Wafer carrying device

Abstract

The invention provides a wafer carrying device which comprises a moving mechanism, a connecting support, a mounting disc, a plurality of non-contact adsorption assemblies and a plurality of anti-falling assemblies, the connecting support is connected to the driving end of the moving mechanism, the mounting disc is connected to the connecting support, and the moving mechanism is configured to drive the mounting disc to move horizontally and ascend and descend; the plurality of non-contact adsorption assemblies are arranged at the bottom of the mounting disc in the circumferential direction and are configured to adsorb a wafer located below the mounting disc in a non-contact mode; and the plurality of anti-falling assemblies are arranged on the mounting disc along the circumferential direction and are configured to extend to the lower part of the adsorbed wafer from the circumferential side. The non-contact adsorption of the wafer is implemented through the plurality of non-contact adsorption assemblies, that is, the non-contact adsorption assemblies do not need to press down the wafer when absorbing the wafer, and extrusion between the non-contact adsorption assemblies and the wafer is not needed in the carrying process, so that any damage to the wafer is avoided. In addition, when the non-contact adsorption assembly accidentally loses the adsorption force, the wafer is carried by the anti-falling assembly, and anti-falling is achieved.

Description

Technical Field

[0001] The present application relates to the field of semiconductor device production, and specifically to a wafer handling device. Background Art

[0002] During the semiconductor production process, a wafer handling device is required to take the wafer out of a material box and transport the wafer to a processing station for processing. Existing wafer handling devices generally use a vacuum suction cup to contact the wafer to implement wafer suction.

[0003] However, for thin wafers, the vacuum chuck can easily break the wafer due to excessive pressure when pressing down on the wafer. The vacuum chuck may cause indentations or scratches on the wafer when adsorbing the wafer. In addition, during the handling process, when the vacuum system fails, the vacuum chuck may break the vacuum, causing the wafer to fall accidentally. Summary of the invention

[0004] In order to solve the above technical problems, the present application provides a wafer handling device, which adopts the following technical solutions:

[0005] A wafer handling device includes a moving mechanism, a connecting bracket, a mounting plate, a plurality of non-contact adsorption components and a plurality of anti-falling components, wherein:

[0006] The connecting bracket is connected to the driving end of the moving mechanism, the mounting plate is connected to the connecting bracket, and the moving mechanism is configured to drive the mounting plate to translate and lift;

[0007] A plurality of non-contact adsorption components are arranged at the bottom of the mounting plate along the circumferential direction and are configured to adsorb the wafer located below the mounting plate in a non-contact manner;

[0008] A plurality of anti-falling components are arranged on the mounting plate along the circumferential direction and are configured to extend from the circumferential side to the bottom of the adsorbed wafer.

[0009] The wafer handling device provided by the present application implements non-contact adsorption of wafers through a number of non-contact adsorption components, that is, the non-contact adsorption component does not need to press down the wafer when sucking the wafer, and does not need to squeeze the wafer during the handling process, thereby avoiding any damage to the wafer. In addition, after the non-contact adsorption components adsorb the wafer, a number of anti-fall components extend from the peripheral side to the bottom of the adsorbed wafer, thereby implementing anti-fall protection for the wafer. In other words, when the non-contact adsorption component accidentally loses its adsorption force, the wafer is taken up by the anti-fall component to prevent it from falling.

[0010] In some embodiments, the non-contact adsorption component includes a seat body and a core body, wherein: the seat body is connected to the mounting plate, an air duct connected to a compressed air source is arranged in the seat body, a mounting groove is arranged at the bottom of the seat body, which runs from the first end of the seat body to the second end of the seat body, the mounting groove is connected to the air duct, the core body is embedded in the mounting groove, and the contact points between the two side surfaces of the core body and the mounting groove are provided with a first air cavity connected to the air duct, a first blowing seam connected to the first air cavity on the corresponding side is formed between the first side edge of the core body and the seat body, and a second blowing seam connected to the first air cavity on the corresponding side is formed between the second side edge of the core body and the seat body; after the high-pressure gas supplied by the compressed air source enters the first air cavity on both sides through the air duct, it is blown out at high speed to both sides of the non-contact adsorption component through the first blowing seam and the second blowing seam to generate an adsorption area below the non-contact adsorption component.

[0011] A method for implementing a non-contact adsorption component is provided. When a compressed air source is blown out at high speed to both sides of the non-contact adsorption component through a first air blowing slit and a second air blowing slit, the air below the non-contact adsorption component is taken away, thereby generating an adsorption area below the non-contact adsorption component. In addition, the non-contact adsorption component is a split structure consisting of a seat body and a core body, which facilitates the processing and forming of internal air path structures such as an airway, a first air cavity, and an installation groove.

[0012] In some embodiments, the non-contact adsorption component includes a seat body and a baffle, wherein: the seat body is connected to the mounting plate, an air duct connected to a compressed air source is provided in the seat body, a second air cavity connected to the air duct is provided at the bottom of the seat body, and the second air cavity opens downward; the baffle is provided at the bottom of the seat body and covers the second air cavity, and a first air blowing slit and a second air blowing slit connected to the second air cavity are respectively formed at the contact points between the opposite side edges of the baffle and the seat body; after the high-pressure gas supplied by the compressed air source enters the second air cavity through the air duct, it is blown out at high speed to both sides of the non-contact adsorption component through the first air blowing slit and the second air blowing slit to generate an adsorption area below the non-contact adsorption component.

[0013] Another implementation method of the non-contact adsorption component is provided. When the compressed air source is blown out at high speed to both sides of the non-contact adsorption component through the first air blowing slit and the second air blowing slit, the air below the non-contact adsorption component is taken away, thereby generating an adsorption area below the non-contact adsorption component. In addition, the non-contact adsorption component is a split structure consisting of a seat body and a baffle, which facilitates the processing and forming of internal air path structures such as the airway and the second air cavity.

[0014] In some embodiments, the anti-fall assembly includes a support plate, a translational drive component and an L-shaped hook, wherein: the support plate is arranged at the edge of the mounting plate, the upper end of the hook is rotatably connected to the support plate via a rotating shaft, and the lower end of the hook is the anti-fall end; the translational drive component is arranged on the mounting plate, and the translational drive component is used to drive the hook to rotate toward or away from the mounting plate, so that the hook switches between a working position and an avoidance position; when the hook is switched to the working position, the anti-fall end of the hook extends downward to the bottom of the mounting plate; when the hook is switched to the avoidance position, the anti-fall end of the hook is withdrawn from the bottom of the mounting plate.

[0015] The invention provides an anti-falling component with simple structure and convenient control, which can drive the hook to rotate through a translation driving member to implement anti-falling protection for the wafer. In addition, the main components of the anti-falling component are arranged on the upper side of the mounting plate, which will not interfere with the non-contact adsorption component.

[0016] In some embodiments, the translation drive member includes a cylinder, a cylinder body of the cylinder is disposed on the mounting plate, and a telescopic rod of the cylinder radially passes through the support plate outward and then abuts against the hook claw.

[0017] The cylinder has the advantages of light weight and high driving speed, which reduces the weight of the anti-falling component. In addition, the telescopic rod of the cylinder is against the hook claw, but not connected to the hook claw, which facilitates the maintenance and disassembly of the hook claw and the translation drive member.

[0018] In some embodiments, the wafer handling device includes three non-contact adsorption components, which are evenly arranged on the mounting plate along the circumference, and the distances between the three non-contact adsorption components and the center of the mounting plate are equal; the wafer handling device includes three anti-fall components, which are evenly arranged on the mounting plate along the circumference, and the distances between the three anti-fall components and the center of the mounting plate are equal.

[0019] By setting three non-contact adsorption components and setting the installation positions of the three non-contact adsorption components, the three non-contact adsorption components can implement stable adsorption of the wafer to prevent the wafer from tilting or sliding. By setting three anti-falling components and setting the installation positions of the three anti-falling components, when the non-contact adsorption components lose their adsorption force, the wafer can be stably supported on the three anti-falling components.

[0020] In some embodiments, the wafer transport device also includes a positioning component arranged on the connecting bracket, and the positioning component is connected to the control end signal of the moving mechanism; the positioning component is configured to position the wafer to be transported to obtain the position information of the wafer, and send the position information of the wafer to the control end of the moving mechanism; the moving mechanism is configured to drive the mounting plate to translate according to the position information of the wafer, so that the center of the mounting plate is aligned with the center of the wafer.

[0021] By setting the positioning component, the wafer is positioned so that the center of the mounting plate is aligned with the center of the wafer, and finally the adsorption stability of the three non-contact adsorption components on the wafer is improved. In addition, the wafer can enter the area between the three anti-falling components, and finally ensure that the three anti-falling components can extend from the circumference to the bottom of the adsorbed wafer.

[0022] In some embodiments, the wafer handling device also includes a plurality of limit assemblies, which are circumferentially arranged at the bottom of the mounting plate; the bottom surface of the limit assemblies is lower than the adsorption surface of the non-contact adsorption assembly, and a flexible layer is arranged on the bottom surface of the limit assemblies.

[0023] By setting a number of limiter components and making the bottom surface of the limiter components lower than the adsorption surface of the non-contact adsorption component, on the one hand, the adsorbed wafer is pressed against the bottom surface of the limiter components to prevent the wafer from floating up and down. On the other hand, it is ensured that the wafer does not come into contact with the adsorption surface of the non-contact adsorption component. Since a flexible layer is provided on the bottom surface of the limiter component, it is possible to prevent the limiter component from causing pressure damage to the wafer.

[0024] In some embodiments, the wafer handling device includes three limiting components, and the three limiting components are evenly arranged on the mounting plate along the circumferential direction, and the distances between the three limiting components and the center of the mounting plate are equal.

[0025] By setting three limit assemblies and setting the installation positions of the three limit assemblies, the three limit assemblies can implement stable limit on the wafer to prevent the wafer from being compressed due to uneven force.

[0026] In some embodiments, the mounting plate is connected to the connecting bracket via three connecting columns evenly arranged along the circumference, and the distances between the three connecting columns and the center of the mounting plate are equal.

[0027] The connection stability between the mounting plate and the connecting bracket is improved to prevent the mounting plate from tilting or shaking. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 Schematic diagram of the structure of the wafer handling device in the embodiment of the present application;

[0029] Figure 2 It is a schematic diagram of the assembly of the mounting plate, the non-contact adsorption component and the anti-falling component in the embodiment of the present application;

[0030] Figure 3 This is a schematic structural diagram of a non-contact adsorption component in one embodiment of the present application;

[0031] Figure 4 This is a schematic structural diagram of a non-contact adsorption component in another embodiment of the present application;

[0032] Figure 5 It is a schematic diagram of the structure of the anti-falling assembly in the embodiment of the present application;

[0033] Figure 6 It is a schematic diagram of the structure of the limiting component and the non-contact adsorption component in the embodiment of the present application.

[0034] Figures 1 to 6 Included:

[0035] Moving mechanism 1: translation driving unit 11, lifting driving unit 12;

[0036] Connect bracket 2;

[0037] Installation disk 3;

[0038] Non-contact adsorption component 4: base body 41, core body 42, air channel 43, first air cavity 44, first air blowing slit 45, second air blowing slit 46, baffle 47, second air cavity 48;

[0039] Anti-falling component 5: support plate 51, translation driving member 52, hook 53, rotating shaft 54;

[0040] Limiting assembly 6: connecting rod 61, limiting block 62;

[0041] Connecting column 7. DETAILED DESCRIPTION

[0042] The technical solution of the present application will be described clearly and completely below in conjunction with the accompanying drawings. Obviously, the described embodiments are part of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present application.

[0043] In the description of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present application. In addition, the terms "first", "second", and "third" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.

[0044] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0045] In addition, the technical features involved in the different embodiments of the present application described below can be combined with each other as long as they do not conflict with each other.

[0046] As described in the background technology section, the existing wafer handling device uses a vacuum suction cup to contact the wafer to suck the wafer. For thin wafers, the wafer may be broken due to excessive pressure when the vacuum suction cup presses down on the wafer. When the vacuum suction cup adsorbs the wafer, it may cause indentations or scratches on the wafer. In addition, during the handling process, when the vacuum system fails, the vacuum suction cup will break the vacuum, causing the wafer to fall accidentally.

[0047] To this end, the present application provides a wafer handling device. Figure 1 and Figure 2 As shown, the wafer handling device in the embodiment of the present application includes a moving mechanism 1, a connecting bracket 2, a mounting plate 3, a plurality of non-contact adsorption components 4 and a plurality of anti-falling components 5, wherein:

[0048] The connecting bracket 2 is connected to the driving end of the moving mechanism 1 , the mounting plate 3 is connected to the connecting bracket 2 , and the moving mechanism 1 is configured to drive the mounting plate 3 to translate and rise and fall.

[0049] A plurality of non-contact adsorption components 4 are circumferentially arranged at the bottom of the mounting plate 3 , and are configured to adsorb the wafer 100 located below the mounting plate 3 in a non-contact manner.

[0050] A plurality of anti-falling components 5 are disposed on the mounting plate 3 along the circumferential direction, and are configured to extend from the circumferential side to below the adsorbed wafer 100 .

[0051] The optional working process of the wafer handling device in the embodiment of the present application is as follows:

[0052] The moving mechanism 1 drives the mounting plate 3 to translate and rise and fall, so that a plurality of non-contact adsorption components 4 are distributed circumferentially above the wafer 100 to be transported and close to the wafer 100 .

[0053] A plurality of non-contact adsorption components 4 are controlled to adsorb the wafer 100 in a non-contact adsorption manner.

[0054] A plurality of anti-falling components 5 are controlled to extend from the peripheral side to the bottom of the circle 100 to implement anti-falling protection for the wafer 100 .

[0055] The moving mechanism 1 drives the mounting plate 3 to move to the target position, and controls the plurality of anti-falling components 5 to withdraw from under the wafer 100 .

[0056] The plurality of non-contact adsorption components 4 are controlled to release the wafer 100 .

[0057] The wafer handling device provided in the embodiment of the present application implements non-contact adsorption of the wafer 100 through a plurality of non-contact adsorption components 4, that is, the non-contact adsorption components 4 do not need to press down the wafer 100 when sucking the wafer 100, and do not need to squeeze the wafer 100 during the handling process, thereby avoiding any damage to the wafer 100.

[0058] In addition, after the non-contact adsorption components 4 adsorb the wafer, the anti-fall components 5 extend from the peripheral side to the bottom of the adsorbed wafer 100, thereby implementing anti-fall protection for the wafer 100. In this way, when the non-contact adsorption components 4 accidentally lose their adsorption force, the wafer 100 is received by the anti-fall components 5 to prevent it from falling.

[0059] Optionally, the moving mechanism 1 includes a translation driving unit 11 and a lifting driving unit 12, wherein the lifting driving unit 12 is connected to the driving end of the translation driving unit 11, and the connecting bracket 2 is connected to the driving end of the lifting driving unit 12, the translation driving unit 11 is used to drive the installation disk 3 to translate, and the lifting driving unit 12 is used to drive the installation disk 3 to rise and fall.

[0060] like Figure 3 As shown, in an optional embodiment, the non-contact adsorption component 4 includes a seat body 41 and a core body 42, wherein: the seat body 41 is connected to the mounting plate 3, an air duct 43 connected to a compressed air source is arranged in the seat body 41, a mounting groove is arranged at the bottom of the seat body 41 from the first end of the seat body 41 to the second end of the seat body, the mounting groove is communicated with the air duct 43, the core body 2 is embedded in the mounting groove, and a first air cavity 44 connected to the air duct 43 is arranged at the contact point between the two side surfaces of the core body 42 and the mounting groove, a first air blowing gap 45 connected to the first air cavity 44 on the corresponding side is formed between the first side edge of the core body 42 and the seat body 41, and a second air blowing gap 46 connected to the first air cavity 44 on the corresponding side is formed between the second side edge of the core body 42 and the seat body 41.

[0061] After the high-pressure gas supplied by the compressed gas source enters the first air cavity 44 on both sides through the air channel 43, it is blown out at high speed to both sides of the non-contact adsorption component through the first blowing slit 45 and the second blowing slit 46, so that the air under the non-contact adsorption component 4 is taken away, and finally an adsorption area for adsorbing wafers is generated under the non-contact adsorption component 4.

[0062] Since the non-contact adsorption component 4 is a split structure consisting of a base body 41 and a core body 42, it is convenient to process and shape the internal air path structure such as the air channel 43, the first air cavity 44 and the installation groove. The first air cavity 44 can be, for example, a plurality of groove bodies arranged on the two side surfaces of the core body 42, the upper end of the groove body is connected to the air channel 43, and the lower end is connected to the first air blowing slit 45 or the second air blowing slit 46.

[0063] like Figure 4 As shown, in another optional embodiment, the non-contact adsorption component 4 includes a seat body 41 and a baffle 47, wherein: the seat body 41 is connected to the mounting plate 3, an air passage 43 connected to the compressed air source is provided in the seat body 41, and a second air cavity 48 connected to the air passage 43 is provided at the bottom of the seat body 41, and the second air cavity 48 opens downward. The baffle 47 is arranged at the bottom of the seat body 41 and covers the second air cavity 48, and the first air blowing slot 45 and the second air blowing slot 46 connected to the second air cavity 48 are respectively formed at the contact points between the opposite side edges of the baffle 47 and the seat body 41.

[0064] After the high-pressure gas supplied by the compressed gas source enters the second air cavity 48 through the air channel 43, it is blown out at high speed to both sides of the non-contact adsorption component 4 through the first blowing slit 45 and the second blowing slit 46, so that the air under the non-contact adsorption component 4 is taken away, and finally an adsorption area for adsorbing wafers is generated under the non-contact adsorption component 4.

[0065] Since the non-contact adsorption component 4 is a split structure consisting of a base body 41 and a baffle 47 , it is convenient to process and shape the internal air path structures such as the air channel 43 and the second air cavity 48 .

[0066] like Figure 5 As shown, the anti-falling assembly 5 optionally includes a support plate 51, a translation drive member 52 and an L-shaped hook 53, wherein: the support plate 51 is arranged at the edge of the mounting plate 3, the upper end of the hook 53 is rotatably connected to the support plate 51 via a rotating shaft 54, and the lower end of the hook 53 is an anti-falling end. The translation drive member 52 is arranged on the mounting plate 3, and the translation drive member 52 is used to drive the hook 53 to rotate toward or away from the mounting plate 3, so that the hook 53 switches between the working position A and the avoidance position B.

[0067] When the hook 53 is moved to the working position A, the anti-falling end of the hook A extends downward to the bottom of the mounting plate 3 , thereby implementing anti-falling protection for the adsorbed wafer 100 .

[0068] When the hook 53 is moved to the avoidance position B, the anti-falling end of the hook is withdrawn from under the mounting plate 3, so that the non-contact adsorption component 4 can absorb the wafer to be transported, or release the wafer to the target position.

[0069] Since the supporting plate 51 , the translation driving member 52 and other components are all arranged on the upper side of the mounting plate 3 , the anti-falling component 5 will not interfere with the adsorption of the non-contact adsorption component 4 .

[0070] like Figure 5 As shown, optionally, the translation driving member 52 includes a cylinder, wherein the cylinder body of the cylinder is arranged on the mounting plate 3, and the telescopic rod of the cylinder passes through the support plate 51 radially outward and then abuts against the hook 53. When the telescopic rod of the cylinder is extended, the hook 53 can be pushed away from the mounting plate 3 to rotate to the avoidance position B, and when the telescopic rod of the cylinder is retracted, the hook 53 rotates toward the mounting plate 3 to the working position A under the action of its own gravity.

[0071] The air cylinder has the advantages of light weight and high driving speed, which reduces the weight of the anti-falling assembly 5 and ultimately reduces the overall weight of the mounting plate 3. In addition, the telescopic rod of the air cylinder abuts against the hook 53, but is not connected to the hook 53, which facilitates the maintenance and disassembly of the hook 53 and the translation drive member 51.

[0072] like Figure 2 As shown, optionally, the wafer handling device in the embodiment of the present application includes three non-contact adsorption components 4, which are evenly arranged on the mounting plate 3 along the circumferential direction, and the distances between the three non-contact adsorption components 4 and the center of the mounting plate are equal. In this way, the wafer 100 can be stably adsorbed to prevent the wafer 100 from tilting or sliding.

[0073] Optionally, the wafer handling device in the embodiment of the present application includes three anti-falling components 5, which are evenly arranged on the mounting plate 3 along the circumferential direction, and the distances between the three anti-falling components 5 and the center of the mounting plate 3 are equal. In this arrangement, when the non-contact adsorption component loses its adsorption force, the wafer can be stably supported on the three anti-falling components 5.

[0074] Optionally, the wafer handling device in the embodiment of the present application further includes a positioning assembly (not shown in the figure) arranged on the connecting bracket 2, and the positioning assembly is connected to the control end signal of the moving mechanism 1. After the moving mechanism 1 drives the mounting plate 3 to move above the wafer 100 to be transported, the positioning assembly is configured to position the wafer 100 to be transported, so as to obtain the position information of the wafer, and send the position information of the wafer 100 to the control end of the moving mechanism 1.

[0075] The moving mechanism 1 is configured to drive the installation plate 3 to translate according to the position information of the wafer 100, and finally align the center of the installation plate 3 with the center of the wafer 100. In this way, the three non-contact adsorption components 4 can be evenly distributed above the wafer 100 along the circumferential direction, and finally ensure the adsorption stability of the three non-contact adsorption components 4 on the wafer 100. In addition, it is ensured that the wafer 100 can enter the area between the three anti-falling components 5, and finally ensure that the three anti-falling components 5 can all extend from the circumferential side to the bottom of the adsorbed wafer 100.

[0076] like Figure 2 and Figure 5 As shown, optionally, the wafer handling device in the embodiment of the present application further includes a plurality of limiter components 6, which are circumferentially arranged at the bottom of the mounting plate 3. The bottom surface of the limiter component 6 is lower than the adsorption surface of the non-contact adsorption component 4, and a flexible layer is arranged on the bottom surface of the limiter component 6.

[0077] By providing a plurality of stopper components 6 and making the bottom surface of the stopper components 6 lower than the adsorption surface of the non-contact adsorption component 4, on the one hand, the adsorbed wafer 100 is made to abut against the bottom surface of the plurality of stopper components 6, preventing the wafer 100 from floating up and down. On the other hand, it ensures that the wafer 100 is kept separated from the adsorption surface of the non-contact adsorption component 4. In addition, since a flexible layer is provided on the bottom surface of the stopper component 6, it is possible to prevent the stopper component 6 from causing pressure loss to the wafer 100.

[0078] Optionally, the limiting assembly 6 includes a connecting rod 61 and a limiting block 62, wherein the upper end of the connecting rod 61 is screwed to the bottom of the mounting plate 3, and the limiting block 62 is connected to the lower end of the connecting rod 61. The flexible layer is arranged on the bottom surface of the limiting block 62, and the flexible layer can be, for example, a rubber layer, a silicone layer, etc.

[0079] Optionally, the wafer handling device in the embodiment of the present application includes three limit assemblies 6, which are evenly arranged on the mounting plate 3 along the circumferential direction, and the distances between the three limit assemblies 6 and the center of the mounting plate 3 are equal. In this way, the three limit assemblies 6 can implement stable limit of the wafer 100, preventing the wafer 100 from being compressed due to uneven force.

[0080] like Figure 1 and Figure 2 As shown, optionally, the mounting plate 3 is connected to the connecting bracket 2 via three connecting columns 7 evenly arranged along the circumference, and the distances between the three connecting columns 7 and the center of the mounting plate 3 are equal. Such an arrangement can improve the connection stability between the mounting plate 3 and the connecting bracket 2 and prevent the mounting plate 3 from tilting or shaking.

[0081] The present application is described in sufficient detail above with certain particularity. It should be understood by those skilled in the art that the description in the embodiments is merely exemplary, and all changes made without departing from the true spirit and scope of the present application should fall within the scope of protection of the present application. The scope of protection claimed in the present application is defined by the claims, rather than by the above description in the embodiments.

Claims

1. A wafer transport device, characterized in that: The wafer handling device includes a moving mechanism, a connecting bracket, a mounting plate, a plurality of non-contact adsorption components and a plurality of anti-falling components, wherein: The connecting bracket is connected to the driving end of the moving mechanism, the mounting plate is connected to the connecting bracket, and the moving mechanism is configured to drive the mounting plate to translate and rise and fall; A plurality of the non-contact adsorption components are arranged at the bottom of the mounting plate along the circumferential direction and are configured to adsorb the wafer located below the mounting plate in a non-contact manner; A plurality of anti-falling components are arranged on the mounting plate along the circumferential direction and are configured to extend from the circumferential side to the bottom of the adsorbed wafer.

2. The wafer transport device according to claim 1, wherein: The non-contact adsorption component includes a seat body and a core body, wherein: The seat body is connected to the mounting plate, an air passage communicating with a compressed air source is arranged in the seat body, a mounting groove is arranged at the bottom of the seat body, which runs from the first end of the seat body to the second end of the seat body, the mounting groove is communicated with the air passage, the core body is embedded in the mounting groove, and a first air cavity communicating with the air passage is arranged at the contact points between the two side surfaces of the core body and the mounting groove, a first air blowing gap communicating with the first air cavity on the corresponding side is formed between the first side edge of the core body and the seat body, and a second air blowing gap communicating with the first air cavity on the corresponding side is formed between the second side edge of the core body and the seat body; After the high-pressure gas supplied by the compressed air source enters the first air cavities on both sides through the air channel, it is blown out at high speed to both sides of the non-contact adsorption component through the first air blowing slit and the second air blowing slit to generate an adsorption area below the non-contact adsorption component.

3. The wafer transport device according to claim 1, wherein: The non-contact adsorption component includes a seat body and a baffle, wherein: The seat body is connected to the mounting plate, an air passage communicating with a compressed air source is arranged in the seat body, a second air cavity communicating with the air passage is arranged at the bottom of the seat body, and the second air cavity opens downward; The baffle is arranged at the bottom of the seat body and covers the second air cavity, and the first air blowing slot and the second air blowing slot communicating with the second air cavity are respectively formed at the contact points between the two opposite sides of the baffle and the seat body; After the high-pressure gas supplied by the compressed air source enters the second air cavity through the air passage, it is blown out at high speed to both sides of the non-contact adsorption component through the first air blowing slit and the second air blowing slit to generate an adsorption area below the non-contact adsorption component.

4. The wafer transport device according to claim 1, wherein: The anti-falling assembly includes a support plate, a translation drive member and an L-shaped hook, wherein: The support plate is arranged at the edge of the mounting plate, the upper end of the hook is rotatably connected to the support plate via a rotating shaft, and the lower end of the hook is an anti-falling end; The translation driving member is arranged on the mounting plate, and the translation driving member is used to drive the hook to rotate toward or away from the mounting plate, so that the hook switches between the working position and the avoidance position; When the hook is moved to the working position, the anti-falling end of the hook extends downward to below the mounting plate; When the hook is moved to the avoidance position, the anti-falling end of the hook is withdrawn from below the mounting plate.

5. The wafer transport device according to claim 4, characterized in that: The translation driving member comprises a cylinder, a cylinder body of the cylinder is arranged on the mounting plate, and a telescopic rod of the cylinder passes through the supporting plate radially outward and then abuts against the hook claw.

6. The wafer transport device according to claim 1, wherein: The wafer handling device comprises three non-contact adsorption components, which are evenly arranged on the mounting plate along the circumferential direction, and the distances between the three non-contact adsorption components and the center of the mounting plate are equal; The wafer handling device comprises three anti-falling components, which are evenly arranged on the mounting plate along the circumferential direction, and the distances between the three anti-falling components and the center of the mounting plate are equal.

7. The wafer transport device according to claim 1, wherein: The wafer handling device further comprises a positioning component disposed on the connecting bracket, wherein the positioning component is signal-connected to a control end of the moving mechanism; The positioning component is configured to position the wafer to be transported to obtain position information of the wafer, and send the position information of the wafer to the control end of the moving mechanism; The moving mechanism is configured to drive the mounting plate to translate according to the position information of the wafer so that the center of the mounting plate is aligned with the center of the wafer.

8. The wafer transport device according to claim 1, wherein: The wafer handling device further comprises a plurality of position limiting components, wherein the plurality of position limiting components are circumferentially arranged at the bottom of the mounting plate; The bottom surface of the limiting component is lower than the adsorption surface of the non-contact adsorption component, and a flexible layer is arranged on the bottom surface of the limiting component.

9. The wafer transport device according to claim 8, characterized in that: The wafer handling device comprises three position-limiting assemblies, which are evenly arranged on the mounting plate along the circumferential direction, and the distances between the three position-limiting assemblies and the center of the mounting plate are equal.

10. The wafer transport device according to claim 8, wherein: The mounting plate is connected to the connecting bracket via three connecting columns evenly arranged along the circumference, and the distances between the three connecting columns and the center of the mounting plate are equal.

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