Semiconductor trigger circuit of three-pole air gap

Abstract

The invention provides a semiconductor trigger circuit of a three-pole air gap, which comprises the three-pole air gap and a response semiconductor trigger circuit D arranged outside the three-pole air gap, the three-pole air gap comprises a main discharge electrode A connected with the high-voltage end of the protected electrical equipment, a grounded discharge electrode B and a control electrode C connected with the trigger control circuit, and an internal discharge trigger gap E is arranged in the three-pole air gap; the response trigger circuit is used for enabling an internal discharge trigger gap located in the three-pole air gap to discharge; a first end electrode of the internal discharge trigger gap E is connected with the control electrode C, and a second end electrode is connected with the discharge electrode B; the first end of the response trigger circuit D is connected with the main discharge electrode A, the second end of the response trigger circuit D is connected with the first end of the internal discharge trigger gap E through the control electrode C, and the response trigger circuit D is connected with the internal discharge trigger gap E in series.

Description

Technical Field

[0001] The invention relates to the field of overvoltage protection of power systems, and in particular to a three-pole air-gap semiconductor trigger circuit and a surge protector. Background Art

[0002] Overvoltage often occurs during the operation of power transmission and distribution systems and various electrical equipment. Overvoltage may be caused by a variety of reasons such as lightning strikes, switch operations, power system failures, etc. Its amplitude may far exceed the normal operating voltage, which will pose a serious threat to the insulation performance of electrical equipment and even cause equipment damage, affecting the reliable operation of the power system.

[0003] Traditional overvoltage protection devices, such as simple bipolar air gap discharge devices, can limit voltage to a certain extent, but they have many defects. The discharge voltage of the bipolar air gap is highly dispersed and is significantly affected by environmental factors (such as humidity, air pressure, etc.). It is difficult to accurately control the discharge moment, and the discharge stability is insufficient. After multiple discharges, the electrodes are easily ablated, which reduces the protection performance. In addition, for some rapidly changing overvoltages, its response speed is slow and it cannot effectively protect the equipment in a timely manner.

[0004] With the continuous development of power systems and the increasing performance requirements of electrical equipment, there is an urgent need for a protection circuit that can respond to overvoltage more accurately, quickly and stably to ensure the safe and stable operation of power systems and electrical equipment. Summary of the invention

[0005] Based on this, it is necessary to provide a three-pole air gap trigger circuit, which can accurately control the discharge voltage, improve the stability and response speed of the discharge, effectively reduce the damage of overvoltage to electrical equipment, and at the same time reduce the impact of environmental factors on the discharge performance and extend the service life of the device.

[0006] In order to solve the above technical problems, the present invention provides a semiconductor trigger circuit of a three-pole air gap, comprising a three-pole air gap and a response trigger circuit D arranged outside the three-pole air gap, wherein the three-pole air gap comprises a main discharge electrode A connected to the high-voltage end of the protected electrical equipment, a grounded discharge electrode B and a control electrode C connected to the trigger control circuit, an internal discharge trigger gap E is arranged inside the three-pole air gap, and the response semiconductor trigger circuit is used to discharge the internal discharge trigger gap located inside the three-pole air gap; the first end electrode of the internal discharge trigger gap E is connected to the control electrode C, and the second end electrode is connected to the discharge electrode B; the first end of the response trigger circuit D is connected to the main discharge electrode A, the second end of the response trigger circuit D is connected to the first end of the internal discharge trigger gap E through the control electrode C, and the response trigger circuit D is connected in series with the internal discharge trigger gap E.

[0007] Preferably, the internal discharge trigger gap E is an internal interlayer gap arranged on a multi-layer PCB board, an interlayer exposed area is arranged on the multi-layer PCB board, and the multi-layer PCB board is located at the interlayer exposed area to form an internal interlayer gap structure.

[0008] Preferably, the multi-layer PCB board includes conductive layers stacked in sequence from top to bottom, and insulating isolation layers and isolation layers are arranged between the conductive layers. The conductive layers stacked in sequence are connected to form a first conductive layer and a second conductive layer, and the conductive layers are staggered into a relatively exposed state to form an internal discharge gap E.

[0009] Preferably, the external trigger circuit D is electrically connected to a first conductive layer of the multilayer PCB board forming an internal discharge gap E, and the discharge electrode B is electrically connected to a second conductive layer of the multilayer PCB board forming an internal discharge gap E.

[0010] Preferably, the responsive semiconductor trigger circuit comprises a nonlinear conductive element, and the nonlinear conductive element is any one of a semiconductor discharge tube (TSS), a transient voltage suppression diode (TVS), a gas discharge tube (GDT) and a pulse capacitor.

[0011] Preferably, the responsive semiconductor trigger circuit is composed of a plurality of or one nonlinear conductive elements connected in series, and the plurality of nonlinear conductive elements are selected from any combination of fast response discharge tubes, transient voltage suppression diodes, gas discharge tubes and pulse capacitors.

[0012] Preferably, the breakdown voltage of the internal discharge trigger gap E is smaller than the breakdown voltage between the main discharge electrode A and the discharge electrode B.

[0013] A surge protector, wherein the trigger circuit of the three-pole air gap forms the basis of the surge protector.

[0014] Beneficial effects of the present invention: The discharge voltage of the main discharge channel of the three-pole air discharge gap of the present invention is relatively high, and it is difficult to directly trigger the discharge at both ends of the gap. The trigger circuit of this scheme preferentially discharges by establishing a gap with a smaller discharge voltage inside the gap, thereby triggering the discharge of the main channel of the three-pole discharge gap to achieve the main channel conduction. The fast response trigger circuit outside the three-pole air gap causes the internal discharge trigger gap to discharge, thereby accelerating the discharge of the three-pole air gap. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] The above and other purposes, features and advantages of the present invention will become more clear by more specific description of the preferred embodiments of the present invention shown in the accompanying drawings. The same reference numerals indicate the same parts in all the accompanying drawings, and the accompanying drawings are not deliberately scaled to the actual size, and the focus is on illustrating the main purpose of the present invention.

[0016] Figure 1 It is a schematic diagram of the trigger circuit composition of a three-pole air gap according to a preferred embodiment of the present invention;

[0017] Figure 2 This is a connection diagram of a trigger circuit according to a preferred embodiment 1 of the present invention;

[0018] Figure 3 This is a connection diagram of a trigger circuit according to a second preferred embodiment of the present invention;

[0019] Figure 4 This is a connection diagram of a trigger circuit according to a third preferred embodiment of the present invention;

[0020] Figure 5 This is a connection diagram of a trigger circuit according to a fourth preferred embodiment of the present invention;

[0021] Figure 6 Schematic diagram of the cross-sectional view of the gap structure of a multi-layer PCB board according to a preferred embodiment of the present invention;

[0022] In the figure: 1 and 3 are connected to form a first conductive layer; 2 and 4 are connected to form a second conductive layer; and an insulating isolation layer 5. DETAILED DESCRIPTION

[0023] To facilitate understanding of the present invention, the present invention will be described more fully below with reference to the relevant drawings.

[0024] It should be noted that when an element is considered to be "connected" to another element, it may be directly connected to another element and integrated therewith, or there may be an intermediate element at the same time. The terms "installed", "one end", "the other end" and similar expressions used herein are for illustrative purposes only.

[0025] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those generally understood by those skilled in the art. The terms used in the specification herein are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0026] refer to Figure 1-Figure 6 As shown, the present invention provides a trigger circuit of a three-pole air gap, comprising a three-pole air gap and a response semiconductor trigger circuit D arranged outside the three-pole air gap, wherein the three-pole air gap comprises a main discharge electrode A connected to the high-voltage end of the protected electrical equipment, a grounded discharge electrode B and a control electrode C connected to the trigger control circuit, an internal discharge trigger gap E is arranged inside the three-pole air gap, and the response trigger circuit is used to discharge the internal discharge trigger gap located inside the three-pole air gap; the first end electrode of the internal discharge trigger gap E is connected to the control electrode C, and the second end electrode is connected to the discharge electrode B; the first end of the response trigger circuit D is connected to the main discharge electrode A, the second end of the response trigger circuit D is connected to the first end of the internal discharge trigger gap E through the control electrode C, and the response semiconductor trigger circuit D is connected in series with the internal discharge trigger gap E.

[0027] The present invention uses an external trigger circuit to discharge the internal discharge trigger gap, thereby accelerating the discharge of the three-pole air gap main discharge channel. The present invention provides a method for determining the maximum continuous voltage of the surge protector based on the trigger circuit.

[0028] It should be noted that the main discharge electrode A and the discharge electrode B form a main discharge electrode gap, that is, a three-pole discharge gap main channel; a discharge trigger gap E is arranged inside the three-pole discharge gap.

[0029] The discharge voltage of the main discharge channel of the three-pole air discharge gap of the present invention is relatively high, and it is difficult to directly trigger the discharge at both ends of the gap. The trigger circuit of this scheme preferentially discharges the gap with a smaller discharge voltage inside the gap, thereby triggering the discharge of the main channel of the three-pole discharge gap to achieve the main channel conduction.

[0030] The existing air gaps are divided into two types: multi-layer graphite type and multi-layer discharge tube type. The purpose of using multi-layer gaps is to reduce the discharge voltage between adjacent layers. The interlayer discharge of multi-layer gaps is triggered by capacitive pulse or varistor pulse, thereby forming multiple trigger circuits, which need to trigger each layer of gap in turn.

[0031] refer to Figure 6In a preferred embodiment, the internal discharge trigger gap E is an internal interlayer gap set on a multi-layer PCB board, an interlayer exposed area is set on the multi-layer PCB board, and the multi-layer PCB board is located at the interlayer exposed area to form an internal interlayer gap structure.

[0032] refer to Figure 6 In a preferred embodiment, the conductive layers and isolation layers stacked in sequence from top to bottom on the multi-layer PCB board include first conductive layers 1 and 3; second conductive layers 2 and 4 and isolation layer 5; 1 and 3 are interconnected, 2 and 4 are interconnected, and 1, 2, 3, and 4 are all provided with insulating isolation layer 5 windows on the insulating isolation layer 5, and are in a bare state without isolation of the insulating isolation layer 5, forming an interlayer bare area, so that between the first conductive layer 1 and the second conductive layer 2 at the insulating isolation layer 5 window; between the second conductive layer 2 and the first conductive layer 3, and between the first conductive layer 3 and the second conductive layer 4, an internal interlayer gap structure is formed due to the setting of the insulating isolation layer 5 window.

[0033] refer to Figure 6 The circuit of the three-pole air gap semiconductor discharge adopts a multi-layer PCB board for its internal discharge trigger gap. The PCB board is designed through structural design. The partial cross section between the top surface of the multi-layer PCB board and the bottom surface of the PCB board is designed to be an interlayer exposed structure. A gap is formed between the interlayer exposure. The gap is designed to be a relatively fixed low interlayer discharge voltage. When the external discharge trigger circuit is turned on instantaneously, a transient pulse voltage is generated, which causes the interlayer exposed part to discharge, thereby promoting the main discharge channel between the A pole and the B pole of the three-pole air gap to discharge. The multi-layer design provides multiple internal gaps, which has the benefit of improving the stability of the discharge. The first conductive layer 1 is connected to the external trigger circuit D, and the second conductive layer 4 is connected to the B pole of the three-pole gap.

[0034] The external surge triggers the discharge between the exposed layers of the PCB through the external trigger circuit D, thereby accelerating the discharge conduction between the A pole and the B pole.

[0035] In a preferred embodiment, the external trigger circuit D is electrically connected to the first conductive layer, and the second conductive layer is electrically connected to the discharge electrode B.

[0036] In a preferred embodiment, the response trigger circuit includes a nonlinear conductive element, which is any one of a fast response discharge tube, a transient voltage suppression diode, a gas discharge tube and a pulse capacitor. The response trigger circuit is composed of one or more components of a fast response discharge tube, a transient voltage suppression diode, a pulse capacitor, and a combination thereof. Its function is to provide a transient pulse for the internal discharge trigger gap.

[0037] In a preferred embodiment, the responsive semiconductor trigger circuit is composed of a plurality of nonlinear conductive elements connected in series in sequence, and the plurality of nonlinear conductive elements are selected from any combination of fast response discharge tubes, gas discharge tube transient voltage suppression diodes and pulse capacitors.

[0038] One end of the fast response trigger circuit is connected to the A pole of the three-pole air gap, and the other end is connected to the top surface of the multilayer PCB board with the discharge structure inside the three-pole gap through the C pole of the three-pole air gap. The bottom surface of the PCB board is connected to the negative pole of the three-pole air gap.

[0039] In a preferred embodiment, the breakdown voltage of the internal discharge triggering gap E is smaller than the breakdown voltage between the main discharge electrode A and the discharge electrode B.

[0040] A surge protector is also provided, wherein the trigger circuit of the three-pole air gap forms the basis of the surge protector.

[0041] The three-pole air gap includes a main discharge electrode A, a discharge electrode B and a control electrode C.

[0042] Optionally, the trigger circuit of the three-pole air gap further includes a trigger control circuit, and the trigger control circuit includes an external response trigger circuit D of the three-pole air gap. The trigger control circuit includes a voltage detection module, a signal processing module and a pulse trigger module. The voltage detection module monitors the voltage at both ends of the protected electrical equipment in real time. When the voltage exceeds a preset overvoltage threshold, the voltage signal is transmitted to the signal processing module. The signal processing module generates a trigger control signal and transmits it to the pulse trigger module. The pulse trigger module outputs a pulse signal to the control electrode C.

[0043] Technical principle: The present invention utilizes the sudden conduction principle of nonlinear conductive elements to provide a pulse trigger level for the discharge trigger gap when a surge pulse arrives, resulting in discharge of the discharge trigger. This accelerates the discharge conduction of the air discharge gap. Figure 1 A trigger circuit of a three-pole air gap is shown, which is composed of a D external trigger circuit and an E discharge trigger gap; one end of the D external trigger circuit is connected to the A pole of the three-level discharge gap through the C pole of the three-pole gap, and the other end is connected to one end of the E discharge trigger gap, and the other end of the E discharge trigger gap is connected to the B pole. When a surge pulse arrives, the D external trigger circuit is turned on, and its transient conduction pulse causes the E discharge trigger gap to discharge, thereby accelerating the discharge conduction of the air gap between the A pole and the B pole.

[0044] The three-pole air gap trigger circuit provides a transient pulse for the internal discharge trigger gap, and is composed of one or more of a fast response discharge tube, a transient voltage suppression diode, a pulse capacitor, and a combination thereof.

[0045] Embodiment 1

[0046] The three-pole air gap trigger circuit can be Figure 2 As shown, the circuit is composed of ⑧ fast response discharge tube (GDT) or semiconductor discharge tube (TSS) and ⑨ internal trigger discharge gap. The conduction withstand voltage of ⑧ fast response discharge tube or semiconductor discharge tube (TSS) + ⑨ internal trigger discharge gap conduction maintenance voltage is the maximum continuous voltage of the surge protector formed by the circuit.

[0047] Embodiment 2

[0048] The three-pole air gap trigger circuit can be composed of Figure 3 As shown, the circuit consists of ⑩ transient suppression diode (TVS) or semiconductor discharge tube (TSS), Fast response discharge tube (GDT) and Internal trigger discharge gap. ⑩ Transient suppression diode conduction voltage or semiconductor discharge tube (TSS) + Fast response discharge tube conduction withstand voltage + The internal trigger discharge gap conduction maintenance voltage is the maximum continuous voltage of the surge protector formed by the circuit.

[0049] Embodiment 3

[0050] The three-pole air gap trigger circuit can be composed of Figure 4 As shown, the circuit consists of ① pulse capacitor, ② fast response discharge tube (GDT) or semiconductor discharge tube (TSS) and ③ internal trigger discharge gap. The conduction withstand voltage of ② fast response discharge tube or semiconductor discharge tube (TSS) + ③ internal trigger discharge gap conduction maintenance voltage is the maximum continuous voltage of the surge protector formed by the circuit. The purpose of adding ① pulse capacitor is to limit the current of the trigger circuit, which is to increase the service life of the circuit.

[0051] Embodiment 4

[0052] The three-pole air gap trigger circuit can be composed of Figure 5 As shown in the figure, the circuit consists of ④ pulse capacitor, ⑤ transient voltage suppressor diode (TVS) or semiconductor discharge tube (TSS), ⑥ fast response discharge tube (GDT) and ⑦ internal trigger discharge gap. The conduction voltage of ⑤ transient voltage suppressor diode (TVS) + the conduction withstand voltage of ⑥ fast response discharge tube (GDT) + ⑦ internal trigger discharge gap conduction maintenance voltage is the maximum continuous voltage of the surge protector formed by the circuit. The purpose of adding ④ pulse capacitor is to limit the current of the trigger circuit, which is conducive to improving the service life of the circuit.

[0053] In the present application, unless otherwise clearly specified and limited, a first feature being “above” or “below” a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being “above”, “above”, and “above” a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being “below”, “below”, and “below” a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0054] In the description of this specification, the description with reference to the terms "preferred embodiment", "further embodiment", "other embodiments" or "specific example" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, unless they are contradictory.

[0055] Although the embodiments of the present application have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be understood as limitations on the present application. Ordinary technicians in this field can change, modify, replace and modify the above embodiments within the scope of the present application.

Claims

1. A three-pole air-gap semiconductor trigger circuit, characterized in that: The invention comprises a three-pole air gap and a response semiconductor trigger circuit D arranged outside the three-pole air gap, wherein the three-pole air gap comprises a main discharge electrode A connected to the high-voltage end of the protected electrical equipment, a grounded discharge electrode B and a control electrode C connected to the trigger control circuit, an internal discharge trigger gap E is arranged inside the three-pole air gap, and the response semiconductor trigger circuit is used to discharge the internal discharge trigger gap located inside the three-pole air gap; the first end electrode of the internal discharge trigger gap E is connected to the control electrode C, and the second end electrode is connected to the discharge electrode B; the first end of the response trigger circuit D is connected to the main discharge electrode A, the second end of the response trigger circuit D is connected to the first end of the internal discharge trigger gap E through the control electrode C, and the response trigger circuit D is connected in series with the internal discharge trigger gap E.

2. The semiconductor trigger circuit according to claim 1, characterized in that: The internal discharge trigger gap E is an internal interlayer gap set on a 2-layer to multi-layer PCB board, and an interlayer exposed area is set on the multi-layer PCB board. The multi-layer PCB board is located at the interlayer exposed area to form an internal interlayer gap structure.

3. The semiconductor trigger circuit according to claim 1, characterized in that: The multi-layer PCB board includes conductive layers and isolation layers stacked in sequence from top to bottom, and insulating isolation layers are arranged between the conductive layers. The conductive layers stacked in sequence are connected to form a first conductive layer and a second conductive layer, and the conductive layers are staggered into a relatively exposed state to form an internal discharge gap E.

4. The semiconductor trigger circuit according to claim 1, characterized in that: The external trigger circuit D is electrically connected to the first conductive layer of the multilayer PCB board forming an internal discharge gap E, and the discharge electrode B is electrically connected to the second conductive layer of the multilayer PCB board forming an internal discharge gap E.

5. The semiconductor trigger circuit according to claim 4, characterized in that: The responsive semiconductor trigger circuit includes a nonlinear conductive element, which is any one of a semiconductor discharge tube (TSS), a transient voltage suppression diode (TVS), a gas discharge tube and a pulse capacitor.

6. The semiconductor trigger circuit according to claim 1, characterized in that: The responsive semiconductor trigger circuit is composed of a plurality of or one nonlinear conductive elements connected in series in sequence, and the plurality of nonlinear conductive elements are selected from any combination of semiconductor discharge tubes, transient voltage suppression diodes, gas discharge tubes and pulse capacitors.

7. The trigger circuit according to claim 1, characterized in that: The breakdown voltage of the internal discharge triggering gap E is lower than the breakdown voltage between the main discharge electrode A and the discharge electrode B.

8. An air gap surge protector, characterized in that: A trigger circuit comprising a three-pole air gap according to any one of claims 1 to 7, wherein the trigger circuit of the three-pole air gap forms the basis of the surge protector.

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