Semiconductor device

Abstract

An optical device (1) has a feedthrough substrate (2). The feed-through substrate (2) is connected with one end of the flexible substrate (3). The cover (4) covers one end of the flexible substrate (3). The feed-through substrate (2) has a second wiring pattern (8) joined to the first wiring pattern (12) by solder (13) at one end of the flexible substrate (3). Guide slopes (15a, 15b) are provided on the inner surface of the cover (4).

Description

Technical Field

[0001] The present disclosure relates to a semiconductor device with a flexible substrate. Background Art

[0002] A semiconductor device is used in which one end of a flexible substrate is joined to a feedthrough substrate of an optical device by soldering, and the other end of the flexible substrate is connected to an inspection jig or a circuit substrate (for example, see Patent Document 1).

[0003] Patent Document 1: Japanese Patent Application Publication No. 2000-77122

[0004] When mounting a semiconductor device on an inspection jig or substrate, there is a problem that the flexible substrate is bent sharply near the solder joint, causing the flexible substrate to break. In recent years, the thickness of the flexible substrate has increased, and the stress applied is large, which makes it easy to break. Summary of the invention

[0005] The present disclosure has been made to solve the above-mentioned problems, and an object of the present disclosure is to obtain a semiconductor device capable of preventing disconnection of a flexible substrate.

[0006] The semiconductor device disclosed herein is characterized by comprising: a flexible substrate; an optical device having a feedthrough substrate connected to one end of the flexible substrate; and a cover covering the one end of the flexible substrate, wherein the flexible substrate has a first wiring pattern, the feedthrough substrate has a second wiring pattern connected to the first wiring pattern at the one end of the flexible substrate by solder, and a guide slope is provided on the inner surface of the cover.

[0007] In the present disclosure, a cover is covered on one end of the flexible substrate to be soldered, and a guide slope is provided on the inner surface of the cover. Therefore, the flexible substrate is gently bent along the guide slope. Therefore, the flexible substrate will not bend sharply near the solder joint, so that disconnection can be prevented. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] Figure 1 This is a perspective view showing the semiconductor device according to the first embodiment.

[0009] Figure 2 This is an enlarged cross-sectional view of a solder joint portion of the semiconductor device according to the first embodiment.

[0010] Figure 3 It is a cross-sectional view showing the cover according to the first embodiment.

[0011] Figure 4 This is a front view showing the cover according to the first embodiment.

[0012] Figure 5 This is a cross-sectional view showing a usage state of the semiconductor device according to the first embodiment.

[0013] Figure 6 It is an enlarged cross-sectional view of a solder joint portion of a semiconductor device according to a comparative example.

[0014] Figure 7 This is an enlarged cross-sectional view of a solder joint portion of the semiconductor device according to the second embodiment. DETAILED DESCRIPTION

[0015] The semiconductor device according to the embodiment will be described with reference to the drawings. The same reference numerals are given to the same or corresponding components, and repeated description may be omitted.

[0016] Implementation Method 1

[0017] Figure 1 1 is a perspective view showing a semiconductor device according to Embodiment 1. An optical device 1 for optical communication includes a feedthrough substrate 2. The feedthrough substrate 2 is connected to one end of a flexible substrate 3. A cover 4 covers one end of the flexible substrate 3.

[0018] The optical device 1 includes a bracket 5, a laser diode chip 6 disposed on the bracket 5, and a lens 7 in addition to a feedthrough substrate 2. A wiring pattern 8 is disposed on the feedthrough substrate 2. The wiring pattern 8 is connected to a wiring pattern 9 of the bracket 5 via a lead 10. The wiring pattern 9 is connected to the laser diode chip 6 via a lead 11. The output light of the laser diode chip 6 is collected by the lens 7.

[0019] Figure 2 This is an enlarged cross-sectional view of a solder joint portion of the semiconductor device according to the first embodiment. Figure 3 1 is a cross-sectional view showing a cover according to Embodiment 1. A wiring pattern 12 is provided on the surface of the flexible substrate 3. A wiring pattern 8 is provided on the upper surface of the feedthrough substrate 2. The wiring pattern 8 is bonded to the wiring pattern 12 at one end of the flexible substrate 3 by solder 13. The wiring pattern 12 and the wiring pattern 8 are, for example, copper patterns, and are wiring patterns in which ground patterns are arranged on both sides of signal wiring for passing high-frequency signals.

[0020] The cover 4 includes a cover upper portion 4a and a cover lower portion 4b that clamp the flexible substrate 3 from above and below. The inner surface of the cover upper portion 4a is the lower surface of the cover upper portion 4a, and includes a flat portion 14a that contacts the back surface of the flexible substrate 3, and a guide slope 15a that is arranged at a position closer to the other end of the feedthrough substrate 2 than the flat portion 14a. On the inner surface of the cover upper portion 4a, there is no corner between the guide slope 15a and the flat portion 14a, and the guide slope 15a and the flat portion 14a are smoothly connected. The inner surface of the cover lower portion 4b is the upper surface of the cover lower portion 4b, and includes a flat portion 14b that contacts the surface of the flexible substrate 3, and a guide slope 15b that is arranged at a position closer to the other end of the feedthrough substrate 2 than the flat portion 14b. On the inner surface of the cover lower portion 4b, there is no corner between the guide slope 15b and the flat portion 14b, and the guide slope 15b and the flat portion 14b are smoothly connected. The guide slopes 15a and 15b are smooth curved surfaces without corners. The flat portion 14a and the flat portion 14b face each other and are parallel to each other.

[0021] The flexible substrate 3 is inserted into the space between the cover upper portion 4a and the cover lower portion 4b. Since the guide slopes 15a and 15b are provided on the inner surface of the cover 4, the interval between the cover upper portion 4a and the cover lower portion 4b widens from one end toward the other end of the flexible substrate 3. In addition, only one of the guide slopes 15a and 15b may be provided.

[0022] Cover upper portion 4a of cover 4 also covers the upper portion of feedthrough substrate 2 at the solder joint portion. However, if cover 4 covers both upper and lower portions of feedthrough substrate 2, the product becomes too large, so cover 4 covers only the upper side of feedthrough substrate 2.

[0023] Figure 4 1 is a front view showing a cover according to Embodiment 1. The cover 4 has a hinge 16 connecting the cover upper portion 4a and the cover lower portion 4b at one side of the cover 4, and a hook 17 for attaching the cover upper portion 4a and the cover lower portion 4b to be detachable at the other side of the cover 4. After the hook 17 is removed and one end of the flexible substrate 3 is accommodated between the cover upper portion 4a and the cover lower portion 4b, the cover 4 can be covered at one end of the flexible substrate 3 by locking the hook 17. The cover 4 can be removed arbitrarily by using the hinge 16 and the hook 17. Therefore, the cover 4 can be removed and reused after the flexible substrate 3 is fixed to the feedthrough substrate 2.

[0024] Figure 5 1 is a cross-sectional view showing a use state of the semiconductor device according to Embodiment 1. An inspection jig (not shown) for generating a test signal or a circuit board (not shown) for generating a signal to be provided to the optical device 1 is mounted on the other end of the flexible substrate 3. At this time, the flexible substrate 3 is gently bent along the guide slope 15a.

[0025] Next, the effects of the present embodiment will be described in comparison with the comparative example. Figure 61 is an enlarged cross-sectional view of a solder joint portion of a semiconductor device according to a comparative example. The flexible substrate 3 and the feedthrough substrate 2 are fixed by a reinforcing resin 18. However, since the flexible substrate 3 is bent near the fixing portion, the breakage of the flexible substrate 3 cannot be fully prevented.

[0026] On the other hand, in the present embodiment, the cover 4 is covered on the end of the flexible substrate 3 to be soldered, and the guide slopes 15a and 15b are provided on the inner surface of the cover 4. Therefore, the flexible substrate 3 is gently bent along the guide slope 15a or the guide slope 15b. Therefore, the flexible substrate 3 is not sharply bent near the solder joint, so that the wire breakage can be prevented. In addition, there is no need to use a special material for the flexible substrate 3 for preventing the wire breakage, and the existing material can be used, so there is no influence on the high-frequency characteristics of the flexible substrate 3.

[0027] In order to prevent short circuit, the cover 4 is made of an insulator such as resin. However, in order to prevent external interference, the cover 4 is preferably made of a radio wave absorber. The radio wave absorber is, for example, a resin mixture containing metal powder. The metal powder is, for example, natural shungite ore pulverized powder.

[0028] Implementation Method 2

[0029] Figure 7 This is an enlarged cross-sectional view of the solder joint of the semiconductor device according to Embodiment 2. The insert member 19 is inserted into the cover 4 to press the flexible substrate 3 against the guide slope 15a. This can fix the curved shape of the flexible substrate 3. The other structures and effects are the same as those of Embodiment 1.

[0030] Description of Reference Numerals

[0031] 1…optical device; 2…feedthrough substrate; 3…flexible substrate; 4…cover; 4a…cover upper portion; 4b…cover lower portion; 8…wiring pattern; 12…wiring pattern; 13…solder; 14a, 14b…flat portion; 15a, 15b…guide slope; 16…hinge; 17…hook; 19…insertion component.

Claims

1. A semiconductor device, characterized in that: have: Flexible substrates; an optical device having a feed-through substrate connected to one end of the flexible substrate; and a cover covering the one end of the flexible substrate, The flexible substrate has a first wiring pattern, The feedthrough substrate has a second wiring pattern joined to the first wiring pattern by solder at the one end of the flexible substrate, A guide slope is arranged on the inner surface of the cover.

2. The semiconductor device according to claim 1, wherein: The inner surface of the cover has a flat portion in contact with the flexible substrate, The guide slope is arranged at a position closer to the other end side of the feedthrough substrate than the flat portion.

3. The semiconductor device according to claim 2, wherein: In the inner surface of the cover, there is no corner portion between the guide slope and the flat portion.

4. The semiconductor device according to any one of claims 1 to 3, characterized in that The cover comprises an upper cover portion and a lower cover portion for clamping the flexible substrate from above and below. The interval between the cover upper portion and the cover lower portion increases from the one end of the flexible substrate toward the other end of the flexible substrate.

5. The semiconductor device according to claim 4, wherein: The cover includes a hinge connecting the cover upper portion and the cover lower portion at one side surface of the cover, and a hook detachably attaching the cover upper portion and the cover lower portion at the other side surface of the cover.

6. The semiconductor device according to any one of claims 1 to 5, wherein: The flexible substrate is bent along the guide slope.

7. The semiconductor device according to claim 6, wherein: An insertion member is provided, the insertion member being inserted into the cover to press the flexible substrate against the guide slope to fix the curved shape of the flexible substrate.

8. The semiconductor device according to any one of claims 1 to 7, wherein: The material of the cover is a radio wave absorber.

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