devices to be simulated and the networks to be simulated.

[0056] In some embodiments, based on the device to be simulated and the network to be simulated, the printed circuit board assembly is divided into multiple grid units, wherein the size of the grid units corresponding to each device to be simulated and the network to be simulated may be the same or different. For example, taking the device to be simulated as a GPU and the network to be simulated as a power network as an example, the GPU may be divided into 0.5mm x 0.5mm grid units, and the power network may be divided into 1mm x 1mm grid units.

[0057] In some embodiments, determining power density distribution information of a printed circuit board assembly in an electronic device based on the heat generation power of each grid unit includes: In response to the heating power of each grid unit meeting the first preset condition, power density distribution information of the printed circuit board assembly in the electronic device is determined based on the heating power of each grid unit.

[0058] In some embodiments, the first preset condition refers to that the voltage drop, current, etc. are within the design allowable range, and the heat generation power corresponding to each grid unit.

[0059] In some embodiments, when the heat generation power of each grid unit does not meet the first preset condition, design optimization is required, such as adjusting the layout of printed circuit board components, adding decoupling capacitors, optimizing heat dissipation design, etc., and then re-simulating and verifying.

[0060] In some embodiments, in response to the heat generation power of each grid unit meeting the first preset condition, the power density distribution information of the printed circuit board assembly is determined based on the heat generation power of each grid unit, so that the power distribution of the printed circuit board assembly can be evaluated more accurately.

[0061] In some embodiments, the design information of the printed circuit board assembly includes at least one of electrical information and physical information of the printed circuit board assembly, the electrical information includes voltage source information, current source information and intermediate link information, and the physical information includes stacking information, routing layout information and material property information.

[0062] In some embodiments, the design information of the printed circuit board assembly can be a three-dimensional model of board design information such as voltage source information, current source information, intermediate link information, stacking information, routing layout information, material property information, etc. Specifically, the voltage source information includes power supply network and decoupling capacitor; the current source information can include static current, dynamic current and current density; the intermediate link information includes signal path, impedance matching and other information; the stacking information includes the number of layers, dielectric thickness and other information; the routing layout information includes routing width, routing spacing and other information; the material property information includes copper foil thickness, substrate material and thermal conductivity and other information.

[0063] Furthermore, the power density distribution information is the heat generation power information of each point in the three-dimensional space of the printed circuit board assembly obtained by converting the calculated DC voltage drop of each grid unit on the printed circuit board assembly, the designed stacking information and the wiring layout.

[0064] In some embodiments, the heat dissipation model of the electronic device includes at least one of the following attribute information of the electronic device in a working state: component space dimension information, heat generating component power information, fan pressure-flow characteristic curve heat dissipation information, and material thermal parameter attribute information.

[0065] In some embodiments, component space dimension information refers to the specific dimensions of each component in the electronic device, such as the CPU, GPU, memory bar, hard disk, etc., and the specific layout information of each component in the chassis. Heat generating components refer to components such as chips, fan pressure-flow characteristic curve is used to describe the relationship between pressure and flow of the fan at different speeds, and material thermal parameter attribute information refers to the thermal conductivity and thermal expansion coefficient of the material, etc., which are used to measure the relationship between the material and temperature.

[0066] In some embodiments, inputting the power density distribution information into a heat dissipation model of the electronic device to obtain the temperature field data of the printed circuit board assembly of the electronic device in a working state includes: Determine the average heating power value in each grid unit corresponding to the power density distribution information; In some embodiments, multiple heating power values ​​corresponding to each grid unit corresponding to the power density distribution information can be accumulated to obtain the total heating power value in each grid unit corresponding to the power density distribution information, and the total heating power value in each grid unit and the area or volume of each grid unit can be used to obtain the average heating power value in each grid unit corresponding to the power density distribution information.

[0067] Determine the average heating power value in each grid unit as the power value in the corresponding grid unit in the heat dissipation model of the electronic device; In some embodiments, by determining the average heat generation power value within each grid unit as the power value within the corresponding grid unit in the heat dissipation model of the electronic device, the power density distribution information of the printed circuit board assembly can be combined with the overall heat dissipation model of the electronic device, thereby providing accurate data for subsequent thermal simulation and heat dissipation design.

[0068] Based on the power value in the corresponding grid unit in the heat dissipation model of the electronic device, the temperature field data of the printed circuit board assembly of the electronic device in the working state is determined.

[0069] In some embodiments, the temperature field data of the printed circuit board assembly may be saved as a text file in the form of three-dimensional coordinates.

[0070] In some embodiments, based on the power value in the corresponding grid unit in the heat dissipation model of the electronic device, combined with parameters such as power distribution, material properties, boundary conditions, etc., thermal simulation is used to determine the temperature field data of the printed circuit board assembly of the electronic device under working conditions, wherein the material properties refer to thermal conductivity, specific heat capacity and density, etc., and the boundary conditions refer to ambient temperature, airflow velocity and fan configuration, etc.

[0071] In some embodiments, determining material parameters in the printed circuit board assembly based on the temperature field data includes: Determining temperature field data of a first preset area based on the temperature field data of the printed circuit board assembly; In some embodiments, the first preset area may be the entire area of ​​the printed circuit board assembly or a partial area of ​​the printed circuit board assembly, where the partial area refers to an area of ​​interest to the user, which is determined by user needs and may specifically be a high-power area.

[0072] In some embodiments, by determining the temperature field data of the first preset area based on the temperature field data of the printed circuit board assembly, the temperature distribution of the first preset area can be evaluated.

[0073] Establish a bidirectional coupling simulation model of electromagnetic signals and heat dissipation and determine the grid units corresponding to the bidirectional coupling simulation model; In some embodiments, the bidirectional coupling simulation model refers to a simulation model that considers electromagnetic signals and heat dissipation simultaneously.

[0074] In some embodiments, signal transmission may cause local heating, such as wire resistance loss, dielectric loss, etc. The signal here usually refers to a high-speed signal. Temperature changes may affect the electrical properties of the material, such as the metal conductivity decreases with increasing temperature.

[0075] Allocating the temperature field data of the first preset area to the grid units corresponding to the bidirectional coupling simulation model to obtain the temperature field data in each grid unit; In some embodiments, by allocating the temperature field data of the first preset area to the grid units corresponding to the bidirectional coupling simulation model, the temperature field data in each grid unit is obtained, and the influence of electromagnetic signals and thermal signals on the temperature in each grid unit in the printed circuit board assembly can be considered at the same time, which can more accurately reflect the performance of the printed circuit board assembly under actual working conditions.

[0076] Based on the temperature field data of each grid unit, material parameters in the printed circuit board assembly corresponding to the temperature field data of each grid unit are determined from a preset temperature change mapping relationship.

[0077] Based on the temperature field data of each grid unit, determining the material parameters of the printed circuit board assembly corresponding to the temperature field data of each grid unit from the preset temperature change mapping relationship includes: Based on the temperature field data of each grid unit, determining the change value of the material parameter in the printed circuit board assembly corresponding to the temperature field data of each grid unit from a preset temperature change mapping relationship; In some embodiments, the preset temperature change mapping relationship may be expressed in the form of a graph, such as a three-dimensional graph or a two-dimensional table.

[0078] In some embodiments, the preset temperature change mapping relationship may also be expressed in the form of a function expression.

[0079] In some embodiments, the preset temperature change mapping relationship can be obtained through multiple experiments, or from a study of the relationship between relevant temperature and material changes.

[0080] Based on the changed value of the material parameter in the printed circuit board assembly, the material parameter in the printed circuit board assembly is determined.

[0081] In some embodiments, the material parameters in the printed circuit board assembly may be obtained by making a one-to-one correspondence between the change values ​​of the material parameters in the printed circuit board assembly and the grid cells corresponding to the bidirectional coupling simulation model.

[0082] In some embodiments, determining quality data of a signal transmitted by an electronic device through a printed circuit board based on a material parameter includes: In response to a material parameter in the printed circuit board assembly meeting a second preset condition, quality data of a signal transmitted by the electronic device through the printed circuit board is determined based on the material parameter.

[0083] In some embodiments, the quality data of the transmission signal may include the integrity of the signal, that is, the loss and distortion of the signal during the transmission process.

[0084] In some embodiments, the second preset condition refers to a condition that meets design requirements, industry standards or previous empirical data. Taking the FR-4 substrate as an example, the material parameter of the printed circuit board assembly is the dielectric constant, and the dielectric constant should be no higher than 4.4.

[0085] In some embodiments, by responding to material parameters in a printed circuit board assembly meeting a second preset condition and determining quality data of signals transmitted by an electronic device through a printed circuit board based on these parameters, the design performance of the printed circuit board assembly can be effectively evaluated and optimized to determine whether the material in the printed circuit board assembly needs to be adjusted.

[0086] In some embodiments, determining quality data of a signal transmitted by an electronic device through a printed circuit board based on a material parameter includes: Based on the material parameter, determining a performance loss of the material parameter, the performance loss being at least one of insertion loss, return loss, or crosstalk loss; In some embodiments, insertion loss refers to the reduction in power when a signal is transmitted through a signal line, and insertion loss includes conductor loss and dielectric loss.

[0087] In some embodiments, return loss refers to signal loss caused by a portion of the signal being reflected back to the source end due to impedance mismatch.

[0088] In some embodiments, crosstalk loss refers to the interference caused by a signal on a signal transmission path to an adjacent signal path, and may include near-end crosstalk and far-end crosstalk.

[0089] The performance loss based on material parameters determines the quality data of the signals transmitted by electronic devices through the printed circuit board.

[0090] In some embodiments, the quality data of the transmission signal includes that the signal is not interfered by noise, distorted, or lost on the transmission path of the printed circuit board assembly, thereby ensuring the accuracy of signal transmission.

[0091] In some embodiments, the evaluation index of the quality data of the transmission signal includes the transmission loss of the signal, including the signal line loss on the printed circuit board assembly. Specifically, the signal line loss depends on the characteristics of the transmission medium, that is, the printed circuit board assembly board.

[0092] Through the description of the above implementation methods, those skilled in the art can clearly understand that the method according to the above embodiment can be implemented by means of software plus a necessary general hardware platform, and of course by hardware, but in many cases the former is a better implementation method.

[0093] The embodiment of the present application further provides a signal integrity testing device 300, Figure 3 A schematic diagram of a signal integrity test device provided by an embodiment of the present disclosure is shown in FIG. Figure 3 As shown, including: A first acquisition unit 301 is used to acquire power density distribution information of a printed circuit board assembly in an electronic device; The second acquisition unit 302 is used to input the power density distribution information into the heat dissipation model of the electronic device to obtain the temperature field data of the printed circuit board assembly of the electronic device in the working state; The determination unit 303 is used to determine material parameters in the printed circuit board assembly based on the temperature field data, and determine quality data of signals transmitted by the electronic device through the printed circuit board based on the material parameters.

[0094] The power density distribution information of the printed circuit board assembly in the electronic device is obtained; the power density distribution information is input into the heat dissipation model of the electronic device to obtain the temperature field data of the printed circuit board assembly of the electronic device in the working state; based on the temperature field data, the material parameters in the printed circuit board assembly are determined, and based on the material parameters, the quality data of the signal transmitted by the electronic device through the printed circuit board is determined, that is, by incorporating the changes in the material parameters of the printed circuit board assembly into the evaluation, and by including the heat dissipation and other heat-generating components of the electronic device in the working state, the technical problem of inaccurate signal integrity testing caused by inaccurate temperature field data is solved, and the technical effect of improving the accuracy of the signal integrity test of the printed circuit board assembly is achieved.

[0095] Furthermore, in a possible implementation of the embodiment of the present disclosure, the first acquiring unit 301 is used to: Dividing the printed circuit board assembly into a plurality of grid units according to design information of the printed circuit board assembly in the electronic device; Performing DC voltage drop simulation calculation on multiple grid cells to obtain the DC voltage drop of each grid cell on the printed circuit board assembly; Power density distribution information of a printed circuit board assembly in an electronic device is determined based on a DC voltage drop of each grid cell on the printed circuit board assembly.

[0096] Furthermore, in a possible implementation of the embodiment of the present disclosure, the first acquiring unit 301 is used to: Determine the heating power of each grid unit in the electronic device based on the DC voltage drop of each grid unit and the current corresponding to each grid unit; Based on the heat generation power of each grid unit, the power density distribution information of the printed circuit board assembly is determined.

[0097] Furthermore, in a possible implementation of the embodiment of the present disclosure, the first acquiring unit 301 is used to: According to the design information of the printed circuit board assembly in the electronic device, determine the device to be simulated and the network to be simulated in the printed circuit board assembly, the device to be simulated is the physical component installed in the printed circuit board assembly, and the network to be simulated is the electrical connection path in the printed circuit board assembly; The printed circuit board assembly is divided into a plurality of grid cells based on the devices to be simulated and the networks to be simulated.

[0098] Furthermore, in a possible implementation of the embodiment of the present disclosure, the first acquiring unit 301 is used to: In response to the heating power of each grid unit meeting the first preset condition, power density distribution information of the printed circuit board assembly in the electronic device is determined based on the heating power of each grid unit.

[0099] Furthermore, in a possible implementation of the embodiment of the present disclosure, the design information of the printed circuit board assembly includes at least one of electrical information and physical information of the printed circuit board assembly, the electrical information includes voltage source information, current source information and intermediate link information, and the physical information includes stacking information, routing layout information and material property information.

[0100] Furthermore, in a possible implementation of the embodiment of the present disclosure, the heat dissipation model of the electronic device includes at least one of the following attribute information of the electronic device in a working state: component spatial dimension information, heat generation component power information, fan pressure-flow characteristic curve heat dissipation information and material thermal parameter attribute information.

[0101] Furthermore, in a possible implementation of the embodiment of the present disclosure, the second acquiring unit 302 is used to: Determine the average heating power value in each grid unit corresponding to the power density distribution information; Determine the average heating power value in each grid unit as the power value in the corresponding grid unit in the heat dissipation model of the electronic device; Based on the power value in the corresponding grid unit in the heat dissipation model of the electronic device, the temperature field data of the printed circuit board assembly of the electronic device in the working state is determined.

[0102] Further, in a possible implementation of the embodiment of the present disclosure, the determining unit 303 is used to: Based on the temperature field data, determining the temperature field data of the first preset area; Establish a bidirectional coupling simulation model of electromagnetic signals and heat dissipation and determine the grid units corresponding to the bidirectional coupling simulation model; Allocating the temperature field data of the first preset area to the grid units corresponding to the bidirectional coupling simulation model to obtain the temperature field data in each grid unit; Based on the temperature field data of each grid unit, material parameters in the printed circuit board assembly corresponding to the temperature field data of each grid unit are determined from a preset temperature change mapping relationship.

[0103] Further, in a possible implementation of the embodiment of the present disclosure, the determining unit 303 is used to: Based on the temperature field data of each grid unit, determining the change value of the material parameter in the printed circuit board assembly corresponding to the temperature field data of each grid unit from a preset temperature change mapping relationship; Based on the changed value of the material parameter in the printed circuit board assembly, the material parameter in the printed circuit board assembly is determined.

[0104] Further, in a possible implementation of the embodiment of the present disclosure, the determining unit 303 is used to: In response to a material parameter in the printed circuit board assembly meeting a second preset condition, quality data of a signal transmitted by the electronic device through the printed circuit board is determined based on the material parameter.

[0105] Further, in a possible implementation of the embodiment of the present disclosure, the determining unit 303 is used to: Based on the material parameter, determining a performance loss of the material parameter, the performance loss being at least one of insertion loss, return loss, or crosstalk loss; The performance loss based on material parameters determines the quality data of the signals transmitted by electronic devices through the printed circuit board.

[0106] For the description of the features in the embodiment corresponding to the signal integrity testing device, reference may be made to the relevant description of the embodiment corresponding to the signal integrity testing method, which will not be described in detail here.

[0107] An embodiment of the present application further provides an electronic device, including a memory and a processor, wherein a computer program is stored in the memory, and the processor is configured to run the computer program to execute the steps in any one of the above signal integrity test method embodiments.

[0108] An embodiment of the present application further provides a computer-readable storage medium, in which a computer program is stored, wherein the computer program is configured to execute the steps of any of the above-mentioned signal integrity test method embodiments when running.

[0109] In an exemplary embodiment, the computer-readable storage medium may include, but is not limited to, various media that can store computer programs, such as a USB flash drive, a read-only memory (ROM), a random access memory (RAM), a mobile hard disk, a magnetic disk or an optical disk.

[0110] An embodiment of the present application further provides a computer program product, which includes a computer program. When the computer program is executed by a processor, the steps in any one of the above signal integrity test method embodiments are implemented.

[0111] An embodiment of the present application further provides another computer program product, including a non-volatile computer-readable storage medium, wherein the non-volatile computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the steps in any of the above-mentioned signal integrity test method embodiments are implemented.

[0112] Professionals may further appreciate that the units and algorithm steps of each example described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, computer software, or a combination of the two. In order to clearly illustrate the interchangeability of hardware and software, the composition and steps of each example have been generally described in the above description according to function. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Professionals and technicians may use different methods to implement the described functions for each specific application, but such implementation should not be considered to be beyond the scope of this application.

[0113] The above is a detailed introduction to a signal integrity test method, electronic device, storage medium and product provided by the present application. Specific examples are used herein to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the method and core idea of ​​the present application. It should be pointed out that for ordinary technicians in this technical field, without departing from the principles of the present application, several improvements and modifications can be made to the present application, and these improvements and modifications also fall within the scope of protection of the claims of the present application.

Claims

1. A signal integrity testing method, characterized in that: include: Obtaining power density distribution information of printed circuit board assemblies in electronic devices; Inputting the power density distribution information into a heat dissipation model of the electronic device to obtain temperature field data of the printed circuit board assembly of the electronic device in a working state; Based on the temperature field data, material parameters in the printed circuit board assembly are determined, and based on the material parameters, quality data of signals transmitted by the electronic device through the printed circuit board is determined.

2. The signal integrity testing method according to claim 1, characterized in that: The obtaining of power density distribution information of a printed circuit board assembly in an electronic device comprises: Dividing the printed circuit board assembly into a plurality of grid units according to design information of the printed circuit board assembly in the electronic device; Performing a DC voltage drop simulation calculation on the plurality of grid units to obtain a DC voltage drop of each grid unit on the printed circuit board assembly; Based on the DC voltage drop of each grid unit on the printed circuit board assembly, power density distribution information of the printed circuit board assembly in the electronic device is determined.

3. The signal integrity testing method according to claim 2, characterized in that: The determining of the power density distribution information of the printed circuit board assembly in the electronic device based on the DC voltage drop of each grid unit on the printed circuit board assembly comprises: Determining the heating power of each grid unit based on the DC voltage drop of each grid unit and the current corresponding to each grid unit; Based on the heat generation power of each grid unit, power density distribution information of the printed circuit board assembly in the electronic device is determined.

4. The signal integrity testing method according to claim 3, characterized in that: The step of dividing the printed circuit board assembly into a plurality of grid units according to design information of the printed circuit board assembly in the electronic device comprises: According to the design information of the printed circuit board assembly in the electronic device, determine the device to be simulated and the network to be simulated in the printed circuit board assembly, wherein the device to be simulated is a physical component installed in the printed circuit board assembly, and the network to be simulated is an electrical connection path in the printed circuit board assembly; Based on the to-be-simulated device and the to-be-simulated network, the printed circuit board assembly is divided into a plurality of grid units.

5. The signal integrity testing method according to claim 3, characterized in that: The determining of the power density distribution information of the printed circuit board assembly in the electronic device based on the heat generation power of each grid unit includes: In response to the heating power of each grid unit meeting a first preset condition, power density distribution information of a printed circuit board assembly in the electronic device is determined based on the heating power of each grid unit.

6. The signal integrity testing method according to claim 2, characterized in that: The design information of the printed circuit board assembly includes at least one of electrical information and physical information of the printed circuit board assembly, the electrical information includes voltage source information, current source information and intermediate link information, and the physical information includes stacking information, routing layout information and material property information.

7. The signal integrity testing method according to claim 1, characterized in that: The heat dissipation model of the electronic device includes at least one of the following attribute information of the electronic device in a working state: component space dimension information, heat generating component power information, fan pressure-flow characteristic curve heat dissipation information and material thermal parameter attribute information.

8. The signal integrity testing method according to claim 7, characterized in that: Inputting the power density distribution information into the heat dissipation model of the electronic device to obtain the temperature field data of the printed circuit board assembly of the electronic device in the working state includes: Determine an average heating power value in each grid unit corresponding to the power density distribution information; Determine the average heating power value in each grid unit as the power value in the corresponding grid unit in the heat dissipation model of the electronic device; Based on the power value in the corresponding grid unit in the heat dissipation model of the electronic device, the temperature field data of the printed circuit board assembly of the electronic device in the working state is determined.

9. The signal integrity testing method according to claim 1, characterized in that: Determining material parameters in the printed circuit board assembly based on the temperature field data includes: Based on the temperature field data, determining the temperature field data of the first preset area; Establishing a bidirectional coupling simulation model of electromagnetic signals and heat dissipation and determining a grid unit corresponding to the bidirectional coupling simulation model; Allocating the temperature field data of the first preset area to the grid units corresponding to the bidirectional coupling simulation model to obtain the temperature field data in each grid unit; Based on the temperature field data of each grid unit, material parameters in the printed circuit board assembly corresponding to the temperature field data of each grid unit are determined from a preset temperature change mapping relationship.

10. The signal integrity testing method according to claim 9, characterized in that: The step of determining the material parameters of the printed circuit board assembly corresponding to the temperature field data of each grid unit from a preset temperature change mapping relationship based on the temperature field data of each grid unit includes: Based on the temperature field data of each grid unit, determining a change value of a material parameter in a printed circuit board assembly corresponding to the temperature field data of each grid unit from a preset temperature change mapping relationship; Based on the change value of the material parameter in the printed circuit board assembly, the material parameter in the printed circuit board assembly is determined.

11. The signal integrity testing method according to claim 10, characterized in that: The determining, based on the material parameter, quality data of a signal transmitted by the electronic device through the printed circuit board comprises: In response to a material parameter in the printed circuit board assembly meeting a second preset condition, quality data of a signal transmitted by the electronic device through the printed circuit board is determined based on the material parameter.

12. The signal integrity testing method according to claim 11, characterized in that: The determining, based on the material parameter, quality data of a signal transmitted by the electronic device through the printed circuit board comprises: Based on the material parameter, determining a performance loss of the material parameter, the performance loss being at least one of insertion loss, return loss, or crosstalk loss; Based on the performance loss of the material parameter, quality data of the signal transmitted by the electronic device through the printed circuit board is determined.

13. An electronic device, characterized in that: include: Memory for storing computer programs; A processor, configured to implement the steps of the signal integrity testing method according to any one of claims 1 to 12 when executing the computer program.

14. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores a computer program, wherein the computer program implements the steps of the signal integrity testing method according to any one of claims 1 to 12 when executed by a processor.

15. A computer program product comprising a computer program, characterized in that When the computer program is executed by a processor, the steps of the signal integrity testing method according to any one of claims 1 to 12 are implemented.

Images