Performance improving method of high-thermal-conductivity single-component insulating heat-dissipating adhesive

Abstract

The invention discloses a method for improving the performance of a high-thermal-conductivity single-component insulating heat-dissipating adhesive, and relates to the technical field of insulating adhesive tapes. Comprising the steps of raw material screening, heat-conducting filler surface treatment, formula proportion optimization, high-speed stirring dispersion, ultrasonic dispersion strengthening, heat treatment process, nano material introduction, packaging storage optimization, performance inspection and quality control. According to the present invention, the material can achieve the high heat conduction effect, the alumina heat conduction filler has the high heat conductivity, and can effectively transfer heat after the surface treatment and mixing with the insulating resin, and the nano-scale graphene has the excellent heat conduction performance, such that the overall heat conduction coefficient can be further improved by adding the nano-scale graphene into the heat dissipation glue; the heat dissipation function of the heat dissipation glue can be realized without adding other components when the heat dissipation glue is used.

Description

Technical Field

[0001] The invention relates to the technical field of insulating tapes, and in particular to a method for improving the performance of a high thermal conductivity single-component insulating heat dissipating adhesive. Background Art

[0002] With the rapid development of electronic technology, electronic equipment is constantly moving towards miniaturization, integration, and high power. In this process, heat dissipation has become one of the key factors restricting the performance and reliability of electronic equipment. As an important heat dissipation material, high thermal conductivity single-component insulating heat dissipation adhesive plays an increasingly important role in the field of electronic equipment heat dissipation. Traditional heat dissipation materials often have problems such as insufficient thermal conductivity, poor insulation performance, and inconvenient use. For example, some heat dissipation pastes need to be mixed with multiple components before they can be used. Not only is the operation complicated, but it is also prone to uneven mixing, which affects the heat dissipation effect. In addition, some heat dissipation materials have low thermal conductivity and cannot meet the heat dissipation requirements of high-power electronic equipment. At the same time, heat dissipation materials with poor insulation performance may cause short circuits and other faults between electronic equipment, seriously affecting the safety and stability of the equipment. In order to solve these problems, researchers have been working hard to explore new heat dissipation materials and heat dissipation technologies. The emergence of high thermal conductivity single-component insulating heat dissipation adhesive provides a new solution to the heat dissipation problem of electronic equipment. This heat dissipation adhesive has the advantages of high thermal conductivity, good insulation performance, and easy use, and can effectively meet the heat dissipation needs of electronic equipment. To this end, we propose a performance improvement method for high thermal conductivity single-component insulating heat dissipation adhesive. Summary of the invention

[0003] The object of the present invention is to provide a method for improving the performance of a high thermal conductivity single-component insulating heat dissipation adhesive.

[0004] In order to solve the problems raised in the above background technology, the present invention provides the following technical solutions: a method for improving the performance of a high thermal conductivity single-component insulating heat dissipation adhesive, including raw material screening, surface treatment of thermal conductive fillers, optimization of formula ratio, high-speed stirring and dispersion, ultrasonic dispersion strengthening, heat treatment process, introduction of nanomaterials, packaging and storage optimization, and performance inspection and quality control. The specific steps of the method for improving the performance of a high thermal conductivity single-component insulating heat dissipation adhesive are as follows:

[0005] Step 1: Raw material screening: select alumina thermal conductive filler and bisphenol A epoxy resin as raw materials;

[0006] Step 2, surface treatment of the thermal conductive filler, adding the alumina thermal conductive filler into a container containing a silane coupling agent solution, stirring at a constant temperature, filtering and drying after stirring, to obtain a surface-modified thermal conductive filler;

[0007] Step 3: Optimize the formula ratio, mix the surface-modified thermal conductive filler and the bisphenol A epoxy resin in a mass ratio of 79:35, and add a defoamer and a leveling agent to stir and mix to obtain a semi-mixed material;

[0008] Step 4: High-speed stirring and dispersing: transferring the mixture into a high-speed mixer, and rapidly stirring until the thermal conductive filler is evenly dispersed in the insulating resin to obtain a mixture;

[0009] Step 5: Ultrasonic dispersion strengthening and heat treatment process: the prepared mixture is placed in an ultrasonic disperser for ultrasonic dispersion, and after dispersion, it is placed in an oven for heat treatment to obtain a mixed heat dissipation adhesive;

[0010] Step 6: Introduce nanomaterials, transfer the mixed heat dissipation adhesive into a mixing tank, add nano-graphite and stir to mix, and after mixing, obtain a finished heat dissipation adhesive;

[0011] Step 7: Packaging and storage optimization, performance inspection and quality control: test the performance of the prepared heat dissipation adhesive. After passing the test, use aluminum-plastic composite bags for sealed packaging and put it into subsequent use.

[0012] As a further solution of the present invention: in the step 1, the purity of the alumina thermal conductive filler is 99.5%-99.9%, the particle size is 30um-60um, the bisphenol A epoxy resin is the insulating resin, and the epoxy equivalent is between 180g / mol-200g / mol.

[0013] As a further solution of the present invention: in the step 2, the concentration of the silane coupling agent is 5%, the constant temperature needs to be controlled at 40° C., the stirring rate is 500 r / min, and the stirring time is 60 min-80 min.

[0014] As a further solution of the present invention: in the step three, the added defoamer accounts for 3.5%-7% of the total mass, the leveling agent accounts for 2%-4% of the total mass, and the antioxidant accounts for 1%-2% of the total mass.

[0015] As a further solution of the present invention: in the step 4, when the mixture is put into the high-speed mixer, it is stirred at a stirring rate of 1500r / min-1800r / min for 30min-45min, and no electricity is controlled during stirring.

[0016] As a further solution of the present invention: in the step five, an ultrasonic disperser with a power of 1000W is used to disperse the stirred mixture, and the dispersion time is 40min-50min. During the ultrasonic dispersion process, the material temperature is maintained between 25°C and 40°C. The dispersion method is intermittent dispersion, and the ultrasound is applied for 5min and then paused for 1min. After the ultrasound is completed, it is placed in an oven and heat treated at 80°C for 2h, and the heat dissipation glue is turned over every 30min.

[0017] As a further solution of the present invention: in step six, the mass of nano-graphene added to the heat dissipation adhesive accounts for 2%-5% of the total mass of the heat dissipation adhesive, the diameter of the graphene flakes is 5um-10um, and before adding, the graphene is surface activated by plasma treatment technology for 15min-20min.

[0018] As a further solution of the present invention: in the step seven, the performance testing and quality control include testing the thermal conductivity of each batch of heat dissipation adhesive, and the qualified thermal conductivity is greater than 3.0W / (m·K), the thermal conductivity test is performed using the transient hot wire method, the test temperature is 25°C, the insulation resistance test is not less than 1000MΩ, an insulation resistance tester is used, the test voltage is 500V, the hardness test is performed using a Shore durometer, the qualified hardness is in the range of 80-90 degrees, the test temperature is 25°C, and the test time is 10s.

[0019] As a further solution of the present invention: in the step seven, after passing the inspection, the product is sealed and packaged in an aluminum-plastic composite bag, the storage environment temperature is controlled at 25°C, the relative humidity is 30%-50%, and a desiccant is placed in the package, and the amount of desiccant is 1% of the total mass of the heat dissipation adhesive product.

[0020] By adopting the above technical solution, compared with the prior art, the beneficial effects of the present invention are:

[0021] 1. The present invention can make the material achieve high thermal conductivity by adding high-purity alumina thermal conductive filler and nano-graphene to the heat dissipation adhesive. The alumina thermal conductive filler itself has a high thermal conductivity. After surface treatment and mixing with the insulating resin, it can effectively transfer heat. Nano-graphene has excellent thermal conductivity. Adding it to the heat dissipation adhesive can further improve the overall thermal conductivity, so that the heat dissipation adhesive can achieve its heat dissipation function without adding other components when in use. By adding bisphenol A type epoxy resin to the heat dissipation adhesive, it can play an insulating role, and while ensuring heat dissipation, it can prevent electrical faults such as short circuits between electronic devices. At the same time, the high-purity alumina thermal conductive filler and nano-graphene can play a major role in heat dissipation. By improving the thermal conductivity of the heat dissipation adhesive, the heat generated by the electronic equipment is quickly conducted away to achieve the purpose of heat dissipation.

[0022] 2. The present invention selects common and relatively low-cost alumina thermal conductive filler and bisphenol A epoxy resin in the raw material screening stage, and through precise purity and particle size control, it not only ensures the high performance of the heat dissipation adhesive, but also avoids the use of expensive rare materials. In the preparation process, the optimized process flow reduces complicated operation links and equipment investment. The combination of high-speed stirring dispersion and ultrasonic dispersion enhancement allows the thermal conductive filler to be more evenly dispersed in the insulating resin, reducing performance instability and scrap rate caused by uneven dispersion, thereby reducing production costs. At the same time, the single-component design eliminates the need for complicated mixing operations during use of the heat dissipation adhesive, saving time and labor costs, and improving production efficiency. It can better meet the needs of large-scale production and rapid application, and bring significant economic benefits to electronic equipment manufacturers. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 The figure is a schematic diagram of the preparation process of the insulating heat dissipation adhesive in an embodiment of the present invention. DETAILED DESCRIPTION

[0024] The specific embodiments of the present invention are further described below in conjunction with the accompanying drawings. It should be noted that the description of these embodiments is used to help understand the present invention, but does not constitute a limitation of the present invention. In addition, the technical features involved in the various embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0025] The present invention discloses a method for improving the performance of a high thermal conductivity single-component insulating heat dissipation adhesive, including raw material screening, surface treatment of thermal conductive fillers, optimization of formula ratio, high-speed stirring and dispersion, ultrasonic dispersion strengthening, heat treatment process, introduction of nanomaterials, packaging and storage optimization, and performance inspection and quality control. The specific steps of the method for improving the performance of a high thermal conductivity single-component insulating heat dissipation adhesive are as follows:

[0026] Step 1: Raw material screening: select alumina thermal conductive filler and bisphenol A epoxy resin as raw materials;

[0027] Step 2, surface treatment of the thermal conductive filler, adding the alumina thermal conductive filler into a container containing a silane coupling agent solution, stirring at a constant temperature, filtering and drying after stirring, to obtain a surface-modified thermal conductive filler;

[0028] Step 3: Optimize the formula ratio, mix the surface-modified thermal conductive filler and the bisphenol A epoxy resin in a mass ratio of 79:35, and add a defoamer and a leveling agent to stir and mix to obtain a semi-mixed material;

[0029] Step 4: High-speed stirring and dispersing: transferring the mixture into a high-speed mixer, and rapidly stirring until the thermal conductive filler is evenly dispersed in the insulating resin to obtain a mixture;

[0030] Step 5: Ultrasonic dispersion strengthening and heat treatment process: the prepared mixture is placed in an ultrasonic disperser for ultrasonic dispersion, and after dispersion, it is placed in an oven for heat treatment to obtain a mixed heat dissipation adhesive;

[0031] Step 6: Introduce nanomaterials, transfer the mixed heat dissipation adhesive into a mixing tank, add nano-graphite and stir to mix, and after mixing, obtain a finished heat dissipation adhesive;

[0032] Step 7: Packaging and storage optimization, performance inspection and quality control: test the performance of the prepared heat dissipation adhesive. After passing the test, use aluminum-plastic composite bags for sealed packaging and put it into subsequent use.

[0033] In one embodiment of the present invention: in step one, the purity of the alumina thermal conductive filler is 99.5%-99.9%, the particle size is 30um-60um, the bisphenol A epoxy resin is the insulating resin, and the epoxy equivalent is between 180g / mol-200g / mol.

[0034] In one embodiment of the present invention: in step 2, the concentration of the silane coupling agent is 5%, the constant temperature needs to be controlled at 40° C., the stirring rate is 500 r / min, and the stirring time is 60 min-80 min.

[0035] In one embodiment of the present invention: in step three, the added defoamer accounts for 3.5%-7% of the total mass, the leveling agent accounts for 2%-4% of the total mass, and the antioxidant accounts for 1%-2% of the total mass.

[0036] In one embodiment of the present invention: in step 4, when the mixture is placed in a high-speed mixer, it is stirred at a stirring rate of 1500 r / min-1800 r / min for 30 min-45 min, and no electricity is controlled during stirring.

[0037] In one embodiment of the present invention: in step five, an ultrasonic disperser with a power of 1000W is used to disperse the stirred mixture, and the dispersion time is 40min-50min. During the ultrasonic dispersion process, the material temperature is maintained between 25°C and 40°C. The dispersion method is intermittent dispersion, and the ultrasound is applied for 5min and then paused for 1min. After the ultrasound is completed, it is placed in an oven and heat treated at 80°C for 2h, and the heat dissipation glue is turned over every 30min.

[0038] In one embodiment of the present invention: in step six, the mass of nano-graphene added to the heat dissipation adhesive is 2%-5% of the total mass of the heat dissipation adhesive, the diameter of the graphene flakes is 5um-10um, and the graphene is surface activated for 15min-20min using plasma treatment technology before adding.

[0039] In one embodiment of the present invention: In step seven, performance testing and quality control include testing the thermal conductivity of each batch of heat dissipation adhesive, and the qualified thermal conductivity is greater than 3.0W / (m·K), the thermal conductivity test is performed using a transient hot wire method, the test temperature is 25°C, the insulation resistance test is not less than 1000MΩ, an insulation resistance tester is used, the test voltage is 500V, the hardness test is performed using a Shore durometer, the qualified hardness is in the range of 80-90 degrees, the test temperature is 25°C, and the test time is 10s.

[0040] In one embodiment of the present invention: in step seven, after passing the inspection, the product is sealed and packaged in an aluminum-plastic composite bag, the storage environment temperature is controlled at 25°C, the relative humidity is 30%-50%, and a desiccant is placed in the package, and the amount of the desiccant is 1% of the total mass of the heat dissipation adhesive product.

[0041] Embodiment 1

[0042] Raw material screening: Alumina thermal conductive filler with a purity of 99.7% and a particle size of 45um was selected, and the epoxy equivalent of bisphenol A epoxy resin was 190g / mol;

[0043] Surface treatment of thermal conductive filler: Add alumina thermal conductive filler to 5% silane coupling agent solution, control the constant temperature at 40°C, and stir at a stirring rate of 500r / min for 70min. After stirring, filter and dry at 80°C for 3 hours;

[0044] Optimize the formula ratio: Mix the surface-modified thermal conductive filler with bisphenol A epoxy resin at a mass ratio of 79:35, add 5% of the total mass of defoamer, 3% of the leveling agent and 1.5% of the antioxidant;

[0045] High-speed stirring and dispersion: put the mixture into a high-speed mixer and stir at a stirring rate of 1600r / min for 40min. Control the power off during stirring;

[0046] Ultrasonic dispersion strengthening and heat treatment process: Use an ultrasonic disperser with a power of 1000W to disperse the stirred mixture for 45 minutes. During the ultrasonic dispersion process, keep the material temperature at around 35°C. After every 5 minutes of ultrasonic treatment, pause for 1 minute. After the ultrasonic treatment is completed, put it in an oven and heat treat it at 80°C for 2 hours. Turn the heat dissipation glue every 30 minutes.

[0047] Introduction of nanomaterials: Add nano-scale graphene to the heat dissipation adhesive, the mass of which accounts for 3% of the total mass of the heat dissipation adhesive, and the diameter of the graphene sheet is 8um. The graphene surface is activated by plasma treatment technology for 18 minutes;

[0048] Packaging and storage optimization, performance inspection and quality control: After passing the inspection, the products are sealed in aluminum-plastic composite bags. The storage environment temperature is controlled at 25°C and the relative humidity is 40%. A desiccant is placed in the package, and the amount of desiccant is 1% of the total mass of the heat dissipation adhesive product.

[0049] Test data:

[0050] Thermal conductivity: 3.2W / (m·K) (The thermal conductivity was tested using the transient hot wire method at a temperature of 25°C);

[0051] Insulation resistance: 1200MΩ (using insulation resistance tester, test voltage is 500V);

[0052] Hardness: 85 degrees (using Shore hardness tester, test temperature is 25℃, test time is 10s).

[0053] Embodiment 2

[0054] Raw material screening: Alumina thermal conductive filler with a purity of 99.8% and a particle size of 50um was selected, and the epoxy equivalent of bisphenol A epoxy resin was 185g / mol;

[0055] Surface treatment of thermal conductive filler: Add alumina thermal conductive filler to 5% silane coupling agent solution, control the constant temperature at 40°C, and stir at a stirring rate of 500r / min for 65min. After stirring, filter and dry at 80°C for 3 hours;

[0056] Optimize the formula ratio: Mix the surface-modified thermal conductive filler and bisphenol A epoxy resin in a mass ratio of 79:35, add 4% of the total mass of defoamer, 2.5% of the leveling agent and 1.2% of the antioxidant;

[0057] High-speed stirring and dispersion: put the mixture into a high-speed mixer and stir at a stirring rate of 1700r / min for 35min. Control the power off during stirring;

[0058] Ultrasonic dispersion strengthening and heat treatment process: Use an ultrasonic disperser with a power of 1000W to disperse the stirred mixture. The dispersion time is 42 minutes. During the ultrasonic dispersion process, keep the material temperature at about 32°C. After each ultrasonic dispersion for 5 minutes, pause for 1 minute. After the ultrasonic dispersion is completed, put it in an oven and heat-treat it at 80°C for 2 hours. Turn the heat dissipation glue every 30 minutes.

[0059] Introduction of nanomaterials: Add nano-scale graphene to the heat dissipation adhesive, the mass of which accounts for 4% of the total mass of the heat dissipation adhesive, and the diameter of the graphene sheet is 7um. The graphene surface is activated by plasma treatment technology for 16 minutes;

[0060] Packaging and storage optimization, performance inspection and quality control: After passing the inspection, the products are sealed in aluminum-plastic composite bags. The storage environment temperature is controlled at 25°C and the relative humidity is 45%. A desiccant is placed in the package, and the amount of desiccant is 1% of the total mass of the heat dissipation adhesive product.

[0061] Test data:

[0062] Thermal conductivity: 3.3W / (m·K);

[0063] Insulation resistance: 1150MΩ;

[0064] Hardness: 83 degrees.

[0065] Embodiment 3

[0066] Raw material screening: Alumina thermal conductive filler with a purity of 99.6% and a particle size of 55um was selected, and the epoxy equivalent of bisphenol A epoxy resin was 195g / mol;

[0067] Surface treatment of thermal conductive filler: Add alumina thermal conductive filler to 5% silane coupling agent solution, control the constant temperature at 40°C, and stir at a stirring rate of 500r / min for 75min. After stirring, filter and dry at 80°C for 3 hours;

[0068] Optimize the formula ratio: Mix the surface-modified thermal conductive filler with bisphenol A epoxy resin at a mass ratio of 79:35, add 6% of the total mass of defoamer, 3.5% of the leveling agent and 1.8% of the antioxidant;

[0069] High-speed stirring and dispersion: put the mixture into a high-speed mixer and stir at a stirring rate of 1550r / min for 42min. Control the power off during stirring;

[0070] Ultrasonic dispersion strengthening and heat treatment process: Use an ultrasonic disperser with a power of 1000W to disperse the stirred mixture for 48 minutes. During the ultrasonic dispersion process, keep the material temperature at around 38°C. After each 5 minutes of ultrasonic treatment, pause for 1 minute. After the ultrasonic treatment is completed, put it in an oven and heat-treat it at 80°C for 2 hours. Turn the heat dissipation glue every 30 minutes.

[0071] Introduction of nanomaterials: Add nano-scale graphene to the heat dissipation adhesive, the mass of which accounts for 2.5% of the total mass of the heat dissipation adhesive, and the diameter of the graphene sheet is 6um. The graphene surface is activated by plasma treatment technology for 17 minutes;

[0072] Packaging and storage optimization, performance inspection and quality control: After passing the inspection, the products are sealed in aluminum-plastic composite bags. The storage environment temperature is controlled at 25°C and the relative humidity is 35%. A desiccant is placed in the package, and the amount of desiccant is 1% of the total mass of the heat dissipation adhesive product.

[0073] Test data:

[0074] Thermal conductivity: 3.1W / (m·K);

[0075] Insulation resistance: 1050MΩ;

[0076] Hardness: 87 degrees.

[0077] Embodiment 4:

[0078] Raw material screening: Alumina thermal conductive filler with a purity of 99.5% and a particle size of 35um was selected, and the epoxy equivalent of bisphenol A epoxy resin was 182g / mol;

[0079] Surface treatment of thermal conductive filler: Add alumina thermal conductive filler to 5% silane coupling agent solution, control the constant temperature at 40°C, and stir at a stirring rate of 500r / min for 60min. After stirring, filter and dry at 80°C for 3 hours;

[0080] Optimize the formula ratio: Mix the surface-modified thermal conductive filler with bisphenol A epoxy resin at a mass ratio of 79:35, add 3.5% of the total mass of defoamer, 2% of the leveling agent and 1% of the antioxidant;

[0081] High-speed stirring and dispersion: put the mixture into a high-speed mixer and stir at a stirring rate of 1800r / min for 30min. Control the machine to be without electricity during stirring.

[0082] Ultrasonic dispersion strengthening and heat treatment process: Use an ultrasonic disperser with a power of 1000W to disperse the stirred mixture for 50 minutes. During the ultrasonic dispersion process, keep the material temperature at about 28°C. After ultrasonication for 5 minutes, pause for 1 minute. After the ultrasonication is completed, put it in an oven and heat-treat it at 80°C for 2 hours. Turn the heat dissipation glue every 30 minutes.

[0083] Introduction of nanomaterials: Add nano-scale graphene to the heat dissipation adhesive, the mass of which accounts for 2% of the total mass of the heat dissipation adhesive, and the diameter of the graphene sheet is 5um. Use plasma treatment technology to perform surface activation treatment on the graphene for 15 minutes;

[0084] Packaging and storage optimization, performance inspection and quality control: After passing the inspection, the products are sealed in aluminum-plastic composite bags. The storage environment temperature is controlled at 25°C and the relative humidity is 42%. A desiccant is placed in the package, and the amount of desiccant is 1% of the total mass of the heat dissipation adhesive product.

[0085] Test data:

[0086] Thermal conductivity: 3.05W / (m·K);

[0087] Insulation resistance: 1080MΩ;

[0088] Hardness: 82 degrees.

[0089] The test data in the above four groups of embodiments are obtained by testing using the same method and under the same conditions, and within the component range of the present invention, the prepared heat dissipation adhesive can meet the heat dissipation requirements of electronic equipment under high-power operation while ensuring the safety and stability of the equipment.

[0090] The embodiments of the present invention are described in detail above with reference to the accompanying drawings, but the present invention is not limited to the described embodiments. For those skilled in the art, various changes, modifications, substitutions and variations of these embodiments are made without departing from the principles and spirit of the present invention, and still fall within the scope of protection of the present invention.

[0091] In the description of the specification, the description with reference to the terms "one embodiment", "example", "specific example", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0092] The above contents are merely examples and explanations of the present invention. Various modifications or additions to the specific embodiments described or replacements in similar ways by technicians in the technical field shall fall within the protection scope of the present invention as long as they do not deviate from the invention or exceed the scope defined by the claims.

[0093] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical scheme and inventive concept of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A method for improving the performance of a high thermal conductivity single-component insulating heat dissipation adhesive, comprising raw material screening, surface treatment of thermal conductive fillers, optimization of formula ratio, high-speed stirring and dispersion, ultrasonic dispersion enhancement, heat treatment process, introduction of nanomaterials, packaging and storage optimization, and performance inspection and quality control, characterized in that: The specific steps of the method for improving the performance of the high thermal conductivity single-component insulating heat dissipation adhesive are as follows: Step 1: Select alumina thermal conductive filler and bisphenol A epoxy resin as raw materials; Step 2: adding alumina thermal conductive filler into a container containing a silane coupling agent solution, stirring at a constant temperature, filtering and drying after stirring, to obtain a surface-modified thermal conductive filler; Step 3: Mix the surface-modified thermal conductive filler and bisphenol A epoxy resin in a mass ratio of 79:35, and add a defoamer and a leveling agent to mix them, so as to prepare a semi-mixed material; Step 4: transfer the mixture into a high-speed mixer and stir quickly until the thermal conductive filler is evenly dispersed in the insulating resin to obtain a mixture; Step 5: Place the prepared mixture into an ultrasonic disperser for ultrasonic dispersion, and after dispersion, place it into an oven for heat treatment to obtain a mixed heat dissipation adhesive; Step 6: transfer the mixed heat dissipation adhesive into a stirring tank, add nano-graphite and stir to mix, and obtain a finished heat dissipation adhesive after the mixing is completed; Step 7: Test the performance of the prepared heat dissipation adhesive. If the adhesive passes the test, seal it in an aluminum-plastic composite bag and put it into subsequent use.

2. The method for improving the performance of a high thermal conductivity single-component insulating heat dissipation adhesive according to claim 1, characterized in that: In the step 1, the purity of the alumina thermal conductive filler is 99.5%-99.9%, the particle size is 30um-60um, the bisphenol A epoxy resin is the insulating resin, and the epoxy equivalent is between 180g / mol-200g / mol.

3. The method for improving the performance of a high thermal conductivity single-component insulating heat dissipation adhesive according to claim 1, characterized in that: In the step 2, the concentration of the silane coupling agent is 5%, the constant temperature needs to be controlled at 40° C., the stirring rate is 500 r / min, and the stirring time is 60 min-80 min.

4. The method for improving the performance of a high thermal conductivity single-component insulating heat dissipation adhesive according to claim 1, characterized in that: In the step three, the added defoamer accounts for 3.5%-7% of the total mass, the leveling agent accounts for 2%-4% of the total mass, and the antioxidant accounts for 1%-2% of the total mass.

5. The method for improving the performance of a high thermal conductivity single-component insulating heat dissipation adhesive according to claim 1, characterized in that: In the step 4, when the mixture is placed in a high-speed mixer, it is stirred at a stirring rate of 1500 r / min-1800 r / min for 30 min-45 min, and no electricity is used during the stirring.

6. The method for improving the performance of a high thermal conductivity single-component insulating heat dissipation adhesive according to claim 1, characterized in that: In the step 5, an ultrasonic disperser with a power of 1000 W is used to disperse the stirred mixture, and the dispersion time is 40 min-50 min. During the ultrasonic dispersion process, the material temperature is maintained between 25°C and 40°C, and the dispersion method is intermittent dispersion. After each ultrasonic dispersion for 5 min, there is a pause of 1 min. After the ultrasonic dispersion is completed, it is placed in an oven and heat treated at 80°C for 2 h, and the heat dissipation glue is turned over every 30 min.

7. The method for improving the performance of a high thermal conductivity single-component insulating heat dissipation adhesive according to claim 1, characterized in that: In step six, the mass of nano-graphene added to the heat dissipation adhesive accounts for 2%-5% of the total mass of the heat dissipation adhesive, the diameter of the graphene flakes is 5um-10um, and the graphene is surface activated for 15min-20min using plasma treatment technology before adding.

8. The method for improving the performance of a high thermal conductivity single-component insulating heat dissipation adhesive according to claim 1, characterized in that: In step seven, the performance testing and quality control include testing the thermal conductivity of each batch of heat dissipation adhesive, and the qualified thermal conductivity is greater than 3.0W / (m·K), the thermal conductivity test is performed using the transient hot wire method, the test temperature is 25°C, the insulation resistance test is not less than 1000MΩ, an insulation resistance tester is used, the test voltage is 500V, the hardness test is performed using a Shore durometer, the qualified hardness is in the range of 80-90 degrees, the test temperature is 25°C, and the test time is 10s.

9. The method for improving the performance of a high thermal conductivity single-component insulating heat dissipation adhesive according to claim 1, characterized in that: In the step 7, after passing the inspection, the product is sealed and packaged in an aluminum-plastic composite bag, the storage environment temperature is controlled at 25° C., the relative humidity is 30%-50%, and a desiccant is placed in the package. The amount of desiccant is 1% of the total mass of the heat dissipation adhesive product.

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