One-time lead punching device of multi-station CSOP packaging device

Abstract

The invention discloses a one-time lead punching device of a multi-station CSOP packaging device, and belongs to the technical field of integrated circuit packaging. The device comprises an upper die main body and a lower die main body; the top of the upper die body is provided with an upper positioning guide column hole and an upper equal-height limiting column, the top of the upper die body is provided with a plurality of upper tool bits which are symmetrical pairwise, positioning needle holes are formed in the two sides of each upper tool bit, and a positioning key is arranged between the upper tool bits which are symmetrical pairwise. Lower equal-height limiting columns are arranged at the positions, corresponding to the upper positioning guide column holes, of the top of the lower die body, lower positioning guide column holes are formed in the positions, corresponding to the upper equal-height limiting columns, of the top of the lower die body, and a punching module is arranged at the top of the lower die body. The punching module is provided with a positioning key groove, a positioning pin and a lower tool edge corresponding to the positioning key, the positioning pin hole and the upper tool bit respectively. The problem that in the prior art, only a single device or a single-face lead can be punched at a time can be solved.

Description

Technical Field

[0001] The invention belongs to the technical field of integrated circuit packaging, and in particular relates to a one-time lead punching device for a multi-station CSOP packaging device. Background Art

[0002] With the increase in market demand for domestic electronic components and the improvement of user requirements, there are stricter requirements for the production capacity, production efficiency and appearance quality of ceramic small outline package (CSOP) packaged devices. According to quality and technical requirements, ceramic flat package multi-lead devices will be operated with metal outer frames during the production process to avoid deformation or twisting of the leads. Before screening, such products need to cut off the metal outer frames with the same potential to form a flat and symmetrical lead state to meet the screening test requirements such as testing and aging.

[0003] Due to the low strength of the ceramic shell and the small spacing between adjacent leads, CSOP packaged devices are prone to large lead size deviations on both sides, poor size symmetry, and burrs on the lead cuts after being cut by manual scissors, which affects the appearance quality and reliability of use. The traditional manual cutting method has high requirements on the personnel's skill level, operating habits and scissor quality standards, and it is difficult to ensure the accuracy and consistency of the device size after trimming. At present, the existing motorized cutting methods at home and abroad have very high requirements on the precision processing of equipment tooling and the stability of the punching system. Only a single device or single-sided lead can be punched at a time. The process of completing the precise size cutting of multiple sides and multiple leads at one time is very difficult and the cost is high. Multiple motorized stamping and shearing methods are prone to lead indentation, cut burrs, shell porcelain falling off, and even cause device appearance failure. It is not only time-consuming and labor-intensive, but also has low production efficiency, and there are major risks in appearance quality and pass rate. Summary of the invention

[0004] The object of the present invention is to provide a one-time lead punching device for a multi-station CSOP packaging device, so as to solve the problem that the prior art can only punch a single device or a single-sided lead at a time.

[0005] In order to achieve the above object, the present invention adopts the following technical solutions: In a first aspect, a one-time lead punching device for a multi-station CSOP package device comprises: an upper mold body and a lower mold body, wherein the upper mold body and the lower mold body are respectively mounted on an upper mold frame and a lower mold frame of a mold frame of a ceramic flat package trimming device; An upper positioning guide column hole and an upper equal height limit column are arranged on the top of the upper mold body, a plurality of upper cutter heads symmetrical in pairs are arranged on the top of the upper mold body, positioning pin holes are arranged on both sides of the upper cutter heads, and positioning keys are arranged between the upper cutter heads symmetrical in pairs; A lower equal height limit column is set on the top of the lower mold body corresponding to the position of the upper positioning guide column hole, and a lower positioning guide column hole is set on the top of the lower mold body corresponding to the position of the upper equal height limit column. A punching module is set on the top of the lower mold body, and a positioning key slot, a positioning pin and a lower cutting edge are set on the punching module corresponding to the positions of the positioning key, the positioning pin hole and the upper cutting head respectively.

[0006] In some embodiments, spring columns of equal height are arranged inside the upper mold body, and positioning guide columns are arranged at positions corresponding to the positions of the upper positioning guide column holes.

[0007] In some embodiments, an upper slide rail is disposed at the bottom of the upper mold body, and upper compression spring type positioning ball grooves are disposed on both sides of the bottom of the upper mold body.

[0008] In some embodiments, a lower sliding rail is provided at the bottom of the lower mold body, and lower compression spring type positioning ball grooves are provided on both sides of the bottom of the lower mold body.

[0009] In some embodiments, a ceramic shell avoidance area is reserved between adjacent positioning keys, and a ceramic shell placement area is reserved between adjacent positioning key slots.

[0010] In some embodiments, the ceramic shell avoidance area corresponds to the ceramic shell placement area.

[0011] In some embodiments, a connection rib avoidance area is reserved between adjacent positioning pin holes, and a connection rib placement area is reserved between adjacent positioning pins.

[0012] In some embodiments, the connection rib avoidance area corresponds to the connection rib placement area.

[0013] In some embodiments, a metal outer frame placement area is reserved between the lower blade and the edge of the punching module.

[0014] In some embodiments, a disassembly handle is provided at the bottom of the lower mold body, and the push-pull direction of the disassembly handle is consistent with the movement direction of the lower sliding rail.

[0015] Compared with the prior art, the present invention has the following beneficial effects: The invention provides a disposable lead punching device for a multi-station CSOP packaging device, comprising: an upper mold body and a lower mold body, wherein an upper positioning guide post hole and an upper equal height limit post are arranged on the top of the upper mold body, a plurality of upper cutter heads symmetrical in pairs are arranged on the top of the upper mold body, positioning pin holes are arranged on both sides of the upper cutter heads, and positioning keys are arranged between the upper cutter heads symmetrical in pairs; a lower equal height limit post is arranged on the top of the lower mold body corresponding to the position of the upper positioning guide post hole, a lower positioning guide post hole is arranged on the top of the lower mold body corresponding to the position of the upper equal height limit post, a punching module is arranged on the top of the lower mold body, and a positioning key slot, a positioning pin and a lower cutting edge are arranged on the punching module corresponding to the positions of the positioning key, the positioning pin hole and the upper cutter head respectively. The upper positioning guide post hole and the lower equal height limit post, as well as the upper equal height limit post and the lower positioning guide post hole are precisely meshed, and a number of symmetrical upper cutter heads cooperate with the lower cutting edge to perform multi-station one-time trimming of double-sided lead packaging. The positioning key cooperates with the positioning key slot and the positioning pin cooperates with the positioning pin hole to achieve precise positioning. Therefore, the device can perform multi-station one-time trimming of ceramic flat double-sided lead packaging, while meeting the product size, appearance and quality standard requirements, greatly improving production efficiency and cutting process reliability, and reducing the probability of device appearance damage.

[0016] Furthermore, in the present invention, spring columns of equal height are arranged in the upper mold body, which can provide buffering protection for the entire device during the shearing process.

[0017] Furthermore, an upper slide rail is arranged at the bottom of the upper mold body of the present invention, upper compression spring type positioning ball grooves are arranged on both sides of the bottom of the upper mold body, a lower slide rail is arranged at the bottom of the lower mold body, and lower compression spring type positioning ball grooves are arranged on both sides of the bottom of the lower mold body. The upper slide rail and the lower slide rail can be compatible with the ceramic flat package trimming equipment, and the upper compression spring type positioning ball groove and the lower compression spring type positioning ball groove can be matched with the limit ball of the ceramic flat package trimming equipment to realize the precise positioning of the tooling.

[0018] Furthermore, the present invention reserves a ceramic shell avoidance area between adjacent positioning keys and a ceramic shell placement area between adjacent positioning key slots, and by pressing and fixing the leads on both sides, the tooling does not directly contact the device cover and the ceramic body during the punching process, thereby avoiding mechanical overstress damage to the product.

[0019] Furthermore, the present invention reserves a connection rib avoidance area between adjacent positioning pin holes and a connection rib placement area between adjacent positioning pins, which can enable the tooling to avoid the connection rib position of the device during the punching process, ensure the shear length of the connection rib, and prevent porcelain cracks at the connection rib position.

[0020] Furthermore, a metal outer frame placement area is reserved between the lower blade and the edge of the punching module, which can avoid the position of waste during the shearing process and affect the positioning of the punching device and the risk of excess materials, and facilitates the collection of waste through the integrated waste frame after trimming. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 A schematic plan view of the structure of an upper mold body of a one-time lead punching device for a multi-station CSOP packaging device is provided in accordance with an embodiment of the present invention; Figure 2 A schematic cross-sectional structure diagram of an upper mold body of a one-time lead punching device for a multi-station CSOP packaging device is provided in accordance with an embodiment of the present invention; Figure 3 A schematic plan view of the structure of a lower die body of a one-time lead punching device for a multi-station CSOP packaging device is provided for an embodiment of the present invention; Figure 4 A schematic cross-sectional structure diagram of a lower mold body of a one-time lead punching device for a multi-station CSOP packaging device is provided for an embodiment of the present invention; In the figure, 1. upper positioning guide post hole; 2. upper equal height limit post; 3. upper spring type positioning ball groove; 4. upper cutter head; 5. positioning key; 6. positioning pin hole; 7. upper slide rail; 8. equal height spring post; 9. positioning guide post; 10. lower slide rail; 11. lower spring type positioning ball groove; 12. disassembly handle; 13. lower cutter edge; 14. positioning key slot; 15. positioning pin; 16. lower equal height limit post; 17. lower positioning guide post hole; 18. punching module. DETAILED DESCRIPTION

[0022] Hereinafter, only certain exemplary embodiments are briefly described, and the described embodiments may be modified in various different ways without departing from the spirit or scope of the present invention. Therefore, the drawings and description are to be regarded as illustrative in nature and not restrictive.

[0023] In the description of the present invention, it is to be understood that the terms “center”, “longitudinal”, “lateral”, “length”, “width”, “thickness”, “up”, “down”, “front”, “back”, “left”, “right”, “vertical”, “horizontal”, “top”, “bottom”, “inside”, “outside”, “clockwise”, “counterclockwise”, “axial”, “radial”, “circumferential”, etc., indicating orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed or operate in a specific orientation, and therefore should not be understood as limiting the present invention.

[0024] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0025] In the present invention, unless otherwise clearly specified and limited, the terms "install", "connect", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or a communication; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0026] The embodiments of the present invention are described in detail below with reference to the accompanying drawings.

[0027] Embodiment 1 This embodiment provides a one-time lead punching device for a multi-station CSOP packaged device, comprising an upper mold body and a lower mold body, on which a package model and an electroplating mark are designed; like Figure 1 and Figure 2 As shown, an upper positioning guide post hole 1 and an upper equal height limit post 2 are arranged on the top of the upper mold body, there are 4 upper equal height limit posts 2 and they are arranged at the corners of the upper mold body respectively, and there are 4 upper positioning guide post holes 1 and they are arranged at the corners of the upper mold body respectively; Five groups of upper cutter heads 4 are arranged symmetrically in pairs on the top of the upper mold body, with a total of 10 upper cutter heads 4; positioning pinholes 6 are arranged on both sides of the upper cutter heads 4, and the positioning pinholes 6 on both sides are symmetrically arranged with the upper cutter heads 4 as the center, with a total of 20 positioning pinholes, and one positioning pinhole is arranged on each side of each upper cutter head 4; Positioning keys 5 are arranged between the two symmetrical upper cutting heads 4, and a total of 10 positioning keys 5 are arranged; The upper mold body is provided with spring columns 8 of equal height, and a positioning guide column 9 is provided corresponding to the position of the upper positioning guide column hole 1. A total of three spring columns 8 of equal height are provided, and the spacing between adjacent spring columns 8 of equal height is equal. Upper slide rails 7 are arranged on the protruding parts on both sides of the bottom of the upper mold body, and upper compression spring type positioning ball grooves 3 are arranged on both sides of the bottom of the upper mold body.

[0028] like Figure 3 and Figure 4As shown, a lower equal height limit column 16 is arranged at the top of the lower mold body corresponding to the position of the upper positioning guide column hole 1, and a total of 4 lower equal height limit columns 16 are arranged. A lower positioning guide column hole 17 is arranged at the top of the lower mold body corresponding to the position of the upper equal height limit column 2, and a total of 4 lower positioning guide column holes 17 are arranged. A punching module 18 is arranged at the top of the lower mold body, and a positioning key slot 14, a positioning pin 15 and a lower blade 13 are arranged on the punching module 18 corresponding to the positions of the positioning key 5, the positioning pin hole 6 and the upper cutter head 4, respectively. There are 10 positioning key slots 14, 20 positioning pins 15 and 10 lower blades 13. The precise positioning and shearing of the symmetrically positioned upper blade head 4 and lower blade edge 13 can achieve a punching accuracy of ±0.05mm, the diameter clearance error of the upper positioning guide post hole 1, the lower positioning guide post hole 17 and the positioning pin hole 6 is ±0.01mm, and the positioning accuracy error range is ≤10mil.

[0029] The protruding parts on both sides of the bottom of the lower mold body are provided with lower slide rails 10, and the lower compression spring type positioning ball grooves 11 are provided on both sides of the bottom of the lower mold body; a disassembly handle 12 is provided at the bottom of the lower mold body, and the push and pull direction of the disassembly handle 12 is consistent with the movement direction of the lower slide rail 10. The disassembly handle 12 can prompt the operator to distinguish between the upper mold body and the lower mold body, and it is easy to disassemble and replace the lower mold body. The upper mold body is installed at the upper position of the ceramic flat package trimming equipment mold frame, and is connected to the upper mold frame of the ceramic flat package trimming equipment mold frame through the upper slide rail 7. The lower mold body is installed at the lower position of the ceramic flat package trimming equipment mold frame, and is connected to the lower mold frame of the ceramic flat package trimming equipment mold frame through the lower slide rail 10.

[0030] A ceramic shell avoidance area is reserved between adjacent positioning keys 5, forming a total of 5 ceramic shell avoidance areas, and a ceramic shell placement area is reserved between adjacent positioning key slots 14, forming a total of 5 ceramic shell placement areas, and the positions of the ceramic shell avoidance area and the ceramic shell placement area correspond; A connection rib avoidance area is reserved between adjacent positioning pin holes 6, forming a total of 10 connection rib avoidance areas, and a connection rib placement area is reserved between adjacent positioning pins 15, forming a total of 10 connection rib placement areas, and the positions of the connection rib avoidance area and the connection rib placement area correspond; A metal outer frame placement area is reserved between the lower blade 13 and the edge of the punching module 18, forming a total of 10 metal outer frame placement areas; The disposable lead wire punching device provided in this embodiment has the following advantages: (1) The tooling can be replaced easily and quickly. An upper slide rail 7 and a lower slide rail 10 are respectively arranged on the left and right sides of the upper mold body and the lower mold body. The push-pull and card seat extraction methods are adopted, and the tooling can be compatible with ceramic flat package trimming equipment.

[0031] (2) Four symmetrically positioned compression spring-type positioning ball grooves are designed on the left and right sides of the upper and lower mold bodies, which cooperate with the limiting balls of the trimming equipment to achieve precise positioning of the tooling and ensure that the compressed air state is normal and the pressure is controllable when the equipment is running.

[0032] (3) The four upper equal height limit columns 2 of the upper die body and the four lower positioning guide column holes 17 of the lower die body, as well as the four upper positioning guide column holes 1 of the upper die body and the four lower equal height limit columns 16 of the lower die body, perform precise gearing to ensure the punching depth, punching force and stability.

[0033] (4) The upper die body is provided with three spring columns 8 of equal height, which can provide buffer protection for the entire device during the shearing process.

[0034] (5) The upper die body and the lower die body respectively use 20 positioning pin holes 6 and 20 positioning pins 15 symmetrically located at the four corners, which can realize the precise placement and limiting of the five adjacent workstation components on the punching module 18, and ensure the precise meshing positioning of the upper cutter head 4 and the lower cutting edge 13, thereby reducing the punching error.

[0035] (6) The upper die body and the lower die body respectively use a sharp upper cutter head 4 and a sharp lower cutter edge on both sides of the 5 adjacent workstations, which are symmetrically positioned. Through one-time precise positioning, stamping and shearing, the leads of the 5 devices on both sides can be trimmed at the same time to prevent burrs at the lead cuts.

[0036] (7) The upper mold body and the lower mold body are designed with 5 workstations of ceramic shell avoidance area and ceramic shell placement area respectively. By pressing and fixing the leads on both sides, the tooling does not directly contact the device cover and the ceramic body during the punching process, thus avoiding mechanical overstress damage to the product.

[0037] (8) Both the upper and lower mold bodies are designed with symmetrical connecting rib avoidance and placement areas on both sides of the five workstations. During the punching process, the tooling avoids the connecting rib position of the device to ensure the shear length of the connecting rib and prevent porcelain cracks at the connecting rib position.

[0038] (9) The lead contact surface areas on both sides of the upper mold body are ground and polished at 5 stations to avoid appearance problems such as lead indentation, deformation, and poor coplanarity of the device leads.

[0039] (10) The lower die body is equipped with a metal outer frame placement area with 5 stations to avoid the displacement or residual formation of waste during the shearing process, and to facilitate the collection of waste after shearing. It can be easily absorbed and cleaned in time through the magnetic strip to avoid affecting the positioning and appearance quality during the process.

[0040] The one-time lead punching device provided in this embodiment can achieve the simultaneous cutting effect of double-sided leads of multi-station (≤5) CSOP packaged devices, overcome the disadvantages of poor lead size accuracy and consistency in manual cutting, reduce the probability of device appearance damage, production time and cost, greatly improve the production efficiency, effective production capacity, lead size accuracy and consistency of this series of packaged devices, improve equipment utilization and process reliability, and have good punching stability. This embodiment can achieve the one-time edge trimming effect of multi-station ceramic flat double-sided lead packaging, which has good technical guidance significance for the design and application of this series of packaging multi-station one-time punching devices; in addition, this embodiment can complete the simultaneous stamping and shearing of two-sided lead devices at 5 stations through precise positioning and engagement of the device, which is at least 10 times more efficient than the traditional manual edge trimming method, and at least 5 times more efficient than the single-sided lead or single device lead multiple punching method.

[0041] Embodiment 2 A one-time lead punching device for a multi-station CSOP package device, characterized in that it comprises: an upper mold body and a lower mold body, wherein the upper mold body and the lower mold body are respectively mounted on an upper mold frame and a lower mold frame of a mold frame of a ceramic flat package trimming device; An upper positioning guide post hole 1 and an upper equal height limit post 2 are arranged on the top of the upper mold body, and four groups of upper cutter heads 4 are arranged symmetrically in pairs on the top of the upper mold body, and positioning pin holes 6 are arranged on both sides of the upper cutter heads 4, and positioning keys 5 are arranged between the upper cutter heads 4 that are symmetrical in pairs; A lower equal height limit column 16 is set at the top of the lower mold body corresponding to the position of the upper positioning guide column hole 1, and a lower positioning guide column hole 17 is set at the top of the lower mold body corresponding to the position of the upper equal height limit column 2. A punching module 18 is set at the top of the lower mold body, and a positioning key slot 14, a positioning pin 15 and a lower cutting edge 13 are set on the punching module 18 corresponding to the positions of the positioning key 5, the positioning pin hole 6 and the upper cutting head 4 respectively.

[0042] A ceramic shell avoidance area is reserved between adjacent positioning keys 5, and a ceramic shell placement area is reserved between adjacent positioning key slots 14, and the positions of the ceramic shell avoidance area and the ceramic shell placement area correspond to each other; A connection rib avoidance area is reserved between adjacent positioning pin holes 6, and a connection rib placement area is reserved between adjacent positioning pins 15, and the positions of the connection rib avoidance area and the connection rib placement area correspond to each other; A metal outer frame placement area is reserved between the lower blade 13 and the edge of the punching module 18 .

[0043] This embodiment achieves precise positioning by positioning guide post holes and equal height limit posts, ensuring the dimensional accuracy, consistency, lead coplanarity and appearance quality of the device after shearing, and achieving the multi-station one-time trimming effect of ceramic flat double-sided lead packaging, which has good technical guidance significance for the design and application of this series of packaging multi-station one-time punching devices. The device can perform multi-station one-time trimming of ceramic flat double-sided lead packaging, while meeting the product size, appearance and quality standard requirements, greatly improving production efficiency and shearing process reliability, and reducing the probability of device appearance damage.

[0044] It is known from common technical knowledge that the present invention can be implemented by other embodiments that do not deviate from its spirit or essential features. Therefore, the above disclosed embodiments are only illustrative in all respects, not exclusive, and all changes within the scope of the present invention or equivalent to the scope of the present invention are included in the present invention.

Claims

1. A one-time lead punching device for multi-station CSOP packaging devices, characterized in that: include: An upper mold body and a lower mold body, wherein the upper mold body and the lower mold body are respectively mounted on an upper mold frame and a lower mold frame of a mold frame of a ceramic flat package trimming device; An upper positioning guide column hole (1) and an upper equal height limit column (2) are arranged on the top of the upper mold body, a plurality of upper cutter heads (4) are arranged symmetrically in pairs on the top of the upper mold body, positioning pin holes (6) are arranged on both sides of the upper cutter heads (4), and positioning keys (5) are arranged between the upper cutter heads (4) that are symmetrical in pairs; A lower equal height limit post (16) is arranged at the top of the lower die body at a position corresponding to the upper positioning guide post hole (1), a lower positioning guide post hole (17) is arranged at the top of the lower die body at a position corresponding to the upper equal height limit post (2), a punching module (18) is arranged at the top of the lower die body, and a positioning key slot (14), a positioning pin (15) and a lower blade (13) are arranged on the punching module (18) at positions corresponding to the positioning key (5), the positioning pin hole (6) and the upper blade head (4), respectively.

2. The one-time lead punching device for a multi-station CSOP packaging device according to claim 1, characterized in that: A spring column (8) of equal height is arranged inside the upper die body, and a positioning guide column (9) is arranged at a position corresponding to the upper positioning guide column hole (1).

3. The one-time lead punching device for a multi-station CSOP packaging device according to claim 1, characterized in that: An upper slide rail (7) is arranged at the bottom of the upper mold body, and upper compression spring type positioning ball grooves (3) are arranged on both sides of the bottom of the upper mold body.

4. The one-time lead punching device for a multi-station CSOP packaging device according to claim 1, characterized in that: A lower sliding rail (10) is provided at the bottom of the lower mold body, and lower compression spring type positioning ball grooves (11) are provided on both sides of the bottom of the lower mold body.

5. The one-time lead punching device for a multi-station CSOP packaging device according to claim 1, characterized in that: A ceramic shell avoidance area is reserved between adjacent positioning keys (5), and a ceramic shell placement area is reserved between adjacent positioning key slots (14).

6. A one-time lead cutting device for a multi-station CSOP packaging device according to claim 5, characterized in that: The ceramic shell avoidance area corresponds to the ceramic shell placement area.

7. The one-time lead cutting device for multi-station CSOP packaging device according to claim 1, characterized in that: A connection rib avoidance area is reserved between adjacent positioning pin holes (6), and a connection rib placement area is reserved between adjacent positioning pins (15).

8. A one-time lead cutting device for a multi-station CSOP packaging device according to claim 7, characterized in that: The connection rib avoidance area corresponds to the connection rib placement area.

9. The one-time lead cutting device for multi-station CSOP packaging device according to claim 1, characterized in that: A metal outer frame placement area is reserved between the lower blade (13) and the edge of the punching module (18).

10. The one-time lead cutting device for multi-station CSOP packaging device according to claim 4, characterized in that: A disassembly handle (12) is provided at the bottom of the lower mold body, and the push-pull direction of the disassembly handle (12) is consistent with the movement direction of the lower sliding rail (10).

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