An electron gun beam spot quality optimization device

Abstract

This application relates to an electron gun beam spot quality optimization device, including a beam quality optimization and control system and a beam spot morphology detection sensor. The beam spot morphology detection sensor contains a beam spot morphology detection substrate and a tungsten probe array, both connected to the beam quality optimization and control system. The beam quality optimization and control system is connected to the electron gun's image-eliminating coil and coaxial coil. The beam spot morphology detection substrate detects the beam spot morphology of the electron beam generated by the electron gun and transmits the detection results to the beam quality optimization and control system. The tungsten probe array detects the beam spot energy distribution of the electron beam and transmits the detection results to the beam quality optimization and control system. The beam quality optimization and control system adjusts the driving current of the image-eliminating coil according to the detection results from the beam spot morphology detection substrate to make the electron beam beam spot morphology circular; and adjusts the driving current of the coaxial coil according to the detection results from the tungsten probe array to make the electron beam spot energy exhibit a Gaussian distribution from the center outwards.

Description

Technical Field

[0001] This application relates to the field of electron gun processing technology, and in particular to an electron gun beam spot quality optimization device. Background Technology

[0002] An electron beam is a high-energy particle stream formed by the electrostatic convergence and electromagnetic focusing of electrons accelerated by a high-voltage electric field. It has crucial applications in welding, smelting, and additive manufacturing. Electron beams have very high energy density; upon bombarding a material surface, the kinetic energy of the electrons is converted into heat energy, achieving melting and bonding of the material. Good electron beam spot characteristics are a fundamental prerequisite for ensuring the quality of electron beam processing. Due to limitations such as cathode surface deformation and the machining precision of the electron gun, the beam spot morphology on the material surface is usually elliptical or irregular, and the energy center point is not at the center of the beam spot, making it difficult to obtain a high-quality electron beam processing process. However, current methods for effectively detecting electron beam spots are difficult, manual adjustment of the electron beam spot is very challenging, and the parameter values ​​adjusted by different operators vary greatly, making it difficult to achieve the required high-quality beam spot. Summary of the Invention

[0003] This application provides an electron gun beam spot quality optimization device, which solves the current problem of difficulty in effectively detecting and optimizing electron beam spots.

[0004] This application provides an electron gun beam spot quality optimization device, including a beam quality optimization and control system and a beam spot morphology detection sensor; the beam spot morphology detection sensor is provided with a beam spot morphology detection substrate and a tungsten probe array, which are respectively connected to the beam quality optimization and control system; the beam quality optimization and control system is respectively connected to the electron gun's image cancellation coil and coaxial coil.

[0005] The beam spot morphology detection substrate is used to detect the beam spot morphology of the electron beam generated by the electron gun and transmit the detection results to the beam quality optimization and control system; the tungsten probe array is used to detect the beam spot energy distribution of the electron beam and transmit the detection results to the beam quality optimization and control system.

[0006] The beam quality optimization and control system is used to adjust the driving current of the image-eliminating coil according to the detection results of the beam spot morphology detection substrate, so that the beam spot morphology of the electron beam is circular; and to adjust the driving current of the coaxial coil according to the detection results of the tungsten probe array, so that the beam spot energy of the electron beam is distributed in a Gaussian manner from the center to the periphery.

[0007] Furthermore, the beam quality optimization and control system includes a sampling circuit, a conversion circuit, and beam spot quality control software; the sampling circuit is connected to the beam spot morphology detection substrate, the tungsten probe array, and the conversion circuit, respectively; the conversion circuit is connected to the sampling circuit, the beam spot quality control software, the image cancellation coil, and the coaxial coil, respectively.

[0008] The sampling circuit is used to receive the detection results from the beam spot morphology detection substrate and the tungsten probe array respectively, and outputs the detection results to the beam spot quality control software after processing by the conversion circuit.

[0009] The beam spot quality control software is used to output a control signal for the image removal coil drive current based on the detection results of the beam spot morphology detection substrate, and to output a control signal for the coaxial coil drive current based on the detection results of the tungsten probe array.

[0010] Furthermore, multiple tungsten detection components are disposed on the beam spot morphology detection substrate, and each tungsten detection component is connected to the sampling circuit through a sampling resistor. The tungsten detection components are used to collect the beam current signal when the electron beam scans on the beam spot morphology detection substrate, and output the beam current signal to the sampling circuit through the sampling resistor.

[0011] Furthermore, the tungsten detection assembly includes two tungsten detection plates arranged in parallel, with ceramic insulating plates disposed on the outer sides of each tungsten detection plate; the tungsten detection plates are connected to the sampling circuit through a sampling resistor.

[0012] Furthermore, the tungsten probe array is ring-shaped and includes multiple tungsten probes that are uniformly distributed and located on the same plane; each tungsten probe is connected to the sampling circuit through a sampling resistor; the tungsten probes are used to collect the beam current signal when the electron beam passes through the middle of the tungsten probe array, and output the beam current signal to the sampling circuit through the sampling resistor.

[0013] Furthermore, the tungsten probe array is parallel to the coaxial coil and is on the same axis as the electron gun.

[0014] Furthermore, it also includes an image cancellation coil drive circuit and a coaxial coil drive circuit; the conversion circuit is connected to the image cancellation coil through the image cancellation coil drive circuit and to the coaxial coil through the coaxial coil drive circuit.

[0015] Furthermore, it also includes a scanning coil drive circuit; the beam spot morphology detection sensor is also equipped with a scanning coil, and the beam quality optimization and control system also includes a waveform generation circuit; the waveform generation circuit is connected to the scanning coil through the scanning coil drive circuit;

[0016] The waveform generation circuit is used to output the scanning waveform to the scanning coil drive circuit. The scanning coil drive circuit is used to adjust the drive current of the scanning coil. The scanning coil is used to control the electron beam to scan on the beam spot morphology detection substrate.

[0017] Furthermore, it also includes a focusing coil drive circuit; the conversion circuit is also connected to the focusing coil of the electron gun through the focusing coil drive circuit; the focusing coil drive circuit is used to adjust the drive current of the focusing coil.

[0018] Furthermore, a water-cooled target is also provided inside the beam spot morphology detection sensor. The water-cooled target is connected to the sampling circuit through a sampling resistor. The water-cooled target is used to receive the bombardment of the electron beam and remove the heat generated by the electron beam bombardment.

[0019] The above-mentioned technical solution of this application has the following advantages:

[0020] The electron gun beam spot quality optimization device provided in this application detects the beam spot morphology of the electron beam generated by the electron gun through a beam spot morphology detection substrate, detects the beam spot energy distribution of the electron beam through a tungsten probe array, and then adjusts the driving current of the image-eliminating coil according to the detection results of the beam spot morphology detection substrate through a beam current quality optimization and control system to make the beam spot morphology of the electron beam circular. According to the detection results of the tungsten probe array, the driving current of the coaxial coil is adjusted to make the beam spot energy of the electron beam exhibit a Gaussian distribution from the center to the periphery, thereby achieving the purpose of effectively detecting the electron beam spot and optimizing the quality of the electron beam spot. Attached Figure Description

[0021] To more clearly illustrate the technical solutions in the specific embodiments of this application or the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0022] Figure 1 A schematic diagram of the electron gun beam spot quality optimization device provided in this application;

[0023] Figure 2 This is a schematic diagram of the electron gun provided in this application;

[0024] Figure 3 This is a schematic diagram of the beam spot morphology detection substrate provided in this application;

[0025] Figure 4 This is a schematic diagram of the feature signal sampling provided in this application;

[0026] Figure 5 The value of the beam sampling signal obtained from the tungsten detector chip provided in this application.

[0027] Figure reference numerals: 1. Beam quality optimization and control system; 101. Conversion circuit; 102. Sampling circuit; 103. Waveform generation circuit; 104. Beam spot quality control software; 2. Electron beam; 3. Beam spot morphology detection substrate; 301. First ceramic insulating plate; 302. First tungsten detector; 303. Second tungsten detector; 304. Second ceramic insulating plate; 305. Third ceramic insulating plate; 306. Third tungsten detector; 307. Fourth tungsten detector; 308. Fourth ceramic insulating plate; 4. Coaxial coil; 401. Coaxial X-axis coil drive circuit; 402. Coaxial Y-axis coil drive circuit; 5. Image cancellation coil; 501. Image cancellation X-axis coil drive circuit; 502. Image cancellation Y-axis coil drive circuit; 6. Focusing coil; 601. Focusing... 7. Focusing coil drive circuit; 8. Beam spot morphology detection sensor; 701. Top cover of beam spot morphology detection sensor; 702. Upper housing of beam spot morphology detection sensor; 703. Insulating gasket between housings; 704. Lower housing of beam spot morphology detection sensor; 705. Insulating base plate of beam spot morphology detection sensor; 9. Water-cooled target; 801. Water inlet of water-cooled target; 802. Water outlet of water-cooled target; 10. Scanning coil; 901. Scanning coil drive circuit; 11. Electron gun; 12. Tungsten probe array; 1101. First tungsten probe; 1102. Second tungsten probe; 1103. Third tungsten probe; 1104. Fourth tungsten probe; 1105. Fifth tungsten probe; 1106. Sixth tungsten probe; 1107. Seventh tungsten probe; 1108. Eighth tungsten probe. Detailed Implementation

[0028] In the following description, specific details such as particular system architectures and techniques are set forth for illustrative purposes and not for limitation, in order to provide a thorough understanding of the embodiments of this application. However, those skilled in the art will understand that this application may also be implemented in other embodiments without these specific details. In other instances, detailed descriptions of well-known systems, devices, circuits, and methods are omitted so as not to obscure the description of this application with unnecessary detail.

[0029] It should be understood that, when used in this application specification and the appended claims, the term "comprising" indicates the presence of the described features, integrals, steps, operations, elements and / or components, but does not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components and / or a collection thereof.

[0030] Furthermore, in the description of this application and the appended claims, the terms "first," "second," "third," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0031] References to "one embodiment" or "some embodiments" in this specification mean that one or more embodiments of this application include a specific feature, structure, or characteristic described in connection with that embodiment. Therefore, the phrases "in one embodiment," "in some embodiments," "in other embodiments," "in still other embodiments," etc., appearing in different parts of this specification do not necessarily refer to the same embodiment, but rather mean "one or more, but not all, embodiments," unless otherwise specifically emphasized. The terms "comprising," "including," "having," and variations thereof mean "including but not limited to," unless otherwise specifically emphasized. "A plurality" means "two or more."

[0032] To address the current challenges in effectively detecting and optimizing electron beam spots, this application provides an electron gun beam spot quality optimization device. By controlling the electron beam to rapidly scan the beam spot morphology detection substrate, beam spot morphology distribution parameters are acquired and the image cancellation coil current is adjusted. The beam spot energy distribution is measured by detecting the beam current received by the tungsten probe array, and the drive current of the coaxial coil is adjusted accordingly, thereby achieving the goal of optimizing electron beam spot quality.

[0033] The specific embodiments of this application will be described in further detail below with reference to the accompanying drawings and examples. The following examples are used to illustrate this application, but are not intended to limit the scope of this application.

[0034] This application provides an electron gun beam spot quality optimization device, such as... Figure 1 and Figure 2 As shown, the system includes a beam quality optimization and control system 1 and a beam spot morphology detection sensor 7. The beam spot morphology detection sensor 7 contains a beam spot morphology detection substrate 3 and a tungsten probe array 11, both connected to the beam quality optimization and control system 1. The beam quality optimization and control system 1 is connected to the image-eliminating coil 5 and the coaxial coil 4 of the electron gun 10. The beam spot morphology detection substrate 3 is used to detect the beam spot morphology of the electron beam 2 generated by the electron gun 10 and transmits the detection results to the beam quality optimization and control system 1. The tungsten probe array 11 is used to detect the beam spot energy distribution of the electron beam 2 and transmit the detection results to the beam quality optimization and control system 1. The beam quality optimization and control system 1 adjusts the driving current of the image-eliminating coil 5 according to the detection results of the beam spot morphology detection substrate 3 to make the beam spot morphology of the electron beam 2 circular. It also adjusts the driving current of the coaxial coil 4 according to the detection results of the tungsten probe array 11 to make the beam spot energy of the electron beam 2 Gaussian distributed from the center outwards.

[0035] The beam spot morphology information is obtained by the beam spot morphology detection substrate 3 and transmitted to the beam quality optimization and control system 1 for comparison and analysis calculation. The driving current of the image-eliminating coil 5 is adjusted to make the beam spot morphology more circular. Then, the beam spot passes through the center of the tungsten probe array 11, the focusing current value is adjusted, the tungsten probe receives the beam energy distribution information, and inputs it to the beam quality optimization and control system 1 for comparison and analysis calculation. The driving current of the coaxial coil 4 is adjusted to optimize the beam spot energy distribution, thereby achieving the purpose of effectively detecting the electron beam spot and optimizing the quality of the electron beam spot.

[0036] In some embodiments, such as Figure 1 As shown, the beam quality optimization and control system 1 includes a sampling circuit 102, a conversion circuit 101, and beam spot quality control software 104. The sampling circuit 102 is connected to the beam spot morphology detection substrate 3, the tungsten probe array 11, and the conversion circuit 101, respectively. The conversion circuit 101 is connected to the sampling circuit 102, the beam spot quality control software 104, the image cancellation coil 5, and the coaxial coil 4, respectively. The sampling circuit 102 is used to receive the detection results from the beam spot morphology detection substrate 3 and the tungsten probe array 11, and outputs the detection results to the beam spot quality control software 104 after processing by the conversion circuit 101. The beam spot quality control software 104 is used to output the control signal of the image cancellation coil driving current according to the detection result of the beam spot morphology detection substrate 3, and output the control signal of the coaxial coil driving current according to the detection result of the tungsten probe array 11.

[0037] In some embodiments, such as Figure 3 As shown, multiple tungsten detection components are provided on the beam spot morphology detection substrate 3, and each tungsten detection component is connected to the sampling circuit 102 through a sampling resistor. The tungsten detection components are used to collect the beam current signal when the electron beam 2 scans on the beam spot morphology detection substrate 3, and output the beam current signal to the sampling circuit 102 through the sampling resistor.

[0038] In some embodiments, such as Figure 3 As shown, the tungsten detection assembly includes two tungsten detection plates arranged in parallel, with ceramic insulating plates disposed on the outer sides of the two tungsten detection plates respectively; the tungsten detection plates are connected to the sampling circuit 102 through sampling resistors.

[0039] In some embodiments, such as Figure 4 As shown, the tungsten probe array 11 is ring-shaped and includes multiple tungsten probes that are uniformly distributed and located on the same plane. Each tungsten probe is connected to the sampling circuit 102 through a sampling resistor. The tungsten probes are used to collect the beam signal when the electron beam 2 passes through the middle of the tungsten probe array 11, and output the beam signal to the sampling circuit 102 through the sampling resistor.

[0040] In some embodiments, the tungsten probe array 11 is parallel to the coaxial coil 4 and is on the same axis as the electron gun 10.

[0041] In some embodiments, such as Figure 1 As shown, it also includes an image cancellation coil drive circuit and a coaxial coil drive circuit; the conversion circuit 101 is connected to the image cancellation coil 5 through the image cancellation coil drive circuit and to the coaxial coil 4 through the coaxial coil drive circuit.

[0042] In some embodiments, such as Figure 1 As shown, it also includes a scanning coil drive circuit 901; a scanning coil 9 is also provided in the beam spot morphology detection sensor 7, and the beam quality optimization and control system 1 also includes a waveform generation circuit 103; the waveform generation circuit 103 is connected to the scanning coil 9 through the scanning coil drive circuit 901; the waveform generation circuit 103 is used to output the scanning waveform to the scanning coil drive circuit 901, the scanning coil drive circuit 901 is used to adjust the drive current of the scanning coil 9, and the scanning coil 9 is used to control the electron beam 2 to scan on the beam spot morphology detection substrate 3.

[0043] In some embodiments, such as Figure 1 As shown, it also includes a focusing coil drive circuit 601; the conversion circuit 101 is also connected to the focusing coil 6 of the electron gun 10 through the focusing coil drive circuit 601; the focusing coil drive circuit 601 is used to adjust the drive current of the focusing coil 6.

[0044] In some embodiments, such as Figure 1 As shown, a water-cooled target 8 is also provided in the beam spot morphology detection sensor 7. The water-cooled target 8 is connected to the sampling circuit 102 through a sampling resistor. The water-cooled target 8 is used to receive the bombardment of the electron beam 2 and remove the heat generated by the bombardment of the electron beam 2.

[0045] This application discloses a device that, based on the characteristic parameters of the detected beam spot, uses computer software analysis to online optimize and adjust the parameters of the electron gun's coaxial coil and anti-image coil, thereby calibrating the beam spot morphology and rapidly optimizing the electron gun beam quality. The electron gun beam quality optimization device includes a beam quality optimization and control system 1, a beam spot morphology detection substrate 3, a coaxial anti-image focusing coil and its driving circuit, a beam spot morphology detection sensor 7, a water-cooled target 8, a scanning coil and its driving circuit, an electron gun 10, and a tungsten probe array 11. The electron beam 2 is generated by the electron gun 10 and rapidly scans the beam spot morphology detection substrate 3 via the scanning coil 9. The tungsten probe located on the beam spot morphology detection substrate 3 detects the beam spot morphology and transmits the detection results to the beam quality control system 1 for calibration, analysis, and calculation, adjusting the beam spot morphology distribution. The tungsten probe array 11 detects the beam spot energy distribution; by comparing the beam current values ​​obtained from the eight tungsten probes, the driving current of the coaxial coil 4 is adjusted to achieve an approximately Gaussian distribution of the beam spot energy density from the center outwards.

[0046] The implementation process of the electron gun beam spot quality optimization device is as follows: The electron beam 2 is generated by the electron gun 10 and directly irradiates the water-cooled target 8 inside the beam spot morphology detection sensor 7. At this time, the beam quality optimization and control system 1 outputs a control signal to the scanning coil drive circuit 901, which controls the electron beam 2 to scan rapidly on the beam spot morphology detection substrate 3 through the scanning coil 9. When the electron beam sweeps across the tungsten detector plate placed on the beam spot morphology detection substrate 3, the beam current received by the tungsten detector plate is converted into a voltage signal through the sampling resistor and transmitted to the beam quality optimization and control system 1 for detection and analysis. Through the beam current signals measured by the tungsten detector plate in different directions, the beam quality optimization and control system 1 will construct a preliminary beam spot morphology distribution map. According to the obtained beam spot morphology, the beam spot morphology is made to tend to be circular by adjusting the driving current of the image cancellation coil 5. After the beam spot morphology is corrected, the scanning device is turned off, the tungsten probe array 11 is placed, and the beam current is applied and passes through the center of the tungsten probe array 11. The beam current values ​​measured by the tungsten probes are converted into voltage signals through their respective sampling resistors and transmitted to the beam quality optimization and control system 1. The beam quality optimization and control system 1 obtains a preliminary energy distribution map of the beam spot based on the beam current measured on eight tungsten probes, and fine-tunes the driving current of the coaxial coil 4 to make the beam current obtained on the eight tungsten probes approximately equal, thereby improving the energy distribution of the electron beam spot. This device has advantages such as simple operation and accurate measurement. The heat generated by the electron beam hitting the water-cooled target 8 is removed by water cooling, allowing for the detection of beam spot morphology for high-power electron beams such as those above 30kW, and rapid optimization of beam spot quality.

[0047] The beam quality optimization and control system 1 consists of an analog-to-digital / digital-to-analog converter circuit 101, a sampling circuit 102, a waveform generation circuit 103, and beam spot quality control software 104. The waveform generation circuit 103 generates an electron beam deflection signal, which is input to the scanning drive circuit 901 to drive the scanning coil 9 to generate a deflection current, thereby realizing rapid scanning of the electron beam on the beam spot morphology detection substrate 3. The sampling circuit 102 receives the sampling signals from the beam current on the beam spot morphology detection substrate 3 and the tungsten probe array 11, and after processing by the analog-to-digital / digital-to-analog converter circuit 101, it is input to the beam spot quality control software 104. The beam spot quality control software 104 constructs a preliminary morphology and energy distribution map of the beam spot based on the information transmitted by the sampling circuit 102, compares it with the set beam spot state, and outputs the signal to the analog-to-digital / digital-to-analog converter circuit 101 to convert it into an analog signal. After being input to the alignment, image cancellation, and focusing drive circuits, the driving current of the alignment, image cancellation, and focusing coils is changed, thereby changing the beam spot morphology and energy distribution, and realizing the correction of beam spot morphology and energy distribution.

[0048] like Figure 1 and Figure 2As shown, electron beam 2 is generated by electron gun 10; the coaxial coil 4, image-erasing coil 5, and focusing coil 6 are all installed inside electron gun 10 for optimizing and calibrating the electron beam spot quality. Figure 3 As shown, the beam spot morphology detection substrate 3 includes a first ceramic insulating plate 301, a first tungsten detector 302, a second tungsten detector 303, a second ceramic insulating plate 304, a third ceramic insulating plate 305, a third tungsten detector 306, a fourth tungsten detector 307, and a fourth ceramic insulating plate 308; the scanning trajectory of the electron beam on the beam spot morphology detection substrate 3 is OABCDO or ODCBAO; the thickness of the first tungsten detector 302, the second tungsten detector 303, the third tungsten detector 306, and the fourth tungsten detector 307 is 0.1 mm, the first tungsten detector 302 and the second tungsten detector 303 are spaced 1 mm apart, and the third tungsten detector 306 and the fourth tungsten detector 307 are spaced 1 mm apart. Figure 5 As shown, when the electron beam 2 scans on the beam spot morphology detection substrate 3, if the roundness of the beam spot morphology is good, the time intervals t1-t0, t3-t2, t5-t4, and t7-t6 of the beam current passing through the first tungsten detector should be t1-t0 = t3-t2 = t5-t4 = t7-t6; otherwise, the driving current value of the image cancellation coil 5 should be adjusted to improve the beam spot morphology.

[0049] like Figure 1 As shown, the beam spot morphology detection sensor 7 consists of a top cover 701, an upper housing 702, an insulating gasket 703 between the housings, a lower housing 704, and an insulating base plate 705. The water-cooled target 8 receives prolonged bombardment from the electron beam 2 and removes the heat generated by the electron beam bombardment through water cooling.

[0050] like Figure 4 As shown, the tungsten probe array 11 consists of a first tungsten probe 1101, a second tungsten probe 1102, a third tungsten probe 1103, a fourth tungsten probe 1104, a fifth tungsten probe 1105, a sixth tungsten probe 1106, a seventh tungsten probe 1107, and an eighth tungsten probe 1108. All tungsten probes are mounted on the same horizontal plane, with their tips evenly distributed on a circle with a diameter of 2 mm. The included angle between the probes is 45°. The horizontal plane of the probe array is parallel to the coaxial coil 4 and is on the same axis as the electron gun. By controlling the driving current of the focusing coil 6, the beam focus is adjusted so that each tungsten probe can detect the beam signal. The signal is converted into a voltage signal by the sampling resistor and transmitted to the sampling circuit 102. When the voltage signal detected by each tungsten probe is the same, it indicates that the coaxiality of the beam is high, and it is not necessary to adjust the X-axis and Y-axis coil current signals of the coaxial coil; otherwise, coaxial calibration is performed.

[0051] In the application, electron beam 2 is generated by electron gun 10 and bombards water-cooled target 8. At this time, waveform generation circuit 103 outputs a scanning waveform to scanning coil drive circuit 901. Scanning coil drive circuit 901 changes the drive current of scanning coil 9, enabling electron beam 2 to rapidly scan the beam spot morphology detection substrate 3. The beam spot morphology distribution information is detected by various tungsten detectors on the beam spot morphology detection substrate 3. This information is then transmitted to beam spot quality control software 104 via sampling circuit 102 for comparison, analysis, and calculation, thereby outputting a control signal to change the drive current of image-eliminating coil 5, making the beam spot morphology more circular. Afterwards, the drive signal of scanning coil 9 is turned off, and the current value of focusing coil 6 is adjusted. The energy distribution of the beam spot is detected by tungsten probe array 11, and after processing by sampling circuit 102, it is transmitted to beam spot quality control software 104 for comparison, analysis, and calculation, thereby outputting a control signal to change the drive current in the coaxial coil 4, optimizing the beam spot energy distribution of the electron beam. Through the above methods, the beam spot morphology of the electron beam is finally calibrated to be circular, and the beam spot energy exhibits a Gaussian distribution from the center to the periphery, thereby optimizing the quality of the electron beam spot.

[0052] Regarding the embodiments of this application, it should also be noted that, without conflict, the embodiments of this application and the features in the embodiments can be combined with each other to obtain new embodiments.

[0053] Those skilled in the art will clearly understand that, for the sake of convenience and brevity, the above-described division of functional units and modules is merely an example. In practical applications, the above functions can be assigned to different functional units and modules as needed, that is, the internal structure of the device can be divided into different functional units or modules to complete all or part of the functions described above. The functional units and modules in the embodiments can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit. Furthermore, the specific names of the functional units and modules are only for easy differentiation and are not intended to limit the scope of protection of this application.

[0054] The above-described embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application, and should all be included within the protection scope of this application.

Claims

1. An electron gun beam spot quality optimization device, characterized in that, It includes a beam quality optimization and control system and a beam spot morphology detection sensor; the beam spot morphology detection sensor is provided with a beam spot morphology detection substrate and a tungsten probe array, which are respectively connected to the beam quality optimization and control system; the beam quality optimization and control system is respectively connected to the image cancellation coil and the coaxial coil of the electron gun. The beam spot morphology detection substrate is used to detect the beam spot morphology of the electron beam generated by the electron gun and transmit the detection results to the beam quality optimization and control system. The tungsten probe array is used to detect the beam spot energy distribution of the electron beam and transmit the detection results to the beam quality optimization and control system. The beam quality optimization and control system is used to adjust the driving current of the image-eliminating coil according to the detection results of the beam spot morphology detection substrate, so that the beam spot morphology of the electron beam is circular; and to adjust the driving current of the coaxial coil according to the detection results of the tungsten probe array, so that the beam spot energy of the electron beam is distributed in a Gaussian manner from the center to the periphery. The beam quality optimization and control system includes a sampling circuit, a conversion circuit, and beam spot quality control software; multiple tungsten detection components are disposed on the beam spot morphology detection substrate, and each of the tungsten detection components is connected to the sampling circuit through a sampling resistor. The tungsten detection assembly includes two tungsten detection plates arranged in parallel, with ceramic insulating plates disposed on the outer sides of the two tungsten detection plates respectively; the tungsten probe array is ring-shaped and includes multiple tungsten probes that are evenly distributed and located on the same plane; each tungsten probe is connected to the sampling circuit through a sampling resistor.

2. The electron gun beam spot quality optimization device as described in claim 1, characterized in that, The sampling circuit is connected to the beam spot morphology detection substrate, the tungsten probe array and the conversion circuit respectively. The conversion circuit is connected to the sampling circuit, the beam spot quality control software, the image cancellation coil and the coaxial coil respectively. The sampling circuit is used to receive the detection results of the beam spot morphology detection substrate and the tungsten probe array respectively, and output the detection results to the beam spot quality control software after processing by the conversion circuit. The beam spot quality control software is used to output a control signal for the image cancellation coil drive current based on the detection results of the beam spot morphology detection substrate, and to output a control signal for the coaxial coil drive current based on the detection results of the tungsten probe array.

3. The electron gun beam spot quality optimization device as described in claim 1, characterized in that, The tungsten detection component is used to acquire the beam current signal when the electron beam scans on the beam spot morphology detection substrate, and outputs the beam current signal to the sampling circuit through the sampling resistor.

4. The electron gun beam spot quality optimization device as described in claim 1, characterized in that, The tungsten detector is connected to the sampling circuit via a sampling resistor.

5. The electron gun beam spot quality optimization device as described in claim 1, characterized in that, The tungsten probe is used to collect the beam signal when the electron beam passes through the middle of the tungsten probe array, and outputs the beam signal to the sampling circuit through the sampling resistor.

6. The electron gun beam spot quality optimization device as described in claim 1, characterized in that, The tungsten probe array is parallel to the coaxial coil and is on the same axis as the electron gun.

7. The electron gun beam spot quality optimization device as described in claim 1, characterized in that, It also includes an image cancellation coil drive circuit and a coaxial coil drive circuit; the conversion circuit is connected to the image cancellation coil through the image cancellation coil drive circuit and to the coaxial coil through the coaxial coil drive circuit.

8. The electron gun beam spot quality optimization device as described in claim 1, characterized in that, It also includes a scanning coil driving circuit; the beam spot morphology detection sensor is also equipped with a scanning coil, and the beam quality optimization and control system also includes a waveform generation circuit; the waveform generation circuit is connected to the scanning coil through the scanning coil driving circuit. The waveform generation circuit is used to output a scanning waveform to the scanning coil driving circuit. The scanning coil driving circuit is used to adjust the driving current of the scanning coil. The scanning coil is used to control the electron beam to scan on the beam spot morphology detection substrate.

9. The electron gun beam spot quality optimization device as described in claim 1, characterized in that, It also includes a focusing coil drive circuit; the conversion circuit is also connected to the focusing coil of the electron gun through the focusing coil drive circuit; the focusing coil drive circuit is used to adjust the drive current of the focusing coil.

10. The electron gun beam spot quality optimization device as described in claim 1, characterized in that, The beam spot morphology detection sensor is also equipped with a water-cooled target, which is connected to the sampling circuit through a sampling resistor; the water-cooled target is used to receive the bombardment of the electron beam and remove the heat generated by the electron beam bombardment.

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