Display panel, preparation method of display panel and electronic device

Abstract

The display panel, the preparation method of the display panel and the electronic equipment provided by the embodiments of the present application relate to the technical field of display, and the display panel comprises an array substrate, an isolation structure, a light emitting unit and a first encapsulation layer. The isolation structure is provided with an isolation opening; the first encapsulation layer is located on a side of the light emitting unit away from the array substrate, and the first encapsulation layer comprises a plurality of encapsulation units arranged at intervals, and at least part of the encapsulation units extends from a side of the isolation structure to a side of the isolation structure away from the array substrate; the encapsulation unit comprises a border portion located on the side of the isolation structure away from the array substrate, and a projection of a part of the border portion away from the array substrate on the array substrate is located in a projection of a part of the border portion close to the array substrate on the array substrate. The present application can better protect the light emitting unit of the front process, thereby improving the display effect of the display panel.

Description

Technical Field

[0001] This application relates to the field of display technology, and more specifically, to a display panel, a method for manufacturing the display panel, and an electronic device. Background Technology

[0002] Organic light-emitting diodes (OLEDs) and flat panel displays based on light-emitting diodes (LEDs) are widely used in various consumer electronics products such as mobile phones, televisions, laptops, and desktop computers due to their advantages such as high image quality, energy saving, thin body, and wide range of applications, becoming the mainstream of display panels.

[0003] However, there are still some problems with the display panel that need to be addressed. Summary of the Invention

[0004] To overcome the technical problems mentioned in the background, this application provides a display panel, which includes:

[0005] Array substrate;

[0006] An isolation structure located on one side of the array substrate, the isolation structure having an isolation opening;

[0007] The light-emitting unit is located at least partially within the isolation opening;

[0008] A first encapsulation layer located on the side of the light-emitting unit away from the array substrate, the first encapsulation layer comprising a plurality of spaced encapsulation units, at least a portion of the encapsulation units extending from the side of the isolation structure to the side of the isolation structure away from the array substrate, the side of the isolation structure being the surface of the isolation structure facing the isolation opening;

[0009] The packaging unit includes a cladding portion located on the side of the isolation structure away from the array substrate, wherein the orthographic projection of the portion of the cladding portion away from the array substrate on the array substrate does not exceed the orthographic projection of the portion of the cladding portion close to the array substrate on the array substrate.

[0010] In some possible implementations, along a direction away from the array substrate, the packaging unit includes a first packaging sublayer, the first packaging sublayer being located at a portion of the isolation structure away from the array substrate and disposed at an angle away from the side of the isolation opening;

[0011] Preferably, the packaging unit further includes a second packaging sub-layer located on the side of the first packaging sub-layer away from the array substrate, wherein the second packaging sub-layer is inclined on the side of the isolation structure away from the array substrate and away from the isolation opening;

[0012] Preferably, the orthographic projection of the second encapsulation sublayer on the array substrate is located within the orthographic projection of the first encapsulation sublayer on the array substrate;

[0013] Preferably, the packaging unit further includes a third packaging sub-layer located on the side of the second packaging sub-layer away from the array substrate, wherein the third packaging sub-layer is inclined on the side of the isolation structure away from the array substrate and away from the isolation opening;

[0014] Preferably, the orthographic projection of the third encapsulation sublayer on the array substrate is located within the orthographic projection of the second encapsulation sublayer on the array substrate;

[0015] Preferably, the edging portion is inclined on the side away from the isolation opening;

[0016] Preferably, the side of the edging portion away from the isolation opening includes a stepped surface.

[0017] In some possible implementations, along a direction away from the array substrate, the edge portion of the packaging unit includes a first packaging sublayer and a second packaging sublayer, the sides of the first packaging sublayer and the second packaging sublayer away from the isolation opening being stepped;

[0018] Preferably, the edge portion of the packaging unit further includes a third packaging sub-layer located on the side of the second packaging sub-layer away from the array substrate, and the sides of the second packaging sub-layer and the third packaging sub-layer away from the isolation opening are stepped.

[0019] In some possible implementations, the etching rates of the first encapsulation sublayer, the second encapsulation sublayer, and the third encapsulation sublayer increase sequentially.

[0020] In some possible implementations, the light transmittance of both the first and second encapsulation sublayers is greater than that of the third encapsulation sublayer.

[0021] Preferably, the light transmittance of the first encapsulation sublayer is greater than that of the second encapsulation sublayer.

[0022] In some possible implementations, the thickness of the third encapsulation sublayer is less than the thickness of the first encapsulation sublayer along a direction perpendicular to the array substrate;

[0023] Preferably, the thickness of the third encapsulation sublayer is less than the thickness of the second encapsulation sublayer in a direction perpendicular to the array substrate;

[0024] Preferably, along the direction perpendicular to the array substrate, the ratio of the thickness of the third encapsulation sublayer to the thickness of the first encapsulation sublayer is 1:6 to 1:4;

[0025] Preferably, along the direction perpendicular to the array substrate, the ratio of the thickness of the third encapsulation sublayer to the thickness of the second encapsulation sublayer is 1:5 to 1:3;

[0026] Preferably, along a direction perpendicular to the array substrate, the thickness of the second encapsulation sublayer is less than the thickness of the first encapsulation sublayer;

[0027] Preferably, along the direction perpendicular to the array substrate, the ratio of the thickness of the second encapsulation sublayer to the thickness of the first encapsulation sublayer is 1:2-5:6.

[0028] In some possible implementations, the material of the first encapsulation sublayer includes silicon oxide;

[0029] Preferably, the material of the second encapsulation sublayer includes silicon oxynitride;

[0030] Preferably, the material of the third encapsulation sublayer includes silicon nitride.

[0031] In some possible implementations, there is a gap between the side of the edging portion near the array substrate and the side of the isolation structure away from the array substrate;

[0032] Preferably, adjacent packaging units are spaced apart on the side of the isolation structure away from the array substrate;

[0033] Preferably, the orthographic projection of the packaging unit on the array substrate covers the orthographic projection of the isolation opening on the array substrate.

[0034] In some possible implementations, the light-emitting unit includes a first electrode, a light-emitting portion, and a second electrode, which are at least partially located within the isolation opening and are sequentially stacked in a direction away from the array substrate, wherein the second electrode is electrically connected to the isolation structure;

[0035] The display panel further includes a pixel defining layer located on the side of the first electrode away from the array substrate, and the isolation structure is located on the side of the pixel defining layer away from the array substrate; the pixel defining layer includes pixel openings that expose at least a portion of the first electrode, and the orthographic projection of the isolation structure on the array substrate is located between the orthographic projections of two adjacent pixel openings on the array substrate.

[0036] Preferably, the orthographic projection of the pixel opening on the array substrate is located within the orthographic projection of the isolation opening on the array substrate.

[0037] In some possible implementations, the display panel further includes a second encapsulation layer located on the side of the first encapsulation layer away from the array substrate;

[0038] Preferably, the display panel further includes a third encapsulation layer located on the side of the second encapsulation layer away from the array substrate;

[0039] Preferably, the materials of both the first encapsulation layer and the third encapsulation layer include inorganic materials;

[0040] Preferably, the second encapsulation layer comprises an organic material.

[0041] In some possible implementations, the isolation structure includes a first isolation portion and a second isolation portion stacked sequentially along a direction away from the array substrate, wherein the orthographic projection of the side of the first isolation portion away from the array substrate on the array substrate is located within the orthographic projection of the second isolation portion on the array substrate.

[0042] In some possible implementations, the second electrode of the light-emitting unit is electrically connected to the first isolation portion; and / or, the isolation structure further includes a third isolation portion located on the side of the first isolation portion facing the array substrate, and the second electrode of the light-emitting unit is electrically connected to the third isolation portion;

[0043] Preferably, the material of the third isolation portion includes molybdenum metal; and / or, the material of the first isolation portion includes aluminum metal; and / or, the material of the second isolation portion includes titanium metal.

[0044] In some possible implementations, this application also provides a display panel, the display panel comprising:

[0045] Array substrate;

[0046] An isolation structure located on one side of the array substrate, the isolation structure having an isolation opening;

[0047] The light-emitting unit is located at least partially within the isolation opening;

[0048] A first encapsulation layer located on the side of the light-emitting unit away from the array substrate, the first encapsulation layer comprising a plurality of spaced encapsulation units, at least a portion of the encapsulation units extending from the side of the isolation structure to the side of the isolation structure away from the array substrate, the side of the isolation structure being the surface of the isolation structure facing the isolation opening;

[0049] In the direction away from the array substrate, the packaging unit includes multiple packaging sub-layers stacked sequentially, and the etching rate of the multiple packaging sub-layers increases sequentially in the direction away from the array substrate.

[0050] In some possible implementations, along a direction away from the array substrate, the packaging unit includes a first packaging sublayer and a second packaging sublayer stacked sequentially.

[0051] Preferably, the light transmittance of the first encapsulation sub-layer is greater than the light transmittance of the second encapsulation sub-layer;

[0052] Preferably, the packaging unit further includes a third packaging sublayer located on the side of the second packaging sublayer away from the array substrate;

[0053] The light transmittance of the first encapsulation sublayer and the second encapsulation sublayer is greater than that of the third encapsulation sublayer;

[0054] Preferably, the thickness of the third encapsulation sublayer is less than the thickness of the first encapsulation sublayer in a direction perpendicular to the array substrate;

[0055] Preferably, the thickness of the third encapsulation sublayer is less than the thickness of the second encapsulation sublayer in a direction perpendicular to the array substrate;

[0056] Preferably, along the direction perpendicular to the array substrate, the ratio of the thickness of the third encapsulation sublayer to the thickness of the first encapsulation sublayer is 1:6 to 1:4;

[0057] Preferably, along the direction perpendicular to the array substrate, the ratio of the thickness of the third encapsulation sublayer to the thickness of the second encapsulation sublayer is 1:5 to 1:3;

[0058] Preferably, along a direction perpendicular to the array substrate, the thickness of the second encapsulation sublayer is less than the thickness of the first encapsulation sublayer;

[0059] Preferably, along the direction perpendicular to the array substrate, the ratio of the thickness of the second encapsulation sublayer to the thickness of the first encapsulation sublayer is 1:2-5:6.

[0060] In some possible implementations, this application also provides a method for manufacturing a display panel, the method comprising:

[0061] Provide an array substrate;

[0062] An isolation structure is formed on one side of the array substrate, and the isolation structure is provided with an isolation opening;

[0063] Prepare light-emitting units, with at least a portion of the light-emitting units located within the isolation opening;

[0064] A first encapsulation layer is formed on the side of the light-emitting unit away from the array substrate. The first encapsulation layer includes a plurality of encapsulation units spaced apart. At least a portion of the encapsulation units extend from the side of the isolation structure to the side of the isolation structure away from the array substrate. The side of the isolation structure is the surface of the isolation structure facing the isolation opening. The encapsulation unit includes a cladding portion located on the side of the isolation structure away from the array substrate. The orthographic projection of the portion of the cladding portion away from the array substrate on the array substrate does not exceed the orthographic projection of the portion of the cladding portion close to the array substrate on the array substrate.

[0065] In some possible implementations, this application also provides an electronic device, which includes the display panel described in this application, or a display panel prepared by the method for preparing the display panel described in this application.

[0066] Compared with the prior art, this application has the following beneficial effects:

[0067] This application provides a display panel, a method for manufacturing the display panel, and an electronic device. By placing the orthographic projection of the portion of the edge portion away from the array substrate on the array substrate within the orthographic projection of the portion of the edge portion close to the array substrate on the array substrate, the cathode of the light-emitting unit in the later process can continuously cover the encapsulation unit of the light-emitting unit in the earlier process, thereby better protecting the light-emitting unit in the earlier process and improving the display effect of the display panel. Attached Figure Description

[0068] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0069] Figure 1 A cross-sectional schematic diagram of the display panel during the manufacturing process in the related technology provided in the embodiments of this application;

[0070] Figure 2 A cross-sectional schematic diagram of the display panel in the related technology provided in the embodiments of this application;

[0071] Figure 3 One of the cross-sectional schematic diagrams of the display panel provided in the embodiments of this application;

[0072] Figure 4 One of the cross-sectional schematic diagrams of the display panel provided in the embodiments of this application during the manufacturing process;

[0073] Figure 5 A second cross-sectional schematic diagram of the display panel provided in the embodiments of this application;

[0074] Figure 6 A second cross-sectional schematic diagram of the display panel provided in the embodiments of this application during the manufacturing process;

[0075] Figure 7 A third cross-sectional schematic diagram of the display panel provided in the embodiments of this application;

[0076] Figure 8 A third cross-sectional schematic diagram of the display panel provided in the embodiments of this application during the manufacturing process;

[0077] Figure 9 A cross-sectional schematic diagram of a display panel including a second encapsulation layer provided in an embodiment of this application;

[0078] Figure 10 A cross-sectional schematic diagram of a display panel including a third encapsulation layer provided in an embodiment of this application;

[0079] Figure 11 The isolation structure provided in this application embodiment includes a cross-sectional schematic diagram of a three-layer structure;

[0080] Figure 12 A schematic flowchart illustrating a method for manufacturing a display panel according to an embodiment of this application;

[0081] Figure 13 A cross-sectional schematic diagram showing a first electrode layer formed on one side of an array substrate, provided for an embodiment of this application;

[0082] Figure 14 A cross-sectional schematic diagram showing the formation of a pixel defining material layer on the side of the first electrode layer away from the array substrate, provided for an embodiment of this application;

[0083] Figure 15 A cross-sectional schematic diagram of an isolation structure material layer formed on the side of the pixel defining material layer away from the array substrate, provided in an embodiment of this application;

[0084] Figure 16 A cross-sectional schematic diagram of an etching isolation structure material layer to form an isolation structure provided in an embodiment of this application;

[0085] Figure 17 A cross-sectional schematic diagram of etching a pixel-defining material layer to form a pixel-defining layer, provided in an embodiment of this application;

[0086] Figure 18 This is a cross-sectional schematic diagram of a light-emitting portion formed within an isolation opening, provided as an embodiment of this application.

[0087] Figure 19This is a cross-sectional schematic diagram of a second electrode located within an isolation opening on the side of the light-emitting portion away from the array substrate, provided for an embodiment of this application.

[0088] Reference numerals: 1. Array substrate; 2. Pixel defining layer; 21. Pixel opening; 3. Isolation structure; 31. First isolation portion; 32. Second isolation portion; 33. Third isolation portion; 4. Encapsulation structure; 41. First encapsulation film layer; 42. Second encapsulation film layer; 5. First electrode; 6. Light-emitting portion; 7. Second electrode; 8. Light-emitting unit; 81. First light-emitting unit; 82. Second light-emitting unit; 9. First encapsulation layer; 901. Edge-sealing portion; 91. First encapsulation sublayer; 92. Second encapsulation sublayer; 93. Third encapsulation sublayer; 10. Isolation opening; 11. First encapsulation layer; 12. Second encapsulation layer; 13. Pixel defining material layer; 14. Isolation structure material layer. Detailed Implementation

[0089] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0090] Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely to illustrate selected embodiments of the application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0091] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0092] In the description of this application, it should be noted that the terms "center," "upper," "lower," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product of the invention is in use. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application. In addition, the terms "first," "second," and "third," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0093] It should be noted that, where there is no conflict, different features in the embodiments of this application can be combined with each other.

[0094] Please see Figure 1 In the process of realizing this invention, the inventors discovered the following problems in the related technology. The display panel in the related technology includes an array substrate 1, an isolation structure 3 located on one side of the array substrate 1, a light-emitting unit 8 located within an isolation opening 10 formed by the isolation structure 3, and a first encapsulation layer located on the side of the light-emitting unit 8 away from the array substrate 1. The first encapsulation layer includes an encapsulation structure 4 covering the light-emitting unit 8. The encapsulation structure 4 includes a first encapsulation film layer 41 and a second encapsulation film layer 42 sequentially stacked along a direction away from the array substrate 1, with the first encapsulation film layer 41 contracting inward relative to the second encapsulation film layer 42.

[0095] During the fabrication of the light-emitting unit 8, for example, when the second light-emitting unit is fabricated in the order of the first light-emitting unit and the second light-emitting unit, the cathode of the second light-emitting unit will cover the side of the encapsulation structure 4 of the first light-emitting unit away from the array substrate 1. The cathode of the second light-emitting unit can protect the encapsulation structure 4 of the first light-emitting unit.

[0096] However, since the first encapsulation film layer 41 of the first light-emitting unit shrinks inward relative to the second encapsulation film layer 42, the cathode of the second light-emitting unit cannot continuously cover the encapsulation structure 4 of the first light-emitting unit at the position where the first encapsulation film layer 41 shrinks inward relative to the second encapsulation film layer 42. Therefore, the encapsulation structure 4 of the first light-emitting unit cannot be completely protected, and ultimately the first light-emitting unit cannot be completely protected.

[0097] Please see Figure 2 In subsequent manufacturing processes, since the cathode of the second light-emitting unit cannot completely protect the encapsulation structure 4 of the first light-emitting unit, the first light-emitting unit may be damaged, preventing the cathode of the first light-emitting unit from properly connecting with the corresponding isolation structure 3, thereby affecting the display effect of the display panel.

[0098] In view of this, this embodiment provides a solution to improve the display effect of the display panel, and the solution provided in this embodiment will be described in detail below.

[0099] Please see Figure 3 This embodiment provides a display panel, which includes an array substrate 1, an isolation structure 3, a light-emitting unit 8, and a first encapsulation layer 9.

[0100] The array substrate 1 may include a substrate and a plurality of driving units located on one side of the substrate, each driving unit may include one or more semiconductor switching devices. The semiconductor switching devices may be formed by the combination of multiple film layers in the array substrate 1; for example, the semiconductor switching devices may be thin-film transistors formed by the combination of multiple film layers.

[0101] The isolation structure 3 is located on one side of the array substrate 1, and the isolation structure 3 is provided with an isolation opening 10.

[0102] The composition and preparation of the isolation structure 3 are further described in patents PCT / CN2023 / 134518, 202310759370.2, 202310740412.8, 202310707209.0, 202311346196.5, 202311499823.9, 202310731471.9, and 202311091555.7 for reference.

[0103] At least some of the light-emitting units 8 are located within the isolation opening 10. The light-emitting unit 8 may include a first light-emitting unit and a second light-emitting unit. The first light-emitting unit and the second light-emitting unit emit different colors. For example, the first light-emitting unit may emit red light, and the second light-emitting unit may emit green light.

[0104] The first encapsulation layer 9 is located on the side of the light-emitting unit 8 away from the array substrate 1. The first encapsulation layer 9 includes a plurality of encapsulation units spaced apart. At least some of the encapsulation units extend from the side of the isolation structure 3 to the side of the isolation structure 3 away from the array substrate 1. The side of the isolation structure 3 is the surface of the isolation structure 3 facing the isolation opening 10.

[0105] The packaging unit includes a cladding portion 901 located on the side of the isolation structure 3 away from the array substrate 1. The orthographic projection of the portion of the cladding portion 901 away from the array substrate 1 on the array substrate 1 does not exceed the orthographic projection of the portion of the cladding portion 901 close to the array substrate 1 on the array substrate 1.

[0106] Please see Figure 4According to the manufacturing sequence of the first light-emitting unit 81 and the second light-emitting unit 82, since the orthographic projection of the portion of the packaging unit 901 away from the array substrate 1 in the pre-process is located within the orthographic projection of the portion of the packaging unit 901 near the array substrate 1 on the array substrate 1, that is, along the direction perpendicular to the array substrate 1, in all cross-sections of the packaging unit 901 along the direction parallel to the array substrate 1, the orthographic projection of the cross-section on the side away from the array substrate 1 is located within the orthographic projection of the cross-section on the side near the array substrate 1. Therefore, the second electrode 7 of the second light-emitting unit 82 in the post-process can continuously cover the packaging unit corresponding to the first light-emitting unit 81 at the position of the packaging portion 901, and the cathode of the second light-emitting unit 82 can completely cover the packaging unit of the first light-emitting unit 81, thereby providing complete protection for the first light-emitting unit 81. Thus, the packaging unit of the first light-emitting unit 81 is not easily damaged when the second light-emitting unit 82 in the post-processing is prepared, and the first light-emitting unit 81 is not easily damaged. Therefore, the cathode of the first light-emitting unit can be better connected with the corresponding isolation structure 3.

[0107] If there is a third light-emitting unit in the subsequent process of the second light-emitting unit 82, the principle is the same as that of the first light-emitting unit 81. The second light-emitting unit 82 is not easily damaged, and the cathode of the second light-emitting unit 82 can also be well connected with the corresponding isolation structure 3.

[0108] If there is no subsequent third light-emitting unit in the processing of the second light-emitting unit 82, the second light-emitting unit 82 will not be damaged, and the cathode of the second light-emitting unit 82 can also be well connected with the corresponding isolation structure 3. In this way, the cathodes of all light-emitting units 8 of the display panel can be effectively connected with the corresponding isolation structure 3.

[0109] Based on the above design, this embodiment places the orthographic projection of the portion of the edge portion 901 away from the array substrate 1 on the array substrate 1 within the orthographic projection of the portion of the edge portion 901 close to the array substrate 1 on the array substrate 1. This allows the cathode of the light-emitting unit 8 in the later process to continuously cover the packaging unit of the light-emitting unit 8 in the earlier process, thereby providing better protection for the light-emitting unit 8 in the earlier process and improving the display effect of the display panel.

[0110] In some possible implementations, please refer again. Figure 3The light-emitting unit 8 includes a first electrode 5, a light-emitting part 6, and a second electrode 7, which are at least partially located within the isolation opening 10 and are sequentially stacked in a direction away from the array substrate 1. The second electrode 7 is electrically connected to the isolation structure 3. The display panel also includes a pixel defining layer 2 located on the side of the first electrode 5 away from the array substrate 1. The isolation structure 3 is located on the side of the pixel defining layer 2 away from the array substrate 1. The pixel defining layer 2 includes a pixel opening 21 that exposes at least a portion of the first electrode 5. The orthographic projection of the isolation structure 3 on the array substrate 1 is located between the orthographic projections of two adjacent pixel openings 21 on the array substrate 1. The orthographic projection of the pixel opening 21 on the array substrate 1 is located within the orthographic projection of the isolation opening 10 on the array substrate 1.

[0111] When forming the light-emitting functional layer, the light-emitting functional layer is separated by the isolation structure 3 to form multiple spaced light-emitting parts 6. When forming the second electrode layer, the second electrode layer is separated by the isolation structure 3 to form multiple spaced second electrodes 7. The isolation structure 3 includes a conductive material, and the second electrodes 7 are electrically connected to the isolation structure 3. A first electrode 5, a light-emitting part 6, and a second electrode 7 form a light-emitting unit 8. Among them, the first electrode 5 is the anode, and the second electrode 7 is the cathode.

[0112] In some possible implementations, there is a gap between the side of the edge portion 901 near the array substrate 1 and the side of the isolation structure 3 away from the array substrate 1, adjacent packaging units are spaced apart on the side of the isolation structure 3 away from the array substrate 1, and the orthographic projection of the packaging unit on the array substrate 1 covers the orthographic projection of the isolation opening 10 on the array substrate 1.

[0113] During the patterning process of the light-emitting unit 8, the first encapsulation layer 9 is disconnected at the isolation structure 3 to form an encapsulation unit. The encapsulation unit can completely and independently encapsulate the corresponding light-emitting unit 8, thereby improving the display characteristics of the display panel.

[0114] In some possible implementations, please refer again. Figure 3 and Figure 4Along the direction away from the array substrate 1, the packaging unit includes a first packaging sub-layer 91. The first packaging sub-layer 91 is located on the side of the isolation structure 3 away from the array substrate 1 and is inclined away from the side of the isolation opening 10. The packaging unit also includes a second packaging sub-layer 92 located on the side of the first packaging sub-layer 91 away from the array substrate 1. The second packaging sub-layer 92 is located on the side of the isolation structure 3 away from the array substrate 1 and is inclined away from the side of the isolation opening 10. The orthographic projection of the second packaging sub-layer 92 on the array substrate 1 is located within the orthographic projection of the first packaging sub-layer 91 on the array substrate 1. The packaging unit also includes a third packaging sub-layer 93 located on the side of the second packaging sub-layer 92 away from the array substrate 1. The third packaging sub-layer 93 is located on the side of the isolation structure 3 away from the array substrate 1 and is inclined away from the side of the isolation opening 10. The orthographic projection of the third packaging sub-layer 93 on the array substrate 1 is located within the orthographic projection of the second packaging sub-layer 92 on the array substrate 1.

[0115] In this way, the cathode of the second light-emitting unit 82 in the post-processing stage can more easily and continuously cover the packaging unit corresponding to the first light-emitting unit 81 at the edge 901 position, and the cathode of the second light-emitting unit 82 can more easily and completely cover the packaging unit of the first light-emitting unit 81, thereby providing more complete protection for the first light-emitting unit 81.

[0116] In some embodiments, please refer again Figure 3 and Figure 4 The edge portion is inclined away from the isolation opening 10. In this embodiment, the cathode of the second light-emitting unit 82 in the post-processing stage can continuously cover the encapsulation unit corresponding to the first light-emitting unit 81 at the edge portion 901.

[0117] In other embodiments, please refer to Figure 5 and Figure 6 The side of the edge portion away from the isolation opening 10 includes a stepped surface, and the portions of the first encapsulation sublayer 91, the second encapsulation sublayer 92, and the third encapsulation sublayer 93 located on the side of the isolation structure 3 away from the array substrate 1 are inclined away from the side of the isolation opening 10. In this embodiment, the cathode of the second light-emitting unit 82 in the later process can continuously cover the encapsulation unit corresponding to the first light-emitting unit 81 at the position of the edge portion 901.

[0118] In some other embodiments, please refer to Figure 7 and Figure 8 The side of the edge portion away from the isolation opening 10 includes a stepped surface, and the first encapsulation sublayer 91, the second encapsulation sublayer 92, and the third encapsulation sublayer 93 are vertically arranged on the side of the isolation structure 3 away from the array substrate 1 and away from the isolation opening 10. In this embodiment, the cathode of the second light-emitting unit 82 in the later process can continuously cover the encapsulation unit corresponding to the first light-emitting unit 81 at the position of the edge portion 901.

[0119] Preferably, along the direction away from the array substrate 1, the packaging unit includes a first packaging sublayer 91, a second packaging sublayer 92 and a third packaging sublayer 93 stacked sequentially, and the etching rates of the first packaging sublayer 91, the second packaging sublayer 92 and the third packaging sublayer 93 increase sequentially.

[0120] Since the etching rates of the first encapsulation sublayer 91, the second encapsulation sublayer 92, and the third encapsulation sublayer 93 increase sequentially, the third encapsulation sublayer 93 will shrink inward relative to the second encapsulation sublayer 92 when etching the first encapsulation layer 9, and the second encapsulation sublayer 92 will shrink inward relative to the first encapsulation sublayer 91. Since the first encapsulation sublayer 91, the second encapsulation sublayer 92, and the third encapsulation sublayer 93 are stacked sequentially in a direction away from the array substrate 1, after the light-emitting unit 8 is fabricated, the orthographic projection of the portion of the encapsulation unit's edge 901 away from the array substrate 1 on the array substrate 1 is located within the orthographic projection of the portion of the edge 901 close to the array substrate 1 on the array substrate 1. This also makes it easier for the side of the edge 901 away from the isolation opening 10 to form an inclined surface, so that the second electrode 7 of the second light-emitting unit 82 in the subsequent process, such as the cathode, can continuously cover the encapsulation unit corresponding to the first light-emitting unit 81 at the position of the edge 901. The cathode of the second light-emitting unit 82 can completely cover the encapsulation unit of the first light-emitting unit 81, thereby providing complete protection for the first light-emitting unit 81. In this way, the packaging unit of the first light-emitting unit 81 is not easily damaged when the second light-emitting unit 82 in the post-processing is manufactured, so that the cathode of the first light-emitting unit can be better connected with the corresponding isolation structure 3, and ultimately the light-emitting unit 8 of the display panel is less likely to fail.

[0121] In some possible implementations, the light transmittance of the first encapsulation sublayer 91 and the second encapsulation sublayer 92 is greater than that of the third encapsulation sublayer 93, and the light transmittance of the first encapsulation sublayer 91 is greater than that of the second encapsulation sublayer 92.

[0122] The material of the packaging unit in the related technology can be made only of the material of the third packaging sub-layer 93. The light transmittance of the material of the third packaging sub-layer 93 is not good enough, which will affect the optical characteristics of the display panel in the related technology.

[0123] In this embodiment, since the material of some encapsulation units is replaced with the first encapsulation sub-layer 91 and the second encapsulation sub-layer 92 with better transmittance, this embodiment can not only better guarantee the morphology of the encapsulation unit and make the light-emitting unit 8 less prone to failure, but also improve the light transmittance of the encapsulation unit, and ultimately improve the optical characteristics of the display panel.

[0124] In some possible implementations, please refer again. Figure 3Along the direction perpendicular to the array substrate 1, the thickness H3 of the third packaging sublayer 93 is less than the thickness H1 of the first packaging sublayer 91.

[0125] Since the light transmittance of the third encapsulation sublayer 93 is less than that of the first encapsulation sublayer 91, making the third encapsulation sublayer thinner than the first encapsulation sublayer 91 can increase the proportion of the film layer with higher light transmittance in the encapsulation unit, thereby further improving the light transmittance of the encapsulation unit.

[0126] Specifically, the ratio of the thickness H3 of the third encapsulation sublayer 93 to the thickness H1 of the first encapsulation sublayer 91 is 1:6 to 1:4. For example, the ratio of thickness H3 to thickness H1 can be 1:4, 1:5, or 1:6. By reasonably setting the ratio of thickness H3 to thickness H1, the light transmittance of the encapsulation unit can be improved without increasing the thickness of the encapsulation unit and ensuring the quality of the encapsulation unit.

[0127] Preferably, please see again. Figure 3 Along the direction perpendicular to the array substrate 1, the thickness H3 of the third encapsulation sublayer 93 is less than the thickness H2 of the second encapsulation sublayer 92.

[0128] Since the light transmittance of the third encapsulation sublayer 93 is less than that of the second encapsulation sublayer 92, making the third encapsulation sublayer thinner than the second encapsulation sublayer 92 can increase the proportion of the film layer with higher light transmittance in the encapsulation unit, thereby further improving the light transmittance of the encapsulation unit.

[0129] Specifically, the ratio of the thickness H3 of the third encapsulation sublayer 93 to the thickness H2 of the second encapsulation sublayer 92 is 1:5 to 1:3. For example, the ratio of thickness H3 to thickness H2 can be 1:3, 1:4, or 1:5. By reasonably setting the ratio of thickness H3 to thickness H2, the light transmittance of the encapsulation unit can be improved without increasing the thickness of the encapsulation unit and ensuring the quality of the encapsulation unit.

[0130] Preferably, please see again. Figure 3 Along the direction perpendicular to the array substrate 1, the thickness H2 of the second encapsulation sublayer 92 is less than the thickness of the first encapsulation sublayer 91H1.

[0131] Since the light transmittance of the second encapsulation sublayer 92 is less than that of the first encapsulation sublayer 91, making the second encapsulation sublayer thinner than the first encapsulation sublayer 91 can increase the proportion of the film layer with higher light transmittance in the encapsulation unit, thereby further improving the light transmittance of the encapsulation unit.

[0132] Specifically, the ratio of the thickness H2 of the second encapsulation sublayer 92 to the thickness H1 of the first encapsulation sublayer 91 is 1:2-5:6. For example, the ratio of thickness H2 to thickness H1 can be 3:4, 3:5, 1:2, 4:5, 2:3, or 5:6, etc. By appropriately setting the ratio of thickness H2 to thickness H1, the light transmittance of the encapsulation unit can be improved without increasing the thickness of the encapsulation unit or ensuring the quality of the encapsulation unit.

[0133] Preferably, the material of the first encapsulation sublayer 91 includes silicon oxide, the material of the second encapsulation sublayer 92 includes silicon oxynitride, and the material of the third encapsulation sublayer 93 includes silicon nitride. By appropriately setting the materials of the first encapsulation sublayer 91, the second encapsulation sublayer 92, and the third encapsulation sublayer 93, the display effect and quality of the display panel can be improved.

[0134] For some possible implementations, please refer to Figure 9 and Figure 10 The display panel also includes a second encapsulation layer 11 located on the side of the first encapsulation layer 9 away from the array substrate 1 and a third encapsulation layer 12 located on the side of the second encapsulation layer 11 away from the array substrate 1. The materials of the first encapsulation layer 9 and the third encapsulation layer 12 both include inorganic materials, and the second encapsulation layer 11 includes organic materials.

[0135] The second encapsulation layer 11 and the third encapsulation layer 12 can achieve a better encapsulation effect on the light-emitting unit 8, thereby further improving the encapsulation quality of the display panel.

[0136] In some possible implementations, please refer again. Figure 10 The isolation structure 3 includes a first isolation portion 31 and a second isolation portion 32 stacked sequentially along the direction away from the array substrate 1. The orthographic projection of the side of the first isolation portion 31 away from the array substrate 1 on the array substrate 1 is located within the orthographic projection of the second isolation portion 32 on the array substrate 1.

[0137] Since the second isolation portion 32 is located on the side of the first isolation portion 31 away from the array substrate 1, and the lateral width of the second isolation portion 32 is greater than the lateral width of the first isolation portion 31, the second isolation portion 32 will disconnect the light-emitting functional layer and the second electrode layer at the isolation structure 3. In this way, the isolation structure 3 formed by the first isolation portion 31 and the second isolation portion 32 can more easily make each light-emitting unit 8 independently packaged.

[0138] In some possible implementations, please refer again. Figure 10 The second electrode 7 of the light-emitting unit 8 is electrically connected to the first isolation part 31. The first isolation part 31 includes a conductive material, and the second electrode 7 corresponding to the light-emitting unit 8 extends to contact the side wall of the first isolation part 31 so as to realize the electrical connection between the second electrode 7 corresponding to the light-emitting unit 8 and the first isolation part 31.

[0139] Please see Figure 11 The isolation structure 3 also includes a third isolation section 33 located on the side of the first isolation section 31 facing the array substrate 1, and the second electrode 7 of the light-emitting unit 8 is electrically connected to the third isolation section 33.

[0140] The third isolation section 33 includes a conductive material, and the second electrode 7 corresponding to the light-emitting unit 8 extends to contact the side wall of the third isolation section 33 so as to achieve electrical connection between the second electrode 7 corresponding to the light-emitting unit 8 and the third isolation section 33.

[0141] Specifically, the material of the third isolation portion 33 includes molybdenum metal; and / or, the material of the first isolation portion 31 includes aluminum metal; and / or, the material of the second isolation portion 32 includes titanium metal. Thus, when the isolation structure 3 isolates the second electrode layer into the second electrode 7, the second electrode 7 is more easily electrically connected to the first isolation portion 31 and / or the third isolation portion 33.

[0142] In some possible implementations, please refer again. Figure 3 and Figure 4 This application also provides a display panel, which includes an array substrate 1, an isolation structure 3, a light-emitting unit 8, and a first encapsulation layer 9.

[0143] The isolation structure 3 is located on one side of the array substrate 1. The isolation structure 3 is provided with an isolation opening 10, and at least some of the light-emitting units 8 are located in the isolation opening 10.

[0144] The first encapsulation layer 9 is located on the side of the light-emitting unit 8 away from the array substrate 1. The first encapsulation layer 9 includes a plurality of encapsulation units spaced apart. At least some of the encapsulation units extend from the side of the isolation structure 3 to the side of the isolation structure 3 away from the array substrate 1. The side of the isolation structure 3 is the surface of the isolation structure 3 facing the isolation opening 10.

[0145] In the direction away from the array substrate 1, the packaging unit includes multiple packaging sub-layers stacked in sequence, and the etching rate of the multiple packaging sub-layers increases sequentially in the direction away from the array substrate 1.

[0146] In the direction away from the array substrate 1, the packaging unit includes a first packaging sublayer 91, a second packaging sublayer 92, and a third packaging sublayer 93 stacked sequentially. The etching rates of the first packaging sublayer 91, the second packaging sublayer 92, and the third packaging sublayer 93 increase sequentially.

[0147] Since the etching rates of the first encapsulation sublayer 91, the second encapsulation sublayer 92, and the third encapsulation sublayer 93 increase sequentially, when etching the first encapsulation layer 9, the third encapsulation sublayer 93 will shrink inward relative to the second encapsulation sublayer 92, and the second encapsulation sublayer 92 will shrink inward relative to the first encapsulation sublayer 91. Since the first encapsulation sublayer 91, the second encapsulation sublayer 92, and the third encapsulation sublayer 93 are stacked sequentially in a direction away from the array substrate 1, after the light-emitting unit 8 is fabricated, the side of the encapsulation unit's edge portion 901 facing the isolation opening 10 will form an inclined surface that slopes away from the isolation opening 10.

[0148] Please see again Figure 4 Because the edge portion 901 of the packaging unit in the pre-process is inclined towards the side of the isolation opening 10, the cathode of the second light-emitting unit 82 in the post-process can continuously cover the corresponding packaging unit of the first light-emitting unit 81 at the edge portion 901. The cathode of the second light-emitting unit 82 can completely cover the packaging unit of the first light-emitting unit 81, thus providing complete protection for the packaging unit of the first light-emitting unit 81. Therefore, the packaging unit of the first light-emitting unit 81 is less likely to be damaged during the fabrication of the second light-emitting unit 82 in the post-process, and consequently, the first light-emitting unit 81 is less likely to be damaged. Thus, the cathode of the first light-emitting unit 81 can better overlap with the corresponding isolation structure 3.

[0149] If there is a third light-emitting unit in the subsequent process of the second light-emitting unit 82, the principle is the same as that of the first light-emitting unit 81. The second light-emitting unit 82 is not easily damaged, and the cathode of the second light-emitting unit 82 can also be well connected with the corresponding isolation structure 3.

[0150] If there is no subsequent third light-emitting unit in the process of manufacturing the second light-emitting unit 82, the second light-emitting unit 82 will not be damaged, and the cathode of the second light-emitting unit 82 can also be well connected with the corresponding isolation structure 3. In this way, the cathodes of all light-emitting units 8 of the display panel can be effectively connected with the corresponding isolation structure 3, thereby improving the display effect of the display panel.

[0151] In summary, by tilting the edge portion 901 of the encapsulation unit toward the side of the isolation opening 10, this application allows the cathode of the back-process light-emitting unit 8 to continuously cover the front-process light-emitting unit 8, thereby providing better protection for the front-process light-emitting unit 8 and improving the display effect of the display panel.

[0152] For some possible implementations, please refer to Figure 12 This application also provides a method for manufacturing a display panel, the method comprising:

[0153] S10: Provide an array substrate 1.

[0154] The array substrate 1 may include a substrate and a plurality of driving units located on one side of the substrate, each driving unit may include one or more semiconductor switching devices. The semiconductor switching devices may be formed by the combination of multiple film layers in the array substrate 1; for example, the semiconductor switching devices may be thin-film transistors formed by the combination of multiple film layers.

[0155] S11: An isolation structure 3 is formed on one side of the array substrate 1, and the isolation structure 3 is provided with an isolation opening 10.

[0156] Please see Figure 13 A first electrode layer is formed on one side of the array substrate 1, and the first electrode layer includes a plurality of first electrodes 5 spaced apart.

[0157] Please see Figure 14 A pixel defining material layer 13 is formed on the side of the first electrode layer away from the array substrate 1.

[0158] Please see Figure 15 An isolation structure material layer 14 is formed on the side of the pixel defining material layer 13 away from the array substrate 1.

[0159] Please see Figure 16 The isolation structure material layer 14 is etched to form the isolation structure 3.

[0160] Please see Figure 17 The pixel defining material layer 13 is etched to form a pixel defining layer 2, which includes a pixel opening 21 that exposes at least a portion of the first electrode 5. The orthographic projection of the isolation structure 3 on the array substrate 1 is located between the orthographic projections of two adjacent pixel openings 21 on the array substrate 1. The orthographic projection of the pixel opening 21 on the array substrate 1 is located within the orthographic projection of the isolation opening 10 on the array substrate 1.

[0161] S12: Prepare light-emitting units 8, with at least a portion of the light-emitting units 8 located within the isolation opening 10.

[0162] Please see Figure 18 A light-emitting part 6 is formed inside the isolation opening 10.

[0163] The light-emitting functional layer is broken at the isolation structure 3, so that at least part of the light-emitting functional layer is located in the isolation opening 10 to form the light-emitting part 6. By controlling the evaporation angle, the light-emitting part 6 can be prevented from contacting the isolation structure 3.

[0164] Please see Figure 19 A second electrode 7 is formed on the side of the light-emitting part 6 away from the array substrate 1, located within the isolation opening 10.

[0165] The second electrode layer is broken at the isolation structure 3, so that at least part of the second electrode layer is located within the isolation opening 10 to form the second electrode 7. By controlling the evaporation angle, the second electrode 7 can extend from the isolation opening 10 to make electrical contact with the isolation structure 3, so as to connect adjacent second electrodes 7 or connect the second electrode 7 to other circuits. In this way, the manufacturing difficulty of the display panel can be reduced.

[0166] S13: A first encapsulation layer 9 is formed on the side of the light-emitting unit 8 away from the array substrate 1. The first encapsulation layer 9 includes a plurality of encapsulation units spaced apart. At least a portion of the encapsulation units extend from the side of the isolation structure 3 to the side of the isolation structure 3 away from the array substrate 1. The side of the isolation structure 3 is the surface of the isolation structure 3 facing the isolation opening 10. The encapsulation unit includes an edge portion 901 located on the side of the isolation structure 3 away from the array substrate 1. The orthographic projection of the portion of the edge portion 901 away from the array substrate 1 on the array substrate 1 does not exceed the orthographic projection of the portion of the edge portion 901 close to the array substrate 1 on the array substrate 1.

[0167] Please see again Figure 4 During the formation of the light-emitting unit 8 and the packaging unit, since the orthographic projection of the portion of the packaging unit 901 away from the array substrate 1 does not exceed the orthographic projection of the portion of the packaging unit 901 close to the array substrate 1, that is, along the direction perpendicular to the array substrate 1, in all cross-sections of the packaging portion 901 along the direction parallel to the array substrate 1, the orthographic projection of the cross-section away from the array substrate 1 is located within the orthographic projection of the cross-section close to the array substrate 1. Therefore, the second electrode 7 of the second light-emitting unit 82 in the subsequent process, such as the cathode, can continuously cover the packaging unit corresponding to the first light-emitting unit 81 at the position of the packaging portion 901. The cathode of the second light-emitting unit 82 can completely cover the packaging unit of the first light-emitting unit 81, thereby providing complete protection for the first light-emitting unit 81. Thus, it is not easy to damage the packaging unit of the first light-emitting unit 81 when fabricating the second light-emitting unit 82 in the subsequent process, and therefore it is not easy to damage the first light-emitting unit 81. As a result, the cathode of the first light-emitting unit 81 can be better connected with the corresponding isolation structure 3. The final display panel formed by the above method is as follows: Figure 3 As shown, this illustrates the display effect of the display panel formed using this method.

[0168] In some possible implementations, this application also provides an electronic device that includes the display panel described in this application, or includes a display panel prepared by the method described in this application. This electronic device may include a device with image processing capabilities, such as a server, personal computer, laptop computer, etc. Because this electronic device includes the display panel described in this application, its display effect is better.

[0169] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0170] The embodiments described above are merely illustrative of several implementations of the present invention, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these all fall within the protection scope of the present invention. Therefore, the protection scope of this invention patent should be determined by the appended claims.

Claims

1. A display panel, characterized in that, The display panel includes: Array substrate; An isolation structure located on one side of the array substrate, the isolation structure having an isolation opening; The light-emitting unit is located at least partially within the isolation opening; A first encapsulation layer located on the side of the light-emitting unit away from the array substrate, the first encapsulation layer comprising a plurality of encapsulation units spaced apart; The encapsulation unit includes an edge portion located on the side of the isolation structure away from the array substrate. The orthographic projection of the portion of the edge portion away from the array substrate on the array substrate does not exceed the orthographic projection of the portion of the edge portion close to the array substrate on the array substrate. The encapsulation unit includes a first encapsulation sublayer, a second encapsulation sublayer, and a third encapsulation sublayer stacked sequentially along a direction away from the array substrate. The light transmittance of the first encapsulation sublayer is greater than that of the third encapsulation sublayer. Along a direction perpendicular to the array substrate, the thickness of the third encapsulation sublayer is less than that of the first encapsulation sublayer.

2. The display panel according to claim 1, characterized in that, The first encapsulation sublayer is located on the side of the isolation structure away from the array substrate and is inclined away from the side of the isolation opening; The second encapsulation sublayer is located on the side of the isolation structure away from the array substrate and is inclined away from the side of the isolation opening; The third encapsulation sublayer is located on the side of the isolation structure away from the array substrate and is inclined away from the side of the isolation opening.

3. The display panel according to claim 1, characterized in that, The orthographic projection of the second encapsulation sublayer on the array substrate is located within the orthographic projection of the first encapsulation sublayer on the array substrate; The orthographic projection of the third encapsulation sublayer on the array substrate is located within the orthographic projection of the second encapsulation sublayer on the array substrate.

4. The display panel according to claim 1, characterized in that, The edging portion is inclined on the side away from the isolation opening, or the side of the edging portion away from the isolation opening includes a stepped surface.

5. The display panel according to claim 1, characterized in that, The first encapsulation sublayer extends from the side of the isolation structure to the side of the isolation structure away from the array substrate, and the side of the isolation structure is the face of the isolation structure facing the isolation opening.

6. The display panel according to claim 1, characterized in that, The sides of the first and second encapsulation sublayers away from the isolation opening are stepped; The second and third encapsulation sublayers have stepped sides away from the isolation opening.

7. The display panel according to claim 1, characterized in that, The etching rates of the first encapsulation sublayer, the second encapsulation sublayer, and the third encapsulation sublayer increase sequentially.

8. The display panel according to claim 1, characterized in that, The light transmittance of the second encapsulation sub-layer is greater than that of the third encapsulation sub-layer; The light transmittance of the first encapsulation sublayer is greater than that of the second encapsulation sublayer.

9. The display panel according to any one of claims 1-8, characterized in that, Along a direction perpendicular to the array substrate, the thickness of the third encapsulation sublayer is less than the thickness of the second encapsulation sublayer; Along a direction perpendicular to the array substrate, the thickness of the second encapsulation sublayer is less than the thickness of the first encapsulation sublayer.

10. The display panel according to claim 9, characterized in that, Along a direction perpendicular to the array substrate, the ratio of the thickness of the third encapsulation sublayer to the thickness of the first encapsulation sublayer is 1:6 to 1:4; Along a direction perpendicular to the array substrate, the ratio of the thickness of the third encapsulation sublayer to the thickness of the second encapsulation sublayer is 1:5 to 1:3; Along a direction perpendicular to the array substrate, the ratio of the thickness of the second encapsulation sublayer to the thickness of the first encapsulation sublayer is 1:2-5:

6.

11. The display panel according to any one of claims 1-8, characterized in that, The material of the first encapsulation sublayer includes silicon oxide; The material of the second encapsulation sublayer includes silicon oxynitride; The material of the third encapsulation sublayer includes silicon nitride.

12. The display panel according to any one of claims 1-8, characterized in that, There is a gap between the side of the edging portion near the array substrate and the side of the isolation structure away from the array substrate; The adjacent packaging units are spaced apart on the side of the isolation structure away from the array substrate; The orthographic projection of the packaging unit on the array substrate covers the orthographic projection of the isolation opening on the array substrate.

13. The display panel according to any one of claims 1-8, characterized in that, The light-emitting unit includes a first electrode, a light-emitting part, and a second electrode, which are at least partially located within the isolation opening and are sequentially stacked in a direction away from the array substrate. The second electrode is electrically connected to the isolation structure. The display panel further includes a pixel defining layer located on the side of the first electrode away from the array substrate, and the isolation structure is located on the side of the pixel defining layer away from the array substrate; the pixel defining layer includes pixel openings that expose at least a portion of the first electrode, and the orthographic projection of the isolation structure on the array substrate is located between the orthographic projections of two adjacent pixel openings on the array substrate. The orthographic projection of the pixel opening on the array substrate lies within the orthographic projection of the isolation opening on the array substrate.

14. The display panel according to any one of claims 1-8, characterized in that, The display panel further includes a second encapsulation layer located on the side of the first encapsulation layer away from the array substrate; The display panel further includes a third encapsulation layer located on the side of the second encapsulation layer away from the array substrate; Both the first encapsulation layer and the third encapsulation layer are made of inorganic materials; The second encapsulation layer comprises organic materials.

15. The display panel according to any one of claims 1-8, characterized in that, The isolation structure includes a first isolation portion and a second isolation portion stacked sequentially along a direction away from the array substrate, wherein the orthographic projection of the side of the first isolation portion away from the array substrate on the array substrate is located within the orthographic projection of the second isolation portion on the array substrate.

16. The display panel according to claim 15, characterized in that, The second electrode of the light-emitting unit is electrically connected to the first isolation portion; and / or, the isolation structure further includes a third isolation portion located on the side of the first isolation portion facing the array substrate, and the second electrode of the light-emitting unit is electrically connected to the third isolation portion; The material of the third isolation part includes molybdenum metal; and / or, the material of the first isolation part includes aluminum metal; and / or, the material of the second isolation part includes titanium metal.

17. A display panel, characterized in that, The display panel includes: Array substrate; An isolation structure located on one side of the array substrate, the isolation structure having an isolation opening; The light-emitting unit is located at least partially within the isolation opening; A first encapsulation layer located on the side of the light-emitting unit away from the array substrate, the first encapsulation layer comprising a plurality of encapsulation units spaced apart; In the direction away from the array substrate, the packaging unit includes multiple packaging sub-layers stacked sequentially. The etching rate of the multiple packaging sub-layers increases sequentially in the direction away from the array substrate. The packaging unit includes a first packaging sub-layer, a second packaging sub-layer, and a third packaging sub-layer stacked sequentially in the direction away from the array substrate. The light transmittance of the first packaging sub-layer is greater than that of the third packaging sub-layer. In the direction perpendicular to the array substrate, the thickness of the third packaging sub-layer is less than that of the first packaging sub-layer.

18. The display panel according to claim 17, characterized in that, The light transmittance of the first encapsulation sublayer is greater than that of the second encapsulation sublayer; The light transmittance of the first encapsulation sublayer and the second encapsulation sublayer is greater than that of the third encapsulation sublayer.

19. The display panel according to claim 17, characterized in that, Along a direction perpendicular to the array substrate, the thickness of the third encapsulation sublayer is less than the thickness of the second encapsulation sublayer; Along a direction perpendicular to the array substrate, the thickness of the second encapsulation sublayer is less than the thickness of the first encapsulation sublayer.

20. The display panel according to claim 19, characterized in that, Along a direction perpendicular to the array substrate, the ratio of the thickness of the third encapsulation sublayer to the thickness of the first encapsulation sublayer is 1:6 to 1:4; Along a direction perpendicular to the array substrate, the ratio of the thickness of the third encapsulation sublayer to the thickness of the second encapsulation sublayer is 1:5 to 1:3; Along a direction perpendicular to the array substrate, the ratio of the thickness of the second encapsulation sublayer to the thickness of the first encapsulation sublayer is 1:2-5:

6.

21. The display panel according to claim 17, characterized in that, The first encapsulation sublayer extends from the side of the isolation structure to the side of the isolation structure away from the array substrate, and the side of the isolation structure is the face of the isolation structure facing the isolation opening.

22. A method for manufacturing a display panel, characterized in that, The method includes: Provide an array substrate; An isolation structure is formed on one side of the array substrate, and the isolation structure is provided with an isolation opening; Prepare light-emitting units, with at least a portion of the light-emitting units located within the isolation opening; A first encapsulation layer is formed on the side of the light-emitting unit away from the array substrate, and the first encapsulation layer includes a plurality of encapsulation units spaced apart. The encapsulation unit includes a cladding portion located on the side of the isolation structure away from the array substrate. The orthographic projection of the portion of the cladding portion away from the array substrate on the array substrate does not exceed the orthographic projection of the portion of the cladding portion close to the array substrate on the array substrate. The encapsulation unit includes a first encapsulation sublayer, a second encapsulation sublayer, and a third encapsulation sublayer stacked sequentially along a direction away from the array substrate. The light transmittance of the first encapsulation sublayer is greater than that of the third encapsulation sublayer. Along a direction perpendicular to the array substrate, the thickness of the third encapsulation sublayer is less than that of the first encapsulation sublayer.

23. An electronic device, characterized in that, The electronic device includes a display panel as described in any one of claims 1-21, or includes a display panel prepared by the method for preparing a display panel as described in claim 22.

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