Method for adjusting metal coverage rate of packaging substrate and related equipment
By adjusting the number of heat dissipation holes in the metal layer in the packaging substrate to adjust the metal coverage ratio, the problem of warping of the packaging substrate is solved, the installation pass rate is improved and the design and production requirements are met.
Patent Information
- Application Number
- CN202510103771.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-22
- Publication Date
- 2025-05-06
AI Technical Summary
Packaging substrates often have warping problems, which affect the installation pass rate and are difficult to effectively solve the existing technology.
By obtaining the metal coverage of the first metal layer and the second metal layer in the packaging substrate, determining whether it is necessary to adjust the metal coverage according to the difference value and the preset difference value, and adjusting the metal coverage by adjusting the number of heat dissipation holes.
By adjusting the metal coverage of the metal layer, warping problems are reduced, the installation pass rate of the packaging substrate is improved, and design and production process requirements are met.
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Figure CN119943677A_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of chip design technology, and in particular to a method for adjusting the metal coverage of a packaging substrate and related equipment. Background Art
[0002] The package substrate generally includes a core layer and multiple metal layers and multiple dielectric layers located on both sides of the core layer. The core layer or dielectric layer is located between adjacent metal layers, and the traces or conductive planes on adjacent metal layers are connected through vias that penetrate the core layer or dielectric layer. However, current package substrates often have warping problems, which affects their installation qualification rate. Summary of the invention
[0003] The present application discloses a method for adjusting the metal coverage of a packaging substrate and related equipment to improve the warping of the packaging substrate.
[0004] In a first aspect, the present application discloses a method for adjusting the metal coverage of a packaging substrate, comprising: obtaining the metal coverage of a first metal layer and a second metal layer in the packaging substrate; determining whether the metal coverage of the first metal layer and / or the second metal layer needs to be adjusted and the number of heat dissipation holes that need to be adjusted in the first metal layer and / or the second metal layer according to the difference in metal coverage between the first metal layer and the second metal layer and a preset difference; wherein adjusting the number of heat dissipation holes of the first metal layer and / or the second metal layer is used to adjust the metal coverage of the first metal layer and / or the second metal layer; the heat dissipation hole is a through hole that penetrates any of the metal layers and dissipates heat to the metal layer.
[0005] In this embodiment, the warping of the packaging substrate can be improved by adjusting the number of heat dissipation holes in the first metal layer and / or the second metal layer and adjusting the metal coverage of the first metal layer and / or the second metal layer, and then by making the difference in metal coverage between the first metal layer and the second metal layer less than or equal to a preset difference.
[0006] In some embodiments of the present application, determining the number of heat dissipation holes that need to be adjusted in the first metal layer and / or the second metal layer based on the difference in metal coverage between the first metal layer and the second metal layer and the preset difference includes: determining the number of heat dissipation holes that need to be adjusted in the first metal layer based on the difference between the metal coverage and the preset difference, the area of the first metal layer, and the area of the heat dissipation holes; or determining the number of heat dissipation holes that need to be adjusted in the second metal layer based on the difference between the metal coverage and the preset difference, the area of the second metal layer, and the area of the heat dissipation holes.
[0007] In this implementation manner, the number of heat dissipation holes that need to be adjusted in the first metal layer or the second metal layer can be determined more accurately, and thus the metal coverage of the first metal layer and / or the second metal layer can be adjusted more accurately.
[0008] In some embodiments of the present application, it also includes: adjusting the number of heat dissipation holes of the first metal layer and / or the second metal layer according to the number of heat dissipation holes that need to be adjusted in the first metal layer and / or the second metal layer and preset adjustment constraints of the heat dissipation holes; the adjustment constraints of the heat dissipation holes are used to determine whether the number of heat dissipation holes of the first metal layer and / or the second metal layer can be adjusted.
[0009] In this embodiment, the metal coverage of the first metal layer and / or the second metal layer can be adjusted while making the package substrate meet the design requirements and production process requirements.
[0010] In some embodiments of the present application, the adjustment constraint of the heat dissipation holes includes a first adjustment constraint and a second adjustment constraint, the first adjustment constraint is used to determine whether the metal layer with the largest metal coverage between the first metal layer and the second metal layer can add heat dissipation holes, and the second adjustment constraint is used to determine whether the metal layer with the smallest metal coverage between the first metal layer and the second metal layer can delete heat dissipation holes. Then, according to the number of heat dissipation holes that need to be adjusted in the first metal layer and / or the second metal layer and the preset adjustment constraint of the heat dissipation holes, adjusting the number of heat dissipation holes in the first metal layer and / or the second metal layer includes: adding heat dissipation holes to the first metal layer according to the number of heat dissipation holes that need to be adjusted in the first metal layer and the first adjustment constraint, so as to adjust the number of heat dissipation holes in the first metal layer; wherein the metal coverage of the first metal layer is greater than the metal coverage of the second metal layer; and / or, according to the number of heat dissipation holes that need to be adjusted in the second metal layer and the second adjustment constraint, deleting some heat dissipation holes in the second metal layer to adjust the number of heat dissipation holes in the second metal layer.
[0011] In this implementation manner, after adding heat dissipation holes to the first metal layer and / or deleting heat dissipation holes in the second metal layer, the package substrate can meet design requirements and production process requirements.
[0012] In some embodiments of the present application, the first adjustment constraint condition at least includes: the distance between the heat dissipation hole and the target structure of the metal layer where the heat dissipation hole is located, the distance between the heat dissipation hole and the edge of the metal layer where the heat dissipation hole is located, the distance between the heat dissipation hole and the target structure of the adjacent metal layer of the metal layer where the heat dissipation hole is located, and the distance between the heat dissipation hole and the edge of the adjacent metal layer of the metal layer where the heat dissipation hole is located are greater than or equal to their respective corresponding preset distances; the target structure at least includes vias, traces, pads or other heat dissipation holes; the second adjustment constraint condition at least includes: the number of heat dissipation holes in the target area where the heat dissipation hole is located and multiple target areas adjacent to the heat dissipation hole is greater than a preset number; the target area includes an area with an area equal to the preset area; the multiple target areas include areas above, below, left, right, upper left, upper right, lower left and lower right of the heat dissipation hole.
[0013] With this implementation, it is possible to more accurately determine whether the packaging substrate meets the design requirements and production process requirements after adding heat dissipation holes to the metal layer with the largest metal coverage between the first metal layer and the second metal layer, or after deleting the heat dissipation holes of the metal layer with the smallest metal coverage between the first metal layer and the second metal layer.
[0014] In some embodiments of the present application, adding heat dissipation holes to the first metal layer according to the number of heat dissipation holes that need to be adjusted in the first metal layer and the first adjustment constraint includes: dividing the first metal layer into multiple first areas; the number of the first areas is determined by the number of heat dissipation holes that need to be adjusted in the first metal layer; determining whether adding a heat dissipation hole in any of the first areas satisfies the first adjustment constraint, and if so, adding a heat dissipation hole in the first area.
[0015] In this implementation manner, it can be ensured that the heat dissipation holes in the first metal layer after the heat dissipation holes are added are evenly distributed.
[0016] In some embodiments of the present application, determining whether adding a heat dissipation hole in any of the first areas satisfies the first adjustment constraint includes: dividing the first area into multiple sub-areas; the maximum side length of the sub-area is less than the diameter of the heat dissipation hole, and the minimum side length of the sub-area is greater than one tenth of the diameter of the heat dissipation hole; determining one by one in a preset order whether adding a heat dissipation hole in the sub-area satisfies the first adjustment constraint, and if adding a heat dissipation hole in any of the sub-areas satisfies the first adjustment constraint, adding a heat dissipation hole in the sub-area; the preset order includes a spiral order starting with the sub-area located at the center of the first metal layer.
[0017] In this implementation, the heat dissipation hole may be added preferentially at the center of the first area to improve the reliability of the heat dissipation hole.
[0018] In some embodiments of the present application, deleting some heat dissipation holes in the second metal layer according to the number of heat dissipation holes that need to be adjusted in the second metal layer and the second adjustment constraint includes: dividing the second metal layer into multiple second areas; the number of the second areas is determined by the number of heat dissipation holes that need to be adjusted in the second metal layer; determining whether deleting any heat dissipation hole in any second area satisfies the second adjustment constraint, and if so, deleting the heat dissipation holes in the second area.
[0019] In this implementation manner, it can be ensured that the heat dissipation holes in the second metal layer after the heat dissipation holes are deleted are evenly distributed.
[0020] In a second aspect, the present application discloses a computer device, comprising a memory and a processor; the memory is used to store instructions; the processor is used to execute the metal coverage adjustment method of the packaging substrate as described in any of the above items according to the instructions stored in the memory.
[0021] In this implementation manner, the metal coverage of the packaging substrate can be automatically adjusted, and the adjustment efficiency of the metal coverage of the packaging substrate can be improved.
[0022] In a third aspect, the present application discloses a computer-readable storage medium having stored thereon instructions for executing the method for adjusting the metal coverage of a packaging substrate as described in any one of the above items.
[0023] In this implementation manner, the metal coverage of the packaging substrate can be automatically adjusted, and the adjustment efficiency of the metal coverage of the packaging substrate can be improved. BRIEF DESCRIPTION OF THE DRAWINGS
[0024] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the background technology, the drawings required for use in the embodiments of the present application or the background technology will be described below.
[0025] Figure 1 A schematic diagram of the cross-sectional structure of a packaging substrate disclosed in an embodiment of the present application.
[0026] Figure 2 A schematic diagram of the structure of a routing disclosed in an embodiment of the present application.
[0027] Figure 3 This is a schematic diagram of the structure of a welding pad disclosed in an embodiment of the present application.
[0028] Figure 4 A schematic diagram of the structure of a via disclosed in an embodiment of the present application.
[0029] Figure 5 This is a flow chart of a method for adjusting the metal coverage of a packaging substrate disclosed in an embodiment of the present application.
[0030] Figure 6 A schematic diagram of the structure of a heat dissipation hole disclosed in an embodiment of the present application.
[0031] Figure 7 A schematic diagram of the structure of a target area where a heat dissipation hole is located is disclosed in an embodiment of the present application.
[0032] Figure 8 A schematic structural diagram of a target area above or below a heat dissipation hole disclosed in an embodiment of the present application.
[0033] Fig. 9 It is a structural schematic diagram of a target area on the left or right side of a heat dissipation hole disclosed in an embodiment of the present application.
[0034] Fig.10 This is a schematic structural diagram of a target area at the upper left, lower left, upper right or lower right of a heat dissipation hole disclosed in an embodiment of the present application.
[0035] Fig.11 This is a schematic diagram of the structure of multiple first regions of a first metal layer disclosed in an embodiment of the present application.
[0036] Fig.12 This is a schematic diagram of the structure of multiple sub-regions of a first region disclosed in an embodiment of the present application.
[0037] Fig.13 This is a schematic diagram of the structure of multiple second regions of a second metal layer disclosed in an embodiment of the present application. DETAILED DESCRIPTION
[0038] The technical solutions in the embodiments of the present application will be described below in conjunction with the drawings in the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.
[0039] In current packaging substrates, the metal layers are mostly arranged symmetrically with respect to the core layer. Figure 1 As shown, taking the packaging substrate including 10 metal layers as an example, the first metal layer L1 and the tenth metal layer L10 are symmetrically arranged with respect to the core layer L0, the second metal layer L2 and the ninth metal layer L9 are symmetrically arranged with respect to the core layer L0, the third metal layer L3 and the eighth metal layer L8 are symmetrically arranged with respect to the core layer L0, the fourth metal layer L4 and the seventh metal layer L7 are symmetrically arranged with respect to the core layer L0, and the fifth metal layer L5 and the sixth metal layer L6 are symmetrically arranged with respect to the core layer L0.
[0040] In the process of designing the package substrate, it is necessary to determine whether the difference in metal coverage between two metal layers symmetrically arranged about the core layer exceeds the allowable range. For example, it is necessary to determine whether the difference in metal coverage between the first metal layer L1 and the tenth metal layer L10 exceeds the allowable range. If the difference between the two exceeds the allowable range, it is necessary to adjust the metal coverage of at least one of the two metal layers to avoid the package substrate from warping due to the difference in metal coverage between the two metal layers exceeding the allowable range. Among them, the metal coverage refers to the ratio of the area of the metal layer to the area of the entire metal layer. Because the metal in the package substrate is usually copper, the metal coverage can also be called the residual copper rate or the copper coverage rate.
[0041] Generally speaking, if Figure 1 As shown in FIG. 1 , the metal layer of the package substrate includes a trace 110, a pad 111, a via 112, and a metal plane 113. If the PIN attribute of the trace 110, the pad 111, or the via 112 is different from the PIN attribute of the metal plane 113 around it, then Figures 2 to 4 As shown, it is necessary to set a metal-free area 114 around the trace 110, pad 111 or via 112 to avoid short circuit between the trace 110, pad 111 or via 112 with different PIN properties and the metal plane 113. Among them, the metal-free area 114 around the trace 110, pad 111 and via 112 is the main factor affecting the metal coverage of the metal layer. In other words, if the difference in the total area of the metal-free area 114 of the two metal layers symmetrically arranged with respect to the core layer is too large, the difference in the metal coverage of the two metal layers will be too large, which will easily cause the problem of warping of the package substrate.
[0042] However, because the traces 110, pads 111, vias 112 and the metal-free areas 114 around them are designed in the early stage of the design of the packaging substrate based on the production process requirements of the packaging substrate, these metal-free areas 114 cannot be arbitrarily adjusted significantly in the later stage, and fine-tuning the metal-free areas 114 cannot effectively adjust the metal coverage of the metal layer.
[0043] Based on this, the present application discloses a metal coverage adjustment scheme for a packaging substrate, which adjusts the metal coverage of the packaging substrate by setting heat dissipation holes in each metal layer of the packaging substrate and adjusting the number of heat dissipation holes in the metal layer of the packaging substrate to improve the warping problem of the packaging substrate.
[0044] As an optional implementation of the disclosure of the present application, the embodiment of the present application discloses a method for adjusting the metal coverage of a packaging substrate, such as Figure 5 As shown, the method includes:
[0045] S101: Obtain metal coverage of a first metal layer and a second metal layer in a packaging substrate.
[0046] In some embodiments of the present application, the first metal layer and the second metal layer are any two metal layers symmetrically arranged about the core layer in the package substrate. For example, the first metal layer and the second metal layer are the first metal layer L1 and the tenth metal layer L10, respectively, or the first metal layer and the second metal layer are the second metal layer L2 and the ninth metal layer L9, ..., or the first metal layer and the second metal layer are the fifth metal layer L5 and the sixth metal layer L6, respectively.
[0047] Of course, the present application is not limited to this. In other embodiments, the first metal layer and the second metal layer can also be any two adjacent metal layers in the packaging substrate. For example, the first metal layer and the second metal layer are respectively the first metal layer L1 and the second metal layer L2, or the first metal layer and the second metal layer are respectively the second metal layer L2 and the third metal layer L3,…, or the first metal layer and the second metal layer are respectively the ninth metal layer L9 and the tenth metal layer L10.
[0048] In an embodiment of the present application, the metal coverage of the first metal layer and the second metal layer in the packaging substrate can be obtained by obtaining the design file of the packaging substrate. The design file of the packaging substrate is used to design a model of the packaging substrate so as to manufacture a packaging substrate with the same structure based on the designed model of the packaging substrate. It should be noted that the structures of the routing 110, pads 111, vias 112, and metal planes 113 in each metal layer have been designed in the design file of the packaging substrate. Therefore, the metal coverage of the first metal layer and the second metal layer can be calculated based on the ratio of the total area of the structures of the routing 110, pads 111, vias 112, and metal planes 113 in the first metal layer and the second metal layer to the area of the entire metal layer.
[0049] S102: If the difference in metal coverage between the first metal layer and the second metal layer is greater than a preset difference, determining the number of heat dissipation holes that need to be adjusted in the first metal layer and / or the second metal layer according to the difference in metal coverage between the first metal layer and the second metal layer and the preset difference, wherein adjusting the number of heat dissipation holes in the first metal layer and / or the second metal layer is used to adjust the metal coverage of the first metal layer and / or the second metal layer.
[0050] In an embodiment of the present application, after obtaining the metal coverage of the first metal layer and the second metal layer in the packaging substrate, the difference P1 of the metal coverage of the first metal layer and the second metal layer is calculated, and then it is determined whether the difference P1 of the metal coverage is greater than the preset difference P0. Among them, the preset difference P0 can be a fixed difference, such as 10%, or a difference range, such as 8% to 10%. If the difference P1 of the metal coverage is greater than or equal to the preset difference P0, it is necessary to adjust the metal coverage of the first metal layer and / or the second metal layer. If the difference P1 of the metal coverage is less than the preset difference P0, it is not necessary to adjust the metal coverage of the first metal layer and / or the second metal layer.
[0051] Taking the preset difference P0 of 10% as an example, if the metal coverage of the first metal layer is 76% and the metal coverage of the second metal layer is 89%, the difference P1 between the metal coverage of the first metal layer and the second metal layer is equal to 13%, and the difference P1 in metal coverage is greater than the preset difference P0, and the metal coverage of the first metal layer and / or the second metal layer needs to be adjusted; if the metal coverage of the first metal layer is 76% and the metal coverage of the second metal layer is 85%, the difference P1 in metal coverage of the first metal layer and the second metal layer is equal to 9%, and the difference P1 in metal coverage is less than the preset difference P0, and the metal coverage of the first metal layer and / or the second metal layer does not need to be adjusted.
[0052] In an embodiment of the present application, when the difference P1 in metal coverage between the first metal layer and the second metal layer is greater than the preset difference P0, or in other words, when the metal coverage of the first metal layer and / or the second metal layer needs to be adjusted, the number of heat dissipation holes that need to be adjusted in the first metal layer and / or the second metal layer can be determined based on the difference P1 in metal coverage between the first metal layer and the second metal layer and the preset difference P0, so as to adjust the metal coverage of the first metal layer and / or the second metal layer by adjusting the number of heat dissipation holes of the first metal layer and / or the second metal layer, so that the difference P1 in metal coverage between the first metal layer and the second metal layer is less than or equal to the preset difference P0, so as to avoid warping of the packaging substrate caused by the large difference in metal coverage between the first metal layer and the second metal layer.
[0053] In the embodiment of the present application, each metal layer of the packaging substrate can be provided with heat dissipation holes. Figure 6 As shown, the heat dissipation hole 115 is a through hole that penetrates any metal layer and dissipates heat for the metal layer. Usually, the heat dissipation hole 115 is set on the metal plane 113 of any metal layer. It should be noted that in the embodiment of the present application, the heat dissipation holes 115 in each metal layer may have been designed in the design file of the package substrate. When the metal coverage of the metal layer needs to be adjusted, only the number of the heat dissipation holes 115 needs to be adjusted.
[0054] In some embodiments of the present application, the number C1 of heat dissipation holes that need to be adjusted in the first metal layer can be determined based on the difference between the metal coverage P1 of the first metal layer and the second metal layer and the preset difference P0, the area S1 of the first metal layer, and the area S0 of the heat dissipation holes. In some embodiments, C1=S1*|P1-P0| / S0. In other embodiments, the number C2 of heat dissipation holes that need to be adjusted in the second metal layer can also be determined based on the difference between the metal coverage P1 of the first metal layer and the second metal layer and the preset difference P0, the area S2 of the second metal layer, and the area S0 of the heat dissipation holes. In some embodiments, C2=S2*|P1-P0| / S0. Of course, the present application is not limited to this. In other embodiments, other calculation parameters can be added as needed to obtain the number of heat dissipation holes that need to be adjusted in the first metal layer or the second metal layer.
[0055] It should be noted that, when the difference P1 in metal coverage between the first metal layer and the second metal layer is greater than the preset difference P0, or in other words, when the metal coverage of the first metal layer and / or the second metal layer needs to be adjusted, the number of heat dissipation holes in the first metal layer and / or the second metal layer can be adjusted by adding heat dissipation holes to the metal layer with the largest metal coverage among the first metal layer and the second metal layer, and / or deleting some heat dissipation holes of the metal layer with the smallest metal coverage among the first metal layer and the second metal layer.
[0056] However, because the production process of the package substrate requires that heat dissipation holes are not allowed to be added within a certain range of structures such as routing, vias, and pads of the same or adjacent metal layers, and a certain number of heat dissipation holes of a certain size need to be added within a certain area of each metal layer to ensure the heat dissipation capacity of the package substrate, when adjusting the number of heat dissipation holes of the first metal layer and / or the second metal layer, the adjustment constraints of the heat dissipation holes need to be met. Of course, when setting the heat dissipation holes in the early stage of the design, the adjustment constraints of the heat dissipation holes also need to be met.
[0057] On this basis, in some embodiments of the present application, after determining the number of heat dissipation holes that need to be adjusted in the first metal layer and / or the second metal layer, it is also necessary to adjust the number of heat dissipation holes in the first metal layer and / or the second metal layer according to the number of heat dissipation holes that need to be adjusted in the first metal layer and / or the second metal layer and the preset adjustment constraints of the heat dissipation holes, wherein the adjustment constraints of the heat dissipation holes are used to determine whether the first metal layer and / or the second metal layer can adjust the number of heat dissipation holes.
[0058] In some embodiments of the present application, the adjustment constraint of the heat dissipation hole includes a first adjustment constraint and a second adjustment constraint. The first adjustment constraint is used to determine whether the metal layer with the largest metal coverage rate between the first metal layer and the second metal layer can add a heat dissipation hole, and the second adjustment constraint is used to determine whether the metal layer with the smallest metal coverage rate between the first metal layer and the second metal layer can delete the heat dissipation hole. Of course, the present application is not limited to this. In other embodiments, the same adjustment constraint may be satisfied regardless of adding or deleting a heat dissipation hole, which will not be described in detail here.
[0059] On this basis, in some embodiments of the present application, heat dissipation holes can be added to the first metal layer according to the number of heat dissipation holes that need to be adjusted in the first metal layer and the first adjustment constraint condition to adjust the number of heat dissipation holes in the first metal layer, wherein the metal coverage of the first metal layer is greater than the metal coverage of the second metal layer. In other embodiments, some heat dissipation holes in the second metal layer can be deleted according to the number of heat dissipation holes that need to be adjusted in the second metal layer and the second adjustment constraint condition to adjust the number of heat dissipation holes in the second metal layer. In other embodiments, heat dissipation holes can be added to the first metal layer according to the number of heat dissipation holes that need to be adjusted in the first metal layer and the first adjustment constraint condition, while some heat dissipation holes in the second metal layer can be deleted according to the number of heat dissipation holes that need to be adjusted in the second metal layer and the second adjustment constraint condition.
[0060] In some embodiments of the present application, the first adjustment constraint condition includes at least: the distance between the heat dissipation hole and the target structure of the metal layer where it is located, the distance between the heat dissipation hole and the edge of the metal layer where it is located, the distance between the heat dissipation hole and the target structure of the adjacent metal layer of the metal layer where it is located, and the distance between the heat dissipation hole and the edge of the adjacent metal layer of the metal layer where it is located is greater than or equal to their respective corresponding preset distances, wherein the target structure includes at least vias, traces, pads or other heat dissipation holes.
[0061] For example, the distance between the heat dissipation hole and the via hole of the metal layer where it is located is greater than or equal to the first distance, the distance between the heat dissipation hole and the routing of the metal layer where it is located is greater than or equal to the second distance, the distance between the heat dissipation hole and the pad of the metal layer where it is located is greater than or equal to the third distance, the distance between the heat dissipation hole and other heat dissipation holes of the metal layer where it is located is greater than or equal to the fourth distance, the distance between the heat dissipation hole and the edge of the metal layer where it is located is greater than or equal to the fifth distance, the distance between the heat dissipation hole and the via hole of the adjacent metal layer of the metal layer where it is located is greater than or equal to the sixth distance, the distance between the heat dissipation hole and the routing of the adjacent metal layer of the metal layer where it is located is greater than or equal to the seventh distance, the distance between the heat dissipation hole and the pad of the adjacent metal layer of the metal layer where it is located is greater than or equal to the eighth distance, the distance between the heat dissipation hole and other heat dissipation holes of the adjacent metal layer of the metal layer where it is located is greater than or equal to the ninth distance, and the distance between the heat dissipation hole and the edge of the adjacent metal layer of the metal layer where it is located is greater than or equal to the tenth distance.
[0062] In some embodiments of the present application, the second adjustment constraint condition includes at least: the number of heat dissipation holes in the target area where the heat dissipation hole is located and the multiple target areas adjacent to the heat dissipation hole is greater than a preset number; the target area includes an area with an area equal to the preset area; the multiple target areas include areas above, below, left, right, upper left, upper right, lower left and lower right of the heat dissipation hole.
[0063] For example, Figure 7 As shown, the number of heat dissipation holes in the target area P where the heat dissipation hole 115 is located is greater than the preset number, such as Figure 8 As shown, the number of heat dissipation holes in the target area P above or below the heat dissipation hole 115 is greater than the preset number, such as Fig. 9 As shown, the number of heat dissipation holes in the target area P located to the left or right of the heat dissipation hole 115 is greater than the preset number, such as Fig.10 As shown, the number of heat dissipation holes in the target area P located at the upper left, upper right, lower left or lower right of the heat dissipation hole 115 is greater than the preset number. The target area may be a rectangular area of 2000um×2000um, and the preset number may be 9.
[0064] Of course, the present application is not limited to this. In other embodiments, the first adjustment constraint condition and the second adjustment constraint condition can be set according to the actual design and production requirements of the packaging substrate, which will not be repeated here.
[0065] In order to evenly add or delete heat dissipation holes, in some embodiments of the present application, the metal layer is evenly divided into multiple regions, and heat dissipation holes are added or deleted region by region. Fig.11 As shown, the first metal layer can be first divided into multiple first regions R1, and then it is determined whether adding a heat dissipation hole in any first region R1 satisfies the first adjustment constraint condition. If the first adjustment constraint condition is satisfied, a heat dissipation hole is added in the first region R1, and it is determined whether adding a heat dissipation hole in the next first region R1 satisfies the first adjustment constraint condition. If the first adjustment constraint condition is not satisfied, a heat dissipation hole is not added in the first region R1, and it is determined whether adding a heat dissipation hole in the next first region R1 satisfies the first adjustment constraint condition.
[0066] The number of the first regions R1 is determined by the number of heat dissipation holes that need to be adjusted in the first metal layer. For example, the first metal layer can be adjusted 2 times in the X-axis direction and the Y-axis direction with the X-axis and Y-axis of the first metal layer as reference lines. n The first metal layer is divided into two equal parts in the X-axis direction. n At the same time, the first metal layer is divided into two n The first metal layer divides the first region R1 into four equal parts.n The value of n can be obtained by formula 4. n-1 <C1<4 n Sure.
[0067] In some embodiments of the present application, when determining whether adding a heat dissipation hole in any first region R1 satisfies the first adjustment constraint condition, such as Fig.12 As shown, the first region R1 can be further divided into multiple sub-regions R11, and then it is determined one by one in a preset order whether adding a heat dissipation hole in the sub-region R11 satisfies the first adjustment constraint condition. For example, it is determined whether after adding the heat dissipation hole in the sub-region R11, the distance between the heat dissipation hole and the target structure of the metal layer where it is located, the distance between the heat dissipation hole and the edge of the metal layer where it is located, the distance between the heat dissipation hole and the target structure of the adjacent metal layer of the metal layer where it is located, and the distance between the heat dissipation hole and the edge of the adjacent metal layer of the metal layer where it is located are greater than or equal to their respective corresponding preset distances. If so, adding the heat dissipation hole in the sub-region R11 satisfies the first adjustment constraint condition. Otherwise, adding the heat dissipation hole in the sub-region R11 does not satisfy the first adjustment constraint condition.
[0068] If adding a heat dissipation hole in any sub-region R11 satisfies the first adjustment constraint condition, then a heat dissipation hole is added in the sub-region R11, and it is determined whether adding a heat dissipation hole in the next sub-region R11 satisfies the first adjustment constraint condition. If adding a heat dissipation hole in any sub-region R11 does not satisfy the first adjustment constraint condition, then a heat dissipation hole is not added in the sub-region R11, and it is determined whether adding a heat dissipation hole in the next sub-region R11 satisfies the first adjustment constraint condition. The maximum side length of the sub-region R11 is less than the diameter of the heat dissipation hole, and the minimum side length of the sub-region R11 is greater than one tenth of the diameter of the heat dissipation hole.
[0069] It should be noted that when adding heat dissipation holes in any sub-region R11, the heat dissipation holes can be added at the grid point positions of the grid lines of the sub-region R11, for example, the grid point positions of the grid lines of the sub-region R11 are the center positions of the heat dissipation holes. Alternatively, the center position of the sub-region R11 can be determined first, and then the heat dissipation holes can be added at the center position of the sub-region R11, for example, the grid point positions of the grid lines of the sub-region R11 are the center positions of the heat dissipation holes.
[0070] It should also be noted that, because many areas where heat dissipation holes can be added are very small, the first area R1 is divided into multiple sub-areas R11, so that these areas can be found more easily through small-size retrieval.
[0071] Because the closer the added heat dissipation holes are to the center of the first region R1, the better the reliability of the heat dissipation holes. Therefore, in some embodiments of the present application, heat dissipation holes are added one by one in the sub-region R11 in a preset order that spreads from the center of the first region R1 to the surrounding areas. On this basis, in some embodiments of the present application, the preset order includes a spiral order starting from the sub-region R11 located at the center of the first metal layer. The spiral order is as follows: Fig.12 Of course, the present application is not limited thereto, and in other embodiments, the preset sequence may also be a plurality of line segments extending from the center of the first region R1 to the surroundings, which will not be described in detail here.
[0072] In some embodiments of the present application, in the process of adding heat dissipation holes in multiple first regions R1, it is determined whether the total number Sum1 of heat dissipation holes added in multiple first regions R1 is greater than the number C1 of heat dissipation holes that need to be adjusted in the first metal layer. If so, it means that the difference in metal coverage between the first metal layer and the second metal layer is less than or equal to the preset difference, and the metal coverage adjustment process of the first metal layer and the second metal layer can be terminated. If not, it means that the difference in metal coverage between the first metal layer and the second metal layer is still greater than the preset difference, and it is necessary to continue adding heat dissipation holes. If heat dissipation holes are added in all first regions R1, but the total number Sum1 of heat dissipation holes is still less than the number C1 of heat dissipation holes that need to be adjusted, it is necessary to delete some heat dissipation holes in the second metal layer.
[0073] In some other embodiments of the present application, Fig.13 As shown, the second metal layer may be first divided into a plurality of second regions R2, and then it is determined whether deleting any heat dissipation hole in any second region R2 satisfies the second adjustment constraint condition. For example, after deleting any heat dissipation hole in any second region R2, it is determined whether the number of heat dissipation holes in the target region where the heat dissipation hole is located, the target region above, below, left, right, upper left, upper right, lower left and lower right of the heat dissipation hole is greater than a preset number. If the number of heat dissipation holes in these nine target regions is greater than the preset number, then deleting the heat dissipation hole in the second region R2 satisfies the second adjustment constraint condition. Otherwise, deleting the heat dissipation hole in the second region R2 does not satisfy the second adjustment constraint condition. If deleting any heat dissipation hole in any second region R2 satisfies the second adjustment constraint condition, then the heat dissipation hole in the second region is deleted, and it is determined whether deleting the heat dissipation hole in the next second region R2 satisfies the second adjustment constraint condition. If deleting any heat dissipation hole in any second region R2 does not satisfy the second adjustment constraint condition, then the heat dissipation hole in the second region is not deleted, and it is determined whether deleting the heat dissipation hole in the next second region R2 satisfies the second adjustment constraint condition.
[0074] The number of the second regions R2 is determined by the number of heat dissipation holes that need to be adjusted in the second metal layer. For example, the second metal layer can be adjusted 2 times in the X-axis direction and the Y-axis direction with the X-axis and Y-axis of the second metal layer as reference lines. n The second metal layer is divided into two equal parts in the X-axis direction. n At the same time, the second metal layer is divided into two n The second metal layer divides the second region R2 into 4 n The value of n can be obtained by formula 4. n-1 <C2<4 n Sure.
[0075] It should be noted that in some embodiments of the present application, heat dissipation holes can be first added to the metal layer with the largest metal coverage among the first metal layer and the second metal layer. If after adding heat dissipation holes to the metal layer with the largest metal coverage among the first metal layer and the second metal layer, the difference in metal coverage between the first metal layer and the second metal layer is less than a preset difference, some heat dissipation holes of the metal layer with the smallest metal coverage among the first metal layer and the second metal layer will no longer be deleted. Otherwise, some heat dissipation holes of the metal layer with the smallest metal coverage among the first metal layer and the second metal layer will also need to be deleted.
[0076] Among them, after adding heat dissipation holes to the metal layer with the largest metal coverage among the first metal layer and the second metal layer, it is necessary to re-acquire the metal coverage of the first metal layer and the second metal layer to determine the number C2 of heat dissipation holes that need to be adjusted for the metal layer with the smallest metal coverage among the first metal layer and the second metal layer based on the latest difference in metal coverage between the first metal layer and the second metal layer.
[0077] Of course, the present application is not limited to this. In other embodiments, some heat dissipation holes of the metal layer with the smallest metal coverage in the first metal layer and the second metal layer can be deleted first, and then heat dissipation holes can be added to the metal layer with the largest metal coverage in the first metal layer and the second metal layer. This will not be repeated here.
[0078] In some embodiments of the present application, in the process of deleting the heat dissipation holes in the multiple second regions R2, it is also determined whether the total number Sum2 of the heat dissipation holes deleted in the multiple second regions R2 is greater than the number C2 of the heat dissipation holes that need to be adjusted in the second metal layer. If so, it means that the difference in metal coverage between the first metal layer and the second metal layer is less than or equal to the preset difference, and the metal coverage adjustment process of the second metal layer can be terminated. If not, it means that the difference in metal coverage between the first metal layer and the second metal layer is still greater than the preset difference, and it is necessary to continue to delete the heat dissipation holes. Normally, after adding heat dissipation holes to the metal layer with the largest metal coverage in the first metal layer and the second metal layer, and deleting some heat dissipation holes in the metal layer with the smallest metal coverage in the first metal layer and the second metal layer, the difference in metal coverage between the first metal layer and the second metal layer will be less than or equal to the preset difference.
[0079] It should be noted that in some embodiments of the present application, the first region R1 or the second region R2 can be traversed in a spiral order. In other embodiments, the first region R1 or the second region R2 can also be traversed in a bow-shaped order, which will not be repeated here.
[0080] As another optional implementation of the contents disclosed in the present application, an embodiment of the present application further discloses a computer device, including a memory and a processor; the memory is used to store instructions; the processor is used to execute the metal coverage adjustment method of the packaging substrate disclosed in any of the above embodiments according to the instructions stored in the memory.
[0081] As another optional implementation of the contents disclosed in the present application, an embodiment of the present application further discloses a computer-readable storage medium, on which instructions for executing the method for adjusting the metal coverage of a packaging substrate disclosed in any of the above embodiments are stored.
[0082] Those skilled in the art can understand that all or part of the processes in the above-mentioned embodiments can be completed by instructing the relevant hardware through a computer program, and the computer program can be stored in a non-volatile computer-readable storage medium. When the computer program is executed, it can include the processes of the embodiments of the above-mentioned methods. Among them, any reference to memory, storage, database or other media used in the embodiments provided in this specification can include non-volatile and / or volatile memory. Non-volatile memory can include read-only memory (ROM), programmable ROM (PROM), electrically programmable ROM (EPROM), electrically erasable programmable ROM (EEPROM) or flash memory. Volatile memory can include random access memory (RAM) or external cache memory. As an illustration and not limitation, RAM is available in many forms, such as static RAM (SRAM), dynamic RAM (DRAM), synchronous DRAM (SDRAM), double data rate SDRAM (DDRSDRAM), enhanced SDRAM (ESDRAM), synchronous link (Synchlink) DRAM (SLDRAM), memory bus (Rambus) direct RAM (RDRAM), direct memory bus dynamic RAM (DRDRAM), and memory bus dynamic RAM (RDRAM).
[0083] As another optional implementation of the contents disclosed in the present application, an embodiment of the present application further discloses a computer program product, which includes computer program instructions, which, when executed by a processor, enable the processor to execute the method for adjusting the metal coverage of the packaging substrate disclosed in any of the above embodiments.
[0084] The computer program product may be written in any combination of one or more programming languages to write program codes for performing the operations of the embodiments of the present application, including object-oriented programming languages such as Java, C++, etc., and conventional procedural programming languages such as "C" language or similar programming languages. The program code may be executed entirely on the user computing device, partially on the user device, as a separate software package, partially on the user computing device and partially on a remote computing device, or entirely on a remote computing device or server.
[0085] The technical features of the above embodiments may be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.
[0086] The above embodiments only express several implementation methods of this specification, and the descriptions are relatively specific and detailed, but they cannot be understood as limiting the scope of the patent application. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of this specification, which all belong to the protection scope of this specification. Therefore, the protection scope of the patent of this specification shall be based on the attached claims.
Claims
1. A method for adjusting metal coverage of a packaging substrate, characterized in that: include: Obtaining metal coverage of a first metal layer and a second metal layer in a packaging substrate; If the difference in metal coverage between the first metal layer and the second metal layer is greater than a preset difference, the number of heat dissipation holes that need to be adjusted in the first metal layer and / or the second metal layer is determined according to the difference in metal coverage between the first metal layer and the second metal layer and the preset difference; wherein, adjusting the number of heat dissipation holes in the first metal layer and / or the second metal layer is used to adjust the metal coverage of the first metal layer and / or the second metal layer; the heat dissipation holes are through holes that penetrate any of the metal layers and dissipate heat for the metal layers.
2. The method according to claim 1, characterized in that The determining, according to the difference in metal coverage between the first metal layer and the second metal layer and the preset difference, the number of heat dissipation holes that need to be adjusted in the first metal layer and / or the second metal layer comprises: Determining the number of heat dissipation holes that need to be adjusted in the first metal layer according to the difference between the metal coverage rate and the preset difference, the area of the first metal layer, and the area of the heat dissipation holes; or, The number of heat dissipation holes that need to be adjusted in the second metal layer is determined according to the difference between the metal coverage rate and the preset difference, the area of the second metal layer, and the area of the heat dissipation holes.
3. The method according to claim 1, characterized in that Also includes: The number of heat dissipation holes of the first metal layer and / or the second metal layer is adjusted according to the number of heat dissipation holes that need to be adjusted of the first metal layer and / or the second metal layer and the preset adjustment constraints of the heat dissipation holes; the adjustment constraints of the heat dissipation holes are used to determine whether the number of heat dissipation holes of the first metal layer and / or the second metal layer can be adjusted.
4. The method according to claim 3, characterized in that The adjustment constraint of the heat dissipation hole includes a first adjustment constraint and a second adjustment constraint, wherein the first adjustment constraint is used to determine whether the metal layer with the largest metal coverage rate between the first metal layer and the second metal layer can add heat dissipation holes, and the second adjustment constraint is used to determine whether the metal layer with the smallest metal coverage rate between the first metal layer and the second metal layer can delete the heat dissipation holes. Then, according to the number of heat dissipation holes that need to be adjusted in the first metal layer and / or the second metal layer and the preset heat dissipation hole adjustment constraint, adjusting the number of heat dissipation holes in the first metal layer and / or the second metal layer includes: According to the number of heat dissipation holes that need to be adjusted in the first metal layer and the first adjustment constraint condition, heat dissipation holes are added to the first metal layer to adjust the number of heat dissipation holes in the first metal layer; wherein the metal coverage of the first metal layer is greater than the metal coverage of the second metal layer; and / or, According to the number of heat dissipation holes in the second metal layer that needs to be adjusted and the second adjustment constraint condition, some heat dissipation holes in the second metal layer are deleted to adjust the number of heat dissipation holes in the second metal layer.
5. The method according to claim 4, characterized in that The first adjustment constraint condition at least includes: the distance between the heat dissipation hole and the target structure of the metal layer where it is located, the distance between the heat dissipation hole and the edge of the metal layer where it is located, the distance between the heat dissipation hole and the target structure of the adjacent metal layer of the metal layer where it is located, and the distance between the heat dissipation hole and the edge of the adjacent metal layer of the metal layer where it is located are greater than or equal to their respective corresponding preset distances; the target structure at least includes vias, traces, pads or other heat dissipation holes; The second adjustment constraint condition includes at least: the number of heat dissipation holes in the target area where the heat dissipation hole is located and the multiple target areas adjacent to the heat dissipation hole is greater than a preset number; the target area includes an area with an area equal to a preset area; the multiple target areas include areas located above, below, to the left, to the right, upper left, upper right, lower left and lower right of the heat dissipation hole.
6. The method according to claim 4 or 5, characterized in that: The adding heat dissipation holes to the first metal layer according to the number of heat dissipation holes that need to be adjusted in the first metal layer and the first adjustment constraint condition comprises: Dividing the first metal layer into a plurality of first regions; the number of the first regions is determined by the number of heat dissipation holes that need to be adjusted in the first metal layer; It is determined whether adding a heat dissipation hole in any of the first regions satisfies the first adjustment constraint condition, and if so, a heat dissipation hole is added in the first region.
7. The method according to claim 6, characterized in that The determining whether adding a heat dissipation hole in any of the first regions satisfies the first adjustment constraint condition comprises: Dividing the first area into a plurality of sub-areas; wherein the maximum side length of the sub-areas is smaller than the diameter of the heat dissipation hole, and the minimum side length of the sub-areas is greater than one tenth of the diameter of the heat dissipation hole; Determine one by one in a preset order whether adding a heat dissipation hole in the sub-area satisfies the first adjustment constraint condition; if adding a heat dissipation hole in any of the sub-areas satisfies the first adjustment constraint condition, then add a heat dissipation hole in the sub-area; the preset order includes a spiral order starting from the sub-area located at the center of the first metal layer.
8. The method according to claim 4 or 5, characterized in that: The deleting some of the heat dissipation holes in the second metal layer according to the number of heat dissipation holes that need to be adjusted in the second metal layer and the second adjustment constraint condition comprises: Dividing the second metal layer into a plurality of second regions; the number of the second regions is determined by the number of heat dissipation holes that need to be adjusted in the second metal layer; Determine whether deleting any heat dissipation hole in the second area satisfies the second adjustment constraint condition, and if so, delete the heat dissipation hole in the second area.
9. A computer device, characterized in that: including memory and processor; The memory is used to store instructions; The processor is used to execute the metal coverage adjustment method of the packaging substrate according to any one of claims 1 to 8 according to the instructions stored in the memory.
10. A computer-readable storage medium, characterized in that: Instructions for executing the method for adjusting the metal coverage of a packaging substrate as described in any one of claims 1 to 8 are stored thereon.