Preparation method of Balliin coating for non-airtight packaging circuit

Abstract

The invention discloses a preparation method of a BALIN coating for a non-airtight packaging circuit, and belongs to the technical field of circuit packaging, the central position of a pipe cap to be packaged is punched, then the packaging of the circuit is completed, the circuit is installed in a circular mold with a closed lower end, a pipe shell is sealed, a lower pin of the pipe shell is protected from being coated with a coating, and the packaging of the circuit is completed. The method comprises the following steps: putting a mold into a deposition chamber in a BALIN vapor deposition device for deposition, preparing a BALIN coating in a circuit through a vapor deposition technology, taking out the mold after deposition is finished, removing sealing treatment, cutting off coating burrs on the periphery of the circuit, and finally preparing the BALIN coating in the circuit through the vapor deposition technology. And the final quality of products is ensured.

Description

Technical Field

[0001] The invention belongs to the technical field of circuit packaging, and in particular relates to a method for preparing a balinin coating for a non-airtight packaging circuit. Background Art

[0002] Parylene coating (also known as Parylene coating, Parylene coating), prepared by vacuum vapor deposition technology of monomer para-xylene dimer and its derivatives, is a new type of uniform, transparent and dense polymer material with excellent electrical insulation properties, physical and mechanical properties, moisture and mildew resistance, and good isolation and protection functions. It has great application prospects in many fields of the electronics industry, such as electronic circuit components, microelectronic integrated circuits, micro-electromechanical systems and hybrid integrated circuits.

[0003] At present, domestically produced non-sealed circuits are sealed with epoxy glue to ensure that the quality and reliability of internal components of hybrid circuits are effectively guaranteed during storage, transportation, and use. However, due to the performance of the materials used, the circuit has air leakage, which causes the components to absorb moisture, thus affecting the performance of the device. The use of Balin coating technology in non-airtight packaged circuits can effectively solve the problem of failure of internal components of the circuit due to moisture, but there are two problems in the application of this technology: (1) Protection of the back pins and conductors of non-airtight packaged circuits: Balin coating is formed by single-molecule polymerization in a vacuum chamber. Because gaseous particles can penetrate everywhere and there are holes in the tube shell of non-airtight circuits, the protection of the back pins and conductors needs to be solved before the preparation of Balin coating; (2) Non-airtight packaged circuits are sealed inside the circuit by bonding the package cap with epoxy resin glue. Experiments have shown that the protection method of coating first and then sealing the cap has problems with the bonding strength of the package cap in mechanical impact assessment. Summary of the invention

[0004] The invention provides a method for preparing a balinine coating for a non-airtight packaging circuit, which solves the problems in the background technology.

[0005] To achieve the above object, the present invention provides the following technical solutions: A method for preparing a balinin coating for a non-airtight packaging circuit, comprising: Fixing the substrate with components mounted on it in the inner cavity of the tube shell; Punch a hole at the center of the tube cap to be packaged; Bonding the packaging cap to the substrate to complete the circuit packaging; The circuit is installed in a circular mold with a closed lower end, and the tube shell is sealed; placing the mold into a deposition chamber in a Balinin vapor deposition device to perform deposition; After the deposition is completed, the mold is taken out, the sealing process is removed, and the coating burrs around the circuit are cut off.

[0006] Preferably, the center of the tube cap to be packaged is punched with a laser, and the hole size is 300-400um.

[0007] Preferably, the sealing process for the tube shell is specifically as follows: The tube shell is sealed using a nitrile rubber ring and a nitrile sealing plug. The nitrile rubber ring is used to seal the gap between the circuit shell and the inner cavity of the mold, and the nitrile sealing plug is inserted into the circular hole on the tube shell from bottom to top.

[0008] Preferably, one end of the deposition chamber in the Balinin vapor deposition equipment is connected to the cracking furnace and the sublimation furnace in sequence, and the other end is connected to the cold trap and the vacuum pump in sequence.

[0009] Preferably, during the deposition process, the mass of a single charge in the sublimation furnace is not less than 60 g, and Balinim F is used as the raw material.

[0010] Preferably, the temperature of the sample sublimation furnace of the Balinin vapor deposition equipment is set to 170°C-180°C.

[0011] Preferably, the temperature of the cracking reaction chamber is set to 670° C.-680° C., and the temperature of the deposition chamber is room temperature.

[0012] Preferably, the Balinin F powder is vaporized in a sublimation furnace and then decomposed in a cracking furnace, and then enters a room temperature deposition chamber to react and produce a Balinin coating.

[0013] Preferably, the Balinin F powder enters through the hole at the center of the tube cap after being cracked.

[0014] Preferably, epoxy resin adhesive is used to complete the bonding of the tube cap to be packaged.

[0015] Compared with the prior art, the present invention has the following beneficial effects: the present invention provides a method for preparing a balinin coating for a non-airtight packaging circuit, a hole is punched at the center of a tube cap to be packaged, and then the circuit is packaged, the circuit is installed in a circular mold with a closed lower end, and the tube shell is sealed to protect the lower pins of the tube shell from being coated, the mold is placed in a deposition chamber in a balinin vapor deposition device, deposition is performed, and a balinin coating is prepared inside the circuit by vapor deposition technology, the coating has excellent performance and provides comprehensive protection for the circuit, and after the deposition is completed, the mold is taken out, the sealing process is released, and the coating burrs around the circuit are cut off to ensure the final quality of the product.

[0016] Furthermore, the pore size is 300-400um, which can control the air intake and thus the thickness of the deposited layer; on the other hand, after the deposition is completed, the deposited coating can just achieve the purpose of plugging the pores, thereby preventing excess matter from entering the circuit chamber. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 This is a flow chart of a method for preparing a balinin coating for a non-airtight packaging circuit according to the present invention; Figure 2 It is a sealing schematic diagram of the non-airtight packaged circuit of the present invention; Figure 3 It is a Balinin vapor deposition equipment.

[0018] In the figure, 1-packaging tube cap; 2-sealing rubber ring; 3-mold; 4-tube shell; 5-sealing plug; 6-components, 7-sublimation furnace; 8-cracking furnace; 9-deposition chamber, 10-cold trap; 11-vacuum pump. DETAILED DESCRIPTION

[0019] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Generally, the components of the embodiments of the present invention described and shown in the drawings here can be arranged and designed in various different configurations.

[0020] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the invention claimed for protection, but merely represents selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0021] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0022] In the description of the embodiments of the present invention, it should be noted that if the terms "upper", "lower", "horizontal", "inner", etc. indicate an orientation or positional relationship based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship in which the product of the invention is usually placed when in use, it is only for the convenience of describing the present invention and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention. In addition, the terms "first", "second", etc. are only used to distinguish the description, and cannot be understood as indicating or implying relative importance.

[0023] In addition, if the term "horizontal" appears, it does not mean that the component must be absolutely horizontal, but can be slightly tilted. For example, "horizontal" only means that its direction is more horizontal than "vertical", which does not mean that the structure must be completely horizontal, but can be slightly tilted.

[0024] In the description of the embodiments of the present invention, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "set", "install", "connect", and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal connection of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0025] In order to enable those skilled in the art to better understand the technical solution of the present invention, the present invention will be further described in detail below with reference to the accompanying drawings.

[0026] like Figure 1 As shown, the present invention provides a method for preparing a balinine coating for a non-airtight packaged circuit, comprising: Fix the substrate with components mounted on it in the inner cavity of the tube shell, specifically, fix it on the lower pin tube shell with adhesive (the circuit pin is located below the tube shell); Punch a hole at the center of the tube cap to be packaged; Bonding the packaging cap to the substrate to complete the circuit packaging; The circuit is installed in a circular mold with a closed lower end, and the tube shell is sealed; The mold is placed in a deposition chamber in a Balinim vapor deposition apparatus for deposition.

[0027] After the deposition is completed, the mold is taken out, the sealing process is removed, and the coating burrs around the circuit are cut off.

[0028] The center of the tube cap to be packaged is laser-drilled with a hole size of 300-400um.

[0029] The specific sealing treatment of the tube shell is as follows: The tube shell is sealed using a nitrile rubber ring and a nitrile sealing plug. The nitrile rubber ring is used to seal the gap between the circuit shell and the inner cavity of the mold, and the nitrile sealing plug is inserted into the circular hole on the tube shell from bottom to top.

[0030] One end of the deposition chamber in the Balinin vapor deposition equipment is connected to a cracking furnace and a sublimation furnace in sequence, and the other end is connected to a cold trap and a vacuum pump in sequence.

[0031] During the deposition process, the single charge mass in the sublimation furnace was not less than 60 g, and Balinim F was used as the raw material.

[0032] The temperature of the sample sublimation furnace of the Balinin vapor deposition equipment was set to 170°C-180°C.

[0033] The temperature of the cracking reaction chamber was set at 670°C-680°C, and the temperature of the deposition chamber was room temperature.

[0034] The Balinin F powder is vaporized in a sublimation furnace and then decomposed in a cracking furnace, and then enters a room temperature deposition chamber to react and produce a Balinin coating.

[0035] The Balinin F powder enters through the hole at the center of the tube cap after being cracked.

[0036] Use epoxy resin adhesive to complete the bonding of the tube cap to be packaged.

[0037] Example 1 1. A method for preparing a balinine coating for a non-airtight packaging circuit, comprising the following steps: 2. Fix the substrate with mounted components in the inner cavity of the tube shell.

[0038] 3. Use laser to drill a hole in the center of the tube cap to be packaged, with a hole size of 320um.

[0039] 4. Use epoxy resin adhesive to bond the packaging cap to the substrate to complete the circuit packaging.

[0040] 5. Install the circuit in a circular mold with a closed lower end, and use a nitrile rubber ring and a nitrile sealing plug to seal the tube shell. The nitrile rubber ring is used to seal the gap between the circuit shell and the inner cavity of the mold, and the nitrile sealing plug is inserted into the circular hole on the tube shell from bottom to top.

[0041] 6. Place the mold into the deposition chamber of the Balinin vapor deposition equipment, one end of the deposition chamber is connected to the cracking furnace and the sublimation furnace, and the other end is connected to the cold trap and the vacuum pump.

[0042] 7. During the deposition process, the single charge mass in the sublimation furnace was 70 g, and Balin F was used as the raw material. The sublimation furnace temperature was set to 175°C, the pyrolysis reaction chamber temperature was set to 675°C, and the deposition chamber temperature was room temperature.

[0043] 8. After the Balinin F powder is vaporized in the sublimation furnace, it enters the cracking furnace for decomposition, and then enters the room temperature deposition chamber through the hole at the center of the tube cap to react and form a Balinin coating.

[0044] 9. After deposition, take out the mold, remove the sealing process, and cut off the coating burrs around the circuit.

[0045] Example 2 A method for preparing a balinin coating for a non-airtight packaging circuit comprises the following steps: 1. Fix the substrate with components mounted on it in the inner cavity of the tube shell.

[0046] 2. Use laser to drill a hole in the center of the tube cap to be packaged, with a hole diameter of 400um.

[0047] 3. Use epoxy resin adhesive to bond the packaging cap to the substrate to complete the circuit packaging.

[0048] 4. Install the circuit in a circular mold with a closed lower end, and seal the tube shell with a nitrile rubber ring and a nitrile sealing plug.

[0049] 5. Place the mold into the deposition chamber of the Balinin vapor deposition equipment, which is connected to a cracking furnace, a sublimation furnace, a cold trap and a vacuum pump.

[0050] 6. During the deposition process, the single charge mass in the sublimation furnace was 80 g, and Balin F was used as the raw material. The sublimation furnace temperature was set to 180°C, the pyrolysis reaction chamber temperature was set to 680°C, and the deposition chamber temperature was room temperature.

[0051] 7. After the Balinin F powder is vaporized in the sublimation furnace, it enters the cracking furnace for decomposition, and then enters the deposition chamber through the hole in the center of the tube cap to react and form a Balinin coating.

[0052] 8. After deposition, take out the mold, remove the sealing process, and cut off the coating burrs around the circuit.

[0053] Example 3 A method for preparing a balinin coating for a non-airtight packaging circuit comprises the following steps: 1. Fix the substrate with components mounted on it in the inner cavity of the tube shell.

[0054] 2. Use laser to drill two holes in the center of the tube cap to be packaged, with a hole diameter of 300um.

[0055] 3. Use epoxy resin adhesive to bond the packaging cap to the substrate to complete the circuit packaging.

[0056] 4. Install the circuit in a circular mold with a closed lower end, and seal the tube shell with a nitrile rubber ring and a nitrile sealing plug.

[0057] 5. Place the mold into the deposition chamber of the Balinin vapor deposition equipment, which is connected to a cracking furnace, a sublimation furnace, a cold trap and a vacuum pump.

[0058] 6. During the deposition process, the single charge mass in the sublimation furnace was 60 g, and Balin F was used as the raw material. The temperature of the sublimation furnace was set to 170°C, the temperature of the pyrolysis reaction chamber was set to 670°C, and the temperature of the deposition chamber was room temperature.

[0059] 7. After the Balinin F powder is vaporized in the sublimation furnace, it enters the cracking furnace for decomposition, and then enters the deposition chamber through the hole in the center of the tube cap to react and form a Balinin coating.

[0060] 8. After deposition, take out the mold, remove the sealing process, and cut off the coating burrs around the circuit.

[0061] The present invention successfully realizes the balin coating of the airtight packaged circuit through reasonable mold design and process arrangement, realizes the effective protection of the components and bonding wires inside the circuit, and improves the water vapor resistance and quality stability of the circuit.

[0062] Although the embodiments of the present invention are described above in conjunction with the accompanying drawings, the present invention is not limited to the above-mentioned specific embodiments and application fields, and the above-mentioned specific embodiments are only illustrative and instructive, rather than restrictive. Under the guidance of the specification, a person skilled in the art can also make many forms without departing from the scope of protection of the claims of the present invention, all of which belong to the scope of protection of the present invention.

Claims

1. A method for preparing a balinine coating for a non-airtight packaging circuit, characterized in that: include: Fixing the substrate with components mounted on it in the inner cavity of the tube shell; Punch a hole at the center of the tube cap to be packaged; Bonding the packaging cap to the substrate to complete the circuit packaging; The circuit is installed in a circular mold with a closed lower end, and the tube shell is sealed; placing the mold into a deposition chamber in a Balinin vapor deposition device to perform deposition; After the deposition is completed, the mold is taken out, the sealing process is removed, and the coating burrs around the circuit are cut off.

2. The method for preparing a balinine coating for a non-airtight packaging circuit according to claim 1, characterized in that: The center of the tube cap to be packaged is laser-drilled with a hole size of 300-400um.

3. The method for preparing a balinin coating for a non-airtight packaging circuit according to claim 1, characterized in that: The specific sealing treatment of the tube shell is as follows: The tube shell is sealed using a nitrile rubber ring and a nitrile sealing plug. The nitrile rubber ring is used to seal the gap between the circuit shell and the inner cavity of the mold, and the nitrile sealing plug is inserted into the circular hole on the tube shell from bottom to top.

4. The method for preparing a balinin coating for a non-airtight packaging circuit according to claim 1, characterized in that: One end of the deposition chamber in the Balinin vapor deposition equipment is connected to a cracking furnace and a sublimation furnace in sequence, and the other end is connected to a cold trap and a vacuum pump in sequence.

5. The method for preparing a balinine coating for a non-airtight packaging circuit according to claim 4, characterized in that: During the deposition process, the single charge mass in the sublimation furnace was not less than 60 g, and Balinim F was used as the raw material.

6. The method for preparing a balinin coating for a non-airtight packaging circuit according to claim 5, characterized in that: The temperature of the sample sublimation furnace of the Balinin vapor deposition equipment was set to 170°C-180°C.

7. The method for preparing a balinin coating for a non-airtight packaging circuit according to claim 6, characterized in that: The temperature of the cracking reaction chamber was set at 670°C-680°C, and the temperature of the deposition chamber was room temperature.

8. The method for preparing a balinin coating for a non-airtight packaging circuit according to claim 7, characterized in that: The Balinin F powder is vaporized in a sublimation furnace and then decomposed in a cracking furnace, and then enters a room temperature deposition chamber to react and produce a Balinin coating.

9. The method for preparing a balinin coating for a non-airtight packaging circuit according to claim 8, characterized in that: The Balinin F powder enters through the hole at the center of the tube cap after being cracked.

10. The method for preparing a balinin coating for a non-airtight packaging circuit according to claim 1, characterized in that: Use epoxy resin adhesive to complete the bonding of the tube cap to be packaged.

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