Wafer reliability test structure, device and equipment

Abstract

The invention provides a wafer reliability test structure, device and equipment. The wafer reliability test structure comprises a substrate, and a power supply module, a control module, a switching module, a heating structure and a measuring plate which are arranged on the substrate, wherein the power supply module and the control module are respectively and fixedly arranged on the substrate, the switching module and the measuring plate are arranged on the substrate in a plugging manner, the heating structure is arranged in a top area of the switching module, and the heating structure is connected with the control module so as to heat a wafer to be measured connected with a first contact of the switching module; a second contact of the switching module is connected with the power supply module, and the power supply module is connected with the control module to supply power to the wafer to be tested; and a third contact of the switching module is connected with a preset test circuit on the measuring plate, and the preset test circuit is also connected with the control module so as to perform reliability test of corresponding functions of the preset test circuit on the wafer to be tested. Therefore, maintenance and replacement by a user are facilitated, and the structural space is saved.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and in particular to a wafer reliability testing structure, device and equipment. Background Art

[0002] The third generation of semiconductor materials is a type of wide bandgap semiconductor material that is different from the first generation of semiconductor materials silicon and germanium, and the second generation of semiconductor materials indium phosphide and arsenide. Due to the wide bandgap characteristics of the third generation of semiconductor materials, it has superior properties such as high breakdown electric field, high thermal conductivity, high electron saturation rate, and strong radiation resistance, so it is particularly suitable for manufacturing high temperature, high pressure, and high power semiconductor devices.

[0003] In recent years, wide bandgap semiconductor materials have been widely used in the manufacture of power electronic devices. Wide bandgap semiconductor devices represented by silicon carbide power devices are replacing traditional silicon-based devices and are widely used in DC-DC converters, photovoltaic inverters, motor drives and other scenarios. However, due to the differences in the properties of semiconductor materials (the surface of silicon carbide wafers is rougher, the diameter is smaller, and the hardness is close to diamond), the production and manufacturing of silicon carbide power devices faces greater challenges and the yield rate of production is low. Since the silicon carbide power module contains multiple chips inside, the failure of one chip will affect the entire module. Therefore, wafer-level reliability screening can greatly improve the yield rate of the packaged module and reduce the cost caused by module failure. Silicon carbide wafer reliability test equipment is a special equipment for high-temperature reliability screening of silicon carbide power chips at the wafer stage, which is an urgent need for power semiconductor packaging and testing manufacturers. HTGB and HTRB tests are conventional tests for reliability screening. The test adds gate bias or reverse bias to the main blocking junction of the device under test at high temperature with a voltage close to the maximum rated voltage to assess the leakage current change of the device under high temperature and long-term reverse bias voltage.

[0004] In response to this demand, different types of wafer reliability testing equipment have emerged on the market. Existing equipment is difficult to repair due to technical difficulties and limited size. Summary of the invention

[0005] The purpose of the present invention is to address the deficiencies in the above-mentioned prior art and provide a wafer reliability test structure, device and equipment to solve the problems of difficulty in board repair in the prior art.

[0006] To achieve the above purpose, the technical solution adopted in the embodiment of the present application is as follows: In a first aspect, an embodiment of the present application provides a wafer reliability test structure, comprising: a substrate, and a power module, a control module, a switching module, a heating structure, and a measurement board arranged on the substrate; The power module and the control module are respectively fixedly arranged on the substrate, the adapter module and the measuring board are pluggably arranged on the substrate, the heating structure is arranged in the top area of ​​the adapter module, and the heating structure is connected to the control module to heat the wafer to be measured connected to the first contact of the adapter module; The second contact of the adapter module is connected to the power module, and the power module is connected to the control module to supply power to the wafer to be tested; the third contact of the adapter module is connected to the preset test circuit on the measurement board, and the preset test circuit is also connected to the control module to perform reliability test of the corresponding function of the preset test circuit on the wafer to be tested.

[0007] Optionally, the wafer reliability test structure further includes: a drawer-type bottom plate, the drawer-type bottom plate is pluggably arranged on the substrate, the measurement board is fixedly arranged on the drawer-type bottom plate, and the adapter module is slidably arranged on the drawer-type bottom plate.

[0008] Optionally, the heating structure includes: a pneumatic structure, and the control module is connected to the pneumatic structure to control the pneumatic structure to press downward so that the adapter module contacts a preset heating platform to heat the wafer to be tested.

[0009] Optionally, the preset test circuit includes: a test circuit for at least two test functions; the wafer reliability test structure also includes: a switching board, on which a function switching circuit is provided, and the function switching circuit connects the test circuits for the at least two test functions.

[0010] Optionally, the switching board is also provided with: an overcurrent protection circuit and a discharge circuit, the power supply module is connected to the discharge circuit via the overcurrent protection circuit, and the discharge circuit is connected to the second contact of the adapter module to supply power to the wafer to be tested.

[0011] Optionally, the preset test circuit further includes: at least two switch units, and the at least two switch units are respectively connected to the test circuits of the at least two test functions.

[0012] Optionally, the number of the measurement boards is at least two, and different measurement boards are respectively provided with test circuits with different test functions, and at least two measurement boards are pluggably arranged at different positions of the adapter module on the substrate.

[0013] Optionally, the test circuits of the at least two test functions include: a high temperature aging test circuit, a high temperature reverse bias test circuit, and a high temperature gate bias test circuit.

[0014] In a second aspect, an embodiment of the present application provides a wafer reliability testing device, which includes multiple wafer reliability testing structures for performing reliability tests on multiple wafers at the same time; the wafer reliability testing structure is any one of the wafer reliability testing structures described in the first aspect above.

[0015] In a third aspect, an embodiment of the present application provides a wafer reliability testing device, which includes: a housing, and the wafer reliability testing device described in the second aspect above, which is arranged in the housing.

[0016] Compared with the prior art, this application has the following beneficial effects: The present application provides a wafer reliability test structure, device and equipment, the wafer reliability test structure includes: a substrate, and a power module, a control module, a switching module, a heating structure and a measuring board arranged on the substrate; wherein the power module and the control module are respectively fixedly arranged on the substrate, the switching module and the measuring board are pluggable and arranged on the substrate, the heating structure is arranged in the top area of ​​the switching module, the heating structure is connected to the control module to heat the wafer to be tested connected to the first contact of the switching module; the second contact of the switching module is connected to the power module, and the power module is connected to the control module to supply power to the wafer to be tested; the third contact of the switching module is connected to the preset test circuit on the measuring board, and the preset test circuit is also connected to the control module to perform reliability test of the corresponding function of the preset test circuit on the wafer to be tested. Thus, by setting the wafer reliability test structure, it is convenient for users to carry out maintenance and replacement, and saves structural space. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for use in the embodiments are briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without creative work.

[0018] Figure 1 A schematic top view of a wafer reliability test structure provided in an embodiment of the present application; Figure 2 A schematic front view of a wafer reliability test structure provided in an embodiment of the present application; Figure 3 A structure diagram of a wafer reliability test circuit provided in an embodiment of the present application.

[0019] Icon: 1-power module, 2-control module, 3-transfer module, 4-heating structure, 5-measurement board, 6-drawer-type bottom plate, 7-switch board. DETAILED DESCRIPTION

[0020] In order to make the purpose, technical scheme and advantages of the embodiments of the present invention clearer, the technical scheme in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. The components of the embodiments of the present application described and shown in the drawings here can be arranged and designed in various different configurations.

[0021] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the present application for protection, but merely represents selected embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present application.

[0022] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0023] In addition, the terms “first”, “second”, etc., if used, are merely used to distinguish between the descriptions and should not be understood as indicating or implying relative importance.

[0024] It should be noted that, in the absence of conflict, the features in the embodiments of the present invention may be combined with each other.

[0025] The following is an explanation of a wafer reliability test structure provided in an embodiment of the present application through a specific example. Figure 1 A schematic top view of a wafer reliability test structure provided in an embodiment of the present application. Figure 2 A front view schematic diagram of a wafer reliability test structure provided in an embodiment of the present application.

[0026] like Figure 1 , Figure 2 As shown, the wafer reliability test structure includes: a substrate, and a power module 1, a control module 2, a switching module 3, a heating structure 4 and a measurement board 5 arranged on the substrate.

[0027] Among them, the power module 1 and the control module 2 are respectively fixedly arranged on the substrate, the adapter module 3 and the measuring board 5 are pluggably arranged on the substrate, the heating structure 4 is arranged in the top area of ​​the adapter module 3, and the heating structure 4 is connected to the control module 2 to heat the wafer to be tested connected to the first contact of the adapter module 3. For example, the heating structure 4 can be composed of a motion mechanism to perform a downward pressing action under the control of the control module 2 to contact the wafer to be tested connected to the adapter module 3 to achieve heating of the wafer to be tested.

[0028] The second contact of the adapter module 3 is connected to the power module 1, and the power module 1 is connected to the control module 2 to supply power to the wafer to be tested; the third contact of the adapter module 3 is connected to the preset test circuit on the measurement board 5, and the preset test circuit is also connected to the control module 2 to perform reliability test of the corresponding function of the preset test circuit on the wafer to be tested.

[0029] like Figure 1 As shown, the power module 1 is arranged at the upper left corner of the substrate, the control module 2 is arranged at the upper right corner of the substrate, the measuring board 5 is located at the lower part of the substrate, and the adapter module 3 and the heating structure 4 are located in the middle of the lower part of the substrate. The above components are fixed on the substrate by structural members, which saves structural space.

[0030] The adapter module 3 and the measuring board 5 are pluggable on the substrate. When the user performs routine maintenance on the wafer reliability test structure, the adapter module 3 and the measuring board 5 can be quickly unplugged for rapid repair and replacement. The preset test circuit is integrated into the measuring board 5, saving structural space.

[0031] By way of example, the wafer to be tested is a power semiconductor wafer. The adapter module 3 is a probe card, which is used to connect the pins of the wafer to be tested and make the connection of the pins tighter, thereby improving the test accuracy.

[0032] By way of example, the power module 1 includes at least one low voltage source and one high voltage source to provide different voltages to the wafer to be tested under different test functions.

[0033] Before the wafer test is performed, the wafer to be tested is placed in the adapter module 3, the pins of the wafer to be tested are connected to the first contacts of the adapter module 3, and the wafer to be tested and the adapter module 3 form a whole. The heating structure 4 is arranged in the top area of ​​the adapter module 3 so that the heating effect of the heating structure 4 can just act on the wafer to be tested. The wafer to be tested is connected to the power module 1 through the first contact and the second contact of the adapter module 3, and the wafer to be tested is connected to the preset test circuit on the measurement board 5 through the first contact and the third contact of the adapter module 3.

[0034] When performing wafer testing, the control module 2 supplies power to the power module 1, the heating structure 4, and the measuring board 5. The control module 2 sends test instructions to the power module 1, the heating structure 4, and the measuring board 5. The power module 1 supplies power to the wafer to be tested, the heating structure 4 heats the wafer to be tested, and the preset test circuit on the measuring board 5 collects the electrical signal of the wafer to be tested, and the measuring board 5 feeds back the collected electrical signal to the control module 2. The control module 2 uploads the collected electrical signal to the host, and the host determines the test result of the wafer to be tested based on the collected electrical signal, and finally displays it on the computer screen for the user to view.

[0035] In summary, in this embodiment, the wafer reliability test structure includes: a substrate, and a power module, a control module, a switching module, a heating structure and a measuring board arranged on the substrate; wherein the power module and the control module are respectively fixedly arranged on the substrate, the switching module and the measuring board are pluggable and arranged on the substrate, the heating structure is arranged in the top area of ​​the switching module, the heating structure is connected to the control module to heat the wafer to be tested connected to the first contact of the switching module; the second contact of the switching module is connected to the power module, and the power module is connected to the control module to supply power to the wafer to be tested; the third contact of the switching module is connected to the preset test circuit on the measuring board, and the preset test circuit is also connected to the control module to perform reliability test of the corresponding function of the preset test circuit on the wafer to be tested. Thus, by setting the wafer reliability test structure, it is convenient for users to repair and replace, and saves structural space.

[0036] Continuing to refer to the above embodiments and drawings, in another embodiment of the present application, the wafer reliability test structure also includes: a drawer-type bottom plate 6, the drawer-type bottom plate 6 is pluggable and arranged on the substrate, the measurement board 5 is fixedly arranged on the drawer-type bottom plate 6, and the adapter module 3 is slidably arranged on the drawer-type bottom plate 6.

[0037] The drawer-type bottom plate 6 can be plugged in and out on the base plate by sliding. By setting up the drawer-type bottom plate 6, the measuring board 5 and the adapter module 3 can be plugged in and out and moved from the base plate, which serves as a quick plug-in maintenance structure, making it convenient for users to repair and replace the measuring board 5.

[0038] By slidingly setting the adapter module 3 on the drawer-type bottom plate 6, the user can move the adapter module 3 to the outside of the wafer reliability test structure, so as to facilitate the installation of the wafer to be tested into the adapter module 3. After the wafer to be tested is installed in the adapter module 3, the adapter module 3 is pushed into the wafer reliability test structure, thereby improving the operation efficiency.

[0039] In summary, in this embodiment, the wafer reliability test structure further includes: a drawer-type bottom plate, the drawer-type bottom plate is pluggable and arranged on the substrate, the measurement board is fixedly arranged on the drawer-type bottom plate, and the adapter module is slidably arranged on the drawer-type bottom plate. Thus, it is convenient for maintenance and replacement, and the operation efficiency is improved.

[0040] Continuing to refer to the above embodiments and drawings, in another embodiment of the present application, the heating structure 4 includes: a pneumatic structure, the control module 2 is connected to the pneumatic structure to control the pneumatic structure to press down so that the adapter module 3 contacts the preset heating platform to heat the wafer to be tested.

[0041] The pneumatic structure includes multiple cylinders, and the control module 2 controls the multiple cylinders so that the multiple cylinders are inflated and pressed down to act on the wafer to be tested, so that the contact points of the wafer to be tested and the adapter module 3 are more closely contacted, thereby improving the test accuracy of the entire wafer reliability test structure. In addition, by closely contacting the heating structure 4 with the adapter module 3 and the wafer to be tested, the test aging temperature of the test structure is increased, and the aging temperature can be increased to a maximum of 200°C.

[0042] In summary, in this embodiment, the heating structure includes: a pneumatic structure, and the control module is connected to the pneumatic structure to control the pneumatic structure to press down so that the adapter module contacts the preset heating platform to heat the wafer to be tested. Thus, the test accuracy is improved and the test aging temperature of the test structure is increased.

[0043] Continuing to refer to the above embodiments and drawings, in another embodiment of the present application, the preset test circuit includes: a test circuit with at least two test functions; the wafer reliability test structure also includes: a switching board 7, on which a function switching circuit is provided, and the function switching circuit connects the test circuits with at least two test functions.

[0044] By setting at least two test circuits for test functions, the test scenario can be expanded. The control module 2 sends the test instruction to the function switching circuit in the switch board 7, determines the test function, and controls the corresponding test circuit to work to complete the test task.

[0045] For example, the function switching circuit in the switching board 7 is connected to the test circuit in the measuring board 5 via a cable.

[0046] In summary, in this embodiment, the preset test circuit includes: a test circuit with at least two test functions; the wafer reliability test structure also includes: a switch board, on which a function switch circuit is provided, and the function switch circuit connects the test circuit with at least two test functions. Thus, the test scenario is expanded.

[0047] Continuing to refer to the above embodiments and drawings, in another embodiment of the present application, the switching board 7 is also provided with: an overcurrent protection circuit and a discharge circuit, the power module 1 is connected to the discharge circuit through the overcurrent protection circuit, and the discharge circuit is connected to the second contact of the adapter module 3 to supply power to the wafer to be tested.

[0048] By setting up an overcurrent protection circuit, overvoltage and other situations can be avoided during the test process, thus protecting the entire test circuit and test structure and effectively preventing unexpected situations during the test process.

[0049] In summary, in this embodiment, the switch board is further provided with: an overcurrent protection circuit and a discharge circuit, the power module is connected to the discharge circuit via the overcurrent protection circuit, and the discharge circuit is connected to the second contact of the adapter module to supply power to the wafer to be tested, thereby protecting the entire test circuit and test structure.

[0050] Continuing to refer to the above embodiments and drawings, in another embodiment of the present application, the preset test circuit further includes: at least two switch units, and the at least two switch units are respectively connected to the test circuits of at least two test functions.

[0051] The switch unit is connected to the path of the test circuit, and the control module 2 controls the on / off of the switch unit to realize different test functions in the control test circuit, thereby improving the test efficiency.

[0052] In summary, in this embodiment, the preset test circuit also includes: at least two switch units, at least two switch units are respectively connected to the test circuits of at least two test functions, enriching the reliability test scenarios, thereby realizing flexible test control of multiple test functions and improving test efficiency.

[0053] Continuing to refer to the above embodiments and drawings, in another embodiment of the present application, the number of measuring boards 5 is at least two, different measuring boards 5 are respectively provided with test circuits with different test functions, and at least two measuring boards 5 are pluggable and arranged at different positions of the adapter module 3 on the substrate.

[0054] By providing a plurality of measuring boards 5 , the test circuits with a plurality of test functions can be expanded, the structural space can be fully utilized, and the space utilization rate can be improved.

[0055] In summary, in this embodiment, the number of the measuring boards is at least two, different measuring boards are respectively provided with test circuits with different test functions, and at least two measuring boards are pluggably arranged at different positions of the adapter module on the substrate, thereby making full use of the structural space and improving the space utilization rate.

[0056] In another embodiment of the present application, the test circuit with at least two test functions includes: a high temperature aging test circuit, a high temperature reverse bias test circuit, and a high temperature gate bias test circuit.

[0057] Based on the above embodiments, another embodiment of the present application further provides a wafer reliability testing circuit. Figure 3 A structure diagram of a wafer reliability test circuit provided in an embodiment of the present application.

[0058] like Figure 3As shown, when the wafer to be tested is tested, the control module 2 supplies power to all boards except the wafer to be tested, and the control module 2 controls the cylinder in the heating structure 4 to inflate and press down, so that the contacts on the adapter module 3 are connected to all the test circuits on the measuring board 5 through contact adapter, and controls the heating structure 4 to heat the wafer to be tested and the adapter module 3. The adapter module 3 sends different test category controls to the power module 1, the measuring board 5, and the switching board 7. The power module 1 provides voltage and current, and the switching board 7 performs the actual test mode switching operation and protects against sudden failure conditions in the circuit. After the wafer to be tested obtains voltage and current, the preset test circuit on the measuring board 5 collects the electrical signal of the wafer to be tested, and the measuring board 5 feeds back the collected electrical signal to the control module 2. The control module 2 uploads the collected electrical signal to the host, and the host determines the test result of the wafer to be tested based on the collected electrical signal, and finally displays it on the computer screen for the user to view.

[0059] The following is an explanation of a wafer reliability test device provided in an embodiment of the present application through a specific embodiment. The wafer reliability test device includes multiple wafer reliability test structures for performing reliability tests on multiple wafers at the same time; the wafer reliability test structure is any of the wafer reliability test structures in the above embodiments.

[0060] For example, multiple wafer reliability test structures are vertically installed inside the wafer reliability test device, and each wafer reliability test structure serves as a layer of the wafer reliability test device. The multiple wafer reliability test structures are independent of each other and can independently complete the wafer test work. For example, the number of multiple wafer reliability test structures can be greater than or equal to 6. Specifically, the number of wafer reliability test structures can be set according to the test requirements, thereby increasing the number of wafers that can be tested.

[0061] In summary, in this embodiment, the wafer reliability test device includes multiple wafer reliability test structures for simultaneously performing reliability tests on multiple wafers; the wafer reliability test structure is any of the wafer reliability test structures in the above embodiments, thereby increasing the number of wafers that can be tested.

[0062] The following is an explanation of a wafer reliability testing device provided in an embodiment of the present application through a specific example.

[0063] The wafer reliability testing device comprises: a housing, and the wafer reliability testing device of the above embodiment arranged in the housing. Thus, by setting the wafer reliability testing structure, it is convenient for users to perform maintenance and replacement, saves structural space, and increases the number of wafers that can be tested.

[0064] It should be noted that each component and the connection method between the components in the present application are prior arts and are not described in detail to avoid confusion.

[0065] The above description is only the preferred embodiment of the present application, and is not intended to limit the present application. For those skilled in the art, the present application may have various changes and variations. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present application shall be included in the protection scope of the present application. It should be noted that similar numbers and letters represent similar items in the following drawings, so once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings. The above description is only the preferred embodiment of the present application, and is not intended to limit the present application. For those skilled in the art, the present application may have various changes and variations. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present application shall be included in the protection scope of the present application.

Claims

1. A wafer reliability test structure, characterized in that: include: A substrate, and a power module, a control module, a switching module, a heating structure and a measuring plate arranged on the substrate; The power module and the control module are respectively fixedly arranged on the substrate, the adapter module and the measuring board are pluggably arranged on the substrate, the heating structure is arranged in the top area of ​​the adapter module, and the heating structure is connected to the control module to heat the wafer to be measured connected to the first contact of the adapter module; The second contact of the adapter module is connected to the power module, and the power module is connected to the control module to supply power to the wafer to be tested; the third contact of the adapter module is connected to the preset test circuit on the measurement board, and the preset test circuit is also connected to the control module to perform reliability test of the corresponding function of the preset test circuit on the wafer to be tested.

2. The wafer reliability test structure according to claim 1, characterized in that: The wafer reliability test structure further includes: a drawer-type bottom plate, the drawer-type bottom plate is pluggably arranged on the substrate, the measurement board is fixedly arranged on the drawer-type bottom plate, and the adapter module is slidably arranged on the drawer-type bottom plate.

3. The wafer reliability test structure according to claim 1, characterized in that: The heating structure includes: a pneumatic structure, and the control module is connected to the pneumatic structure to control the pneumatic structure to press down so that the adapter module contacts a preset heating platform to heat the wafer to be tested.

4. The wafer reliability test structure according to claim 1, characterized in that: The preset test circuit includes: a test circuit with at least two test functions; the wafer reliability test structure also includes: a switching board, on which a function switching circuit is arranged, and the function switching circuit connects the test circuits with the at least two test functions.

5. The wafer reliability test structure according to claim 4, characterized in that: The switching board is also provided with: an overcurrent protection circuit and a discharge circuit, the power supply module is connected to the discharge circuit via the overcurrent protection circuit, and the discharge circuit is connected to the second contact of the adapter module to supply power to the wafer to be tested.

6. The wafer reliability test structure according to claim 4, characterized in that: The preset test circuit further includes: at least two switch units, and the at least two switch units are respectively connected to the test circuits of the at least two test functions.

7. The wafer reliability test structure according to claim 1, characterized in that: There are at least two measuring boards, and different measuring boards are respectively provided with test circuits with different test functions. At least two measuring boards are pluggably arranged at different positions of the adapter module on the substrate.

8. The wafer reliability test structure according to claim 4, characterized in that: The test circuits of the at least two test functions include: a high temperature aging test circuit, a high temperature reverse bias test circuit, and a high temperature gate bias test circuit.

9. A wafer reliability testing device, characterized in that: The wafer reliability testing device comprises a plurality of wafer reliability testing structures for performing reliability tests on a plurality of wafers simultaneously; the wafer reliability testing structure is the wafer reliability testing structure described in any one of claims 1 to 8 above.

10. A wafer reliability testing device, characterized in that: The wafer reliability testing equipment comprises: a housing, and the wafer reliability testing device according to claim 9 arranged in the housing.

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