Wafer back defect detection device

Abstract

The invention relates to a wafer back defect detection device. The wafer back defect detection device comprises a rack; the bearing mechanism is used for fixing a wafer; the bearing mechanism is arranged on the first translation mechanism; the first translation direction of the first translation mechanism is perpendicular to the second translation direction of the second translation mechanism; the detection mechanism is arranged below the bearing mechanism; the multi-angle dark field light source mechanism comprises a multi-angle reflection assembly fixedly arranged on the rack and located above the line scanning visual inspection assembly and a dark field light source arranged on the multi-angle reflection assembly, and the multi-angle reflection assembly is provided with a plurality of reflection faces facing the bearing mechanism and arranged at different angles. The wafer back surface defect detection device can provide multi-angle dark field light to illuminate the defects on the back surface of the wafer from different angles, so that a better dark field imaging effect is realized.

Description

[0001] This application claims the priority of the Chinese patent application filed with the China Patent Office on December 26, 2024, with application number 2024119473617 and application name “Wafer back side defect detection device and wafer back side defect detection method”, the entire contents of which are incorporated by reference in this application. Technical Field

[0002] The present invention relates to the technical field of round wafer detection equipment, and in particular to a wafer backside defect detection device. Background Art

[0003] In the process of preparing a single bare chip from a wafer, it is usually necessary to perform surface treatment on the wafer, such as thinning the back of the wafer, and then dicing the wafer to obtain a single bare chip. The wafer back thinning process usually includes wafer back grinding, polishing and water washing. Back grinding can greatly reduce the overall thickness of the wafer, the polishing process makes the back surface of the wafer flat, and water washing can wash away the powder and debris generated on the wafer surface due to grinding and polishing. However, when performing the above process flow, each step will inevitably cause pollution to the surface of the wafer. For example, during the back grinding process, grinding lines, cracks, debris, edge collapse and other problems will occur, during the polishing process, impurities such as powder, scratches, foreign particles will be generated, and during the water washing process, sewage, stains, residues and other pollution will be left. If the above defects are large in area, widely distributed or in large numbers, they will greatly affect the quality of the bare chip after wafer dicing and cutting. If defective wafers are sent downstream for further processing, it will lead to a large waste of production time and raw materials, and increase production costs. Therefore, there is a need for an apparatus capable of detecting defects on the back side of a wafer.

[0004] At present, there are some wafer backside inspection devices in the prior art that use multiple visual inspection components to work simultaneously. Due to the high unit price of visual inspection components, the material cost of using multiple visual inspection components is high. In addition, when the existing visual inspection components are performing dark field image acquisition, due to the problem of illumination angle, the required exposure time is longer, resulting in a slower scanning speed, resulting in reduced efficiency, and the dark field imaging effect is poor, and the inspection results cannot accurately reflect the actual defect situation. Summary of the invention

[0005] Based on this, it is necessary to provide a wafer back side defect detection device to address the problem of poor dark field imaging effect of existing wafer detection equipment.

[0006] A wafer backside defect detection device, comprising:

[0007] frame;

[0008] A carrying mechanism, the carrying mechanism is used to fix the wafer;

[0009] a first translation mechanism, wherein the first translation mechanism is arranged on the frame, and the bearing mechanism is arranged on the first translation mechanism;

[0010] a second translation mechanism, wherein the second translation mechanism is arranged on the frame, and a first translation direction of the first translation mechanism is perpendicular to a second translation direction of the second translation mechanism;

[0011] A detection mechanism, the detection mechanism is arranged below the carrying mechanism, the detection mechanism comprises a connecting bracket arranged on the second translation mechanism, a line scan vision detection component connected to one side of the connecting bracket, and an area array vision detection component connected to the other side of the connecting bracket; and

[0012] A multi-angle dark field light source mechanism, the multi-angle dark field light source mechanism includes a multi-angle reflection component fixed to the frame and located above the line scan vision detection component and a dark field light source arranged on the multi-angle reflection component, the multi-angle reflection component has a plurality of reflection surfaces facing the supporting mechanism and arranged at different angles and a through slot extending along the second translation direction, the through slot is located above the line scan vision detection component, and the area array vision detection component is located on the outside of the multi-angle reflection component.

[0013] In one of the embodiments, the line scan visual detection component includes a line scan lens, a line scan camera and a linear light source respectively fixed to the connecting bracket, and the linear light source, the line scan lens and the line scan camera are arranged in sequence from top to bottom.

[0014] In one embodiment, the area array visual inspection component includes an area array lens, an area array camera connected below the area array lens, and a focusing module fixed to the connecting bracket, and the area array lens and the area array camera are arranged on the focusing module.

[0015] In one embodiment, the first translation mechanism includes a pair of linear slide rails fixed to the frame at intervals and extending along the first translation direction, a plurality of sliders slidably disposed on the linear slide rails, and a linear motor fixed to the frame, the plurality of sliders are respectively fixedly connected to both sides of the supporting mechanism, and the linear motor is drivably connected to one side of the supporting mechanism.

[0016] In one embodiment, the first translation mechanism includes a pair of limit blocks, the linear motor is arranged on the inner side of one of the linear slide rails, and the limit blocks are respectively arranged at both ends of the linear slide rail on which the linear motor is arranged.

[0017] In one of the embodiments, the first translation mechanism further includes a grating ruler fixedly mounted on the outer side of one of the linear slide rails, and the grating ruler extends along the first translation direction.

[0018] In one embodiment, the multi-angle reflection assembly includes a fixed box fixed to the frame and two groups of reflection components fixed to the fixed box at intervals, the interval between the two groups of reflection components is the through seam, each group of the reflection components includes a plurality of reflection components fixed in the fixed box at different angles, and the reflection components have the reflection surface.

[0019] In one of the embodiments, the multi-angle reflection assembly further includes a cooling pipeline, and the cooling pipeline is fixed to the side of the fixed box.

[0020] In one of the embodiments, the first translation mechanism further includes a drag chain assembly, wherein the drag chain assembly is disposed between the frame and the linear motor, and a wiring harness of the linear motor is disposed in the drag chain assembly.

[0021] In one embodiment, the rack is a marble rack.

[0022] The wafer back side defect detection device of the present application can provide multi-angle dark field light to illuminate the defects on the back side of the wafer from different angles, thereby achieving better dark field imaging effects and improving the accuracy of the detection results.

[0023] The wafer back side defect detection device of the present application only requires a set of line scan visual detection components and area array visual detection components to realize the detection of the back side of the wafer, which can reduce the cost of wafer back side detection equipment, improve economic benefits and save materials. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 A front perspective schematic diagram of a wafer backside defect detection device provided by an embodiment of the present application;

[0025] Figure 2 A rear perspective schematic diagram of a wafer backside defect detection device according to the above embodiment of the present application is shown;

[0026] Figure 3 A three-dimensional schematic diagram of a first translation assembly of the wafer backside defect detection device according to the above embodiment of the present application is shown;

[0027] Figure 4 A three-dimensional schematic diagram of a detection mechanism of a wafer backside defect detection device according to the above embodiment of the present application is shown;

[0028] Figure 5A three-dimensional schematic diagram of a multi-angle dark field light source mechanism of a wafer backside defect detection device according to the above embodiment of the present application is shown;

[0029] Figure 6 A schematic diagram of the steps of a wafer backside defect detection method provided by an embodiment of the present application;

[0030] Figure 7 A schematic diagram of step S300 of the wafer back side defect detection method according to the above embodiment of the present application is shown.

[0031] Figure numerals: 10, frame; 20, bearing mechanism; 30, first translation mechanism; 31, linear slide rail; 32, slider; 33, linear motor; 34, limit block; 35, grating ruler; 36, drag chain assembly; 40, second translation mechanism; 50, detection mechanism; 51, connecting bracket; 52, line scan vision detection assembly; 521, line scan lens; 522, line scan camera; 523, linear light source; 53, area array vision detection assembly; 531, area array lens; 532, area array camera; 533, focusing module; 60, multi-angle dark field light source mechanism; 61, multi-angle reflection assembly; 611, fixed box; 612, reflection member; 613, through gap; 614, reflection surface; 615, cooling pipeline. DETAILED DESCRIPTION

[0032] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the specific embodiments of the present invention are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present invention. However, the present invention can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present invention, so the present invention is not limited by the specific embodiments disclosed below.

[0033] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0034] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the present invention, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0035] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0036] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0037] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used herein are for illustrative purposes only and are not intended to be the only implementation method.

[0038] Based on the problem that the dark field imaging effect of the existing wafer inspection equipment is poor, the present application provides a wafer back side defect inspection device and a wafer back side defect inspection method. The wafer back side defect inspection device can provide multi-angle dark field light to illuminate the defects on the back side of the wafer from different angles, thereby achieving better dark field imaging effect and improving the accuracy of the inspection results.

[0039] For details, please refer to Figure 1 , Figure 2 and Figure 4In some embodiments, the wafer back defect detection device of the present application may include a frame 10, a supporting mechanism 20, a first translation mechanism 30, a second translation mechanism 40, a detection mechanism 50 and a multi-angle dark field light source mechanism 60. The supporting mechanism 20 is used to fix the supporting mechanism 20 of the wafer, the first translation mechanism 30 is arranged on the frame 10, the supporting mechanism 20 is arranged on the first translation mechanism 30, and the first translation mechanism 30 can drive the supporting mechanism 20 to move forward or reversely along the first translation direction. The second translation mechanism 40 is arranged on the second translation mechanism 40 of the frame 10, and the first translation direction of the first translation mechanism 30 is perpendicular to the second translation direction of the second translation mechanism 40. The detection mechanism 50 may include a connecting frame, a line scan visual detection component 52 and a planar array visual detection component 53, the line scan visual detection component 52 is connected to one side of the connecting bracket 51, and the planar array visual detection component 53 is connected to the other side of the connecting bracket 51. The connecting bracket 51 is disposed on the second translation mechanism 40 , and the second translation mechanism 40 can drive the detection mechanism 50 to move forward or backward along the second translation direction. The detection mechanism 50 is disposed below the carrying mechanism 20 , so that the back side of the wafer faces the detection mechanism 50 .

[0040] The multi-angle dark field light source mechanism 60 may include a multi-angle reflection component 61 and a dark field light source. The multi-angle reflection component 61 is fixed to the frame 10 and located above the line scan visual detection component 52. The dark field light source is arranged in the multi-angle reflection component 61. The multi-angle reflection component 61 has a plurality of reflection surfaces 614 arranged at different angles facing the supporting mechanism 20 and a through slit 613 extending along the second translation direction. The through slit 613 is located above the line scan visual detection component 52, so that the line scan visual detection component 52 can pass through the through slit 613 to detect the back side of the wafer. The area array visual detection component 53 is located outside the multi-angle reflection component 61, and can avoid the multi-angle reflection component 61 to detect the back side of the wafer.

[0041] It is understandable that when the dark field light source irradiates the dark field light to the multi-angle reflection component 61, each reflection surface 614 of the multi-angle reflection component 61 can reflect the dark field light to the back side of the wafer at different angles to illuminate the defects on the back side of the wafer from different angles.

[0042] For example, taking the front-to-back direction as the first translation direction and the left-to-right direction as the second translation direction, when the wafer is fixed on the carrier mechanism 20, the back of the wafer faces the detection mechanism 50, and the detection mechanism 50 can be driven to move to the right by the second translation mechanism 40, so that the line scan visual detection component 52 and the area array visual detection component 53 move to the right synchronously and detect the back of the wafer, thereby outputting a strip image from left to right. Then, the carrier mechanism 20 is driven to move forward by the first translation mechanism 30 to drive the wafer forward, and the part to be detected is placed above the detection mechanism 50, and then the detection mechanism 50 is driven to move to the right by the second translation mechanism 40, so that the line scan visual detection component 52 and the area array visual detection component 53 move to the right simultaneously and detect the back of the wafer, thereby outputting a strip image from right to left. By repeating the above operation, the carrier mechanism 20 is gradually moved forward, and the line scan visual detection component 52 and the area array visual detection component 53 are alternately scanned left and right, and a strip image is output to achieve full coverage detection of the back side of the entire wafer. By subsequently splicing the strip images and classifying and counting the defects on the back side of the wafer, wafers that do not meet the conditions can be detected to prevent them from entering the subsequent process. In addition, only one set of line scan visual detection components 52 and area array visual detection components 53 is needed to detect the back side of the wafer, which can reduce the cost of wafer back side detection equipment, improve economic benefits, and save materials.

[0043] Alternatively, if Figure 4 As shown, in some embodiments, the line scan visual inspection component 52 may include a line scan lens 521, a line scan camera 522, and a linear light source 523, which are respectively fixed to the connecting bracket 51. The linear light source 523, the line scan lens 521, and the line scan camera 522 are arranged in sequence from top to bottom. The linear light source 523 can emit linear light, which can pass through the slit 613 to illuminate the back side of the wafer. The line scan camera 522 has high precision and can continuously scan the back side of the wafer line by line during translation.

[0044] Alternatively, if Figure 4 As shown, in some embodiments, the area array visual inspection component 53 includes an area array lens 531, an area array camera 532 connected to the bottom of the area array lens 531, and a focusing module 533 fixed to the connecting bracket 51, and the area array lens 531 and the area array camera 532 are arranged on the focusing module 533. The area array camera 532 has high precision and can continuously scan the back side of the wafer during the translation process. The focusing module 533 can drive the area array camera 532 to translate up and down, and can automatically adjust the distance between the area array camera 532 and the wafer according to the focusing distance, thereby realizing automatic focusing, so that the area array camera 532 can scan the back side of the wafer more clearly.

[0045] Alternatively, if Figure 3 As shown, in some embodiments, the first translation mechanism 30 includes a pair of linear slide rails 31, a plurality of sliders 32, and a linear motor 33. The two linear slide rails 31 are fixedly arranged on the frame 10 at intervals and extend along the first translation direction. The plurality of sliders 32 are slidably arranged on the linear slide rails 31, and the plurality of sliders 32 are fixedly connected to both sides of the supporting mechanism 20. The linear motor 33 is fixedly arranged on the frame 10, and the linear motor 33 is drivably connected to one side of the supporting mechanism 20. In this way, the linear slide rails 31 can support the two ends of the supporting mechanism 20 respectively. Through the cooperation of the sliders 32 and the slide rails, the supporting mechanism 20 can move more smoothly. When the linear motor 33 drives the supporting mechanism 20, the supporting mechanism 20 can slide forward or backward along the first direction.

[0046] Preferably, if Figure 3 As shown, in some embodiments, the first translation mechanism 30 includes a pair of limit blocks 34, the linear motor 33 is arranged on the inner side of one of the linear slide rails 31, and the limit blocks 34 are respectively arranged at both ends of the linear slide rail 31 provided with the linear motor 33, which can limit the sliding stroke of the slider 32, thereby limiting the translation of the supporting mechanism 20 within the stroke range.

[0047] Preferably, if Figure 3 As shown, in some embodiments, the first translation mechanism 30 further includes a grating ruler 35 fixed to the outer side of one of the linear slide rails 31, and the grating ruler 35 extends along the first translation direction. The grating ruler 35 can feedback the actual position of the supporting mechanism 20, and can cooperate with the linear motor 33 to achieve high-precision control of the position of the supporting mechanism 20.

[0048] Preferably, if Figure 3 As shown, in some embodiments, the first translation mechanism 30 further includes a drag chain assembly 36, which is arranged between the frame 10 and the linear motor 33, and the wiring harness of the linear motor 33 is arranged in the drag chain assembly 36 to follow, limit and protect the wiring harness when the linear motor 33 translates with the supporting mechanism 20.

[0049] It is worth noting that the second translation mechanism 40 may also adopt a structure similar to that of the first translation mechanism 30, which will not be described in detail in this application.

[0050] Alternatively, if Figure 5As shown, in some embodiments, the multi-angle reflective assembly 61 may include a fixed box 611 fixed to the frame 10 and two groups of reflective members 612 fixed to the fixed box 611 at intervals, the interval between the two groups of reflective members 612 is the through slit 613, each group of the reflective members 612 includes a plurality of reflective members 612 fixed in the fixed box 611 at different angles, and the reflective member 612 has the reflective surface 614. The reflective member 612 may be made of metal material to form the reflective surface 614.

[0051] Preferably, if Figure 5 As shown, in some embodiments, the multi-angle reflection assembly 61 further includes a cooling pipeline 615, and the cooling pipeline 615 is fixed to the side of the fixed frame to cool the multi-angle dark field light source mechanism 60.

[0052] Optionally, in some embodiments, the rack 10 of the present application may be implemented as a marble rack. Marble has good stability and high precision, which can make the detection result more accurate.

[0053] For further information, please refer to Figure 6 The wafer back side defect detection method of the present application can detect the back side of the wafer by using the above-mentioned wafer back side defect detection device. The wafer back side defect detection method can include the following steps:

[0054] S100, fixing the wafer to be tested by a carrying mechanism;

[0055] S200, irradiating the back side of the wafer at different angles with dark field light emitted by the dark field light source of the multi-angle dark field light source mechanism through multiple reflective surfaces at different angles of the multi-angle dark field light source mechanism; and

[0056] S300, the supporting mechanism and the detection mechanism are driven to move respectively by the first translation mechanism and the second translation mechanism, so that the line scan vision detection component and the area array vision detection component of the detection mechanism detect the back side of the wafer.

[0057] It can be understood that the wafer back side defect detection method of the present application can make the dark field imaging clearer, have better imaging effect, and make the detection result more accurate by irradiating the dark field light to the back side of the wafer at different angles.

[0058] Preferably, if Figure 7 As shown, in some embodiments, the step of S300, respectively driving the carrying mechanism and the detection mechanism to move by the first translation mechanism and the second translation mechanism, so that the line scan visual detection component and the area array visual detection component of the detection mechanism detect the back side of the wafer, may include the following steps:

[0059] S310, driving the detection mechanism to move a set length distance in the positive direction along the second translation direction through the second translation mechanism, so that the line scan visual detection component passes through the slit of the multi-angle dark field light source mechanism to detect the back side of the wafer, and the area array visual detection component detects the back side of the wafer to output a positive strip image;

[0060] S320, driving the bearing mechanism to move forward along the first translation direction by the first translation mechanism to a set width;

[0061] S330, driving the detection mechanism to move the set length in the reverse direction along the second translation direction through the second translation mechanism, so that the line scan visual detection component passes through the slit of the multi-angle dark field light source mechanism to detect the back side of the wafer, and the area array visual detection component detects the back side of the wafer to output a reverse strip image;

[0062] S340, driving the bearing mechanism to move forward in the first translation direction by the first translation mechanism to a set width;

[0063] S350, repeat the above steps until the detection is completed.

[0064] It can be understood that by repeating steps S310 to S340, multiple positive strip images and reverse strip images can be obtained, and by sequentially splicing the positive strip images and reverse strip images, the back side of the wafer can be fully covered. In this way, only one set of line scan visual inspection components 52 and area array visual inspection components 53 are needed to detect the back side of the wafer, which can reduce the cost of wafer back side inspection equipment, improve economic benefits, and save materials.

[0065] It is worth noting that in step S310, the set movement length distance is at least greater than the diameter of the wafer, and in step S320, the set width distance is generally the width of the light-passing slit.

[0066] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0067] The above-mentioned embodiments only express several implementation methods of the present invention, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the attached claims.

Claims

1. A wafer backside defect detection device, characterized in that: include: frame; A carrying mechanism, the carrying mechanism is used to fix the wafer; a first translation mechanism, wherein the first translation mechanism is arranged on the frame, and the bearing mechanism is arranged on the first translation mechanism; a second translation mechanism, wherein the second translation mechanism is arranged on the frame, and a first translation direction of the first translation mechanism is perpendicular to a second translation direction of the second translation mechanism; A detection mechanism, the detection mechanism is arranged below the carrying mechanism, and the detection mechanism includes a connecting bracket arranged on the second translation mechanism, a line scan vision detection component connected to one side of the connecting bracket, and an area array vision detection component connected to the other side of the connecting bracket; as well as A multi-angle dark field light source mechanism, the multi-angle dark field light source mechanism includes a multi-angle reflection component fixed to the frame and located above the line scan vision detection component and a dark field light source arranged on the multi-angle reflection component, the multi-angle reflection component has a plurality of reflection surfaces facing the supporting mechanism and arranged at different angles and a through slot extending along the second translation direction, the through slot is located above the line scan vision detection component, and the area array vision detection component is located on the outside of the multi-angle reflection component.

2. The wafer back side defect detection device according to claim 1, characterized in that: The line scan visual detection component includes a line scan lens, a line scan camera and a linear light source, which are respectively fixed to the connecting bracket, and the linear light source, the line scan lens and the line scan camera are arranged in sequence from top to bottom.

3. The wafer back side defect detection device according to claim 1, characterized in that: The area array visual detection component includes an area array lens, an area array camera connected below the area array lens, and a focusing module fixed to the connecting bracket, and the area array lens and the area array camera are arranged on the focusing module.

4. The wafer back side defect detection device according to any one of claims 1 to 3, characterized in that: The first translation mechanism includes a pair of linear slide rails fixed to the frame at intervals and extending along the first translation direction, a plurality of sliders slidably arranged on the linear slide rails, and a linear motor fixed to the frame. The plurality of sliders are respectively fixedly connected to both sides of the supporting mechanism, and the linear motor is drivably connected to one side of the supporting mechanism.

5. The wafer back side defect detection device according to claim 4, characterized in that: The first translation mechanism includes a pair of limit blocks. The linear motor is arranged on the inner side of one of the linear slide rails. The limit blocks are respectively arranged at two ends of the linear slide rail on which the linear motor is arranged.

6. The wafer back side defect detection device according to claim 4, characterized in that: The first translation mechanism further includes a grating ruler fixedly arranged on the outer side of one of the linear slide rails, and the grating ruler extends along the first translation direction.

7. The wafer back side defect detection device according to any one of claims 1 to 3, characterized in that: The multi-angle reflection assembly includes a fixed box fixed to the frame and two groups of reflection components fixed to the fixed box at intervals, the interval between the two groups of reflection components is the through gap, each group of reflection components includes a plurality of reflection components fixed in the fixed box at different angles, and the reflection components have the reflection surface.

8. The wafer back side defect detection device according to claim 7, characterized in that: The multi-angle reflection assembly further includes a cooling pipeline, and the cooling pipeline is fixedly arranged on the side of the fixed box.

9. The wafer back side defect detection device according to any one of claims 1 to 3, characterized in that: The first translation mechanism further includes a drag chain assembly, which is arranged between the frame and the linear motor, and the wiring harness of the linear motor is arranged in the drag chain assembly.

10. The wafer back side defect detection device according to any one of claims 1 to 3, characterized in that: The rack is a marble rack.

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