Controller

Abstract

The invention provides a controller capable of effectively cooling with a small number of fans. A controller (1) is provided with: a driver substrate unit (3A) that is held in a state in which a plurality of driver substrates (31) are arranged in parallel in the Y direction; a power supply circuit unit (4) adjacent to the driver substrate unit (3A) in the Y direction; a fan (32) facing the driver substrate in the X direction; and a housing (2) provided with an air vent (24a) facing the fan in the X direction. A first voltage substrate (41) of the power supply circuit unit is disposed parallel to the driver substrate and faces a gap (S3) between the driver substrate unit and the power supply circuit unit. Gaps (S1, S2) between adjacent driver substrates of the driver substrate unit face the fan in the X direction, and a part of a gap (S3) between the power circuit unit and the driver substrate unit faces the fan in the X direction.

Description

Technical Field

[0001] The present invention relates to a controller in which various substrates and electrical components are accommodated in a casing. Background Art

[0002] Patent Document 1 describes a controller that provides a driving current to an actuator (motor) of a robot and that houses various electrical components, a substrate, a cooling fan, and the like in a metal casing.

[0003] The controller of Patent Document 1 has an interface unit (communication substrate unit) on the inner side of the front panel of the housing, which is provided with a substrate equipped with a plurality of connectors. In addition, a power input unit (power supply unit) connected to an external AC power supply is provided inside the housing, and a terminal block and a noise filter connected to the power supply line of the external AC power supply are provided. A cooling fan is installed on the back panel of the housing. A driver substrate unit composed of a driver substrate (drive circuit substrate) that generates a drive current output to the motor is provided on the inner side of the fan. A main circuit unit (power supply circuit unit) is provided between the driver substrate unit and the interface unit (communication substrate unit), and the main circuit unit is provided with a plurality of capacitors on the substrate for converting AC voltage into DC voltage. Prior art literature Patent Literature

[0004] Patent Document 1: Japanese Patent Application Publication No. 2023-28305 Summary of the invention

[0005] In the controller of Patent Document 1, an air intake port is provided in a wide range of the back panel, and a plurality of fans are arranged in a row. Therefore, although air can be directly supplied from the fan to a wide range, the number of fans is large, and the component cost is correspondingly high. Therefore, it is desirable to have a structure that can effectively cool even if the number of fans is reduced. In particular, the controller has a substrate with a large heat generation such as a power supply circuit in addition to a driver substrate, and a structure that can effectively cool them with a small number of fans is required.

[0006] In view of the above problems, an object of the present invention is to provide a controller structure capable of efficiently cooling with a small number of fans.

[0007] In order to solve the above-mentioned problems, the controller of the present invention comprises: a driver substrate unit, which is maintained on a first base frame in a state where a plurality of driver substrates for generating a driving current for driving a motor are arranged in parallel in a first direction; a power supply circuit unit, which is adjacent to the driver substrate unit in the first direction; a fan, which is opposite to the driver substrate in a second direction orthogonal to the first direction; and a housing, which accommodates the driver substrate unit, the power supply circuit unit and the fan, and is provided with a vent opposite to the fan in the second direction, the power supply circuit unit having at least one substrate, the at least one substrate including a first voltage substrate for generating a DC voltage of a first voltage, the first voltage substrate being arranged in parallel with the driver substrate and facing a gap between the driver substrate unit and the power supply circuit unit, the gap between adjacent driver substrates of the driver substrate unit being opposite to the fan in the second direction, and at least a portion of the gap between the power supply circuit unit and the driver substrate unit being opposite to the fan in the second direction.

[0008] According to the present invention, the air vent of the housing is set at a position opposite to the fan, and the fan is arranged in a manner opposite to the direction (second direction) orthogonal to the arrangement direction (first direction) of the plurality of driver substrates. Moreover, the gap between the driver substrate unit and the power circuit unit is also made opposite to the fan, and the substrate (first voltage substrate) of the power circuit unit is arranged in parallel with the driver substrate and is arranged to face the gap opposite to the fan. By configuring each substrate and the fan in this way, the air generated by the fan flows not only in the gap facing the driver substrate, but also in the gap facing the substrate of the power circuit unit. Therefore, even one fan can effectively cool both the driver substrate unit and the power circuit unit. In addition, the power circuit unit is in a posture along the airflow direction, and the airflow from the fan is not easily blocked by the power circuit unit. Therefore, the air easily flows in the entire housing, so even if the number of fans is small, the inside of the controller can be effectively cooled.

[0009] In the present invention, preferably, each of the plurality of driver substrates has a heat sink disposed on a surface on the side where the power circuit unit is located. In this way, airflow is blown onto the heat sinks of all the driver substrates, thereby enabling efficient cooling.

[0010] In the present invention, the fan is preferably fixed to the driver substrate unit via the first base frame. In this way, by fixing the fan to the base frame holding the driver substrate instead of fixing it to the housing, the position accuracy of the fan relative to the driver substrate can be improved. In addition, since it is not necessary to fix the fan to the housing separately, the assemblability can be improved. Moreover, since the wiring of the fan and the wiring of the driver substrate can be concentrated, the load of the wiring operation can be reduced.

[0011] In the present invention, the first base frame preferably includes: a first base plate fixed to the housing; a plurality of first substrate mounting plates erected in parallel from the first base plate; and a frame top plate fixed to the front ends of the plurality of first substrate mounting plates, the plurality of driver substrates are respectively fixed to the first substrate mounting plates, and the fan is fixed to the edge of the first base plate on the vent side and the edge of the frame top plate on the vent side. In this way, the fan can be held in a manner opposite to the gap between the driver substrates.

[0012] In the present invention, it is preferred that the power supply circuit unit has at least two substrates, the at least two substrates include a second voltage substrate for generating a DC voltage of a second voltage different from the first voltage, and the second voltage substrate is arranged with the first voltage substrate in a manner that the substrate surface faces the same direction as the first voltage substrate. In this way, a plurality of power supply circuits for generating DC voltages of different voltages can be unitized. Therefore, it is not necessary to assemble each power supply circuit separately to the housing, thereby improving assemblability and enabling centralized wiring. In addition, both substrates face the gap where air flows, and are in a posture along the direction of airflow from the fan, so that cooling can be performed effectively.

[0013] In this case, it is preferred that the first voltage substrate and the second voltage substrate are arranged on the same surface. In this way, the two substrates can be cooled evenly. In addition, since the power circuit unit is thin, air can easily flow in the housing. Moreover, since it is a unit with a small planar size, the installation space is small. Therefore, the planar size of the entire device can be reduced.

[0014] In the present invention, preferably, the first voltage substrate and the second voltage substrate have electronic components disposed on the substrate surface facing the driver substrate unit side. In this way, the electronic components can be directly cooled by airflow from a fan, thereby preventing the electronic components from becoming hot.

[0015] In the present invention, it is preferred that the power circuit unit has a first base member fixed to the housing, the first base member has a first mounting plate parallel to the driver substrate, the first mounting plate has the first voltage substrate fixed from the driver substrate unit side, and has an opening portion formed by cutting off a region opposite to the first voltage substrate. In this way, the substrate of the power circuit unit can be kept in a posture parallel to the driver substrate. In addition, by providing a notch on the first mounting plate, the heat of the first voltage substrate can be dissipated to the side opposite to the driver substrate unit. Therefore, the temperature rise of the power circuit unit can be suppressed.

[0016] In the present invention, it is preferred that a main circuit unit is provided for providing a DC voltage having a voltage different from the first voltage to the driver substrate, and the driver substrate unit, the power circuit unit, and the main circuit unit are arranged in this order in the first direction. In this way, the airflow generated by the fan is sent toward the gap between the power circuit unit and the driver substrate unit, which are arranged in the center of the three units. As a result, air easily flows from the center of the housing to each part of the housing, so that the inside of the controller can be effectively cooled by one fan. In the airflow analysis using the three-dimensional model, it was confirmed that the air flowing along the power circuit unit in the gap between the power circuit unit and the driver substrate unit flows toward the main circuit unit side.

[0017] In the present invention, the main circuit unit preferably includes: a heat dissipation component disposed at a position opposite to the notch provided in the first mounting plate in the first direction; and a heating element fixed to the heat dissipation component. In this way, a part of the air sent to the gap between the power circuit unit and the driver substrate unit contacts the heat dissipation component of the main circuit unit via the notch of the first mounting plate. Therefore, a single fan can cool not only the power circuit unit and the driver substrate but also the heating element of the main circuit unit.

[0018] In the present invention, the fan preferably sucks air from the vent side and blows air toward the driver substrate side. In this way, since the external air first contacts the driver substrate and the power circuit unit, the driver substrate and the power circuit unit can be effectively cooled.

[0019] In the present invention, it is preferred that the housing has an outer panel opposite to the fan in the second direction, the vent is formed on the outer panel, and the fan is arranged in a posture inclined in a direction in which the interval with the outer panel narrows in the first direction toward the power circuit unit side. In this way, when the fan is arranged obliquely relative to the outer panel, a gap is formed between the outer panel and the fan, which widens in the first direction toward the side opposite to the power circuit unit. Therefore, the air in the housing sucked from the side opposite to the power circuit unit can be blown in a direction inclined toward the power circuit unit side. Thus, the airflow toward the power circuit unit side can be increased, and the cooling efficiency of the power circuit unit can be improved. In addition, by such a configuration, not only the external air sucked from the vent, but also the air in the housing is sucked by the fan from the gap between the outer panel and the fan, so the airflow circulating inside the housing increases. Therefore, the air cooling efficiency can be improved. In addition, by such a configuration, an airflow circulating around the driver substrate unit and an airflow circulating through the inside of the driver substrate unit are generated, so the cooling efficiency of the driver substrate unit can be improved. For example, the airflow passing through the driver substrate unit is reflected by the components in the housing and becomes the airflow returning to the fan side, and circulates inside and around the driver substrate unit. Therefore, even if the number of driver substrates is increased and the driver substrate unit is enlarged, the entire driver substrate unit can be cooled by one fan.

[0020] In the present invention, the minimum value of the gap between the fan and the exterior panel is preferably 6 mm or more. Through flow analysis, it can be confirmed that when a gap of 6 mm or more is provided, the air supply volume of the fan can be increased compared with a case where there is no gap. Therefore, the cooling efficiency can be improved.

[0021] In the present invention, the fan is preferably fixed to the driver substrate unit via the first base frame, and the first base frame is provided with a fan mounting portion at an edge on the vent side, and the fan mounting portion is inclined in a direction in which the interval with the exterior panel becomes narrower toward the power circuit unit side in the first direction. In this way, by providing the fan mounting portion on the base frame holding the driver substrate instead of on the housing, the structure for mounting the fan in a direction inclined relative to the exterior panel can be simplified.

[0022] According to the present invention, the air generated by the fan flows not only in the gap facing the driver substrate but also in the gap facing the substrate of the power circuit unit. Therefore, both the driver substrate unit and the power circuit unit can be effectively cooled by one fan. In addition, the power circuit unit is in a posture along the airflow direction, and the airflow from the fan is not easily blocked by the power circuit unit. Therefore, the air easily flows in the entire housing, so that the inside of the controller can be effectively cooled even if the number of fans is small. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 This is a perspective view of the external appearance of the controller according to the first embodiment. Figure 2 yes Figure 1 Exploded perspective view of the controller. Figure 3 This is a perspective view of a plurality of electric units housed in a casing as viewed from the front panel side. Figure 4 This is a perspective view of a plurality of electric units housed in a housing as viewed from the rear panel side. Figure 5 This is a top view of the controller with the cover removed. Figure 6 It is a plan view showing the fixing position of the base member of each electric unit with respect to the bottom panel. Figure 7 This is an exploded perspective view of the driver unit. Figure 8 This is an exploded perspective view of the power supply circuit unit. Fig. 9 This is an exploded perspective view of the main circuit unit. Fig.10 This is a side view of the main circuit unit viewed from the Y1 direction. Fig.11 It is an exploded perspective view of the first substrate, the second substrate and the second base frame of the main circuit unit. Fig.12 It is an explanatory diagram showing a part of the assembling process of the electric unit (an explanatory diagram of the process of assembling the power circuit unit). Fig.13 It is an explanatory diagram showing a part of the assembly process of the electric unit (an explanatory diagram of the process of assembling the main circuit unit). Fig.14 It is an explanatory diagram showing a part of the assembly process of the electric unit (an explanatory diagram of the process of assembling the driver unit). Fig.15 It is a top view of the driver unit, power supply circuit unit, and main circuit unit. Fig.16This is a perspective view of the driver unit, power supply circuit unit, and main circuit unit as viewed from the rear panel side. Fig.17 This is a top view of the controller according to Embodiment 2 with the cover removed. Fig.18 This is a perspective view of a driver unit in the controller according to the second embodiment. Fig.19 yes Fig.18 Exploded perspective view of the driver unit. Fig. 20 This is a diagram to explain the contents and results of the airflow analysis test. DETAILED DESCRIPTION

[0024] Hereinafter, an embodiment of a controller to which the present invention is applied will be described with reference to the drawings. A controller 1 of the present embodiment is a device that supplies power to a robot (manipulator) having an actuator such as a motor.

[0025] (Implementation Method 1) Figure 1 This is a perspective view of the external appearance of the controller 1 according to the first embodiment. Figure 2 yes Figure 1 An exploded perspective view of the controller 1. Figure 3 This is a perspective view of the plurality of electric units 10 housed in the housing 2 as viewed from the front panel 23 side. Figure 4 This is a perspective view of the plurality of electric units 10 housed in the housing 2 as viewed from the rear panel 24 side. Figure 5 It is a top view of the controller 1 with the cover 2B removed.

[0026] In this specification, the three directions XYZ are mutually orthogonal directions. In this specification, for convenience, the Z direction is set as the up and down direction of the controller 1. The Z1 direction is downward, and the Z2 direction is upward. The X direction is the front and back direction of the controller 1. The X1 direction is the front, and the X2 direction is the back. The Y direction is the width direction of the controller 1. The Y1 direction and the Y2 direction are one side and the other side of the Y direction. The Y direction is the first direction. The X direction is the second direction. In addition, in the actual use of the controller 1, the Z direction may not be consistent with the up and down direction (vertical direction). For example, it can also be set to use the Y direction as the up and down direction.

[0027] (Overall structure) like Figure 1 , Figure 2As shown, the controller 1 of the first embodiment includes a metal housing 2. The housing 2 is a rectangular parallelepiped, and includes a bottom panel 21 facing the Z1 direction, a top panel 22 facing the Z2 direction, a front panel 23 facing the X1 direction, and a back panel 24 facing the X2 direction. The housing 2 is formed by assembling two parts, namely, a housing body 2A including the bottom panel 21 and a cover 2B including the top panel 22. The housing body 2A has a box shape that opens in the Z2 direction. The cover 2B is assembled to the housing body 2A from the Z2 direction to close the opening of the housing body 2A.

[0028] The housing body 2A includes: a front panel 23 and a back panel 24, which stand up along the Z2 direction from the edges of the bottom panel 21 in the X1 direction and the X2 direction; a side panel 25, which stands up along the Z2 direction from the edge of the bottom panel 21 in the Y1 direction and connects the ends of the front panel 23 and the back panel 24 in the Y1 direction; and a side panel 26, which stands up along the Z2 direction from the edge of the bottom panel 21 in the Y2 direction and connects the ends of the front panel 23 and the back panel 24 in the Y2 direction. The height of the side panels 25 and 26 in the Z direction is lower than that of the front panel 23 and the back panel 24.

[0029] The cover 2B includes a side panel 27 extending from the edge of the top panel 22 in the Y1 direction to the Z1 direction, and a side panel 28 extending from the edge of the top panel 22 in the Y2 direction to the Z1 direction. The side panels 27 and 28 are provided at their front ends with stepped portions 27a and 28a inserted into the inner sides of the side panels 25 and 26 of the housing body 2A.

[0030] like Figure 2 , Figure 3 , Figure 4 , Figure 5 As shown, a plurality of electric units 10 are housed in the housing 2. In the present embodiment, all the electric units 10 are arranged on the same surface and fixed on the same surface. The housing body 2A includes a bottom panel 21 opposite to the top panel 22 of the cover 2B. The bottom panel 21 is used as a unit fixing surface for fixing all the electric units 10.

[0031] like Figure 3 , Figure 4As shown, a plurality of electrical units 10 are respectively provided with a metal base member 11 and a substrate or an electronic component fixed on the base member 11. Each electrical unit 10 is a unit in which substrates or electronic components of related functions are concentrated and fixed on the same base member 11. In this specification, an electronic component includes a component in which an electronic component or a substrate is modularized. The electrical unit 10 is fixed to the bottom panel 21 via the base member 11. In the present embodiment, each electrical unit 10 is arranged in a manner that does not hinder the loading and unloading of other electrical units 10 relative to the bottom panel 21. That is, each electrical unit 10 is arranged in a manner that the fixing portion where the base member 11 is fixed to the bottom panel 21 does not overlap with other electrical units 10 in the Z direction.

[0032] Figure 6 2 is a top view showing the fixing position of the base member 11 of each electric unit 10 relative to the bottom panel 21. Figure 2 As shown in FIG. 2 , a boss portion 29 protruding in the Z2 direction is provided on the inner surface (top surface) of the bottom panel 21. Figure 5 , Figure 6 As shown, each electric unit 10 is fixed to a different boss portion 29 via a fixing hole 29a of the base member 11, and the fixing portion (fixing hole 29a) does not overlap with other electric units 10. Therefore, during maintenance, it is not necessary to remove other electric units 10, and only the electric unit 10 including the maintenance target portion can be installed and removed relative to the housing body 2A.

[0033] like Figure 2 , Figure 5 As shown, six electrical units 10, namely, a driver unit 3, a power circuit unit 4, a main circuit unit 5, an interface unit 6, an output unit 7, and a power input unit 8, are accommodated in the housing 2. The three electrical units 10, namely, the driver unit 3, the power circuit unit 4, and the main circuit unit 5, are arranged in this order toward the Y1 direction and are arranged on the inner side of the rear panel 24. The three electrical units 10, namely, the interface unit 6, the output unit 7, and the power input unit 8, are arranged in this order toward the Y2 direction and are arranged on the inner side of the front panel 23. The details of each electrical unit 10 are described below.

[0034] (Driver unit) like Figure 2 As shown, the driver unit 3 is a unit including a driver substrate unit 3A that holds a plurality of driver substrates 31 on a first base frame 30 as a base member 11, and a cooling fan 32 is integrated with the driver substrate unit 3A.

[0035] Figure 7 FIG. 2 is an exploded perspective view of the driver unit 3. Figure 7As shown, the first base frame 30 includes a first base plate 301, a plurality of first substrate mounting plates 302, and a frame top plate 303. The first base plate 301 is in the shape of a plate along the XY plane and is fixed to the bottom panel 21 (see FIG. Figure 2 ). The first substrate mounting plates 302 are arranged in parallel in a posture vertically standing from the first base plate 301. In this embodiment, three first substrate mounting plates 302 along the XZ plane are arranged in parallel with the Y direction. The frame top plate 303 is fixed to the upper ends of the plurality of first substrate mounting plates 302 in a posture along the XY plane. Two openings 304 extending in the X direction are provided on the frame top plate 303.

[0036] The driver unit 3 includes a plurality of driver substrates 31 and a fan 32 fixed to the first base frame 30. The driver unit 3 includes three driver substrates 31. Each driver substrate 31 is arranged in parallel with the first substrate mounting plate 302 and is fixed to the first substrate mounting plate 302 from the Y2 direction. Each driver substrate 31 has a heat sink 33 fixed to the substrate surface in the Y1 direction, and an electronic component 34 such as an IGBT module is mounted on the substrate surface in the Y2 direction.

[0037] A connector 35 for connecting a power line is disposed at the end of each driver substrate 31 in the Z2 direction. Figure 3 , Figure 4 As shown, the connectors 35 of the two driver substrates 31 on the Y1 side and the center are arranged in the opening 304 of the frame top plate 303. The connector 35 of the driver substrate 31 on the Y2 side is located closer to the Y2 direction than the end of the frame top plate 303 in the Y2 direction. Therefore, the connector 35 of the driver unit 3 is not covered by the frame top plate 303, and the power wiring can be connected from the Z2 direction.

[0038] like Figure 7 As shown, at the end of the Z1 direction of each driver substrate 31, a wiring substrate 36 is arranged along the XY plane. The driver substrate 31 is connected to the wiring substrate 36 via a connector 37 that is fitted in the Z direction. The end of the driver substrate 31 in the Z1 direction is held by the first base frame 30 via the connector 37 and the wiring substrate 36. In addition, at the end of the first base frame 30 in the X1 direction, a unit-to-unit connection connector 38 for connecting wiring from other electric units 10 is arranged.

[0039] The fan 32 is provided in a posture capable of blowing air in a direction (X direction) orthogonal to the arrangement direction (Y direction) of the driver substrates 31, and is arranged in the X2 direction of the driver substrate 31. The end of the fan 32 in the Z2 direction is fixed to the end of the frame top plate 303 in the X2 direction. The end of the fan 32 in the Z1 direction is fixed to the end of the first base plate 301 in the X2 direction.

[0040] like Figure 2 As shown in FIG. 1 , a circular vent 24a is provided at one location on the back panel 24. The vent 24a is located in the area on the Y2 side of the back panel 24. Figure 2 , Figure 5 As shown in the figure, when the driver unit 3 is assembled inside the corner where the side panel 26 and the back panel 24 in the Y2 direction of the housing body 2A are connected, the fan 32 arranged at the end of the driver unit 3 in the X2 direction is opposite to the vent 24a in the X direction. In this state, when the fan 32 is driven, air is sucked from the vent 24a, and the air flows in the gap between the adjacent driver substrates 31. The cooling effect of the airflow of the fan 32 will be described later.

[0041] (Power supply circuit unit) Figure 8 4 is an exploded perspective view of the power supply circuit unit 4. Figure 3 , Figure 4 , Figure 8 As shown, the power circuit unit 4 includes a first base member 40 as a base member 11. The first base member 40 includes: a first mounting plate 401 along the XZ plane; and a first fixing plate 402 bent from the end of the first mounting plate 401 on the Z1 side to the Y2 direction. The first fixing plate 402 is provided at two locations separated in the X direction. The first base member 40 is fixed to the bottom panel 21 (see FIG. 2 ) as the unit fixing surface by fixing the first fixing plates 402 at two locations to the boss portions 29. Figure 2 ).

[0042] The first mounting plate 401 is provided with a rectangular notch 403 formed by cutting away the Z2 direction portion (upper end portion) of the X2 direction end portion (end portion on the back panel 24 side), and a rectangular opening 404 formed by cutting away a larger area in the X1 direction of the notch 403. The first fixing plate 402 is configured in a frame shape surrounding the opening 404.

[0043] The power supply circuit unit 4 includes a first voltage substrate 41 and a second voltage substrate 42. A first power supply circuit for generating a DC voltage of a first voltage from an AC voltage is provided on the first voltage substrate 41. A second power supply circuit for generating a DC voltage of a second voltage different from the first voltage from an AC voltage is provided on the second voltage substrate 42. For example, the first voltage is 24V and the second voltage is 5V. Both the first voltage and the second voltage are voltages different from the DC voltage (15V) supplied to the driver substrate 31. The power supply circuit unit 4 supplies DC voltages of 24V and 5V to other electrical units 10. For example, a DC voltage of 24V for driving the fan 32 is supplied to the driver unit 3, and a DC voltage of 5V is supplied to the control circuit substrate 64 described below.

[0044] The first voltage substrate 41 and the second voltage substrate 42 are fixed to the first mounting plate 401 from the Y2 direction (driver unit 3 side) and are arranged on the same surface. The first voltage substrate 41 and the second voltage substrate 42 are fixed to the front end of the spacer 405 protruding from the first mounting plate 401 in the Y2 direction. As a result, the first voltage substrate 41 and the second voltage substrate 42 are in a posture parallel to the XZ plane like the driver substrate 31, and are opposite to the driver unit 3 in the Y direction. The first voltage substrate 41 and the second voltage substrate 42 are mounted with electronic components 43 constituting a power supply circuit such as a power module on the substrate surface in the Y2 direction opposite to the driver unit 3. The first voltage substrate 41 and the second voltage substrate 42 face the opening 404 of the first mounting plate 401, so it is a structure that can also dissipate heat from the surface on the side where the electronic components are not mounted.

[0045] The first voltage substrate 41 and the second voltage substrate 42 are both rectangular substrates that are longer in the X direction and are arranged side by side in the Z direction. In the present embodiment, the first voltage substrate 41 for 24V is located in the Z2 direction, and the second voltage substrate 42 for 5V is located in the Z1 direction. The length of the second voltage substrate 42 in the X direction is longer than that of the first voltage substrate 41. The first voltage substrate 41 and the second voltage substrate 42 both overlap with the opening 404 of the first mounting plate 401, but do not overlap with the notch 403. The notch 403 of the first mounting plate 401 is shaped in such a way that the first mounting plate 401 is notched in accordance with the difference in length between the first voltage substrate 41 and the second voltage substrate 42 in the X direction.

[0046] (Main circuit unit) Fig. 9 It is an exploded perspective view of the main circuit unit 5 . Fig.10 This is a side view of the main circuit unit 5 as viewed from the Y1 direction. Fig.11 FIG. 5 is an exploded perspective view of the first substrate 51, the second substrate 52 and the second base frame 50 of the main circuit unit 5. Figure 3 , Figure 4 , Fig. 9 As shown, the main circuit unit 5 includes a second base frame 50 as the base member 11. Fig. 9 , Fig.10As shown, the second base frame 50 includes a second base plate 501, a pair of second substrate mounting plates 502 and a connecting plate 503. The pair of second substrate mounting plates 502 stand vertically from the second base plate 501 and are arranged in the X direction. In the present embodiment, from the second base plate 501 along the XY plane, a pair of second substrate mounting plates 502 along the YZ plane stand in the Z2 direction. The second substrate mounting plate 502 on the X2 side is formed integrally with the second base plate 501. The connecting plate 503 is fixed to the upper ends of the pair of second substrate mounting plates 502 in a posture along the XY plane. In addition, the pair of second substrate mounting plates 502 may also be inclined relative to the direction vertically standing from the second base plate 501.

[0047] The main circuit unit 5 includes a first substrate 51, a second substrate 52, and a third substrate 53. The first substrate 51 and the second substrate 52 are in a posture parallel to the second base plate 501 and overlap in the Z direction. The first substrate 51 is located on the upper side (Z2 side) of the second substrate 52. The four corners of the first substrate 51 and the second substrate 52 are connected by spacers 54, and are connected by two spacers 55 at a position close to the center of the substrate. The two spacers 55 are electrically connected to the circuit on the first substrate 51 and the circuit on the second substrate 52. The spacer 55 is a spacer for power wiring that also serves as a power wiring that supplies the voltage from the rectifier circuit mounted on the first substrate 51 to the power wiring of the second substrate 52.

[0048] The first substrate 51 and the second substrate 52 are mounted between a pair of second substrate mounting plates 502. Both ends of the second substrate 52 in the X direction located on the Z1 side are supported by arm portions 504 bent from both ends of the pair of second substrate mounting plates 502 in the Y direction. The first substrate 51 is supported by the pair of second substrate mounting plates 502 via the second substrate 52.

[0049] The third substrate 53 is arranged in a vertical position extending in the Z direction and is disposed on the side of the main circuit unit 5 in the X1 direction. The third substrate 53 is fixed to the second substrate mounting plate 502 on the X1 side from the side opposite to the first substrate 51 and the second substrate 52 (X1 side). Figure 8 As shown, the second substrate mounting plate 502 on the X1 side is provided with a rectangular opening 505 in the center and is formed in a frame shape.

[0050] The first substrate 51 and the second substrate 52 are assembled in such a manner that the substrate surfaces on which the circuits and components are mounted are opposite to each other, and components are not mounted on the portions of the substrates facing each other. The first substrate 51 has a rectifier circuit and various components described below mounted on the substrate surface on the Z2 side opposite to the second substrate 52, and no components are mounted on the substrate surface on the Z1 side opposite to the second substrate 52. The second substrate 52 has a plurality of main circuit capacitors 520 mounted on the substrate surface on the Z1 side opposite to the first substrate 51, and no components are mounted on the area of ​​the substrate surface on the Z2 side opposite to the first substrate 51 that faces the first substrate 51. The second substrate 52 is longer in the Y direction than the first substrate 51, and has a substrate end 52a on the Y2 side that does not face the first substrate 51. The second substrate 52 has a power wiring connector 521 and an LED lamp 522 mounted on the substrate surface on the Z2 side of the substrate end 52a. The main circuit unit 5 supplies a 15V DC voltage to the driver substrate 31 from the power wiring connector 521 of the second substrate 52.

[0051] like Fig. 9 As shown, the components mounted on the first substrate 51 include: two main circuit relays 510 arranged at the end of the first substrate 51 in the X2 direction; an anti-surge resistor 511 and an anti-surge relay 512 arranged in the Y2 direction of the main circuit relay 510; a 15V pre-driver power supply 513 and a 24V brake power supply 514 arranged on the X1 side of the main circuit relay 510; a diode bridge 515 constituting a rectifier circuit; and connectors 516, 517, 518 for connecting to other electric units 10. The connectors 516, 517, 518 are arranged at the end of the first substrate 51 in the Y1 direction. The diode bridge 515 is fixed to a heat sink 519, and the heat sink 512 is fixed to the end of the first substrate 51 in the Y2 direction. The spacer 55 for power wiring between the first substrate 51 and the second substrate 52 is arranged on the back side of the pre-driver power supply 513 and the brake power supply 514.

[0052] The main circuit unit 5 further includes a safety relay module 56 for emergency stopping the motor and a regenerative resistor 57. The safety relay module 56 is fixed to the second base plate 501 on the Y1 side of the first substrate 51 and the second substrate 52. The regenerative resistor 57 is fixed to the top surface of the connecting plate 503. The regenerative resistor 57 is connected to the connector on the first substrate 51.

[0053] like Figure 3As shown in FIG. 1 , a signal relay 531 is mounted on the third substrate 53 as an element for emergency stop control, and a connector 532 is mounted for connection with the signal relay 531. The signal relay 531 is arranged in the area on the Z1 side of the third substrate 53, and the connector 532 is arranged in the area on the Z2 side of the third substrate 53. Therefore, the connector 532 is arranged on the upper part of the main circuit unit 5, so it is easy to access when the main circuit unit 5 is assembled in the housing body 2A, and is arranged at a position where the wiring cable can be easily connected.

[0054] like Figure 2 , Figure 5 As shown, the main circuit unit 5 is assembled on the inner side of the corner where the side panel 25 and the back panel 24 of the housing body 2A are connected in the Y1 direction. As described above, on the inner side of the back panel 24, the driver unit 3, the power circuit unit 4 and the main circuit unit 5 are arranged in this order in the Y direction. The main circuit unit 5 is arranged in the following posture: the end where the safety relay module 56 is arranged is the Y1 side (side panel 25 side), and the end where the heat dissipation component 519 on the first substrate 51 and the power wiring connector 521 on the second substrate 52 are arranged is the Y2 side (power circuit unit 4 and driver unit 3 side). As described later, the heat dissipation component 519 is opposite to the notch 403 of the power circuit unit 4.

[0055] (Interface Unit) like Figure 3 , Figure 4 As shown, the interface unit 6 includes a second base member 60 as the base member 11. The second base member 60 includes: a rectangular plate 601 along the XY plane; and two boss fixing portions 602 provided at the ends of the plate 601 in the X2 direction. Figure 5 , Figure 6 As shown, the two boss fixing portions 602 of the second base member 60 are fixed to the boss portions 29 of the bottom panel 21 .

[0056] The interface unit 6 includes a first communication substrate 61, a second communication substrate 62, a third communication substrate 63, and a control circuit substrate 64. The board 601, the control circuit substrate 64, the third communication substrate 63, the second communication substrate 62, and the first communication substrate 61 are stacked in sequence in the Z1 direction and connected via spacers. A communication connector 65 is arranged at the end of each substrate in the X1 direction.

[0057] Among the first communication substrate 61, the second communication substrate 62, the third communication substrate 63 and the control circuit substrate 64, the substrate located on the upper side (Z2 side) is shorter in the X direction than the substrate located on the lower side (Z1 side). These four substrates are offset in such a manner that the positions of the ends on the X1 side are aligned. Therefore, the interface unit 6 as a whole is configured to be stepped on the X2 side, and the end of the substrate on the lower side in the X2 direction is configured to be visible from the upper side (Z2 side). At the ends of the control circuit substrate 64 and the third communication substrate 63 in the X2 direction, an inter-unit connection connector 66 (refer to Figure 4 ).

[0058] like Figure 2 and Figure 5 As shown, the interface unit 6 is assembled inside the corner where the side panel 25 and the front panel 23 of the housing body 2A in the Y1 direction are connected. The front panel 23 is provided with a plurality of openings 23a in the area on the Y1 side (see Figure 2 ).like Figure 1 As shown, a plurality of communication connectors 65 are respectively arranged in the openings 23a of the front panel 23, and can be connected from the front of the housing.

[0059] The connector 532 mounted on the third substrate 53 of the main circuit unit 5 is arranged on the X2 side of the interface unit 6. As described above, the X2 side of the interface unit 6 is stepped, and is formed in a shape that recedes toward the X1 side as it goes upward (Z2 side). Therefore, a space is ensured on the X1 side of the connector 532 of the main circuit unit 5, and a space required for the installation and removal work to the connector 532 is ensured.

[0060] (Output unit) like Figure 3 , Figure 4 As shown, the output unit 7 includes a third base member 70 as the base member 11. The third base member 70 includes: a rectangular connector mounting plate 701 along the YZ plane; and a third fixing plate 702 bent in the X2 direction from the end of the connector mounting plate 701 in the Z1 direction. The third fixing plate 702 is provided with fixing holes 29a for fixing to the boss portion 29 of the bottom panel 21 at two locations.

[0061] The output unit 7 includes: an external output connector 71 for outputting a driving current to the outside; a monitoring signal connector 72 for outputting a monitoring signal to the outside; two emergency stop connectors 73 and 74 for inputting an emergency stop signal from the outside; an encoder connector 75 for inputting an encoder signal from an actuator (motor); and a circuit breaker 76. The monitoring signal connector 72 is, for example, a connector for connecting to a teaching box. Figure 4As shown, an external output connector 71 , a monitoring signal connector 72 , emergency stop connectors 73 and 74 , an encoder connector 75 , and a circuit breaker 76 are mounted in an opening 70 a provided in a connector mounting plate 701 .

[0062] like Figure 2 and Figure 5 As shown, the output unit 7 is assembled inside the front panel 23 of the housing body 2A and is located adjacent to the interface unit 6. On the front panel 23, a plurality of openings 23b are provided on the Y2 side of the region where the opening 23a for the communication connector 65 is provided (see Figure 2 ).like Figure 1 As shown, the external output connector 71, the monitoring signal connector 72, the emergency stop connectors 73 and 74, the encoder connector 75, and the circuit breaker 76 are arranged in the opening 23b of the front panel 23 and can be connected from the front of the housing.

[0063] (Power input unit) like Figure 3 , Figure 4 As shown, the power input unit 8 includes a fourth base member 80 as the base member 11. The fourth base member 80 includes: a fourth mounting plate 801 having a rectangular shape along the XZ plane; and a fourth fixing plate 802 bent in the Y1 direction from the end of the fourth mounting plate 801 in the Z1 direction. The fourth fixing plate 802 is provided with fixing holes 29a for fixing to the boss portion 29 of the bottom panel 21 at three locations.

[0064] The power input unit 8 includes: a power input terminal block 81 to which a power supply line from an external power source is connected; a noise filter 82; and a grounding plate 83. The power input terminal block 81 is fixed to the fourth fixing plate 802. In this embodiment, the power input terminal block 81 is fixed to the fourth fixing plate 802 via a plate separate from the fourth base member 80. The noise filter 82 is fixed to the fourth mounting plate 801. Figure 3 As shown, the grounding piece 83 is formed integrally with the fourth base member 80. The grounding piece 83 is bent from the edge of the fourth mounting plate 801 in the X1 direction toward the Z2 direction.

[0065] like Figure 2 and Figure 5 As shown, the power input unit 8 is assembled inside the corner where the side panel 26 and the front panel 23 of the housing body 2A are connected in the Y2 direction. Figure 1 As shown in FIG. 2 , an opening 23c is provided at the end of the front panel 23 on the Y2 side, which is opposite to the power input terminal block 81 and the grounding plate 83. Figure 1Although not shown in the figure, a plate that blocks the opening 23c is mounted on the front panel 23, and a power supply cable from an external power source is introduced into the housing 2 via a sleeve held on the plate. The power supply cable includes: a power supply line connected to the power input terminal block 81; and a grounding line connected to the grounding plate 83.

[0066] For example, a single-phase AC voltage for control power and a three-phase AC voltage for drive power are input from a power supply cable to the power input unit 8. A circuit breaker 76 provided on the output unit 7 is connected to a voltage supply path connecting the power input terminal block 81 and the noise filter 82. The noise filter 82 includes a filter circuit for removing noise superimposed on the AC voltage supplied to the main circuit unit 5.

[0067] (Electric unit assembly process) Fig.12 , Fig.13 , Fig.14 It is an explanatory diagram showing a part of the assembly process of the electric unit 10 . Fig.12 It is an explanatory diagram of the process of assembling the power circuit unit 4. Fig.13 It is an explanatory diagram of the process of assembling the main circuit unit 5. Fig.14 1 is an explanatory diagram of a process of assembling the driver unit 3. When assembling the controller 1, for example, the assembly process described below can be performed. In addition, the assembly process described below is an example, and is not limited to this order.

[0068] For example, Fig.12 As shown, the three electrical units 10 (power input unit 8, output unit 7 and interface unit 6) on the front panel 23 side are assembled to the housing body 2A. Figure 5 and Figure 6 As shown, since each electric unit 10 is arranged in a manner that does not hinder the loading and unloading of other electric units 10, the three electric units 10 can be installed in any order.

[0069] Next, the power circuit unit 4 and the main circuit unit 5 arranged in the center of the three electrical units 10 on the back panel 24 side are assembled. Fig.12 , Fig.13 As shown in FIG. 1 , first assemble the power circuit unit 4. Then, as shown in FIG. Fig.13 As shown, the main circuit unit 5 is assembled on the Y1 side of the power circuit unit 4.

[0070] like Fig.14 As shown, it is necessary to draw the power distribution cable 12 between the main circuit unit 5 and the power input unit 8. Figure 5 As shown, in this embodiment, the power circuit unit 4 is arranged at a position retreated from the rear panel 24 compared to the two electrical units 10 (main circuit unit 5, driver unit 3) on both sides. Fig.14 As shown, the power distribution cable 12 extends along the X2 direction inside the side panel 26, and then extends along the Y1 direction inside the back panel 24, from the gap S between the power circuit unit 4 and the back panel 24 toward the main circuit unit 5. Fig.14 Although not shown in the figure, the power distribution cable 12 is drawn around the end portion on the Y1 side of the first substrate 51 and connected to the connector on the first substrate 51 .

[0071] After the driver unit 3 is assembled, the power distribution cable 12 is passed through the gap between the driver unit 3 and the housing body 2A. When the main circuit unit 5 is installed or removed, the power distribution cable 12 is disconnected from the connector on the first substrate 51 to remove only the main circuit unit 5.

[0072] (Cooling effect of the drive unit fan) Fig.15 FIG. 4 is a top view of the driver unit 3, the power supply circuit unit 4 and the main circuit unit 5. Fig.15 In the figure, the frame top plate 303 of the driver unit 3 is omitted, and the regenerative resistor 57 and the connection plate 503 of the main circuit unit 5 are omitted. Fig.16 This is a perspective view of the driver unit 3, the power circuit unit 4, and the main circuit unit 5 as viewed from the rear panel 24 side. Fig.16 In FIG. 5 , the regenerative resistor 57 and the connection plate 503 are omitted from the main circuit unit 5 , and the second base plate 501 is shown in a disassembled state.

[0073] like Fig.15 As shown in FIG. 1 , in the driver unit 3, the driver substrates 31 extending in the X direction are arranged in the Y direction. Gaps S1 and S2 for air to pass through are provided between adjacent driver substrates 31. Figure 5 ) is consistent with the X direction. The fan 32 is arranged at a position opposite to the two gaps S1 and S2. Therefore, when the fan 32 is driven, air flows through the gaps S1 and S2.

[0074] A power circuit unit 4 is arranged on the Y1 side of the driver unit 3, and is assembled as a whole into a thin shape parallel to the driver substrate 31. In the power circuit unit 4, the first voltage substrate 41 and the second voltage substrate 42 are arranged on the side facing the driver unit 3, and extend in parallel with the driver substrate 31. In the present embodiment, the end of the fan 32 of the driver unit 3 in the Y1 direction extends to a position facing a part of the gap S3 between the driver unit 3 and the power circuit unit 4. Therefore, when the fan 32 is driven, air flows not only through the gaps S1 and S2 of the adjacent driver substrates 31, but also through the gap S3 between the driver unit 3 and the power circuit unit 4.

[0075] Since the three driver substrates 31 are all provided with heat sinks 33 fixed on the surfaces on the Y1 side, the airflow from the fan 32 cools the three heat sinks 33. In addition, the power circuit unit 4 has electronic components 43 constituting the power circuit mounted on the substrate surfaces of the first voltage substrate 41 and the second voltage substrate 42 on the driver unit 3 side (Y2 side), so the air from the fan 32 flows through the portion generating more heat.

[0076] like Fig.13 , Fig.16 As shown, a notch 403 is formed at the end of the power circuit unit 4 on the back panel 24 side (X2 side). As described above, the power circuit unit 4 is retracted toward the X1 side until a gap S is formed between it and the back panel 24 (see FIG. Figure 5 ) position, so that the notch portion 403 faces the gap S3 through which the air from the fan 32 passes. Fig.16 It can be seen that the notch 403 faces the heat dissipation component 519 of the main circuit unit 5. Fig.16 As shown by the arrow in , the airflow from the fan 32 flows toward the heat sink 519 via the notch 403. Therefore, the heat sink 519 is cooled.

[0077] like Figure 2 As shown in FIG. 1 , the housing 2 is provided with vents 23d and 23e on the front panel 23, and air is exhausted to the front side, but there is no vent in the central portion of the front panel 23 located on the X1 side of the power circuit unit 4. The three-dimensional model of this embodiment is used to perform fluid analysis, and the results confirm that when the fan 32 is driven, an airflow ( 23d, 23e ) is generated from the airflow along the power circuit unit 4 and returns to the main circuit unit 5 side via the output unit 7 and the interface unit 6. Figure 5 In addition, the flow velocity of the airflow in each part of the housing 2 was determined by fluid analysis, and it was confirmed that the air flows throughout the entire interior of the housing 2, and the difference in flow velocity due to different positions is small.

[0078] As a different arrangement from the present embodiment, a fluid analysis was also performed using a three-dimensional model for an arrangement in which the configurations of the driver unit 3 and the power circuit unit 4 were swapped. However, it was confirmed that in this case, compared with the present embodiment, it was difficult for air to bypass the power circuit unit 4 side, and the flow rate near the power circuit unit 4 became lower, making it impossible to cool effectively.

[0079] In addition, in the present embodiment, an air intake fan that draws air from the vent 24a into the housing 2 is used as the fan 32, but an exhaust fan that exhausts air from the vent 24a to the outside of the housing 2 may be used. Even if the airflow directions are opposite, the power supply circuit unit 4 and the heat dissipation component 519 of the main circuit unit 5 can be cooled by one fan 32.

[0080] (Effects of Embodiment 1) As described above, the controller 1 of the present embodiment includes: a driver substrate unit 3A, which is held on the first base frame 30 in a state where a plurality of driver substrates 31 for generating a driving current for driving a motor are arranged in parallel with the Y direction (first direction); a power circuit unit 4, which is adjacent to the driver substrate unit 3A in the Y direction; a fan 32, which is opposite to the driver substrate 31 in the X direction (second direction); and a housing 2, which accommodates the driver substrate unit 3A, the power circuit unit 4, and the fan 32, and is provided with a vent 24a opposite to the fan 32 in the X direction. The power circuit unit 4 includes at least one substrate, which includes a first voltage substrate 41 for generating a DC voltage of a first voltage (24V). The first voltage substrate 41 is arranged in parallel with the driver substrate 31 and faces the gap S3 between the driver substrate unit 3A and the power circuit unit 4. The gaps S1 and S2 between the adjacent driver substrates 31 of the driver substrate unit 3A face the fan 32 in the X direction, and a portion of the gap S3 between the power supply circuit unit 4 and the driver substrate unit 3A faces the fan 32 in the X direction.

[0081] In the present embodiment, a part of the gap S3 faces the fan 32 , but the fan 32 may be moved to a position facing the power circuit unit 4 so that the entire gap S3 faces the fan 32 .

[0082] According to the present embodiment, the vent 24a of the housing 2 is provided at a position opposite to the fan 32, and the fan 32 is arranged so as to be opposite to the plurality of driver substrates 31 in a direction (X direction) orthogonal to the arrangement direction (Y direction) of the plurality of driver substrates 31. In addition, the gap S3 between the driver substrate unit 3A and the power circuit unit 4 is also opposite to the fan 32, and the first voltage substrate 41 of the power circuit unit 4 is arranged in parallel with the driver substrate 31 and is arranged to face the gap S3 opposite to the fan 32. By arranging the substrates and the fan 32 in this way, the air generated by the fan 32 flows not only in the gaps S1 and S2 facing the driver substrate 31, but also in the gap S3 of the substrate facing the power circuit unit 4. Therefore, both the driver substrate unit 3A and the power circuit unit 4 can be effectively cooled by one fan 32. In addition, the power circuit unit 4 is in a posture along the airflow direction, and the airflow from the fan 32 is not easily blocked by the power circuit unit 4. Therefore, the air easily flows in the entire housing 2, so that the inside of the controller 1 can be effectively cooled even if the number of fans 32 is small.

[0083] In this embodiment, the plurality of driver substrates 31 are provided with heat sinks 33 on the surface on the side where the power circuit unit 4 is located. Therefore, air flows onto the heat sinks 33 of all the driver substrates 31, thereby enabling efficient cooling.

[0084] In the present embodiment, the fan 32 is fixed to the driver substrate unit 3A via the first base frame 30. Thus, by fixing the fan 32 to the first base frame 30 holding the driver substrate 31 instead of fixing it to the housing 2, the position accuracy of the fan 32 relative to the driver substrate 31 can be improved. In addition, since it is not necessary to fix the fan 32 separately to the housing 2, the assemblability can be improved. In addition, since the wiring of the fan 32 and the wiring of the driver substrate 31 can be concentrated, the load of the wiring work can be reduced.

[0085] In this embodiment, the first base frame 30 includes: a first base plate 301 fixed to the housing 2; a plurality of first substrate mounting plates 302 rising in parallel from the first base plate 301; and a frame top plate 303 fixed to the front ends of the plurality of first substrate mounting plates 302. The plurality of driver substrates 31 are respectively fixed to the first substrate mounting plates 302. The fan 32 is fixed to the edge of the first base plate 301 on the side of the vent 24a (X2 side) and the edge of the frame top plate 303 on the side of the vent 24a (X2 side). With this frame structure, the fan 32 can be held opposite to the gaps S1 and S2 of the driver substrate 31.

[0086] In the present embodiment, the power circuit unit 4 has at least two substrates, and the at least two substrates include a second voltage substrate 42 for generating a DC voltage of a second voltage (5V) different from the first voltage (24V). The second voltage substrate 42 is arranged in an array with the first voltage substrate 41, and the substrate surface faces the same direction as the first voltage substrate 41. Thus, a plurality of power circuits for generating DC voltages of different voltages can be unitized. Therefore, it is not necessary to assemble each power circuit separately to the housing 2, so that the assemblability can be improved and the wiring can be centralized. In addition, both substrates face the gap where the air flows, and are in a posture along the direction of the airflow from the fan 32. Therefore, cooling can be performed effectively.

[0087] In this embodiment, since the first voltage substrate 41 and the second voltage substrate 42 are arranged on the same surface, the two substrates can be cooled equally. In addition, since the power circuit unit 4 is thin, air can easily flow in the housing 2. Moreover, since it is a unit with a small plane size, the installation space on the bottom panel 21 is small. Therefore, the plane size of the entire device can be reduced.

[0088] In this embodiment, the first voltage substrate 41 and the second voltage substrate 42 have electronic components 43 disposed on the substrate surface facing the driver substrate unit 3A side (Y2 side). Therefore, the electronic components 43 can be directly cooled by the airflow from the fan 32, thereby preventing the electronic components 43 from becoming hot.

[0089] In the present embodiment, the power circuit unit 4 includes a first base member 40 fixed to the housing 2. The first base member 40 includes a first mounting plate 401 parallel to the driver substrate 31, the first mounting plate 401 having a first voltage substrate 41 fixed thereto from the driver substrate unit 3A side (Y2 side), and an opening portion 404 formed by cutting away a region opposite to the first voltage substrate 41. With such a frame structure, the substrate of the power circuit unit 4 can be kept in a posture parallel to the driver substrate 31. In addition, by providing the opening portion 404 on the first mounting plate 401, the heat of the first voltage substrate 41 can be dissipated to the side opposite to the driver substrate unit 3A (Y1 side). Therefore, the temperature rise of the power circuit unit 4 can be suppressed.

[0090] In the present embodiment, there is a main circuit unit 5 for providing a DC voltage (15V) different from the first voltage (24V) to the driver substrate 31. The driver substrate unit 3A, the power circuit unit 4 and the main circuit unit 5 are arranged in this order in the Y direction (first direction). By configuring the fan 32 as described above, the airflow generated by the fan 32 is blown toward the gap S3 between the power circuit unit 4 and the driver substrate unit 3A, which are configured in the center of the three units. As a result, air easily flows from the center of the housing 2 to each part of the housing 2, so that the inside of the controller 1 can be effectively cooled by one fan 32. In the airflow analysis using the three-dimensional model, it was confirmed that the airflow flowing along the power circuit unit 4 in the gap S3 between the power circuit unit 4 and the driver substrate unit 3A bypassed the main circuit unit 5 side.

[0091] In the present embodiment, the main circuit unit 5 includes: a heat sink 519 disposed at a position opposite to the notch 403 provided in the first mounting plate 401 in the Y direction (first direction); and a diode bridge 515 as a heating element fixed to the heat sink 519. Therefore, a part of the airflow sent to the gap S3 between the power circuit unit 4 and the driver substrate unit 3A is blown to the heat sink 519 of the main circuit unit 5 via the notch 403 of the first mounting plate 401. Therefore, by a single fan 32, not only the power circuit unit 4 and the driver substrate 31 but also the diode bridge 515 of the main circuit unit 5 can be cooled.

[0092] In this embodiment, the fan 32 sucks air from the vent 24a side and blows air toward the driver board 31. Therefore, since the external air first hits the driver board 31 and the power circuit unit 4, the driver board 31 and the power circuit unit 4 can be effectively cooled.

[0093] (Implementation Method 2) Fig.17 It is a top view of the controller 101 of Embodiment 2 with the cover 2B removed. Hereinafter, regarding the controller 101 of Embodiment 2, description of the same configuration as that of Embodiment 1 will be omitted, and configurations different from those of Embodiment 1 will be described.

[0094] like Fig.17 As shown, the controller 101 includes a rectangular parallelepiped housing 2. The housing 2 includes a housing body 2A that accommodates a plurality of electrical units, similarly to the first embodiment. The controller 101 includes a driver unit 103, a power circuit unit 4, a main circuit unit 5, an interface unit 6, an output unit 7, and a power input unit 8 as electrical units accommodated in the housing body 2A. The driver unit 103, the power circuit unit 4, and the main circuit unit 5 are arranged in this order toward the Y1 direction and are arranged on the inner side of the back panel 24 of the housing body 2A.

[0095] Fig.18 This is a perspective view of the driver unit 103 in the controller 101 according to the second embodiment. Fig.19 yes Fig.18 The exploded perspective view of the driver unit 103 is shown in FIG. Fig.18 and Fig.19 As shown, the driver unit 103 includes a driver substrate unit 103A in which a plurality of driver substrates 31 are held on a first base frame 130 as a base member 11. The driver unit 103 is an integrated unit in which a cooling fan 32 is assembled to the driver substrate unit 103A.

[0096] The controller 1 of the first embodiment supplies drive current to the actuator of the 6-axis (6-DOF) robot via three driver substrates 31, whereas the controller 101 of the second embodiment supplies drive current to the actuator of the 8-axis (8-DOF) robot via four driver substrates 31. Figure 5 , Fig.17 It can be seen that the driver unit 103 according to the second embodiment has a larger size in the Y direction because the number of driver substrates 31 is increased from 3 to 4.

[0097] like Fig.18 , Fig.19As shown, a mounting plate 305 is arranged at the edge of the first base frame 130 in the X2 direction, in other words, at the edge of the vent 24a side of the first base frame 130. The mounting plate 305 is screwed to the end of the frame top plate 303 in the X2 direction constituting the first base frame 130. Fig.19 As shown, the mounting plate 305 includes a fan mounting portion 306 bent in the Z1 direction. The cooling fan 32 is fixed to the first base frame 130 by being screwed to the fan mounting portion 306 from the X2 side.

[0098] like Fig.19 As shown in FIG. 1 , the fan mounting portion 306 is inclined toward the X2 direction as it is directed toward the Y1 direction. By forming the fan mounting portion 306 as an inclined surface inclined with respect to the XZ plane, the fan 32 is fixed in an inclined posture as described below.

[0099] like Fig.17 , Fig.18 , Fig.19 As shown, in the second embodiment, the direction of the cooling fan 32 is different from that in the first embodiment. In the first embodiment, the rotation axis L of the fan 32 is consistent with the X direction, while in the second embodiment, the rotation axis L of the fan 32 is inclined in a direction that forms an acute angle with respect to the X axis direction. The fan 32 is opposite to the vent 24a provided on the back panel 24 as the outer panel of the housing 2. The fan 32 is arranged in a posture inclined in a direction in which the gap with the back panel 24 becomes narrower as it moves toward the Y1 direction in which the power circuit unit 4 is arranged. As a result, a wedge-shaped gap S5 that opens in the Y2 direction is formed between the back panel 24 and the fan 32.

[0100] (Cooling effect of air flow from a fan) like Fig.17 As shown, the driver unit 103 of the second embodiment arranges four driver substrates 31 extending in the X direction in the Y direction. Therefore, three gaps S0, S1, and S2 for air to pass through are provided between adjacent driver substrates 31. The gaps S1 and S2 of the driver substrates 31 and the gap S3 between the driver unit 103 and the power supply circuit unit 4 are opposite to the fan 32. Therefore, when the fan 32 is driven, an airflow toward the X1 direction through the gaps S1, S2, and S3 is generated as in the first embodiment. As a result, Fig.17As shown by the arrow A, an airflow is generated from the airflow along the power circuit unit 4 to return to the main circuit unit 5 side via the output unit 7 and the interface unit 6. In addition, as in the first embodiment, the frame of the power circuit unit 4 is provided with a notch 403 at the end on the X2 side, and an airflow is generated toward the heat dissipation component 519 of the main circuit unit 5 via the notch 403. In the second embodiment, as in the first embodiment, the air flows throughout the interior of the housing 2, and the difference in flow velocity due to the position is small.

[0101] In the second embodiment, since the fan 32 is tilted toward the power circuit unit 4, the airflow toward the power circuit unit 4 increases. In addition, the airflow toward the heat sink 519 of the main circuit unit 5 via the notch 403 of the substrate of the power circuit unit 4 increases. As a result, the cooling effect of the diode bridge 515 arranged on the back side of the heat sink 519 is improved.

[0102] like Fig.17 As shown in FIG. 1 , by tilting the fan 32, a gap S5 opening in the Y2 direction is formed between the back panel 24 and the fan 32. Therefore, when the fan 32 is driven, in addition to the external air sucked from the vent 24a, Fig.17 As shown by arrow B, the air in the housing 2 is sucked from the gap S5 by the fan 32. By adopting a configuration that easily sucks air from the housing 2, as shown in the air flow analysis described later, the air flow at the air intake port of the fan 32 increases, and the air flow at the air exhaust port of the fan 32 also increases.

[0103] In Embodiment 2, the number of driver substrates 31 is increased to four, while the size of the fan 32 is not increased. Therefore, among the gaps S0, S1, and S2 of the four driver substrates 31, the gap S0 closest to the Y2 side is not opposite to the fan 32, and the airflow from the fan 32 does not flow into the gap S0. Fig.17 As shown by the arrow B, air is sucked from the gap S5 between the vent 24a and the fan 32, so Fig.17 As shown by the arrow C, an airflow in the X2 direction is generated from the gap S0 closest to the Y1 side toward the gap S5. Fig.17 As shown by arrow D in FIG. 2 , an airflow in the direction X2 toward the gap S5 is also generated in the gap S4 between the driver substrate 31 at the end and the side panel 26 of the housing 2 .

[0104] Thus, in the second embodiment, by tilting the fan 32, not only the airflow passing through the gaps S1 and S2 facing the fan 32 but also the airflow passing through the gaps S0 and S4 not facing the fan 32 is generated. Since the airflow passing through the gaps S0 and S4 is directed toward the fan 32, an airflow is generated that circulates inside and around the driver unit 103. Therefore, the large driver unit 103 can be cooled as a whole by one fan 32.

[0105] (Airflow analysis test) Fig. 20 This is an explanatory diagram of the contents and results of the airflow analysis test. The fan 32 is set at different levels 1 to 4 in different configurations and postures, and the flow rate at four positions P1 to P4 at each level is calculated through airflow analysis. P1 is the vent 24a set on the back panel 24 of the housing 2. P2 is the fan air intake port, and P3 is the fan exhaust port. P4 is the exhaust port of the housing 2, specifically, the Fig.17 The vents on the front panel 23 are shown. The contents of levels 1 to 4 are as follows Fig. 20 As shown. Levels 1 to 3 are all when the fan 32 is not tilted, and the gap with the back panel 24 is: level 1 is 0mm, level 2 is 6mm, and level 3 is 12mm. Level 4 is when the fan 32 is tilted, and the minimum gap with the back panel 24 is 6mm and the maximum is 12mm.

[0106] like Fig. 20 As shown, when a gap is provided between the fan 32 and the back panel 24, and when the fan 32 is tilted relative to the back panel 24, the flow rates of P1 and P4 are reduced, and the flow rates of P2 and P3 are increased. Therefore, it can be confirmed that the air supply volume of the fan 32 is increased. In addition, the reduction in the flow rate through the vents of the back panel 24 and the front panel 23 means that the airflow circulating inside the housing 2 is increased. By increasing the air supply volume and the airflow circulating inside the housing 2, the air cooling efficiency can be improved.

[0107] Furthermore, the results of the airflow analysis confirmed that the circulation volume of air in the casing 2 and the air supply volume can be increased not only when the casing 2 is tilted but also when a gap is provided between the casing 2 and the rear panel 24 .

[0108] However, when the fan 32 is not tilted, air is equally sucked not only from the Y2 side (driver unit 103 side) but also from the Y1 side (power circuit unit 4 side), so there is a concern that the airflow toward the power circuit unit 4 will decrease and the airflow circulating inside and around the driver unit 103 will decrease compared to the case where the fan 32 is tilted. Therefore, it is preferable to tilt the fan 32.

[0109] (Effects of Embodiment 2) As described above, in the controller 101 of the second embodiment, the housing 2 includes the back panel 24 facing the fan 32 in the X direction, and the vent 24a is formed in the back panel 24. The fan 32 is arranged in a posture inclined in a direction in which the distance from the back panel 24 becomes narrower toward the power circuit unit 4 side in the Y direction.

[0110] With such an arrangement, a gap S5 is formed between the back panel 24 and the fan 32, which becomes wider in the Y direction as it goes toward the side opposite to the power circuit unit 4. Therefore, the air in the housing 2 sucked from the side opposite to the power circuit unit 4 can be blown in a direction inclined toward the power circuit unit 4. Thus, the airflow toward the power circuit unit 4 can be increased, and the cooling efficiency of the power circuit unit 4 and the cooling efficiency of the diode bridge 515 provided on the main circuit unit 5 can be improved.

[0111] In addition, by such a configuration, the air in the housing 2 is sucked by the fan 32 from the gap S5, so that the airflow circulating inside the housing 2 can be increased, and the air cooling efficiency can be improved. In addition, by such a configuration, an airflow circulating around the driver substrate unit 103A and an airflow circulating through the inside of the driver substrate unit 103A are generated, so that the cooling efficiency of the driver substrate unit 103A can be improved. In this embodiment, due to the increase of the driver substrate 31, a gap S0 not facing the fan 32 is formed, but the airflow sucked by the fan 32 passes through the gap S0 of the driver substrate 31 not facing the fan 32 and heads toward the gap S5 between the fan 32 and the back panel 24. The airflow passing through the gap S0 not facing the fan 32 includes the airflow passing through the gaps S1 and S2 facing the fan 32, which is reflected by the components in the housing 2 and returned to the fan 32 side. Therefore, the entire driver substrate unit 103A can be effectively cooled by one fan 32.

[0112] exist Fig. 20 In the air flow analysis shown, when comparing levels 2, 3, and 4 with level 1, the air volume of the fan 32 can be increased compared to the case where there is no gap when the minimum value of the gap between the fan 32 and the back panel 24 is set to 6 mm or more. Therefore, the air cooling efficiency can be improved.

[0113] In the second embodiment, the fan 32 is fixed to the driver substrate unit 103A via the first base frame 130. The first base frame 130 is provided with a fan mounting portion 306 at the edge on the vent 24a side, and the fan mounting portion 222 is inclined in a direction in which the interval with the back panel 24 becomes narrower as it goes toward the power circuit unit 4 side in the Y direction. In this way, by providing the fan mounting portion 306 on the base frame holding the driver substrate 31 instead of on the housing 2, the structure for mounting the fan 32 in a direction inclined relative to the back panel 24 can be simplified.

[0114] (Other embodiments) The present invention may take the following forms. (1) A controller comprising: a driver substrate unit held on the first base frame in a state where a plurality of driver substrates for generating a driving current for driving the motor are arranged in parallel in a first direction; a power circuit unit adjacent to the driver substrate unit in the first direction; a fan that is opposite to the driver substrate in a second direction orthogonal to the first direction; and a housing that accommodates the driver substrate unit, the power circuit unit, and the fan, and is provided with a vent that is opposite to the fan in the second direction, The power circuit unit includes at least one substrate including a first voltage substrate for generating a DC voltage of a first voltage. The first voltage substrate is arranged in parallel with the driver substrate and faces a gap between the driver substrate unit and the power circuit unit. In the driver substrate unit, gaps between adjacent driver substrates face the fan in the second direction, and at least a portion of a gap between the power supply circuit unit and the driver substrate unit faces the fan in the second direction.

[0115] (2) In the controller of (1) above, The plurality of driver substrates each have a heat sink disposed on a surface on the side where the power circuit unit is located.

[0116] (3) In the controller of (1) or (2) above, The fan is fixed to the driver substrate unit through the first base frame.

[0117] (4) In the controller of (3) above, The first base frame comprises: a first base plate fixed to the housing; a plurality of first substrate mounting plates rising in parallel from the first base plate; and a frame top plate fixed to the front ends of the plurality of first substrate mounting plates. The plurality of driver substrates are respectively fixed to the first substrate mounting plate, The fan is fixed to an edge of the first base plate on the air vent side and an edge of the frame top plate on the air vent side.

[0118] (5) In the controller described in any one of (1) to (4) above, The power circuit unit includes at least two substrates, the at least two substrates including a second voltage substrate that generates a DC voltage of a second voltage different from the first voltage. The second voltage substrate is arranged side by side with the first voltage substrate such that a substrate surface faces the same direction as that of the first voltage substrate.

[0119] (6) In the controller of (5) above, The first voltage substrate and the second voltage substrate are arranged on the same surface.

[0120] (7) In the controller of (5) or (6) above, The first voltage substrate and the second voltage substrate have electronic components arranged on substrate surfaces facing the driver substrate unit side.

[0121] (8) In the controller described in any one of (1) to (7) above, The power circuit unit includes a first base member fixed to the housing. The first base member includes a first mounting plate parallel to the driver substrate. The first mounting plate has the first voltage substrate fixed thereto from the driver substrate unit side, and includes an opening portion formed by cutting out a region facing the first voltage substrate.

[0122] (9) In the controller of (8) above, A main circuit unit having a direct current voltage different from the first voltage provided to the driver substrate, The driver substrate unit, the power circuit unit, and the main circuit unit are arranged in this order in the first direction.

[0123] (10) In the controller of (9) above, The main circuit unit includes: a heat dissipating member disposed at a position opposing the notch portion provided in the first mounting plate in the first direction; and a heating element fixed to the heat dissipating member.

[0124] (11) In the controller described in any one of (1) to (10) above, The fan draws air from the vent side and sends air to the driver substrate side.

[0125] (12) In the controller described in any one of (1) to (11) above, The housing includes an exterior panel facing the fan in the second direction, the vent is formed on the exterior panel, and the fan is arranged in a posture inclined in a direction in which the distance between the fan and the exterior panel becomes narrower toward the power circuit unit in the first direction.

[0126] (13) In the controller of (12) above, The minimum value of the gap between the fan and the exterior panel is greater than 6 mm.

[0127] (14) In the controller of (12) or (13) above, The fan is fixed to the driver substrate unit via the first base frame, and the first base frame is provided with a fan mounting portion at an edge on the vent side, the fan mounting portion being inclined in a direction in which the distance from the exterior panel becomes narrower toward the power circuit unit side in the first direction. Explanation of symbols

[0128] 1, 101 ... controller, 2 ... housing, 2A ... housing body, 2B ... cover, 3, 103 ... driver unit, 3A, 103A ... driver substrate unit, 4 ... power circuit unit, 5 ... main circuit unit, 6 ... interface unit, 7 ... output unit, 8 ... power input unit, 10 ... electrical unit, 11 ... base member, 12 ... power distribution cable, 21 ... bottom panel, 22 ... top panel, 23 ... front panel, 23a, 23b, 23c ... opening, 23d, 23e ... vent, 24 ... back panel, 24a ... vent, 25, 26, 27, 28 ... side panel, 27a, 28a ... step portion, 29 ... boss portion, 29a ... fixing hole, 30, 130 ... first base Frame, 31…Driver substrate, 32…Fan, 33…Heat sink, 34…Electronic component, 35…Connector, 36…Wiring substrate, 37…Connector, 38…Connector for connecting between units, 40…First base member, 41…First voltage substrate, 42…Second voltage substrate, 43…Electronic component, 50…Second base frame, 51…First substrate, 52…Second substrate, 52a…Substrate end, 53…Third substrate, 54, 55…Spacer, 56…Safety relay module, 57…Regenerative resistor, 60…Second base member, 61…First communication substrate, 62…Second communication substrate, 63…Third communication substrate, 64…Control circuit substrate, 65…Communication connector, 66…Inter-unit Connector for connection, 70… Third base member, 70a… Opening, 71… External output connector, 72… Monitoring signal connector, 73, 74… Emergency stop connector, 75… Encoder connector, 76… Circuit breaker, 80… Fourth base member, 81… Power input terminal block, 82… Noise filter, 83… Grounding plate, 301… First base plate, 302… First substrate mounting plate, 303… Frame top plate, 304… Opening, 305… Mounting plate, 306… Fan mounting portion, 401… First mounting plate, 402… First fixing plate, 403… Notch, 404… Opening, 405… Spacer, 501… Second base plate, 502… Second substrate mounting plate, 503… Connecting plate, 504…arm, 505…opening, 510…main circuit relay, 511…anti-shock resistor, 512…anti-shock relay, 513…pre-driver power supply, 514…brake power supply, 515…diode bridge, 516, 517, 518…connector, 519…heat dissipation component, 520…main circuit capacitor, 521…connector for power wiring, 522…LED lamp, 531…signal relay, 532…connector, 601…plate, 602…boss fixing portion, 701…connector mounting plate, 702…third fixing plate, 801…fourth mounting plate, 802…fourth fixing plate, L…rotation axis, S, S0, S1, S2, S3, S4, S5 gaps.

Claims

1. A controller, characterized in that: have: a driver substrate unit held on the first base frame in a state where a plurality of driver substrates for generating a driving current for driving the motor are arranged in parallel in a first direction; a power circuit unit, the power circuit unit being adjacent to the driver substrate unit in the first direction; a fan, the fan being opposite to the driver substrate in a second direction orthogonal to the first direction; as well as a housing that accommodates the driver substrate unit, the power circuit unit, and the fan, and is provided with a vent that is opposite to the fan in the second direction, The power circuit unit includes at least one substrate including a first voltage substrate for generating a DC voltage of a first voltage. The first voltage substrate is arranged in parallel with the driver substrate and faces a gap between the driver substrate unit and the power circuit unit. A gap between adjacent driver substrates of the driver substrate unit faces the fan in the second direction, and at least a portion of a gap between the power supply circuit unit and the driver substrate unit faces the fan in the second direction.

2. The controller according to claim 1, characterized in that: The plurality of driver substrates each have a heat sink disposed on a surface on the side where the power circuit unit is located.

3. The controller according to claim 1, characterized in that: The fan is fixed to the driver substrate unit via the first base frame.

4. The controller according to claim 3, characterized in that: The first base frame comprises: a first base plate fixed to the housing; a plurality of first substrate mounting plates rising in parallel from the first base plate; and a frame top plate fixed to the front ends of the plurality of first substrate mounting plates. The plurality of driver substrates are respectively fixed to the first substrate mounting plate, The fan is fixed to an edge of the first base plate on the side of the air vent and an edge of the frame top plate on the side of the air vent.

5. The controller according to claim 1, characterized in that: The power circuit unit includes at least two substrates, the at least two substrates including a second voltage substrate that generates a DC voltage of a second voltage different from the first voltage. The second voltage substrate is arranged side by side with the first voltage substrate such that a substrate surface faces the same direction as that of the first voltage substrate.

6. The controller according to claim 5, characterized in that: The first voltage substrate and the second voltage substrate are arranged on the same surface.

7. The controller according to claim 5, characterized in that: The first voltage substrate and the second voltage substrate have electronic components arranged on substrate surfaces facing the driver substrate unit side.

8. The controller according to claim 1, characterized in that: The power circuit unit includes a first base member fixed to the housing. The first base member includes a first mounting plate parallel to the driver substrate. The first mounting plate has the first voltage substrate fixed thereto from the driver substrate unit side, and includes an opening portion formed by cutting out a region facing the first voltage substrate.

9. The controller according to claim 8, characterized in that: A main circuit unit is provided, the main circuit unit supplies a DC voltage having a voltage different from the first voltage to the driver substrate, The driver substrate unit, the power circuit unit, and the main circuit unit are arranged in this order in the first direction.

10. The controller according to claim 9, characterized in that: The main circuit unit includes: a heat dissipation member disposed at a position opposing the notch portion provided in the first mounting plate in the first direction; and a heat generating element fixed to the heat dissipation member.

11. The controller according to claim 1, characterized in that: The fan sucks air from the vent side and sends air to the driver substrate side.

12. The controller according to claim 1, characterized in that: The housing includes an exterior panel facing the fan in the second direction, and the vent is formed on the exterior panel. The fan is disposed in a posture in which the fan is inclined in a direction in which a distance between the fan and the exterior panel becomes narrower toward the power circuit unit side in the first direction.

13. The controller according to claim 12, characterized in that: The minimum value of the gap between the fan and the exterior panel is greater than 6 mm.

14. The controller according to claim 12, characterized in that: The fan is fixed to the driver substrate unit via the first base frame. The first base frame is provided with a fan mounting portion at an edge on the ventilation port side, the fan mounting portion being inclined in a direction in which a distance between the fan mounting portion and the exterior panel becomes narrower toward the power circuit unit side in the first direction.

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