Circulating liquid resistivity adjusting device for semiconductor temperature control equipment
Patent Information
- Application Number
- CN202510110442.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-23
- Publication Date
- 2025-05-06
AI Technical Summary
During semiconductor manufacturing, the resistivity of the circulating liquid is unstable, which affects the performance and life of the temperature control equipment. If the resistivity is too low or too high, it will cause equipment failure or increase energy consumption.
A circulating fluid resistivity adjustment device is designed, including an adjustment branch and an adjustment module. The circulating fluid flow through the adjustment branch is controlled through the solenoid valve for processing, and the resistivity is monitored and adjusted in real time to ensure that it is within the optimal range.
The stability of the resistivity of the circulating fluid is achieved, the stability and reliability of the equipment is improved, the energy consumption is reduced, the service life of the equipment is extended, and the integration and maintenance of the equipment is simplified.
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Figure CN119943718A_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of semiconductor temperature control technology, and in particular to a circulating fluid resistivity adjustment device for semiconductor temperature control equipment. Background Art
[0002] In the field of semiconductor manufacturing, precise temperature control is the core element to ensure the stability of the production process and product quality. To achieve this goal, semiconductor temperature control equipment widely uses circulating fluid systems to accurately control the temperature of the production environment through the heat conduction of the circulating fluid.
[0003] However, the resistivity characteristics of the circulating fluid have an important impact on the performance of the temperature control system. Resistivity is not only related to the efficiency of heat conduction, but also directly related to the corrosion resistance, electrical safety and overall operational stability of the equipment. If the resistivity is too low, it may lead to increased electrochemical corrosion inside the equipment and affect the life of the equipment; if the resistivity is too high, it may increase energy consumption and reduce heat conduction efficiency, thereby affecting production efficiency and cost control. Therefore, how to effectively control the resistivity of the circulating fluid and keep it within the optimal range has become a key issue that needs to be urgently solved in the design and maintenance of semiconductor temperature control equipment. Summary of the invention
[0004] In view of this, an embodiment of the present application provides a circulating fluid resistivity adjustment device for a semiconductor temperature control device, which can stabilize the circulating fluid resistivity of the semiconductor temperature control device and improve the stability of the device and the energy-saving efficiency.
[0005] The technical solution of the embodiment of the present application is implemented as follows:
[0006] In a first aspect, an embodiment of the present application provides a circulating fluid resistivity adjustment device for a semiconductor temperature control device, wherein the semiconductor temperature control device comprises a circulating pipeline, wherein a circulating fluid flows in the circulating pipeline, and the device comprises: an adjustment branch and an adjustment module;
[0007] The adjusting branch is connected in parallel to the circulation pipeline, and the adjusting branch is used to shunt the circulating fluid in the circulation pipeline and to increase the resistivity of the shunt circulating fluid;
[0008] The regulating branch is provided with a solenoid valve for controlling the opening and closing of the regulating branch;
[0009] The adjustment module is used to control the opening and closing of the solenoid valve, and the signal output end of the adjustment module is connected to the signal input end of the solenoid valve.
[0010] In a second aspect, an embodiment of the present application further provides a circulating fluid resistivity adjustment system for semiconductor temperature control equipment, the system comprising the circulating fluid resistivity adjustment device for semiconductor temperature control equipment described in the first aspect.
[0011] In a third aspect, an embodiment of the present application further provides a method for adjusting the resistivity of a circulating fluid for a semiconductor temperature control device, wherein the circulating fluid resistivity adjusting device for a semiconductor temperature control device is applied in the semiconductor temperature control device, and the method comprises:
[0012] The resistivity of the circulating fluid of the semiconductor temperature control device is detected by a resistivity meter within a specific period, and it is determined whether the resistivity is greater than a lower limit value. If not, the solenoid valve is controlled to be normally open;
[0013] If so, determine whether the resistivity is greater than the target value. If so, control the solenoid valve not to operate; if not, control the solenoid valve to close after opening for a specific time.
[0014] In a fourth aspect, an embodiment of the present application further provides an electronic device, comprising: a processor, a storage medium and a bus, wherein the storage medium stores machine-readable instructions executable by the processor, and when the electronic device is running, the processor communicates with the storage medium through the bus, and the processor executes the machine-readable instructions to execute the circulating fluid resistivity adjustment method for semiconductor temperature control equipment described in the third aspect.
[0015] In a fifth aspect, an embodiment of the present application further provides a computer-readable storage medium, on which a computer program is stored. When the computer program is executed by a processor, the method for adjusting the resistivity of the circulating fluid for a semiconductor temperature control device described in the third aspect is executed.
[0016] The embodiments of the present application have the following beneficial effects:
[0017] (1) Through the precise control of the adjustment branch (such as the ion exchange resin filter barrel) and the solenoid valve, the resistivity of the circulating fluid can be adjusted in real time. When the resistivity is lower than the set lower limit, the solenoid valve automatically opens, allowing more circulating fluid to flow through the adjustment branch for processing, thereby increasing the resistivity; when the resistivity reaches or exceeds the target value, the solenoid valve closes to avoid over-processing. This precise control method ensures the stability of the circulating fluid resistivity and meets the strict requirements of semiconductor temperature control equipment.
[0018] (2) Improving equipment stability: The stability of the circulating fluid resistivity is crucial to the operation of semiconductor temperature control equipment. The embodiments of the present application effectively avoid equipment failure or performance degradation caused by resistivity fluctuations by real-time monitoring and adjustment of resistivity. This improves the stability and reliability of the equipment and extends the service life of the equipment.
[0019] (3) Energy saving and consumption reduction: In the embodiment of the present application, when the resistivity meets the requirements, the solenoid valve remains closed, avoiding unnecessary circulating fluid treatment and energy consumption. This intelligent control method helps to reduce equipment operating costs and improve energy efficiency.
[0020] (4) Easy integration and maintenance: The embodiment of the present application has a simple structure and is easy to integrate into existing semiconductor temperature control equipment. At the same time, due to the use of standardized components and connection methods, the maintenance and replacement of the device becomes more convenient and quick. BRIEF DESCRIPTION OF THE DRAWINGS
[0021] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.
[0022] Figure 1 It is a schematic diagram of the structure of a circulating fluid resistivity adjustment device for semiconductor temperature control equipment provided in an embodiment of the present application;
[0023] Figure 2 It is a schematic flow chart of a method for adjusting the resistivity of a circulating fluid for a semiconductor temperature control device provided in an embodiment of the present application;
[0024] Figure 3 It is a schematic diagram of the composition structure of the electronic device provided in the embodiment of the present application. DETAILED DESCRIPTION
[0025] To make the purpose, technical scheme and advantages of the embodiments of the present application clearer, the technical scheme in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. It should be understood that the drawings in the present application only serve the purpose of explanation and description and are not used to limit the scope of protection of the present application. In addition, it should be understood that the schematic drawings are not drawn in real proportion. The flowchart used in this application shows the operations implemented according to some embodiments of the present application. It should be understood that the operations of the flowchart can be implemented out of sequence, and the steps without logical context can be reversed in order or implemented simultaneously. In addition, those skilled in the art can add one or more other operations to the flowchart under the guidance of the content of the present application, or remove one or more operations from the flowchart.
[0026] In the following description, reference is made to “some embodiments”, which describe a subset of all possible embodiments, but it will be understood that “some embodiments” may be the same subset or different subsets of all possible embodiments and may be combined with each other without conflict.
[0027] In addition, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. The components of the embodiments of the present application described and shown in the drawings here can be arranged and designed in various configurations. Therefore, the following detailed description of the embodiments of the present application provided in the drawings is not intended to limit the scope of the application claimed for protection, but merely represents the selected embodiments of the present application. Based on the embodiments of the present application, all other embodiments obtained by those skilled in the art without making creative work belong to the scope of protection of the present application.
[0028] In the following description, the terms "first\second\third" involved are merely used to distinguish similar objects and do not represent a specific ordering of the objects. It can be understood that "first\second\third" can be interchanged with a specific order or sequence where permitted, so that the embodiments of the present application described herein can be implemented in an order other than that illustrated or described herein.
[0029] It should be noted that the term "comprising" will be used in the embodiments of the present application to indicate the existence of the features declared thereafter, but does not exclude the addition of other features.
[0030] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used herein are for the purpose of describing the embodiments of this application and are not intended to limit this application.
[0031] See also Figure 1 , Figure 1 This is a schematic diagram of the structure of the circulating fluid resistivity adjustment device for semiconductor temperature control equipment provided in the embodiment of the present application, which will be combined with Figure 1 Provide explanation.
[0032] The embodiment of the present application provides a circulating fluid resistivity adjustment device for a semiconductor temperature control device, wherein the semiconductor temperature control device comprises a circulating pipeline, in which a circulating fluid flows, and the device comprises: an adjustment branch and an adjustment module;
[0033] The adjusting branch is connected in parallel to the circulation pipeline, and the adjusting branch is used to shunt the circulating fluid in the circulation pipeline and to increase the resistivity of the shunt circulating fluid;
[0034] The regulating branch is provided with a solenoid valve for controlling the opening and closing of the regulating branch;
[0035] The adjustment module is used to control the opening and closing of the solenoid valve, and the signal output end of the adjustment module is connected to the signal input end of the solenoid valve.
[0036] Here, the circulation pipeline and the circulation fluid are applied to a semiconductor temperature control device, which includes a circulation pipeline. Circulating fluid flows in the circulation pipeline for temperature control of the semiconductor device. The adjustment branch is connected in parallel to the circulation pipeline for diverting part of the circulation fluid. The adjustment branch has the function of increasing the resistivity of the diverted circulation fluid. A solenoid valve is provided in the adjustment branch for controlling the opening and closing of the adjustment branch. The opening and closing state of the solenoid valve determines whether the adjustment branch diverts the circulation fluid and the amount of the diversion. The adjustment module is the control core of the device, which is used to control the opening and closing of the solenoid valve. The signal output end of the adjustment module is connected to the signal input end of the solenoid valve to realize electrical signal transmission and control.
[0037] When the semiconductor temperature control equipment is working, the circulating fluid continues to flow in the circulation pipeline to control the temperature of the semiconductor equipment. When the resistivity of the circulating fluid needs to be adjusted, the adjustment module sends a signal to the solenoid valve. After receiving the signal, the solenoid valve opens, allowing part of the circulating fluid to be diverted through the adjustment branch. The circulating fluid diverted to the adjustment branch undergoes specific treatment (such as adding electrolytes, changing the solution concentration, etc.) to increase its resistivity. The treated circulating fluid may re-enter the main circulation pipeline, or mix with the circulating fluid in the main circulation pipeline, thereby changing the resistivity of the entire circulation system.
[0038] The adjustment module can accurately control the opening and closing time and opening degree of the solenoid valve according to actual needs, thereby achieving precise control of the split flow rate. The solenoid valve has a fast response speed and can quickly adjust the resistivity of the circulating fluid to meet the real-time needs of semiconductor temperature control equipment.
[0039] In a possible implementation, the adjustment branch is an ion exchange resin filter barrel, and the ion exchange resin filter barrel is used to adsorb anions and cations in the circulating liquid flowing through to increase the resistivity of the circulating liquid.
[0040] Here, the adjustment branch is an ion exchange resin filter barrel. The ion exchange resin filter barrel is a specially designed container filled with ion exchange resin. Ion exchange resin is a polymer material with ion exchange function. It can adsorb anions and cations in the liquid flowing through its surface, and replace the ions on the resin with the ions in the liquid by ion exchange. When the circulating liquid flows through the ion exchange resin filter barrel, the anions and cations in it are adsorbed by the resin and replace the ions on the resin. This process can remove some ions in the circulating liquid, thereby increasing its resistivity.
[0041] In some embodiments, the adjustment module controls the solenoid valve to open when the resistivity of the circulating fluid is lower than a lower limit value.
[0042] In some embodiments, when the resistivity of the circulating fluid is higher than the lower limit value, the adjustment module determines whether the resistivity is higher than the target value. If it is lower than the target value, the adjustment module controls the solenoid valve to open for a specific time and then close; if it is higher than the target value, the adjustment module controls the solenoid valve not to operate.
[0043] Here, the adjustment module continuously monitors the resistivity of the circulating fluid. When the resistivity is lower than the preset lower limit, the adjustment module considers that the resistivity of the circulating fluid needs to be increased. When the resistivity of the circulating fluid is lower than the lower limit, the adjustment module controls the solenoid valve to open.
[0044] After the solenoid valve is opened, the circulating fluid begins to be diverted into the ion exchange resin filter barrel for treatment to increase the resistivity.
[0045] When the resistivity of the circulating fluid is higher than the lower limit, the adjustment module further determines whether the resistivity is higher than the target value. If the resistivity is still lower than the target value, the adjustment module will control the solenoid valve to open for a specific time (this time period can be preset according to actual needs) to allow an appropriate amount of circulating fluid to pass through the ion exchange resin filter barrel for treatment. After the treatment is completed, the solenoid valve automatically closes and the circulating fluid resumes its normal flow path.
[0046] If the resistivity is already higher than the target value, the adjustment module considers that the current resistivity has met the requirement, and therefore controls the solenoid valve to remain in this state in order to maintain a higher resistivity.
[0047] In a possible implementation manner, the detection of the resistivity is repeatedly performed within a specific time period.
[0048] Here, by repeatedly detecting the resistivity within a specific time period, the adjustment module can understand the changes in the resistivity of the circulating fluid in real time. Once the resistivity deviates from the preset range, the adjustment module can respond quickly and adjust the resistivity by controlling the opening and closing of the solenoid valve to ensure that it is within the target range. Periodic resistivity detection helps to detect potential faults or abnormal conditions in a timely manner. If the resistivity continues to deviate from the normal range, it may mean that there are impurities in the circulating fluid, resin failure, or other problems. Timely adjustment can prevent these problems from causing damage to semiconductor temperature control equipment. In an embodiment of the present application, the cycle can be set to once every 5 minutes.
[0049] In some embodiments, the resistivity of the circulating fluid is detected by a resistivity meter, the resistivity meter is arranged in the circulation pipeline, and the signal output end of the resistivity meter is connected to the signal input end of the adjustment module.
[0050] Here, the resistivity meter is installed directly in the circulation pipeline to ensure that the resistivity meter can accurately and quickly measure the resistivity of the circulating fluid. The resistivity meter indirectly determines the resistivity of the circulating fluid by measuring the conductivity of the circulating fluid under specific conditions. Generally, resistivity is inversely proportional to conductivity, that is, the higher the resistivity, the lower the conductivity; and vice versa. The signal output end of the resistivity meter is connected to the signal input end of the adjustment module. When the resistivity meter completes the measurement, it will send the measured resistivity value to the adjustment module in the form of an electrical signal. After receiving the signal sent by the resistivity meter, the adjustment module will immediately analyze the resistivity value. According to the preset logic and algorithm, the adjustment module will decide whether the resistivity of the circulating fluid needs to be adjusted, and how to achieve this goal by controlling the solenoid valve.
[0051] An embodiment of the present application also provides a circulating fluid resistivity adjustment system for semiconductor temperature control equipment, and the system includes the circulating fluid resistivity adjustment device for semiconductor temperature control equipment described in the embodiment of the present application.
[0052] See also Figure 2 , Figure 2 : is a flow chart of a method for adjusting the resistivity of a circulating fluid for a semiconductor temperature control device provided in an embodiment of the present application. Figure 2 As shown, an embodiment of the present application provides a method for adjusting the resistivity of a circulating fluid for a semiconductor temperature control device, wherein the device for adjusting the resistivity of a circulating fluid for a semiconductor temperature control device is applied in the semiconductor temperature control device, and the method includes:
[0053] The resistivity of the circulating fluid of the semiconductor temperature control device is detected by a resistivity meter within a specific period, and it is determined whether the resistivity is greater than a lower limit value. If not, the solenoid valve is controlled to be normally open;
[0054] If so, determine whether the resistivity is greater than the target value. If so, control the solenoid valve not to operate; if not, control the solenoid valve to close after opening for a specific time.
[0055] Here, a resistivity meter is used to detect the resistivity of the circulating fluid of the semiconductor temperature control equipment within a specific period. This period can be set according to actual needs to ensure real-time monitoring and adjustment of the resistivity.
[0056] Comparison of resistivity with lower limit value: After the test is completed, the measured resistivity is compared with the preset lower limit value.
[0057] If the resistivity is less than or equal to the lower limit, it means that the resistivity of the circulating fluid is too low and needs to be increased. At this time, the solenoid valve is controlled to remain normally open, so that more circulating fluid flows through the ion exchange resin filter barrel for treatment to increase the resistivity.
[0058] Resistivity compared to target value: If the resistivity is greater than the lower limit, it is further compared to the target value.
[0059] If the resistivity is greater than or equal to the target value, it means that the resistivity of the circulating fluid has met the requirements and no further adjustment is required. At this time, the control solenoid valve does not operate.
[0060] If the resistivity is less than the target value but greater than the lower limit, it means that the resistivity of the circulating fluid has increased but has not yet reached the optimal state. At this time, the control solenoid valve is closed after opening for a specific time. This time can be set according to actual needs to ensure that the appropriate amount of circulating fluid flows through the ion exchange resin filter barrel for treatment, while avoiding waste caused by excessive treatment.
[0061] In summary, the embodiments of the present application have the following beneficial effects:
[0062] (1) Through the precise control of the adjustment branch (such as the ion exchange resin filter barrel) and the solenoid valve, the resistivity of the circulating fluid can be adjusted in real time. When the resistivity is lower than the set lower limit, the solenoid valve automatically opens, allowing more circulating fluid to flow through the adjustment branch for processing, thereby increasing the resistivity; when the resistivity reaches or exceeds the target value, the solenoid valve closes to avoid over-processing. This precise control method ensures the stability of the circulating fluid resistivity and meets the strict requirements of semiconductor temperature control equipment.
[0063] (2) Improving equipment stability: The stability of the circulating fluid resistivity is crucial to the operation of semiconductor temperature control equipment. The embodiments of the present application effectively avoid equipment failure or performance degradation caused by resistivity fluctuations by real-time monitoring and adjustment of resistivity. This improves the stability and reliability of the equipment and extends the service life of the equipment.
[0064] (3) Energy saving and consumption reduction: In the embodiment of the present application, when the resistivity meets the requirements, the solenoid valve remains closed, avoiding unnecessary circulating fluid treatment and energy consumption. This intelligent control method helps to reduce equipment operating costs and improve energy efficiency.
[0065] (4) Easy integration and maintenance: The embodiment of the present application has a simple structure and is easy to integrate into existing semiconductor temperature control equipment. At the same time, due to the use of standardized components and connection methods, the maintenance and replacement of the device becomes more convenient and quick.
[0066] like Figure 3 As shown, Figure 3 The present invention provides a schematic diagram of the structure of an electronic device 300, wherein the electronic device 300 includes:
[0067] A processor 301, a storage medium 302 and a bus 303, wherein the storage medium 302 stores machine-readable instructions executable by the processor 301. When the electronic device 300 is running, the processor 301 communicates with the storage medium 302 via the bus 303, and the processor 301 executes the machine-readable instructions to execute the steps of the method for adjusting the resistivity of the circulating fluid for semiconductor temperature control equipment described in the embodiment of the present application.
[0068] In actual application, the components in the electronic device 300 are coupled together via the bus 303. It is understood that the bus 303 is used to realize the connection and communication between these components. In addition to the data bus, the bus 303 also includes a power bus, a control bus, and a status signal bus. However, for the sake of clarity, Figure 3 Various buses are labeled as bus 303.
[0069] The electronic device has the following beneficial effects:
[0070] (1) Through the precise control of the adjustment branch (such as the ion exchange resin filter barrel) and the solenoid valve, the resistivity of the circulating fluid can be adjusted in real time. When the resistivity is lower than the set lower limit, the solenoid valve automatically opens, allowing more circulating fluid to flow through the adjustment branch for processing, thereby increasing the resistivity; when the resistivity reaches or exceeds the target value, the solenoid valve closes to avoid over-processing. This precise control method ensures the stability of the circulating fluid resistivity and meets the strict requirements of semiconductor temperature control equipment.
[0071] (2) Improving equipment stability: The stability of the circulating fluid resistivity is crucial to the operation of semiconductor temperature control equipment. The embodiments of the present application effectively avoid equipment failure or performance degradation caused by resistivity fluctuations by real-time monitoring and adjustment of resistivity. This improves the stability and reliability of the equipment and extends the service life of the equipment.
[0072] (3) Energy saving and consumption reduction: In the embodiment of the present application, when the resistivity meets the requirements, the solenoid valve remains closed, avoiding unnecessary circulating fluid treatment and energy consumption. This intelligent control method helps to reduce equipment operating costs and improve energy efficiency.
[0073] (4) Easy integration and maintenance: The embodiment of the present application has a simple structure and is easy to integrate into existing semiconductor temperature control equipment. At the same time, due to the use of standardized components and connection methods, the maintenance and replacement of the device becomes more convenient and quick.
[0074] The embodiment of the present application also provides a computer-readable storage medium, which stores executable instructions. When the executable instructions are executed by at least one processor 301, the circulating fluid resistivity adjustment method for semiconductor temperature control equipment described in the embodiment of the present application is implemented.
[0075] In some embodiments, the storage medium can be a magnetic random access memory (FRAM), a read-only memory (ROM), a programmable read-only memory (PROM), an erasable programmable read-only memory (EPROM), an electrically erasable programmable read-only memory (EEPROM), a flash memory, a magnetic surface storage, an optical disk, or a compact disc read-only memory (CDROM); it can also be various devices including one or any combination of the above memories.
[0076] In some embodiments, executable instructions may be in the form of a program, software, software module, script or code, written in any form of programming language (including compiled or interpreted languages, or declarative or procedural languages), and may be deployed in any form, including as a stand-alone program or as a module, component, subroutine or other unit suitable for use in a computing environment.
[0077] As an example, executable instructions may, but do not necessarily, correspond to a file in a file system, may be stored as part of a file that stores other programs or data, for example, in one or more scripts in a HyperText Markup Language (HTML) document, in a single file dedicated to the program in question, or in multiple coordinated files (for example, files storing one or more modules, subroutines, or code portions).
[0078] By way of example, executable instructions may be deployed to be executed on one computing device, or on multiple computing devices located at one site, or on multiple computing devices distributed across multiple sites and interconnected by a communication network.
[0079] The computer-readable storage medium has the following advantages:
[0080] (1) Through the precise control of the adjustment branch (such as the ion exchange resin filter barrel) and the solenoid valve, the resistivity of the circulating fluid can be adjusted in real time. When the resistivity is lower than the set lower limit, the solenoid valve automatically opens, allowing more circulating fluid to flow through the adjustment branch for processing, thereby increasing the resistivity; when the resistivity reaches or exceeds the target value, the solenoid valve closes to avoid over-processing. This precise control method ensures the stability of the circulating fluid resistivity and meets the strict requirements of semiconductor temperature control equipment.
[0081] (2) Improving equipment stability: The stability of the circulating fluid resistivity is crucial to the operation of semiconductor temperature control equipment. The embodiments of the present application effectively avoid equipment failure or performance degradation caused by resistivity fluctuations by real-time monitoring and adjustment of resistivity. This improves the stability and reliability of the equipment and extends the service life of the equipment.
[0082] (3) Energy saving and consumption reduction: In the embodiment of the present application, when the resistivity meets the requirements, the solenoid valve remains closed, avoiding unnecessary circulating fluid treatment and energy consumption. This intelligent control method helps to reduce equipment operating costs and improve energy efficiency.
[0083] (4) Easy integration and maintenance: The embodiment of the present application has a simple structure and is easy to integrate into existing semiconductor temperature control equipment. At the same time, due to the use of standardized components and connection methods, the maintenance and replacement of the device becomes more convenient and quick.
[0084] In the several embodiments provided in the present application, it should be understood that the disclosed methods and electronic devices can be implemented in other ways. The device embodiments described above are only schematic. For example, the division of the units is only a logical function division. There may be other division methods in actual implementation, such as: multiple units or components can be combined, or can be integrated into another system, or some features can be ignored or not executed. In addition, the coupling, direct coupling, or communication connection between the components shown or discussed can be through some interfaces, and the indirect coupling or communication connection of the devices or units can be electrical, mechanical or other forms.
[0085] The modules described as separate components may or may not be physically separated, and the components shown as modules may or may not be physical units, that is, they may be located in one place or distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.
[0086] In addition, each functional unit in each embodiment of the present application may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit.
[0087] If the functions are implemented in the form of software functional units and sold or used as independent products, they can be stored in a non-volatile computer-readable storage medium that is executable by a processor. Based on this understanding, the technical solution of the present application can essentially be embodied in the form of a software product, or in other words, the part that contributes to the prior art or the part of the technical solution. The computer software product is stored in a storage medium, including several instructions for a computer device (which can be a personal computer, a platform server, or a network device, etc.) to perform all or part of the steps of the method described in each embodiment of the present application. The aforementioned storage medium includes: various media that can store program codes, such as USB flash drives, mobile hard disks, ROM, RAM, magnetic disks, or optical disks.
[0088] The above are only specific implementations of the present application, but the protection scope of the present application is not limited thereto. Any technician familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.
Claims
1. A circulating fluid resistivity adjustment device for semiconductor temperature control equipment, characterized in that: The semiconductor temperature control device comprises a circulation pipeline, in which a circulation fluid flows, and the device comprises: an adjustment branch and an adjustment module; The adjusting branch is connected in parallel to the circulation pipeline, and the adjusting branch is used to shunt the circulating fluid in the circulation pipeline and to increase the resistivity of the shunt circulating fluid; The regulating branch is provided with a solenoid valve for controlling the opening and closing of the regulating branch; The adjustment module is used to control the opening and closing of the solenoid valve, and the signal output end of the adjustment module is connected to the signal input end of the solenoid valve.
2. The device according to claim 1, characterized in that The adjustment branch is an ion exchange resin filter barrel, and the ion exchange resin filter barrel is used to adsorb anions and cations in the circulating liquid flowing through to increase the resistivity of the circulating liquid.
3. The device according to claim 1, characterized in that The adjustment module controls the solenoid valve to open when the resistivity of the circulating fluid is lower than a lower limit value.
4. The device according to claim 1, characterized in that When the resistivity of the circulating fluid is higher than the lower limit value, the adjustment module determines whether the resistivity is higher than the target value. If it is lower than the target value, the adjustment module controls the solenoid valve to open for a specific time and then close; if it is higher than the target value, the adjustment module controls the solenoid valve not to operate.
5. The device according to claim 3 or 4, characterized in that The detection of the resistivity is repeated within a specific time period.
6. The device according to any one of claims 1 to 5, characterized in that: The resistivity of the circulating fluid is detected by a resistivity meter, which is arranged in the circulating pipeline, and a signal output end of the resistivity meter is connected to a signal input end of the adjustment module.
7. A circulating fluid resistivity adjustment system for semiconductor temperature control equipment, characterized in that: The system includes a circulating fluid resistivity adjustment device for semiconductor temperature control equipment as described in any one of claims 1-6.
8. A method for adjusting the resistivity of circulating fluid in semiconductor temperature control equipment, characterized in that: The circulating fluid resistivity adjustment device for semiconductor temperature control equipment is applied in the semiconductor temperature control equipment, and the method includes: The resistivity of the circulating fluid of the semiconductor temperature control device is detected by a resistivity meter within a specific period, and it is determined whether the resistivity is greater than a lower limit value. If not, the solenoid valve is controlled to be normally open; If so, determine whether the resistivity is greater than the target value. If so, control the solenoid valve not to operate; if not, control the solenoid valve to close after opening for a specific time.
9. An electronic device, characterized in that: include: A processor, a storage medium and a bus, wherein the storage medium stores machine-readable instructions executable by the processor. When the electronic device is running, the processor communicates with the storage medium via the bus, and the processor executes the machine-readable instructions to execute the circulating fluid resistivity adjustment method for semiconductor temperature control equipment as described in claim 8.
10. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores a computer program, and when the computer program is executed by the processor, the method for adjusting the resistivity of the circulating fluid for a semiconductor temperature control device according to claim 8 is executed.