Packaging method and device of semiconductor material tube and storage medium

Abstract

The invention relates to the technical field of semiconductor packaging, in particular to a semiconductor material pipe packaging method and device and a storage medium. According to the packaging method for the semiconductor material tubes, the semiconductor material tubes of a target packaging batch and target batch information need to be obtained firstly; selecting missing charging pipes for the target packaging batch to carry out number statistics to obtain the number of the missing charging pipes in the batch and the number of elements corresponding to each missing charging pipe; according to the number of upper limit material pipes for packaging, the number of batch material lacking pipes, the number of elements corresponding to each material lacking pipe, the number of upper limit elements contained in a single pipe and the target batch information, packaging parameters are calculated, and the number of box-loaded elements, a material pipe configuration scheme and the total number of batch packaging boxes are obtained; and carrying out packaging operation on each semiconductor material tube based on the number of the box-loaded elements of each material tube packaging box, the material tube configuration scheme and the total batch packaging box number to obtain each material tube packaging box. In this way, a high-efficiency and high-quality solution is provided for packaging of semiconductor material pipes.

Description

Technical Field

[0001] The present application relates to the field of semiconductor packaging technology, and in particular to a packaging method for semiconductor material tubes and a device and storage medium thereof. Background Art

[0002] Semiconductor tubes refer to tubes used to hold semiconductor components. Packaged and tested semiconductor components (such as integrated circuits, chips, etc.) are placed in tubes according to certain quantities and specifications for easy storage, transportation and use. Such tubes are called semiconductor tubes. In the packaging process of semiconductor tubes, related technologies face a series of complex and cumbersome manual operation processes, in which multiple links require manual intervention, resulting in the entire packaging process not only being inefficient but also prone to human errors.

[0003] It should be pointed out that there is no mature case of automated packaging specifically for semiconductor tubes in the industry. The relevant technologies for semiconductor tube packaging have the characteristics of low efficiency, high error rate, and difficult quality control in the complex manual operation process. In particular, it is difficult to accurately determine the corresponding packaging parameters for each tube packaging box. Therefore, how to carry out efficient and high-quality packaging operations for semiconductor tubes is still a major problem that needs to be solved in the industry. Summary of the invention

[0004] The present application aims to solve at least one of the technical problems existing in the prior art. To this end, the present application proposes a semiconductor material tube packaging method and device, and a storage medium, which can perform high-efficiency and high-quality packaging operations on semiconductor material tubes.

[0005] A method for packaging a semiconductor material tube according to a first aspect of the present application includes:

[0006] Obtaining semiconductor material tubes of a target packaging batch and target batch information corresponding to the target packaging batch, wherein the semiconductor material tubes are used to accommodate semiconductor components, and each of the semiconductor material tubes has the same upper limit number of components that can be accommodated in a single tube; wherein the semiconductor material tubes that have reached the upper limit number of components that can be accommodated in a single tube are full material tubes, and the semiconductor material tubes that have not reached the upper limit number of components that can be accommodated in a single tube are underfilled material tubes;

[0007] Select the missing charging tubes for the target packaging batch and count the number thereof to obtain the number of missing charging tubes in the batch and the number of components corresponding to each missing charging tube;

[0008] Calculate the packaging parameters according to the preset upper limit number of material tubes, the number of tubes without loading in the batch, the number of components corresponding to each tube without loading, the upper limit number of components that can be contained in a single tube, and the target batch information, and obtain the number of components in each material tube packaging box, the material tube configuration plan, and the total number of boxes in the batch packaging;

[0009] Based on the number of components on each tube packaging box, the tube configuration scheme and the total number of boxes in the batch packaging, a packaging operation is performed on each semiconductor tube to obtain each tube packaging box corresponding to the target packaging batch.

[0010] According to some embodiments of the present application, the packaging parameter calculation is performed based on the preset upper limit number of material tubes for packaging, the number of tubes without loading in the batch, the number of components corresponding to each of the tubes without loading, the upper limit number of components that can be accommodated in a single tube, and the target batch information to obtain the number of components in each material tube packaging box, the material tube configuration scheme, and the total number of boxes in the batch packaging, including:

[0011] Extracting the total number of batch components corresponding to the target packaging batch from the target batch information;

[0012] Determine the number of fully filled tubes in a batch based on the total number of components in the batch, the number of components corresponding to each of the unfilled tubes, and the upper limit number of components that can be contained in a single tube;

[0013] Determine the total number of packaging boxes in the batch and the material tube configuration scheme corresponding to each material tube packaging box according to the number of unfilled material tubes in the batch, the number of fully filled material tubes in the batch and the upper limit number of material tubes in the packaging;

[0014] The number of components in each tube packaging box is determined based on the upper limit number of tubes in the packaging, the upper limit number of components that can be contained in a single tube, and the number of components corresponding to each unfilled tube.

[0015] According to some embodiments of the present application, determining the number of fully loaded tubes in a batch based on the total number of components in the batch, the number of components corresponding to each of the unloaded tubes, and the upper limit number of components that can be accommodated by a single tube includes:

[0016] The number of components corresponding to each of the missing charging tubes is summed to calculate the total number of missing charging tube components of the semiconductor components in each of the missing charging tubes;

[0017] The total number of full-filled tube components of the semiconductor components in each full-filled tube is obtained by performing a difference calculation based on the total number of components in the batch and the total number of components in the unfilled tube;

[0018] A quotient operation is performed based on the total number of components in the fully filled material tube and the upper limit number of components that can be contained in a single tube to determine the number of fully filled material tubes in the batch.

[0019] According to some embodiments of the present application, the material tube configuration scheme includes a conventional configuration scheme for a full box and a specific configuration scheme for an underfull box, and the total number of boxes of the batch packaging and the material tube configuration scheme corresponding to each material tube packaging box are determined according to the number of unfilled material tubes in the batch, the number of fully filled material tubes in the batch and the number of material tubes at the upper limit of packaging, including:

[0020] Counting full boxes according to the number of full tubes in the batch and the upper limit number of tubes in the package to determine the conventional configuration scheme, the number of full boxes and the remaining number of full tubes for each full box;

[0021] Count the unfilled boxes according to the remaining number of full tubes, the number of tubes without material in the batch and the number of tubes with upper limit of the package, so as to determine the specific configuration scheme and the number of unfilled boxes for each unfilled box;

[0022] The total number of boxes in the batch packaging is obtained by summing the number of full boxes and the number of unfull boxes.

[0023] According to some embodiments of the present application, the full box counting is performed according to the number of full material tubes in the batch and the upper limit number of material tubes in the package to determine the conventional configuration scheme, the number of full boxes and the remaining number of full tubes for each full box, including:

[0024] Generating the conventional configuration scheme for each full box according to the number of upper limit material tubes for packaging;

[0025] The quotient operation is performed on the number of fully filled tubes in the batch and the number of tubes with the upper limit of packaging to obtain the number of full boxes and the remainder of full tubes.

[0026] According to some embodiments of the present application, the counting of unfilled boxes according to the remaining number of full tubes, the number of tubes without material in the batch, and the number of tubes with an upper limit of the package is performed to determine the specific configuration scheme and the number of unfilled boxes for each unfilled box, including:

[0027] The sum of the remaining number of full tubes and the number of tubes without loading in the batch is determined as the underfill box calculation factor;

[0028] Performing a quotient operation on the underfill box calculation factor and the number of upper limit tubes for packaging;

[0029] In response to the unfull box calculation factor being divisible by the upper limit number of material tubes for packaging in a quotient operation, a corresponding specific configuration scheme is generated for each unfull box, and the quotient of the unfull box calculation factor and the upper limit number of material tubes for packaging is determined as the number of unfull boxes.

[0030] According to some embodiments of the present application, after performing a quotient operation on the underfill box calculation factor and the number of upper limit tubes for packaging, the method further includes:

[0031] In response to the fact that the unfull box calculation factor cannot be divided by the upper limit number of material tubes for packaging in the quotient operation, the corresponding specific configuration scheme is generated for each unfull box, and the quotient of the unfull box calculation factor and the upper limit number of material tubes for packaging is summed with 1 to obtain the number of unfull boxes.

[0032] According to some embodiments of the present application, generating the corresponding specific configuration scheme for each of the unfull boxes includes:

[0033] When the number of material tubes in the unfilled box reaches the upper limit of the number of material tubes in the packaging, the corresponding specific configuration scheme is generated for the unfilled box according to the conventional packaging specification; wherein the conventional packaging specification refers to the packaging specification of the semiconductor material tubes according to the conventional configuration scheme;

[0034] When the number of material tubes in the unfilled box does not reach the upper limit of the number of material tubes in the packaging, the corresponding specific configuration scheme is generated for the unfilled box according to the number of the semiconductor material tubes in the unfilled box.

[0035] According to some embodiments of the present application, generating the corresponding specific configuration scheme for the incomplete box according to the number of the semiconductor material tubes in the incomplete box includes:

[0036] If the number of the semiconductor material tubes in the incomplete box is greater than the preset number of small specifications, generating the corresponding specific configuration scheme for the incomplete box according to the conventional packaging specifications;

[0037] If the number of the semiconductor material tubes in the incomplete box is less than or equal to the number of small specifications, the corresponding specific configuration scheme is generated for the incomplete box according to the preset conventional packaging specifications.

[0038] According to some embodiments of the present application, if the number of the semiconductor material tubes in the incomplete box is less than or equal to the number of small specifications, generating the corresponding specific configuration scheme for the incomplete box according to the preset conventional packaging specifications includes:

[0039] If the number of the semiconductor material tubes in the unfilled box is less than or equal to the number of small specifications, and the number of the semiconductor material tubes in the unfilled box is less than a preset sway limit number, fill the unfilled box with empty filling tubes;

[0040] For the partially filled box filled with the empty filling tube, the corresponding specific configuration scheme is generated according to the conventional packaging specification.

[0041] According to some embodiments of the present application, the number of components in each material tube packaging box includes the number of components in a full box and the number of components in an incomplete box;

[0042] The determining the number of components in each tube packaging box according to the upper limit number of tubes in the packaging, the upper limit number of components that can be contained in a single tube, and the number of components corresponding to each tube without filling includes:

[0043] For each of the incomplete boxes, the number of components in the corresponding incomplete box is determined according to the upper limit number of components that can be contained in the single tube and the number of components corresponding to each of the incomplete tubes;

[0044] For each of the full boxes, the number of components contained in the corresponding full box is determined according to the upper limit number of material tubes for packaging and the upper limit number of components that can be contained in a single tube.

[0045] According to some embodiments of the present application, for each of the incomplete boxes, determining the number of components in the corresponding incomplete box according to the upper limit number of components that can be contained in the single tube and the number of components corresponding to each of the insufficiently loaded tubes includes:

[0046] For each of the incomplete boxes, determining the corresponding full tube and the underfilled tube;

[0047] For the unfilled box, sum the number of components corresponding to each of the unfilled tubes to obtain the first sub-number of the unfilled box;

[0048] For the unfilled box, sum the upper limit number of components that can be contained in a single tube corresponding to each of the fully filled tubes to obtain a second sub-number of components contained in the unfilled box;

[0049] The first sub-number of the unfull box and the second sub-number of the unfull box corresponding to the unfull box are summed to obtain the number of components in the unfull box.

[0050] According to some embodiments of the present application, before selecting the missing charging tubes for the target packaging batch and counting the number of missing charging tubes to obtain the number of missing charging tubes in the batch and the number of components corresponding to each missing charging tube, the method further includes:

[0051] Scanning the material tube identification code of each semiconductor material tube to obtain the material tube grade constraint information corresponding to each semiconductor material tube;

[0052] Scanning the component identification code of each semiconductor component in each semiconductor material tube to obtain the component level corresponding to each semiconductor component in the semiconductor material tube;

[0053] For the semiconductor components whose component grades do not satisfy the material pipe grade constraint information, the semiconductor components are sorted out from the corresponding semiconductor material pipe and marked as grade problem components.

[0054] According to some embodiments of the present application, before selecting the missing charging tubes for the target packaging batch and counting the number of missing charging tubes to obtain the number of missing charging tubes in the batch and the number of components corresponding to each missing charging tube, the method further includes:

[0055] Capturing an image of each semiconductor material tube to obtain a corresponding tube-mounted component image; wherein the tube-mounted component image is used to present each semiconductor component accommodated in the corresponding semiconductor material tube;

[0056] The selecting and counting the missing charging tubes for the target packaging batch to obtain the number of missing charging tubes in the batch and the number of components corresponding to each missing charging tube includes:

[0057] Based on the tube-mounted component image corresponding to each of the semiconductor material tubes, the tube-mounted component images are counted to obtain the number of tubes without material loading in the batch and the number of components corresponding to each of the tubes without material loading.

[0058] According to some embodiments of the present application, before counting the number of the tube-mounted component images based on the tube-mounted component images corresponding to each of the semiconductor material tubes, the method further includes:

[0059] Performing component appearance inspection on each of the semiconductor components housed in the semiconductor material tube based on the tube-mounted component image;

[0060] The semiconductor components that do not meet the appearance qualification conditions during the component appearance inspection are sorted out from the semiconductor material tube and marked as components with appearance problems.

[0061] According to some embodiments of the present application, the semiconductor components that do not meet the appearance qualification conditions in the component appearance inspection are sorted out from the semiconductor material tube and marked as components with appearance problems, including:

[0062] In response to the presence of the semiconductor component that does not meet the appearance qualification condition in the tube-mounted component image, re-capturing the image of the semiconductor material tube to update the tube-mounted component image;

[0063] In response to the semiconductor components that still do not meet the appearance qualification condition still existing in the updated tube-mounted component image, the semiconductor components that do not meet the appearance qualification condition are sorted out from the semiconductor material tube and marked as components with appearance problems.

[0064] According to some embodiments of the present application, the step of obtaining semiconductor material tubes of a target packaging batch and target batch information corresponding to the target packaging batch includes:

[0065] Obtain a target transport box filled with a plurality of the semiconductor material tubes; wherein the semiconductor material tubes filled in the target transport box belong to the same target packaging batch;

[0066] The tote identification configured for the target tote is scanned to obtain the target batch information corresponding to the target packaging batch.

[0067] In a second aspect, an embodiment of the present application provides a semiconductor material tube packaging device, comprising:

[0068] a batch information acquisition module, used to acquire semiconductor material tubes of a target packaging batch and target batch information corresponding to the target packaging batch, wherein the semiconductor material tubes are used to accommodate semiconductor components, and each of the semiconductor material tubes has the same upper limit number of components that can be accommodated in a single tube; wherein a fully filled material tube is a semiconductor material tube that has reached the upper limit number of components that can be accommodated in a single tube, and an underfilled material tube is a semiconductor material tube that has not reached the upper limit number of components that can be accommodated in a single tube;

[0069] A batch number counting module is used to select the missing charging tubes for the target packaging batch and count the number of the missing charging tubes to obtain the number of the missing charging tubes in the batch and the number of components corresponding to each of the missing charging tubes;

[0070] A packaging parameter calculation module is used to calculate packaging parameters according to a preset upper limit number of material tubes for packaging, the number of tubes without loading in the batch, the number of components corresponding to each of the tubes without loading, the upper limit number of components that can be accommodated in a single tube, and the target batch information, so as to obtain the number of components in each material tube packaging box, the material tube configuration scheme, and the total number of boxes in the batch packaging;

[0071] The tube packaging module is used to perform packaging operations on each semiconductor tube based on the number of components in each tube packaging box, the tube configuration scheme and the total number of boxes in the batch packaging to obtain each tube packaging box corresponding to the target packaging batch.

[0072] In a third aspect, an embodiment of the present application provides a computer-readable storage medium, wherein the storage medium stores a program, and the program is executed by a processor to implement a semiconductor material tube packaging method as described in any one of the embodiments of the first aspect of the present application.

[0073] The semiconductor material tube packaging method and device and storage medium according to the embodiments of the present application have at least the following beneficial effects:

[0074] According to the packaging method of semiconductor material tubes of the embodiment of the present application, it is necessary to first obtain semiconductor material tubes of the target packaging batch and the target batch information corresponding to the target packaging batch. The semiconductor material tubes are used to accommodate semiconductor components, and each semiconductor material tube has the same upper limit number of components that can be accommodated in a single tube; wherein, the semiconductor material tubes that have reached the upper limit number of components that can be accommodated in a single tube are fully loaded material tubes, and the semiconductor material tubes that have not reached the upper limit number of components that can be accommodated in a single tube are underfilled material tubes; for the target packaging batch, underfilled material tubes are selected for number statistics to obtain the number of underfilled material tubes in the batch and the number of components corresponding to each underfilled material tube; packaging parameters are calculated based on the preset upper limit number of material tubes for packaging, the number of underfilled material tubes in the batch, the number of components corresponding to each underfilled material tube, the upper limit number of components for a single tube, and the target batch information to obtain the number of components on the box corresponding to each material tube packaging box, the material tube configuration plan, and the total number of boxes for batch packaging; packaging operations are performed on each semiconductor material tube based on the number of components on the box corresponding to each material tube packaging box, the material tube configuration plan, and the total number of boxes for batch packaging to obtain each material tube packaging box corresponding to the target packaging batch. In this way, this packaging method for semiconductor tubes effectively improves packaging efficiency, reduces error rate, simplifies quality control process, and provides a high-efficiency and high-quality solution for the packaging of semiconductor tubes through automated tube classification, statistics of unfilled tubes, packaging parameter calculation and packaging operation.

[0075] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become apparent from the description below, or will be learned through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0076] The above and / or additional aspects and advantages of the present application will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0077] Figure 1 A schematic diagram of a process for packaging a semiconductor material tube provided in an embodiment of the present application;

[0078] Figure 2 for Figure 1 A flow chart of step S101 in FIG.

[0079] Figure 3 A schematic diagram of a process for marking components with grade problems in an embodiment of the present application;

[0080] Figure 4 for Figure 1 A flow chart of step S102 in FIG.

[0081] Figure 5 A schematic diagram of a process for counting the number of tubes lacking material based on the image of the tube-mounted component in an embodiment of the present application;

[0082] Figure 6 A schematic diagram of a process for marking components with appearance problems in an embodiment of the present application;

[0083] Figure 7 for Figure 6 A flow chart of step S602 in FIG.

[0084] Figure 8 for Figure 1 A flow chart of step S103;

[0085] Fig. 9 for Figure 8 A flow chart of step S802 in FIG.

[0086] Fig.10 for Figure 8 A flow chart of step S803 in FIG.

[0087] Fig.11 for Fig.10 A flow chart of step S1001 in FIG.

[0088] Fig.12 for Fig.10 A flow chart of step S1002 in FIG.

[0089] Fig.13 A schematic diagram of a flow chart for generating a corresponding specific configuration solution for each unfilled box in an embodiment of the present application;

[0090] Fig.14 for Fig.13 A flow chart of step S1302 in FIG.

[0091] Fig.15 for Figure 8 A flow chart of step S804 in FIG.

[0092] Fig.16 for Fig.15 A flow chart of step S1501 in FIG.

[0093] Fig.17 It is a schematic block diagram of a module of a semiconductor material tube packaging device provided in an embodiment of the present application;

[0094] Fig.18 It is a schematic diagram of the hardware structure of the electronic device provided in the embodiment of the present application. DETAILED DESCRIPTION

[0095] The embodiments of the present application are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and cannot be understood as limiting the present application.

[0096] In the description of this application, "several" means one or more, "more" means more than two, "greater than", "less than", "exceed", etc. are understood to exclude the number itself, and "above", "below", "within", etc. are understood to include the number itself. If there is a description of "first" or "second", it is only used for the purpose of distinguishing technical features, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

[0097] In the description of the present application, it should be understood that descriptions involving orientation, such as up, down, left, right, front, back, etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0098] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0099] In the description of this application, it should be noted that, unless otherwise clearly defined, the terms such as setting, installing, connecting, etc. should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in this application in combination with the specific content of the technical solution. In addition, the identification of specific steps below does not represent a limitation on the order of steps and execution logic. The execution order and execution logic between each step should be understood and inferred with reference to the contents described in the embodiment.

[0100] The following is an explanation of the technical terms involved in the embodiments of the present application:

[0101] The packaging process of semiconductor components is aimed at loading a packaging batch of semiconductor components into corresponding semiconductor tubes, and then packaging these semiconductor tubes into tube packaging boxes according to specific packaging requirements and parameters.

[0102] Semiconductor material tube refers to a material tube used to accommodate semiconductor components. The packaged and tested semiconductor components (such as diodes, transistors, etc.) are loaded into semiconductor material tubes according to certain quantities and specifications for easy storage, transportation and use.

[0103] In the field of semiconductor packaging, the two technical terms "packaging batch" and "lot" are often used interchangeably. They both refer to semiconductor components that are divided into the same group during the packaging process. Among them, a packaging batch is also a lot, which corresponds to a group of semiconductor components. In the packaging process of semiconductor components, the corresponding packaging operations are usually performed in units of lots.

[0104] The target packaging batch refers to a packaging batch of semiconductor components that will be packaged during the packaging process. The target packaging batch contains a certain number of semiconductor tubes.

[0105] The upper limit of the number of components that can be accommodated in a single tube refers to the maximum number of semiconductor components that can be accommodated in a semiconductor material tube.

[0106] A fully filled tube refers to a semiconductor tube that has been filled with components and has reached the upper limit of the number of components that can be accommodated in a single tube.

[0107] An underfilled tube refers to a semiconductor tube that has not been fully loaded with components and has not reached the upper limit of the number of components that can be accommodated in a single tube.

[0108] The total number of components in a batch refers to the total number of semiconductor components in the target packaging batch.

[0109] The total number of components in full tubes refers to the total number of components in all full tubes in a target packaging batch.

[0110] The total number of missing tube components refers to the total number of components in all missing tubes in a target packaging batch;

[0111] The upper limit of the number of tubes in a package refers to the maximum number of tubes that each tube packaging box can contain.

[0112] The number of fully filled tubes in a batch refers to the total number of fully filled tubes in the target packaging batch.

[0113] The number of missing loading tubes in a batch refers to the total number of missing loading tubes in the target packaging batch.

[0114] The material tube packaging box refers to the packaging box used to package these semiconductor material tubes after the semiconductor material tubes are packaged.

[0115] The total number of boxes in a batch packaging refers to the total number of tube packaging boxes formed after packaging the semiconductor tubes in the target packaging batch. The tube packaging boxes may include full boxes and incomplete boxes.

[0116] A full box refers to a situation where the number of fully filled tubes in a tube packaging box reaches the upper limit of the number of tubes in the packaging.

[0117] An underfilled box refers to a situation where the number of fully filled tubes in a tube packaging box does not reach the upper limit of the number of tubes in the packaging.

[0118] The number of full boxes refers to the number of full boxes in the total number of boxes in a batch.

[0119] The number of unfilled boxes refers to the number of unfilled boxes in the total number of boxes in a batch.

[0120] The number of components in a box refers to the number of semiconductor components in a tube packaging box. The number of components in a box can include the number of components in a full box and the number of components in an incomplete box.

[0121] The number of components in a full box refers to the total number of components in all the tubes in the full box.

[0122] The number of components in a partially filled box refers to the total number of components in all tubes (whether fully filled or underfilled) in the partially filled box.

[0123] The tube configuration scheme is used to describe the arrangement of semiconductor tubes in each tube packaging box.

[0124] It should be clear that in the process of packaging semiconductor material tubes for the target packaging batch, the embodiment of the present application can define multiple material tube configuration schemes for the target packaging batch, so as to facilitate the semiconductor material tubes contained in the target packaging batch to be allocated into their respective material tube packaging boxes according to the material tube configuration scheme to complete the packaging of the semiconductor material tubes.

[0125] In the packaging process of semiconductor material tubes, the relevant technology faces a series of complex and cumbersome manual operation processes, which include appearance inspection, identification information confirmation, labeling, labeling, label verification, vacuum packaging, folding cartons, and carton packaging. Each link requires manual intervention, which makes the entire packaging process not only inefficient but also prone to human errors. For example, in the appearance inspection stage, the operator needs to carefully check the appearance of the semiconductor components in each semiconductor material tube. Any negligence may cause unqualified semiconductor components to flow into the next link. Similarly, identification information confirmation and label verification also rely on manual operation. The operator must ensure that the information of each label is consistent with the actual semiconductor component and the actual semiconductor material tube. The complexity and repeatability of this process greatly increase the risk of error. For another example, manual participation in the packaging process of semiconductor material tubes makes it difficult to ensure the consistency of the number and grade of components in each material tube, and it is also difficult to avoid the problems of mixing and incorrect filling.

[0126] It is worth noting that there is currently no automated packaging line in the industry specifically for packaging semiconductor material tubes, which cannot effectively reduce packaging costs and makes it difficult to achieve standardization and information management of the packaging process.

[0127] Therefore, the limitations of related technologies not only affect production efficiency, but also put forward higher requirements on the quality control and traceability of semiconductor components in tube packaging and semiconductor material tube packaging.

[0128] In general, the current technologies related to semiconductor tube packaging have problems such as low efficiency, high error rate, and difficulty in quality control in the complex manual operation process. In particular, it is difficult to accurately determine the corresponding packaging parameters for each tube packaging box. It is urgent to improve the overall packaging efficiency and packaging quality through the introduction of automation technology.

[0129] The present application aims to solve at least one of the technical problems existing in the prior art. To this end, the present application proposes a semiconductor material tube packaging method and device, and a storage medium, which can perform high-efficiency and high-quality packaging operations on semiconductor material tubes.

[0130] Further explanation is given below based on the accompanying drawings.

[0131] Reference Figure 1 According to the semiconductor material tube packaging method of the embodiment of the present application, the method may include:

[0132] Step S101, obtaining semiconductor tubes of a target packaging batch and target batch information corresponding to the target packaging batch;

[0133] Step S102, selecting missing charging tubes for the target packaging batch and counting the number of missing charging tubes in the batch and obtaining the number of components corresponding to each missing charging tube;

[0134] Step S103, calculating packaging parameters according to the preset upper limit number of tubes, the number of tubes without loading in a batch, the number of components corresponding to each tube without loading, the upper limit number of components that can be contained in a single tube, and the target batch information, to obtain the number of components in each tube packaging box, the tube configuration scheme, and the total number of boxes in the batch packaging;

[0135] Step S104 , performing packaging operations on each semiconductor tube based on the number of components on each tube packaging box, the tube configuration scheme, and the total number of boxes in the batch packaging, to obtain each tube packaging box corresponding to the target packaging batch.

[0136] The semiconductor material tube packaging method shown in step S101 to step S104 of the present application requires first obtaining semiconductor material tubes of a target packaging batch and target batch information corresponding to the target packaging batch. The semiconductor material tubes are used to accommodate semiconductor components, and each semiconductor material tube has the same upper limit number of components that can be accommodated in a single tube; wherein, a semiconductor material tube whose semiconductor components accommodated in the tube reach the upper limit number of components that can be accommodated in a single tube is a fully filled material tube, and a semiconductor material tube whose semiconductor components accommodated in the tube do not reach the upper limit number of components that can be accommodated in a single tube is an underfilled material tube; the underfilled material tubes are selected for the target packaging batch for number statistics , get the number of tubes missing in the batch and the number of components corresponding to each tube missing; calculate the packaging parameters according to the preset upper limit of the number of tubes, the number of tubes missing in the batch, the number of components corresponding to each tube missing, the upper limit of the number of components that can be accommodated in a single tube and the target batch information, and get the number of components on the box corresponding to each tube packaging box, the tube configuration scheme and the total number of boxes in the batch; perform packaging operations on each semiconductor tube based on the number of components on the box corresponding to each tube packaging box, the tube configuration scheme and the total number of boxes in the batch, and get each tube packaging box corresponding to the target packaging batch. In this way, the packaging efficiency of semiconductor tubes can be effectively improved, the error rate can be reduced, the quality control process can be simplified, and a high-efficiency and high-quality solution can be provided for the packaging of semiconductor tubes.

[0137] In step S101 of some embodiments, semiconductor tubes of a target packaging batch and target batch information corresponding to the target packaging batch are obtained;

[0138] It should be noted that in the process of semiconductor packaging, each packaging batch will have its own unique information set, that is, the corresponding batch information. In some embodiments, the batch information of the packaging batch may include, but is not limited to: the number of the packaging batch, the production date, the component type, the component specification, the component quantity and the quality control data, etc. In some embodiments, the batch information can be generated by the production management system of the semiconductor component and is continuously updated and referenced during the production, testing and packaging of the semiconductor component. It should be noted that the target batch information refers to the batch information of the target packaging batch.

[0139] In some embodiments, the first step of semiconductor material tube packaging is to obtain semiconductor material tubes of a target packaging batch and target batch information corresponding to the target packaging batch. It should be noted that using semiconductor material tubes as containers for semiconductor components can ensure that semiconductor components can be stored safely. Each semiconductor material tube has an upper limit number of components that can be accommodated in a single tube, which is determined by the physical size and design of the semiconductor material tube. It should be pointed out that the upper limit number of components that can be accommodated in a single tube means that each semiconductor material tube has a fixed capacity, which is the maximum number of semiconductor components that the semiconductor material tube can accommodate.

[0140] In this step, the semiconductor material tubes of the embodiment of the present application include fully filled material tubes and underfilled material tubes. Fully filled material tubes refer to semiconductor material tubes whose single tubes are already filled with components and whose upper limit number of components a single tube can accommodate is reached. These fully filled material tubes fully utilize their capacity. In contrast, underfilled material tubes refer to semiconductor material tubes whose single tubes are not yet filled with components and whose upper limit number of components a single tube can accommodate is not reached. These underfilled material tubes may not be filled due to various reasons in the production process (such as component shortage, quality control, etc.).

[0141] In some embodiments, batch information can be used to guide and verify the operation of each step during the packaging of semiconductor tubes. For example, after obtaining the batch information, it can be determined how to allocate semiconductor components to corresponding semiconductor tubes based on the batch information; for another example, it can be determined how many semiconductor components each semiconductor tube should contain based on the batch information. In addition, batch information can also be used for quality traceability. If a problem is found in a semiconductor tube or a semiconductor component in the future, the batch information can be used to trace the problem back to the specific link in the production process, so as to diagnose the problem and improve the quality.

[0142] Reference Figure 2 According to some embodiments of the present application, step S101 obtains semiconductor material tubes of a target packaging batch and target batch information corresponding to the target packaging batch, including:

[0143] Step S201, obtaining a target transport box filled with a plurality of semiconductor material tubes; wherein the semiconductor material tubes filled in the target transport box belong to the same target packaging batch;

[0144] Step S202, scanning the transport box identification configured for the target transport box to obtain target batch information corresponding to the target packaging batch.

[0145] In step S201 of some embodiments, a target transport box filled with multiple semiconductor tubes is obtained. It should be noted that the transport box is used to temporarily or long-term store semiconductor tubes on the production line. The semiconductor components filled in each transport box belong to the same packaging batch. This storage method of semiconductor tubes helps to maintain batch consistency and simplifies the management and tracking process. The target transport box is used to fill the semiconductor tubes corresponding to the target packaging batch.

[0146] In step S202 of some embodiments, target batch information corresponding to the target packaging batch is obtained by scanning the transport box identification configured for the target transport box. It should be noted that the transport box identification can be a barcode or a QR code, and target batch information about the target transport box and the semiconductor material tubes therein, such as batch number, production date, number of material tubes, component type, etc., can be obtained by scanning the transport box identification. Scanning this transport box identification is an automated data collection process, which enables the embodiments of the present application to quickly and accurately determine the target batch information to which the target transport box belongs for the packaging process of semiconductor material tubes.

[0147] Through the embodiment of the present application shown in step S201 to step S202, each semiconductor material tube and the target batch information to which they belong can be accurately associated. This not only helps to ensure accuracy during the packaging process, but also provides a basis for quality control and product traceability. It should be understood that by obtaining the target transport box and scanning the transport box identification, it helps to ensure that each semiconductor material tube can be correctly identified and processed, thereby achieving efficient and accurate packaging operations.

[0148] Reference Figure 3 According to some embodiments of the present application, before selecting missing charging tubes for the target packaging batch and counting the number of missing charging tubes in step S102 to obtain the number of missing charging tubes in the batch and the number of components corresponding to each missing charging tube, the following method may be further included:

[0149] Step S301, scanning the tube identification code of each semiconductor tube to obtain the tube grade constraint information corresponding to each semiconductor tube;

[0150] Step S302, scanning the component identification code of each semiconductor component in each semiconductor material tube to obtain the component grade corresponding to each semiconductor component in the semiconductor material tube;

[0151] Step S303 , for semiconductor components whose component grades do not satisfy the material tube grade constraint information, the semiconductor components are sorted out from the corresponding semiconductor material tube and marked as grade problem components.

[0152] In some embodiments of the present application, a detailed inspection and verification of the semiconductor tube and its internal components is also included before step S102. The purpose of this process is to ensure that the components in each tube meet the predetermined grade requirements, thereby ensuring the quality of the final product.

[0153] In step S301 of some embodiments, each semiconductor material tube is scanned for a material tube identification code. The material tube identification code may include specifications, grades, and other key production parameters of the semiconductor material tube. By scanning these material tube identification codes, the grade constraint information corresponding to each material tube may be obtained, and these grade constraint information define the component grades that should be included in the semiconductor material tube. This step helps to ensure the correct grade of the components in the material tube, because it provides reference data for subsequent component inspection.

[0154] In step S302 of some embodiments, the component identification code of each semiconductor component in each semiconductor material tube is scanned. The component identification code may include information such as the model, production batch, and performance grade of the component. By scanning the component identification code, the grade of the component in the tube can be obtained, thereby verifying whether each semiconductor component in the semiconductor material tube meets the grade requirements of the semiconductor material tube. This step involves individual inspection of each semiconductor component to ensure that they all meet the grade constraints of the corresponding semiconductor material tube.

[0155] In step S303 of some embodiments, if it is found that there are semiconductor components whose grades do not meet the grade constraint information of the material tube, these semiconductor components need to be picked out from the corresponding semiconductor material tube and marked as grade problem components. This step ensures that only components that meet the grade requirements are loaded into the material tube. Picking out and marking grade problem components not only helps prevent unqualified products from flowing into downstream links, but also facilitates subsequent quality review and problem tracking. These grade problem components can be stored separately for further inspection or rework.

[0156] Through step S301 to step S303 of the embodiment of the present application, a detailed quality control process is formed to ensure that the semiconductor components in each semiconductor material tube can meet the corresponding grade requirements. This automated quality control not only improves the accuracy and efficiency of the packaging process, but also helps maintain the quality and reliability of the product and reduces the potential risks and costs caused by grade mismatch.

[0157] In step S102 of some embodiments, for a target packaging batch, missing charging tubes are selected and counted to obtain the number of missing charging tubes in the batch and the number of components corresponding to each missing charging tube;

[0158] It should be noted that step S102 is intended to count the number of tubes lacking loading in the target packaging batch. Among them, a tube lacking loading refers to a semiconductor tube whose single tube is not yet fully loaded with components and whose upper limit of the number of components that can be accommodated in a single tube is not reached. In this step, the embodiment of the present application needs to identify all tubes lacking loading and count the specific number of these tubes lacking loading, that is, the number of tubes lacking loading in the batch. In addition, for each tube lacking loading, it is also necessary to count the number of components actually contained therein.

[0159] According to some embodiments provided by the present application, in the process of obtaining semiconductor material tubes of the target packaging batch, each semiconductor material tube can be configured with a corresponding order. Among them, the order can reflect whether the semiconductor material tube is a tube that is not fully loaded or a tube that is fully loaded. For example, the order in which the tube that is not fully loaded is configured is at the front, and the order in which the tube that is fully loaded is configured is at the back. On this basis, the embodiments of the present application can be based on this order, and the semiconductor material tube that is first obtained is the tube that is not fully loaded. In this way, the number of tubes that are not fully loaded in the target packaging batch can be quickly counted.

[0160] In summary, step S102 automatically counts the number of tubes without filling and records the number of components in each tube without filling in detail. By counting the number of tubes without filling, the number of tubes that are not fully filled with components in the target packaging batch, that is, the number of tubes without filling in the batch, can be accurately grasped. Knowing the number of tubes without filling in the batch can help calculate how many tube packaging boxes are needed. In some cases, it can also help determine the tube configuration scheme in the subsequent steps, so as to more effectively utilize the space of these tube packaging boxes. On the other hand, counting the number of components corresponding to each tube without filling helps to clarify the actual component distribution in the target packaging batch, so as to calculate the tube configuration scheme of full tubes and tubes without filling in the subsequent steps, ensuring that in the packaging process of semiconductor tubes, each tube packaging box can be optimized according to the actual component distribution, thereby improving space utilization and packaging efficiency.

[0161] Reference Figure 4 According to some embodiments of the present application, step S102 selects missing charging tubes for a target packaging batch and performs number counting to obtain the number of missing charging tubes in the batch and the number of components corresponding to each missing charging tube, which may include:

[0162] Step S401, for each semiconductor tube of the target packaging batch, selecting a tube with insufficient loading as the current tube with insufficient loading;

[0163] Step S402, counting the number of components for the currently missing charging tube to obtain the number of components corresponding to the currently missing charging tube;

[0164] Step S403, selecting a missing tube from the remaining semiconductor tubes in the target packaging batch as the current missing tube, returning to perform component number counting for the current missing tube, until all the missing tubes in the target packaging batch are selected, and obtaining the component number corresponding to each missing tube;

[0165] Step S404, counting the number of missing loading tubes in the target packaging batch to obtain the number of missing loading tubes in the batch.

[0166] In step S401 of some embodiments, for each semiconductor tube of the target packaging batch, a missing tube is selected as the current missing tube. This step can use a visual inspection system, a sensor, or a barcode scanning technology to select the missing tube as the current missing tube.

[0167] In step S402 of some embodiments, the number of components is counted for the current missing charging tube to obtain the number of components corresponding to the current missing charging tube. It should be noted that when each missing charging tube in the target packaging batch is used as the current missing charging tube, the number of components contained therein can be determined through 402. This step helps to clarify the filling status of each missing charging tube, and the number of components corresponding to each missing charging tube will be used for subsequent packaging parameter calculation and determination of the tube configuration plan.

[0168] In step S403 of some embodiments, the missing tubes will be selected from the remaining tubes in the target packaging batch, and the number of components will be repeatedly counted until all the missing tubes are counted. This cycle ensures a detailed count of each missing tube, providing complete data support for packaging parameter calculation and tube configuration solution determination.

[0169] In step S404 of some embodiments, all the missing tubes in the target packaging batch are counted to obtain the total number of missing tubes in the batch, that is, the number of missing tubes in the batch. It should be noted that by counting the number of missing tubes in the batch, it is possible to determine how many tube packaging boxes are needed and how to configure these tube packaging boxes to accommodate the semiconductor tubes in the target packaging batch, and how to allocate full tubes and missing tubes.

[0170] Through the embodiment of the present application shown in step S401 to step S404, the number of full tubes in the target packaging batch and the number of components in each underfilled tube can be accurately grasped. These data provide a basis for calculating packaging parameters and formulating an effective tube configuration plan, ensuring high efficiency of the packaging process.

[0171] Reference Figure 5According to some embodiments of the present application, before selecting missing charging tubes for the target packaging batch and counting the number of missing charging tubes in step S102 to obtain the number of missing charging tubes in the batch and the number of components corresponding to each missing charging tube, the following method may be further included:

[0172] Step S501, collecting images of each semiconductor material tube to obtain corresponding tube-mounted component images; wherein the tube-mounted component images are used to present each semiconductor component accommodated in the corresponding semiconductor material tube;

[0173] In step S102, the missing charging tubes are selected for the target packaging batch and the number is counted to obtain the number of missing charging tubes in the batch and the number of components corresponding to each missing charging tube, including:

[0174] Step S502 , based on the tube-mounted component image corresponding to each semiconductor tube, select tubes with missing material for the target packaging batch and perform number statistics to obtain the number of tubes with missing material in the batch and the number of components corresponding to each tube with missing material.

[0175] In step 501 of some embodiments, an image is captured for each semiconductor material tube to obtain a corresponding tube-mounted component image; wherein the tube-mounted component image is used to present each semiconductor component contained in the corresponding semiconductor material tube. It should be noted that the tube-mounted component image is a visual presentation of each semiconductor component in the material tube, which provides an intuitive reference for subsequent component number statistics. By capturing an image of each semiconductor material tube, the arrangement and number of components inside the semiconductor material tube can be captured through some visual detection methods, and the tube-mounted component image is obtained as basic data for subsequent analysis.

[0176] Reference Figure 6 According to some embodiments of the present application, before selecting the tube-mounted component image corresponding to each semiconductor tube and counting the number of tubes lacking material for the target packaging batch in step S502, the following method may also be included:

[0177] Step S601, performing component appearance inspection on each semiconductor component contained in a semiconductor material tube based on the tube-mounted component image;

[0178] Step S602 , for semiconductor components that do not meet the appearance qualification conditions during the component appearance inspection, they are picked out from the semiconductor material tube and marked as components with appearance problems.

[0179] In step S601 of some embodiments, each semiconductor component contained in the semiconductor material tube is inspected for appearance based on the tube-mounted component image. This step is an important part of quality control, and its purpose is to inspect the appearance of each component through automated visual inspection to ensure that they are free of damage, cracks, contamination or other appearance defects that may affect performance.

[0180] It should be noted that the appearance inspection of components can be carried out by using high-resolution cameras to collect images of tube-mounted components, combined with image processing algorithms to identify and evaluate whether there are any abnormalities on the surface of the components in the images of tube-mounted components. These image processing algorithms can compare with the preset appearance standards, automatically detect appearance deviations, and mark components that do not meet the appearance qualification conditions. This automated appearance inspection greatly improves the speed and accuracy of the inspection and reduces the subjectivity and errors that may be introduced by manual inspection.

[0181] In step S602 of some embodiments, for semiconductor components that do not meet the appearance qualification conditions during the component appearance inspection, it is necessary to pick out these components from the semiconductor material tube and mark them as components with appearance problems. This step ensures that only semiconductor components with qualified appearance will be retained in the semiconductor material tube, while those with potential problems will be separated for further analysis and processing. Picking out components with appearance problems not only helps to improve the quality of the final product, but also helps to prevent these components with appearance problems from causing greater losses in subsequent production or use.

[0182] Reference Figure 7 According to some embodiments of the present application, step S602, for semiconductor components that do not meet the appearance qualification conditions in the component appearance inspection, is sorted out from the semiconductor material tube and marked as components with appearance problems, which may include:

[0183] Step S701, in response to the presence of semiconductor components that do not meet the appearance qualification condition in the tube-mounted component image, re-capturing the image of the semiconductor material tube to update the tube-mounted component image;

[0184] Step S702 , in response to the semiconductor components that still do not meet the appearance qualification condition in the updated tube-mounted component image, the semiconductor components that do not meet the appearance qualification condition are picked out from the semiconductor material tube and marked as components with appearance problems.

[0185] In step S701 of some embodiments, when a semiconductor component that does not meet the appearance qualification condition is detected in the tube-mounted component image, the semiconductor material tube can be re-imaged to update the tube-mounted component image. It should be noted that the re-image of the semiconductor material tube may be due to a variety of reasons, including unclear initial images, changes in component positions, or omissions of certain components during the first inspection. By re-capturing the image, more accurate component position and status information in the semiconductor material tube can be obtained, which is helpful for the appearance inspection and number counting of semiconductor components.

[0186] In step S702 of some embodiments, if the updated tube-mounted component image still shows semiconductor components that do not meet the appearance qualification conditions, then a sorting operation will need to be performed to sort out these semiconductor components that do not meet the appearance qualification conditions from the semiconductor material tube and mark them as components with appearance problems. This step shows the strictness of the quality control of the embodiment of the present application, that is, after re-capturing the image, all semiconductor components that do not meet the conditions will be removed to ensure that only components with appearance qualifications are contained in the semiconductor material tube. This strict handling of components with appearance problems not only improves the quality of the product, but also helps to reduce problems that may occur in subsequent production processes.

[0187] Through step S701 to step S702 of the embodiment of the present application, an automated quality control process is formed, which ensures that the semiconductor components in the semiconductor material tube meet strict standards in appearance. By continuously updating image data and accurately picking out components with appearance problems, the accuracy of the packaging process is improved and the product quality is better guaranteed.

[0188] Through step S601 to step S602 of the embodiment of the present application, this automated appearance inspection and problem component sorting process not only improves packaging efficiency, but also ensures that only components that meet appearance standards will be included in the final packaging, and components with appearance problems will be sorted out, thereby better ensuring product quality.

[0189] In step S502 of some embodiments, based on the tube-mounted component image corresponding to each semiconductor material tube, the tubes without material are selected for the target packaging batch for number counting, and the number of tubes without material in the batch and the number of components corresponding to each tube without material are obtained. It should be noted that this step uses image processing and pattern recognition technology to automatically identify and count the number of components presented in the tube-mounted component image. This image-based number counting method improves the accuracy and efficiency of statistics because it reduces errors and omissions in manual counting and also speeds up processing.

[0190] The embodiment of the present application shown by step S501 to step S502 constitutes an automated, image-based counting process for the number of tube components. They provide an efficient and accurate component counting method before counting the number of tubes without loading and the number of components. This image-based processing method not only improves the accuracy and efficiency of the packaging process, but also ensures the quality of the product and reduces the potential risks and costs caused by inaccurate counting.

[0191] In step S103 of some embodiments, packaging parameters are calculated based on the preset upper limit number of material tubes for packaging, the number of tubes without loading in a batch, the number of components corresponding to each tube without loading, the upper limit number of components that can be contained in a single tube, and target batch information, to obtain the number of components in each material tube packaging box, the material tube configuration scheme, and the total number of boxes in the batch packaging;

[0192] In some embodiments, step S103 is the core link in the semiconductor tube packaging method, which involves the calculation of packaging parameters so as to most effectively distribute the semiconductor tubes into the tube packaging boxes in subsequent steps to improve packaging efficiency and meet specific packaging requirements.

[0193] In some embodiments, the process of packaging parameter calculation may involve determining how many components each tube packaging box should contain, how to configure the tubes (including full tubes and underfilled tubes) in the tube packaging box to maximize space utilization, and how to ensure that the packaging meets specific quality standards and packaging requirements.

[0194] It should be clear that in the process of packaging semiconductor tubes, if the accurate packaging parameters are not calculated and each tube is simply packaged in sequence, the number of tubes and components in each tube packaging box will be inconsistent. In this case, the efficiency and accuracy of tube packaging are difficult to guarantee, because the packaging status of each packaging box will vary due to human factors, lacking consistency and predictability.

[0195] Therefore, in order to ensure the consistency and efficiency of packaging, for a target packaging batch, all the tubes and their component quantities must be planned and calculated uniformly according to certain rules. In some cases, the first principle of this planning is to fill the full tubes first, and the remaining unfilled tubes need to be allocated according to certain rules to ensure that the packaging state of each tube packaging box is as close to the optimal as possible.

[0196] In the related art, in the manual packaging scenario, the operator can distinguish between full and underfilled tubes through simple calculations and intuitive recognition, and pack according to the predetermined number of labels. The operator's experience and intuitive judgment play a key role in this process, and they can flexibly adjust the packaging plan according to the actual situation.

[0197] However, in the process of automated packaging, the situation becomes much more complicated. In some embodiments of the present application, it is necessary to be able to automatically identify full tubes and underfull tubes, calculate the ideal packaging state of each tube packaging box, and accurately distribute them. This not only involves the physical identification and counting of semiconductor tubes, but also is closely related to the subsequent actual packaging operations.

[0198] In order to overcome these difficulties, the embodiment of the present application automatically identifies full tubes and underfull tubes and automatically determines various packaging parameters, which facilitates the subsequent automated packaging of semiconductor material tubes and achieves high efficiency and high quality of the entire automated packaging process. In this way, not only the accuracy of packaging is improved, but also the possibility of human error is reduced.

[0199] It should be noted that the upper limit of the number of tubes in a package refers to the maximum number of tubes that can be contained in each tube packaging box. This upper limit of the number of tubes in a package can be preset based on the size and design of the tube packaging box to ensure that the semiconductor tubes can be safely stored and easily transported. The number of tubes missing in a batch and the number of components corresponding to each missing tube provide detailed information on the filling status of the missing tubes in the current batch, which is crucial for deciding how to allocate full and missing tubes.

[0200] It should be emphasized that the upper limit number of components that can be contained in a single tube refers to the maximum number of semiconductor components that can be contained in a semiconductor tube. This upper limit number of components that can be contained in a single tube helps calculate the number of semiconductor components in different tube packaging boxes, that is, the number of components in the box. The target batch information can include the total number of batch components of semiconductor components in the target packaging batch.

[0201] In the related art, the packaging process of semiconductor tubes mainly relies on manual operation, so it is often not necessary to accurately determine the specific tube configuration plan for each tube packaging box. During the manual packaging process, the tubes are usually placed in the packaging box based on experience and on-site conditions. This method lacks precision and consistency, is inefficient, and is prone to errors.

[0202] In contrast, the present application provides an automated solution by accurately calculating and generating a material tube configuration plan for each material tube packaging box. In subsequent steps, the material tubes can be placed in the packaging box according to the material tube configuration plan.

[0203] Specifically, the present application first obtains the upper limit number of material tubes for packaging, the number of tubes lacking in a batch, the number of components corresponding to each tube lacking in loading, the upper limit number of components that can be accommodated in a single tube, and the target batch information in an automated manner for the target packaging batch. Furthermore, taking into account various different situations such as full boxes and underfull boxes, the corresponding material tube configuration scheme is generated for each situation through the various parameters obtained above to ensure that the embodiment of the present application can perform efficient and high-quality packaging operations on semiconductor material tubes. Subsequently, the semiconductor material tubes are loaded into the material tube packaging box according to the generated material tube configuration scheme, so that the packaging efficiency and accuracy can be improved.

[0204] It should be understood that the material tube configuration scheme determined by automated calculation can achieve a relatively ideal space utilization rate for each material tube packaging box (whether full or not), which not only reduces material waste, but also helps to reduce logistics costs. In addition, the material tube configuration scheme also helps to improve the automation level of the production line. Through the material tube configuration scheme, the automated packaging process can accurately place each semiconductor material tube into the designated material tube packaging box, reducing the need for manual operation and the possibility of human error, while also improving the work efficiency of semiconductor material tube packaging.

[0205] Based on the various parameters involved above, the packaging parameter calculation in step S103 will need to determine the number of components on the box corresponding to each material tube packaging box, the material tube configuration plan and the total number of boxes in the batch packaging. The number of components on the box refers to the total number of components that should be contained in each material tube packaging box, which directly affects the filling rate and space utilization efficiency of the material tube packaging box. The material tube configuration plan details the arrangement of full material tubes and underfilled material tubes in each material tube packaging box to ensure that all semiconductor material tubes can be placed reasonably. The total number of boxes in the batch packaging refers to the total number of material tube packaging boxes formed after packaging the semiconductor material tubes in the target packaging batch. Among them, the material tube packaging box can include full boxes and underfilled boxes.

[0206] It should be understood that the embodiments of the present application can ensure high efficiency and accuracy of the packaging process through accurate packaging parameter calculation, while reducing manual operation errors and improving packaging consistency. In addition, the automated calculation process also helps to reduce labor costs and improve the overall performance of the production line. It can be seen that this method can provide a clear and predictable packaging solution for the packaging of semiconductor tubes, ensuring that each tube packaging box can meet the required packaging requirements.

[0207] Reference Figure 8 According to some embodiments of the present application, step S103 calculates packaging parameters according to the preset upper limit number of material tubes for packaging, the number of tubes without loading in a batch, the number of components corresponding to each tube without loading, the upper limit number of components that can be accommodated in a single tube, and the target batch information, and obtains the number of components in each material tube packaging box, the material tube configuration scheme, and the total number of boxes in the batch packaging, which may include:

[0208] Step S801, extracting the total number of batch components corresponding to the target packaging batch from the target batch information;

[0209] Step S802, determining the number of fully loaded tubes in the batch based on the total number of components in the batch, the number of components corresponding to each unloaded tube, and the upper limit number of components that can be contained in a single tube;

[0210] Step S803, determining the total number of packaging boxes in the batch and the material tube configuration scheme corresponding to each material tube packaging box according to the number of unfilled material tubes in the batch, the number of fully filled material tubes in the batch and the upper limit number of material tubes in the packaging;

[0211] Step S804, determining the number of components in each tube packaging box according to the upper limit number of tubes for packaging, the upper limit number of components that can be contained in a single tube, and the number of components corresponding to each unfilled tube.

[0212] In step S801 of some embodiments, the total number of batch components corresponding to the target packaging batch is extracted from the target batch information. The total number of batch components determines the scale of components that need to be packaged in the entire target packaging batch. It should be noted that the total number of batch components is one of the key data included in the target batch information.

[0213] In step S802 of some embodiments, the embodiments of the present application determine the number of fully loaded tubes in the batch based on the total number of components in the batch, the number of components corresponding to each unloaded tube, and the upper limit number of components that can be accommodated in a single tube. It should be noted that fully loaded tubes refer to tubes that are already filled with semiconductor components and have reached the upper limit number of components that can be accommodated in a single tube. Based on the total number of components in the batch, the number of components in the unloaded tube, and the upper limit number of components that can be accommodated in a single tube, the embodiments of the present application can calculate the number of fully loaded tubes in the batch corresponding to the fully loaded tubes in the target batch information.

[0214] Reference Fig. 9 According to some embodiments of the present application, step S802 determines the number of fully loaded tubes in a batch based on the total number of components in the batch, the number of components corresponding to each unloaded tube, and the upper limit number of components that can be contained in a single tube, and may include:

[0215] Step S901, summing the number of components corresponding to each missing charging tube, and calculating the total number of missing charging tube components of the semiconductor components in each missing charging tube;

[0216] Step S902, performing a difference calculation based on the total number of components in the batch and the total number of components in the unfilled tubes to obtain the total number of components in the fully filled tubes of semiconductor components in each fully filled tube;

[0217] Step S903, performing a quotient operation based on the total number of components in the fully-filled tubes and the upper limit number of components that can be contained in a single tube, so as to determine the number of fully-filled tubes in the batch.

[0218] In step S901 of some embodiments, the embodiments of the present application sum the number of components corresponding to each missing charging tube to calculate the total number of missing charging tube components of the semiconductor components in all missing charging tubes. The embodiments of the present application can obtain the total number of missing charging tube components by collecting the number of components of each missing charging tube and then adding these numbers. It should be clarified that the total number of missing charging tube components refers to the total number obtained by summing up the number of components in all missing charging tubes in a target packaging batch.

[0219] In step S902 of some embodiments, the embodiments of the present application perform a difference calculation based on the total number of batch components and the total number of components in the missing tubes to obtain the total number of full tube components of semiconductor components in the full tubes. This step is completed by subtraction, that is, subtracting the total number of components in the missing tubes from the total number of batch components in the entire target packaging batch, and the result is the total number of full tube components in all full tubes. It should be clear that the total number of full tube components refers to the total number obtained by adding up the number of components in all full tubes in a target packaging batch.

[0220] In step S903 of some embodiments, the embodiments of the present application perform a quotient operation based on the total number of components in the fully-filled material tubes and the upper limit number of components that can be contained in a single tube to determine the number of fully-filled material tubes in the batch. This step is completed by dividing the total number of components in the fully-filled material tubes by the upper limit number of components that can be contained in a single tube. The result of this division operation is the number of fully-filled material tubes in the batch, that is, the number of material tubes that have been fully filled with components and have reached the upper limit number of components that can be contained in a single tube.

[0221] In some more specific embodiments, the total number of components in a batch can be expressed as X, and the upper limit number of components that can be accommodated in each semiconductor tube can be expressed as A. max , the number of components corresponding to each missing loading tube can be expressed as A1, A2, A3, ..., A M , where M is the number of missing tubes in a batch, and the number of components corresponding to each missing tube is less than A max .

[0222] First, the number of components corresponding to each missing charging tube is A1, A2, A3, ..., A M Sum the numbers and calculate the total number of missing tube components Y, which can be expressed as:

[0223]

[0224] Furthermore, a difference calculation is performed based on the total number of batch components X and the total number of components in the unfilled tubes Y to obtain the total number of components in the fully filled tubes, which can be expressed as XY.

[0225] Furthermore, according to the total number of components in the fully filled tube XY and the upper limit number of components that can be accommodated in a single tube A max By performing the quotient operation, the number of fully filled tubes in a batch can be determined, which can be expressed as:

[0226]

[0227] The embodiment of the present application shown by steps S901 to S903 can accurately determine the number of fully filled material tubes in the target packaging batch, which is crucial for the subsequent packaging parameter calculation and material tube configuration scheme. This automated calculation method not only improves the accuracy and efficiency of the calculation, but also reduces the possibility of human error, ensuring the accuracy and efficiency of the packaging process.

[0228] In step S803 of some embodiments, the embodiments of the present application determine the total number of batch packaging boxes and the material tube configuration scheme corresponding to each material tube packaging box based on the number of unfilled material tubes in the batch, the number of fully filled material tubes in the batch, and the number of material tubes with an upper limit of packaging. The material tube packaging box refers to the packaging box used to package these semiconductor material tubes after packaging the semiconductor material tubes. The total number of batch packaging boxes refers to the total number of material tube packaging boxes formed after packaging the semiconductor material tubes in the target packaging batch. The material tube configuration scheme is used to describe the arrangement of the semiconductor material tubes in each material tube packaging box.

[0229] It should be emphasized that in the process of packaging semiconductor tubes for the target packaging batch, the embodiment of the present application can define multiple tube configuration schemes for the target packaging batch, so as to facilitate the allocation of the semiconductor tubes contained in the target packaging batch into their respective tube packaging boxes according to the tube configuration scheme. Among them, the upper limit of the number of tubes in the packaging refers to the maximum number of tubes that each tube packaging box can accommodate. The embodiment of the present application can reasonably determine the tube configuration scheme for each tube packaging box under the premise of meeting the upper limit of the number of tubes in the packaging. In the subsequent steps, the fully loaded tubes and the under-loaded tubes are allocated to different tube packaging boxes according to the tube configuration scheme, which can ensure that all semiconductor tubes can be reasonably packaged.

[0230] Reference Fig.10 According to some embodiments of the present application, the material tube configuration scheme includes a conventional configuration scheme for a full box and a special configuration scheme for an underfull box. Step S803 determines the total number of boxes in a batch and the material tube configuration scheme corresponding to each material tube packaging box according to the number of tubes without filling in the batch, the number of tubes with full filling in the batch and the number of tubes with an upper limit of packaging, which may include:

[0231] Step S1001, counting full boxes according to the number of full tubes in a batch and the upper limit number of tubes in a package, so as to determine the conventional configuration scheme, the number of full boxes and the remaining number of full tubes for each full box;

[0232] Step S1002, counting the unfilled boxes according to the remaining number of full tubes, the number of tubes without material in the batch and the number of tubes with the upper limit of packaging, so as to determine the specific configuration scheme and the number of unfilled boxes for each unfilled box;

[0233] Step S1003, summing the number of full boxes and the number of unfull boxes to obtain the total number of boxes in the batch packaging.

[0234] In some embodiments of the present application, the material tube configuration scheme involves how to effectively allocate full material tubes and underfilled material tubes to different material tube packaging boxes. Specifically, the material tube configuration scheme can include a conventional configuration scheme for a full box and a specific configuration scheme for an underfilled box to ensure that all semiconductor material tubes can be reasonably packaged while meeting the space utilization and component protection requirements of the material tube packaging box. Among them, a full box refers to the situation where the number of full material tubes in a material tube packaging box reaches the upper limit of the number of material tubes in the packaging, and an underfilled box refers to the situation where the number of full material tubes in a material tube packaging box does not reach the upper limit of the number of material tubes in the packaging.

[0235] In step S1001 of some embodiments, full boxes are counted according to the number of fully filled tubes in a batch and the number of tubes with an upper limit for packaging. The purpose of this step is to determine the conventional configuration scheme, the number of full boxes, and the remaining number of full tubes for each full box. It should be noted that for the target packaging batch of semiconductor tubes, conventional configuration schemes and specific configuration schemes may be included. Among them, the conventional configuration scheme refers to the tube configuration scheme that completely fills the tube packaging box with fully filled tubes, and the packaging specifications for packaging semiconductor tubes according to the conventional configuration scheme are called conventional packaging specifications; the specific configuration scheme refers to the tube configuration scheme that fills the tube packaging box with fully or partially unfilled tubes.

[0236] The embodiment of the present application can determine how many complete full boxes can be formed and the number of full tubes remaining by calculating the number of full tubes and the number of tubes that each tube packaging box can accommodate; wherein the number of full tubes remaining refers to the number of full tubes that will remain after all full boxes of the target packaging batch are filled.

[0237] Reference Fig.11 According to some embodiments of the present application, step S1001 counts full boxes according to the number of full tubes in a batch and the number of tubes with an upper limit of packaging to determine a conventional configuration scheme for each full box, the number of full boxes, and the remaining number of full tubes, which may include:

[0238] Step S1101, generating a conventional configuration plan for each full box according to the number of upper limit tubes for packaging;

[0239] Step S1102, performing a quotient operation on the number of fully filled tubes of a batch and the number of tubes of the upper limit of packaging to obtain the number of full boxes and the remainder of full tubes.

[0240] In step S1101 of some embodiments, a conventional configuration scheme for each full box is generated according to the number of tubes in the upper limit of packaging. Based on the number of tubes in the upper limit of packaging, the embodiments of the present application can determine how many full tubes should be included in each full box, thereby generating a standard conventional configuration scheme. This conventional configuration scheme provides a template for each full box to ensure that all full boxes can be filled according to the same standard, which can improve the consistency and efficiency of packaging. For example, a tube packaging box filled according to the conventional configuration scheme needs to include 7 full tubes.

[0241] In step S1102 of some embodiments, a quotient operation is performed on the number of fully loaded material tubes in a batch and the number of material tubes in the upper limit of packaging to obtain the number of full boxes and the remainder of full tubes. It should be noted that the number of material tubes in the upper limit of packaging refers to the maximum number of material tubes that can be accommodated in each material tube packaging box. Based on this upper limit number of material tubes in packaging, the embodiments of the present application can determine how many material tubes should be contained in each full box. Based on this, the number of fully loaded material tubes in a batch is calculated as a quotient with the number of material tubes in the upper limit of packaging to obtain the number of full boxes in the total number of boxes in the batch packaging, as well as the remainder of full tubes of full loaded material tubes that will remain after all full boxes are formed by the full number of full loaded material tubes in the batch.

[0242] In some more specific embodiments, the number of tubes in the upper limit of packaging can be expressed as N, and the number of tubes in the batch full of material can be expressed as Z. Based on this, the number of tubes in the batch full of material Z and the number of tubes in the upper limit of packaging N are calculated as quotients to obtain the number of full boxes P and the remainder of full tubes g, which can be expressed as:

[0243]

[0244] g=Z mod N

[0245] Among them, [.] indicates rounding operation. mod indicates remainder operation, that is, Z mod N = g means "the number of full-filled tubes in a batch Z is divided by the number of tubes in the upper limit of packaging N, and the remainder is the remainder of the full tube g".

[0246] In step S1002 of some embodiments, the unfilled boxes are counted according to the remaining number of full tubes, the number of tubes with missing material in the batch, and the upper limit number of tubes for packaging obtained in the previous step. The purpose of this step is to determine the specific configuration scheme and the number of unfilled boxes for each unfilled box. It should be noted that an unfilled box refers to a situation where the number of full tubes in a tube packaging box does not reach the upper limit number of tubes for packaging, and the specific configuration scheme refers to a tube configuration scheme for filling tube packaging with all or part of the missing tubes. Among them, the specific configuration scheme can be a tube configuration scheme for mixing full tubes with missing tubes for packaging, and can also be a tube configuration scheme specifically for packaging missing tubes.

[0247] Reference Fig.12According to some embodiments of the present application, step S1002 counts the unfilled boxes according to the remaining number of full tubes, the number of tubes without material in a batch, and the number of tubes with an upper limit of packaging to determine the specific configuration scheme and the number of unfilled boxes for each unfilled box, which may include:

[0248] Step S1201, the sum of the remaining number of full tubes and the number of tubes without filling in the batch is determined as the calculation factor of the underfilled box;

[0249] Step S1202, performing a quotient operation on the underfill box calculation factor and the upper limit number of tubes for packaging;

[0250] Step S1203, in response to the unfilled box calculation factor being divided by the upper limit number of tubes for packaging in the quotient operation, a corresponding specific configuration scheme is generated for each unfilled box, and the quotient of the unfilled box calculation factor and the upper limit number of tubes for packaging is determined as the number of unfilled boxes.

[0251] In some embodiments of the present application, step S1002 focuses on determining a specific configuration scheme for the unfilled boxes and the number of unfilled boxes. This step is performed after the number of full boxes and the number of full tubes remaining have been determined, in order to ensure that the unfilled tubes can also be packaged reasonably.

[0252] In step S1201 of some embodiments, the remaining number of full tubes is added to the number of tubes lacking material in the batch to determine the unfilled box calculation factor. This unfilled box calculation factor is the basis for unfilled box counting, which reflects the total number of tubes remaining after forming a full box. The unfilled box calculation factor includes the remaining number of full tubes and the number of all tubes lacking material.

[0253] In step S1202 of some embodiments, a quotient operation is performed on the underfill calculation factor and the upper limit number of tubes for packaging. This step is performed by dividing the underfill calculation factor by the upper limit number of tubes for packaging of each tube packaging box. The purpose of this division operation is to determine how many tube packaging boxes are needed to accommodate the remaining tubes after the box is full.

[0254] In step S1203 of some embodiments, if the unfilled box calculation factor is divisible by the packaging upper limit tube number in the quotient calculation, a corresponding specific configuration scheme is generated for each unfilled box, and the quotient of the unfilled box calculation factor and the packaging upper limit tube number is determined as the number of unfilled boxes. This means that if the total number of remaining tubes is divisible by the packaging upper limit tube number of each tube packaging box, then each unfilled box will have a specific configuration scheme to ensure that these semiconductor tubes are correctly loaded into the box.

[0255] According to some embodiments of the present application, after performing a quotient operation on the underfill box calculation factor and the upper limit number of tubes for packaging in step S1102, the following step S1204 may also be included.

[0256] In step S1204 of some embodiments, in response to the fact that the unfull box calculation factor cannot be divided by the upper limit number of packaging tubes in the quotient operation, a corresponding specific configuration scheme is generated for each unfull box, and the quotient of the unfull box calculation factor and the upper limit number of packaging tubes is summed with 1 to obtain the number of unfull boxes.

[0257] In some embodiments of the present application, in addition to considering the case where the underfill box calculation factor can be divided by the upper limit number of tubes of packaging, it is also necessary to handle the complex case where the underfill box calculation factor cannot be divided by the upper limit number of tubes of packaging.

[0258] After calculating the quotient of the unfilled box calculation factor and the number of tubes in the upper limit of packaging, if it is found that the unfilled box calculation factor cannot be divided by the number of tubes in the upper limit of packaging, it means that there are remaining tubes that are not enough to fill a standard tube packaging box. In order to handle this situation, a corresponding specific configuration scheme is generated for each unfilled box in the step. This specific configuration scheme can be generated based on the specific number and characteristics of the remaining tubes to ensure that all semiconductor tubes can be effectively packaged.

[0259] Furthermore, the quotient of the underfill calculation factor and the number of tubes in the upper limit of packaging is added to 1 to obtain the number of underfill boxes. The purpose of this operation is to ensure that even when it is not divisible, the number of underfill boxes required to accommodate all the remaining tubes can be accurately calculated. The reason for adding 1 to the quotient is that even if the number of remaining tubes is not enough to fill a full tube packaging box, an additional tube packaging box is still required to package these remaining tubes.

[0260] Through the meticulous processing of the embodiment of the present application, it is possible to ensure that all semiconductor tubes, whether fully filled or underfilled, can be properly packaged without omission. This method improves the flexibility and adaptability of the packaging process, ensuring that the packaging task can be completed efficiently even when faced with an irregular number of remaining tubes.

[0261] In some more specific embodiments, the remaining number of full tubes can be expressed as g, and the number of tubes without filling in a batch can be expressed as M. Therefore, the calculation factor of the unfilled box can be expressed as g+M.

[0262] Furthermore, the quotient of the underfilled box calculation factor g+M and the upper limit number of tubes N can be expressed as:

[0263]

[0264] In response to the fact that the underfill box calculation factor g+M is divided by the upper limit number of tubes N in the packaging operation, that is, (g+M) mod N = 0, a corresponding specific configuration scheme needs to be generated for each underfill box, and the quotient of the underfill box calculation factor and the upper limit number of tubes is calculated. Determine the number of unfilled boxes Q, that is,

[0265]

[0266] In response to the fact that the underfill box calculation factor g+M cannot be divided by the upper limit number of tubes N in the packaging in the quotient operation, that is, (g+M) mod N≠0, it is necessary to generate a corresponding specific configuration scheme for each underfill box, and convert the quotient of the underfill box calculation factor and the upper limit number of tubes into Sum with 1 to get the number of unfilled boxes Q, which is

[0267] The embodiment of the present application shown in step S1101 to step S1103 can accurately determine the number and configuration of the unfilled boxes, ensuring that all semiconductor tubes, whether full or underfilled, can be effectively packaged. This automated counting and configuration scheme generation process improves packaging efficiency, reduces human errors, and ensures packaging consistency and reliability.

[0268] In step S1003 of some embodiments, the number of full boxes and the number of unfull boxes are summed to obtain the total number of boxes for batch packaging. This step is used to determine the total number of material tube packaging boxes required to complete the entire batch packaging. This total number of boxes for batch packaging is very important information for material requirement planning, logistics scheduling and cost control.

[0269] Through the steps S1001 to S1003 provided in the embodiment of the present application, a detailed material tube configuration solution process is formed, which ensures that both fully loaded material tubes and under-loaded material tubes can be reasonably allocated to different material tube packaging boxes. This automated configuration solution not only improves packaging efficiency, but also ensures packaging consistency and reliability, ultimately achieving efficient and high-quality packaging operations.

[0270] Reference Fig.13 According to some embodiments of the present application, generating a corresponding specific configuration scheme for each unfilled box may include:

[0271] Step S1301, when the number of material tubes in the unfilled box reaches the upper limit of the number of material tubes to be packaged, a corresponding specific configuration scheme is generated for the unfilled box according to conventional packaging specifications; wherein the conventional packaging specifications refer to packaging specifications for semiconductor material tubes according to conventional configuration schemes;

[0272] Step S1302, when the number of material tubes in the unfull box does not reach the upper limit of the number of material tubes in packaging, a corresponding specific configuration scheme is generated for the unfull box according to the number of semiconductor material tubes in the unfull box.

[0273] In some embodiments of the present application, generating a corresponding specific configuration scheme for each unfilled box is a key step, which ensures that the packaging process can still be carried out efficiently and safely even when the tubes are not full. This process involves two different situations, corresponding to whether the number of tubes in the unfilled box reaches the upper limit of the number of tubes for packaging.

[0274] In step S1301 of some embodiments, if the number of material tubes in the unfilled box reaches the upper limit of the number of material tubes in the packaging, a corresponding specific configuration scheme will be generated for the unfilled box according to the conventional packaging specifications. It should be emphasized that the conventional configuration scheme refers to the material tube configuration scheme that completely fills the material tube packaging box with full material tubes, and the packaging specifications for packaging semiconductor material tubes according to the conventional configuration scheme are called conventional packaging specifications; the specific configuration scheme refers to the material tube configuration scheme that fills the material tube packaging box with all or part of the unfilled material tubes. In this case, although these semiconductor material tubes are not completely filled with components, their number reaches the maximum number of material tubes that the material tube packaging box can accommodate, so they can be packaged according to the standard process. This ensures the consistency and efficiency of packaging, while also ensuring that the space of the material tube packaging box is fully utilized.

[0275] In step S1302 of some embodiments, if the number of tubes in the unfull box does not reach the upper limit of the number of tubes in the packaging, a corresponding specific configuration scheme will be generated for the unfull box according to the actual number of semiconductor tubes in the unfull box. In this case, a specific configuration scheme is needed to adapt to the tube packaging box where the number of tubes does not reach the upper limit of the number of tubes in the packaging to ensure that all semiconductor tubes can be properly placed and protected. This specific configuration scheme may involve the arrangement of semiconductor tubes, the use of filling materials, and other protective measures to ensure the safety of semiconductor tubes during transportation and storage.

[0276] Reference Fig.14 According to some embodiments of the present application, step S1302 generates a corresponding specific configuration scheme for the unfilled box according to the number of semiconductor material tubes in the unfilled box, which may include:

[0277] Step S1401, if the number of semiconductor tubes in the unfilled box is less than the preset sway limit number, fill the unfilled box with empty tubes;

[0278] Step S1402, for the partially filled box filled with the empty filling tube, a corresponding specific configuration scheme is generated according to conventional packaging specifications.

[0279] In step S1401 of some embodiments, if the number of semiconductor tubes in the unfilled box is not only less than or equal to the number of small specifications, but also lower than the preset shaking limit number, the embodiments of the present application will fill the unfilled box with empty tubes. The shaking limit number is an important parameter that defines the minimum number of tubes in a package to ensure the stability of the package during transportation and handling. If the number of tubes is lower than this limit, the tubes may shake in the tube packaging box, thereby increasing the risk of damage. Therefore, by filling empty tubes, the total number of tubes in the tube packaging box can be increased, shaking can be reduced, and the stability of the package and the safety of the components can be ensured.

[0280] In step S1402 of some embodiments, for those incomplete boxes filled with empty charging tubes, the embodiments of the present application will generate a corresponding specific configuration scheme according to conventional packaging specifications. This specific configuration scheme will take into account the existence of the filling tubes and ensure that all tubes, including the tubes actually filled with components and the empty charging tubes, can be properly placed and protected. Small configuration schemes may include special arrangements, the use of filling materials or other protective measures to adapt to the situation where the number of tubes is small and includes empty charging tubes.

[0281] Through the two steps of step S1401 to step S1402, the embodiment of the present application can provide a customized solution for the incomplete boxes with a small number of material tubes, ensuring that these packages can meet the requirements of stability and protect the components therein from damage. This meticulous processing method improves the adaptability and flexibility of the packaging, ensuring that all material tubes, regardless of their number, can be safely and efficiently packaged.

[0282] Through the processing of these two situations of step S1401 and step S1402, the embodiment of the present application can flexibly cope with different numbers of semiconductor material tubes and generate appropriate packaging solutions. This flexibility and adaptability are the key to improving packaging efficiency and ensuring packaging quality. It ensures that all semiconductor material tubes, regardless of their quantity, can be packaged safely and efficiently, while also reducing the risk of component damage caused by improper packaging.

[0283] The embodiment of the present application shown by step S1301 to step S1302 can flexibly cope with different numbers of semiconductor material tubes and generate appropriate packaging solutions. This flexibility and adaptability is the key to improving packaging efficiency and ensuring packaging quality. It ensures that all semiconductor material tubes, regardless of their quantity, can be packaged safely and efficiently, while also reducing the risk of component damage caused by improper packaging.

[0284] In step S804 of some embodiments, the embodiments of the present application determine the number of components in each tube packaging box according to the upper limit number of tubes, the upper limit number of components that can be contained in a single tube, and the number of components corresponding to each unfilled tube. This step needs to comprehensively consider the number of components in each semiconductor tube and the capacity of the tube packaging box to ensure that the total number of batch components in each tube packaging box meets the predetermined standard.

[0285] The embodiment of the present application shown in step S801 to step S804 can quickly determine how to optimize the use of the tube packaging box space, how to reasonably allocate each semiconductor tube, and how to ensure that the number of components in each tube packaging box meets the requirements through an automated calculation method. The embodiment of the present application can not only improve packaging efficiency, but also reduce the possibility of human error, and provide a reliable and efficient solution for the packaging of semiconductor tubes.

[0286] Reference Fig.15 According to some embodiments of the present application, the number of components on the box corresponding to each material tube packaging box includes the number of components on the full box of a full box and the number of components on the incomplete box of an incomplete box. Step S804 determines the number of components on the box corresponding to each material tube packaging box according to the upper limit number of material tubes for packaging, the upper limit number of components that can be contained in a single tube, and the number of components corresponding to each unfilled material tube, and may include:

[0287] Step S1501, for each incomplete box, the number of components in the corresponding incomplete box is determined according to the upper limit number of components that can be contained in a single tube and the number of components corresponding to each insufficiently loaded tube;

[0288] Step S1502, for each full box, determine the number of components in the corresponding full box according to the upper limit number of material tubes for packaging and the upper limit number of components that can be contained in a single tube.

[0289] In some embodiments of the present application, the number of components in each tube packaging box is a key parameter, which includes the number of components in a full box and the number of components in an incomplete box. These two numbers together determine the total number of components in the tube packaging box, which is crucial to ensuring packaging efficiency and meeting customer needs.

[0290] In step S1501 of some embodiments, for each unfilled box, the embodiments of the present application will determine the number of components in the unfilled box according to the upper limit of the number of tubes and the number of components corresponding to each unfilled tube. Since the number of fully filled tubes in the unfilled box does not reach the upper limit of the number of tubes, the actual number of components in these tubes needs to be specially considered.

[0291] It should be emphasized that the upper limit of the number of tubes in the packaging refers to the maximum number of tubes that can be accommodated in each tube packaging box. The number of components corresponding to each unfilled tube provides the actual number of components in each unfilled tube. By combining the two parameters of the upper limit of the number of tubes in the packaging and the number of components corresponding to each unfilled tube, the embodiment of the present application can calculate the total number of components in each unfilled box, ensuring that even if the box is not full, the number of components in the box can be accurately recorded and tracked.

[0292] Reference Fig.16 According to some embodiments of the present application, step S1501 determines the number of components in the corresponding unfilled box according to the upper limit number of components that can be contained in a single tube and the number of components corresponding to each unfilled tube for each unfilled box, which may include:

[0293] Step S1601, for each partially filled box, determine the corresponding fully filled tube and underfilled tube;

[0294] Step S1602, for the unfilled box, sum the number of components corresponding to each missing loading tube in the unfilled box to obtain the first sub-number of the unfilled box;

[0295] Step S1603, for the unfull box, sum up the upper limit number of components that can be contained in each tube corresponding to each fully filled tube, to obtain the second sub-number of the unfull box;

[0296] Step S1604, summing the first sub-number of the unfull box and the second sub-number of the unfull box corresponding to the unfull box to obtain the number of components in the unfull box.

[0297] In some embodiments of the present application, step S1501 focuses on determining the number of components in each incomplete box. This process is a key step in ensuring packaging efficiency and accuracy, and involves detailed analysis and calculation of full tubes and underfilled tubes.

[0298] In step S1601 of some embodiments, the embodiments of the present application will determine the full material tubes and the empty material tubes contained in each unfilled box, and the embodiments of the present application can provide necessary basic data for subsequent calculations.

[0299] In step S1602 of some embodiments, the present application embodiment will sum the number of components corresponding to each missing filling tube in the unfilled box to obtain the first sub-number of components in the unfilled box. The purpose of this step is to calculate the total number of components corresponding to each missing filling tube in the unfilled box. The number of components contained in the missing filling tubes is an important part of the number of components in the unfilled box.

[0300] In step S1603 of some embodiments, the embodiments of the present application will sum the upper limit number of components that can be contained in each full tube in the unfull box to obtain the second sub-number of components in the unfull box. The purpose of this step is to calculate the total number of components corresponding to each full tube in the unfull box. The number of components contained in the full tube is an important part of the number of components in the unfull box.

[0301] In step S1604 of some embodiments, the present application embodiment sums the first sub-number of the unfull box and the second sub-number of the unfull box corresponding to the unfull box, thereby obtaining the number of components in the unfull box. The number of components in the unfull box reflects the total number of components corresponding to all material tubes (whether fully loaded or underloaded) in the current unfull box.

[0302] Through the series of steps from step S1601 to step S1604, the embodiment of the present application can accurately determine the number of boxes that are not full. This automated calculation method not only improves the efficiency and accuracy of the packaging process, but also reduces the possibility of human error, providing a flexible and reliable solution for the packaging of semiconductor tubes.

[0303] In some more specific embodiments, full tubes refer to those tubes that are already filled with components and have reached the upper limit of the number of components that can be accommodated in a single tube. Since full tubes have already met the upper limit of the number of components in the packaging requirements, the packaging parameter calculation of full tubes is processed first, which can quickly reduce the number of tubes that need to be further calculated and processed, thereby improving the efficiency of the entire packaging parameter calculation. Therefore, based on the consideration of packaging efficiency and space utilization optimization, some embodiments need to consider full tubes first in the calculation of packaging parameters, and then consider empty tubes.

[0304] On this basis, the previous step needs to count the full boxes according to the number of full-filled material tubes in the batch and the upper limit of the packaging material tubes, and the full tube remainder can be obtained. It should be pointed out that the full tube remainder refers to the number of full-filled material tubes that will remain after all the full boxes of the target packaging batch are filled. The full tube remainder can be expressed as g. The upper limit of the packaging material tube number can be expressed as N, and the upper limit of the number of components that can be contained in a single tube can be expressed as A. max If the unfilled box contains k missing tubes (k≤N), the corresponding numbers are 1, 2, ..., k, and the number of components corresponding to each missing tube can be expressed as A1, A2, A3, ..., A k .

[0305] After packing the full boxes, there is only one unfull box:

[0306] First, sum the number of components corresponding to each missing tube in the unfilled box to obtain the first sub-number H of the unfilled box. (1), which can be expressed as:

[0307] H (1) =A1+A2+...+A k

[0308] Furthermore, for the unfilled box, the upper limit number of components that can be contained in a single tube corresponding to each full tube is summed to obtain the second sub-number of unfilled boxes. Since the remainder of the full tube can be expressed as g, and the number of components in each full tube is the upper limit number of components that can be contained in a single tube A max Based on this, the number of components that can be contained in each fully filled tube is summed up to obtain the second sub-number of unfilled boxes H. (2) , which can be expressed as:

[0309] H (2) =gA max

[0310] Finally, the number of first sub-numbers in the unfull box and the number of second sub-numbers in the unfull box corresponding to the unfull box are summed to obtain the number of components H in the unfull box, which can be expressed as:

[0311] H=H (1) +H (2) =A1+A2+...+A k +gA max

[0312] It can be clearly seen that after the full box is packed, there is only one incomplete box, and the number of components H in the incomplete box can be calculated as above.

[0313] After packing a full box, if you get two or more incomplete boxes:

[0314] In some embodiments of the present application, during the packaging of a partially filled box, it is required to give priority to the packaging of fully filled tubes, and then consider the packaging of insufficient filled tubes. Based on this, for different partially filled boxes, the number of components in the corresponding partially filled box needs to be calculated in different ways.

[0315] First, focus on the first unfilled box, and sum the upper limit number of components that can be contained in each full tube to get the second sub-number of unfilled boxes. Since the remainder of the full tube can be expressed as g, and the number of components in each full tube is the upper limit number of components that can be contained in a single tube A max .

[0316] Based on this, for the first unfilled box, the number of components that can be contained in each full tube corresponding to the upper limit of the single tube is summed up to obtain the second sub-number H1 of the unfilled box: (2) , which can be expressed as:

[0317] H1 (2) =gAmax

[0318] Since the number of tubes with a limited packaging limit is expressed as N, for the first unfilled box, the number of components corresponding to each unfilled tube in the unfilled box is summed up to obtain the first sub-number H1 of the unfilled box. (1) , which can be expressed as:

[0319] H1 (1) =A1+A2+...+A N-g

[0320] For the first unfull box, add the first sub-number H1 to the unfull box corresponding to the unfull box (1) and the number of the second child in the unfilled box H1 (2) Sum them up and get the corresponding number of components in the unfilled box H1, which can be expressed as:

[0321] H1=H1 (1) +H1 (2) =A1+A2+...+A N-g +gA max

[0322] Furthermore, for the incomplete box that only contains missing charging tubes, the number of components is calculated. Among the k missing charging tubes, there are k-(Ng) missing charging tubes left, and (Ng) charging tubes have been included in the calculation of the number of components in the first incomplete box.

[0323] For the second incomplete box, which only contains missing filling tubes, it is necessary to determine the number of components corresponding to each missing filling tube contained therein, and then add up the number of components to obtain the number H2 of components contained in the incomplete box of the second incomplete box.

[0324] After obtaining the number of components H2 in the second incomplete box, if there are still missing charging tubes left, we can further determine the number of components corresponding to each missing charging tube contained in the third incomplete box, which only contains missing charging tubes, and then add up these numbers of components to obtain the number of components H3 in the incomplete box of the third incomplete box.

[0325] This process is repeated until all k-(Ng) missing tubes are included in the calculation of the number of components, and the number of components in the i-th unfilled box is obtained: i .

[0326] In this way, it can be clearly understood that in the case where two or more incomplete boxes are obtained after a full box is packed, the number H of components in the incomplete boxes can be calculated in the above manner.

[0327] In step S1502 of some embodiments, for each full box, the embodiments of the present application will determine the corresponding number of components in the full box according to the upper limit number of material tubes for packaging and the upper limit number of components that can be accommodated in a single tube. A full box refers to the situation where the number of fully filled material tubes in a material tube packaging box reaches the upper limit number of material tubes for packaging. Therefore, the number of components in each fully filled material tube is known, that is, the upper limit number of components that can be accommodated in a single tube. By multiplying the upper limit number of material tubes for packaging with the upper limit number of components that can be accommodated in a single tube, the embodiments of the present application can derive the total number of components in each full box, that is, the number of components in the full box.

[0328] Through the two steps of step S1501 to step S1502, the embodiment of the present application can accurately determine the number of components in each tube packaging box, whether it is full or not. This precise calculation method not only improves the efficiency and accuracy of the packaging process. It ensures that all semiconductor tubes, whether full or not, can be accurately recorded and tracked, reducing the potential risks and costs caused by inaccurate records.

[0329] In step S104 of some embodiments, packaging operations are performed on each semiconductor tube based on the number of components on each tube packaging box, the tube configuration scheme, and the total number of boxes in the batch packaging to obtain each tube packaging box corresponding to the target packaging batch.

[0330] In some embodiments, step S104 marks the execution stage of the semiconductor tube packaging method, which is based on the previously calculated number of components on the box, the tube configuration scheme, and the total number of boxes in the batch packaging to implement specific packaging operations. At this stage, the embodiment of the present application will accurately package each semiconductor tube according to these detailed parameters.

[0331] It should be emphasized that the total number of boxes in a batch packaging refers to the total number of tube packaging boxes formed after packaging the semiconductor tubes in the target packaging batch. Among them, the tube packaging box can include full boxes and unfull boxes. The number of components in a box refers to the number of semiconductor components in a tube packaging box. Among them, the number of components in a box can include the number of components in a full box and the number of components in an unfull box. The tube configuration scheme is used to describe the arrangement of semiconductor tubes in each tube packaging box.

[0332] When performing packaging operations, an automated robotic system can be used to accurately place each semiconductor tube into a designated tube packaging box based on the tube configuration scheme. This process can involve precise operation of the robotic arm, as well as scanning and verification systems to ensure that each tube is correctly identified and placed.

[0333] In addition, packaging operations can also include sealing and labeling of tube packaging boxes. Each tube packaging box will be labeled with key information, such as batch number, component model, number of components in the box, production date, etc. This information is crucial for subsequent inventory management, quality tracking and customer delivery.

[0334] It should be understood that step S104 is the actual operation stage in the semiconductor tube packaging method, which ensures that each semiconductor tube can be accurately packaged into the corresponding tube packaging box according to the predetermined parameters. This process not only improves the packaging efficiency, but also ensures the consistency and reliability of the packaging. In the end, each tube packaging box that meets the requirements of the target packaging batch is obtained, which provides a guarantee for the safe storage and transportation of semiconductor components.

[0335] Reference Fig.17 The present application embodiment provides a semiconductor material tube packaging device, which may include:

[0336] The batch information acquisition module 1701 is used to acquire semiconductor material tubes of a target packaging batch and target batch information corresponding to the target packaging batch, wherein the semiconductor material tubes are used to accommodate semiconductor components, and each semiconductor material tube has the same upper limit number of components that can be accommodated in a single tube; wherein a fully filled material tube is a semiconductor material tube that reaches the upper limit number of components that can be accommodated in a single tube, and an underfilled material tube is a semiconductor material tube that does not reach the upper limit number of components that can be accommodated in a single tube;

[0337] The batch number counting module 1702 is used to select the missing charging tubes for the target packaging batch and count the number of missing charging tubes to obtain the number of missing charging tubes in the batch and the number of components corresponding to each missing charging tube;

[0338] The packaging parameter calculation module 1703 is used to calculate the packaging parameters according to the preset upper limit number of material tubes for packaging, the number of tubes without loading in a batch, the number of components corresponding to each tube without loading, the upper limit number of components that can be contained in a single tube, and the target batch information, so as to obtain the number of components in each material tube packaging box, the material tube configuration scheme, and the total number of boxes in the batch packaging;

[0339] The tube packaging module 1704 is used to perform packaging operations on each semiconductor tube based on the number of components on each tube packaging box, the tube configuration scheme and the total number of boxes in the batch packaging, so as to obtain each tube packaging box corresponding to the target packaging batch.

[0340] It can be seen that the contents of the above-mentioned semiconductor material tube packaging method embodiment are all applicable to the embodiment of the packaging device of the present semiconductor material tube, and the functions specifically implemented by the embodiment of the packaging device of the present semiconductor material tube are the same as those of the above-mentioned semiconductor material tube packaging method embodiment, and the beneficial effects achieved are also the same as those achieved by the above-mentioned semiconductor material tube packaging method embodiment.

[0341] Reference Fig.18 , Fig.18 The hardware structure of an electronic device of another embodiment is illustrated. The electronic device may include:

[0342] The processor 1801 may be implemented by a general-purpose CPU (Central Processing Unit), a microprocessor, an application-specific integrated circuit (ASIC), or one or more integrated circuits, and is used to execute relevant programs to implement the technical solutions provided in the embodiments of the present application.

[0343] The memory 1802 can be implemented in the form of a read-only memory (ROM), a static storage device, a dynamic storage device, or a random access memory (RAM). The memory 1802 can store an operating system and other application programs. When the technical solution provided in the embodiment of this specification is implemented by software or firmware, the relevant program code is stored in the memory 1802, and the processor 1801 calls and executes the semiconductor material tube packaging method of the embodiment of this application;

[0344] Input / output interface 1803, used to implement information input and output;

[0345] The communication interface 1804 is used to realize the communication interaction between the device and other devices. The communication can be realized through a wired manner (such as USB, network cable, etc.) or a wireless manner (such as mobile network, WI FI, Bluetooth, etc.);

[0346] A bus 1805 that transmits information between the various components of the device (e.g., the processor 1801, the memory 1802, the input / output interface 1803, and the communication interface 1804);

[0347] The processor 1801 , the memory 1802 , the input / output interface 1803 and the communication interface 1804 are connected to each other in communication within the device via the bus 1805 .

[0348] The embodiment of the present application further provides a computer program product, which includes a computer program. A processor of a computer device reads and executes the computer program, so that the computer device executes and implements the above-mentioned semiconductor material tube packaging method.

[0349] The terms "first", "second", "third", "fourth", etc. (if any) in the specification of the present disclosure and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchangeable where appropriate, so that the embodiments of the present disclosure described herein can, for example, be implemented in an order other than those illustrated or described herein. In addition, the terms "comprises" and "comprising" and any variations thereof are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units that are clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0350] It should be understood that in the present disclosure, "at least one (item)" means one or more, and "plurality" means two or more. "And / or" is used to describe the association relationship of associated objects, indicating that three relationships may exist. For example, "A and / or B" can mean: only A exists, only B exists, and A and B exist at the same time, where A and B can be singular or plural. The character " / " generally indicates that the objects associated before and after are in an "or" relationship. "At least one of the following" or similar expressions refers to any combination of these items, including any combination of single or plural items. For example, at least one of a, b or c can mean: a, b, c, "a and b", "a and c", "b and c", or "a and b and c", where a, b, c can be single or multiple.

[0351] It should be understood that in the description of the embodiments of the present application, the meaning of multiple (or multiple items) is more than two, greater than, less than, exceed, etc. are understood to not include the number, and above, below, within, etc. are understood to include the number.

[0352] In the several embodiments provided in the present disclosure, it should be understood that the disclosed systems, devices and methods can be implemented in other ways. For example, the device embodiments described above are only schematic. For example, the division of units is only a logical function division. There may be other division methods in actual implementation. For example, multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be an indirect coupling or communication connection through some interfaces, devices or units, which can be electrical, mechanical or other forms.

[0353] The units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0354] In addition, each functional unit in each embodiment of the present disclosure may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit. The above-mentioned integrated unit may be implemented in the form of hardware or in the form of software functional units.

[0355] If the integrated unit is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present disclosure is essentially or the part that contributes to the prior art or all or part of the technical solution can be embodied in the form of a software product, and the computer software product is stored in a storage medium, including a number of instructions to enable a computer device (which can be a personal computer, a server, or a network device, etc.) to perform all or part of the steps of the various embodiments of the present disclosure. The aforementioned storage medium may include: U disk, mobile hard disk, read-only memory (Read-Only Memory, referred to as ROM), random access memory (Random Access Memory, referred to as RAM), disk or optical disk and other media that can store program codes.

[0356] It should also be understood that the various implementations provided in the embodiments of the present application can be combined arbitrarily to achieve different technical effects.

[0357] The above is a specific description of the implementation methods of the present disclosure, but the present disclosure is not limited to the above implementation methods. Technical personnel familiar with the art can also make various equivalent modifications or substitutions without violating the spirit of the present disclosure. These equivalent modifications or substitutions are all included in the scope defined by the claims of the present disclosure.

Claims

1. A method for packaging a semiconductor tube, characterized in that: include: Obtain semiconductor material tubes of a target packaging batch and target batch information corresponding to the target packaging batch, wherein the semiconductor material tubes are used to accommodate semiconductor components, and each of the semiconductor material tubes has the same upper limit number of components that can be accommodated in a single tube; wherein the fully filled material tubes are semiconductor material tubes that have reached the upper limit number of components that can be accommodated in a single tube, and the underfilled material tubes are semiconductor material tubes that have not reached the upper limit number of components that can be accommodated in a single tube; Select the missing charging tubes for the target packaging batch and count the number thereof to obtain the number of missing charging tubes in the batch and the number of components corresponding to each missing charging tube; Calculate the packaging parameters according to the preset upper limit number of material tubes, the number of tubes without loading in the batch, the number of components corresponding to each tube without loading, the upper limit number of components that can be contained in a single tube, and the target batch information, and obtain the number of components in each material tube packaging box, the material tube configuration plan, and the total number of boxes in the batch packaging; Based on the number of components on each tube packaging box, the tube configuration scheme and the total number of boxes in the batch packaging, a packaging operation is performed on each semiconductor tube to obtain each tube packaging box corresponding to the target packaging batch.

2. The method according to claim 1, characterized in that The packaging parameter calculation is performed according to the preset upper limit number of material tubes for packaging, the number of tubes without loading in the batch, the number of components corresponding to each of the tubes without loading, the upper limit number of components that can be accommodated in a single tube, and the target batch information, to obtain the number of components in each material tube packaging box, the material tube configuration scheme, and the total number of boxes in the batch packaging, including: Extracting the total number of batch components corresponding to the target packaging batch from the target batch information; Determine the number of fully filled tubes in a batch based on the total number of components in the batch, the number of components corresponding to each of the unfilled tubes, and the upper limit number of components that can be contained in a single tube; Determine the total number of packaging boxes in the batch and the material tube configuration scheme corresponding to each material tube packaging box according to the number of unfilled material tubes in the batch, the number of fully filled material tubes in the batch and the upper limit number of material tubes in the packaging; The number of components in each tube packaging box is determined based on the upper limit number of tubes in the packaging, the upper limit number of components that can be contained in a single tube, and the number of components corresponding to each unfilled tube.

3. The method according to claim 2, characterized in that The determining the number of fully filled tubes in a batch based on the total number of components in the batch, the number of components corresponding to each of the unfilled tubes, and the upper limit number of components that can be accommodated by a single tube comprises: The number of components corresponding to each of the missing charging tubes is summed to calculate the total number of missing charging tube components of the semiconductor components in each of the missing charging tubes; The total number of full-filled tube components of the semiconductor components in each full-filled tube is obtained by performing a difference calculation based on the total number of components in the batch and the total number of components in the unfilled tube; A quotient operation is performed based on the total number of components in the fully filled material tube and the upper limit number of components that can be contained in a single tube to determine the number of fully filled material tubes in the batch.

4. The method according to claim 2, characterized in that: The material tube configuration scheme includes a conventional configuration scheme for a full box and a special configuration scheme for an underfull box. The total number of boxes in the batch and the material tube configuration scheme corresponding to each material tube packaging box are determined according to the number of unfilled material tubes in the batch, the number of fully filled material tubes in the batch and the upper limit number of material tubes in the packaging, including: Counting full boxes according to the number of full tubes in the batch and the upper limit number of tubes in the package to determine the conventional configuration scheme, the number of full boxes and the remaining number of full tubes for each full box; Count the unfilled boxes according to the remaining number of full tubes, the number of tubes without material in the batch and the number of tubes with upper limit of the package, so as to determine the specific configuration scheme and the number of unfilled boxes for each unfilled box; The total number of boxes in the batch packaging is obtained by summing the number of full boxes and the number of unfull boxes.

5. The method according to claim 4, characterized in that The full box counting is performed according to the number of full tubes in the batch and the upper limit number of tubes in the package to determine the conventional configuration scheme, the number of full boxes and the remaining number of full tubes for each full box, including: Generating the conventional configuration scheme for each full box according to the number of upper limit material tubes for packaging; The quotient operation is performed on the number of fully filled tubes in the batch and the number of tubes with the upper limit of packaging to obtain the number of full boxes and the remainder of full tubes.

6. The method according to claim 4, characterized in that The unfilled boxes are counted according to the remaining number of full tubes, the number of tubes without material in the batch, and the number of tubes with the upper limit of the package to determine the specific configuration scheme and the number of unfilled boxes for each unfilled box, including: The sum of the remaining number of full tubes and the number of tubes without loading in the batch is determined as the underfill box calculation factor; Performing a quotient operation on the underfill box calculation factor and the number of upper limit tubes for packaging; In response to the unfull box calculation factor being divisible by the upper limit number of material tubes for packaging in a quotient operation, a corresponding specific configuration scheme is generated for each unfull box, and the quotient of the unfull box calculation factor and the upper limit number of material tubes for packaging is determined as the number of unfull boxes.

7. The method according to claim 6, characterized in that After performing a quotient operation on the underfill box calculation factor and the number of upper limit material tubes for packaging, the method further includes: In response to the fact that the unfull box calculation factor cannot be divided by the upper limit number of material tubes for packaging in the quotient operation, the corresponding specific configuration scheme is generated for each unfull box, and the quotient of the unfull box calculation factor and the upper limit number of material tubes for packaging is summed with 1 to obtain the number of unfull boxes.

8. The method according to claim 6 or 7, characterized in that: The generating the corresponding specific configuration scheme for each of the unfull boxes includes: When the number of material tubes in the unfilled box reaches the upper limit of the number of material tubes in the packaging, the corresponding specific configuration scheme is generated for the unfilled box according to the conventional packaging specification; wherein the conventional packaging specification refers to the packaging specification of the semiconductor material tubes according to the conventional configuration scheme; When the number of material tubes in the unfilled box does not reach the upper limit of the number of material tubes in the packaging, the corresponding specific configuration scheme is generated for the unfilled box according to the number of the semiconductor material tubes in the unfilled box.

9. The method according to claim 8, characterized in that Generating the corresponding specific configuration scheme for the unfilled box according to the number of the semiconductor material tubes in the unfilled box includes: If the number of the semiconductor material tubes in the incomplete box is greater than the preset number of small specifications, generating the corresponding specific configuration scheme for the incomplete box according to the conventional packaging specifications; If the number of the semiconductor material tubes in the incomplete box is less than or equal to the number of small specifications, the corresponding specific configuration scheme is generated for the incomplete box according to the preset conventional packaging specifications.

10. The method according to claim 9, characterized in that If the number of the semiconductor material tubes in the incomplete box is less than or equal to the number of small specifications, generating the corresponding specific configuration scheme for the incomplete box according to the preset conventional packaging specifications, including: If the number of the semiconductor material tubes in the unfilled box is less than or equal to the number of small specifications, and the number of the semiconductor material tubes in the unfilled box is less than a preset sway limit number, fill the unfilled box with empty filling tubes; For the partially filled box filled with the empty filling tube, the corresponding specific configuration scheme is generated according to the conventional packaging specification.

11. The method according to claim 2, characterized in that The number of components in each tube packaging box includes the number of components in a full box and the number of components in an incomplete box; The determining the number of components in each tube packaging box according to the upper limit number of tubes in the packaging, the upper limit number of components that can be contained in a single tube, and the number of components corresponding to each tube without filling includes: For each of the incomplete boxes, the number of components in the corresponding incomplete box is determined according to the upper limit number of components that can be contained in the single tube and the number of components corresponding to each of the incomplete tubes; For each of the full boxes, the number of components contained in the corresponding full box is determined according to the upper limit number of material tubes for packaging and the upper limit number of components that can be contained in a single tube.

12. The method according to claim 11, characterized in that For each of the incomplete boxes, determining the number of components in the corresponding incomplete box according to the upper limit number of components that can be contained in the single tube and the number of components corresponding to each of the insufficiently filled tubes, includes: For each of the incomplete boxes, determining the corresponding full tube and the underfilled tube; For the unfilled box, sum the number of components corresponding to each of the unfilled tubes to obtain the first sub-number of the unfilled box; For the unfilled box, sum the upper limit number of components that can be contained in a single tube corresponding to each of the fully filled tubes to obtain a second sub-number of components contained in the unfilled box; The first sub-number of the unfull box and the second sub-number of the unfull box corresponding to the unfull box are summed to obtain the number of components in the unfull box.

13. The method according to claim 1, characterized in that The selecting and counting the missing charging tubes for the target packaging batch to obtain the number of missing charging tubes in the batch and the number of components corresponding to each missing charging tube includes: For each of the semiconductor material tubes of the target packaging batch, selecting the tube with insufficient material as the current tube with insufficient material; Counting the number of components of the currently missing charging tube to obtain the number of components of the currently missing charging tube corresponding to the currently missing charging tube; From the remaining semiconductor tubes in the target packaging batch, the tube with missing material is selected as the current tube with missing material, and the number of components corresponding to each tube with missing material is obtained by returning to the process of counting the number of components for the current tube with missing material until all the tubes with missing material in the target packaging batch are selected; The number of the missing loading tubes in the target packaging batch is counted to obtain the number of missing loading tubes in the batch.

14. The method according to claim 1, characterized in that Before selecting the missing charging tubes for the target packaging batch and counting the number of missing charging tubes to obtain the number of missing charging tubes in the batch and the number of components corresponding to each missing charging tube, the method further includes: Scanning the material tube identification code of each semiconductor material tube to obtain the material tube grade constraint information corresponding to each semiconductor material tube; Scanning the component identification code of each semiconductor component in each semiconductor material tube to obtain the component level corresponding to each semiconductor component in the semiconductor material tube; For the semiconductor components whose component grades do not satisfy the material pipe grade constraint information, the semiconductor components are sorted out from the corresponding semiconductor material pipe and marked as grade problem components.

15. The method according to claim 1, characterized in that Before selecting the missing charging tubes for the target packaging batch and counting the number of missing charging tubes to obtain the number of missing charging tubes in the batch and the number of components corresponding to each missing charging tube, the method further includes: Capturing an image of each semiconductor material tube to obtain a corresponding tube-mounted component image; wherein the tube-mounted component image is used to present each semiconductor component accommodated in the corresponding semiconductor material tube; The selecting and counting the missing charging tubes for the target packaging batch to obtain the number of missing charging tubes in the batch and the number of components corresponding to each missing charging tube includes: Based on the tube-mounted component image corresponding to each of the semiconductor material tubes, the tube-mounted component images are counted to obtain the number of tubes without material loading in the batch and the number of components corresponding to each of the tubes without material loading.

16. The method according to claim 15, characterized in that Before counting the number of the tube-mounted component images based on the tube-mounted component images corresponding to each of the semiconductor material tubes, the method further includes: Performing component appearance inspection on each of the semiconductor components housed in the semiconductor material tube based on the tube-mounted component image; The semiconductor components that do not meet the appearance qualification conditions during the component appearance inspection are sorted out from the semiconductor material tube and marked as components with appearance problems.

17. The method according to claim 16, characterized in that The semiconductor components that do not meet the appearance qualification conditions in the component appearance inspection are sorted out from the semiconductor material tube and marked as components with appearance problems, including: In response to the presence of the semiconductor component that does not meet the appearance qualification condition in the tube-mounted component image, re-capturing the image of the semiconductor material tube to update the tube-mounted component image; In response to the semiconductor components that still do not meet the appearance qualification condition still existing in the updated tube-mounted component image, the semiconductor components that do not meet the appearance qualification condition are sorted out from the semiconductor material tube and marked as components with appearance problems.

18. The method according to claim 1, characterized in that The step of obtaining semiconductor material tubes of a target packaging batch and target batch information corresponding to the target packaging batch includes: Obtain a target transport box filled with a plurality of the semiconductor material tubes; wherein the semiconductor material tubes filled in the target transport box belong to the same target packaging batch; The tote identification configured for the target tote is scanned to obtain the target batch information corresponding to the target packaging batch.

19. A semiconductor tube packaging device, characterized in that: include: a batch information acquisition module, used to acquire semiconductor material tubes of a target packaging batch and target batch information corresponding to the target packaging batch, wherein the semiconductor material tubes are used to accommodate semiconductor components, and each of the semiconductor material tubes has the same upper limit number of components that can be accommodated in a single tube; wherein a fully filled material tube is a semiconductor material tube that has reached the upper limit number of components that can be accommodated in a single tube, and an underfilled material tube is a semiconductor material tube that has not reached the upper limit number of components that can be accommodated in a single tube; A batch number counting module is used to select the missing charging tubes for the target packaging batch and count the number of missing charging tubes to obtain the number of missing charging tubes in the batch and the number of components corresponding to each missing charging tube; A packaging parameter calculation module is used to calculate packaging parameters according to a preset upper limit number of material tubes for packaging, the number of tubes without loading in the batch, the number of components corresponding to each of the tubes without loading, the upper limit number of components that can be accommodated in a single tube, and the target batch information, so as to obtain the number of components in each material tube packaging box, the material tube configuration scheme, and the total number of boxes in the batch packaging; The tube packaging module is used to perform packaging operations on each semiconductor tube based on the number of components on each tube packaging box, the tube configuration scheme and the total number of boxes in the batch packaging, so as to obtain each tube packaging box corresponding to the target packaging batch.

20. A computer-readable storage medium, characterized in that: The storage medium stores a program, and the program is executed by a processor to implement the semiconductor material tube packaging method according to any one of claims 1 to 18.

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