Carbon oxide sheet grinding machine

Abstract

The invention discloses a carbon oxide sheet grinding machine. The carbon oxide sheet grinding machine comprises a workbench, an automatic cutting assembly arranged on the workbench and used for cutting a wafer, a grinding assembly used for grinding the wafer and a finished product collecting assembly arranged at the tail end of the grinding assembly and used for collecting the wafer. According to the polishing machine composed of the workbench, the automatic cutting assembly, the polishing assembly and the finished product collecting assembly, automatic polishing of silicon wafers is achieved, and the purposes of achieving production intelligence, improving production efficiency, reducing labor cost and reducing harm to human bodies are achieved.

Description

Technical Field

[0001] The invention relates to the field of silicon wafer production and polishing, and in particular to a carbon-oxygen wafer polishing machine. Background Art

[0002] In the photovoltaic industry, the carbon and oxygen content of polycrystalline silicon and monocrystalline silicon is crucial to product quality, because these impurity elements can significantly affect the electronic properties and photoelectric conversion efficiency of silicon materials. Therefore, accurately measuring the carbon and oxygen content in silicon materials is a key step in the production process. The carbon and oxygen content of polycrystalline silicon and monocrystalline silicon is usually detected by low-temperature Fourier transform infrared spectroscopy (LT-FTIR). In order to obtain a better infrared absorption spectrum, the sample is required to be double-sided polished and have a good optical surface. The sample surface polishing method must be consistent. In the current photovoltaic industry, the carbon and oxygen content of polycrystalline silicon and monocrystalline silicon is detected by cutting 1-2.5mm thick wafers from the produced crystal rods, manually smashing out square pieces of about 50*50 in size, sending them to the pickling tank for cleaning, soaking for 30 minutes, taking them out, wiping the chemical solvent residues and fingerprints on the surface of the square pieces with anhydrous ethanol, and sending them to the laboratory for inspection.

[0003] Disadvantages of pickling include the following:

[0004] 1. Great harm to human health; 2. Serious environmental pollution; 3. Low production efficiency; 4. High labor cost.

[0005] How to effectively solve the above technical problems is a technical problem that urgently needs to be considered in this technical field.

[0006] The information disclosed in this background technology section is only intended to deepen the understanding of the overall background technology of the present invention, and should not be regarded as acknowledging or suggesting in any form that the information constitutes the prior art already known to those skilled in the art. Summary of the invention

[0007] In order to solve the above technical problems, the present invention proposes a carbon oxide wafer polishing machine to achieve the purpose of realizing automatic polishing of silicon wafers, improving production efficiency, reducing labor costs and reducing harm to the human body.

[0008] To achieve the above object, the technical solution of the present invention is as follows:

[0009] A carbon oxide wafer grinding machine comprises a workbench, an automatic cutting assembly arranged on the workbench for cutting wafers, a grinding assembly for grinding wafers, and a finished product receiving assembly arranged at the rear end of the grinding assembly for collecting wafers;

[0010] The automatic cutting assembly includes a double-station material tray, a feeding robot matched with the double-station material tray, a moving linear module arranged at the tail end of the feeding robot, a tool holder arranged above the moving linear module, a transfer module arranged at the tail end of the moving linear module, and a punching machine arranged on one side of the transfer module;

[0011] The double-station material tray is composed of a first rotary cylinder, a positioning tray and a film box; the positioning tray is used to place the film box, and the positioning tray is driven by the first rotary cylinder to rotate;

[0012] The loading robot is composed of an XZ dual-axis servo module, a second rotary cylinder and a suction claw. The XZ dual-axis servo module drives the second rotary cylinder to move, and the second rotary cylinder and the suction claw grasp the wafer and move it to the next station.

[0013] The movable linear module is composed of a linear servo module, a third rotary cylinder, and a vacuum suction cup. The linear servo module drives the third rotary cylinder to move along the direction of the linear servo module. The vacuum suction cup is arranged on the third rotary cylinder and adsorbs the wafer.

[0014] The tool holder comprises a support frame, a first cylinder, and a diamond tool head, wherein the first cylinder drives the diamond tool head to press down and mark;

[0015] The transfer module is composed of a moving module, a cylinder, and a first suction cup. The first suction cup places the scribed wafer on the punching table of the punching machine under the action of the moving module.

[0016] The present invention provides a grinder consisting of a workbench, an automatic cutting component, a grinding component and a finished product receiving component to realize automatic grinding of silicon wafers, thereby achieving the purpose of realizing intelligent production, improving production efficiency, reducing labor costs and reducing harm to the human body.

[0017] It is further worth noting that the automatic cutting assembly also includes a barcode scanner for identifying the wafer, a coding machine for coding the wafer, and a waste recycling machine for collecting waste, and the waste recycling machine is used in conjunction with the transfer module;

[0018] The data of the wafer grasped by the suction claw is obtained by the barcode scanning gun;

[0019] The coding gun converts the data obtained by the barcode scanning gun into other sample numbers and prints them in a designated area of ​​the chip;

[0020] The waste recycling machine comprises a servo movable ground rail and a plurality of recycling frames, and the recycling frames move under the action of the servo movable ground rail.

[0021] It is further worth noting that the grinding assembly includes a machine table, an adjusting cylinder arranged on the machine table, an adjusting disk arranged on the adjusting cylinder, a loading station arranged around the adjusting disk, a first grinding station, a turning station, a second grinding station, and a unloading station;

[0022] The adjusting disk includes a fixed disk in the center and a circular movable disk outside the fixed disk, wherein the movable disk can rotate on its own and is not restricted by the fixed disk;

[0023] The loading station comprises a support frame, a third rotary cylinder, a loading cylinder and a first finger cylinder. The support frame is arranged on the machine platform, the third rotary cylinder is arranged on the support frame, the loading cylinder is arranged on the third rotary cylinder, a connecting rod is arranged at the top of the loading cylinder, and the first finger cylinder is arranged below the other end of the connecting rod;

[0024] The first grinding station is composed of a linear module, a grinder support frame, a first downward pressure cylinder, a reverse thrust cylinder, a spindle motor, and a grinding head. The linear module is arranged on the machine table, and the grinder support frame is arranged on the linear module and moves on the linear module. The first downward pressure cylinder and the reverse thrust cylinder are both arranged on the outside of the grinder support frame. A vertical strip groove is arranged at the center of the grinder support frame, and a mounting block is arranged in the strip groove. The end of the mounting block located on the outside of the grinder support frame is connected with the first downward pressure cylinder and the reverse thrust cylinder; a vertical block is arranged at the other end of the mounting block, and the vertical block moves up and down along a vertical guide rail arranged on the inner side of the grinder support frame, and the mounting block is not limited by the vertical guide rail. The vertical block is installed with a spindle motor, and the head end of the spindle motor is provided with the grinding head;

[0025] The flipping station is composed of a flipping mechanism arranged on the machine platform and an alternating mechanism arranged on the movable disk, the flipping mechanism is composed of a rodless cylinder, a lifting cylinder, a fourth rotating cylinder, a second suction cup, and a flipping support frame, the rodless cylinder is arranged on the machine platform, the lifting cylinder is arranged on the rodless cylinder and can move along the movement direction of the rodless cylinder, the top of the lifting cylinder is provided with a flipping support frame, the fourth rotating cylinder is arranged on the flipping support frame, and the head end of the fourth rotating cylinder is provided with a second suction cup; the alternating mechanism is composed of a vertical linear module, a second finger cylinder, and an alternating support frame; the alternating support frame is arranged on the vertical linear module, the alternating support frame moves up and down along the vertical linear module, and the second finger cylinder is arranged on the alternating support frame;

[0026] The second grinding station structure is consistent with the first grinding station structure;

[0027] The unloading station is composed of a fifth rotating cylinder, a second pressing cylinder, a third suction cup, and a unloading support frame. The unloading support frame is arranged on the machine platform, the unloading support frame is provided with a fifth rotating cylinder, the fifth rotating cylinder is provided with a second pressing cylinder, and the second pressing cylinder is provided with a third suction cup.

[0028] It is further worth noting that it also includes several wafer positioning tools, which are distributed on the movable disk in sequence; the wafer positioning tools include wafer positioning blocks, and the wafer positioning blocks are provided with grooves for positioning the wafer.

[0029] It is further worth noting that a water flow trough is provided at the bottom of the groove. During grinding, water flows through the water flow trough into the bottom pipe opening and flows into the waste water tank provided at the bottom of the groove.

[0030] It is further worth noting that the finished product receiving assembly includes a conveyor line, a material separator and a cache tray. The conveyor line is used to transmit the polished silicon wafers, the material separator is used to separate the silicon wafers transported by the conveyor line; and the cache tray is used to collect different silicon wafers.

[0031] It is further worth noting that the finished product receiving assembly also includes a sensor arranged on the conveyor line to detect silicon wafers.

[0032] It is further worth noting that the device also includes an electric control cabinet and a computer operating table, which realize intelligent control of the entire device.

[0033] It is further worth noting that there is also a circle of protective net arranged on the outer circle of the device.

[0034] The present invention has the following advantages:

[0035] 1. The present invention provides a grinder consisting of a workbench, an automatic cutting component, a grinding component and a finished product receiving component to achieve automatic grinding of silicon wafers, thereby achieving the purpose of realizing intelligent production, improving production efficiency, reducing labor costs and reducing harm to the human body. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art are briefly introduced below.

[0037] Figure 1 A structural schematic diagram of a carbon oxide sheet grinding machine disclosed in an embodiment of the present invention;

[0038] Figure 2 It is a structural schematic diagram of an automatic cutting component in a carbon oxide sheet grinding machine disclosed in an embodiment of the present invention;

[0039] Figure 3 A schematic top view of an automatic cutting assembly in a carbon oxide sheet grinding machine disclosed in an embodiment of the present invention;

[0040] Figure 4 It is a structural schematic diagram of a feeding robot in a carbon oxide sheet grinding machine disclosed in an embodiment of the present invention;

[0041] Figure 5 A schematic diagram of the structure of a grinding component in a carbon oxide sheet grinding machine disclosed in an embodiment of the present invention;

[0042] Figure 6 It is a structural schematic diagram of a loading station in a carbon oxide sheet grinding machine disclosed in an embodiment of the present invention;

[0043] Figure 7 It is a structural schematic diagram of a first grinding station in a carbon oxide sheet grinding machine disclosed in an embodiment of the present invention;

[0044] Figure 8 It is a structural schematic diagram of a turning mechanism in a carbon oxide sheet grinding machine disclosed in an embodiment of the present invention;

[0045] Fig. 9 It is a structural schematic diagram of an alternating mechanism in a carbon-oxygen sheet grinding machine disclosed in an embodiment of the present invention;

[0046] Fig.10 It is a structural schematic diagram of a material unloading station in a carbon oxide sheet grinding machine disclosed in an embodiment of the present invention;

[0047] Fig.11 It is a structural schematic diagram of a square piece positioning tool in a carbon oxide piece grinding machine disclosed in an embodiment of the present invention;

[0048] Fig.12 It is a structural schematic diagram of a finished product receiving component in a carbon oxide sheet grinding machine disclosed in an embodiment of the present invention;

[0049] The numbers and letters in the figure represent the corresponding component names:

[0050] 1. Workbench 2. Automatic cutting assembly 211. First rotary cylinder 212. Positioning tray 213. Film box

[0051] 22. Loading robot 221. XZ dual-axis servo module 222. Second rotary cylinder 223. Suction claw

[0052] 231. Linear servo module 232. Third rotary cylinder 233. Vacuum suction cup 241. Support frame

[0053] 242. First cylinder 243. Diamond bit 251. Moving module 252. Cylinder 253. First suction cup

[0054] 26. Punching machine 27. Barcode scanner 28. Coding machine 29. Waste recycling machine 3. Grinding components

[0055] 31. Machine table 32. Adjusting cylinder 331. Fixed plate 332. Movable plate 34. Loading station 341. Support frame

[0056] 342. Third rotating cylinder 343. Loading cylinder 344. First finger cylinder 35. First grinding station

[0057] 351. Linear module 352. Grinding machine support frame 353. First downward pressure cylinder 354. Reverse thrust cylinder

[0058] 355. Spindle motor 356. Grinding head 357 Mounting block 358. Vertical block 361. Flip mechanism

[0059] 3611. Rodless cylinder 3612. Lifting cylinder 3613. Fourth rotary cylinder 3614. Second suction cup

[0060] 3615. Flip support frame 362. Alternating mechanism 3621. Vertical linear module 3622. Second finger cylinder

[0061] 3623. Alternating support frame 37. Second grinding station 38. Unloading station 381. Fifth rotary cylinder

[0062] 382. Second downward pressure cylinder 383. Third suction cup 384. Unloading support frame 39. Square piece positioning tool

[0063] 391. Square positioning block 392. Groove 393. Water flow channel 4. Finished product receiving assembly 41. Conveyor line 42. Distributor

[0064] 43. Cache tray 5. Electric control cabinet 6. Computer operation table 7. Protective net. DETAILED DESCRIPTION

[0065] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the accompanying drawings in the embodiments of the present invention.

[0066] The present invention provides a carbon oxide wafer grinder, whose working principle is to realize automatic grinding of silicon wafers by providing a grinder composed of a workbench, an automatic cutting component, a grinding component and a finished product receiving component, so as to achieve the purpose of realizing intelligent production, improving production efficiency, reducing labor costs and reducing harm to the human body.

[0067] The present invention is further described in detail below with reference to examples and specific implementation modes.

[0068] like Figure 1As shown, a carbon oxide wafer grinder includes a workbench 1, an automatic cutting component 2 arranged on the workbench for cutting wafers, a grinding component 3 for grinding wafers, a finished product receiving component 4 arranged at the tail end of the grinding component and collecting the wafers, an electric control cabinet 5 arranged on the workbench, a computer operating table 6 arranged on the workbench and a circle of protective net 7 arranged on the outer circle of the equipment, and the electric control cabinet and the computer operating table realize the intelligent control of the whole equipment.

[0069] in:

[0070] like Figure 2 and Figure 3 As shown, the automatic cutting component 2 includes a double-station material tray, a loading robot 22 cooperating with the double-station material tray, a moving linear module arranged at the tail end of the loading robot, a tool holder arranged above the moving linear module, a transfer module arranged at the tail end of the moving linear module, a punching machine 26 arranged on one side of the transfer module, a barcode scanning gun 27 for identifying chips, a coding machine 28 for coding chips, and a waste recycling machine 29 for collecting waste. The wafer box disc filled with wafers is placed in the material tray waiting area by manual loading; when the material tray in the loading area is empty, it rotates 180° and the material waiting area starts loading; the robot scans the code to grab the material from the loading area, rotates 90° and places it on the mobile module; the barcode scanner recognizes the paper information of the wafer (the information must be attached to a fixed corner on one side, with the sticker facing up), and automatically converts it into the corresponding QR code; the 1cm*1cm QR code is printed in the cutting area by laser; the 50*50 square piece in the middle is cut by marking; after the waste pieces are stamped, according to the recognized QR code information, the recycling machine moves the corresponding waste frame to the receiving port to realize automatic classification and recycling to prevent material mixing. The details are as follows:

[0071] The double-station material tray is composed of a first rotary cylinder 211, a positioning tray 212 and a film box 213; the positioning tray is used to place the film box, and the positioning tray is driven to rotate by the first rotary cylinder;

[0072] The loading robot is composed of an XZ dual-axis servo module 221, a second rotary cylinder 222 and a suction claw 223. The XZ dual-axis servo module drives the second rotary cylinder to move, and the second rotary cylinder and the suction claw grasp the wafer and move it to the next station. Figure 4 shown.

[0073] The movable linear module is composed of a linear servo module 231, a third rotary cylinder 232, and a vacuum suction cup 233. The linear servo module drives the third rotary cylinder to move along the direction of the linear servo module; the vacuum suction cup is arranged on the third rotary cylinder and adsorbs the wafer.

[0074] The tool holder includes a support frame 241, a first cylinder 242, and a diamond tool head 243. The first cylinder drives the diamond tool head to press down and mark.

[0075] The transfer module is composed of a moving module 251, a cylinder 252, and a first suction cup 253. The first suction cup places the scribed wafer on the punching table of the punching machine under the action of the moving module.

[0076] The barcode scanning gun detects the data of the wafer grabbed by the suction claw.

[0077] The coding gun converts the data obtained by the barcode scanning gun into other sample numbers and prints them in a designated area of ​​the chip;

[0078] The waste recycling machine is used in conjunction with the transfer module; the waste recycling machine includes a servo movable ground rail and a plurality of recycling frames, and the recycling frames move under the action of the servo movable ground rail.

[0079] like Figure 5 As shown, the grinding assembly includes a machine table 31, an adjusting cylinder 32 arranged on the machine table, an adjusting disk arranged on the adjusting cylinder, a loading station 34, a first grinding station 35, a turning station, a second grinding station 37, a unloading station 38 and several square piece positioning fixtures 39, and the loading station, the first grinding station, the turning station, the second grinding station and the unloading station are arranged around the adjusting disk. The wafer box disc filled with chips is placed in the material tray waiting area through manual loading; when the material tray in the loading area is empty, it is rotated 180° and the waiting area starts to load the pieces; the robot scans the code from the loading area to grab the material, rotates 90° and places it on the mobile module; the barcode scanner recognizes the paper information of the chip (the information must be attached to a fixed corner on one side, with the sticker facing up), and automatically converts it into the corresponding QR code; the 1cm*1cm QR code is printed in the cutting area by laser; the 50*50 square piece in the middle is cut by marking; for the waste chips after stamping, the recycling machine moves the corresponding waste frame to the receiving port according to the recognized QR code information to realize automatic classification and recycling to prevent material mixing.

[0080] Specific:

[0081] like Figure 5 As shown, the adjustment disk includes a fixed disk 331 at the center and a circular movable disk 332 at the outer side of the fixed disk. The movable disk can rotate on its own and is not restricted by the fixed disk.

[0082] like Figure 6As shown, the loading station includes a support frame 341, a third rotary cylinder 341, a loading cylinder 343 and a first finger cylinder 344, the support frame is arranged on the machine platform, the third rotary cylinder is arranged on the support frame, the loading cylinder is arranged on the third rotary cylinder, a connecting rod is arranged at the top of the loading cylinder, and the first finger cylinder is arranged below the other end of the connecting rod.

[0083] like Figure 7 As shown, the first grinding station is composed of a linear module 351, a grinder support frame 352, a first downward pressure cylinder 353, a reverse thrust cylinder 354, a spindle motor 355, and a grinding head 356. The linear module is arranged on the machine platform, and the grinder support frame is arranged on the linear module and moves on the linear module. The first downward pressure cylinder and the reverse thrust cylinder are both arranged on the outside of the grinder support frame. A vertical strip groove is arranged at the center of the grinder support frame, and a mounting block 357 is arranged in the strip groove. The end of the mounting block located on the outside of the grinder support frame is connected to the first downward pressure cylinder and the reverse thrust cylinder; a vertical block 358 is arranged at the other end of the mounting block, and the vertical block moves up and down along the vertical guide rail arranged on the inner side of the grinder support frame, and the mounting block is not limited by the vertical guide rail. The vertical block is installed with a spindle motor, and the head end of the spindle motor is provided with the grinding head.

[0084] like Figure 8 and Fig. 9 As shown, the flipping station is composed of a flipping mechanism 361 arranged on the machine platform and an alternating mechanism 362 arranged on the movable disk, the flipping mechanism is composed of a rodless cylinder 3611, a lifting cylinder 3612, a fourth rotating cylinder 3613, a second suction cup 3614, and a flipping support frame 3615, the rodless cylinder is arranged on the machine platform, the lifting cylinder is arranged on the rodless cylinder and can move along the movement direction of the rodless cylinder, a flipping support frame is arranged on the top of the lifting cylinder, the fourth rotating cylinder is arranged on the flipping support frame, and the head end of the fourth rotating cylinder is arranged with a second suction cup; the alternating mechanism is composed of a vertical linear module 3621, a second finger cylinder 3622, and an alternating support frame 3623; the alternating support frame is arranged on the vertical linear module, the alternating support frame moves up and down along the vertical linear module, and the alternating support frame is arranged with a second finger cylinder.

[0085] The structure of the second grinding station is consistent with the structure of the first grinding station.

[0086] like Fig.10As shown, the unloading station is composed of a fifth rotating cylinder 381, a second pressing cylinder 382, ​​a third suction cup 383, and a unloading support frame 384. The unloading support frame is arranged on the machine table, and the unloading support frame is provided with a fifth rotating cylinder, the fifth rotating cylinder is provided with a second pressing cylinder, and the second pressing cylinder is provided with a third suction cup.

[0087] like Fig.11 As shown, the wafer positioning tooling is distributed on the movable disk in sequence; the wafer positioning tooling includes a wafer positioning block 391, and the wafer positioning block is provided with a groove 392 for positioning the wafer; a water flow trough 393 is provided at the bottom of the groove. During grinding, water flows into the bottom pipe port through the water flow trough and flows into the waste water tank arranged at the bottom of the groove.

[0088] like Fig.12 As shown, the finished product receiving component 4 includes a conveyor line 41, a divider 42, a cache tray 43 and a sensor arranged on the conveyor line to detect silicon wafers; the conveyor line is used to transmit the polished silicon wafers, the divider is used to divide the silicon wafers transmitted by the conveyor line; the cache tray is used to collect different silicon wafers.

[0089] The automatic polishing system provided by the present invention can remove tiny defects and irregular lines on the surface of silicon wafers, making the surface of silicon wafers smoother, achieving a mirror effect, and improving the quality of silicon wafers;

[0090] The automated grinding system can achieve 24-hour uninterrupted production without the need for human intervention, greatly improving production efficiency and significantly reducing labor costs.

[0091] Automated grinding reduces workers' physical labor, reduces pollution in the working environment, and improves working conditions.

[0092] Automated grinding systems are usually more energy-efficient, helping to reduce energy consumption and environmental pollution. Grinding wastewater can be filtered and recycled.

[0093] Through the above method, the carbon oxide wafer grinder provided by the present invention realizes the automatic grinding of silicon wafers by providing a grinder composed of a workbench, an automatic cutting component, a grinding component and a finished product receiving component, thereby achieving the purpose of realizing intelligent production, improving production efficiency, reducing labor costs and reducing harm to the human body.

[0094] The above is only a preferred embodiment of a carbon oxide sheet grinder disclosed in the present invention. It should be pointed out that, for ordinary technicians in this field, several modifications and improvements can be made without departing from the creative concept of the present invention, which all belong to the protection scope of the present invention.

Claims

1. A carbon oxide sheet grinding machine, characterized in that: It comprises a workbench, an automatic cutting assembly arranged on the workbench for cutting wafers, a grinding assembly for grinding wafers, and a finished product receiving assembly arranged at the rear end of the grinding assembly for collecting wafers; The automatic cutting assembly includes a double-station material tray, a feeding robot matched with the double-station material tray, a moving linear module arranged at the tail end of the feeding robot, a tool holder arranged above the moving linear module, a transfer module arranged at the tail end of the moving linear module, and a punching machine arranged on one side of the transfer module; The double-station material tray is composed of a first rotary cylinder, a positioning tray and a film box; the positioning tray is used to place the film box, and the positioning tray is driven by the first rotary cylinder to rotate; The loading robot is composed of an XZ dual-axis servo module, a second rotary cylinder and a suction claw. The XZ dual-axis servo module drives the second rotary cylinder to move, and the second rotary cylinder and the suction claw grasp the wafer and move it to the next station. The movable linear module is composed of a linear servo module, a third rotary cylinder, and a vacuum suction cup. The linear servo module drives the third rotary cylinder to move along the direction of the linear servo module. The vacuum suction cup is arranged on the third rotary cylinder and adsorbs the wafer. The tool holder comprises a support frame, a first cylinder, and a diamond tool head, wherein the first cylinder drives the diamond tool head to press down and mark; The transfer module is composed of a moving module, a cylinder, and a first suction cup. The first suction cup places the scribed wafer on the punching table of the punching machine under the action of the moving module.

2. A carbon oxide sheet grinding machine according to claim 1, characterized in that: The automatic cutting assembly also includes a barcode scanner for identifying the wafer, a coding machine for coding the wafer, and a waste recycling machine for collecting waste, and the waste recycling machine is used in conjunction with the transfer module; The data of the wafer grasped by the suction claw is obtained by the barcode scanning gun; The coding gun converts the data obtained by the barcode scanning gun into other sample numbers and prints them in a designated area of ​​the chip; The waste recycling machine comprises a servo movable ground rail and a plurality of recycling frames, and the recycling frames move under the action of the servo movable ground rail.

3. A carbon oxide sheet grinding machine according to claim 1, characterized in that: The grinding assembly comprises a machine table, an adjusting cylinder arranged on the machine table, an adjusting disk arranged on the adjusting cylinder, a loading station arranged around the adjusting disk, a first grinding station, a turning station, a second grinding station, and a unloading station; The adjusting disk includes a fixed disk in the center and a circular movable disk outside the fixed disk, wherein the movable disk can rotate on its own and is not restricted by the fixed disk; The loading station comprises a support frame, a third rotary cylinder, a loading cylinder and a first finger cylinder. The support frame is arranged on the machine platform, the third rotary cylinder is arranged on the support frame, the loading cylinder is arranged on the third rotary cylinder, a connecting rod is arranged at the top of the loading cylinder, and the first finger cylinder is arranged below the other end of the connecting rod; The first grinding station is composed of a linear module, a grinder support frame, a first downward pressure cylinder, a reverse thrust cylinder, a spindle motor, and a grinding head. The linear module is arranged on the machine table, and the grinder support frame is arranged on the linear module and moves on the linear module. The first downward pressure cylinder and the reverse thrust cylinder are both arranged on the outside of the grinder support frame. A vertical strip groove is arranged at the center of the grinder support frame, and a mounting block is arranged in the strip groove. The end of the mounting block located on the outside of the grinder support frame is connected with the first downward pressure cylinder and the reverse thrust cylinder; a vertical block is arranged at the other end of the mounting block, and the vertical block moves up and down along a vertical guide rail arranged on the inner side of the grinder support frame, and the mounting block is not limited by the vertical guide rail. The vertical block is installed with a spindle motor, and the head end of the spindle motor is provided with the grinding head; The flipping station is composed of a flipping mechanism arranged on the machine platform and an alternating mechanism arranged on the movable disk, the flipping mechanism is composed of a rodless cylinder, a lifting cylinder, a fourth rotating cylinder, a second suction cup, and a flipping support frame, the rodless cylinder is arranged on the machine platform, the lifting cylinder is arranged on the rodless cylinder and can move along the movement direction of the rodless cylinder, the top of the lifting cylinder is provided with a flipping support frame, the fourth rotating cylinder is arranged on the flipping support frame, and the head end of the fourth rotating cylinder is provided with a second suction cup; the alternating mechanism is composed of a vertical linear module, a second finger cylinder, and an alternating support frame; the alternating support frame is arranged on the vertical linear module, the alternating support frame moves up and down along the vertical linear module, and the second finger cylinder is arranged on the alternating support frame; The second grinding station structure is consistent with the first grinding station structure; The unloading station is composed of a fifth rotating cylinder, a second pressing cylinder, a third suction cup, and a unloading support frame. The unloading support frame is arranged on the machine platform, the unloading support frame is provided with a fifth rotating cylinder, the fifth rotating cylinder is provided with a second pressing cylinder, and the second pressing cylinder is provided with a third suction cup.

4. A carbon oxide sheet grinding machine according to claim 3, characterized in that: It also includes several wafer positioning tools, which are distributed on the movable disk in sequence; the wafer positioning tools include wafer positioning blocks, and the wafer positioning blocks are provided with grooves for positioning the wafer.

5. A carbon oxide sheet grinding machine according to claim 4, characterized in that: A water flow trough is provided at the bottom of the groove. During grinding, water flows into the bottom pipe opening through the water flow trough and flows into the waste water tank arranged at the bottom of the groove.

6. A carbon oxide sheet grinding machine according to claim 1, characterized in that: The finished product receiving assembly includes a conveyor line, a material separator and a buffer tray. The conveyor line is used to transmit the polished silicon wafers, the material separator is used to separate the silicon wafers transmitted by the conveyor line; and the buffer tray is used to collect different silicon wafers.

7. A carbon oxide sheet grinding machine according to claim 6, characterized in that: The finished product receiving assembly also includes a sensor arranged on the conveying line for detecting silicon wafers.

8. A carbon oxide sheet grinding machine according to claim 1, characterized in that: It also includes an electric control cabinet and a computer operating table, which realize intelligent control of the entire equipment.

9. A carbon oxide sheet grinding machine according to claim 1, characterized in that: The device also includes a protective net arranged on the outer ring of the device.

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