Liquid Cooling System for Electronic Devices, Electronic Devices, and Liquid Cooling Control Method for Electronic Devices

Abstract

The present application discloses a liquid cooling system for an electronic device, an electronic device, and a liquid cooling control method for an electronic device, relating to the technical field of heat dissipation of electronic devices. The liquid cooling system for an electronic device includes: a condensation device; a liquid cooling pipeline, which is communicated with the condensation device. The cooling medium in the liquid cooling pipeline sequentially passes through the first component, the third component, and the second component of the electronic device and then returns to the condensation device. The heat dissipation power consumption of the third component is greater than that of the first component or the second component, and the gas-liquid state of the cooling medium changes when passing through at least one component. Since the cooling medium in the liquid cooling pipeline makes full use of the absorption potential of each phase state during the gas-liquid two-phase state change and combines the heat dissipation characteristics of each component, the highest-effect heat dissipation effect is achieved, solving the problem of poor cooling effect of the two-phase liquid cooling system in the related art and achieving the purpose of greatly improving the cooling effect of the two-phase liquid cooling system.

Description

Technical Field

[0001] This application relates to the technical field of heat dissipation of electronic devices, and particularly to a liquid cooling system for an electronic device, an electronic device, and a liquid cooling control method for an electronic device. Background Art

[0002] Currently, in the liquid cooling system of electronic devices such as servers, the two-phase cold plate is widely used because it naturally has the advantage of solving the problems of high heat density and high power consumption. In the two-phase liquid cooling system, the efficiency of boiling heat transfer is much higher than that of single-phase convective heat transfer. However, in the current two-phase liquid cooling system, the vaporization situation of the coolant cannot be stably controlled. If the coolant cannot be fully vaporized in the heat source, that is, the dryness is too small, then most of the coolant will flow through the heat source in a liquid state, which will greatly reduce the heat transfer efficiency. And if the coolant is completely vaporized in all heat sources, that is, the dryness is too large, then the further overheating of the coolant will not be able to effectively absorb the heat of the heat source, also reducing the cooling efficiency, thus resulting in a poor cooling effect of the two-phase liquid cooling system as a whole. Summary of the Invention

[0003] This application provides a liquid cooling system for an electronic device, an electronic device, and a liquid cooling control method for an electronic device to at least solve the problem of poor cooling effect of the two-phase liquid cooling system in the related art.

[0004] This application provides a liquid cooling system for an electronic device, including: a condensation device; a liquid cooling pipeline, which is connected to the condensation device. The cooling medium in the liquid cooling pipeline sequentially passes through the first component, the third component, and the second component of the electronic device and then returns to the condensation device. The heat dissipation power consumption of the third component is greater than that of the first component or the second component, and the gas-liquid state of the cooling medium changes when passing through at least one component.

[0005] This application also provides an electronic device, including: a cabinet; at least one electronic node, which is arranged in the cabinet. The electronic node includes a first component, a second component, and a third component; the above-mentioned liquid cooling system for an electronic device, and the liquid cooling pipeline is arranged between the cabinet and the electronic node.

[0006] The present application also provides a liquid cooling control method for an electronic device, which is executed by using the above-mentioned electronic device. The liquid cooling control method for the electronic device includes: obtaining the node power consumption of each component in the electronic device and the node flow rate of the liquid cooling pipeline where it is located, comparing the relationship between the node power consumption and the node flow rate with a preset condition, if the preset condition is not satisfied, controlling and adjusting the opening degree of the valve on the electronic device until the relationship between the node power consumption and the node flow rate satisfies the preset condition; obtaining the overall power consumption of the electronic device and the overall flow rate of the liquid cooling pipeline, comparing the relationship between the overall power consumption and the overall flow rate with the preset condition, if the preset condition is not satisfied, controlling and adjusting the opening degree of the control valve at the inlet of the liquid cooling pipeline until the relationship between the overall power consumption and the overall flow rate satisfies the preset condition.

[0007] Through the present application, since the cooperation relationship among the first component, the second component, and the third component and the liquid cooling pipeline is optimized and designed, and the liquid cooling pipeline passes through the first component, the third component, and the second component in sequence, the cooling medium in the liquid cooling pipeline can make full use of the absorption potential of each phase state during the gas-liquid two-phase state change, and combined with the heat dissipation characteristics of each component, the highest cooling effect can be achieved, solving the problem of poor cooling effect of the two-phase liquid cooling system in the related art, and achieving the purpose of greatly improving the cooling effect of the two-phase liquid cooling system. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] In order to more clearly illustrate the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0009] Figure 1 It is a structural block diagram of the liquid cooling system of the electronic device according to the embodiment of the present application;

[0010] Figure 2 It is a front view of the electronic device according to the embodiment of the present application;

[0011] Figure 3 It is a side view of the electronic device according to the embodiment of the present application;

[0012] Figure 4 It is a schematic structural diagram of the liquid cooling pipeline on the back panel of the electronic device according to the embodiment of the present application;

[0013] Figure 5 It is a schematic structural diagram of the liquid cooling pipeline of the graphic node of the electronic device according to the embodiment of the present application;

[0014] Figure 6 It is a schematic structural diagram of the liquid cooling pipeline of the computing node of the electronic device according to the embodiment of the present application;

[0015] Figure 7 It is a schematic structural diagram of the overall liquid cooling pipeline of the electronic device according to the embodiment of the present application;

[0016] Figure 8 It is a flowchart of the liquid cooling control method of the electronic device according to the embodiment of the present application.

[0017] Among them, the above-mentioned drawings include the following reference numerals:

[0018] 10. Condensing device; 20. Liquid cooling pipeline; 21. First section; 211. Common section; 212. Branch section; 22. Second section; 23. Third section; 30. Control valve; 40. Flowmeter; 50. Valve; 60. Acquisition device; 70. Control device; 80. Cabinet; 81. Backplane; 90. Electronic node; 91. First component; 92. Second component; 93. Third component; 100. Manifold; 110. First cooling device. Specific embodiments

[0019] Next, the technical solutions in the embodiments of the present application will be clearly and completely described in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts belong to the protection scope of the present application.

[0020] It should be noted that the orientation or positional relationship indicated by terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation to the present application. The terms "mounted", "connected", and "coupled" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two elements. The terms "parallel", "perpendicular", and "equal" include the described situations and situations similar to the described situations, and the range of the similar situations is within the acceptable deviation range, where the acceptable deviation range is determined by those of ordinary skill in the art considering the measurements being discussed and the errors associated with the measurements of specific quantities (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallel and approximate parallel, and the acceptable deviation range of approximate parallel can be, for example, within 5° deviation; "perpendicular" includes absolute perpendicular and approximate perpendicular, and the acceptable deviation range of approximate perpendicular can also be, for example, within 5° deviation. "Equal" includes absolute equality and approximate equality, and the acceptable deviation range of approximate equality can be, for example, that the difference between the two equal ones is less than or equal to 5% of any one of them. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific situations.

[0021] In order to enable those skilled in the art of the present technology to better understand the solution of the present application, the present application will be further described in detail below with reference to the drawings and specific embodiments.

[0022] In order to solve the problem of poor cooling effect in the related art of the two-phase liquid cooling system, the present application provides a liquid cooling system for an electronic device, an electronic device, and a liquid cooling control method for an electronic device.

[0023] As Figure 1 shown, a liquid cooling system for an electronic device includes a condensation device 10 and a liquid cooling pipeline 20. The liquid cooling pipeline 20 is communicated with the condensation device 10. The cooling medium in the liquid cooling pipeline 20 sequentially passes through the first component 91, the third component 93, and the second component 92 of the electronic device and then returns to the condensation device 10. The heat dissipation power consumption of the third component 93 is greater than that of the first component 91 or the second component 92, and the gas-liquid state of the cooling medium changes when passing through at least one component.

[0024] In this embodiment, the cooperation relationship among the first component 91, the second component 92, and the third component 93 with the liquid cooling pipeline 20 is optimized. The liquid cooling pipeline 20 passes through the first component 91, the third component 93, and the second component 92 in sequence, so that the cooling medium in the liquid cooling pipeline 20 makes full use of the absorption potential of each phase state during the gas-liquid two-phase state change, and combines the heat dissipation characteristics of each component, thereby achieving the highest cooling effect and realizing the purpose of greatly improving the cooling effect of the two-phase liquid cooling system.

[0025] In this embodiment, the heat generation power consumption of the first component 91, the second component 92, and the third component 93 gradually increases from low to high, so that the power consumption arrangement order passed by the liquid cooling pipeline 20 through the above three components is in the form of "low, high, medium". This can further improve the cooling effect and enable all three components to be cooled well. Of course, in addition to the above setting method, other arrangement methods can also be adopted.

[0026] For example, in an embodiment not shown in the figure, the power consumption of the first component 91, the second component 92, and the third component 93 is such that the power consumption of the first component 91 is the highest, and the power consumptions of the second component 92 and the third component 93 are both lower, so that the power consumption arrangement order passed by the liquid cooling pipeline 20 through the above three components is in the form of "high, low, low". Of course, there are also many other arrangement methods.

[0027] It should be noted that since the number of components may not be limited to three, the above arrangement form of the components can only be the arrangement form of some of the components passed by the liquid cooling pipeline 20. For example, other components can be added between the "low, high, medium" arrangement forms in this embodiment. The components also include a fourth component, and the arrangement form of the components passed by the liquid cooling pipeline 20 is the first component 91, the fourth component, the third component 93, and the second component 92. That is to say, as long as any three components passed by the liquid cooling pipeline 20 meet the required power consumption arrangement requirements, the liquid cooling pipeline 20 can pass through more components, and the arrangement method of this part of the components can be set as needed.

[0028] The cooling medium in this embodiment has an undersaturated liquid state, a saturated liquid state, a saturated vapor state, and a superheated vapor state. Among them, the undersaturated liquid state means that the cooling medium is in a complete liquid state and has a certain heat absorption space before turning into a gas state. The saturated liquid state means that the cooling medium is in a liquid state and at the critical state between the liquid state and the gas state. At this time, the cooling medium will turn into a gas state when absorbing heat again. The saturated vapor state means that the cooling medium is in a gas state and at the critical state just completely transformed from the liquid state to the gas state. The superheated vapor state means the state formed by the cooling medium continuing to absorb heat on the basis of the saturated vapor state.

[0029] Based on the above state of the cooling medium, when the aforementioned liquid cooling medium passes through the first component 91, the third component 93, the second component 92, and the condensation device 10, its phase change is as follows: The cooling medium in the condensation device 10 is an undersaturated liquid medium. The undersaturated liquid medium absorbs heat at the first component 91 to form a saturated liquid medium, then absorbs heat at the third component 93 to form a saturated vapor medium, then absorbs heat at the second component 92 to form superheated steam, and then passes through the condensation device 10 to condense and reform into an undersaturated liquid medium. The above process makes full use of the undersaturated single-phase (liquid phase) of the two-phase refrigerant subcooling section to absorb the heat of low-power components, uses the highest heat transfer efficiency of the two-phase vaporization latent heat to absorb the heat of high-power components, and uses the superheat of the single-phase (superheated steam) to absorb the heat of medium-power components, so as to make full use of the absorption potential of each part, combine the heat dissipation characteristics of each component, and achieve the best cooling effect.

[0030] It should be noted that the phase change of the above cooling medium is not strict, but there can be fluctuations. For example, when the undersaturated liquid medium absorbs heat at the first component 91, it can also form a phase state close to the saturated liquid or a slightly supersaturated liquid phase state. However, this will affect the subsequent heat absorption effect and slightly reduce the overall cooling effect. But compared with the traditional method, it can still improve the cooling effect.

[0031] The liquid cooling system of the electronic device in this embodiment can be used in a whole cabinet server or a single-node server. At the same time, it is not limited to servers and can also be used in other devices such as switches and routers.

[0032] When used in single-node devices such as single-node servers, the first component 91, the second component 92, and the third component 93 are located in the same electronic node 90. At this time, the liquid cooling pipeline 20 includes a first section 21, a third section 23, and a second section 22 that are respectively in heat exchange cooperation with the first component 91, the third component 93, and the second component 92. Among them, the first section 21, the second section 22, and the third section 23 are located in the same electronic node 90 of the electronic device, so that the first section 21, the second section 22, and the third section 23 can respectively cooperate with the first component 91, the second component 92, and the third component 93 to realize the heat exchange of the cooling medium, and then realize the cooling and heat dissipation of the electronic device.

[0033] When used in a whole rack server, the whole rack server has multiple electronic nodes 90, and different components are respectively arranged in each electronic node 90. At this time, the liquid cooling pipeline 20 still includes a first section 21, a third section 23, and a second section 22 that are respectively in heat exchange cooperation with the first component 91, the third component 93, and the second component 92. However, different from the setting of a single-node server, at least one of the first section 21, the second section 22, and the third section 23 is located in different electronic nodes 90 of the electronic device and can cooperate with the components in different electronic nodes 90, so as to realize heat exchange with the components and thus realize heat dissipation.

[0034] In the following, this embodiment will be mainly described by taking the whole rack server as an example, but some subsequent designs can also be used for single-node servers.

[0035] As Figure 4 shown, in this embodiment, the first section 21 includes a common section 211 and a plurality of branch sections 212. Each branch section 212 is connected and communicated with the common section 211, and the branch section 212 is located in the heat dissipation area of the first component 91. In this way, on the one hand, the branch section 212 can cooperate with a plurality of first components 91 to achieve the effect of unified heat dissipation. On the other hand, the structure form of the series-parallel pipeline can realize the control of a single branch section 212 and the control of the entire first section 21, thereby providing a structural basis for the subsequent flow control.

[0036] In this embodiment, the liquid cooling system of the electronic device further includes a control valve 30 for controlling the flow rate, and the control valve 30 is arranged on the common section 211 and / or at least one branch section 212. In this embodiment, the control valve 30 is arranged on both the common section 211 and the branch section 212, and the flow rate of the common section 211 and the branch section 212 can be controlled through the control valve 30. The main function of the control valve 30 is to solve the problem of flow distribution / drift of each electronic node 90 in the parallel whole rack server. Since there is a problem of flow drift between different whole rack servers, the flow distribution between the whole rack servers can be dynamically adjusted through the control valve 30 on the common section 211. The control valve 30 on the branch section 212 is used to control the heat exchange amount of the backplane 81 where the first section 21 is located. In winter, the opening degree of the control valve 30 can be reduced or even closed to reduce the heat exchange amount of the backplane 81 to avoid the temperature in the computer room being too low. In summer, the control valve 30 can be fully opened to increase the heat exchange amount of the backplane 81 to avoid the temperature in the computer room being too high.

[0037] It should be noted that the above setting of the first section 21 is applicable not only to the whole rack server but also to the single-node server.

[0038] As Figure 7As shown, for the case where there are multiple electronic nodes 90 in the whole cabinet server, in this embodiment, there are multiple third components 93 which are divided into multiple groups. The third components 93 in different groups are arranged in layers and are arranged in the same or different electronic nodes 90. In this embodiment, the third components 93 are grouped according to types, so that the electronic nodes 90 are divided into computing nodes including a central processing module and graphics nodes including a graphics processing module. Among them, the computing nodes and the graphics nodes are respectively located on different layers of the cabinet 80. Based on this, there are multiple third sections 23 in this embodiment of the present invention. Each third section 23 is connected and communicated with the first section 21, and each third section 23 is respectively located at different groups of third components 93. Since the third section 23 cooperates with each computing node and graphics node respectively, the cooling medium in the first section 21 can be shunted into each third section 23, and then enter different electronic nodes 90 respectively, and exchange heat with the components therein, so as to realize the heat exchange of the whole cabinet server.

[0039] Correspondingly, in addition to having multiple third components 93, there are also multiple second components 92 in the whole cabinet server, and the second components 92 are arranged on the layers where different groups of third components 93 are located, so that each electronic node 90 is provided with a third component 93 and a second component 92. Correspondingly, there are also multiple second sections 22. Each second section 22 is respectively located at the second component 92 on different layers and is connected and communicated with the third section 23 on the same layer, so that each electronic node 90 is provided with a second section 22. In this way, the cooling medium in the first section 21 is shunted into the third section 23 of each electronic node 90, then enters the second section 22 of this electronic node 90 through the third section 23, and then converges from the second section 22 and enters the condensation device 10 together, so as to realize the cooling and heat dissipation of each electronic node 90 in the whole cabinet server.

[0040] Of course, the specific setting methods of the above-mentioned third components 93 and second components 92 can also be adjusted according to needs. Different groups of third components 93 and second components 92 can also be arranged in the same electronic node 90, and the third components 93 can also be grouped according to other factors, not limited to the type division in this embodiment. And the number of the third components 93 and the second components 92 in the same electronic node 90 can also be set according to needs, and one or more can be set, so that the electronic node 90 can have multiple functions. At this time, the third section 23 and the second section 22 in the electronic node 90 can be further designed according to needs, such as adding a parallel structure form, so that the components that need to dissipate heat in the electronic node 90 can all cooperate with the corresponding sections to achieve comprehensive heat dissipation.

[0041] In this embodiment, the liquid cooling system of the electronic device further includes a flow meter 40 and a valve 50. The flow meter 40 and the valve 50 are arranged at the inlet end of the second section 22. The flow meter 40 and the valve 50 can control the flow rate of the cooling medium entering each electronic node 90, and they can cooperate with the aforementioned control valve 30 to dynamically adjust the flow rate of the cooling medium in each electronic node 90 of the whole cabinet server, achieving the effect of adapting the flow rate to the power consumption and further improving the cooling effect.

[0042] The liquid cooling system of the electronic device in this embodiment further includes a collection device 60 and a control device 70. The collection device 60 is electrically connected to the flow meter 40. The collection device 60 can collect the flow rate data in the flow meter 40 and the power consumption of each component. The control device 70 is electrically connected to components such as the collection device 60, the valve 50, and the control valve 30. The control device 70 can receive and process the flow rate data and power consumption collected by the collection device 60, and thus control the opening degrees of the control valve 30 and the valve 50 according to the flow rate data and power consumption, so as to associate the power consumption with the flow rate, dynamically adjust the cooling conditions of each component, increase the flow rate for components or electronic nodes 90 with increased power consumption, and decrease the flow rate for components or electronic nodes 90 with decreased power consumption, thereby solving the problem of flow drift. Through the design of the cooperation mode between the liquid cooling pipeline 20 and components with different power consumptions in this embodiment, combined with the above dynamic adjustment between the flow rate and the power consumption, they cooperate with each other as a whole, enabling the electronic device to cool and dissipate heat stably and reliably.

[0043] It should be noted that the dynamic adjustment design of the above control valve 30, flow meter 40, and valve 50 is applicable to both the whole cabinet server and the single node server. When used for the whole cabinet server, it mainly allocates the power consumption and flow rate of each electronic node 90, and when used for the single node server, it mainly allocates the power consumption and flow rate of each component.

[0044] The liquid cooling system of the electronic device in this embodiment further includes a circulation pump. The circulation pump is arranged on the liquid cooling pipeline 20, and in this embodiment, it is arranged at the outlet of the condensation device 10, so that the circulation pump provides power for the flow of the cooling medium. In this embodiment, since the absorption potential of the cooling medium is fully utilized, the power consumption of the circulation pump can be utilized as much as possible, not only completely eliminating the cavitation risk of the circulation pump faced by the server, but also greatly saving the power consumption of the circulation pump. At the same time, since the subcooling degree at the inlet of the circulation pump meets the requirements, the service life and reliability of the circulation pump are extended.

[0045] Such as Figures 2 to 7As shown in the figure, this embodiment also provides an electronic device, which includes a cabinet 80, at least one electronic node 90, and the above-mentioned electronic device liquid cooling system. Among them, the electronic node 90 is arranged in the cabinet 80. The electronic node 90 includes a first component 91, a second component 92, and a third component 93. The electronic node 90 can be one or more. When the electronic node 90 is one, the electronic device is a single-node server. When the electronic node 90 is multiple, the electronic device is a whole-cabinet server. The liquid cooling pipeline 20 is arranged between the cabinet 80 and the electronic node 90. For the specific layout of the liquid cooling pipeline 20, refer to the description of the above-mentioned electronic device liquid cooling system, which will not be elaborated here. The electronic device formed by the above-mentioned electronic device liquid cooling system can not only fundamentally solve the leakage risk of the current mainstream whole-cabinet single-phase liquid cooling server and the problem of being unable to cope with high-heat-density components, but also completely eliminate the cavitation risk of the circulation pump faced by the whole-cabinet two-phase liquid cooling server, save 60% of the power consumption of the circulation pump, improve the heat dissipation efficiency at the end of the condenser by 50%, reduce the volume and cost of the condensation heat exchanger of the condensation device by 50%, and also solve the flow drift problem of the parallel whole-cabinet liquid cooling server.

[0046] The electronic node 90 mentioned in this embodiment includes at least one of, but is not limited to, a computing node, a switching node, and a storage node.

[0047] When the electronic node 90 is one, that is, the electronic device is a single-node device, such as a single-node server, a switch, or a router, the first component 91, the second component 92, and the third component 93 are all arranged in the electronic node 90. At this time, the liquid cooling pipeline 20 is arranged in the electronic node 90 and exchanges heat with the first component 91, the third component 93, and the second component 92 in sequence to achieve the cooling and heat dissipation effect. At this time, the series-parallel structure form of the liquid cooling pipeline 20 can be set according to the components that need to dissipate heat. For example, if there are three third components 93, the third section 23 can be divided into three parallel branches, and the three parallel branches exchange heat with the three third components 93 respectively, etc.

[0048] When the electronic node 90 is multiple, that is, the electronic device is a whole-device, such as a whole-cabinet server, as Figure 2 shown, each electronic node 90 can be arranged in the cabinet 80 in a layered manner from top to bottom. At this time, the first section 21 of the liquid cooling pipeline 20 can be integrally arranged between each electronic node 90 and pass through the heat dissipation area of the first component 91 of each electronic node 90, so as to exchange heat with the first component 91 of each electronic node 90 respectively. The second section 22 and the third section 23 are respectively arranged in each electronic node 90, so that the second section 22 and the third section 23 of the liquid cooling pipeline 20 are arranged in each electronic node 90. The second section 22 and the third section 23 can exchange heat with the second component 92 and the third component 93 in the electronic node 90 respectively.

[0049] Optionally, the first component 91 includes at least one of an input / output module and a hard disk module, the second component 92 includes at least one of a power supply module and a storage module, and the third component 93 includes at least one of a graphics processing module and a central processing module. Of course, the first component 91, the second component 92, and the third component 93 are not limited to the specific examples described above in this embodiment. They can be increased or decreased according to needs, and more components such as a fourth component and a fifth component can also be added according to needs.

[0050] As Figure 3 and Figure 7 shown, the electronic device of this embodiment further includes a manifold 100. Since the function of the manifold 100 is to perform shunting and confluence between the first section 21 of the whole cabinet server and the third section 23 in each electronic node 90, and between the second section 22 in each electronic node 90 and the condensation device 10, the manifold 100 is mainly used on the whole cabinet server. For a single-node server, the manifold 100 can be set according to needs or not set. In the scenario of the whole cabinet server, in this embodiment, a manifold 100 is provided between the first section 21 and the third section 23, and between the second section 22 and the condensation device 10. More specifically, it is provided on the inner side of the backplane 81 of the cabinet 80, so that the cooling medium in the first section 21 is shunted to the third section 23 in each electronic node 90 through the manifold 100. After passing through the third section 23 and the second section 22, the cooling medium in each second section 22 is confluent to the condensation device 10 again through the manifold 100.

[0051] The above-mentioned manifold 100 can be in the form of multiple settings to respectively achieve the functions of shunting to the third section 23 and confluence to the condensation device 10, or a single manifold 100 can be set. The single manifold 100 has two independent structural functions of shunting and confluence at the same time, so that the effects of shunting and confluence can be achieved simultaneously.

[0052] Optionally, the electronic device includes a first cooling device 110 disposed at the first component 91. The first cooling device 110 has a heat dissipation area. The first section 21 of the liquid cooling pipeline 20 passes through the heat dissipation area and absorbs the heat of the first component 91. Considering that the first component 91 is a component with low power consumption, the first cooling device 110 can be used for cooling at the first component 91. The first cooling device 110 preferably adopts the form of an air cooling device. The air cooling device is connected to the first component 91, thereby realizing air cooling and heat dissipation of the first component 91. At this time, the air outlet of the air cooling device serves as the heat dissipation area. The branch section 212 of the first section 21 passes through the heat dissipation area, thereby exchanging heat with the hot air in the heat dissipation area to achieve the cooling effect on the first component 91. The air cooling device drives the cold air to pass through the first component 91 to form hot air, and the hot air becomes cold air after heat exchange with the first section 21 and is blown out of the cabinet 80.

[0053] As Figure 4 shown, the cabinet 80 of this embodiment includes a backplane 81. The air cooling device is disposed at the backplane 81. It can be embedded in the backplane 81 or disposed on the inner side surface of the backplane 81. Ventilation holes are formed on the backplane 81. The heat dissipation area of the air cooling device faces the ventilation holes of the backplane 81, thereby realizing that the air cooling device discharges the hot air from the ventilation holes to the computer room. The first section 21 of the liquid cooling pipeline 20 is arranged through the backplane 81. The first section 21 of this embodiment is provided with four large sections, namely an inlet section, an outlet section, two parallel sections and a transition section. Among them, the inlet section and the outlet section serve as the common section 211, and the parallel sections serve as the branch sections 212. They all extend longitudinally. The inlet section and the outlet section are both located below the parallel sections. The two parallel sections are arranged horizontally at intervals. A transition section is provided at the top of the two parallel sections. The transition section is connected and communicated with the two parallel sections at the same time, so that the flow path of the first section 21 is: inlet section, one parallel section, transition section, another parallel section, outlet section. After the cooling medium flowing out from the outlet section is shunted by the flow distributor 100, it can enter the third section 23 of each electronic node 90 again after passing through the flowmeter 40 and the valve 50.

[0054] As Figure 5 shown, for the graphics node, a graphics processing module serving as the third component 93 and a power module serving as the second component 92 are arranged inside it. There are multiple graphics processing modules, so the third section 23 is provided with multiple parallel parts. The cooling medium flowing out from the backplane 81 enters the third section 23, is shunted inside the third section 23, and absorbs heat through phase change after passing through each graphics processing module and becomes saturated steam with a dryness of about 1. Then it passes through the power module, absorbs the heat of the power module by using the convection of the high-speed steam, and enters the flow distributor 100 to converge into the condenser in the condensation device 10 and is recondensed into a liquid with a certain degree of subcooling.

[0055] As Figure 6 shown, for a computing node, a central processing module serving as a third component 93 and a storage module serving as a second component 92 are provided inside. There are multiple central processing modules, so there are multiple parallel parts in the third section 23. The cooling medium flowing out from the backplane 81 enters the third section 23, is shunted inside the third section 23, and after passing through each central processing module and undergoing a phase change to absorb heat, it becomes saturated steam with a dryness of about 1. Then, it passes through the storage module, absorbs the heat of the storage module by means of the convection of high-speed steam, and then enters the manifold 100 to be converged and flows into the condenser in the condensation device 10 to be re-condensed into a liquid with a certain degree of subcooling.

[0056] Generally speaking, in this application, the subcooled coolant with a certain degree of subcooling in the condensation device is used as the cooling medium. The coolant first absorbs the heat discharged by the low-power components inside the node through the backplane by air cooling. The saturated liquid refrigerant at the outlet of the backplane enters the manifold 100 inside the node, and then enters the node to cool the high-power components. After the refrigerant becomes saturated steam, it enters the medium-power components. After using the high-speed flowing superheated steam to solve the heat dissipation of the medium-power components, it enters the condensation device to be condensed into a liquid refrigerant, and then enters the circulation pump, and so on in a cycle.

[0057] As Figure 8 shown, this embodiment also provides a liquid cooling control method for an electronic device, which is executed by using the above-mentioned electronic device. The liquid cooling control method for an electronic device includes: obtaining the node power consumption of each component in the electronic device and the node flow rate of the liquid cooling pipeline 20 where it is located, comparing the relationship between the node power consumption and the node flow rate with a preset condition. If the preset condition is not met, controlling and adjusting the opening degree of the valve 50 on the electronic device until the relationship between the node power consumption and the node flow rate meets the preset condition; obtaining the overall power consumption of the electronic device and the overall flow rate of the liquid cooling pipeline 20, comparing the relationship between the overall power consumption and the overall flow rate with a preset condition. If the preset condition is not met, controlling and adjusting the opening degree of the control valve 30 at the inlet of the liquid cooling pipeline 20 until the relationship between the overall power consumption and the overall flow rate meets the preset condition. By collecting and monitoring the power consumption and flow rate of each component, the electronic node 90 and the overall electronic device in real time as described above, the dynamic adjustment of the flow rate distribution can be realized, the effect of matching the flow rate with the power consumption can be achieved, and further, the problem of flow rate drift can be avoided, and the cooling effect can be further improved.

[0058] In this embodiment, the preset conditions include: the relationship between flow rate and power consumption is: Power consumption = Subcooling degree × Mass flow rate × Specific heat of liquid refrigerant + Latent heat of vaporization × Mass flow rate + Superheat degree × Mass flow rate × Specific heat of superheated steam; where the subcooling degree and the superheat degree are preset values, the mass flow rate is obtained by the flowmeter 40, and the latent heat of vaporization, the specific heat of liquid refrigerant, and the specific heat of superheated steam are physical property parameters. After obtaining the corresponding parameters, the control device 70 calculates whether the power consumption and the flow rate satisfy the above relationship, so as to adjust the flow rate, so that the power consumption and the flow rate of each component and the electronic node 90 finally meet the requirements.

[0059] In this embodiment, the liquid cooling control method for the electronic device further includes: when the node power consumption and the node flow rate, and the overall power consumption and the overall flow rate of the whole machine both meet the preset conditions, obtaining a shutdown instruction; when no shutdown instruction is obtained, repeating the process of obtaining the node power consumption of each component in the electronic device and the node flow rate of the liquid cooling pipeline 20 where it is located, and obtaining the overall power consumption of the electronic device and the overall flow rate of the liquid cooling pipeline 20. The above process is for the purpose of realizing real-time collection and monitoring, so that the electronic device is in a real-time monitoring state of flow balance during use, ensuring that problems such as flow drift will not occur.

[0060] In this embodiment, the liquid cooling control method for the electronic device further includes: obtaining the ambient temperature, and controlling the opening degree of the control valve 30 on the branch section 212 of the liquid cooling pipeline 20 according to the ambient temperature, and there is a direct proportional relationship between the level of the ambient temperature and the opening degree of the control valve 30 on the branch section 212 of the liquid cooling pipeline 20. As mentioned above, when the ambient temperature is too low in winter, the opening degree of the control valve 30 can be reduced or even closed to reduce the heat exchange amount of the backplane 81 and avoid the temperature inside the computer room from being too low; in summer, the control valve 30 can be fully opened to increase the heat exchange amount of the backplane 81 and avoid the temperature inside the computer room from being too high. In this way, liquid cooling heat dissipation and environmental heat dissipation complement each other and cooperate together to achieve efficient cooling and heat dissipation of the electronic device.

[0061] It should be noted that the multiple in the above embodiments refers to at least two.

[0062] From the above description, it can be seen that the above-mentioned liquid cooling system of the electronic device of the present invention optimizes the cooperation relationship between the first component 91, the second component 92, and the third component 93 and the liquid cooling pipeline 20, and adopts the form that the liquid cooling pipeline 20 sequentially passes through the first component 91, the third component 93, and the second component 92. Thus, when the cooling medium in the liquid cooling pipeline 20 changes in the gas-liquid two-phase state, the absorption potential of each phase state in each stage is fully utilized, and combined with the heat dissipation characteristics of each component, the highest-effect heat dissipation effect is achieved, and the purpose of greatly improving the cooling effect of the two-phase liquid cooling system is realized. At the same time, the electronic device of the present application can not only fundamentally solve the leakage risk of the current mainstream single-phase liquid cooling servers in the whole cabinet and the problem of being unable to cope with high-heat-density components, but also completely eliminate the cavitation risk of the circulation pump faced by the two-phase liquid cooling servers in the whole cabinet, save 60% of the power consumption of the circulation pump, improve the heat dissipation efficiency at the end of the condenser by 50%, reduce the volume and cost of the condensation heat exchanger of the condensation device by 50%, and also solve the flow drift problem of the parallel liquid cooling servers in the whole cabinet.

[0063] The above provides a detailed introduction to a liquid cooling system for an electronic device, an electronic device, and a liquid cooling control method for an electronic device provided by the present application. Specific examples are used in this article to elaborate on the principle and implementation manner of the present application. The description of the above embodiments is only used to help understand the method and its core idea of the present application. It should be noted that for those of ordinary skill in the art in the technical field, without departing from the principle of the present application, several improvements and modifications can be made to the present application, and these improvements and modifications also fall within the protection scope of the claims of the present application.

Claims

1. A liquid cooling system for electronic equipment, characterized in that: include: Condensing device (10); A liquid cooling pipeline (20), the liquid cooling pipeline (20) being in communication with the condensing device (10), the cooling medium in the liquid cooling pipeline (20) sequentially passing through a first component (91), a third component (93), and a second component (92) of the electronic device, and flowing back to the condensing device (10), the heat consumption of the third component (93) being greater than that of the first component (91) or the second component (92), and the gas-liquid state of the cooling medium changing when passing through at least one component; The heat dissipation of the first component (91), the second component (92) and the third component (93) are arranged in descending order; The undersaturated liquid medium in the condensing device (10) absorbs heat at the first component (91) to form a saturated liquid medium, then absorbs heat at the third component (93) to form a saturated steam medium, then absorbs heat at the second component (92) to form superheated steam, and then condenses at the condensing device (10) to form an undersaturated liquid medium; The undersaturated liquid medium is the cooling medium in a completely liquid state and has room for absorbing heat before becoming a gaseous state; the saturated liquid medium is the cooling medium in a liquid state and in a critical state between liquid and gaseous states; the saturated steam medium is the cooling medium in a gaseous state and in a critical state of completely transforming from liquid to gaseous state; the superheated steam is the state in which the cooling medium continues to absorb heat on the basis of the saturated steam medium.

2. The electronic equipment liquid cooling system according to claim 1, characterized in that: The liquid cooling pipeline (20) comprises a first segment (21), a third segment (23), and a second segment (22) which respectively cooperate with the first component (91), the third component (93), and the second component (92) for heat exchange; the first segment (21), the second segment (22), and the third segment (23) are located at the same electronic node (90) of the electronic device.

3. The electronic equipment liquid cooling system according to claim 2, characterized in that: The first segment (21) comprises a common segment (211) and a plurality of branch segments (212), each of the branch segments (212) being butt-jointed and connected to the common segment (211), and the branch segments (212) are located within a heat dissipation area of ​​the first component (91).

4. The electronic equipment liquid cooling system according to claim 1, characterized in that: The liquid cooling pipeline (20) comprises a first segment (21), a third segment (23), and a second segment (22) which respectively cooperate with the first component (91), the third component (93), and the second component (92) for heat exchange, and at least one of the first segment (21), the second segment (22), and the third segment (23) is located at a different electronic node (90) of the electronic device.

5. The electronic equipment liquid cooling system according to claim 4, characterized in that: The first segment (21) comprises a common segment (211) and a plurality of branch segments (212), each of the branch segments (212) being butt-jointed and connected to the common segment (211), and the branch segments (212) are located within a heat dissipation area of ​​the first component (91).

6. The electronic equipment liquid cooling system according to claim 5, characterized in that: The electronic equipment liquid cooling system further comprises a control valve (30) for controlling flow, and the control valve (30) is arranged on the common section (211) and / or at least one of the branch sections (212).

7. The electronic equipment liquid cooling system according to claim 4, characterized in that: The third components (93) are multiple and divided into multiple groups. The third components (93) of different groups are arranged in layers and arranged in the same or different electronic nodes (90). The third segments (23) are multiple, each of the third segments (23) is connected to the first segment (21), and each of the third segments (23) is located at the third components (93) of different groups.

8. The electronic equipment liquid cooling system according to claim 7, characterized in that: There are a plurality of second components (92), and the layers where the third components (93) of different groups are located are all provided with the second components (92); there are a plurality of second segments (22), and each second segment (22) is located at the second components (92) of different layers, and is butt-jointed and connected with the third segments (23) of the same layer.

9. The electronic equipment liquid cooling system according to claim 7, characterized in that: The electronic equipment liquid cooling system further comprises a flow meter (40) and a valve (50), and the flow meter (40) and the valve (50) are arranged at the inlet end of the second segment (22).

10. The electronic equipment liquid cooling system according to claim 9, characterized in that: The electronic equipment liquid cooling system further comprises a collection device (60) and a control device (70), wherein the collection device (60) is electrically connected to the flow meter (40), and the control device (70) is electrically connected to the collection device (60) and the valve (50).

11. An electronic device, characterized in that: include: Cabinet (80); At least one electronic node (90), the electronic node (90) being arranged in the cabinet (80), the electronic node (90) comprising a first component (91), a second component (92), and a third component (93); In the electronic equipment liquid cooling system according to any one of claims 1 to 10, a liquid cooling pipeline (20) is provided between the cabinet (80) and the electronic node (90).

12. The electronic device according to claim 11, characterized in that: The electronic device is a single-node device, and the liquid cooling pipeline (20) is arranged in the electronic node (90) of the single-node device and performs heat exchange with the first component (91), the third component (93), and the second component (92) in sequence.

13. The electronic device according to claim 11, characterized in that: There are a plurality of electronic nodes (90), the first section (21) of the liquid cooling pipeline (20) passes through the heat dissipation area of ​​the first component (91) of each electronic node (90), and each electronic node (90) is provided with a second section (22) and a third section (23) of the liquid cooling pipeline (20).

14. The electronic device according to claim 13, characterized in that: The electronic device further comprises a distributor (100), wherein the distributor (100) is arranged between the first segment (21) and the third segment (23), and between the second segment (22) and the condensing device (10); the cooling medium of the first segment (21) is distributed to each of the third segments (23) via the distributor (100), and the cooling medium of each of the second segments (22) is converged to the condensing device (10) via the distributor (100).

15. The electronic device according to claim 11, characterized in that: The first component (91) includes at least one of an input / output module and a hard disk module, the second component (92) includes at least one of a power module and a storage module, and the third component (93) includes at least one of a graphics processing module and a central processing module.

16. The electronic device according to claim 11, characterized in that: The electronic device comprises a first cooling device (110), the first cooling device (110) being arranged at the first component (91), the first cooling device (110) having a heat dissipation area, and the first section (21) of the liquid cooling pipeline (20) passing through the heat dissipation area and absorbing heat of the first component (91).

17. The electronic device according to claim 16, characterized in that: The first cooling device (110) is an air cooling device, the air cooling device is connected to the first component (91), and the air outlet of the air cooling device serves as the heat dissipation area.

18. The electronic device according to claim 17, characterized in that: The cabinet (80) has a back plate (81), the air cooling device is arranged on the inner side of the back plate (81) and the heat dissipation area of ​​the air cooling device faces the back plate (81), and the first section (21) of the liquid cooling pipeline (20) is located at the back plate (81).

19. A liquid cooling control method for electronic equipment, characterized in that: The electronic device according to any one of claims 11 to 18 is used to perform the liquid cooling control method of the electronic device, comprising: Obtaining the node power consumption of each component in the electronic device and the node flow rate of the liquid cooling pipeline (20) in which the component is located, comparing the relationship between the node power consumption and the node flow rate with a preset condition, and if the preset condition is not satisfied, controlling and adjusting the opening of the valve (50) on the electronic device until the relationship between the node power consumption and the node flow rate satisfies the preset condition; The whole machine power consumption of the electronic device and the whole machine flow rate of the liquid cooling pipeline (20) are obtained, and the relationship between the whole machine power consumption and the whole machine flow rate is compared with the preset condition. If the preset condition is not met, the opening of the control valve (30) at the inlet of the liquid cooling pipeline (20) is controlled and adjusted until the relationship between the whole machine power consumption and the whole machine flow rate meets the preset condition.

20. The electronic equipment liquid cooling control method according to claim 19, characterized in that: The preset conditions include: The relationship between flow rate and power consumption is: Power consumption = subcooling × mass flow rate × specific heat of liquid refrigerant + latent heat of vaporization × mass flow rate + superheat × mass flow rate × specific heat of superheated steam; The subcooling degree and the superheating degree are preset values, the mass flow rate is obtained through a flow meter (40), and the latent heat of vaporization, the specific heat of the liquid refrigerant, and the specific heat of the superheated steam are physical property parameters.

21. The electronic equipment liquid cooling control method according to claim 19, characterized in that: The electronic equipment liquid cooling control method further includes: When the preset conditions are satisfied between the node power consumption and the node flow, and between the whole machine power consumption and the whole machine flow, a shutdown instruction is obtained; when the shutdown instruction is not obtained, the process of obtaining the node power consumption of each component in the electronic device and the node flow of the liquid cooling pipeline (20) in which the component is located, and the process of obtaining the whole machine power consumption of the electronic device and the whole machine flow of the liquid cooling pipeline (20) are repeated.

22. The electronic equipment liquid cooling control method according to claim 19, characterized in that: The electronic equipment liquid cooling control method further includes: The ambient temperature is obtained, and the opening of the control valve (30) on the branch section (212) of the liquid cooling pipeline (20) is controlled according to the ambient temperature, and the ambient temperature is proportional to the opening of the control valve (30) on the branch section (212) of the liquid cooling pipeline (20).

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