Intelligent storage device for wafer storage and use method

Abstract

The invention relates to the technical field of wafer intelligent storage, in particular to intelligent storage equipment for wafer storage and a use method. According to the technical scheme, the automatic wafer machining device comprises a device base provided with automatic wafer machining equipment and a wafer storage box, a placement table is fixed to the lower portion of the side wall of the device base, the device base and the placement table are in a step shape, grounding anti-static metal wires are fixed to the device base and the placement table, and a material disc is rotationally connected to the device base through a stepping motor; the side, close to the automatic wafer machining equipment, of the material disc is inserted into the automatic wafer machining equipment, the outer side of the material disc extends out of the outer edge of the equipment base, material storage grooves are evenly formed in the periphery of the material disc, and the wafer storage box is arranged on the containing table. According to the invention, after the wafer is taken out from the wafer automatic processing equipment by using the face plate, the wafer is automatically overturned to be upright by using the rotating rod, and then the wafer can be stably placed in the wafer storage box by using the lifting of the storage plate, so that the purpose of automatic size is realized, manual taking and storage are not needed, and the working efficiency is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer intelligent storage, and in particular to an intelligent storage device for wafer storage and a use method thereof. Background Art

[0002] Wafer is the basic material in semiconductor manufacturing. It is a round, flat thin sheet usually made of silicon (Si) in single crystal form. It can also be made of other semiconductor materials such as gallium arsenide (GaAs) or silicon germanium (SiGe). Wafer is the basis for making integrated circuits (ICs) and microelectronic devices. Complex circuit structures can be formed on the surface of the wafer through processes such as lithography, etching, ion implantation, and deposition.

[0003] The wafer storage environment needs to be kept highly clean, usually in a clean room to avoid contamination from dust and other particulate matter. The temperature and humidity of the storage environment need to be strictly controlled, usually at around 22°C and between 30%-50% to prevent the wafer from getting damp or generating static electricity. Dedicated wafer storage boxes are usually used for storage operations. Wafer storage requires high reliability and precision. Manual handling of wafers is inefficient and can easily cause fragmentation or affect yield. Summary of the invention

[0004] The object of the present invention is to provide an intelligent storage device for wafer storage and a method of use to solve the problems raised in the above background technology.

[0005] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: comprising an equipment base with automatic wafer processing equipment installed and a wafer storage box, a placing table is fixed under the side wall of the equipment base, the equipment base and the placing table are stepped, and are both fixed with grounded anti-static metal wires, a material tray is connected to the equipment base through a stepper motor, the material tray is inserted into the automatic wafer processing equipment on the side close to the automatic wafer processing equipment, the outer side of the material tray extends out of the outer edge of the equipment base, and material storage grooves are evenly opened on the outer periphery of the material tray, the wafer storage box is arranged on the placing table, a pair of vertical poles are slidably connected to the placing table and at positions corresponding to the wafer storage box through a driving assembly, a mounting plate is fixed between the vertical poles and at the size and above of the wafer, a material storage plate is mounted on the surface of the mounting plate close to the material tray, a second vacuum suction cup is mounted on the material storage plate, and a flip assembly is arranged on the placing table and between the material tray and the wafer storage box.

[0006] Preferably, the flipping assembly includes a fixed upright plate, a lifting upright plate, a rotating rod and a flipping plate. The fixed upright plate is fixed on the placement table and is located between the material tray and the wafer storage box. The lifting upright plate is slidably connected to the outer arm of the fixed upright plate. The rotating rod is rotatably connected to the top of the lifting upright plate. The end of the rotating rod is located below the material storage slot and is fixedly connected to the flipping plate. A first vacuum suction cup is fixed to the upper end of the flipping plate.

[0007] Preferably, a lifting block is slidably connected inside the fixed vertical plate, the lifting block is fixedly connected to the lifting vertical plate, a screw rod is rotatably connected inside the lifting block, the screw rod passes through the lifting block and is threadedly connected to the lifting block, a servo motor is fixed on the upper end of the fixed vertical plate, and the output end of the servo motor is fixed on the upper end of the screw rod.

[0008] Preferably, an outer side groove is provided on the outer side wall of the material storage trough, and the width of the outer side groove is greater than the width of the rotating rod.

[0009] Preferably, a right-angle groove is provided on the upper end of the lifting upright plate, the rotating rod is rotatably connected in the right-angle groove at one end close to the lifting upright plate, and a flip motor for driving the rotating rod to rotate is fixed to the outer side wall of the lifting upright plate.

[0010] Preferably, the driving assembly includes a slide rail, a track block and a travel motor. The slide rail is fixed to the upper end of the placement table and is symmetrically distributed on both sides of the wafer storage box. The track block is slidably connected to the upper end of the slide rail, the travel motor is fixed to the side wall of the track block, the bottom of the vertical pole is fixed to the upper end of the track block, and a laser positioning controller electrically connected to the travel motor is fixed on the vertical pole.

[0011] Preferably, a driving groove is opened on the side wall of the slide rail at a position corresponding to the travel motor, a linear gear plate is fixed in the driving groove, the output ends of the travel motor are all located in the driving groove, and a driving gear is fixed thereto, the driving gear and the linear gear plate are meshed, and the travel motor is a synchronous drive motor.

[0012] Preferably, a cross beam is fixed between the upper ends of the vertical poles, and an end block is fixed on the cross beam, a telescopic cylinder is fixed on the end block, the output end of the telescopic cylinder is fixed on the material storage plate, and limiting grooves are provided on the mounting plate and on both sides of the material storage plate, limiting rods are fixed on both sides of the material storage plate, and the upper ends of the limiting rods are located above the material storage plate and are slidably connected in the limiting grooves.

[0013] Preferably, the wafer storage box is divided into equidistant storage cavities by mutually symmetrical partition bars, and a pair of right-angle positioning blocks are fixed to the upper end of the placement table, and the right-angle positioning blocks are abutted against the front end of the wafer storage box.

[0014] Preferably, a method for using a smart storage device for wafer storage is: S1. First, connect the entire device to an external power supply, complete the processing of the wafer in the wafer automatic processing equipment, and send the wafers out one by one by rotating the tray.

[0015] S2. The lifting plate is raised to make the first vacuum suction cup contact the bottom of the wafer to fix the wafer, and then the flip motor is driven to drive the rotating rod to rotate, so that the flip plate and the wafer can be rotated to an upright state.

[0016] S3. The travel motor drives the vertical rod to slide horizontally, so that the second vacuum suction cup can abut against the wafer and fix it by adsorption. At this time, the first vacuum suction cup is released and the flip plate is reset.

[0017] S4. By sliding the vertical rod, the wafer can be driven to move to the designated position above the wafer storage box. S5. The storage plate is driven downward by the telescopic cylinder, and enters the wafer storage box to release the wafer, thereby completing the storage operation of a single wafer.

[0018] S6. Repeat the above operation until the storage cavity in the wafer storage box is full.

[0019] Compared with the prior art, the present invention has the following beneficial effects: After the wafer is taken out from the automatic wafer processing equipment using the face plate, it is automatically flipped upright using the rotating rod, and then it can be stably placed in the wafer storage box by raising and lowering the storage plate, achieving the purpose of automated sizing. There is no need for manual picking and storage, which improves work efficiency.

[0020] Automated storage of wafers can reduce manual intervention, thereby reducing the risk of wafer damage or incorrect handling due to human error. Grounded anti-static metal wires are used for electrostatic protection to reduce static damage to wafers and improve storage safety. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 A schematic diagram of the side structure of an intelligent storage device for wafer storage and a method of using the same according to the present invention; Figure 2 A schematic diagram of the combined structure of a pole and a mounting plate of an intelligent storage device for wafer storage and a method of using the same according to the present invention; Figure 3 It is a schematic diagram of the top view of the upper surface structure of a placement table and a device base of an intelligent storage device for wafer storage and a method of using the present invention; Figure 4 A schematic diagram of the combined structure of a lifting vertical plate and a fixed vertical plate of an intelligent storage device for wafer storage and a method of using the present invention; Figure 5 A schematic diagram of the internal structure of a wafer storage box of an intelligent storage device for wafer storage and a method of using the same in the present invention; Figure 6 The present invention is an intelligent storage device for wafer storage and a method of using the same Figure 2 Enlarged structural diagram at A in the middle.

[0022] In the figure: 1. Equipment base; 11. Wafer automatic processing equipment; 2. Material tray; 21. Stepper motor; 22. Material storage slot; 23. Outer groove; 3. Fixed vertical plate; 31. Lifting block; 32. Screw rod; 33. Servo motor; 4. Lifting vertical plate; 41. Rotating rod; 42. Flipping plate; 43. First vacuum suction cup; 44. Right-angle groove; 45. Flipping motor; 5. Placement table; 51. Right-angle positioning block; 6. Driving assembly; 61. Slide rail; 62. Track block; 63. Travel motor; 64. Driving groove; 65. Linear gear plate; 66. Driving gear; 7. Vertical pole; 71. Mounting plate; 72. Material storage plate; 73. Second vacuum suction cup; 74. End block; 75. Telescopic cylinder; 76. Limiting groove; 77. Limiting rod; 8. Wafer storage box; 81. Partition bar; 82. Storage cavity; 9. Laser positioning controller. DETAILED DESCRIPTION

[0023] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0024] See also Figure 1-6The present invention provides a technical solution: comprising an equipment base 1 on which a wafer automatic processing equipment 11 is installed and a wafer storage box 8, a placement table 5 is fixed below the side wall of the equipment base 1, the equipment base 1 and the placement table 5 are stepped, and both are fixed with grounded anti-static metal wires, a material tray 2 is connected to the equipment base 1 through a stepper motor 21, the material tray 2 is inserted into the wafer automatic processing equipment 11 near the side of the wafer automatic processing equipment 11, the outer side of the material tray 2 extends out of the outer edge of the equipment base 1, and the outer periphery of the material tray 2 is evenly provided with material storage grooves 22, the wafer storage box 8 is arranged on the placement table 5, and the placement table 5 A pair of vertical rods 7 are slidably connected to the wafer storage box 8 through a driving assembly 6 on the top and at a position corresponding to the wafer storage box 8, a mounting plate 71 is fixed between the vertical rods 7 and above the wafer size, a material storage plate 72 is installed on the surface of the mounting plate 71 close to the material tray 2, a second vacuum suction cup 73 is installed on the material storage plate 72, a flip assembly is arranged on the placement table 5 and between the material tray 2 and the wafer storage box 8, the wafer storage box 8 is divided into equidistant storage cavities 82 by mutually symmetrical partition bars 81, a pair of right-angle positioning blocks 51 are fixed on the upper end of the placement table 5, and the right-angle positioning blocks 51 are against the front end of the wafer storage box 8.

[0025] The flip assembly includes a fixed vertical plate 3, a lifting vertical plate 4, a rotating rod 41 and a flip plate 42. The fixed vertical plate 3 is fixed on the placement table 5 and is located between the material tray 2 and the wafer storage box 8. The lifting vertical plate 4 is slidably connected to the outer arm of the fixed vertical plate 3. The rotating rod 41 is rotatably connected to the top of the lifting vertical plate 4. The end of the rotating rod 41 is located below the material storage slot 22 and is fixedly connected to the flip plate 42. A first vacuum suction cup 43 is fixed to the upper end of the flip plate 42. A lifting block 31 is slidably connected in the fixed vertical plate 3. The lifting block 31 is fixedly connected to the lifting vertical plate 4. A screw rod 32 is rotatably connected inside the lifting block 31, and the screw rod 32 passes through the lifting block 31 and is threadedly connected to the lifting block 31. A servo motor 33 is fixed to the upper end of the fixed vertical plate 3, and the output end of the servo motor 33 is fixed to the upper end of the screw rod 32. An outer groove 23 is provided on the outer wall of the storage trough 22, and the width of the outer groove 23 is greater than the width of the rotating rod 41. A right-angle groove 44 is provided on the upper end of the lifting vertical plate 4, and the rotating rod 41 is rotatably connected to the right-angle groove 44 at one end close to the lifting vertical plate 4. A flip motor 45 is fixed to the outer wall of the lifting vertical plate 4 to drive the rotating rod 41 to rotate.

[0026] The driving assembly 6 includes a slide rail 61, a track block 62 and a travel motor 63. The slide rail 61 is fixed on the upper end of the placement table 5 and is symmetrically distributed on both sides of the wafer storage box 8. The track block 62 is slidably connected to the upper end of the slide rail 61. The travel motor 63 is fixed on the side wall of the track block 62. The bottom of the vertical pole 7 is fixed to the upper end of the track block 62. A laser positioning controller 9 electrically connected to the travel motor 63 is fixed on the vertical pole 7. A driving groove 64 is opened on the side wall of the slide rail 61 and at a position corresponding to the travel motor 63. A linear gear plate 65 is fixed in the driving groove 64. The output ends of the travel motor 63 are all located in the driving groove 64 and are fixed with a driving gear 66. The driving gear 66 is meshed with the linear gear plate 65. The travel motor 63 is a synchronous driving motor.

[0027] A crossbeam is fixed between the upper ends of the vertical poles 7, and an end block 74 is fixed on the crossbeam, a telescopic cylinder 75 is fixed on the end block 74, and the output end of the telescopic cylinder 75 is fixed on the material storage plate 72. Limiting grooves 76 are provided on the mounting plate 71 and on both sides of the material storage plate 72. Limiting rods 77 are fixed on both sides of the material storage plate 72. The upper ends of the limiting rods 77 are located above the material storage plate 72 and are slidably connected in the limiting grooves 76.

[0028] Working principle: first, connect the whole device to an external power supply, complete the processing of the wafer in the wafer automatic processing equipment 11, and send out the wafers one by one by rotating the material tray 2, and then use the rise of the lifting plate 4 to make the first vacuum suction cup 43 abut against the bottom of the wafer to adsorb and fix the wafer, and then use the drive of the flip motor 45 to drive the rotating rod 41 to rotate, so that the flip plate 42 and the wafer can be rotated to an upright state, and then through the drive of the walking motor 63, the vertical rod 7 can be driven to slide horizontally, so that the second vacuum suction cup 73 can be abutted against the wafer and adsorbed and fixed, at this time, release the first vacuum suction cup 43, and reset the flip plate 42, and then use the sliding of the vertical rod 7 to drive the wafer to move to the specified position above the wafer storage box 8, and finally use the drive of the telescopic cylinder 75 to drive the storage plate 72 to descend, and enter the wafer storage box 8 to release the wafer, completing the automatic storage of a single wafer, and repeating in sequence to complete the wafer storage operation until The storage chamber 82 in the wafer storage box 8 is filled. During the whole process, the stepper motor 21 can be used to drive the material tray 2 to rotate one by one, so that the material storage slot 22 is aligned with the flip plate 42 in turn. Secondly, the servo motor 33 can be used to drive the screw rod 32 to rotate, and then drive the lifting block 31 and the lifting vertical plate 4 to slide, so as to realize the lifting and resetting of the lifting vertical plate 4, and the driving gear 66 is driven by the walking motor 63 to rotate, and the linear gear plate 65 is used for transmission to realize the autonomous movement of the track block 62. During the movement, the laser positioning controller 9 is used to monitor the position of the column, so that the track block 62 can move to the preset position each time, and the wafer can be accurately placed in the wafer storage box 8. When the wafer descends, the limit rod 77 can be used to limit its maximum descending position to reduce the risk of collision with the bottom of the wafer storage box 8. The whole process realizes the intelligent storage of wafers, improves work efficiency, and reduces the damage to wafers caused by personnel handling.

[0029] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0030] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. An intelligent storage device for wafer storage and a method of use, comprising a device base (1) on which a wafer automatic processing device (11) is installed and a wafer storage box (8), characterized in that: A placement table (5) is fixed below the side wall of the equipment base (1); the equipment base (1) and the placement table (5) are stepped and are both fixed with grounded anti-static metal wires; a material tray (2) is rotatably connected to the equipment base (1) via a stepping motor (21); the material tray (2) is inserted into the wafer automatic processing equipment (11) on the side close to the wafer automatic processing equipment (11); the outer side of the material tray (2) extends out of the outer edge of the equipment base (1); material storage grooves (22) are evenly opened on the outer periphery of the material tray (2); and the wafer storage box ( 8) is arranged on a placement table (5), a pair of vertical rods (7) are slidably connected to the placement table (5) and the corresponding position with the wafer storage box (8) through a driving component (6), a mounting plate (71) is fixed between the vertical rods (7) and located above the wafer size, a material storage plate (72) is installed on the surface of the mounting plate (71) close to the material tray (2), a second vacuum suction cup (73) is installed on the material storage plate (72), and a flip component is arranged on the placement table (5) and located between the material tray (2) and the wafer storage box (8).

2. The intelligent storage device for wafer storage and the method of use according to claim 1, characterized in that: The flip assembly comprises a fixed vertical plate (3), a lifting vertical plate (4), a rotating rod (41) and a flip plate (42); the fixed vertical plate (3) is fixed on the placement table (5) and is located between the material tray (2) and the wafer storage box (8); the lifting vertical plate (4) is slidably connected to the outer arm of the fixed vertical plate (3); the rotating rod (41) is rotatably connected to the top of the lifting vertical plate (4); the end of the rotating rod (41) is located below the material storage slot (22) and is fixedly connected to the flip plate (42); a first vacuum suction cup (43) is fixed to the upper end of the flip plate (42).

3. The intelligent storage device for wafer storage and the method of use according to claim 2, characterized in that: A lifting block (31) is slidably connected inside the fixed vertical plate (3), the lifting block (31) is fixedly connected to the lifting vertical plate (4), a screw rod (32) is rotatably connected inside the lifting block (31), the screw rod (32) passes through the lifting block (31) and is threadedly connected to the lifting block (31), a servo motor (33) is fixed at the upper end of the fixed vertical plate (3), and an output end of the servo motor (33) is fixed to the upper end of the screw rod (32).

4. The intelligent storage device for wafer storage and the method of use according to claim 2, characterized in that: An outer side groove (23) is formed on the outer side wall of the material storage groove (22), and the width of the outer side groove (23) is greater than the width of the rotating rod (41).

5. The intelligent storage device for wafer storage and the method of use according to claim 2, characterized in that: A right-angle groove (44) is formed at the upper end of the lifting upright plate (4); one end of the rotating rod (41) close to the lifting upright plate (4) is rotatably connected in the right-angle groove (44); and a flip motor (45) for driving the rotating rod (41) to rotate is fixed to the outer side wall of the lifting upright plate (4).

6. The intelligent storage device for wafer storage and the method of use according to claim 1, characterized in that: The driving assembly (6) includes a slide rail (61), a track block (62) and a travel motor (63); the slide rail (61) is fixed to the upper end of the placement table (5) and is symmetrically distributed on both sides of the wafer storage box (8); the track block (62) is slidably connected to the upper end of the slide rail (61); the travel motor (63) is fixed to the side wall of the track block (62); the bottom of the vertical pole (7) is fixed to the upper end of the track block (62); and a laser positioning controller (9) electrically connected to the travel motor (63) is fixed on the vertical pole (7).

7. The intelligent storage device for wafer storage and the method of use according to claim 6, characterized in that: A driving groove (64) is provided on the side wall of the slide rail (61) at a position corresponding to the travel motor (63), a linear tooth plate (65) is fixed in the driving groove (64), the output ends of the travel motor (63) are both located in the driving groove (64) and are fixed with a driving gear (66), the driving gear (66) and the linear tooth plate (65) are meshed, and the travel motor (63) is a synchronous driving motor.

8. The intelligent storage device for wafer storage and the method of use according to claim 1, characterized in that: A crossbeam is fixed between the upper ends of the uprights (7), and an end block (74) is fixed on the crossbeam. A telescopic cylinder (75) is fixed on the end block (74). An output end of the telescopic cylinder (75) is fixed on a material storage plate (72). Limiting grooves (76) are provided on the mounting plate (71) and on both sides of the material storage plate (72). Limiting rods (77) are fixed on both sides of the material storage plate (72). The upper ends of the limiting rods (77) are located above the material storage plate (72) and are slidably connected in the limiting grooves (76).

9. The intelligent storage device for wafer storage and the method of use according to claim 1, characterized in that: The wafer storage box (8) is divided into equidistant storage chambers (82) by mutually symmetrical partition bars (81), and a pair of right-angle positioning blocks (51) are fixed to the upper end of the placement table (5), and the right-angle positioning blocks (51) are abutted against the front end of the wafer storage box (8).

10. A method for using the intelligent storage device for wafer storage according to claims 1-9 is: S1, firstly, the entire device is connected to an external power supply, the wafer is placed in the wafer automatic processing equipment (11) and the processing is completed, and the wafers are sent out one by one by rotating the material tray (2); S2, using the lifting plate (4) to rise, the first vacuum suction cup (43) is abutted against the bottom of the wafer to adsorb and fix the wafer, and then the turning motor (45) is driven to drive the rotating rod (41) to rotate, so that the turning plate (42) and the wafer can be turned to an upright state; S3, by driving the travel motor (63), the vertical rod (7) can be driven to slide horizontally, so that the second vacuum suction cup (73) can be pressed against the wafer and adsorbed and fixed, at which time the first vacuum suction cup (43) is released and the flip plate (42) is reset; S4, utilizing the sliding movement of the vertical rod (7) to drive the wafer to move to a designated position above the wafer storage box (8); S5, using the drive of the telescopic cylinder (75) to drive the material storage plate (72) to descend, and enter the wafer storage box (8) to release the wafer, thereby completing the storage operation of a single wafer; S6, repeat the above operation until the storage cavity (82) in the wafer storage box (8) is full.

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