Idler wheel for cleaning edge of wafer and wafer cleaning device with same

Abstract

The invention provides a roller for cleaning the edge of a wafer and a wafer cleaning device with the roller, the roller comprises a first element, a second element, a shaft element and a scrubbing assembly, the first element and the second element are arranged on two opposite sides of the shaft element, the first element, the shaft element and the second element form a clamping space for bearing the wafer, and the scrubbing assembly is arranged in the clamping space. The shaft element is in contact with the side wall of the wafer; the roller is configured to be in contact with the side wall of the wafer through the shaft element so as to carry the wafer; and rotating around the center line of the shaft element to drive the wafer to rotate, and scrubbing the edge area of the wafer through the scrubbing assembly when the wafer is driven to rotate. According to the roller for cleaning the edge of the wafer and the wafer cleaning device with the roller, the scrubbing assembly is arranged, so that the scrubbing assembly can scrub the edge area of the wafer while the roller rotates to drive the wafer to rotate, and therefore, the cleaning effect on the edge area of the wafer can be improved.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and in particular to a roller for cleaning a wafer edge and a wafer cleaning device having the same. Background Art

[0002] In the rapidly developing field of semiconductor manufacturing, chemical mechanical polishing (CMP) has become a key technology for realizing multiple metal layers and interconnects in silicon wafer production. After the wafer is polished, polishing fluid and foreign matter may remain on its surface, especially at the edge of the wafer. It is difficult to remove these residues, so it is crucial to strengthen the cleaning of the edge of the wafer. Currently, most chemical mechanical polishing equipment has automatic cleaning and drying functions.

[0003] In the existing wafer cleaning process, a cleaning brush is usually used to perform contact cleaning on the wafer surface. However, as the use time increases, pollutants will gradually accumulate on the surface of the cleaning brush, which not only reduces the cleaning efficiency, but also has a particularly significant impact on the edge area of ​​the wafer, and even causes wafer contamination. Summary of the invention

[0004] The object of the present invention is to provide a roller for cleaning wafers and a wafer cleaning device having the same, so as to solve one or more problems existing in the prior art, such as the accumulation of pollutants due to the use of the cleaning brush for too long, resulting in reduced wafer cleaning efficiency and weak cleaning of the wafer edge.

[0005] To achieve the above-mentioned purpose, the present invention is implemented through the following technical solutions: a roller for cleaning the edge of a wafer, the roller comprising a first element, a second element, an axis element and a brush assembly, the first element and the second element are arranged on opposite sides of the axis element, the first element, the axis element and the second element form a clamping space for carrying the wafer, and the axis element contacts the side wall of the wafer; the roller is configured to contact the side wall of the wafer through the axis element to carry the wafer; and rotate around the center line of the axis element to drive the wafer to rotate, and when driving the wafer to rotate, the edge area of ​​the wafer is brushed by the brush assembly.

[0006] Optionally, the wafer includes a first surface and a second surface arranged opposite to each other; the brushing assembly includes a first brushing member arranged on a side of the first element close to the second element and a second brushing member arranged on a side of the second element close to the first element; the first brushing member is configured to brush an edge area of ​​the first surface; and the second brushing member is configured to brush an edge area of ​​the second surface.

[0007] Optionally, the first brush member and the second brush member both include a plurality of soft brush strips arranged at intervals.

[0008] Optionally, the soft brush strip includes a silicone strip or a sponge strip.

[0009] Optionally, a plurality of the soft brush strips are evenly distributed on the first element and the second element, and a length extension direction of the soft brush strips is perpendicular to the plane where the wafer is located.

[0010] Optionally, both the first element and the second element are disc-shaped, and the diameter of the first element is the same as the diameter of the second element.

[0011] Optionally, the first element, the second element and the shaft element are all made of polyurethane.

[0012] To achieve the above-mentioned purpose, the present invention also provides a wafer cleaning device, which includes at least two relatively arranged cleaning brushes, at least one roller for cleaning the edge of the wafer as described in any of the above items, and a motor assembly for connecting the cleaning brush and the roller; the cleaning brush is used to spray deionized water onto the wafer, and a gap is formed between the two cleaning brushes for inserting the wafer; the motor assembly is configured to drive the cleaning brush and the roller to rotate.

[0013] Optionally, the cleaning device includes three rollers arranged at intervals, the gap and the three rollers are arranged vertically, and the shaft elements of the three rollers, the brush assembly and the cleaning brush form a receiving space for placing the wafer.

[0014] Optionally, the cleaning device also includes a liquid spray assembly for spraying cleaning liquid onto the wafer; the liquid spray assembly includes at least two oppositely arranged spray rods and a liquid supply assembly connected to the spray rods, and the spray rods are located above the cleaning brush; the liquid supply assembly is used to transport cleaning liquid to the spray rods; the spray rods are configured to spray the cleaning liquid onto the surface of the wafer.

[0015] Compared with the prior art, the roller for cleaning the edge of a wafer and the wafer cleaning device having the same provided by the present invention have the following beneficial effects:

[0016] The roller for cleaning the edge of a wafer provided by the present invention comprises a first element, a second element, an axis element and a brushing assembly, wherein the first element and the second element are arranged on opposite sides of the axis element, the first element, the axis element and the second element form a clamping space for carrying the wafer, and the axis element contacts the side wall of the wafer; the roller is configured to contact the side wall of the wafer through the axis element to carry the wafer; and rotate around the center line of the axis element to drive the wafer to rotate, and when driving the wafer to rotate, the edge area of ​​the wafer is brushed by the brushing assembly. Thus, the roller for cleaning the edge of a wafer provided by the present invention can drive the wafer to rotate when the roller rotates through the coordinated use of the first element, the second element and the axis element; by setting the brushing assembly, the roller can drive the wafer to rotate while the roller rotates, and the brushing assembly can brush the edge area of ​​the wafer, thereby improving the cleaning effect of the edge area of ​​the wafer. The use of the roller for cleaning the edge of the wafer provided by the present invention in a wafer cleaning device can not only ensure the cleaning progress of the wafer, but also improve the ability to clean the edge area of ​​the wafer, thereby reducing wafer defects and further improving the wafer yield.

[0017] Furthermore, the wafer includes a first surface and a second surface that are arranged opposite to each other; the brush assembly includes a first brush member arranged on a side of the first element close to the second element and a second brush member arranged on a side of the second element close to the first element; the first brush member is configured to brush an edge area of ​​the first surface; the second brush member is configured to brush an edge area of ​​the second surface. Therefore, the roller for cleaning the edge of the wafer provided by the present invention can brush the edge area of ​​the first surface of the wafer by arranging the first brush member on a side of the first element close to the second element when the roller rotates to drive the wafer to rotate, and can brush the edge area of ​​the second surface of the wafer by arranging the second brush member on a side of the second element close to the first element, thereby ensuring that the edge areas of both sides of the wafer can be brushed, and can further improve the cleaning effect on the edge area of ​​the wafer.

[0018] Furthermore, the first brush cleaning member and the second brush cleaning member each include a plurality of soft brush strips arranged at intervals. Thus, the roller for cleaning the edge of a wafer provided by the present invention can more gently remove pollutants in the edge area of ​​the wafer by using the soft brush strips, thereby avoiding scratching the wafer; by arranging the intervals between the soft brush strips, it is possible to avoid large pieces of pollutants from adhering to the soft brush strips, thereby further improving the cleaning effect on the edge area of ​​the wafer.

[0019] The wafer cleaning device provided by the present invention comprises at least two cleaning brushes arranged opposite to each other, at least one roller for cleaning the edge of a wafer as described in any one of the above items, and a motor assembly for connecting the cleaning brush and the roller; the cleaning brush is used to spray deionized water on the wafer, and a gap for inserting the wafer is formed between the two cleaning brushes; the motor assembly is configured to drive the cleaning brush and the roller to rotate. Thus, the wafer cleaning device provided by the present invention drives the cleaning brush and the roller to rotate by the motor assembly, so that the cleaning brush can clean the surface of the wafer; by adopting the roller for cleaning the edge of the wafer as described in any one of the above items, the edge area of ​​the wafer can be cleaned while the roller rotates. In addition, since the wafer cleaning device provided by the present invention and the roller for cleaning the edge of the wafer provided by the present invention belong to the same inventive concept, the wafer cleaning device provided by the present invention at least has all the advantages of the roller for cleaning the edge of the wafer provided by the present invention. For the advantages of the wafer cleaning device provided by the present invention, please refer to the relevant description of the beneficial effects of the roller for cleaning the edge of the wafer provided by the present invention, which will not be repeated here.

[0020] Furthermore, the cleaning device comprises three rollers arranged at intervals, the gap and the three rollers are arranged vertically, and the shaft elements of the three rollers, the brush assembly and the cleaning brush form a receiving space for placing the wafer. Thus, the wafer cleaning device provided by the present invention places the wafer by arranging the gap and the rollers vertically, so that the deionized water sprayed by the cleaning brush can flow downward along the surface of the wafer under the action of gravity, thereby improving the cleaning effect of the wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 A schematic diagram of the structure of a roller for cleaning the edge of a wafer provided in the first embodiment of the present invention;

[0022] Figure 2 A front view of a roller for cleaning the edge of a wafer provided in the first embodiment of the present invention in a state of carrying a wafer;

[0023] Figure 3 A side view of a roller for cleaning the edge of a wafer provided in the first embodiment of the present invention in a state of carrying a wafer;

[0024] Figure 4 A specific example diagram of a wafer cleaning device provided in the second embodiment of the present invention;

[0025] Figure 5 Another specific example diagram of a wafer cleaning device provided in the second embodiment of the present invention;

[0026] The following are the descriptions of the reference numerals:

[0027] 1-roller, 11-first element, 12-second element, 13-axis element, 14-brush assembly, 141-first brush member, 142-second brush member, 2-wafer, 21-first surface, 22-second surface, 3-cleaning brush, 4-spray rod. DETAILED DESCRIPTION

[0028] The roller for cleaning the edge of the wafer and the wafer cleaning device having the same proposed by the present invention are further described in detail in combination with the accompanying drawings and specific embodiments. According to the following description, the advantages and features of the present invention will be clearer. It should be noted that the accompanying drawings are all in a very simplified form and are not in precise proportions, which are only used to conveniently and clearly assist in explaining the purpose of the embodiments of the present invention. In order to make the purpose, features and advantages of the present invention more obvious and easy to understand, please refer to the accompanying drawings. It should be noted that the structure, proportion, size, etc. illustrated in the accompanying drawings of this specification are only used to match the content disclosed in the specification for people familiar with this technology to understand and read, and are not used to limit the limiting conditions for the implementation of the present invention. Any modification of the structure, change of the proportional relationship or adjustment of the size, in the case of the same or similar effects and purposes that can be achieved by the present invention, should still fall within the scope of the technical content disclosed by the present invention. The specific design features of the present invention disclosed herein, including, for example, specific dimensions, directions, positions and shapes, will be determined in part by the specific environment to be applied and used. Furthermore, in the embodiments described below, the same reference numerals may be used in common among different drawings to indicate the same parts or parts having the same functions, and their repeated descriptions may be omitted.

[0029] Embodiment 1

[0030] This embodiment provides a roller for cleaning the edge of a wafer. Figures 1 to 3 , Figure 1 A schematic diagram of the structure of a roller for cleaning the edge of a wafer provided in this embodiment; Figure 2 A front view of the roller for cleaning the edge of a wafer provided in this embodiment in a state of carrying a wafer; Figure 3 A side view of the roller for cleaning the edge of a wafer provided in this embodiment when the roller is carrying a wafer. Figures 1 to 3It can be seen that the roller 1 includes a first element 11, a second element 12, an axis element 13 and a brushing assembly 14, the first element 11 and the second element 12 are arranged on opposite sides of the axis element 13, the first element 11, the axis element 13 and the second element 12 form a clamping space for carrying the wafer 2, and the axis element 13 contacts the side wall of the wafer 2; the roller 1 is configured to contact the side wall of the wafer 2 through the axis element 13 to carry the wafer 2; and rotate around the center line of the axis element 13 to drive the wafer 2 to rotate, and when driving the wafer 2 to rotate, the edge area of ​​the wafer 2 is brushed by the brushing assembly 14. Therefore, the roller for cleaning the edge of the wafer provided in this embodiment can drive the wafer 2 to rotate when the roller 1 rotates through the coordinated use of the first element 11, the second element 12 and the shaft element 13; by setting the brushing component 14, the roller 1 can drive the wafer 2 to rotate while the brushing component 14 can brush the edge area of ​​the wafer 2, thereby improving the cleaning effect of the edge area of ​​the wafer 2. The roller for cleaning the edge of the wafer provided by the present invention is used in the wafer cleaning device, which can not only ensure the cleaning progress of the wafer 2, but also improve the ability to clean the edge area of ​​the wafer 2, thereby reducing wafer defects and further improving the wafer yield.

[0031] Please continue to see Figure 1 and Figure 2 , for example, in some exemplary embodiments, the wafer 2 includes a first surface 21 and a second surface 22 that are arranged opposite to each other; the brush assembly 14 includes a first brush member 141 that is arranged on a side of the first element 11 close to the second element 12 and a second brush member 142 that is arranged on a side of the second element 12 close to the first element 11; the first brush member 141 is configured to brush the edge area of ​​the first surface 21; the second brush member 142 is configured to brush the edge area of ​​the second surface 22. Thus, when the roller 1 rotates to drive the wafer 2 to rotate, the edge area of ​​the first surface 21 of the wafer 2 can be brushed by arranging the first brush member 141 on a side of the first element 11 close to the second element 12, and the edge area of ​​the second surface 22 of the wafer 2 can be brushed by arranging the second brush member 142 on a side of the second element 12 close to the first element 11, thereby ensuring that the edge areas of both sides of the wafer 2 can be brushed, and the cleaning effect of the edge area of ​​the wafer 2 can be further improved.

[0032] It should be noted that the above is only an exemplary description of the brushing assembly 14, and is not a limitation of the present invention. For example, in some other embodiments, the brushing assembly 14 may also include only a first brushing member 141 disposed on a side of the first element 11 close to the second element 12, or only a second brushing member 142 disposed on a side of the second element 12 close to the first element 11.

[0033] In addition, it should be noted that, as those skilled in the art can understand, the first surface 21 of the wafer 2 can be the front side / back side of the wafer 2 , and the second surface 22 of the wafer 2 can be the back side / front side of the wafer 2 .

[0034] Preferably, the first brush member 141 and the second brush member 142 both include a plurality of soft brush strips arranged at intervals. Thus, by using the soft brush strips, contaminants in the edge area of ​​the wafer 2 can be removed more gently to avoid scratching the wafer 2; by arranging the soft brush strips at intervals, large pieces of contaminants can be prevented from adhering to the soft brush strips, thereby further improving the cleaning effect on the edge area of ​​the wafer 2.

[0035] Exemplarily, in some exemplary embodiments, the soft brush bar includes a silicone bar or a sponge bar.

[0036] For example, in some exemplary embodiments, a plurality of the soft brush strips are evenly distributed on the first element 11 and the second element 12, and the length extension direction of the soft brush strips is perpendicular to the plane where the wafer 2 is located. Thus, by evenly distributing the soft brush strips, the cleaning uniformity of the edge area of ​​the wafer 2 can be improved.

[0037] For more information, please see Figure 2 and Figure 3 ,from Figure 2 and Figure 3 It can be seen that the first element 11 and the second element 12 are both in the shape of a disk, and the diameter of the first element 11 is the same as the diameter of the second element 12. Therefore, the roller 1 can smoothly drive the wafer 2 to rotate.

[0038] For example, in some embodiments, the first element 11, the second element 12 and the shaft element 13 are all made of polyurethane. Therefore, since the polyurethane material has excellent friction properties, the roller 1 can drive the wafer 2 to rotate more smoothly.

[0039] Embodiment 2

[0040] This embodiment provides a wafer cleaning device. Figure 4 , Figure 4This is a specific example diagram of a wafer cleaning device provided in this embodiment. Figure 4 It can be seen that the cleaning device includes at least two relatively arranged cleaning brushes 3, at least one roller for cleaning the edge of the wafer as described in any of the above embodiments, and a motor assembly (not shown in the figure) for connecting the cleaning brush 3 and the roller 1, the cleaning brush 3 is used to spray deionized water onto the wafer 2, and a gap is formed between the two cleaning brushes 3 for inserting the wafer 2; the motor assembly is configured to drive the cleaning brush 3 and the roller 1 to rotate.

[0041] Therefore, the wafer cleaning device provided in this embodiment drives the cleaning brush 3 and the roller 1 to rotate through the motor assembly, so that the cleaning brush 3 can clean the surface of the wafer 2; by adopting the roller for cleaning the edge of the wafer described in any of the above embodiments, the edge area of ​​the wafer 2 can be cleaned while the roller 1 rotates. In addition, since the wafer cleaning device provided in this embodiment and the roller for cleaning the edge of the wafer provided in any of the above embodiments belong to the same inventive concept, the wafer cleaning device provided in this embodiment at least has all the advantages of the roller for cleaning the edge of the wafer provided in the above embodiments. For the advantages of the wafer cleaning device provided in this embodiment, please refer to the relevant description of the beneficial effects of the roller for cleaning the edge of the wafer provided in the above embodiments, which will not be repeated here.

[0042] Please continue to see Figure 4 Combined with Figure 1 For example, in some exemplary embodiments, the cleaning device includes three rollers 1 arranged at intervals, the gap and the three rollers 1 are arranged vertically, and the shaft elements 13 of the three rollers 1, the brush assembly 14 and the cleaning brush 3 form a receiving space for placing the wafer 2. Thus, by placing the wafer 2 with the gap and the rollers 1 arranged vertically, the deionized water sprayed by the cleaning brush 3 can flow downward along the surface of the wafer 2 under the action of gravity, thereby improving the cleaning effect of the wafer 2.

[0043] It should be noted that, as those skilled in the art will understand, the above is only an exemplary description and not a limitation of the present invention. Figure 5 , Figure 5 Another specific example diagram of the wafer cleaning device provided in this embodiment. Figure 5 It can be seen that the gap and the three rollers 1 can also be arranged horizontally to place the wafer 2 , and the rollers 1 are located on the left and right sides of the wafer 2 .

[0044] Please continue to see Figure 4Preferably, the cleaning device further comprises a liquid spraying assembly for spraying cleaning liquid onto the wafer 2; the liquid spraying assembly comprises at least two spraying rods 4 arranged opposite to each other and a liquid supply assembly (not shown in the figure) connected to the spraying rods 4, the spraying rods 4 being located above the cleaning brush 3; the liquid supply assembly is used to deliver cleaning liquid to the spraying rods 4; the spraying rods 4 are configured to spray the cleaning liquid onto the surface of the wafer 2. Thus, by spraying the cleaning liquid onto the surface of the wafer 2 through the spraying rods 4, the cleaning effect on the surface of the wafer 2 can be further improved.

[0045] In summary, the roller for cleaning the edge of a wafer and the wafer cleaning device having the same provided by the present invention have the following advantages: the roller for cleaning the edge of a wafer provided by the present invention comprises a first element, a second element, an axis element and a brushing assembly, the first element and the second element are arranged on opposite sides of the axis element, the first element, the axis element and the second element form a clamping space for carrying the wafer, and the axis element contacts the side wall of the wafer; the roller is configured to contact the side wall of the wafer through the axis element to carry the wafer; and rotate around the center line of the axis element to drive the wafer to rotate, and when driving the wafer to rotate, the edge area of ​​the wafer is brushed by the brushing assembly. Therefore, the roller for cleaning the edge of a wafer provided by the present invention can drive the wafer to rotate when the roller rotates through the coordinated use of the first element, the second element and the axis element; by setting the brushing assembly, the roller can drive the wafer to rotate while the roller rotates, thereby improving the cleaning effect of the edge area of ​​the wafer. The use of the roller for cleaning the edge of the wafer provided by the present invention in a wafer cleaning device can not only ensure the cleaning progress of the wafer, but also improve the ability to clean the edge area of ​​the wafer, thereby reducing wafer defects and further improving the wafer yield.

[0046] Furthermore, the wafer includes a first surface and a second surface that are arranged opposite to each other; the brush assembly includes a first brush member arranged on a side of the first element close to the second element and a second brush member arranged on a side of the second element close to the first element; the first brush member is configured to brush an edge area of ​​the first surface; the second brush member is configured to brush an edge area of ​​the second surface. Therefore, the roller for cleaning the edge of the wafer provided by the present invention can brush the edge area of ​​the first surface of the wafer by arranging the first brush member on a side of the first element close to the second element when the roller rotates to drive the wafer to rotate, and can brush the edge area of ​​the second surface of the wafer by arranging the second brush member on a side of the second element close to the first element, thereby ensuring that the edge areas of both sides of the wafer can be brushed, and can further improve the cleaning effect on the edge area of ​​the wafer.

[0047] Furthermore, the first brush cleaning member and the second brush cleaning member each include a plurality of soft brush strips arranged at intervals. Thus, the roller for cleaning the edge of a wafer provided by the present invention can more gently remove pollutants in the edge area of ​​the wafer by using the soft brush strips, thereby avoiding scratching the wafer; by arranging the intervals between the soft brush strips, it is possible to avoid large pieces of pollutants from adhering to the soft brush strips, thereby further improving the cleaning effect on the edge area of ​​the wafer.

[0048] The wafer cleaning device provided by the present invention comprises at least two cleaning brushes arranged opposite to each other, at least one roller for cleaning the edge of a wafer as described in any one of the above items, and a motor assembly for connecting the cleaning brush and the roller; the cleaning brush is used to spray deionized water on the wafer, and a gap for inserting the wafer is formed between the two cleaning brushes; the motor assembly is configured to drive the cleaning brush and the roller to rotate. Thus, the wafer cleaning device provided by the present invention drives the cleaning brush and the roller to rotate by the motor assembly, so that the cleaning brush can clean the surface of the wafer; by adopting the roller for cleaning the edge of the wafer as described in any one of the above items, the edge area of ​​the wafer can be cleaned while the roller rotates. In addition, since the wafer cleaning device provided by the present invention and the roller for cleaning the edge of the wafer provided by the present invention belong to the same inventive concept, the wafer cleaning device provided by the present invention at least has all the advantages of the roller for cleaning the edge of the wafer provided by the present invention. For the advantages of the wafer cleaning device provided by the present invention, please refer to the relevant description of the beneficial effects of the roller for cleaning the edge of the wafer provided by the present invention, which will not be repeated here.

[0049] Furthermore, the cleaning device comprises three rollers arranged at intervals, the gap and the three rollers are arranged vertically, and the shaft elements of the three rollers, the brush assembly and the cleaning brush form a receiving space for placing the wafer. Thus, the wafer cleaning device provided by the present invention places the wafer by arranging the gap and the rollers vertically, so that the deionized water sprayed by the cleaning brush can flow downward along the surface of the wafer under the action of gravity, thereby improving the cleaning effect of the wafer.

[0050] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the present invention rather than to limit it. Although the present invention has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solution of the present invention can be modified or replaced by equivalents without departing from the spirit and scope of the technical solution of the present invention.

Claims

1. A roller for cleaning the edge of a wafer, characterized in that: The roller comprises a first element, a second element, a shaft element and a brush assembly, wherein the first element and the second element are arranged on opposite sides of the shaft element, the first element, the shaft element and the second element form a clamping space for carrying the wafer, and the shaft element contacts the side wall of the wafer; The roller is configured to contact the side wall of the wafer through the shaft element to support the wafer; and to rotate around the center line of the shaft element to drive the wafer to rotate, and when driving the wafer to rotate, the edge area of ​​the wafer is brushed through the brushing component.

2. The roller for cleaning the edge of a wafer according to claim 1, characterized in that: The wafer comprises a first surface and a second surface which are arranged opposite to each other; the brush assembly comprises a first brush member arranged on a side of the first element close to the second element and a second brush member arranged on a side of the second element close to the first element; The first brushing member is configured to brush an edge area of ​​the first surface; The second brushing member is configured to brush an edge area of ​​the second surface.

3. The roller for cleaning the edge of a wafer according to claim 2, characterized in that: The first brushing member and the second brushing member both include a plurality of soft brush strips arranged at intervals.

4. The roller for cleaning the edge of a wafer according to claim 3, characterized in that: The soft brush strip includes a silica gel strip or a sponge strip.

5. The roller for cleaning the edge of a wafer according to claim 3, characterized in that: A plurality of the soft brush strips are evenly distributed on the first element and the second element, and the length extension direction of the soft brush strips is perpendicular to the plane where the wafer is located.

6. The roller for cleaning the edge of a wafer according to claim 1, characterized in that: The first element and the second element are both in the shape of a disk, and the diameter of the first element is the same as the diameter of the second element.

7. The roller for cleaning the edge of a wafer according to claim 1, characterized in that: The first element, the second element and the shaft element are all made of polyurethane.

8. A wafer cleaning device, characterized in that: The cleaning device comprises at least two cleaning brushes arranged opposite to each other, at least one roller for cleaning the edge of a wafer as claimed in any one of claims 1 to 7, and a motor assembly for connecting the cleaning brush and the roller; The cleaning brush is used to spray deionized water onto the wafer, and a gap for inserting the wafer is formed between the two cleaning brushes; the motor assembly is configured to drive the cleaning brush and the roller to rotate.

9. The wafer cleaning device according to claim 8, characterized in that: The cleaning device includes three rollers arranged at intervals, the gap and the three rollers are arranged vertically, and the shaft elements of the three rollers, the brush assembly and the cleaning brush form a receiving space for placing the wafer.

10. The wafer cleaning device according to claim 8, characterized in that: The cleaning device further comprises a liquid spraying assembly for spraying cleaning liquid onto the wafer; the liquid spraying assembly comprises at least two spraying rods arranged opposite to each other and a liquid supply assembly connected to the spraying rods, wherein the spraying rods are located above the cleaning brush; The liquid supply assembly is used to deliver cleaning liquid to the spray rod; The spray bar is configured to spray the cleaning liquid onto the surface of the wafer.

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