Constant-energy laser-assisted curved surface processing method and system

Abstract

The invention belongs to the technical field of ultra-precision machining, and discloses a constant-energy laser-assisted curved surface machining method and system.The method comprises the steps that the inclination angle between a laser beam and an incident plane is adjusted, and the laser beam is made to be emitted out of the front tool face of a diamond tool; based on the curved surface machining cutting track, the acting position of a diamond cutter arc in each machining site is determined, and the laser beam offset distance is obtained; laser focus position compensation is conducted based on the laser beam offset distance, so that any machining site obtains laser assistance; a mapping relation model between the laser power and the material softening temperature corresponding to different machining sites is obtained through simulation; acquiring actual laser power required by all processing sites based on the mapping relation model; and according to the actual laser power, all the machining sites of the to-be-machined area are sequentially subjected to laser-assisted machining. By means of the method, the effect of improving the surface quality and surface shape precision of machining of the hard, brittle and difficult-to-machine material curved surface optical element can be achieved.

Description

Technical Field

[0001] The present application belongs to the field of ultra-precision machining, and more specifically, to a constant energy laser-assisted surface machining method and system. Background Art

[0002] Materials such as single crystal silicon and fused quartz are typical hard and brittle materials that are difficult to process due to their high hardness, high brittleness and low fracture toughness. When they are processed using traditional cutting methods, the brittle fracture of the material leads to poor surface quality and severe sub-surface loss. In addition, the large cutting force and unstable cutting during the brittle removal process lead to severe tool wear, making it difficult to achieve high-precision processing of large-diameter complex curved optical components. With the development and popularization of laser technology, laser in-situ assisted processing technology has become an important method for high-precision processing of hard and brittle materials. It mainly uses single-point diamond cutting technology to achieve plastic removal of materials, thereby improving the processing surface quality and reducing tool wear.

[0003] The existing laser in-situ assisted cutting technology has two major technical bottlenecks in curved surface processing. First, the laser beam is fixed to the center of the diamond tool arc, while the actual cutting point in curved surface processing continuously changes at different positions of the tool edge, resulting in a lack of effective laser assistance in most processing areas. The main reason is that the arc structure of the back tool face makes it difficult to control the optical path, and the energy utilization rate of the backward emission mode is low. Secondly, when using constant speed processing, as the tool moves toward the center of the workpiece, the scanning line speed gradually decreases, causing a sharp increase in heat accumulation under constant laser power, and large local temperature fluctuations, which not only cause uneven softening of the material and ablation defects, but also a large amount of heat accumulation leads to the risk of graphitization of the diamond tool. These two problems together lead to large deviations in the surface accuracy of curved surface components and increased depth of sub-surface damage, which seriously restricts the improvement of the processing quality of optical components. In short, from the perspective of existing technologies, there is currently no suitable processing method for ultra-precision processing of curved surface optical components made of hard, brittle and difficult-to-process materials. Summary of the invention

[0004] In view of the defects of the prior art, the purpose of this application is to provide a constant energy laser-assisted surface processing method, which aims to solve the problem that the existing laser in-situ assisted cutting technology is prone to cause large surface accuracy deviation of curved components and deep sub-surface damage depth, making it difficult to achieve high-precision and low-damage manufacturing.

[0005] To achieve the above objectives, in a first aspect, the present application provides a constant energy laser-assisted surface processing method, comprising: S1 adjusts the inclination angle between the laser beam and the incident surface so that the laser beam is emitted from the rake face of the diamond tool; determines the action position of the diamond tool arc in each processing position based on the surface processing cutting trajectory, and obtains the laser beam offset distance; performs laser focus position compensation based on the laser beam offset distance, so that any processing position can obtain laser assistance; S2 simulates and obtains the mapping relationship model between the laser power and the material softening temperature corresponding to different processing positions; based on the mapping relationship model, the actual laser power required for all processing positions is obtained; S3 performs laser-assisted processing on all processing positions in the processing area in sequence according to the actual laser power.

[0006] Furthermore, the following relationship model is used to adjust the inclination angle between the laser beam and the incident surface so that the laser is emitted from the rake face of the diamond tool:

[0007] in, β is the laser incident angle, L is the diamond tool length, a is the distance from the upper end of the laser incident surface to the cutting edge of the diamond tool, n is the refractive index of diamond.

[0008] Furthermore, the method for compensating the laser focus position based on the laser beam offset distance is: S101 establishes the XY distance relationship model of the diamond tool edge arc; S102 obtains the compensation value of the laser focus in the Y direction after the laser beam is offset in the X direction according to the XY distance relationship model of the diamond tool edge arc; S103 controls the laser beam to move in the Y direction according to the compensation value so that the laser beam coincides with the position to be processed.

[0009] Furthermore, the diamond tool edge arc XY distance relationship model is expressed as the following model:

[0010] in, dx is the laser beam offset distance in the X direction, dy It is the compensation value of laser focus in Y direction.

[0011] Furthermore, the method for obtaining the laser power of all processing positions in the area to be processed based on the mapping relationship model is: S201 outputs the material softening temperature corresponding to each processing point based on the mapping relationship model; S202 compares the softening temperature of the material with the corresponding ideal softening temperature to determine whether the laser power at the current processing position meets the softening requirements: if so, the current laser power is retained as the actual laser power; if not, the laser power is adjusted until the laser power that meets the softening requirements is obtained and the adjustment is stopped.

[0012] Furthermore, the laser power is dynamically matched with the cutting trajectory of the diamond tool in real time until the constant energy assisted processing of all processing positions is completed.

[0013] According to a second aspect of the present application, a system for implementing the constant energy laser-assisted surface processing method as described in any one of the above is also provided, the system comprising: A laser beam adjustment module, used for adjusting the inclination angle between the laser beam and the incident surface, so that the laser beam is emitted from the rake face of the diamond tool; A laser beam offset distance acquisition module is used to determine the action position of the diamond tool arc in each processing position based on the surface processing cutting trajectory to obtain the laser beam offset distance; A laser focus position compensation module, used for performing laser focus position compensation based on the laser beam offset distance, so that any processing position can obtain laser assistance; A laser beam energy control module is used to simulate and obtain a mapping relationship model between the laser power and the material softening temperature corresponding to different processing locations; and is also used to obtain the actual laser power required for all processing locations based on the mapping relationship model; A laser processing module, used for sequentially performing laser-assisted processing on all processing positions in the processing area according to the actual laser power; The multi-directional displacement automatic adjustment platform is used to integrate the laser beam adjustment module, the laser beam offset distance acquisition module, the laser focus position compensation module, the laser beam energy regulation module and the laser processing module to form a closed-loop control system.

[0014] In a third aspect, the present application provides an electronic device comprising: at least one memory for storing programs; and at least one processor for executing the programs stored in the memory. When the program stored in the memory is executed, the processor is used to execute the method described in the first aspect or any possible implementation of the first aspect.

[0015] In a third aspect, the present application provides a computer-readable storage medium, which stores a computer program. When the computer program runs on a processor, the processor executes the method described in the first aspect or any possible implementation of the first aspect.

[0016] In a fourth aspect, the present application provides a computer program product. When the computer program product runs on a processor, the processor executes the method described in the first aspect or any possible implementation of the first aspect.

[0017] It can be understood that the beneficial effects of the second to fourth aspects mentioned above can be found in the relevant description of the first aspect mentioned above, and will not be repeated here.

[0018] In general, the above technical solutions conceived by this application have the following beneficial effects compared with the prior art: (1) The constant energy laser-assisted surface processing provided in this application enables the laser beam to be emitted from the front cutting edge. Compared with the traditional emission from the back cutting edge, it breaks through the optical path control limitation of the arc structure of the back cutting edge, and its energy utilization rate is greatly improved. Based on the constant propagation direction characteristic of the laser, a coordinated control algorithm of the beam offset and focus compensation is developed to achieve real-time matching of the laser posture and the cutting point of the tool edge during the processing process, ensuring that any processing position obtains effective laser assistance, solving the problems of surface accuracy deviation and sub-surface damage caused by insufficient local softening of hard and brittle material surface components, and improving the surface quality and surface accuracy of hard and brittle difficult-to-process surface optical components.

[0019] (2) The laser in-situ assisted processing technology provided in this application establishes a dynamic mapping model of processing position-scanning speed-laser power, and compensates for the linear velocity attenuation caused by the centripetal motion of the tool by real-time power adjustment, thereby maintaining a constant laser energy per unit area; by constructing a workpiece temperature field distribution model, laser energy is obtained to avoid uneven material softening or thermal damage that occurs in traditional constant power processing, thereby significantly improving the quality and integrity of the processed surface.

[0020] (3) The laser in-situ assisted processing system of the present application retains the original processing system. It only needs to improve the laser beam control device in the original in-situ laser assisted cutting system, replace the traditional single manual displacement platform with a multi-directional displacement automatic adjustment platform, and cooperate with various modules for realizing laser beam posture control and laser beam energy control to realize the laser in-situ assisted processing technology provided by the present application. The overall system structure is simple and can realize real-time tracking of the laser beam and the cutting position, avoiding adverse effects on the original processing process. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a schematic diagram of the process of the constant energy laser assisted surface processing method provided in the embodiment of the present application; Figure 2 It is a schematic diagram of the structure of a device for realizing constant energy laser-assisted curved surface processing provided in an embodiment of the present application; Figure 3 It is a schematic diagram of the structure of a diamond tool provided in an embodiment of the present application, in which a laser beam is emitted from the front cutting face of the tool; Figure 4 is a schematic diagram of optical simulation of a laser beam emitted from a rake face of a tool provided in an embodiment of the present application; Figure 5 It is a schematic diagram of optical simulation of a laser beam emitted from the rake face of a diamond tool after being offset by a certain distance, provided in an embodiment of the present application; Figure 6is a schematic diagram of laser focus position compensation provided in an embodiment of the present application; Figure 7 It is a schematic diagram of the laser beam energy regulation process in the constant energy laser-assisted surface machining process provided in an embodiment of the present application; Figure 8 It is a schematic diagram of the structure of an electronic device provided in an embodiment of the present application.

[0022] Throughout the drawings, the same reference numerals are used to denote the same elements or structures, wherein: 100-displacement platform, 101-beam shaping device, 102-laser beam, 103-diamond tool, 104-X-axis piezoelectric nano-displacement platform, 105-Y-axis piezoelectric nano-displacement platform, 106-position controller, 107-laser controller; 500-laser beam, 501-diamond tool, 502-workpiece to be processed, 503-processing center position, 504-laser beam after offset, 505-processing other positions. DETAILED DESCRIPTION

[0023] In order to make the purpose, technical solution and advantages of the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0024] The term "and / or" in this article is a description of the association relationship of associated objects, indicating that there can be three relationships. For example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone. The symbol " / " in this article indicates that the associated objects are in an or relationship, for example, A / B means A or B.

[0025] The terms "first" and "second" in the specification and claims herein are used to distinguish different objects rather than to describe a specific order of the objects. For example, a first response message and a second response message are used to distinguish different response messages rather than to describe a specific order of the response messages.

[0026] In the embodiments of the present application, words such as "exemplary" or "for example" are used to indicate examples, illustrations or descriptions. Any embodiment or design described as "exemplary" or "for example" in the embodiments of the present application should not be interpreted as being more preferred or more advantageous than other embodiments or designs. Specifically, the use of words such as "exemplary" or "for example" is intended to present related concepts in a specific way.

[0027] In the description of the embodiments of the present application, unless otherwise specified, "multiple" means two or more than two. For example, multiple processing units refer to two or more processing units, etc.; multiple elements refer to two or more elements, etc.

[0028] For ease of understanding, the English abbreviations and related technical terms involved in the embodiments of the present application are explained and described below.

[0029] The present application provides a constant energy laser assisted surface processing method, such as Figure 1 As shown, the following steps are included: S1 first controls the laser beam posture: adjusts the inclination angle between the laser beam and the incident surface so that the laser beam is emitted from the rake face of the diamond tool; determines the action position of the diamond tool arc in each processing position based on the surface processing cutting trajectory, and obtains the laser beam offset distance; performs laser focus position compensation based on the laser beam offset distance, so that any processing position can obtain laser assistance; S2 then performs laser beam energy regulation: simulates and obtains the mapping relationship model between the laser power and the material softening temperature corresponding to different processing locations; based on the mapping relationship model, the actual laser power required for all processing locations is obtained; S3 performs laser-assisted processing on all processing positions in the processing area in turn according to the actual laser power.

[0030] In this embodiment, the beam energy control needs to be performed after the laser posture control. The posture control is used to ensure that all processing positions in the area to be processed are irradiated with laser. Then the laser energy at each processing position is controlled to ensure consistent laser energy.

[0031] Figure 2In order to realize the laser in-situ auxiliary processing device of the above steps S1-S3, the device includes a displacement platform 100, a beam shaping device 101, a laser beam 102, a diamond tool 103, an X-axis piezoelectric nano-displacement platform 104, a Y-axis piezoelectric nano-displacement platform 105, a posture controller 106, and a laser controller 107. In this embodiment, the laser beam 102 is collimated and focused by the beam shaping device 101 and then emitted from the arc position of the diamond tool 103; the beam shaping device 101 is installed above the displacement platform 100, the X-axis piezoelectric nano-displacement platform 104, and the Y-axis piezoelectric nano-displacement platform 105. In the process of laser beam posture control, the offset of the laser beam is realized by the X-axis piezoelectric nano-displacement platform 104, and the laser focus position compensation is realized by the Y-axis piezoelectric nano-displacement platform 105. The posture controller 106 is used to control the movement of the X-axis piezoelectric nano-displacement platform 104 and the Y-axis piezoelectric nano-displacement platform 105. During the laser beam energy regulation process, the laser power is controlled by the laser controller 107. The above processing device is equipped with a constant energy laser assisted surface processing system, which can realize constant energy laser assistance in the surface processing process, specifically including laser beam posture regulation and laser beam energy regulation.

[0032] like Figure 3 As shown in FIG. 1 , it is a schematic diagram of the structure of the diamond tool in step S1. In this embodiment, the diamond tool is designed mainly through the following relationship model, specifically by adjusting the inclination angle between the laser beam in the diamond tool and its incident surface β , so that the laser is emitted from the rake face of the diamond tool: (1) in, β is the angle between the laser and its incident surface, L is the diamond tool length, a is the distance from the upper end of the laser incident surface to the cutting edge of the diamond tool, n is the refractive index of diamond.

[0033] For example, when the diamond tool rake angle is -35°, β The use of 40° can ensure that the laser beam is emitted from the front cutting edge of the tool. At the same time, the above relationship model can ensure that the laser beam has a large adjustment range and improve the utilization rate of laser energy.

[0034] like Figure 4 Figures A and B show the optical simulation diagram of the laser beam emitted from the rake face of the diamond tool. Figure 4 Figure A in the middle is a schematic diagram of a diamond tool from a top-down perspective. Figure 4Figure B is a schematic diagram of the front view of the diamond tool. Specifically, after completing the design of the diamond tool structure dimensions according to the above formula (1), the optical simulation is performed using the non-sequential module of the Zemax optical simulation software, so that the laser beam is incident from the center of the diamond tool surface at a height of 0.6 mm from the bottom surface of the diamond tool. The laser beam is refracted and reflected in the diamond tool and is emitted from the center of the tool rake face.

[0035] like Figure 5 The figure shows an optical simulation diagram of a laser beam emitted from the front face of a diamond tool after being offset by a certain distance. Figure 5 Figure A in the middle is a schematic diagram of a diamond tool from a top-down perspective. Figure 5 Figure B is a schematic diagram of the front view of the diamond tool. Specifically, in the Zemax software, the laser beam is incident on the diamond tool after being offset by 0.15 mm in the X direction.

[0036] Depend on Figure 4 and Figure 5 It can be seen from the simulation results that the propagation path of the laser beam after the deviation in this application is different from the propagation path of the laser beam before the deviation ( Figure 4 ) and from Figure 4 Figure C and Figure 5 It can be seen from Figure C that the incoherent irradiance of the laser beam does not change before and after the offset. The distance between the position where the laser beam is emitted from the rake face of the tool and the center axis of the tool arc after the offset is 0.15 mm, that is, the distance between the incident laser and the center axis of the tool arc is the offset distance of the laser beam in the X direction. Based on the characteristic that the propagation path of the laser beam after the offset remains unchanged when the laser beam is emitted from the rake face of the tool, it can be known that the position control of the laser beam can be achieved by moving the laser beam.

[0037] After the aforementioned laser beam is offset, the laser focus position will change due to the circular arc shape of the diamond tool rake face. Therefore, it is necessary to establish a tool edge arc XY distance relationship model, obtain the laser focus Y direction compensation value according to the laser beam X direction offset distance, and compensate the laser focus position by moving the laser beam in the Y direction.

[0038] Specifically, the method for compensating the laser focus position based on the laser beam offset distance includes the following steps: S101 establishes the XY distance relationship model of the diamond tool edge arc: In this embodiment, the XY distance relationship model of the diamond tool edge arc is expressed as: (2) in, dx is the laser beam offset distance in the X direction, dyIt is the compensation value of laser focus in Y direction.

[0039] In other preferred embodiments, the diamond tool cutting edge arc XY distance relationship model can be refined and designed into other forms.

[0040] S102 obtains a compensation value of the laser focus in the Y direction after the laser beam is offset in the X direction according to the XY distance relationship model of the diamond tool edge arc.

[0041] S103 controls the laser beam to move in the Y direction according to the compensation value so that the laser beam coincides with the position to be processed, thereby achieving laser assistance at any processing position during the curved surface processing.

[0042] like Figure 6 , which is a schematic diagram of laser focus position compensation. Specifically, for the machining center position 503 on the machining surface 502, the laser beam 500 is incident from the center position of the diamond tool 501, and the laser beam 500 will be emitted from the center position of the tool rake face after being refracted and reflected in the diamond tool 501. For other machining positions 505 on the machining surface 502, the laser beam needs to be offset to a certain extent, and the offset distance of the laser beam is taken as dx. After the offset, the laser beam 504 will be refracted and reflected in the diamond tool 501, and will be emitted from the tool rake face, and act on other machining positions 505 on the machining surface 502.

[0043] In step S2, the method flow of simulating and obtaining the mapping relationship model between the laser power and the material softening temperature corresponding to different processing positions is as follows: Figure 7 As shown in the figure, the specific steps are as follows: first, a temperature field model (i.e., a mapping relationship model) under laser assistance is established in the finite element software. Specifically, the material parameters, process parameters, and cutting parameters of the surface to be processed are first input, and then the initial laser power is set. Then, the relationship between the laser power and the output softening temperature at different processing positions is obtained. The formula of the temperature field model is: T = G (v, x, y, P) (3) Wherein, T represents the softening temperature of the material, v represents the processing speed, x represents the processing position of the processing site in the x-axis direction, y represents the processing position of the processing site in the y-axis direction, and P represents the laser power.

[0044] Specifically, the method for obtaining the actual laser power required for all processing positions in the area to be processed based on the mapping relationship model is: S201 outputs the material softening temperature corresponding to each processing point based on the mapping relationship model; S202 compares the material softening temperature with the corresponding ideal softening temperature to determine whether the laser power at the current processing position meets the softening requirements: if so, the current laser power is retained as the actual laser power; if not, the laser power is adjusted until the laser power that meets the softening requirements is obtained and the adjustment is stopped.

[0045] In step S3, the actual laser power is dynamically matched with the cutting trajectory of the diamond tool in real time until the constant energy assisted processing of all processing positions is completed. Specifically, the in-situ assisted processing CNC system and the laser are collaboratively controlled to dynamically match the actual laser power with the cutting trajectory of the diamond tool in real time to achieve constant energy assisted processing and complete surface processing.

[0046] Another embodiment of the present application further provides a system for implementing the above-mentioned constant energy laser-assisted surface processing method, the system comprising: A laser beam adjustment module, used for adjusting the inclination angle between the laser beam and the incident surface, so that the laser beam is emitted from the rake face of the diamond tool; A laser beam offset distance acquisition module is used to determine the action position of the diamond tool arc in each processing position based on the surface processing cutting trajectory to obtain the laser beam offset distance; A laser focus position compensation module is used to compensate the laser focus position based on the laser beam offset distance so that any processing position can obtain laser assistance; The laser beam energy control module is used to simulate and obtain the mapping relationship model between the laser power and the material softening temperature corresponding to different processing locations; it is also used to obtain the actual laser power required for all processing locations based on the mapping relationship model; The laser processing module is used to sequentially perform laser-assisted processing on all processing positions in the processing area according to the actual laser power; The multi-directional displacement automatic adjustment platform is used to integrate the laser beam adjustment module, the laser beam offset distance acquisition module, the laser focus position compensation module, the laser beam energy control module and the laser processing module to form a closed-loop control system. Specifically, the multi-directional displacement automatic adjustment platform can receive control instructions from the aforementioned modules, synchronously adjust the spatial position of the optical element and the tool motion trajectory, and transmit the platform displacement, acceleration and other physical parameters back to the control layer; more specifically, the multi-directional displacement automatic adjustment platform integrates a five-axis motion mechanism (XYZ linear axis + AB rotation axis) and corresponding linear motors to achieve multi-directional displacement.

[0047] It can be understood that the detailed functional implementation of each of the above-mentioned units / modules can be found in the introduction of the aforementioned method embodiment, and will not be repeated here.

[0048] It should be understood that the above-mentioned device is used to execute the method in the above-mentioned embodiment. The implementation principle and technical effect of the corresponding program module in the device are similar to those described in the above-mentioned method. The working process of the device can refer to the corresponding process in the above-mentioned method, which will not be repeated here.

[0049] Based on the method in the above embodiment, the embodiment of the present application provides an electronic device, which includes: a processor (Processor) 810, a communication interface (Communications Interface) 820, a memory (Memory) 830 and a communication bus 840, wherein the processor 810, the communication interface 820, and the memory 830 communicate with each other through the communication bus 840. The processor 810 can call the logic instructions in the memory 830 to execute the method in the above embodiment.

[0050] In addition, the logic instructions in the above-mentioned memory 830 can be implemented in the form of software functional units and can be stored in a computer-readable storage medium when sold or used as an independent product. Based on this understanding, the technical solution of the present application, or the part that contributes to the prior art, or the part of the technical solution, can be embodied in the form of a software product, which is stored in a storage medium and includes a number of instructions for a computer device (which can be a personal computer, a server, or a network device, etc.) to perform all or part of the steps of the method described in each embodiment of the present application.

[0051] Based on the method in the above embodiment, an embodiment of the present application provides a computer-readable storage medium, which stores a computer program. When the computer program runs on a processor, the processor executes the method in the above embodiment.

[0052] Based on the method in the above embodiment, an embodiment of the present application provides a computer program product. When the computer program product runs on a processor, the processor executes the method in the above embodiment.

[0053] It is understandable that the processor in the embodiment of the present application may be a central processing unit (CPU), or other general-purpose processors, digital signal processors (DSP), application-specific integrated circuits (ASIC), field programmable gate arrays (FPGA) or other programmable logic devices, transistor logic devices, hardware components or any combination thereof. The general-purpose processor may be a microprocessor or any conventional processor.

[0054] The method steps in the embodiments of the present application can be implemented by hardware or by a processor executing software instructions. The software instructions can be composed of corresponding software modules, and the software modules can be stored in random access memory (RAM), flash memory, read-only memory (ROM), programmable read-only memory (PROM), erasable programmable read-only memory (EPROM), electrically erasable programmable read-only memory (EEPROM), registers, hard disks, mobile hard disks, CD-ROMs, or any other form of storage medium known in the art. An exemplary storage medium is coupled to the processor so that the processor can read information from the storage medium and write information to the storage medium. Of course, the storage medium can also be a component of the processor. The processor and the storage medium can be located in an ASIC.

[0055] In the above embodiments, it can be implemented in whole or in part by software, hardware, firmware or any combination thereof. When implemented by software, it can be implemented in whole or in part in the form of a computer program product. The computer program product includes one or more computer instructions. When the computer program instructions are loaded and executed on a computer, the process or function described in the embodiment of the present application is generated in whole or in part. The computer may be a general-purpose computer, a special-purpose computer, a computer network, or other programmable device. The computer instructions may be stored in a computer-readable storage medium or transmitted through the computer-readable storage medium. The computer instructions may be transmitted from a website site, computer, server or data center to another website site, computer, server or data center by wired (e.g., coaxial cable, optical fiber, digital subscriber line (DSL)) or wireless (e.g., infrared, wireless, microwave, etc.) means. The computer-readable storage medium may be any available medium that a computer can access or a data storage device such as a server or data center that includes one or more available media integrated. The available medium may be a magnetic medium (e.g., a floppy disk, a hard disk, a tape), an optical medium (e.g., a DVD), or a semiconductor medium (e.g., a solid-state drive (SSD)), etc.

[0056] It should be understood that the various numerical numbers involved in the embodiments of the present application are only used for the convenience of description and are not used to limit the scope of the embodiments of the present application.

[0057] It will be easily understood by those skilled in the art that the above description is only a preferred embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present application shall be included in the scope of protection of the present application.

Claims

1. A constant energy laser-assisted surface processing method, characterized in that: include: S1 adjusts the inclination angle between the laser beam and the incident surface so that the laser beam is emitted from the rake face of the diamond tool; determines the action position of the diamond tool arc in each processing position based on the surface processing cutting trajectory, and obtains the laser beam offset distance; performs laser focus position compensation based on the laser beam offset distance, so that any processing position can obtain laser assistance; S2 simulates and obtains the mapping relationship model between the laser power and the material softening temperature corresponding to different processing positions; based on the mapping relationship model, the actual laser power required for all processing positions is obtained; S3 performs laser-assisted processing on all processing positions in the processing area in sequence according to the actual laser power.

2. A constant energy laser-assisted surface processing method as claimed in claim 1, characterized in that: In step S1, the inclination angle between the laser beam and the incident surface is adjusted using the following relationship model so that the laser is emitted from the rake face of the diamond tool: in, β is the laser incident angle, L is the length of the diamond tool, a is the distance from the upper end of the laser incident surface to the cutting edge of the diamond tool, n is the refractive index of diamond.

3. A constant energy laser-assisted curved surface processing method as claimed in claim 1, characterized in that: In step S1, the method for compensating the laser focus position based on the laser beam offset distance is: S101 establishes the XY distance relationship model of the diamond tool edge arc; S102 obtains the compensation value of the laser focus in the Y direction after the laser beam is offset in the X direction according to the XY distance relationship model of the diamond tool edge arc; S103 controls the laser beam to move in the Y direction according to the compensation value so that the laser beam coincides with the position to be processed.

4. A constant energy laser-assisted curved surface processing method as claimed in claim 3, characterized in that: In step S1, the diamond tool edge arc XY distance relationship model is expressed as: in, dx is the laser beam offset distance in the X direction, dy It is the compensation value of laser focus in Y direction.

5. The constant energy laser-assisted curved surface processing method according to claim 1, characterized in that: In step S2, the method for obtaining the actual laser power required for all processing positions in the area to be processed based on the mapping relationship model is: S201 outputs the material softening temperature corresponding to each processing point based on the mapping relationship model; S202 compares the softening temperature of the material with the corresponding ideal softening temperature to determine whether the laser power at the current processing position meets the softening requirements: if so, the current laser power is retained as the actual laser power; if not, the laser power is adjusted until the laser power that meets the softening requirements is obtained and the adjustment is stopped.

6. A constant energy laser assisted surface processing method as claimed in claim 1, characterized in that: In step S3, the actual laser power is dynamically matched with the cutting trajectory of the diamond tool in real time until the constant energy assisted processing of all processing positions is completed.

7. A system for implementing the constant energy laser-assisted surface processing method according to any one of claims 1 to 6, characterized in that: The system comprises: A laser beam adjustment module, used for adjusting the inclination angle between the laser beam and the incident surface, so that the laser beam is emitted from the rake face of the diamond tool; A laser beam offset distance acquisition module is used to determine the action position of the diamond tool arc in each processing position based on the surface processing cutting trajectory to obtain the laser beam offset distance; A laser focus position compensation module, used for performing laser focus position compensation based on the laser beam offset distance, so that any processing position can obtain laser assistance; A laser beam energy control module is used to simulate and obtain a mapping relationship model between the laser power and the material softening temperature corresponding to different processing locations; and is also used to obtain the actual laser power required for all processing locations based on the mapping relationship model; A laser processing module, used for sequentially performing laser-assisted processing on all processing positions in the processing area according to the actual laser power; The multi-directional displacement automatic adjustment platform is used to integrate the laser beam adjustment module, the laser beam offset distance acquisition module, the laser focus position compensation module, the laser beam energy regulation module and the laser processing module to form a closed-loop control system.

8. An electronic device, characterized in that: include: at least one memory for storing a computer program; At least one processor is used to execute the program stored in the memory. When the program stored in the memory is executed, the processor is used to execute the method according to any one of claims 1 to 6.

9. A computer-readable storage medium storing a computer program, characterized in that: When the computer program runs on a processor, the processor is caused to execute the method according to any one of claims 1 to 6.

10. A computer program product, characterized in that When the computer program product runs on a processor, the processor is caused to execute the method according to any one of claims 1 to 6.

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