Semiconductor manufacturing apparatus and semiconductor manufacturing method
By designing general semiconductor manufacturing equipment and shells, combined with automatic guide vehicles and other conveying devices, the problems of low processing efficiency of semiconductor manufacturing equipment and frequent shell replacement in the prior art are solved, and higher production efficiency and yield of process devices are achieved.
Patent Information
- Application Number
- CN202411998866.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-31
- Publication Date
- 2025-05-02
AI Technical Summary
When existing semiconductor manufacturing equipment processes multiple wafers, the processing efficiency is low, and the design characteristics of different process devices are not uniform, resulting in frequent shell replacement and reduced production efficiency.
A general semiconductor manufacturing equipment is designed, using a general shell and wafer box, and by designing the spacing of multiple container slots, the spacing of multiple wafers is adjusted, and the transfer of the shell between different process devices is realized through conveying devices such as automatic guide vehicles.
The production efficiency of semiconductor manufacturing equipment is improved, the number of shell replacement is reduced, the yield rate of process devices is enhanced, and the miniaturization and cost reduction of process devices is achieved.
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Figure CN119920738A_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of semiconductor technology, and in particular to a semiconductor manufacturing device and a semiconductor manufacturing method. Background Art
[0002] At present, in order to reduce the processing cost of chips, it is necessary to set up a larger wafer size so that more chips can be cut from each wafer. However, the processing efficiency of wafers needs to be improved. Summary of the invention
[0003] The present application proposes a semiconductor manufacturing device and a semiconductor manufacturing method, aiming to improve production efficiency.
[0004] To achieve the above objectives, the embodiments of the present application provide the following technical solutions:
[0005] On the one hand, a semiconductor manufacturing device is provided, which includes a housing, a wafer box and a plurality of process devices, wherein the housing includes a chamber, the wafer box is arranged in the chamber, the wafer box includes a plurality of wafer slots, and the wafer slots are used to accommodate wafers. The process device includes a loading and unloading room, and the loading and unloading rooms of the plurality of process devices are used to accommodate the housing.
[0006] The semiconductor manufacturing equipment provided in the above-mentioned embodiment of the present application, the wafer box includes a plurality of wafer slots, each of which can be used to accommodate a wafer, and the spacing between the plurality of wafer slots can be designed to adjust the spacing between the plurality of wafers.
[0007] Moreover, the loading and unloading rooms of various process devices are all used to accommodate the shell, that is, the same shell can be suitable for the loading and unloading rooms of various process devices. The shell used for the wafer box is universal with respect to the loading and unloading rooms of various process devices. In the process of transporting the wafer box between the loading and unloading rooms of multiple process devices, there is no need to replace the shell, which is beneficial to improving production efficiency.
[0008] In some embodiments, the volumes of the loading and unloading chambers of multiple process devices are the same. It can be understood that if the same shell can be placed in the loading and unloading chamber of one type of process device, then the shell can also be placed in the loading and unloading chamber of other types of process devices, so that the loading and unloading chambers of multiple process devices can be equipped with the same shell.
[0009] In some embodiments, the volume of the loading and unloading chamber of the process device is the same as the volume of the shell, that is, the inner cavity of the loading and unloading chamber is adapted to the volume and shape of the shell, so that the shell can be placed in the loading and unloading chamber of the process device, thereby realizing the docking of the shell and the loading and unloading chamber.
[0010] In some embodiments, the semiconductor manufacturing equipment further includes a conveying device, which is used to convey the shell to the process device, and can realize the linkage between the conveying device and the loading and unloading chamber of the process device to realize the transfer of the shell between different process devices.
[0011] In some embodiments, the semiconductor manufacturing equipment further includes a transport device disposed on the conveying device, the transport device being used to transport the shell on the conveying device to the loading and unloading room of the process device, or to transport the shell in the loading and unloading room of the process device to the conveying device.
[0012] In some embodiments, the semiconductor manufacturing equipment further includes a transport device disposed on the process device, the transport device being used to transport the shell on the conveying device to the loading and unloading chamber of the process device, or to transport the shell in the loading and unloading chamber of the process device to the conveying device.
[0013] In some embodiments, the transport device is an automated guided vehicle.
[0014] In some embodiments, multiple wafer slots are arranged at equal intervals along the same direction, so that multiple wafers in the multiple wafer slots can be arranged at equal intervals, which can avoid collisions between the multiple wafers and is conducive to stable storage or transfer of the wafers.
[0015] In some embodiments, the size of the wafer is less than or equal to 4 inches, and the wafer is a small-sized wafer with a process yield of approximately 80% to 90%. By processing small-sized wafers through a variety of process devices, the process yield can be improved and the miniaturization of the process devices can be achieved, which is beneficial to reducing the price of the process devices and improving the stability of the performance of the process devices.
[0016] On the other hand, a semiconductor manufacturing method is provided, which includes: loading wafers into wafer slots of a wafer box; placing the wafer box and wafers in a shell, so that the air pressure in the shell is in the range of 5Pa to 100Pa, so that the shell is in a low vacuum state, which can prevent dust, moisture, and oxygen in the air from entering the shell, and cut off external pollution sources; and moving the shell from the loading and unloading room of one process device to the loading and unloading room of another process device. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] In order to more clearly illustrate the technical solution in the present application, the following is a brief introduction to the drawings required for use in some embodiments of the present application. Obviously, the drawings described below are only drawings of some embodiments of the present application. For ordinary technicians in this field, other drawings can also be obtained based on these drawings. In addition, the drawings described below can be regarded as schematic diagrams, not the actual size of the product involved in the embodiments of the present application, or the actual process of the method.
[0018] Figure 1 A structural diagram of a semiconductor manufacturing device provided in an embodiment of the present application;
[0019] Figure 2A structural diagram of a wafer box and a housing provided in an embodiment of the present application;
[0020] Figure 3 A structural diagram of a wafer box provided in an embodiment of the present application;
[0021] Figure 4 A structural diagram of another semiconductor manufacturing equipment provided in an embodiment of the present application;
[0022] Figure 5 A structural diagram of another semiconductor manufacturing equipment provided in an embodiment of the present application. DETAILED DESCRIPTION
[0023] The following will be combined with the accompanying drawings to clearly and completely describe the technical solutions in some embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments provided by the present application, all other embodiments obtained by ordinary technicians in this field belong to the scope of protection of the present application.
[0024] Unless the context requires otherwise, throughout the specification and claims, the term "comprising" is to be construed in an open, inclusive sense, ie, meaning "including, but not limited to."
[0025] In the following, the terms "first" and "second" are used for descriptive purposes only and are not to be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of the present application, unless otherwise specified, "plurality" means two or more.
[0026] When describing some embodiments, the term "connection" and its derivative expressions may be used. The term "connection" should be understood in a broad sense. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected or indirectly connected through an intermediate medium. For example, when describing some embodiments, the term "connection" may be used to indicate that two or more components are in direct physical or electrical contact with each other.
[0027] Additionally, the use of “based on” is meant to be open and inclusive, as a process, step, calculation, or other action “based on” one or more stated conditions or values may, in practice, be based on additional conditions or values beyond those stated.
[0028] Generally, the semiconductor manufacturing process includes pre-design, front-end process and back-end process, as shown in Table 1 below:
[0029] Preliminary Design Front-end process Back-end process Circuit and pattern design Wafer surface oxidation Wafer dicing Prepare the mask Film formation Wire Bonding Photoresist coating Molding Exposure and Development Final Check Etching thin films to pattern Photoresist stripping Wash Ion implantation Surface flattening Electrode formation Wafer Inspection
[0030] Table 1
[0031] It can be seen that the front-end process of the wafer includes multiple processes, and the process equipment required for different processes is also different. However, the actual situation is that the manufacturers of each process equipment have their own design characteristics, which makes the size, structure and system of different types of process equipment not uniform. For example, different types of process equipment have different requirements for the spacing, shape or material of the shell that holds the wafer. Therefore, the shell that holds the wafer needs to be replaced in different process equipment, which reduces production efficiency.
[0032] To solve the above problems, an embodiment of the present application provides a semiconductor manufacturing device. Figure 1 A structural diagram of a semiconductor manufacturing device provided in an embodiment of the present application; Figure 2 A structural diagram of a wafer box and a housing provided in an embodiment of the present application; Figure 3 A structural diagram of a wafer box provided in an embodiment of the present application.
[0033] See also Figure 1 The semiconductor manufacturing equipment 1 includes a variety of process devices 2, which are used to perform front-end processes of wafers. By way of example, the various process devices 2 include physical vapor deposition (PVD) equipment, chemical vapor deposition (CVD) equipment, a photolithography machine, and ion implantation equipment.
[0034] For example, PVD equipment or CVD equipment can be used to form a thin film on a wafer; a photolithography machine can be used to pattern a thin film to form a circuit pattern; and an ion implantation device can be used to implant ions into a semiconductor thin film to make it conductive.
[0035] See also Figure 1 and Figure 2 The semiconductor manufacturing equipment 1 also includes a shell (Cassette Case) 3 and a wafer box (Process Cassette) 4. The shell 3 has a chamber 31. The wafer box 4 is arranged in the chamber 31. The air pressure in the chamber 31 is in the range of 5Pa to 100Pa. For example, the air pressure in the chamber 31 is less than or equal to 10Pa, so that the chamber 31 is in a low vacuum state, which can prevent dust, moisture, and oxygen in the air from entering the chamber 31 and cut off external pollution sources.
[0036] See also Figure 3 The wafer box 4 includes a plurality of wafer slots 41 , each of which can be used to accommodate a wafer 5 . By designing the spacing between the plurality of wafer slots 41 , the spacing between the plurality of wafers 5 can be adjusted.
[0037] Exemplarily, in the wafer box 4, multiple wafer slots 41 are arranged at equal intervals along the same direction X, so that multiple wafers 5 in the multiple wafer slots 41 can be arranged at equal intervals, which can avoid collisions between the multiple wafers 5 and is conducive to stable storage or transfer of the wafers 5.
[0038] Continue to see Figure 1 Each process device 2 includes a loading and unloading (Load / Unload, Load / Unload, abbreviated as L / UL) station 21. The loading and unloading chambers 21 of multiple process devices 2 are used to accommodate the shell 3, that is, the same shell 3 can be suitable for the loading and unloading chambers 21 of various process devices 2. The shell 3 used for the wafer box 4 is universal with respect to the loading and unloading chambers 21 of multiple process devices 2. In the process of transporting the wafer box 4 between the loading and unloading chambers 21 of multiple process devices 2, there is no need to replace the shell 3, which is beneficial to improving production efficiency.
[0039] In some embodiments, see Figure 1 The volumes of the loading and unloading chambers 21 of various process devices 2 are the same. If the same shell 3 can be placed in the loading and unloading chamber 21 of one type of process device 2, then the shell 3 can also be placed in the loading and unloading chamber 21 of other types of process devices 2, so that the loading and unloading chambers 21 of various process devices 2 can be suitable for the same shell 3.
[0040] In some embodiments, see Figure 1 The volume of the loading and unloading chamber 21 of the process device 2 is the same as the volume of the shell 3, that is, the inner cavity of the loading and unloading chamber 21 is adapted to the volume and shape of the shell 3, so that the shell 3 can be placed in the loading and unloading chamber 21 of the process device 2, thereby realizing the docking of the shell 3 and the loading and unloading chamber 21.
[0041] In some embodiments, see Figure 1 In the semiconductor manufacturing equipment 1, a variety of process devices 2 are used to process small-sized wafers 5. For example, the size of the wafer 5 is less than or equal to 4 inches. Accordingly, the size of the wafer slot 41 of the wafer box 4 can be designed.
[0042] According to Moore's Law and semiconductor development trends, the process yield of large-size wafers is approximately 65% to 75%, while the process yield of small-size wafers is approximately 80% to 90%. By processing small-size wafers 5 through a variety of process devices 2, the process yield can be improved and the miniaturization of the process device 2 can be achieved, which is conducive to reducing the price of the process device 2 and improving the stability of the performance of the process device 2.
[0043] The embodiment of the present application further provides a semiconductor manufacturing method, which comprises the following steps S1 to S3:
[0044] S1: See Figure 3 , the wafers 5 are loaded into the wafer receiving slots 41 of the wafer box 4 .
[0045] Exemplarily, before loading the wafers 5 into the wafer receiving slots 41 of the wafer box 4 , the wafers 5 need to be cleaned to ensure the cleanliness of the wafers 5 .
[0046] S2: See Figure 2 , place the wafer box 4 and the wafer 5 in the shell 3, so that the air pressure in the shell 3 is in the range of 5Pa to 100Pa.
[0047] Exemplarily, after the wafer box 4 and the wafer 5 are placed in the chamber 31 of the shell 3, a vacuum pump is used to evacuate the chamber 31 so that the air pressure in the chamber 31 is in the range of 5Pa to 100Pa, presenting a low vacuum state, which can cut off dust, moisture, and oxygen to avoid contamination of the wafer 5.
[0048] S3: See Figure 1 , the shell 3 is moved from the loading and unloading chamber 21 of one process device 2 to the loading and unloading chamber 21 of another process device 2.
[0049] Illustratively, after the shell 3 is docked with the loading and unloading chamber 21 of a process device 2, the multiple wafers 5 in the wafer box 4 are transferred one by one to the processing chamber of the process device 2 for processing in sequence. After processing, the multiple wafers 5 are loaded into the wafer receiving slot 41 of the wafer box 4 again, and the wafer box 4 and the wafers 5 are placed in the shell 3 again.
[0050] Then, the shell 3 can be manually transported from the loading and unloading chamber 21 of one process device 2 to the loading and unloading chamber 21 of the target process device 2, so that the shell 3 is docked with the loading and unloading chamber 21 of the target process device 2, and the multiple wafers 5 are processed again.
[0051] Figure 4 A structural diagram of another semiconductor manufacturing equipment provided in an embodiment of the present application.
[0052] See also Figure 4 ,and Figure 1 The difference between the semiconductor manufacturing equipment 1 in the figure is that the semiconductor manufacturing equipment 1 also includes a conveying device 6, which is used to convey the shell 3 to the process device 2. The conveying device 6 can be linked with the loading and unloading chamber 21 of the process device 2 to realize the transfer of the shell 3 between different process devices 2.
[0053] Exemplarily, the conveying device 6 is an automatic guided vehicle (AGV).
[0054] In some embodiments, see Figure 4The semiconductor manufacturing equipment 1 also includes a transport device 7 arranged on the process device 2, and the transport device 7 is used to transport the shell 3 in the loading and unloading chamber 21 of the process device 2 to the conveying device 6 to realize the transfer of the shell 3 from the loading and unloading chamber 21 to the conveying device 6.
[0055] For example, the handling device 7 can be a transmission roller disposed on the process device 2, and the housing 3 is located on the transmission roller, and the rotation of the transmission roller drives the housing 3 to move. In addition, the height of the conveying device 6 and the transmission roller are substantially equal, so that the housing 3 can be transferred from the transmission roller to the conveying device 6.
[0056] Alternatively, the transport device 7 may also be a robot arm disposed on the process device 2 , and the shell 3 on the conveying device 6 may be transported to the loading and unloading chamber 21 of the process device 2 by grabbing the robot arm.
[0057] Figure 5 A structural diagram of another semiconductor manufacturing equipment provided in an embodiment of the present application.
[0058] See also Figure 5 The semiconductor manufacturing equipment 1 also includes a transport device 7 arranged on the transport device 6, which is used to transport the shell 3 on the transport device 6 to the loading and unloading chamber 21 of the process device 2, or to transport the shell 3 in the loading and unloading chamber 21 of the process device 2 to the transport device 6.
[0059] Exemplarily, the handling device 7 can be a robotic arm arranged on the conveying device 6, which can grasp the shell 3 on the conveying device 6 and transport it to the loading and unloading chamber 21 of the process device 2, or it can transport the shell 3 in the loading and unloading chamber 21 of the process device 2 to the conveying device 6.
[0060] Alternatively, the handling device 7 may also be a transmission roller disposed on the conveying device 6, and the housing 3 is located on the transmission roller, and the rotation of the transmission roller drives the housing 3 to move. In addition, the height of the transmission roller is substantially equal to that of the loading and unloading chamber 21, so that the housing 3 can be transferred from the transmission roller to the loading and unloading chamber 21.
[0061] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any changes or substitutions that a person skilled in the art can think of within the technical scope disclosed in the present application should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.
Claims
1. A semiconductor manufacturing equipment, characterized in that: include: a housing including a chamber; A wafer box is arranged in the chamber, and the wafer box includes a plurality of wafer slots, and the wafer slots are used to accommodate wafers; A variety of process devices, each of which comprises a loading and unloading room, wherein the loading and unloading rooms of the various process devices are all used to accommodate the shell.
2. The semiconductor manufacturing equipment according to claim 1, characterized in that The volumes of the loading and unloading chambers of the various process devices are the same.
3. The semiconductor manufacturing equipment according to claim 2, characterized in that The volume of the loading and unloading chamber of the process device is the same as the volume of the shell.
4. The semiconductor manufacturing equipment according to claim 1, characterized in that The semiconductor manufacturing equipment further includes a conveying device, which is used to convey the shell to the process device.
5. The semiconductor manufacturing equipment according to claim 4, characterized in that The semiconductor manufacturing equipment also includes a transport device arranged on the transport device, and the transport device is used to transport the shell on the transport device to the loading and unloading room of the process device, or to transport the shell in the loading and unloading room of the process device to the transport device.
6. The semiconductor manufacturing equipment according to claim 4, characterized in that The semiconductor manufacturing equipment also includes a transport device arranged on the process device, and the transport device is used to transport the shell on the conveying device to the loading and unloading room of the process device, or to transport the shell in the loading and unloading room of the process device to the conveying device.
7. The semiconductor manufacturing equipment according to claim 4, characterized in that The conveying device is an automatic guided vehicle.
8. The semiconductor manufacturing equipment according to claim 1, characterized in that Along the same direction, the plurality of chip receiving grooves are arranged at equal intervals.
9. The semiconductor manufacturing equipment according to claim 1, characterized in that The size of the wafer is less than or equal to 4 inches.
10. A semiconductor manufacturing method, characterized in that: include: Loading wafers into wafer receiving slots of a wafer box; Placing the wafer box and the wafer in a housing so that the air pressure in the housing is within a range of 5 Pa to 100 Pa; The shell is transported from a loading and unloading room of one process device to a loading and unloading room of another process device.