Wafer suction flattening structure, suction flattening method, and wafer detection device

Abstract

The present application provides a wafer sucking and leveling structure, a wafer sucking and leveling method, and a wafer detection device. The sucking and leveling structure includes a bottom plate, a carrier plate, a lifting and rotating module, a sucking and leveling module, and a leveling module. The carrier plate is used for carrying the wafer. The lifting and rotating module includes a rotating mechanism and a lifting mechanism. The rotating mechanism is used for carrying the wafer. The sucking and leveling module can adsorb the wafer and reciprocate in a first direction to suck the wafer flat on the carrier plate, which can ensure the flatness of the wafer and facilitate operations such as pre-aligning positioning and scanning of the wafer. The first leveling mechanism, the second leveling mechanism, the third leveling mechanism, and the fourth leveling mechanism of the leveling module are arranged around the carrier plate and are respectively provided on the four sides of the carrier plate. The leveling module can move along the side where it is close to the center of the carrier plate to center and level the wafer on the carrier plate, which can effectively correct the position of the wafer and facilitate subsequent transportation and detection of the wafer.

Description

Technical Field

[0001] The present application relates to the technical field of wafer detection, and particularly relates to a wafer sucking and flattening structure, a wafer sucking and flattening method, and a wafer detection device. Background Art

[0002] A wafer detection device is an important device for testing and characterizing semiconductor devices, and can test the performance of integrated circuit devices on a wafer. Before the wafer detection device tests a wafer, it is necessary to perform pre-alignment on the wafer to accurately identify and calibrate the model and position of the wafer, so as to ensure that the wafer detection device can accurately match and test the wafer.

[0003] However, during the process of wafer manufacturing, some wafers will undergo warping and deformation. During the process of wafer detection, warped and deformed wafers are not conducive to the positioning, scanning code, and subsequent detection steps of the wafer for pre-alignment. In the related art, conventional wafer detection devices cannot effectively position and detect warped and deformed wafers. Summary of the Invention

[0004] The purpose of the present application is to provide a wafer sucking and flattening structure, a wafer sucking and flattening method, and a wafer detection device, so as to solve the technical problem that in the related art, conventional wafer detection devices cannot effectively position and detect warped and deformed wafers.

[0005] In a first aspect, the present application provides a wafer sucking and flattening structure, including:

[0006] A bottom plate;

[0007] A carrier plate, the carrier plate is arranged on the bottom plate and is spaced from the bottom plate, and the carrier plate is used for carrying a wafer;

[0008] A lifting and rotating module, the lifting and rotating module is arranged on the bottom plate, the lifting and rotating module includes a rotating mechanism and a lifting mechanism, the rotating mechanism is used for carrying the wafer and driving the wafer to rotate relative to the bottom plate, and the lifting mechanism is used for carrying the rotating mechanism and driving the rotating mechanism to reciprocate along a first direction, the first direction is perpendicular to the bottom plate;

[0009] A sucking and flattening module, the sucking and flattening module is arranged on the bottom plate, at least part of the sucking and flattening module penetrates through the carrier plate and the bottom plate, the sucking and flattening module is used for carrying and sucking and flattening the wafer, and the sucking and flattening module can reciprocate along the first direction to suck and flatten the wafer on the carrier plate; and

[0010] The alignment module is provided on the bottom plate. The alignment module includes a first alignment mechanism, a second alignment mechanism, a third alignment mechanism, and a fourth alignment mechanism. The first alignment mechanism, the second alignment mechanism, the third alignment mechanism, and the fourth alignment mechanism are arranged around the carrier plate and are respectively provided on the four sides of the carrier plate. The first alignment mechanism, the second alignment mechanism, the third alignment mechanism, and the fourth alignment mechanism can all be used to move along the side close to the center of the carrier plate to align the wafer on the carrier plate.

[0011] In the suction and alignment structure provided by the present application, the carrier plate is provided on the bottom plate and is spaced from the bottom plate. The lifting and rotating module is provided on the bottom plate. The lifting and rotating module includes a rotating mechanism and a lifting mechanism. The rotating mechanism is used to carry the wafer and drive the wafer to rotate relative to the bottom plate. The lifting mechanism is used to carry the rotating mechanism and drive the rotating mechanism to reciprocate along the first direction. The suction and flattening module is provided on the bottom plate. The suction and flattening module at least partially penetrates the carrier plate and the bottom plate. The suction and flattening module is used to carry and flatten the wafer. The suction and flattening module can reciprocate along the first direction to flatten the wafer on the carrier plate. The alignment module is provided on the bottom plate. The alignment module includes a first alignment mechanism, a second alignment mechanism, a third alignment mechanism, and a fourth alignment mechanism. The first alignment mechanism, the second alignment mechanism, the third alignment mechanism, and the fourth alignment mechanism are arranged around the carrier plate and are respectively provided on the four sides of the carrier plate. The first alignment mechanism, the second alignment mechanism, the third alignment mechanism, and the fourth alignment mechanism can all be used to move along the side close to the center of the carrier plate to align the wafer on the carrier plate. The suction and flattening module can drive the wafer to move in the opposite direction of the first direction to place the wafer flat on the carrier plate, which can ensure the flatness of the wafer and facilitate operations such as pre-aligning positioning and scanning of the wafer. The alignment module can align the wafer on the carrier plate, center the larger-sized wafer, effectively correct the position of the wafer, and facilitate subsequent steps such as transporting and detecting the wafer.

[0012] Wherein, the alignment module further includes an alignment driving mechanism. The alignment driving mechanism is connected to the first alignment mechanism and is used to drive the first alignment mechanism to move along the second direction and its opposite direction. The alignment driving mechanism is connected to the second alignment mechanism and is used to drive the second alignment mechanism to move along the third direction and its opposite direction. The alignment driving mechanism is connected to the third alignment mechanism and is used to drive the third alignment mechanism to move along the first direction and its opposite direction. The alignment driving mechanism is connected to the fourth alignment mechanism and is used to drive the fourth alignment mechanism to move along the third direction and its opposite direction. Wherein, the second direction and the third direction are perpendicular, and both the second direction and the third direction are perpendicular to the first direction.

[0013] Among them, the tuning module further includes a fifth tuning mechanism and a sixth tuning mechanism. The first tuning mechanism and the fifth tuning mechanism are arranged at intervals along the third direction, and the third tuning mechanism and the sixth tuning mechanism are arranged at intervals along the third direction;

[0014] The tuning module further includes a guide rail assembly. The guide rail assembly includes a first guide rail, a second guide rail, and a third guide rail. The first guide rail and the third guide rail extend along the second direction and are arranged at intervals. The second guide rail extends along the third direction. Among them, the first tuning mechanism and the third tuning mechanism are slidably connected to the first guide rail, and the first tuning mechanism and the third tuning mechanism move along the first guide rail toward the second direction and its opposite direction. The fifth tuning mechanism and the sixth tuning mechanism are slidably connected to the third guide rail, and the fifth tuning mechanism and the sixth tuning mechanism move along the second guide rail toward the second direction and its opposite direction. The second tuning mechanism and the fourth tuning mechanism are slidably connected to the second guide rail, and the second tuning mechanism and the fourth tuning mechanism move along the second guide rail toward the third direction and its opposite direction.

[0015] Among them, the tuning drive mechanism includes a tuning drive motor and a conveyor belt assembly. The tuning drive motor is connected to the conveyor belt assembly and is used to drive the conveyor belt assembly to move;

[0016] The conveyor belt assembly includes an outer conveyor belt and an inner conveyor belt. The outer conveyor belt and the inner conveyor belt are connected, and the conveying directions of the outer conveyor belt and the inner conveyor belt are opposite;

[0017] The inner conveyor belt includes a first conveying portion, a second conveying portion, and a third conveying portion that are connected in sequence. The outer conveyor belt includes a fourth conveying portion, a fifth conveying portion, and a sixth conveying portion that are connected in sequence. The first conveying portion and the fourth conveying portion are correspondingly arranged and move in opposite directions. The second conveying portion and the fifth conveying portion are correspondingly arranged and move in opposite directions. The third conveying portion and the sixth conveying portion are correspondingly arranged and move in opposite directions. The first conveying portion, the third conveying portion, the fourth conveying portion, and the sixth conveying portion extend along the second direction, and the second conveying portion and the fifth conveying portion extend along the third direction;

[0018] The first rectifying mechanism is connected to the first conveying part, the third rectifying mechanism is connected to the fourth conveying part, and the moving directions of the first rectifying mechanism and the third rectifying mechanism are opposite; the second rectifying mechanism is connected to the second conveying part, the fourth rectifying mechanism is connected to the fifth conveying part, and the moving directions of the second rectifying mechanism and the fourth rectifying mechanism are opposite; the fifth rectifying mechanism is connected to the third conveying part, the sixth rectifying mechanism is connected to the sixth conveying part, and the moving directions of the fifth rectifying mechanism and the sixth rectifying mechanism are opposite.

[0019] Wherein, the rectifying module includes a retracted state and an opened state. When the rectifying module is in the retracted state, the rectifying driving motor rotates clockwise, the inner conveyor belt moves counterclockwise, the outer conveyor belt moves clockwise, the first conveying part drives the first rectifying mechanism to move along the second direction, the second conveying part drives the second rectifying mechanism to move in the opposite direction of the third direction, the third conveying part drives the sixth rectifying mechanism to move in the opposite direction of the second direction, the fourth conveying part drives the third rectifying mechanism to move in the opposite direction of the second direction, the fifth conveying part drives the fourth rectifying mechanism to move along the third direction; the sixth conveying part drives the fifth rectifying mechanism to move along the second direction;

[0020] When the rectifying module is in the opened state, the rectifying driving motor rotates counterclockwise, the inner conveyor belt moves clockwise, the outer conveyor belt moves counterclockwise, the first conveying part drives the first rectifying mechanism to move in the opposite direction of the second direction, the second conveying part drives the second rectifying mechanism to move along the third direction, the third conveying part drives the sixth rectifying mechanism to move along the second direction, the fourth conveying part drives the third rectifying mechanism to move along the second direction, the fifth conveying part drives the fourth rectifying mechanism to move in the opposite direction of the third direction; the sixth conveying part drives the fifth rectifying mechanism to move in the opposite direction of the second direction.

[0021] Wherein, the first rectifying mechanism includes a first connecting piece, a first pressing plate, a first adjusting block, a second adjusting block, a first guide rod and a second guide rod. The first connecting piece is connected to the first guide rail, the first pressing plate is respectively connected to the first connecting piece and the first conveying part. The first adjusting block and the second adjusting block are arranged on the first connecting piece, and the first adjusting block and the second adjusting block are arranged in sequence along the third direction. The first guide rod is arranged on the first adjusting block, the second guide rod is arranged on the second adjusting block, and the first guide rod and the second guide rod are used to abut against and limit the wafer.

[0022] The first adjusting block and the second adjusting block are provided with a first waist-shaped hole, and the first adjusting block and the second adjusting block are fixedly connected through the first waist-shaped hole and the first connecting member.

[0023] The first guide rod includes a main body, an arc-shaped transition portion and an extension portion. The radial dimension of the extension portion is larger than that of the main body, and the radial dimension of the arc-shaped transition portion gradually increases from the main body to the extension portion.

[0024] Wherein, the suction leveling module comprises a first suction leveling mechanism and a second suction leveling mechanism which are arranged at intervals, and the first suction leveling mechanism and the second suction leveling mechanism are arranged on a side of the bottom plate away from the carrying plate;

[0025] The first suction mechanism comprises a first lifting cylinder, a first fixing assembly, a first suction piece and a second suction piece, wherein the first lifting cylinder is used to drive the first fixing assembly to move along the first direction, the first suction piece and the second suction piece are arranged at two ends of the first fixing assembly, and the first suction piece and the second suction piece penetrate the bottom plate and the carrying plate, and the first suction piece and the second suction piece are used to absorb the wafer;

[0026] The second leveling mechanism includes a second lifting cylinder, a second fixed assembly, a third leveling member and a fourth leveling member. The second lifting cylinder is used to drive the second fixed assembly to move along the first direction. The third leveling member and the fourth leveling member are arranged at both ends of the second fixed assembly, and the third leveling member and the fourth leveling member pass through the bottom plate and the supporting plate. The third leveling member and the fourth leveling member are used to absorb the wafer.

[0027] The rotating mechanism comprises a rotating assembly and a suction cup assembly, wherein the rotating assembly is arranged on a side of the bottom plate away from the carrying plate, the rotating assembly is used to drive the suction cup assembly to rotate, the suction cup assembly extends along the first direction and penetrates the bottom plate and the carrying plate, and the suction cup assembly is used to carry and adsorb the wafer;

[0028] The suction cup assembly includes a suction cup seat, a suction cup body and multiple suction cups. The suction cup seat and the suction cup body are connected to form an air suction channel connecting the multiple suction cups. The suction cup body is provided with multiple receiving grooves, and the multiple receiving grooves are used to place the suction cups. In the first direction, the height of the suction cup is higher than the height of the suction cup body, so as to adsorb the wafer tightly against the suction cup body.

[0029] In a second aspect, the present application provides a suction leveling method, which is applied to the suction leveling structure, and the suction leveling method comprises:

[0030] Control the lifting and rotating module to move from the first position to the second position along the first direction for adsorbing and carrying the wafer;

[0031] Control the lifting and rotating module to move to the third position along the opposite direction of the first direction;

[0032] Control the flattening module to move to the first flattening position along the first direction for adsorbing the wafer on the lifting and rotating module;

[0033] Control the lifting and rotating module to move to the first position along the opposite direction of the first direction after the flattening module adsorbs the wafer;

[0034] Control the flattening module to move from the first flattening position to the second flattening position along the opposite direction of the first direction for flattening the wafer on the carrier plate;

[0035] Control the code scanning device to scan the wafer after the wafer is flattened on the carrier plate;

[0036] Control the rectifying mechanism of the rectifying module to move to the first rectifying position along the side close to the lifting and rotating module;

[0037] Control the flattening module to release the wafer after the rectifying mechanism moves to the first rectifying position;

[0038] Control the rectifying mechanism of the rectifying module to move to the second rectifying position for rectifying the wafer.

[0039] In a third aspect, the present application provides a wafer detection device, including a transportation structure and the flattening and rectifying structure as described above. The transportation structure is used to transport the wafer to the flattening and rectifying structure or remove the wafer on the flattening and rectifying structure.

[0040] In the wafer inspection device provided by the present application, a carrier plate is disposed on the bottom plate and is spaced from the bottom plate. A lifting and rotating module is disposed on the bottom plate. The lifting and rotating module includes a rotating mechanism and a lifting mechanism. The rotating mechanism is used to carry the wafer and drive the wafer to rotate relative to the bottom plate. The lifting mechanism is used to carry the rotating mechanism and drive the rotating mechanism to reciprocate along a first direction. A flattening module is disposed on the bottom plate. At least a part of the flattening module penetrates through the carrier plate and the bottom plate. The flattening module is used to carry and flatten the wafer. The flattening module can reciprocate along the first direction to flatten the wafer on the carrier plate. A rectifying module is disposed on the bottom plate. The rectifying module includes a first rectifying mechanism, a second rectifying mechanism, a third rectifying mechanism, and a fourth rectifying mechanism. The first rectifying mechanism, the second rectifying mechanism, the third rectifying mechanism, and the fourth rectifying mechanism are arranged around the carrier plate and are respectively disposed around the carrier plate. The first rectifying mechanism, the second rectifying mechanism, the third rectifying mechanism, and the fourth rectifying mechanism can all be used to move along the side close to the center of the carrier plate to rectify the wafer on the carrier plate. The flattening module can drive the wafer to move in the opposite direction of the first direction to place the wafer flat on the carrier plate, which can ensure the flatness of the wafer and facilitate operations such as pre-aligning positioning and scanning of the wafer. The rectifying module can rectify the wafer on the carrier plate to center the larger-sized wafer, effectively correct the position of the wafer, and facilitate subsequent steps such as transporting and inspecting the wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0041] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0042] Figure 1 is a schematic structural diagram of a wafer inspection device provided by an embodiment of the present application;

[0043] Figure 2 is a schematic structural diagram of a flattening and rectifying structure provided by an embodiment of the present application;

[0044] Figure 3 is a schematic structural diagram of a flattening and rectifying structure removing the carrier plate provided by an embodiment of the present application;

[0045] Figure 4 is a schematic top view structural diagram of a flattening and rectifying structure provided by an embodiment of the present application;

[0046] Figure 5 is a schematic structural diagram of a lifting and rotating module provided by an embodiment of the present application;

[0047] Figure 6Schematic diagram of a lifting and rotating module provided by an embodiment of the present application in the second position Figure 1 ;

[0048] Figure 7 Schematic diagram of a lifting and rotating module provided by an embodiment of the present application in the second position Figure 2 ;

[0049] Figure 8 Schematic diagram of a lifting and rotating module provided by an embodiment of the present application in the third position and a flattening module in the first flattening position Figure 1 ;

[0050] Figure 9 Schematic diagram of a lifting and rotating module provided by an embodiment of the present application in the third position and a flattening module in the first flattening position Figure 2 ;

[0051] Figure 10 Schematic diagram of a setting drive mechanism and a guide rail assembly provided by an embodiment of the present application;

[0052] Figure 11 Partial structural schematic diagram of a setting module provided by an embodiment of the present application Figure 1 ;

[0053] Figure 12 Partial structural schematic diagram of a setting module provided by an embodiment of the present application Figure 2 ;

[0054] Figure 13 Schematic diagram of a setting module provided by an embodiment of the present application in the initial position;

[0055] Figure 14 Schematic diagram of a setting module provided by an embodiment of the present application in the retracted state;

[0056] Figure 15 Schematic diagram of a setting module provided by an embodiment of the present application in the final setting position;

[0057] Figure 16 Schematic diagram of a setting module provided by an embodiment of the present application in the open state;

[0058] Figure 17 Schematic diagram of a square wafer provided by an embodiment of the present application;

[0059] Figure 18 Partial structural schematic diagram of a setting module provided by an embodiment of the present application Figure 3 ;

[0060] Figure 19It is a schematic diagram of a partial structure of a setting module provided by an embodiment of the present application Figure 4 ;

[0061] Figure 20 It is a schematic structural diagram of a first guide rod provided by an embodiment of the present application;

[0062] Figure 21 is Figure 18 An enlarged schematic diagram of area A in

[0063] Figure 22 It is a schematic structural diagram of a setting module for setting a large-sized wafer provided by an embodiment of the present application;

[0064] Figure 23 It is a schematic structural diagram of a setting module for setting a small-sized wafer provided by an embodiment of the present application;

[0065] Figure 24 It is a schematic structural diagram of a suction flattening module provided by an embodiment of the present application;

[0066] Figure 25 It is a schematic structural diagram of a rotating mechanism provided by an embodiment of the present application;

[0067] Figure 26 It is a schematic structural diagram of a suction cup assembly provided by an embodiment of the present application;

[0068] Figure 27 It is a flowchart of a suction flattening and setting method provided by an embodiment of the present application.

[0069] Label description:

[0070] Wafer inspection device 1000, suction and leveling structure 100, bottom plate 10, first via hole 11, carrier plate 20, second via hole 21, lifting and rotating module 30, lifting mechanism 31, lifting fixing plate 311, lifting motor 312, lifting guide rail 313, sliding seat 314, lifting induction piece 315, first position detector 316, second position detector 317, rotating mechanism 32, rotating assembly 321, suction cup assembly 322, suction cup seat 3221, suction cup main body 3222, suction cup 3223, leveling module 40, first leveling mechanism 41, first lifting cylinder 411, first fixing component 412, first leveling piece 413, second leveling piece 414, second leveling mechanism 42, second lifting cylinder 421, second fixing component 422, third leveling piece 423, fourth leveling piece 424, leveling module 50, first leveling mechanism 51, first connecting piece 511, first pressing plate 512, first adjusting block 513, second adjusting block 514, first guide rod 515, main body part 5151, arc transition part 5152, extension part 5153, second guide rod 516, second leveling mechanism 52, second connecting piece 521, second pressing plate 522, third adjusting block 523, third guide rod 524, fourth guide rod 525, third leveling mechanism 53, third connecting piece 531, third pressing plate 532, fourth adjusting block 533, fifth adjusting block 534, fifth guide rod 535, sixth guide rod 536, fourth leveling mechanism 54, fourth connecting piece 541, fourth pressing plate 542, sixth adjusting block 543, seventh guide rod 544, eighth guide rod 545, fifth leveling mechanism 55, fifth connecting piece 551, fifth pressing plate 552, seventh adjusting block 553, eighth adjusting block 554, ninth guide rod 555, tenth guide rod 556, sixth leveling mechanism 56, sixth connecting piece 561, sixth pressing plate 562, ninth adjusting block 563, tenth adjusting block 564, eleventh guide rod 565, twelfth guide rod 566, leveling induction piece 567, leveling driving mechanism 60, leveling driving motor 61, conveyor belt assembly 62, outer conveyor belt 621, first conveying part 6211, second conveying part 6212, third conveying part 6213, inner conveyor belt 622, fourth conveying part 6221, fifth conveying part 6222, sixth conveying part 6223, first conveyor wheel 623, second conveyor wheel 624, third conveyor wheel 625, fourth conveyor wheel 626, first tensioning wheel 627, second tensioning wheel 628, tensioning block 629, first guide rail 71, second guide rail 72, third guide rail 73, installation slide rail 81, first sensor 82, second sensor 83, transportation structure 200, code scanning device 300, first side 91, second side 92, third side 93, fourth side 94, wafer detector 95. Detailed implementation mode

[0071] Next, the technical solutions in the embodiments of the present application will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present application.

[0072] It should be noted that the terms "first", "second", etc. in the specification and claims of the present application and the above-mentioned accompanying drawings are used to distinguish different objects, rather than to describe a specific order. In addition, the terms "include" and "have" and any variations thereof are intended to cover non-exclusive inclusions.

[0073] In this specification, for convenience, terms indicating orientation or positional relationships such as "middle", "upper", "lower", "front", "rear", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. are used to describe the positional relationships of the constituent elements with reference to the accompanying drawings. This is only for the convenience of describing this specification and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present disclosure. The positional relationships of the constituent elements are appropriately changed according to the directions of the described constituent elements. Therefore, it is not limited to the terms described in the specification, and can be appropriately replaced according to the circumstances.

[0074] In this specification, unless otherwise clearly specified and limited, the terms "install", "connect", and "couple" shall be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected, or indirectly connected through an intermediate member, or the internal communication of two elements. For those of ordinary skill in the art, the meanings of the above terms in the present disclosure can be understood according to the circumstances.

[0075] A wafer inspection device is an important device for testing and characterizing semiconductor devices and can test the performance of integrated circuit devices on a wafer.

[0076] A wafer inspection device generally includes components such as a cassette, a transport structure, a test bench, and probes. The cassette is used to store wafers. During the operation of the wafer inspection device, the transport structure is used to take out the wafers to be tested from the cassette and transport the wafers to the test bench for inspection. The transport structure can also remove the inspected wafers from the test bench and put the inspected wafers back into the cassette. Among them, the transport structure includes but is not limited to a robotic structure. The test bench is used to carry the wafer and perform inspections. The probes are arranged above the test bench and are used to contact the wafer to perform electrical performance tests on the wafer.

[0077] However, there are currently many types of wafers. A set of wafer detection devices usually needs to be able to test multiple types of wafers, and the wafers are often offset in the position where they are stored in the cassette. Therefore, before the wafer detection device tests the wafer, it is necessary to perform pre-alignment on the wafer to accurately identify and calibrate the model and position of the wafer, so as to ensure that the wafer detection device can accurately match and test the wafer.

[0078] However, during the process of wafer manufacturing, some wafers will warp and deform. During the process of wafer detection, warped and deformed wafers are not conducive to the positioning, barcode scanning, and subsequent detection steps of wafer pre-alignment. In the related art, conventional wafer detection devices cannot effectively position and detect warped and deformed wafers.

[0079] In view of this, to solve the above problems, please refer to Figures 1 to 5 , Figure 1 which is a schematic structural diagram of a wafer detection device provided by an embodiment of the present application, Figure 2 which is a schematic structural diagram of a suction and flattening structure provided by an embodiment of the present application, Figure 3 which is a schematic structural diagram of a suction and flattening structure removing the carrier plate provided by an embodiment of the present application, Figure 4 which is a top view structural diagram of a suction and flattening structure provided by an embodiment of the present application, Figure 5 which is a schematic structural diagram of a lifting and rotating module provided by an embodiment of the present application.

[0080] The present application provides a suction and flattening structure 100 for wafers to solve the technical problem that in the related art, conventional wafer detection devices cannot effectively position and detect warped and deformed wafers.

[0081] The wafer sucking and aligning structure 100 includes a bottom plate 10, a carrier plate 20, a lifting and rotating module 30, a wafer sucking module 40, and an aligning module 50. The carrier plate 20 is disposed on the bottom plate 10 and spaced apart from the bottom plate 10, and the carrier plate 20 is used for carrying a wafer. The lifting and rotating module 30 is disposed on the bottom plate 10. The lifting and rotating module 30 includes a rotating mechanism 32 and a lifting mechanism 31. The rotating mechanism 32 is used for carrying the wafer and driving the wafer to rotate relative to the bottom plate 10. The lifting mechanism 31 is used for carrying the rotating mechanism 32 and driving the rotating mechanism 32 to reciprocate along a first direction D1, and the first direction D1 is perpendicular to the bottom plate 10. The wafer sucking module 40 is disposed on the bottom plate 10. The wafer sucking module 40 at least partially penetrates through the carrier plate 20 and the bottom plate 10. The wafer sucking module 40 is used for carrying and sucking flat the wafer, and the wafer sucking module 40 can reciprocate along the first direction D1 to suck the wafer flat on the carrier plate 20. The aligning module 50 is disposed on the bottom plate 10. The aligning module 50 includes a first aligning mechanism 51, a second aligning mechanism 52, a third aligning mechanism 53, and a fourth aligning mechanism 54. The first aligning mechanism 51, the second aligning mechanism 52, the third aligning mechanism 53, and the fourth aligning mechanism 54 are arranged around the carrier plate 20 and are respectively disposed around the carrier plate 20. The first aligning mechanism 51, the second aligning mechanism 52, the third aligning mechanism 53, and the fourth aligning mechanism 54 can all be used to move along the side close to the center of the carrier plate 20 to align the wafer on the carrier plate 20.

[0082] The wafer sucking and aligning structure 100 can be but is not limited to being applied to a wafer detection device 1000 to suck and align the wafer so that the wafer can perform corresponding positioning, scanning, and subsequent detection steps. It should be noted that when the wafer sucking and aligning structure 100 is applied to the wafer detection device 1000, the transportation structure 200 of the wafer detection device 1000 can be used to first transport the wafer from the material box to the wafer sucking and aligning structure 100, and then the wafer sucking and aligning structure 100 performs corresponding operations such as sucking and aligning on the wafer. Moreover, after the wafer performs operations such as sucking and aligning, the transportation structure 200 can also move the wafer out of the wafer sucking and aligning structure 100, and the present application does not limit this.

[0083] Specifically, the suction and leveling structure 100 includes a bottom plate 10, and the bottom plate 10 can be used to support the carrier plate 20, the lifting and rotating module 30, the suction and leveling module 40, the leveling module 50 and other structural parts. It should be noted that the bottom plate 10 includes but is not limited to being a part of the frame of the wafer detection device 1000 or being fixed on the frame of the wafer detection device 1000, and this application does not limit this.

[0084] The carrier plate 20 is disposed on the bottom plate 10 and is spaced apart from the bottom plate 10. Specifically, the carrier plate 20 is fixed to the bottom plate 10 through a plurality of support columns and is spaced apart from the bottom plate 10. The carrier plate 20 is used to carry the wafer. The carrier plate 20 and the bottom plate 10 are spaced apart to form a receiving gap, and the receiving gap can be used to receive part of the lifting and rotating module 30, part of the leveling module 40, and part of the setting module 50.

[0085] The lifting and rotating module 30 is fixed on the bottom plate 10, and the lifting and rotating module 30 is fixedly connected to the side of the bottom plate 10 away from the carrying plate 20. Specifically, the lifting and rotating module 30 includes a lifting mechanism 31 and a rotating mechanism 32, the lifting mechanism 31 is fixed to the side of the bottom plate 10 away from the carrying plate 20, the rotating mechanism 32 is fixed on the lifting mechanism 31, the lifting mechanism 31 is used to carry the rotating mechanism 32, and the lifting mechanism 31 can drive the rotating mechanism 32 to reciprocate along the first direction D1.

[0086] The rotating mechanism 32 is used to carry the wafer, and the rotating module can be used to drive the wafer to rotate around the axis of the rotating module to adjust the circumferential position of the wafer, so as to facilitate the pre-alignment positioning, code scanning, and subsequent detection steps of the wafer. Specifically, the rotating mechanism 32 passes through the bottom plate 10 and the carrier plate 20, and the rotating mechanism 32 can be used to expose the carrier plate 20 and receive the wafer above the carrier plate 20.

[0087] Further, in this embodiment, a first through hole 11 is provided on the bottom plate 10. The first through hole 11 can be used for passing through the rotation module. Moreover, a second through hole 21 is provided on the carrier plate 20. The second through hole 21 is arranged corresponding to the first through hole 11, that is, the second through hole 21 coincides with the first through hole 11 in the first direction D1. The second through hole 21 can also be used for passing through the rotation module. In other words, the rotation module passes through the first through hole 11 and the second through hole 21 in sequence, penetrates the bottom plate 10 and the carrier plate 20 through the first through hole 11 and the second through hole 21, and carries the wafer on the carrier plate 20 through the second through hole 21. It should be noted that the radial dimension of the wafer is larger than the radial dimension of the second through hole 21, so that the wafer can be placed on the carrier plate 20 without falling from the second through hole 21. And the radial dimensions of the second through hole 21 and the first through hole 11 are larger than the radial dimension of the rotation module, so that the rotation module can carry the wafer on the carrier plate 20 through the first through hole 11 and the second through hole 21.

[0088] The suction and flattening and aligning structure 100 provided by the present application further includes the suction and flattening module 40. At least a part of the suction and flattening module 40 penetrates through the carrier plate 20 and the bottom plate 10, and the suction and flattening module 40 can reciprocate along the first direction D1. Specifically, the suction and flattening module 40 can move along the first direction D1 to above the carrier plate 20 to carry and flatten the wafer. Moreover, the suction and flattening module 40 can also drive the wafer to move in the opposite direction of the first direction D1 to place the flattened wafer on the carrier plate 20, which can ensure the flatness of the wafer and facilitate operations such as pre-aligning positioning and scanning code of the wafer.

[0089] The suction and flattening and aligning structure 100 provided by the present application further includes the aligning module 50. The first aligning mechanism 51, the second aligning mechanism 52, the third aligning mechanism 53 and the fourth aligning mechanism 54 of the aligning module 50 are all arranged on the bottom plate 10, and the first aligning mechanism 51, the second aligning mechanism 52, the third aligning mechanism 53 and the fourth aligning mechanism 54 surround the carrier plate 20 and are respectively arranged around the carrier plate 20. The first aligning mechanism 51, the second aligning mechanism 52, the third aligning mechanism 53 and the fourth aligning mechanism 54 can all be used to move along the side close to the center of the carrier plate 20 to align the wafer on the carrier plate 20, which can center the larger-sized wafer, effectively correct the position of the wafer, and facilitate subsequent steps such as transporting and detecting the wafer.

[0090] Further, asFigure 4 As shown, in this embodiment, the first alignment mechanism 51, the second alignment mechanism 52, the third alignment mechanism 53, and the fourth alignment mechanism 54 are arranged around the carrier plate 20 in the clockwise direction, and the first alignment mechanism 51 and the third alignment mechanism 53 are arranged at intervals relative to each other, and the second alignment mechanism 52 and the fourth alignment mechanism 54 are arranged at intervals relative to each other.

[0091] In the suction and alignment structure 100 provided in the present application, the carrier plate 20 is arranged on the bottom plate 10 and is spaced from the bottom plate 10. The lifting and rotating module 30 is arranged on the bottom plate 10. The lifting and rotating module 30 includes the rotating mechanism 32 and the lifting mechanism 31. The rotating mechanism 32 is used to carry the wafer and drive the wafer to rotate relative to the bottom plate 10. The lifting mechanism 31 is used to carry the rotating mechanism 32 and drive the rotating mechanism 32 to reciprocate along the first direction D1. The suction and flattening module 40 is arranged on the bottom plate 10. The suction and flattening module 40 at least partially penetrates the carrier plate 20 and the bottom plate 10. The suction and flattening module 40 is used to carry and flatten the wafer. The suction and flattening module 40 can reciprocate along the first direction D1 to flatten the wafer on the carrier plate 20. The alignment module 50 is arranged on the bottom plate 10. The alignment module 50 includes a first alignment mechanism 51, a second alignment mechanism 52, a third alignment mechanism 53, and a fourth alignment mechanism 54. The first alignment mechanism 51, the second alignment mechanism 52, the third alignment mechanism 53, and the fourth alignment mechanism 54 are arranged around the carrier plate 20 and are respectively arranged around the periphery of the carrier plate 20. The first alignment mechanism 51, the second alignment mechanism 52, the third alignment mechanism 53, and the fourth alignment mechanism 54 can all be used to move along the side close to the center of the carrier plate 20 to align the wafer on the carrier plate 20. The suction and flattening module 40 can drive the wafer to move in the opposite direction of the first direction D1 to place the wafer flat on the carrier plate 20, which can ensure the flatness of the wafer and facilitate operations such as pre-aligning positioning and scanning the wafer. The alignment module 50 can align the wafer on the carrier plate 20 to center the large-sized wafer, effectively correct the position of the wafer, and facilitate subsequent steps such as transporting and detecting the wafer.

[0092] It should be noted that in this embodiment, during the process of the wafer detection device 1000 detecting the wafer, when the transportation structure 200 transports the wafer to the suction and alignment structure 100, the overall working process of the suction and alignment structure 100 is as follows.

[0093] First, the lifting and rotating module 30 moves from the first position to the second position along the first direction D1. The lifting and rotating module 30 is used to absorb and carry the wafer. Figure 6 and Figure 7 As shown, Figure 6 This is a structural diagram of a lifting and rotating module in the second position provided by an embodiment of the present application Figure 1 , Figure 7 This is a structural diagram of a lifting and rotating module in the second position provided by an embodiment of the present application Figure 2 .

[0094] Specifically, the lifting mechanism 31 of the lifting and rotating module 30 moves along the first direction D1 and drives the rotating mechanism 32 to move, so that the rotating mechanism 32 on the lifting mechanism 31 can move to the bottom of the wafer and receive and adsorb the wafer.

[0095] For further information, please refer to Figure 5 In this embodiment, the lifting mechanism 31 includes a lifting fixed plate 311, a lifting motor 312, a lifting guide rail 313 and a sliding seat 314. The lifting fixed plate 311 is arranged on the side of the bottom plate 10 away from the carrying plate 20. The lifting guide rail 313 is extended along the first direction D1 and arranged on the lifting fixed plate 311. The sliding seat 314 is arranged on the lifting guide rail 313 and can reciprocate along the first direction D1 relative to the lifting guide rail 313. The output shaft of the lifting motor 312 is connected to the sliding seat 314 and drives the sliding seat 314 to reciprocate along the first direction D1. In addition, the rotating mechanism 32 is arranged on the sliding seat 314 and moves back and forth along the first direction D1 following the sliding seat 314.

[0096] Among them, the first position and the second position of the lifting and rotating module 30 include but are not limited to referring to the first position and the second position of the sliding seat 314 or the rotating mechanism 32. The movement of the lifting and rotating module 30 from the first position to the second position along the first direction D1 includes but is not limited to referring to the movement of the sliding seat 314 or the rotating mechanism 32 from the first position to the second position along the first direction D1. Further, a lifting induction piece 315 is provided on the sliding seat 314, and the lifting induction piece 315 can move along the first direction D1 with the sliding seat 314. A first position detector 316 and a second position detector 317 are provided at intervals on the lifting fixing plate 311. When the lifting and rotating module 30 is in the first position, the sliding seat 314 is in the first position, and the lifting induction piece 315 on the sliding seat 314 corresponds to and triggers the detection of the first position detector 316. The first position detector 316 outputs a corresponding detection signal to the controller so that the controller can perform subsequent control or prompt the user that the position of the rotating mechanism 32 is the first position at this time. When the sliding seat 314 and the rotating mechanism 32 of the lifting and rotating module 30 move from the first position to the second position along the first direction D1, the lifting induction piece 315 on the sliding seat 314 corresponds to and triggers the detection of the second position detector 317. The second position detector 317 outputs a corresponding detection signal to the controller so that the controller can perform subsequent control or prompt the user that the position of the rotating mechanism 32 is the second position at this time.

[0097] Second, the lifting and rotating module 30 moves to the third position along the reverse direction of the first direction D1.

[0098] Among them, the movement of the lifting and rotating module 30 to the third position along the reverse direction of the first direction D1 includes but is not limited to referring to the third position of the sliding seat 314 or the rotating mechanism 32. The movement of the lifting and rotating module 30 to the third position along the reverse direction of the first direction D1 includes but is not limited to referring to the movement of the sliding seat 314 or the rotating mechanism 32 to the third position along the reverse direction of the first direction D1.

[0099] It should be noted that when the lifting and rotating module 30 moves to the third position in the opposite direction of the first direction D1, the distance between the wafer on the lifting and rotating module 30 and the carrier plate 20 is 4 mm - 6 mm. Optionally, when the lifting and rotating module 30 moves to the third position in the opposite direction of the first direction D1, the distance between the wafer on the lifting and rotating module 30 and the carrier plate 20 can be 4.1 mm, or 4.2 mm, or 4.5 mm, or 4.8 mm, or 5.0 mm, or 5.3 mm, or 5.4 mm, or 5.7 mm, or 5.9 mm, or 6 mm, or other values within 4 mm - 6 mm.

[0100] The rotating mechanism 32 moves to the third position in the opposite direction of the first direction D1 to drive the wafer carried on the rotating mechanism 32 to move in the opposite direction of the first direction D1, so as to shorten the distance between the wafer and the carrier plate 20, facilitating the subsequent lifting and adsorption of the wafer by the flattening mechanism.

[0101] It should be noted that in this embodiment, the first direction D1 is the vertically upward direction, and the opposite direction of the first direction D1 is the vertically downward direction. The present application does not limit this.

[0102] Third, the flattening module 40 moves to the first flattening position along the first direction D1, and the flattening module 40 is used to adsorb the wafer on the lifting and rotating module 30. Specifically, that is, the flattening module 40 rises along the first direction D1 and abuts against the wafer, so that the flattening module 40 can adsorb the wafer. As Figure 8 and Figure 9 shown, Figure 8 is a schematic structure of the lifting and rotating module in the third position and the flattening module in the first flattening position provided by the embodiment of the present application Figure 1 , Figure 9 is a schematic structure of the lifting and rotating module in the third position and the flattening module in the first flattening position provided by the embodiment of the present application Figure 2 .

[0103] Fourth, the flattening module 40 moves from the first flattening position in the opposite direction of the first direction D1 to the second flattening position, which is used to flatten the wafer on the carrier plate 20.

[0104] Specifically, the flattening module 40 moves in the opposite direction of the first direction D1 to the second flattening position to place the wafer on the carrier plate 20. At this time, the flattening module 40 adsorbs the periphery of the wafer, and then flattens the wafer relative to the carrier plate 20 to achieve flattening the wafer on the carrier plate 20. It should be noted that flattening the wafer on the carrier plate 20, in other words, means flattening the wafer relative to the carrier plate 20. In other words, it means making the wafer as parallel as possible to the carrier plate 20 to improve the flatness of the wafer surface, and then facilitating the subsequent code scanning device 300 to scan the pattern on the wafer to identify features such as the type and size of the wafer.

[0105] Fifth, after the alignment mechanism of the alignment module 50 (including the first alignment mechanism 51, the second alignment mechanism 52, the third alignment mechanism 53, and the fourth alignment mechanism 54) moves to the first alignment position along the side where the lifting and rotating module 30 is located, the flattening module 40 releases the wafer, and then the alignment mechanism of the alignment module 50 moves to the second alignment position for aligning the wafer.

[0106] After the alignment mechanism of the alignment module 50 moves to the first alignment position along the side where the lifting and rotating module 30 is located, the flattening module 40 releases the wafer. Some structures of the alignment mechanism can be used to prevent large - scale warping of the periphery of the wafer. The specific anti - warping structure will be described in detail later, and this application does not limit it.

[0107] It should be noted that, in this embodiment, the setting mechanism of the setting module 50 moves along the side close to the lifting and rotating module 30 to the first setting position. In other words, the first setting mechanism 51, the second setting mechanism 52, the third setting mechanism 53, and the fourth setting mechanism 54 of the setting module 50 all move along the side close to the center of the carrier plate 20, and move to a position where the distance between the first setting mechanism 51, the second setting mechanism 52, the third setting mechanism 53, the fourth setting mechanism 54 and the wafer is between 3 mm and 5 mm. In other words, the first setting position is the position where the distance between the first setting mechanism 51, the second setting mechanism 52, the third setting mechanism 53, the fourth setting mechanism 54 and the wafer is between 3 mm and 5 mm. Optionally, the first setting position may be a position where the distance between the first setting mechanism 51, the second setting mechanism 52, the third setting mechanism 53, the fourth setting mechanism 54 and the wafer is 3 mm, or 3.1 mm, or 3.3 mm, or 3.5 mm, or 3.8 mm, or 4.0 mm, or 4.2 mm, or 4.4 mm, or 4.6 mm, or 4.7 mm, or 4.9 mm, or other values within 3 mm - 5 mm.

[0108] After the wafer is released by the flattening module 40, the setting mechanism of the setting module 50 moves to the second setting position to set the wafer, which can prevent the flattening module 40 from adsorbing the wafer and hindering the setting of the wafer when the setting mechanism sets the wafer.

[0109] It should be noted that, in this embodiment, the setting mechanism of the setting module 50 moves along the side close to the lifting and rotating module 30 to the second setting position. In other words, the first setting mechanism 51, the second setting mechanism 52, the third setting mechanism 53, and the fourth setting mechanism 54 of the setting module 50 all move along the side close to the center of the carrier plate 20, and move until the first setting mechanism 51, the second setting mechanism 52, the third setting mechanism 53, and the fourth setting mechanism 54 abut against the wafer. The first setting mechanism 51, the second setting mechanism 52, the third setting mechanism 53, and the fourth setting mechanism 54 are respectively arranged around the wafer and abut against the wafer to limit the wafer within the setting space formed by the first setting mechanism 51, the second setting mechanism 52, the third setting mechanism 53, and the fourth setting mechanism 54, so as to realize the setting of the wafer.

[0110] Please refer to Figures 2 to 9, in one embodiment, the tuning module 50 further includes a tuning driving mechanism 60. The tuning driving mechanism 60 is configured to drive the first tuning mechanism 51, the second tuning mechanism 52, the third tuning mechanism 53, and the fourth tuning mechanism 54 to move along the side close to the center of the carrier plate 20. Optionally, the specific structure of the tuning driving mechanism 60 will be described in detail later, and the present application does not limit this.

[0111] Specifically, the tuning driving mechanism 60 is connected to the first tuning mechanism 51 and is configured to drive the first tuning mechanism 51 to move along the second direction D2 (as shown in the second direction D2 Figure 4 shown) and its reverse direction. Wherein, the first tuning mechanism 51 moving along the second direction D2 is moving along the side close to the center of the carrier plate 20, and the first tuning mechanism 51 moving along the reverse direction of the second direction D2 is moving along the side away from the center of the carrier plate 20.

[0112] The tuning driving mechanism 60 is connected to the second tuning mechanism 52 and is configured to drive the second tuning mechanism 52 to move along the third direction D3 (as shown in the third direction D3 Figure 4 shown) and its reverse direction. Wherein, the second tuning mechanism 52 moving along the third direction D3 is moving along the side close to the center of the carrier plate 20, and the second tuning mechanism 52 moving along the reverse direction of the third direction D3 is moving along the side away from the center of the carrier plate 20.

[0113] The tuning driving mechanism 60 is connected to the third tuning mechanism 53 and is configured to drive the third tuning mechanism 53 to move along the second direction D2 and its reverse direction. Wherein, the third tuning mechanism 53 moving along the reverse direction of the second direction D2 is moving along the side close to the center of the carrier plate 20, and the third tuning mechanism 53 moving along the second direction D2 is moving along the side away from the center of the carrier plate 20.

[0114] The tuning driving mechanism 60 is connected to the fourth tuning mechanism 54 and is configured to drive the fourth tuning mechanism 54 to move along the third direction D3 and its reverse direction. Wherein, the fourth tuning mechanism 54 moving along the reverse direction of the third direction D3 is moving along the side close to the center of the carrier plate 20, and the fourth tuning mechanism 54 moving along the third direction D3 is moving along the side away from the center of the carrier plate 20.

[0115] It should be further noted that, in this embodiment, the second direction D2 and the third direction D3 are perpendicular, and both the second direction D2 and the third direction D3 are perpendicular to the first direction D1.

[0116] Further, in one embodiment, the tuning module 50 further includes a fifth tuning mechanism 55 and a sixth tuning mechanism 56. The first tuning mechanism 51 and the fifth tuning mechanism 55 are spaced apart along the third direction D3. The third tuning mechanism 53 and the sixth tuning mechanism 56 are spaced apart along the third direction D3.

[0117] It should be noted that the moving directions of the fifth tuning mechanism 55 and the first tuning mechanism 51 are the same. In other words, when the first tuning mechanism 51 moves along the side (the second direction D2) towards the center of the carrier plate 20 to tune the wafer, the fifth tuning mechanism 55 also moves along the side (the second direction D2) towards the center of the carrier plate 20 to tune the wafer. The first tuning mechanism 51 and the fifth tuning mechanism 55 can be used to tune the relative two ends of one side of the wafer, which can further prevent phenomena such as tilting of one side of the wafer, so as to improve the accuracy and stability of the tuning of the wafer by the tuning module 50.

[0118] The moving directions of the third tuning mechanism 53 and the sixth tuning mechanism 56 are the same. In other words, when the third tuning mechanism 53 moves along the side (the opposite direction of the second direction D2) towards the center of the carrier plate 20 to tune the wafer, the sixth tuning mechanism 56 also moves along the side (the opposite direction of the second direction D2) towards the center of the carrier plate 20 to tune the wafer. The third tuning mechanism 53 and the sixth tuning mechanism 56 can be used to tune the relative two ends of the other side of the wafer, which can further prevent phenomena such as tilting of the other side of the wafer, so as to improve the accuracy and stability of the tuning of the wafer by the tuning module 50.

[0119] Please refer to Figures 10 to 12 , Figure 10 which is a schematic structural diagram of a tuning drive mechanism and a guide rail assembly provided by an embodiment of the present application, Figure 11 which is a partial structural schematic diagram of a tuning module provided by an embodiment of the present application Figure 1 , Figure 12 which is a partial structural schematic diagram of a tuning module provided by an embodiment of the present application Figure 2 。

[0120] The tuning module 50 further includes a guide rail assembly. The guide rail assembly includes a first guide rail 71, a second guide rail 72, and a third guide rail 73. The first guide rail 71 and the third guide rail 73 extend along the second direction D2 and are spaced apart along the third direction D3. The second guide rail 72 extends along the third direction D3. Further, as shown in the figure, the first guide rail 71, the second guide rail 72, and the third guide rail 73 are arranged in a clockwise order.

[0121] Among them, the first setting mechanism 51 and the third setting mechanism 53 are slidably connected to the first guide rail 71, and the first setting mechanism 51 and the third setting mechanism 53 are respectively slidably connected to both ends of the first guide rail 71. The first setting mechanism 51 and the third setting mechanism 53 are configured to move along the first guide rail 71 towards the second direction D2 and its opposite direction.

[0122] The fifth setting mechanism 55 and the sixth setting mechanism 56 are slidably connected to the third guide rail 73, and the fifth setting mechanism 55 and the sixth setting mechanism 56 are respectively slidably connected to both ends of the third guide rail 73. The fifth setting mechanism 55 and the sixth setting mechanism 56 are configured to move along the second guide rail 72 towards the second direction D2 and its opposite direction.

[0123] The second setting mechanism 52 and the fourth setting mechanism 54 are slidably connected to the second guide rail 72, and the second setting mechanism 52 and the fourth setting mechanism 54 are respectively slidably connected to both ends of the second guide rail 72. The second setting mechanism 52 and the fourth setting mechanism 54 are configured to move along the second guide rail 72 towards the third direction D3 and its opposite direction.

[0124] In an embodiment, the setting driving mechanism 60 includes a setting driving motor 61 and a conveyor belt assembly 62. The setting driving motor 61 is connected to the conveyor belt assembly 62 and is configured to drive the conveyor belt assembly 62 to move. In this embodiment, the setting driving motor 61 is a rotating motor, and an output shaft of the setting driving motor 61 is connected to the conveyor belt assembly 62 to drive the conveyor belt assembly 62 to convey.

[0125] The conveyor belt assembly 62 includes an outer conveyor belt 621 and an inner conveyor belt 622. The outer conveyor belt 621 and the inner conveyor belt 622 are connected, and the conveying directions of the outer conveyor belt 621 and the inner conveyor belt 622 are opposite. Further, in this embodiment, the inner conveyor belt 622 and the conveyor belt are perpendicular to the bottom plate 10, facilitating the output shaft of the setting driving motor 61 to be inserted between the outer conveyor belt 621 and the inner conveyor belt 622 and respectively connected to the outer conveyor belt 621 and the inner conveyor belt 622 to drive the conveyor belt and the outer conveyor belt 621 to move in opposite directions.

[0126] In this embodiment, the outer conveyor belt 621 and the inner conveyor belt 622 are in a "concave" shape. Specifically, the outer conveyor belt 621 includes a first conveying portion 6211, a second conveying portion 6212, and a third conveying portion 6213 that are connected in sequence, as Figure 10As shown, in this embodiment, the first conveying part 6211, the second conveying part 6212, and the third conveying part 6213 are connected in sequence in the clockwise direction. The inner conveyor belt 622 includes a fourth conveying part 6221, a fifth conveying part 6222, and a sixth conveying part 6223 that are connected in sequence, as Figure 10 As shown, in this embodiment, the fourth conveying part 6221, the fifth conveying part 6222, and the sixth conveying part 6223 are connected in sequence in the clockwise direction.

[0127] Further, in this embodiment, the first conveying part 6211, the third conveying part 6213, the fourth conveying part 6221, and the sixth conveying part 6223 extend along the second direction D2, and the second conveying part 6212 and the fifth conveying part 6222 extend along the third direction D3, so that the first conveying part 6211, the second conveying part 6212, the third conveying part 6213, the fourth conveying part 6221, the fifth conveying part 6222, and the sixth conveying part 6223 form an inverted "concave" shape, as Figure 10 shown.

[0128] Further, in this embodiment, the first conveying part 6211 and the fourth conveying part 6221 are correspondingly arranged and move in opposite directions, the second conveying part 6212 and the fifth conveying part 6222 are correspondingly arranged and move in opposite directions, and the third conveying part 6213 and the sixth conveying part 6223 are correspondingly arranged and move in opposite directions.

[0129] Further, in this embodiment, the first rectifying mechanism 51 is connected to the first conveying part 6211, the third rectifying mechanism 53 is connected to the fourth conveying part 6221, and the first rectifying mechanism 51 and the third rectifying mechanism 53 move in opposite directions. The second rectifying mechanism 52 is connected to the second conveying part 6212, the fourth rectifying mechanism 54 is connected to the fifth conveying part 6222, and the second rectifying mechanism 52 and the fourth rectifying mechanism 54 move in opposite directions; the fifth rectifying mechanism 55 is connected to the third conveying part 6213, the sixth rectifying mechanism 56 is connected to the sixth conveying part 6223, and the fifth rectifying mechanism 55 and the sixth rectifying mechanism 56 move in opposite directions.

[0130] It should be noted that, in this embodiment, the outer conveyor belt 621 is on the side away from the center of the carrier plate 20 relative to the inner conveyor belt 622, and the guide rail assembly is on the side close to the center of the carrier plate 20 relative to the inner conveyor belt 622. In other words, the first conveying part 6211, the fourth conveying part 6221, and the first guide rail 71 are arranged in sequence along the direction of the side close to the center of the carrier plate 20, the second conveying part 6212, the fifth conveying part 6222, and the second guide rail 72 are arranged in sequence along the direction of the side close to the center of the carrier plate 20, and the third conveying part 6213, the sixth conveying part 6223, and the third guide rail 73 are arranged in sequence along the direction of the side close to the center of the carrier plate 20.

[0131] Further, in this embodiment, the conveyor belt assembly 62 further includes a first conveyor wheel 623, a second conveyor wheel 624, a third conveyor wheel 625, a fourth conveyor wheel 626, a first tensioning wheel 627, and a second tensioning wheel 628. The first conveyor wheel 623 is connected to the output shaft of the setting drive motor 61. The first conveyor wheel 623, the second conveyor wheel 624, the third conveyor wheel 625, and the fourth conveyor wheel 626 are respectively arranged at the four ends of the carrier plate 20. The second conveyor wheel 624 is respectively connected to the second conveying part 6212 and the third conveying part 6213. The third conveyor wheel 625 is respectively connected to the first conveying part 6211 and the second conveying part 6212. The fourth conveyor wheel 626 is arranged between the first conveying part 6211 and the fourth conveying part 6221. The second tensioning wheel 628 is respectively connected to the fourth conveying part 6221 and the fifth conveying part 6222. The first tensioning wheel 627 is respectively connected to the fifth conveying part 6222 and the sixth conveying part 6223.

[0132] Further, in this embodiment, the conveyor belt assembly 62 further includes a tensioning block 629. The fourth conveyor wheel 626 is arranged on the tensioning block 629. The tensioning block 629 is connected to the carrier plate 20 through a waist-shaped groove. The tensioning block 629 can be finely adjusted along the second direction D2 or the reverse direction of the second direction D2 to tension the outer conveyor belt 621 and the inner conveyor belt 622 of the conveyor belt assembly 62.

[0133] Please refer to Figures 10 to 16 , Figure 13 which is a schematic structural diagram of a setting module in an initial position provided by an embodiment of the present application, Figure 14 which is a schematic structural diagram of a setting module in a retracted state provided by an embodiment of the present application, Figure 15 which is a schematic structural diagram of a setting module in a final setting position provided by an embodiment of the present application, Figure 16It is a schematic structural diagram of a setting module in an open state provided by an embodiment of the present application.

[0134] In one embodiment, the setting module includes an initial position and a final setting position, and the setting module 50 includes a retracted state and an open state. Specifically, when the setting module 50 is in the retracted state, the first setting mechanism 51, the second setting mechanism 52, the third setting mechanism 53, the fourth setting mechanism 54, the fifth setting mechanism 55, and the sixth setting mechanism 56 of the setting module 50 all move along the side close to the center of the carrier plate 20; when the setting module 50 is in the open state, the first setting mechanism 51, the second setting mechanism 52, the third setting mechanism 53, the fourth setting mechanism 54, the fifth setting mechanism 55, and the sixth setting mechanism 56 of the setting module 50 all move along the side away from the center of the carrier plate 20.

[0135] Further, please refer to Figure 10 and Figure 14 , when the setting module 50 is in the retracted state, the setting drive motor 61 rotates clockwise, in other words, the output shaft of the setting drive motor 61 rotates clockwise. The inner conveyor belt 622 moves counterclockwise, and the outer conveyor belt 621 moves clockwise. The first conveying part 6211 drives the first setting mechanism 51 to move along the second direction D2, the second conveying part 6212 drives the second setting mechanism 52 to move in the opposite direction of the third direction D3, the third conveying part 6213 drives the sixth setting mechanism 56 to move in the opposite direction of the second direction D2, the fourth conveying part 6221 drives the third setting mechanism 53 to move in the opposite direction of the second direction D2, the fifth conveying part 6222 drives the fourth setting mechanism 54 to move along the third direction D3, and the sixth conveying part 6223 drives the fifth setting mechanism 55 to move along the second direction D2.

[0136] Please refer to Figure 10 and Figure 16When the setting module 50 is in the open state, the setting drive motor 61 rotates counterclockwise. In other words, the output shaft of the setting drive motor 61 rotates counterclockwise. The inner conveyor belt 622 moves clockwise, and the outer conveyor belt 621 moves counterclockwise. The first conveying part 6211 drives the first setting mechanism 51 to move in the opposite direction of the second direction D2, the second conveying part 6212 drives the second setting mechanism 52 to move in the third direction D3, the third conveying part 6213 drives the sixth setting mechanism 56 to move in the second direction D2, the fourth conveying part 6221 drives the third setting mechanism 53 to move in the second direction D2, the fifth conveying part 6222 drives the fourth setting mechanism 54 to move in the opposite direction of the third direction D3, and the sixth conveying part 6223 drives the fifth setting mechanism 55 to move in the opposite direction of the second direction D2.

[0137] It should be noted that in this embodiment, when the setting module 50 is in the retracted state, the setting drive mechanism 60 can drive the first setting mechanism 51, the second setting mechanism 52, the third setting mechanism 53, the fourth setting mechanism 54, the fifth setting mechanism 55, and the sixth setting mechanism 56 to move synchronously along the side closer to the center of the carrier plate 20; when the setting module 50 is in the open state, the setting drive mechanism 60 can drive the first setting mechanism 51, the second setting mechanism 52, the third setting mechanism 53, the fourth setting mechanism 54, the fifth setting mechanism 55, and the sixth setting mechanism 56 to move synchronously along the side away from the center of the carrier plate 20.

[0138] It should be noted that for the convenience of description, please refer to Figures 1 to 17 , Figure 17 is a schematic structural diagram of a square wafer provided by an embodiment of the present application. When the wafer is square, the four sides of the wafer are respectively named the first side 91, the second side 92, the third side 93, and the fourth side 94 of the wafer, and the first side 91, the second side 92, the third side 93, and the fourth side 94 are arranged in a clockwise direction in sequence. The first setting mechanism 51 and the fifth setting mechanism 55 are used to abut against the first side 91 of the wafer, the second setting mechanism 52 is used to abut against the second side 92 of the wafer, the third setting mechanism 53 and the sixth setting mechanism 56 are used to abut against the third side 93 of the wafer, and the fourth setting mechanism 54 is used to abut against the fourth side 94 of the wafer.

[0139] Please refer to Figure 11 and Figure 12 , Figure 18 and Figure 19 , Figure 18This is a schematic diagram of a partial structure of a tuning module provided by an embodiment of the present application Figure 3 , Figure 19 This is a schematic diagram of a partial structure of a tuning module provided by an embodiment of the present application Figure 4 .

[0140] In one embodiment, the first tuning mechanism 51 includes a first connecting member 511, a first pressing plate 512, a first adjusting block 513, a second adjusting block 514, a first guide rod 515 and a second guide rod 516. The first connecting member 511 is connected to the first guide rail 71. The first pressing plate 512 is respectively connected to the first connecting member 511 and the first conveying portion 6211. The first adjusting block 513 and the second adjusting block 514 are provided on the first connecting member 511, and the first adjusting block 513 and the second adjusting block 514 are arranged in sequence along the third direction D3. The first guide rod 515 is provided on the first adjusting block 513, and the second guide rod 516 is provided on the second adjusting block 514. The first guide rod 515 and the second guide rod 516 are used to abut against and limit the wafer

[0141] Specifically, in this embodiment, the first connecting member 511 is provided on the first guide rail 71 and extends in the opposite direction of the second direction D2. The first pressing plate 512 extends in the opposite direction of the third direction D3 and is connected to the first conveying portion 6211. The first conveying portion 6211 drives the first connecting member 511 to move along the second direction D2 or the opposite direction of the second direction D2 through the first pressing plate 512

[0142] The first adjusting block 513 and the second adjusting block 514 are provided on the first connecting member 511. The first adjusting block 513 and the second adjusting block 514 are provided with first waist-shaped holes. The first adjusting block 513 and the second adjusting block 514 are fixedly connected to the first connecting member 511 through the first waist-shaped holes. The first waist-shaped holes extend along the second direction D2. The first adjusting block 513 and the second adjusting block 514 can be finely adjusted relative to the first connecting member 511 along the second direction D2 and its opposite direction through the first waist-shaped holes, so that the first guide rod 515 on the first adjusting block 513 and the second guide rod 516 on the second adjusting block 514 can effectively abut against and tune the first side 91 of the wafer

[0143] The first guide rod 515 and the second guide rod 516 are used to abut against and limit the first side 91 of the wafer. Please refer to Figure 20 , Figure 20It is a schematic structural diagram of a first guide rod provided by an embodiment of the present application. Further, in one embodiment, the first guide rod 515 includes a main body portion 5151, an arc transition portion 5152, and an extension portion 5153. The radial dimension of the extension portion 5153 is greater than that of the main body portion 5151, and the radial dimension of the arc transition portion 5152 gradually increases from the main body portion 5151 to the extension portion 5153.

[0144] The radial dimension of the extension portion 5153 is greater than that of the main body portion 5151. The extension portion 5153 can be used to limit a large warping of the first side 91 of the wafer, so as to achieve the leveling of the square wafer. And, the radial dimension of the arc transition portion 5152 gradually increases from the main body portion 5151 to the extension portion 5153. The arc transition portion 5152 can be used to buffer the warping of the first side 91 of the wafer, avoiding problems such as direct impact and damage to the extension portion 5153 when the edge of the wafer warps, and improving the safety and reliability of the leveling module 50 in leveling the wafer.

[0145] It should be noted that, in this embodiment, the shape of the second guide rod 516 is similar to that of the first guide rod 515, which will not be elaborated herein in the present application and should not be construed as a limitation to the present application.

[0146] Please refer to Figure 11 and Figure 12 、 Figure 18 and Figure 19 , in one embodiment, the second leveling mechanism 52 includes a second connecting member 521, a second pressing plate 522, a third adjusting block 523, a third guide rod 524, and a fourth guide rod 525. The second connecting member 521 is connected to the second guide rail 72. The second pressing plate 522 is respectively connected to the second connecting member 521 and the second conveying portion 6212. The third adjusting block 523 is disposed on the second connecting member 521. The third guide rod 524 and the fourth guide rod 525 are disposed on the third adjusting block 523 at intervals along the second direction D2. The third guide rod 524 and the fourth guide rod 525 are used to abut against and limit the second side 92 of the wafer.

[0147] The second connecting member 521 is provided on the second guide rail 72. Specifically, in the present embodiment, the second pressing plate 522 includes a bent portion that crosses the fourth conveying portion 6221 and is connected to the second conveying portion 6212, so that the second conveying portion 6212 drives the second connecting member 521 to move along the third direction D3 or the opposite direction of the third direction D3 through the second pressing plate 522. Further, the second connecting member 521 includes a first connecting portion and a second connecting portion that are vertically connected. The first connecting portion is connected to the second guide rail 72 and extends in the opposite direction of the second direction D2, and the second connecting portion extends in the opposite direction of the third direction D3. A third adjusting block 523 is provided at one end of the second connecting portion away from the first connecting portion. The third guide rod 524 and the fourth guide rod 525 are provided on the third adjusting block 523 and are used to abut against the second side 92 of the wafer.

[0148] The third adjusting block 523 is provided on the second connecting member 521, and the third adjusting block 523 is provided with a second waist-shaped hole. The third adjusting block 523 is fixedly connected to the second connecting member 521 through the second waist-shaped hole. The second waist-shaped hole extends along the third direction D3, and the third adjusting block 523 can be finely adjusted relative to the second connecting member 521 along the third direction D3 and its opposite direction through the second waist-shaped hole, so that the third guide rod 524 and the fourth guide rod 525 on the third adjusting block 523 can effectively abut against and align the second side 92 of the wafer.

[0149] The third guide rod 524 and the fourth guide rod 525 can be used to abut against the second side 92 of the wafer, and the third guide rod 524 and the fourth guide rod 525 can be used to limit the second side 92 of the wafer from warping greatly. It should be noted that the shapes of the third guide rod 524 and the fourth guide rod 525 are similar to the shape of the first guide rod 515 described above, which will not be elaborated herein in the present application and should not be construed as a limitation to the present application.

[0150] In one embodiment, the third setting mechanism 53 includes a third connecting member 531, a third pressing plate 532, a fourth adjusting block 533, the fifth adjusting block 534, a fifth guide rod 535 and a sixth guide rod 536. The third connecting member 531 is connected to the first guide rail 71. The third pressing plate 532 is respectively connected to the third connecting member 531 and the fourth conveying portion 6221. The fourth adjusting block 533 and the fifth adjusting block 534 are arranged on the third pressing plate 532 along the third direction D3. The fifth guide rod 535 is arranged on the fourth adjusting block 533, and the sixth guide rod 536 is arranged on the fifth adjusting block 534. The fifth guide rod 535 and the sixth guide rod 536 are used to abut against and limit the third side 93 of the wafer.

[0151] Specifically, in this embodiment, the third pressing plate 532 extends along the second direction D2. The fourth conveying portion 6221 drives the third connecting member 531 to move along the second direction D2 or the reverse direction of the second direction D2 on the first guide rail 71 through the third pressing plate 532.

[0152] The fourth adjusting block 533 and the fifth adjusting block 534 are arranged on the third pressing plate 532 along the third direction D3. The fourth adjusting block 533 and the fifth adjusting block 534 are provided with third waist-shaped holes. The fourth adjusting block 533 and the fifth adjusting block 534 are fixedly connected to the third pressing plate 532 through the third waist-shaped holes. The third waist-shaped holes extend along the second direction D2. The fourth adjusting block 533 and the fifth adjusting block 534 can be finely adjusted and moved relative to the third pressing plate 532 along the second direction D2 and its reverse direction through the third waist-shaped holes, so that the fifth guide rod 535 on the fourth adjusting block 533 and the sixth guide rod 536 on the fifth adjusting block 534 can effectively abut against and set the third side 93 of the wafer.

[0153] The fifth guide rod 535 and the sixth guide rod 536 can be used to abut against the third side 93 of the wafer, and the fifth guide rod 535 and the sixth guide rod 536 can be used to limit the third side 93 of the wafer from warping greatly. It should be noted that the shapes of the fifth guide rod 535 and the sixth guide rod 536 are similar to the shape of the first guide rod 515 described above, and will not be elaborated herein in this application, and should not be construed as a limitation to this application.

[0154] In one embodiment, the fourth setting mechanism 54 includes a fourth connecting member 541, a fourth pressing plate 542, a sixth adjusting block 543, a seventh guide rod 544, and an eighth guide rod 545. The fourth connecting member 541 is connected to the second guide rail 72. The fourth pressing plate 542 is respectively connected to the fourth connecting member 541 and the fifth conveying portion 6222. The sixth adjusting block 543 is disposed on the fourth connecting member 541. The seventh guide rod 544 and the eighth guide rod 545 are disposed on the sixth adjusting block 543 at intervals along the second direction D2. The seventh guide rod 544 and the eighth guide rod 545 are configured to abut against and limit the fourth side 94 of the wafer.

[0155] The fourth connecting member 541 is disposed on the second guide rail 72. Specifically, in this embodiment, the fifth conveying portion 6222 drives the fourth connecting member 541 to move along the third direction D3 or the opposite direction of the third direction D3 through the fourth pressing plate 542. Further, the fourth connecting member 541 includes a third connecting portion and a fourth connecting portion that are vertically connected. The third connecting portion is connected to the second guide rail 72 and extends in the opposite direction of the second direction D2. The fourth connecting portion extends along the third direction D3. The sixth adjusting block 543 is disposed at one end of the fourth connecting portion away from the third connecting portion. The seventh guide rod 544 and the eighth guide rod 545 are disposed on the sixth adjusting block 543 and are configured to abut against the fourth side 94 of the wafer.

[0156] The sixth adjusting block 543 is disposed on the fourth connecting member 541, and the sixth adjusting block 543 is provided with a fourth waist-shaped hole. The sixth adjusting block 543 is fixedly connected to the fourth connecting member 541 through the fourth waist-shaped hole. The fourth waist-shaped hole extends along the third direction D3. The sixth adjusting block 543 can be finely adjusted relative to the fourth connecting member 541 along the third direction D3 and its opposite direction through the fourth waist-shaped hole, so that the seventh guide rod 544 and the eighth guide rod 545 on the sixth adjusting block 543 can effectively abut against and set the fourth side 94 of the wafer.

[0157] The seventh guide rod 544 and the eighth guide rod 545 can be used to abut against the fourth side 94 of the wafer, and the seventh guide rod 544 and the eighth guide rod 545 can be used to limit the fourth side 94 of the wafer from warping greatly. It should be noted that the shapes of the seventh guide rod 544 and the eighth guide rod 545 are similar to the shape of the first guide rod 515 described above, and details are not repeated herein in this application and should not be construed as a limitation to this application.

[0158] In one embodiment, the fifth setting mechanism 55 includes a fifth connecting member 551, a fifth pressing plate 552, a seventh adjusting block 553, an eighth adjusting block 554, a ninth guide rod 555 and a tenth guide rod 556. The fifth connecting member 551 is connected to the third guide rail 73. The fifth pressing plate 552 is connected to the fifth connecting member 551 and the sixth conveying part 6223 respectively. The seventh adjusting block 553 and the eighth adjusting block 554 are arranged on the fifth connecting member 551, and the seventh adjusting block 553 and the eighth adjusting block 554 are arranged in sequence along the third direction D3. The ninth guide rod 555 is arranged on the seventh adjusting block 553, and the tenth guide rod 556 is arranged on the eighth adjusting block 554. The ninth guide rod 555 and the tenth guide rod 556 are used to abut against and limit the first side 91 of the wafer.

[0159] Specifically, in this embodiment, the fifth connecting member 551 is arranged on the third guide rail 73 and extends in the opposite direction of the second direction D2. The sixth conveying part 6223 drives the fifth connecting member 551 to move along the second direction D2 or the opposite direction of the second direction D2 through the fifth pressing plate 552.

[0160] The seventh adjusting block 553 and the eighth adjusting block 554 are arranged on the fifth connecting member 551. The seventh adjusting block 553 and the eighth adjusting block 554 are provided with fifth waist-shaped holes. The seventh adjusting block 553 and the eighth adjusting block 554 are fixedly connected to the fifth connecting member 551 through the fifth waist-shaped holes. The fifth waist-shaped holes extend along the second direction D2. The seventh adjusting block 553 and the eighth adjusting block 554 can be finely adjusted relative to the fifth connecting member 551 along the second direction D2 and its opposite direction through the fifth waist-shaped holes, so that the ninth guide rod 555 on the seventh adjusting block 553 and the tenth guide rod 556 on the eighth adjusting block 554 can effectively abut against and set the first side 91 of the wafer.

[0161] The ninth guide rod 555 and the tenth guide rod 556 can be used to abut against the first side 91 of the wafer, and the ninth guide rod 555 and the tenth guide rod 556 can be used to limit the first side 91 of the wafer from warping greatly. It should be noted that the shapes of the ninth guide rod 555 and the tenth guide rod 556 are similar to the shape of the first guide rod 515 described above, and will not be elaborated herein in this application, and should not be construed as a limitation to this application.

[0162] In one embodiment, the sixth setting mechanism 56 includes a sixth connecting member 561, a sixth pressing plate 562, a ninth adjusting block 563, the tenth adjusting block 564, an eleventh guide rod 565 and a twelfth guide rod 566. The sixth connecting member 561 is connected to the third guide rail 73. The sixth pressing plate 562 is respectively connected to the sixth connecting member 561 and the third conveying portion 6213. The ninth adjusting block 563 and the tenth adjusting block 564 are arranged on the sixth pressing plate 562 along the third direction D3. The eleventh guide rod 565 is arranged on the ninth adjusting block 563, and the twelfth guide rod 566 is arranged on the tenth adjusting block 564. The eleventh guide rod 565 and the twelfth guide rod 566 are used to abut against and limit the fourth side 94 of the wafer.

[0163] Specifically, in this embodiment, the sixth pressing plate 562 includes a first extension plate and a second extension plate that are perpendicular to each other. The first extension plate extends along the second direction D2, and the second extension plate extends along the third direction D3 and crosses the sixth conveying portion 6223 and then connects to the third conveying portion 6213. The third conveying portion 6213 drives the sixth connecting member 561 to move along the second direction D2 or the reverse direction of the second direction D2 on the third guide rail 73 through the sixth pressing plate 562.

[0164] The ninth adjusting block 563 and the tenth adjusting block 564 are arranged on the first extension plate of the sixth pressing plate 562 along the third direction D3. The ninth adjusting block 563 and the tenth adjusting block 564 are provided with sixth waist-shaped holes. The ninth adjusting block 563 and the tenth adjusting block 564 are fixedly connected to the sixth pressing plate 562 through the sixth waist-shaped holes. The sixth waist-shaped holes extend along the third direction D3. The ninth adjusting block 563 and the tenth adjusting block 564 can be finely adjusted relative to the sixth pressing plate 562 along the second direction D2 and its reverse direction through the sixth waist-shaped holes, so that the eleventh guide rod 565 on the ninth adjusting block 563 and the twelfth guide rod 566 on the tenth adjusting block 564 can effectively abut against and set the fourth side 94 of the wafer.

[0165] The eleventh guide rod 565 and the twelfth guide rod 566 can be used to abut against the fourth side 94 of the wafer, and the eleventh guide rod 565 and the twelfth guide rod 566 can be used to limit the fourth side 94 of the wafer from warping greatly. It should be noted that the shapes of the eleventh guide rod 565 and the twelfth guide rod 566 are similar to the shape of the first guide rod 515 described above, and will not be elaborated herein in this application, and should not be construed as a limitation to this application.

[0166] Further, please refer toFigure 21 , Figure 21 is Figure 18 An enlarged schematic view of area A in [the figure]. In this embodiment, a sensor assembly is further provided on the carrier plate 20, and the sensor assembly can be used to detect the specific positions of the setting mechanisms (including the first setting mechanism 51, the second setting mechanism 52, the third setting mechanism 53, the fourth setting mechanism 54, the fifth setting mechanism 55, and the sixth setting mechanism 56) of the setting module 50.

[0167] Specifically, the sensor assembly includes an installation slide rail 81, a first sensor 82, and a second sensor 83, and the first sensor 82 and the second sensor 83 are arranged on the installation slide rail 81. In this embodiment, the sensor assembly is arranged corresponding to the sixth setting mechanism 56, that is, a setting induction piece 567 is provided on the sixth setting mechanism 56, and the setting induction piece 567 can move along the second direction D2 or the opposite direction of the second direction D2 with the sixth setting mechanism 56. Specifically, in this embodiment, when the setting induction piece 567 is arranged corresponding to the first sensor 82, at this time the setting module 50 is in the initial position, in other words, the setting mechanisms of the setting module 50 have not moved. When the setting induction piece 567 is arranged corresponding to the second sensor 83, at this time the setting module 50 is in the final setting position, in other words, the setting mechanisms of the setting module 50 move to the position where they cannot move along the side where the lifting and rotating module 30 is located.

[0168] In other embodiments, the sensor assembly may further include a third sensor and a fourth sensor, and the third sensor and the fourth sensor are arranged between the first sensor 82 and the second sensor 83. When the setting induction piece 567 is arranged corresponding to the third sensor, it represents that the setting mechanisms of the setting module 50 move to the first setting position along the side where the lifting and rotating module 30 is located. When the setting induction piece 567 is arranged corresponding to the fourth sensor, it represents that the setting mechanisms of the setting module 50 move to the second setting position along the side where the lifting and rotating module 30 is located.

[0169] It should be noted that in this embodiment, the sensor assembly is provided corresponding to the sixth setting mechanism 56. However, the first setting mechanism 51, the second setting mechanism 52, the third setting mechanism 53, the fourth setting mechanism 54, the fifth setting mechanism 55, and the sixth setting mechanism 56 in the setting module 50 all expand or contract synchronously. Therefore, the movement positions of all the setting mechanisms in the setting module 50 can be judged according to the induction signal of the sensor assembly. Optionally, in other embodiments, the sensor assembly can also be provided corresponding to the first setting mechanism 51, or the second setting mechanism 52, or the third setting mechanism 53, or the fourth setting mechanism 54, or the fifth setting mechanism 55. The present application does not limit this.

[0170] Please refer to Figures 2 to 23 , Figure 22 which is a schematic structural diagram of a setting module for setting a large-sized wafer provided by an embodiment of the present application. Figure 23 which is a schematic structural diagram of a setting module for setting a small-sized wafer provided by an embodiment of the present application. In this embodiment, when the shape of the wafer is a square piece, the setting module 50 can be used to set two wafers of different sizes.

[0171] Moreover, it should be noted that in this embodiment, in the first setting mechanism 51, the first guide rod 515 is closer to the third setting mechanism 53 than the second guide rod 516; in the third setting mechanism 53, the fifth guide rod 535 is closer to the first setting mechanism 51 than the sixth guide rod 536; in the fifth setting mechanism 55, the tenth guide rod 556 is closer to the sixth setting mechanism 56 than the ninth guide rod 555; in the sixth setting mechanism 56, the twelfth guide rod 566 is closer to the fifth setting mechanism 55 than the eleventh guide rod 565.

[0172] The first guide rod 515, the fifth guide rod 535, the tenth guide rod 556, and the twelfth guide rod 566 are used to set the large-sized wafer, and the second guide rod 516, the sixth guide rod 536, the ninth guide rod 555, and the eleventh guide rod 565 are used to set the small-sized wafer.

[0173] Furthermore, in this embodiment, the suction and setting mechanism further includes a wafer detector 95, and the wafer detector 95 can be used to detect the shape of the wafer. When the shape of the wafer is a square piece, the setting module 50 is controlled to perform setting. When the shape of the wafer is a round piece, the setting module 50 does not need to be controlled to work. The suction and setting mechanism can be applied to square wafers and round wafers to improve the practicability and versatility of the suction and setting mechanism.

[0174] Please refer to Figure 24 , Figure 24 which is a schematic structural diagram of a flattening module provided by an embodiment of the present application. In this embodiment, the flattening module 40 includes a first flattening mechanism 41 and a second flattening mechanism 42 arranged at intervals, and the first flattening mechanism 41 and the second flattening mechanism 42 are arranged on the side of the bottom plate 10 away from the carrier plate 20.

[0175] The first flattening mechanism 41 includes a first lifting cylinder 411, a first fixing component 412, a first flattening member 413 and a second flattening member 414. The first lifting cylinder 411 is used to drive the first fixing component 412 to move along the first direction D1. The first flattening member 413 and the second flattening member 414 are arranged at both ends of the first fixing component 412, and the first flattening member 413 and the second flattening member 414 penetrate through the bottom plate 10 and the carrier plate 20. The first flattening member 413 and the second flattening member 414 are used to adsorb the wafer.

[0176] The second flattening mechanism 42 includes a second lifting cylinder 421, a second fixing component 422, a third flattening member 423 and a fourth flattening member 424. The second lifting cylinder 421 is used to drive the second fixing component 422 to move along the first direction D1. The third flattening member 423 and the fourth flattening member 424 are arranged at both ends of the second fixing component 422, and the third flattening member 423 and the fourth flattening member 424 penetrate through the bottom plate 10 and the carrier plate 20. The third flattening member 423 and the fourth flattening member 424 are used to adsorb the wafer.

[0177] The first flattening member 413, the second flattening member 414, the third flattening member 423 and the fourth flattening member 424 are respectively arranged around the carrier plate 20. The first flattening member 413, the second flattening member 414, the third flattening member 423 and the fourth flattening member 424 can respectively adsorb the four corners of the wafer to improve the adsorption and flattening effect on the wafer.

[0178] It should be noted that, in this embodiment, the suction cups 3223 of the first flattening member 413, the second flattening member 414, the third flattening member 423, and the fourth flattening member 424 are corrugated suction cups. Further, in this embodiment, when the flattening module 40 moves to the second flattening position, the heights of the first flattening member 413, the second flattening member 414, the third flattening member 423, and the fourth flattening member 424 in the first direction D1 are slightly higher than those of the carrier plate 20, so that the first flattening member 413, the second flattening member 414, the third flattening member 423, and the fourth flattening member 424 can effectively adsorb the wafer and flatten the wafer on the carrier plate 20.

[0179] Please refer to Figure 2 , Figure 25 and Figure 26 , Figure 25 which are schematic structural diagrams of a rotating mechanism provided by an embodiment of the present application. Figure 26 which is a schematic structural diagram of a suction cup assembly provided by an embodiment of the present application.

[0180] In this embodiment, the rotating mechanism 32 includes a rotating assembly 321 and a suction cup assembly 322. The rotating assembly 321 is disposed on a side of the bottom plate 10 away from the carrier plate 20. The rotating assembly 321 is used to drive the suction cup assembly 322 to rotate. The suction cup assembly 322 extends along the first direction D1 and penetrates through the bottom plate 10 and the carrier plate 20. The suction cup assembly 322 is used to carry and adsorb the wafer.

[0181] The suction cup assembly 322 includes a suction cup base 3221, a suction cup main body 3222, and a plurality of suction cups 3223. The suction cup base 3221 and the suction cup main body 3222 are connected to form a suction channel communicating with the plurality of suction cups 3223. The suction cup main body 3222 is provided with a plurality of receiving grooves for placing the suction cups 3223. In the first direction D1, the height of the suction cups 3223 is higher than that of the suction cup main body 3222 to adsorb the wafer tightly against the suction cup main body 3222.

[0182] Moreover, it should be noted that in this embodiment, the multiple suction cups 3223 of the suction cup assembly 322 are corrugated suction cups, and the height of the multiple suction cups 3223 is higher than that of the suction cup body 3222. When the multiple suction cups 3223 adsorb the wafer, the multiple suction cups 3223 will move slightly in the opposite direction of the first direction D1 due to the vacuum pressure to fit the lower surface of the wafer to the suction cup body 3222 and flatten the wafer on the suction cup body 3222. Further, it should be noted that in this embodiment, when the suction cup 3223 sizing structure levels and sizes the circular wafer, there is no need to control the operation of the flattening module 40. The flattening of the wafer can be achieved only by the suction cup assembly 322 of the rotating mechanism 32, and there is no need to control the operation of the sizing module 50. The sizing of the wafer can be achieved only by driving the suction cup assembly 322 to rotate by the rotating assembly 321.

[0183] Please refer to Figures 1 to 26 , the present application also provides a wafer inspection device 1000, and the wafer inspection device 1000 includes a transportation structure 200 and the leveling and sizing structure 100. The transportation structure 200 is used to transport the wafer to the leveling and sizing structure 100 or remove the wafer on the leveling and sizing structure 100.

[0184] Furthermore, the wafer inspection device 1000 further includes a code scanning device 300, and the code scanning device 300 is used to scan the code of the wafer to identify the type of the wafer, so as to facilitate subsequent operations such as classifying and inspecting the wafer.

[0185] In the wafer inspection device 1000 provided by the present application, the carrier plate 20 is disposed on the bottom plate 10 and spaced from the bottom plate 10. The lifting and rotating module 30 is disposed on the bottom plate 10. The lifting and rotating module 30 includes the rotating mechanism 32 and the lifting mechanism 31. The rotating mechanism 32 is used to carry the wafer and drive the wafer to rotate relative to the bottom plate 10. The lifting mechanism 31 is used to carry the rotating mechanism 32 and drive the rotating mechanism 32 to reciprocate along the first direction D1. The flattening module 40 is disposed on the bottom plate 10. At least a part of the flattening module 40 penetrates through the carrier plate 20 and the bottom plate 10. The flattening module 40 is used to carry and flatten the wafer. The flattening module 40 can reciprocate along the first direction D1 to flatten the wafer on the carrier plate 20. The alignment module 50 is disposed on the bottom plate 10. The alignment module 50 includes a first alignment mechanism 51, a second alignment mechanism 52, a third alignment mechanism 53, and a fourth alignment mechanism 54. The first alignment mechanism 51, the second alignment mechanism 52, the third alignment mechanism 53, and the fourth alignment mechanism 54 are arranged around the carrier plate 20 and are respectively disposed around the carrier plate 20. The first alignment mechanism 51, the second alignment mechanism 52, the third alignment mechanism 53, and the fourth alignment mechanism 54 can all be used to move along the side where the center of the carrier plate 20 is located closer to align the wafer on the carrier plate 20. The flattening module 40 can drive the wafer to move in the opposite direction of the first direction D1 to place the flattened wafer on the carrier plate 20, which can ensure the flatness of the wafer and facilitate operations such as pre-aligning positioning and scanning of the wafer. The alignment module 50 can align the wafer on the carrier plate 20 to center the large-sized wafer, effectively correct the position of the wafer, and facilitate subsequent steps such as transporting and inspecting the wafer.

[0186] It should be noted that, please refer to Figures 1 to 27 , Figure 27 which is a flowchart of a flattening and aligning method provided by an embodiment of the present application.

[0187] The present application also provides a flattening and aligning method, which is applied to the flattening and aligning structure 100. The flattening and aligning method includes steps S100, S200, S300, S400, S500, S600, S700, S800, S900. The detailed descriptions of steps S100, S200, S300, S400, S500, S600, S700, S800, S900 are as follows.

[0188] S100: Control the lifting and rotating module 30 to move from a first position to a second position along a first direction D1 to absorb and carry the wafer.

[0189] Specifically, the lifting mechanism 31 of the lifting and rotating module 30 moves along the first direction D1 and drives the rotating mechanism 32 to move, so that the rotating mechanism 32 on the lifting mechanism 31 can move to the bottom of the wafer and receive and adsorb the wafer.

[0190] S200: Control the lifting and rotating module 30 to move to a third position in the opposite direction of the first direction D1.

[0191] It should be noted that when the lifting and rotating module 30 moves to the third position in the opposite direction of the first direction D1, the distance between the wafer on the lifting and rotating module 30 and the carrier plate 20 is about 5 mm.

[0192] The rotating mechanism 32 moves to the third position in the opposite direction of the first direction D1 to drive the wafer carried on the rotating mechanism 32 to move in the opposite direction of the first direction D1, so as to shorten the distance between the wafer and the supporting plate 20, thereby facilitating the subsequent leveling mechanism to rise and absorb the wafer.

[0193] S300 : Control the suction and leveling module 40 to move along the first direction D1 to a first suction and leveling position to absorb the wafer on the lifting and rotating module 30 .

[0194] Specifically, the suction module 40 rises along the first direction D1 and abuts against the wafer, so that the suction module 40 can absorb the wafer.

[0195] S400 : Control the lifting and rotating module 30 to move to the first position in the opposite direction of the first direction D1 after the leveling module 40 absorbs the wafer.

[0196] Specifically, the lifting and rotating module 30 descends in the opposite direction of the first direction and moves back to the initial position of the lifting and rotating module 30 .

[0197] S500 : Control the suction module 40 to move from the first suction position to a second suction position in the opposite direction of the first direction D1 , so as to suction and level the wafer on the carrier plate 20 .

[0198] Specifically, the flattening module 40 moves in the opposite direction of the first direction D1 to the second flattening position to place the wafer on the carrier plate 20. At this time, the first flattening member 413, the second flattening member 414, the third flattening member 423, and the fourth flattening member 424 of the flattening module 40 respectively adsorb the four sides of the wafer, and then flatten the wafer relative to the carrier plate 20, so as to flatten the wafer on the carrier plate 20. It should be noted that flattening the wafer on the carrier plate 20, in other words, means flattening the wafer relative to the carrier plate 20. In other words, it means making the wafer as parallel as possible to the carrier plate 20 to improve the flatness of the wafer surface, and then facilitating the subsequent barcode scanning device 300 to scan the pattern on the wafer to identify features such as the type and size of the wafer.

[0199] S600: Control the barcode scanning device 300 to scan the wafer after the wafer is flattened on the carrier plate 20.

[0200] Among them, the barcode scanning device 300 scans the pattern on the wafer to identify features such as the type and size of the wafer, which is convenient for subsequent specific electrical performance detection of the wafer.

[0201] S700: Control the alignment mechanism of the alignment module 50 to move to the first alignment position along the side close to the lifting and rotating module 30.

[0202] It should be noted that in this embodiment, the alignment mechanism of the alignment module 50 moves to the first alignment position along the side close to the lifting and rotating module 30. In other words, the first alignment mechanism 51, the second alignment mechanism 52, the third alignment mechanism 53, and the fourth alignment mechanism 54 of the alignment module 50 all move along the side close to the center of the carrier plate 20, and move to a position where the distance between the first alignment mechanism 51, the second alignment mechanism 52, the third alignment mechanism 53, the fourth alignment mechanism 54 and the wafer is about 4 mm.

[0203] S800: Control the flattening module 40 to release the wafer after the alignment mechanism moves to the first alignment position.

[0204] Among them, after the alignment mechanism of the alignment module 50 moves to the first alignment position along the side close to the lifting and rotating module 30, the flattening module 40 then releases the wafer. Some structures of the alignment mechanism can be used to prevent large-scale warping of the four sides of the wafer.

[0205] S900: Control the alignment mechanism of the alignment module 50 to move to the second alignment position for aligning the wafer.

[0206] The setting mechanism of the setting module 50 moves along the side close to the lifting and rotating module 30 to the second setting position. In other words, the first setting mechanism 51, the second setting mechanism 52, the third setting mechanism 53, and the fourth setting mechanism 54 of the setting module 50 all move along the side close to the center of the carrier plate 20 and move to the position where the first setting mechanism 51, the second setting mechanism 52, the third setting mechanism 53, and the fourth setting mechanism 54 abut against the wafer. The first setting mechanism 51, the second setting mechanism 52, the third setting mechanism 53, and the fourth setting mechanism 54 are respectively arranged around the wafer and abut against the wafer to limit the wafer within the setting space formed by the first setting mechanism 51, the second setting mechanism 52, the third setting mechanism 53, and the fourth setting mechanism 54, so as to realize the setting of the wafer.

[0207] In this application, the mention of "embodiment" or "implementation manner" means that the specific features, structures, or characteristics described in connection with the embodiment may be included in at least one embodiment of this application. The phrase appears in various positions in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment mutually exclusive with other embodiments. Those skilled in the art understand explicitly and implicitly that the embodiments described in this application can be combined with other embodiments. In addition, it should also be understood that the features, structures, or characteristics described in each embodiment of this application can be combined arbitrarily without contradiction to form another embodiment that does not deviate from the spirit and scope of the technical solution of this application.

[0208] The above are some implementation manners of this application. It should be noted that for those of ordinary skill in the art, without departing from the principle of this application, several improvements and refinements can be made, and these improvements and refinements are also regarded as the protection scope of this application.

Claims

1. A wafer leveling structure, characterized in that: include: Base plate; A carrier plate, the carrier plate is disposed on the bottom plate and spaced apart from the bottom plate, and the carrier plate is used to carry wafers; A lifting and rotating module, the lifting and rotating module is arranged on the bottom plate, the lifting and rotating module comprises a rotating mechanism and a lifting mechanism, the rotating mechanism is used to carry the wafer and drive the wafer to rotate relative to the bottom plate, the lifting mechanism is used to carry the rotating mechanism and drive the rotating mechanism to reciprocate along a first direction, the first direction is perpendicular to the bottom plate; A suction leveling module, the suction leveling module is arranged on the bottom plate, the suction leveling module at least partially penetrates the carrying plate and the bottom plate, the suction leveling module is used to carry and suck the wafer flat, the suction leveling module can reciprocate along the first direction to suck the wafer flat on the carrying plate, the suction leveling module includes a first suction leveling mechanism and a second suction leveling mechanism arranged at intervals, the first suction leveling mechanism and the second suction leveling mechanism are arranged on the side of the bottom plate away from the carrying plate; the first suction leveling mechanism includes a first lifting cylinder, a first fixing assembly, a first suction member and a second suction member, the first lifting cylinder is used to drive the first fixing assembly to move along the first direction, the first A suction member and a second suction member are arranged at both ends of the first fixed component, and the first suction member and the second suction member penetrate the bottom plate and the carrying plate, and the first suction member and the second suction member are used to absorb the wafer; the second suction mechanism comprises a second lifting cylinder, a second fixed component, a third suction member and a fourth suction member, the second lifting cylinder is used to drive the second fixed component to move along the first direction, the third suction member and the fourth suction member are arranged at both ends of the second fixed component, and the third suction member and the fourth suction member penetrate the bottom plate and the carrying plate, and the third suction member and the fourth suction member are used to absorb the wafer; as well as An adjusting module, wherein the adjusting module is arranged on the base plate, and the adjusting module comprises a first adjusting mechanism, a second adjusting mechanism, a third adjusting mechanism and a fourth adjusting mechanism, wherein the first adjusting mechanism, the second adjusting mechanism, the third adjusting mechanism and the fourth adjusting mechanism are arranged around the carrier plate and are respectively arranged around the carrier plate, and the first adjusting mechanism, the second adjusting mechanism, the third adjusting mechanism and the fourth adjusting mechanism can all be used to move along the side close to the center of the carrier plate to adjust the wafer on the carrier plate.

2. The suction leveling structure according to claim 1, characterized in that: The adjustment module also includes an adjustment drive mechanism, which is connected to the first adjustment mechanism and is used to drive the first adjustment mechanism to move along a second direction and an opposite direction; the adjustment drive mechanism is connected to the second adjustment mechanism and is used to drive the second adjustment mechanism to move along a third direction and an opposite direction; the adjustment drive mechanism is connected to the third adjustment mechanism and is used to drive the third adjustment mechanism to move along the first direction and an opposite direction; the adjustment drive mechanism is connected to the fourth adjustment mechanism and is used to drive the fourth adjustment mechanism to move along the third direction and an opposite direction, wherein the second direction is perpendicular to the third direction, and the second direction and the third direction are both perpendicular to the first direction.

3. The suction leveling structure according to claim 2, characterized in that: The setting module further includes a fifth setting mechanism and a sixth setting mechanism, wherein the first setting mechanism and the fifth setting mechanism are arranged at intervals along the third direction, and the third setting mechanism and the sixth setting mechanism are arranged at intervals along the third direction; The adjustment module also includes a guide rail assembly, which includes a first guide rail, a second guide rail and a third guide rail, the first guide rail and the third guide rail extend along the second direction and are arranged at intervals, and the second guide rail extends along the third direction; wherein, the first adjustment mechanism and the third adjustment mechanism are slidably connected to the first guide rail, the first adjustment mechanism and the third adjustment mechanism move along the first guide rail toward the second direction and the opposite direction, the fifth adjustment mechanism and the sixth adjustment mechanism are slidably connected to the third guide rail, the fifth adjustment mechanism and the sixth adjustment mechanism move along the second guide rail toward the second direction and the opposite direction, the second adjustment mechanism and the fourth adjustment mechanism are slidably connected to the second guide rail, and the second adjustment mechanism and the fourth adjustment mechanism move along the second guide rail toward the third direction and the opposite direction.

4. The suction leveling structure according to claim 3, characterized in that: The setting drive mechanism comprises a setting drive motor and a conveyor belt assembly, wherein the setting drive motor is connected to the conveyor belt assembly and is used to drive the conveyor belt assembly to move; The conveyor belt assembly comprises an outer conveyor belt and an inner conveyor belt, the outer conveyor belt is connected to the inner conveyor belt, and the conveying directions of the outer conveyor belt and the inner conveyor belt are opposite; The inner conveyor belt comprises a first conveyor portion, a second conveyor portion and a third conveyor portion connected in sequence, the outer conveyor belt comprises a fourth conveyor portion, a fifth conveyor portion and a sixth conveyor portion connected in sequence, the first conveyor portion and the fourth conveyor portion are correspondingly arranged and move in opposite directions, the second conveyor portion and the fifth conveyor portion are correspondingly arranged and move in opposite directions, the third conveyor portion and the sixth conveyor portion are correspondingly arranged and move in opposite directions, the first conveyor portion, the third conveyor portion, the fourth conveyor portion and the sixth conveyor portion extend along the second direction, and the second conveyor portion and the fifth conveyor portion extend along the third direction; The first adjusting mechanism is connected to the first conveying part, the third adjusting mechanism is connected to the fourth conveying part, and the moving directions of the first adjusting mechanism and the third adjusting mechanism are opposite; the second adjusting mechanism is connected to the second conveying part, the fourth adjusting mechanism is connected to the fifth conveying part, and the moving directions of the second adjusting mechanism and the fourth adjusting mechanism are opposite; the fifth adjusting mechanism is connected to the third conveying part, the sixth adjusting mechanism is connected to the sixth conveying part, and the moving directions of the fifth adjusting mechanism and the sixth adjusting mechanism are opposite.

5. The suction leveling structure according to claim 4, characterized in that: The setting module includes a retracted state and an open state. When the setting module is in the retracted state, the setting drive motor rotates clockwise, the inner conveyor belt moves counterclockwise, the outer conveyor belt moves clockwise, the first conveying part drives the first setting mechanism to move in the second direction, the second conveying part drives the second setting mechanism to move in the opposite direction of the third direction, the third conveying part drives the sixth setting mechanism to move in the opposite direction of the second direction, the fourth conveying part drives the third setting mechanism to move in the opposite direction of the second direction, the fifth conveying part drives the fourth setting mechanism to move in the third direction; the sixth conveying part drives the fifth setting mechanism to move in the second direction; When the adjustment module is in an open state, the adjustment drive motor rotates counterclockwise, the inner conveyor belt moves clockwise, the outer conveyor belt moves counterclockwise, the first conveying part drives the first adjustment mechanism to move in the opposite direction of the second direction, the second conveying part drives the second adjustment mechanism to move in the third direction, the third conveying part drives the sixth adjustment mechanism to move in the second direction, the fourth conveying part drives the third adjustment mechanism to move in the second direction, the fifth conveying part drives the fourth adjustment mechanism to move in the opposite direction of the third direction; the sixth conveying part drives the fifth adjustment mechanism to move in the opposite direction of the second direction.

6. The suction leveling structure according to claim 5, characterized in that: The first setting mechanism includes a first connecting member, a first pressing plate, a first adjusting block, a second adjusting block, a first guide rod and a second guide rod, the first connecting member is connected to the first guide rail, the first pressing plate is respectively connected to the first connecting member and the first conveying part, the first adjusting block and the second adjusting block are arranged on the first connecting member, and the first adjusting block and the second adjusting block are arranged in sequence along the third direction, the first guide rod is arranged on the first adjusting block, the second guide rod is arranged on the second adjusting block, and the first guide rod and the second guide rod are used to abut and limit the wafer; The first adjusting block and the second adjusting block are provided with a first waist-shaped hole, and the first adjusting block and the second adjusting block are fixedly connected through the first waist-shaped hole and the first connecting member.

7. The suction leveling structure according to claim 6, characterized in that: The first guide rod includes a main body, an arc-shaped transition portion and an extension portion. The radial dimension of the extension portion is larger than that of the main body, and the radial dimension of the arc-shaped transition portion gradually increases from the main body to the extension portion.

8. The suction leveling structure according to any one of claims 1 to 7, characterized in that: The rotating mechanism comprises a rotating assembly and a suction cup assembly, wherein the rotating assembly is arranged on a side of the bottom plate away from the carrying plate, the rotating assembly is used to drive the suction cup assembly to rotate, the suction cup assembly extends along the first direction and penetrates the bottom plate and the carrying plate, and the suction cup assembly is used to carry and adsorb the wafer; The suction cup assembly includes a suction cup seat, a suction cup body and multiple suction cups. The suction cup seat and the suction cup body are connected to form an air suction channel connecting the multiple suction cups. The suction cup body is provided with multiple receiving grooves, and the multiple receiving grooves are used to place the suction cups. In the first direction, the height of the suction cup is higher than the height of the suction cup body, so as to adsorb the wafer tightly against the suction cup body.

9. A suction leveling method, characterized in that: Applicable to the suction leveling structure according to any one of claims 1 to 8, the suction leveling method comprises: Controlling the lifting and rotating module to move from a first position to a second position along a first direction for adsorbing and carrying the wafer; Controlling the lifting and rotating module to move to a third position in the opposite direction of the first direction; Controlling the suction and leveling module to move along the first direction to a first suction and leveling position to absorb the wafer on the lifting and rotating module; Controlling the lifting and rotating module to move to the first position in the opposite direction of the first direction after the wafer is adsorbed by the leveling module; Controlling the suction leveling module to move from the first suction leveling position to a second suction leveling position in the opposite direction of the first direction, so as to make the wafer suction level on the carrier plate; Controlling the code scanning device to scan the wafer after the wafer is sucked flat on the carrier plate; Controlling the setting mechanism of the setting module to move to a first setting position along the side close to the lifting and rotating module; Control the suction and leveling module to release the wafer after the setting mechanism moves to the first setting position; The setting mechanism of the setting module is controlled to move to a second setting position for setting the wafer.

10. A wafer inspection device, characterized in that: It comprises a transport structure and the suction and leveling structure described in any one of claims 1 to 8, wherein the transport structure is used to transport the wafer to the suction and leveling structure or to remove the wafer on the suction and leveling structure.

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