Wafer feeding device

Abstract

The invention provides a wafer feeding device, which comprises a mounting plate, a tensioning seat, a supporting ring, a lifting ring, a pressing plate, a lifting driving mechanism and an auxiliary pressing mechanism, and is characterized in that the tensioning seat is arranged on the mounting plate, and the supporting ring is arranged on the tensioning seat; the lifting ring is arranged on the tensioning seat in a lifting mode and surrounds the outer side of the supporting ring, the pressing plate is fixedly connected to the top end of the lifting ring, a pressing groove is formed between the pressing plate and the lifting ring, and the pressing plate is provided with a suspended section; the lifting driving mechanism drives the lifting ring to be switched between a first height and a second height in a lifting mode, and when the lifting ring ascends to the first height, the wafer ring is inserted into the pressing groove through the insertion opening; when the lifting ring descends to a second height, the bearing film is tensioned on the upper surface of the supporting ring; and when the lifting ring descends to a second height, the auxiliary pressing mechanism is driven by the lifting ring to downwards press the suspended section. According to the wafer feeding device provided by the invention, the suspension section can be ensured to effectively press the wafer ring located at the insertion port, and the wafer ring is prevented from inclining.

Description

Technical Field

[0001] The present application relates to the field of semiconductor chip packaging equipment, and in particular to a wafer feeding device. Background Art

[0002] During the chip packaging process, the chip is carried on a carrier film, and the periphery of the carrier film is tightened and fixed by a wafer ring. Before the loading process, the wafer ring needs to be fixed to the wafer platform, and the wafer platform drives the wafer ring to move so that the chips on the carrier film are moved to the predetermined chip removal station in turn to facilitate picking up by the material removal device.

[0003] The wafer platform includes a tensioning seat, a support ring, a lifting ring and a pressure plate, wherein the support ring is fixedly arranged on the tensioning seat, the lifting ring can be lifted and lowered on the tensioning seat and is located on the outside of the support ring, the pressure plate is connected to the top of the lifting ring, and a clamping gap for clamping the wafer ring is formed between the pressure plate and the lifting ring. In the initial state, the lifting ring is in a high position, and the clamping gap is higher than the support ring. In this state, the wafer ring can be inserted into the clamping gap so that the carrier film covers the upper side of the support ring. Subsequently, the lifting ring and the pressure plate are controlled to descend to a low position, so that the carrier film is tightened by the relative movement of the pressure plate and the support ring.

[0004] In order to facilitate the insertion of the wafer ring into the clamping gap, a part of the pressure plate is set to be suspended, and an insertion port for inserting the wafer ring is formed between the suspended section of the pressure plate and the lifting ring. The resulting problem is that when the pressure plate and the support ring cooperate to tighten the carrier film, the reaction force of the carrier film will cause the suspended section of the pressure plate to warp up, causing the wafer ring to tilt, and then the suspended section of the pressure plate cannot effectively clamp the ring, affecting the fixing effect of the wafer ring. Summary of the invention

[0005] In view of the above technical problems, the present application provides a wafer feeding device, and its detailed technical solution is as follows:

[0006] A wafer feeding device is used to fix a wafer ring, a carrier film carrying a chip is tensioned inside the wafer ring, and the wafer feeding device includes a mounting plate, a tensioning seat, a support ring, a lifting ring, a pressing plate, a lifting drive mechanism and an auxiliary pressing mechanism, wherein:

[0007] The tensioning seat is arranged on the mounting plate, and the supporting ring is arranged on the tensioning seat;

[0008] The lifting ring is escalably arranged on the tensioning seat and surrounds the outer side of the supporting ring. The pressing plate is fixedly connected to the top of the lifting ring. A pressing groove is formed between the pressing plate and the lifting ring. The pressing plate has a suspended section. An insertion port is formed between the suspended section and the lifting ring.

[0009] The lifting drive mechanism is at least partially disposed on the mounting plate and is in transmission connection with the lifting ring, and the lifting drive mechanism is used to drive the lifting ring to lift and switch between a first height and a second height, wherein the first height is higher than the second height;

[0010] When the lifting ring rises to a first height, the insertion opening and the clamping groove are higher than the upper end of the support ring, the wafer ring can be inserted into the clamping groove through the insertion opening, and the carrier film covers the support ring;

[0011] When the lifting ring descends to the second height, the peripheral part of the carrier film is driven by the pressing plate and the lifting ring to descend to a position lower than the upper surface of the support ring, and the middle part of the carrier film is tensioned on the upper surface of the support ring;

[0012] The auxiliary pressing mechanism is arranged on the tensioning seat and is located outside the suspended section. The auxiliary pressing mechanism is in transmission connection with the lifting ring. When the lifting ring descends to the second height, the auxiliary pressing mechanism is configured to press the suspended section downward under the drive of the lifting ring, so that the suspended section presses the wafer ring.

[0013] When the lifting ring rises to a first height, the auxiliary clamping mechanism is configured to release the suspended section driven by the lifting ring.

[0014] The wafer feeding device provided in the present application includes an auxiliary clamping mechanism arranged on the tensioning seat and located on the outside of the suspended section of the pressure plate. When the lifting ring descends to the second height and the support ring tensions the peripheral side of the carrier film upward, the auxiliary clamping mechanism presses the suspended section of the pressure plate downward, thereby ensuring that the suspended section can effectively clamp the wafer ring located at the insertion port, thereby improving the clamping effect of the pressure plate on the wafer ring and preventing the wafer ring from tilting.

[0015] In some embodiments, the auxiliary clamping mechanism includes a rack, a connecting rod, a gear and a pressing claw, wherein:

[0016] The rack is arranged on the tensioning seat in the vertical direction;

[0017] The connecting rod is rotatably mounted on the lifting ring, the connecting rod extends in the horizontal direction, the gear is sleeved on the connecting rod and meshes with the rack, and the pressure claw is connected to the connecting rod;

[0018] When the lifting ring descends from the first height toward the second height, the rack drives the connecting rod to rotate in the first clockwise direction via the gear, and the connecting rod drives the pressing claw to rotate toward the suspended section, so that the pressing claw presses the suspended section downward;

[0019] When the lifting ring rises from the second height toward the first height, the rack drives the connecting rod to rotate along the second clockwise direction via the gear, and the connecting rod drives the pressing claw to rotate away from the suspended section, so that the pressing claw releases the suspended section. The first clockwise direction is opposite to the second clockwise direction.

[0020] By setting the auxiliary clamping mechanism, the auxiliary clamping mechanism can be driven by the lifting ring to achieve follow-up with the lifting ring. The final result is: when the lifting ring descends from the first height to the second height, the auxiliary clamping mechanism presses the suspended section downward; when the lifting ring rises from the second height to the first height, the auxiliary clamping mechanism releases the suspended section. In other words, the auxiliary clamping mechanism does not need to be additionally provided with driving components, and its clamping and releasing operations are completely triggered by the lifting and lowering of the lifting ring. Such a setting can achieve that when the lifting ring is lifted and lowered into place, the auxiliary clamping mechanism implements the clamping or release of the suspended section, thereby speeding up the work rhythm and improving work efficiency. In addition, since the auxiliary clamping mechanism does not need to be additionally provided with driving components, the equipment cost is reduced.

[0021] In some embodiments, the gear has a tooth-missing area, and the tooth-missing area lacks at least one tooth; when the lifting ring is at the first height, the tooth-missing area is staggered with the rack, and the teeth on the gear are meshed with the rack; when the lifting ring is at the second height, the tooth-missing area abuts against the rack, and the teeth on the gear are disengaged from the rack; when the lifting ring descends from the first height to the third height, the pressure claw rotates downward to press the suspended section, the tooth-missing area abuts against the rack, and the teeth on the gear are disengaged from the rack; when the lifting ring continues to descend to the second height, the tooth-missing area slides on the rack; when the lifting ring rises from the second height to the third height, the tooth-missing area slides on the rack, and the teeth on the gear are meshed with the rack; when the lifting ring continues to rise to the first height, the tooth-missing area is staggered with the rack, and the pressure claw rotates upward away from the suspended section. Wherein, the third height is between the first height and the second height.

[0022] When the lifting ring descends from the first height to the third height, the pressure claw rotates downward into position and presses on the suspended section. At this time, the tooth vacant area contacts the rack, and the teeth on the gear are disengaged from the rack. When the lifting ring continues to descend to the second height, the tooth vacant area slides on the rack, and the pressure claw does not continue to rotate downward, but is pressed and maintained on the suspended section with a constant pressure. It can be seen that the pressure claw only rotates downward within the stroke of the lifting ring descending from the first height to the third height, thereby avoiding excessive downward pressure of the pressure claw, causing the pressure claw, the suspended section of the pressure plate or the wafer ring to be over-pressed and deformed.

[0023] When the lifting ring rises from the second height to the third height, the tooth vacant area slides on the rack, and the pressure claw is pressed and held on the suspended section with a constant pressure. When the lifting ring reaches the third height, the teeth on the gear mesh with the rack. When the lifting ring continues to rise to the first height, the pressure claw rotates upward and away from the suspended section driven by the gear to release the suspended section. When the lifting ring reaches the first height, the tooth vacant area is completely offset from the rack. It can be seen that the pressure claw only rotates upward to release the suspended section within the travel of the lifting ring from the third height to the first height to avoid excessive rotation of the pressure claw and interference with the tensioning seat assembly.

[0024] In some embodiments, there is a notch in the middle of the suspended section, which divides the suspended section into a first suspended section and a second suspended section; the auxiliary clamping mechanism includes a first pressing claw and a second pressing claw connected to the connecting rod at intervals, wherein: the first pressing claw is used to clamp and release the first suspended section, and the second pressing claw is used to clamp and release the second suspended section.

[0025] By setting a notch in the middle of the suspended section, the suspended section is divided into a first suspended section and a second suspended section. On the one hand, it is more convenient to insert the wafer ring into the clamping groove between the pressure plate and the lifting ring. On the other hand, the first clamping claw and the second clamping claw can respectively clamp the first suspended section and the second suspended section with free ends downward, so that the first suspended section and the second suspended section firmly clamp the wafer ring at the insertion port, further improving the clamping effect of the suspended section on the wafer ring.

[0026] In some embodiments, the first suspended segment is provided with a first pressure-bearing tongue extending outward from the first suspended segment, and the first pressure claw presses and releases the first suspended segment via the first pressure-bearing tongue; the second suspended segment is provided with a second pressure-bearing tongue extending outward from the second suspended segment, and the second pressure claw presses and releases the second suspended segment via the second pressure-bearing tongue.

[0027] By providing the first pressure-bearing tongue, the pressing stability of the first pressure claw on the first suspended section is improved, and the first pressure claw is prevented from slipping. Similarly, by providing the second pressure-bearing tongue, the pressing stability of the second pressure claw on the second suspended section is improved, and the second pressure claw is prevented from slipping.

[0028] In some embodiments, the lifting drive mechanism includes a first driving unit, N first gears, a first synchronous belt and a second gear, wherein:

[0029] N first gears are arranged on the tensioning seat along the circumferential direction, each first gear is installed on the tensioning seat via a first rotating shaft, and a first synchronous belt is sleeved on the N first gears and meshes with each first gear;

[0030] The bottom of the lifting ring is provided with lifting screw rods corresponding to the 1st to N-1th first gears respectively, and the lower end of each lifting screw rod is screwed into the shaft hole of the corresponding first rotating shaft;

[0031] The second gear is coaxially mounted on the tensioning seat with the Nth first gear via the second rotating shaft, and the second gear is located outside the first synchronous belt;

[0032] The first driving part is arranged on the mounting plate, and the first driving part can be connected with the second gear to drive the second gear to rotate. When the second gear rotates, the first gear and the first synchronous belt installed coaxially drive the first gears to rotate synchronously. When the first gears rotate synchronously, they drive the lifting screws to rise and fall, so as to drive the lifting ring to rise and fall.

[0033] A lifting drive mechanism with a simple structure and high driving stability is provided, which synchronously drives N-1 lifting screws circumferentially arranged at the bottom of a lifting ring to lift and lower through a first driving part via a first synchronous belt, thereby driving the lifting ring to lift and lower, improving the lifting stability of the lifting ring and preventing the lifting ring from tilting to one side during the lifting process.

[0034] In some embodiments, the first driving part includes a mounting seat, a translational driving module, a rotational driving module and a driving gear, wherein: the mounting seat is arranged on the mounting plate and is located on the side of the tensioning seat, and the translational driving module is arranged on the mounting seat; the rotational driving module is slidably connected to the mounting seat and is transmission-connected to the translational driving module, and the driving gear is connected to the movable part of the rotational driving module; the translational driving module is used to drive the driving gear to translate toward or away from the second gear so that the driving gear engages or disengages with the second gear, and when the driving gear engages with the second gear, the rotational driving module drives the driving gear to rotate to drive the second gear to rotate.

[0035] When the lifting ring needs to be driven to lift, the translation drive module drives the rotation drive module and the drive gear to translate toward the second gear, so that the drive gear meshes with the second gear. At this time, the rotation drive module can drive the drive gear to rotate to implement the lifting and lifting of the lifting ring. When the position of the lifting ring needs to be adjusted, the translation drive module drives the rotation drive module and the drive gear to translate away from the second gear, so that the drive gear is separated from the second gear, to prevent the lifting ring from interfering with the translation drive module when moving.

[0036] In some embodiments, the rotational drive module includes a driving member, a turbine, a worm, a photoelectric baffle and a photoelectric sensor, wherein: the worm is installed at the driving end of the driving member and meshes with the turbine for transmission, the turbine and the driving gear are coaxially installed on the connecting member, the connecting member is slidably installed on the mounting seat and connected to the driving end of the translational drive module; the photoelectric baffle is installed at the driving end of the driving member, and the periphery of the photoelectric baffle is provided with tooth grooves, the photoelectric sensor is fixedly installed on the side of the photoelectric baffle and arranged corresponding to the tooth grooves, and the photoelectric sensor is configured to cooperate with the photoelectric baffle to implement detection of the moving position of the driving member.

[0037] Through the transmission cooperation of the worm gear, a driving mode with large output torque and stable driving is provided; combined with the photoelectric baffle and the photoelectric sensor, the control of the lifting accuracy of the lifting ring can be further improved.

[0038] In some embodiments, the first driving part also includes a locking pin, which is connected to the movable part of the translational driving module; when the translational driving module drives the driving gear to engage with the second gear, the locking pin is inserted into a locking hole on the tensioning seat that matches the locking pin; when the translational driving module drives the driving gear to separate from the second gear, the locking pin is withdrawn from the locking hole.

[0039] When the locking pin is withdrawn from the locking hole, the position of the tensioning seat can be adjusted; when the driving gear is engaged with the second gear, the locking pin is inserted into the locking hole on the tensioning seat that matches the locking pin, thereby ensuring that the driving gear and the second gear form a stable engagement and preventing the driving gear from disengaging or slipping from the second gear.

[0040] In some embodiments, the tensioning seat is rotatably mounted on the mounting plate, and the wafer feeding device also includes a rotary drive mechanism arranged on the mounting plate, and the rotary drive mechanism is used to drive the tensioning seat to rotate in the horizontal plane to drive the wafer ring to rotate in the horizontal plane; the rotary drive mechanism includes a second drive unit, a synchronous pulley, a second synchronous belt and a gear disk, wherein: the gear disk is rotatably mounted on the mounting plate, and the tensioning seat is fixedly mounted above the gear disk; the second synchronous belt is provided with meshing teeth, and the meshing teeth on the second synchronous belt are meshed with the outer periphery of the gear disk, and the synchronous pulley is mounted on the mounting plate and is connected to the gear disk through the second synchronous belt; the second drive unit is arranged on the mounting plate, and the second drive unit is used to drive the synchronous pulley to rotate to drive the gear disk and the tensioning seat to rotate in the horizontal plane.

[0041] By setting up a rotation drive mechanism, the rotation drive of the tensioning seat in the horizontal plane is realized, thereby realizing the angle adjustment of the wafer in the wafer ring, ensuring that the wafer picking device can smoothly implement the wafer picking. The rotation drive of the tensioning seat is implemented by the rotation drive mode of the second synchronous belt and the toothed disc, which improves the driving stability of the tensioning seat, thereby improving the angle adjustment accuracy of the wafer. Of course, other existing rotation drive mechanisms can also be used to drive the rotation of the tensioning seat.

[0042] In some embodiments, the wafer feeding device also includes a translation drive mechanism, and the mounting plate is horizontally arranged on the movable part of the translation drive mechanism; the translation drive mechanism is used to drive the mounting plate to translate in the horizontal plane to drive the wafer ring to translate in the horizontal plane; the translation drive mechanism includes a base plate, an X-axis translation drive component, a sliding plate and a Y-axis translation drive component, wherein: the sliding plate is slidably connected to the base plate, the X-axis translation drive component is arranged on the base plate and is transmission-connected to the sliding plate, and the X-axis translation drive component is used to drive the sliding plate to slide along the X-axis; the mounting plate is slidably connected to the sliding plate, the Y-axis translation drive component is arranged on the sliding plate and is transmission-connected to the mounting plate, and the Y-axis translation drive component is used to drive the mounting plate to slide along the Y-axis.

[0043] By setting up a translation drive mechanism, the position of the wafer ring in the horizontal direction is adjusted, thereby adjusting the position of the wafer on it. In this way, before each crystal retrieval, the wafer to be picked up can be adjusted to the predetermined crystal retrieval position, so that the crystal retrieval device can pick up the wafer from the crystal retrieval position each time, thereby improving the crystal retrieval efficiency. In addition, the translation drive device can also realize the switching of the driving mounting plate between the loading position and the wafer retrieval position, which is convenient for manual material replacement. BRIEF DESCRIPTION OF THE DRAWINGS

[0044] Figure 1 It is a schematic structural diagram of a wafer feeding device in an embodiment of the present application at a first viewing angle;

[0045] Figure 2 is a schematic structural diagram of a wafer feeding device in an embodiment of the present application at a second viewing angle;

[0046] Figure 3 is a schematic structural diagram of a wafer feeding device in an embodiment of the present application at a third viewing angle;

[0047] Figure 4 This is a schematic structural diagram of the wafer feeding device in the embodiment of the present application after the translation drive mechanism is omitted from the first viewing angle;

[0048] Figure 5 This is a schematic structural diagram of the wafer feeding device in the embodiment of the present application after the translation drive mechanism is omitted from the second viewing angle;

[0049] Figure 6 It is a structural schematic diagram of components such as a tensioning seat, a support ring, a lifting ring, a pressing plate and an auxiliary pressing mechanism in an embodiment of the present application at a first viewing angle;

[0050] Figure 7 It is a structural schematic diagram of the components such as the tensioning seat, the support ring, the lifting ring, the pressing plate and the auxiliary pressing mechanism in the embodiment of the present application from a second viewing angle;

[0051] Figure 8 It is a structural schematic diagram of the components such as the tensioning seat, the support ring, the lifting ring, the pressing plate and the auxiliary pressing mechanism in the embodiment of the present application from a third viewing angle;

[0052] Fig. 9 It is a structural schematic diagram of the components such as the tensioning seat, the support ring, the lifting ring, the pressing plate and the auxiliary pressing mechanism in the embodiment of the present application at the fourth viewing angle;

[0053] Fig.10 for Fig.11 A partial enlarged view of the A area;

[0054] Fig.11 is a structural schematic diagram of the auxiliary pressing mechanism in an embodiment of the present application;

[0055] Fig.12 It is a schematic diagram of the structure of the connecting rod and the gear in the embodiment of the present application;

[0056] Fig.13 is a schematic structural diagram of the first driving unit in an embodiment of the present application at a first viewing angle;

[0057] Fig.14 is a schematic structural diagram of the first driving unit in the embodiment of the present application at a second viewing angle;

[0058] Fig.15 is a schematic structural diagram of the first driving unit in the embodiment of the present application at a third viewing angle;

[0059] Figures 1 to 15 Included:

[0060] Mounting plate 1;

[0061] Tensioning seat 2;

[0062] Support ring 3;

[0063] Lifting ring 4;

[0064] Pressing plate 5: suspended section 51, insertion port 52, first suspended section 511, second suspended section 512, first pressure-bearing tongue 513, second pressure-bearing tongue 514;

[0065] Lifting drive mechanism 6: first drive unit 61, first gear 62, first synchronous belt 63, second gear 64, mounting seat 611, translation drive module 612, rotation drive module 613, drive gear 614, locking pin 615, photoelectric baffle 616, turbine 617;

[0066] Auxiliary pressing mechanism 7: rack 71, connecting rod 72, gear 73, pressing claw 74, tooth 731, tooth vacancy area 732, first pressing claw 741, second pressing claw 742;

[0067] Rotation drive mechanism 8: second drive unit 81, synchronous pulley 82, second synchronous belt 83, toothed disc 84;

[0068] Translation drive mechanism 9: bottom plate 91 and sliding plate 92. DETAILED DESCRIPTION

[0069] In order to make the above-mentioned objects, features and advantages of the present application more obvious and easy to understand, the present application is further described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0070] In the semiconductor chip bonding process, as described in the background technology section, in order to facilitate the installation of the pressure plate and to facilitate the insertion of the wafer ring into the clamping gap, a part of the pressure plate is set to be suspended, and an insertion port for inserting the wafer ring is formed between the suspended section of the pressure plate and the lifting ring. The resulting problem is that when the pressure plate and the support ring cooperate to tighten the carrier film, the reaction force of the carrier film will cause the suspended section of the pressure plate to warp up, causing the wafer ring to tilt, and then the suspended section of the pressure plate cannot effectively clamp the ring, affecting the fixing effect of the wafer ring, and it will gradually become more obvious as the diameter of the wafer ring increases.

[0071] In order to solve this problem, the present application provides a wafer feeding device, which is used to fix a wafer ring, and a carrier film (such as a blue film) carrying chips is stretched inside the wafer ring.

[0072] like Figures 1 to 9 As shown, the wafer feeding device in the embodiment of the present application includes a mounting plate 1, a tensioning seat 2, a support ring 3, a lifting ring 4, a pressing plate 5, a lifting drive mechanism 6 and an auxiliary pressing mechanism 7, wherein:

[0073] The tensioning seat 2 is arranged on the mounting plate 1 , and the supporting ring 3 is arranged on the tensioning seat 2 .

[0074] The lifting ring 4 is liftably arranged on the tensioning seat 2 and surrounds the outer side of the support ring 3. The pressure plate 5 is fixedly connected to the top of the lifting ring 4. A clamping groove is formed between the pressure plate 5 and the lifting ring 4. The pressure plate 5 has a suspended section 51. An insertion port 52 is formed between the suspended section 51 and the lifting ring 4.

[0075] The lifting drive mechanism 6 is at least partially disposed on the mounting plate 1 and is in transmission connection with the lifting ring 4 . The lifting drive mechanism 6 is used to drive the lifting ring 4 to lift and switch between a first height and a second height, wherein the first height is higher than the second height.

[0076] When the lifting ring 4 rises to the first height, the insertion port 52 and the clamping groove are higher than the upper end of the support ring 3, the wafer ring can be inserted into the clamping groove through the insertion port 52, and the carrier film covers the upper surface of the support ring.

[0077] When the lifting ring 4 descends to the second height, the peripheral part of the carrier film is driven by the pressure plate and the lifting ring to descend to a position lower than the upper surface of the support ring 3, and the middle part of the carrier film is tensioned on the upper surface of the support ring 3.

[0078] The auxiliary clamping mechanism 7 is arranged on the tensioning seat 2 and is located on the outside of the suspended section 51. The auxiliary clamping mechanism 7 is transmission-connected to the lifting ring 4. When the lifting ring 4 descends to the second height, the auxiliary clamping mechanism 7 is configured to press the suspended section 51 downward under the drive of the lifting ring 4, so that the suspended section 51 presses the wafer ring.

[0079] When the lifting ring 4 rises to the first height, the auxiliary pressing mechanism is configured to release the suspended section 51 driven by the lifting ring 4 .

[0080] The optional working process of the wafer feeding device in the embodiment of the present application is as follows:

[0081] First, the lifting ring 4 is controlled to rise to a first height so that the insertion port 52 and the clamping groove are higher than the upper end of the support ring 3. Then, the wafer ring is inserted into the clamping groove through the insertion port 52. After the wafer ring is inserted into place, the carrier film carrying the chip covers the upper part of the support ring 3.

[0082] Next, the lifting ring 4 is controlled to descend to the second height, and the peripheral part of the carrier film is driven by the pressing plate 5 and the lifting ring 4 to descend to a position lower than the upper surface of the support ring 3, so that the middle part of the carrier film is tensioned on the upper surface of the support ring 3. At the same time, the auxiliary clamping mechanism 7 is driven by the lifting ring 4 to press the suspended section 51 downward, so that the suspended section 51 presses the wafer ring.

[0083] At this point, the wafer ring is installed and fixed, and the material removal device picks up and loads the wafer on the carrier film.

[0084] When the wafers on the carrier film are emptied, the lifting ring 4 is controlled to rise to the first height again, and the auxiliary clamping mechanism releases the suspended section 51 under the drive of the lifting ring 4. At the same time, the peripheral part of the carrier film rises under the drive of the pressing plate 5 and the lifting ring 4, thereby separating from the support ring 3. At this time, the emptied wafer ring can be pulled out from the clamping groove through the insertion port 52, and then replaced with a new wafer ring.

[0085] The wafer feeding device in the embodiment of the present application includes an auxiliary clamping mechanism 7 arranged on the tensioning seat 2 and located on the outside of the suspended section 51 of the pressure plate 5. When the lifting ring 4 descends to the second height and the support ring 3 tensions the peripheral part of the carrier film upward, the auxiliary clamping mechanism 7 is driven by the lifting ring 4 to press the suspended section 51 of the pressure plate 5 downward, thereby ensuring that the suspended section 51 can be effectively pressed onto the wafer ring located at the insertion port 52, thereby enhancing the clamping effect of the pressure plate 5 on the wafer ring and preventing the wafer ring from tilting.

[0086] like Figures 9 to 11 As shown, optionally, the auxiliary pressing mechanism 7 includes a rack 71, a connecting rod 72, a gear 73 and a pressing claw 74, wherein:

[0087] The rack 71 is arranged on the tensioning seat 2 along the vertical direction.

[0088] The connecting rod 72 is rotatably mounted on the lifting ring 4 . The connecting rod 72 extends in the horizontal direction. The gear 73 is sleeved on the connecting rod 72 and meshes with the rack 71 . The pressing claw 74 is connected to the connecting rod 72 .

[0089] When the lifting ring 4 descends from the first height to the second height, the rack 71 drives the connecting rod 72 to rotate in a first clockwise direction (such as clockwise direction) via the gear 73, and the connecting rod 72 drives the pressing claw 74 to rotate toward the suspended section 51, so that the pressing claw 74 presses the suspended section 51 downward.

[0090] When the lifting ring 4 rises from the second height toward the first height, the rack 71 drives the connecting rod 72 to rotate along the second clockwise direction (such as counterclockwise direction) via the gear 73, and the connecting rod 72 drives the pressing claw 74 to rotate away from the suspended section 51, so that the pressing claw 74 releases the suspended section 51.

[0091] It can be seen that by setting the auxiliary clamping mechanism 7, the auxiliary clamping mechanism 7 can be driven by the lifting ring 4 to achieve the following movement with the lifting ring 4. Finally, when the lifting ring 4 descends from the first height to the second height, the auxiliary clamping mechanism 7 synchronously presses the suspended section 51 downward. When the lifting ring 4 rises from the second height to the first height, the auxiliary clamping mechanism 7 synchronously releases the suspended section 51.

[0092] That is to say, the auxiliary clamping mechanism 7 does not need to be equipped with additional driving components, and its clamping and releasing operations are completely triggered by the lifting and lowering of the lifting ring 4. With such a configuration, it can be achieved that when the lifting ring 4 is lifted and lowered into place, the auxiliary clamping mechanism 7 can simultaneously implement the clamping or releasing of the suspended section 51, thereby speeding up the work rhythm and improving work efficiency. In addition, since the auxiliary clamping mechanism 7 does not need to be equipped with additional driving components, the equipment cost is reduced.

[0093] Of course, the auxiliary pressing mechanism 7 may also adopt other existing pressing mechanisms that can press and release the suspended section 51 .

[0094] like Fig.12 As shown, optionally, the gear 73 has a tooth vacant area 732, and the tooth vacant area 732 lacks at least one tooth 731. When the lifting ring 4 is at the first height, the tooth vacant area 732 is staggered with the rack 71, and the teeth 732 on the gear 73 are meshed with the rack 71. When the lifting ring 4 is at the second height, the tooth vacant area 732 abuts against the rack 71, and the teeth 731 on the gear 73 are disengaged from the rack 71.

[0095] When the lifting ring 4 descends from the first height to the third height, the pressing claw 74 rotates downward to its position and presses on the suspended section 51. At this time, the tooth vacant area 732 abuts against the rack 71, and the teeth 731 on the gear 73 disengage from the rack 71. When the lifting ring 4 continues to descend to the second height, the tooth vacant area 732 slides on the rack, and the pressing claw 74 does not continue to rotate downward, but is pressed and maintained on the suspended section 51 with a constant pressure. It can be seen that the pressing claw 74 only rotates downward to press the suspended section 51 within the stroke of the lifting ring 4 descending from the first height to the third height, thereby avoiding excessive downward pressure of the pressing claw 74, causing the pressing claw 74, the suspended section 51 of the pressure plate 5 or the wafer ring to be over-pressed and deformed.

[0096] When the lifting ring 4 rises from the second height to the third height, the tooth vacant area 732 slides on the rack 71, and the pressure claw 74 is pressed and held on the suspended section 51 with a constant pressure. When the lifting ring 4 reaches the third height, the tooth 731 on the gear 73 meshes with the rack 71. When the lifting ring 4 continues to rise to the first height, the pressure claw 74 rotates upward and away from the suspended section 51 driven by the gear 73 to release the suspended section 51. When the lifting ring 4 reaches the first height, the tooth vacant area 732 is completely offset from the rack 71. It can be seen that the pressure claw 74 only rotates upward to release the suspended section 51 within the stroke of the lifting ring 4 rising from the third height to the first height, so as to avoid excessive rotation of the pressure claw 74 and interference with the tensioning seat 2 and other components.

[0097] The third height mentioned above is located between the first height and the second height. For example, the third height is located at an intermediate position between the first height and the second height.

[0098] like Fig.10 As shown, optionally, the middle of the suspended section 51 has a notch, which divides the suspended section 51 into a first suspended section 511 and a second suspended section 512. The auxiliary pressing mechanism 7 includes a first pressing claw 741 and a second pressing claw 742 connected to the connecting rod 72 at intervals, that is, the pressing claw interval is set to two. Wherein:

[0099] The first pressing claw 741 is used to press and release the first suspended section 511 , and the second pressing claw 742 is used to press and release the second suspended section 512 .

[0100] The suspended section 51 is divided into a first suspended section 511 and a second suspended section 512. On the one hand, the wafer ring can be more conveniently inserted into the clamping groove between the pressure plate 5 and the lifting ring 4. On the other hand, the first clamping claw 741 and the second clamping claw 742 can respectively clamp the first suspended section 511 and the second suspended section 512 with free ends downward, so that the first suspended section 511 and the second suspended section 512 can be more firmly clamped onto the wafer ring at the insertion port, further improving the clamping effect of the suspended section 51 on the wafer ring.

[0101] In order to improve the stability of the first pressing claw 741 pressing the first suspended section 511 and prevent slipping. Fig.10 As shown, optionally, the first suspended section 511 is provided with a first pressure-bearing tongue 513 extending outward from the first suspended section 511 , and the first pressing claw 741 presses and releases the first suspended section 511 via the first pressure-bearing tongue 513 .

[0102] Similarly, in order to improve the pressing stability of the second pressing claw 742 on the second suspended section 512 and prevent slipping, the second suspended section 512 is provided with a second pressing tongue 514 extending outward from the second suspended section 512 , and the second pressing claw 742 presses and releases the second suspended section 512 via the second pressing tongue 514 .

[0103] like Figures 4 to 5 and Figures 7 and 8 As shown, optionally, the lifting drive mechanism 6 includes a first driving part 61, N first gears 62, a first synchronous belt 63 and a second gear 64, wherein:

[0104] N first gears 62 are arranged on the tensioning seat 2 along the circumferential direction. Each first gear 62 is installed on the tensioning seat 2 via a first rotating shaft. The first synchronous belt 63 is sleeved on the N first gears 62 and meshes with each first gear 62 .

[0105] The bottom of the lifting ring 4 is provided with lifting screws corresponding to the 1st to N-1th first gears 62 one by one, and the lower end of each lifting screw is screwed into the shaft hole of the corresponding first rotating shaft.

[0106] The second gear 64 is coaxially mounted on the tensioning seat 2 with the Nth first gear 62 via the second rotating shaft, and the second gear 64 is located outside the first synchronous belt 63 .

[0107] The first driving part 61 is arranged on the mounting plate 1, and the first driving part 61 can be connected with the second gear 64 to drive the second gear 64 to rotate. When the second gear 64 rotates, the first gear 62 and the first synchronous belt 63 installed coaxially drive the first gears 62 to rotate synchronously. When the first gears 62 rotate synchronously, they drive the lifting screws to rise and fall, so as to drive the lifting ring 4 to rise and fall.

[0108] The first driving part 61 synchronously drives a plurality of lifting screws circumferentially arranged at the bottom of the lifting ring 4 to move up and down, thereby driving the lifting ring 4 to move up and down, improving the lifting stability of the lifting ring 4 and preventing the lifting ring 4 from tilting during the lifting process.

[0109] Optionally, N≥3. That is, the lifting drive mechanism 6 includes at least three first gears 62 .

[0110] like Figures 13 to 15 As shown, optionally, the first driving part 61 includes a mounting seat 611, a translation driving module 612, a rotation driving module 613 and a driving gear 614, wherein:

[0111] The mounting seat 611 is arranged on the mounting plate 1 and is located at the side of the tensioning seat 2, and the translation driving module 612 is arranged on the mounting seat 611. The rotation driving module 613 is slidably connected to the mounting seat 611 and is transmission-connected to the translation driving module 612, and the driving gear 614 is connected to the movable part of the rotation driving module 613.

[0112] The translation drive module 612 is used to drive the driving gear 614 to translate toward or away from the second gear 64 so that the driving gear 614 engages with or disengages from the second gear 64. When the driving gear 614 engages with the second gear 64, the rotation drive module 613 drives the driving gear 614 to rotate, thereby driving the second gear 64 to rotate.

[0113] When it is necessary to implement the lifting and lowering drive of the lifting ring 4, the translation drive module 612 drives the rotation drive module 613 and the driving gear 614 to translate toward the second gear 64, so that the driving gear 614 engages with the second gear 64. At this time, the rotation drive module 613 can drive the driving gear 614 to rotate to implement the lifting and lowering drive of the lifting ring 4.

[0114] When the position of the lifting ring 4 needs to be adjusted, the translation drive module 612 drives the rotation drive module 613 and the drive gear 614 to translate away from the second gear 64, so that the drive gear 614 is meshed and separated from the second gear 64, preventing the lifting ring 4 from interfering with the translation drive module 612 during movement.

[0115] The translation drive module 612 can adopt various existing linear drive modules that can drive the driving gear 614 to translate toward or away from the second gear 64, such as a cylinder module, a screw module, etc.

[0116] The rotation drive module 613 can adopt various existing drive devices that can drive the gear 614 to rotate. For example, the rotation drive module 613 adopts a worm gear reduction drive structure. The worm gear reduction drive has the advantages of large output torque and stable driving, which can further improve the lifting accuracy of the lifting ring 4. Specifically, the rotation drive module 613 includes a driving member (such as a motor), a turbine 617 and a worm. The worm is connected to the driving end of the driving member and meshes with the turbine 617. The driving gear 614 and the turbine 617 are coaxially installed on a connecting member (not shown in the figure) through a rotating shaft. The connecting member is slidably installed on the mounting seat 611 and connected to the driving end of the translation drive module 612. The translation drive module 612 drives the turbine 617 to move back and forth on the worm through the connecting member, thereby driving the driving gear 614 to approach or move away from the second gear 64.

[0117] In addition, a photoelectric baffle 616 is installed at the driving end of the driving member, and a tooth groove is provided on the photoelectric baffle 616. A photoelectric sensor is fixedly installed at the position of the tooth groove corresponding to the side of the photoelectric baffle. When the driving member drives the driving gear 614 to rotate through the turbine 617 and the worm, the photoelectric baffle 616 is synchronously driven to rotate. The photoelectric sensor senses the signal, counts the sensed signal, and calculates the rotation angle of the worm in combination with the predefined tooth groove width, thereby implementing the detection of the moving position of the driving member and controlling the rotation angle of the driving gear 614, which can further improve the accuracy of the angle adjustment.

[0118] In addition, the transmission form of the worm gear has a stable structure and low cost. Of course, the rotary drive module 613 can also use a servo motor or a stepper motor, etc., which will not be repeated here.

[0119] Optionally, the first driving part 61 further includes a locking pin 615, which is connected to the movable part of the translation driving module 612. When the translation driving module 612 drives the driving gear 614 to engage with the second gear 64, the locking pin 615 is synchronously inserted into the locking hole on the tensioning seat 2 that matches the locking pin 615, thereby ensuring that the driving gear 614 and the second gear 64 form a stable engagement and prevent the driving gear 614 from disengaging or slipping from the second gear 64. When the translation driving module 612 drives the driving gear 614 to separate from the second gear 64, the locking pin 615 is withdrawn from the locking hole. When the locking pin 615 is withdrawn from the locking hole, the position of the tensioning seat 2 can be adjusted.

[0120] like Figures 4 to 6 As shown, optionally, the tensioning seat 2 is rotatably mounted on the mounting plate 1, and the wafer feeding device in the embodiment of the present application further includes a rotation driving mechanism 8 disposed on the mounting plate 1, and the rotation driving mechanism 8 is used to drive the tensioning seat 2 to rotate in a horizontal plane, so as to drive the wafer ring to rotate in a horizontal plane. In this way, the angle of the wafer in the wafer ring can be flexibly adjusted to ensure that the wafer picking device can smoothly implement the wafer picking.

[0121] Optionally, the rotary drive mechanism 8 includes a second drive unit 81, a synchronous pulley 82, a second synchronous belt 83 and a toothed disc 84, wherein: the toothed disc 84 is rotatably mounted on the mounting plate 1, and the tensioning seat 2 is fixedly mounted above the toothed disc 84. The second synchronous belt 83 is provided with meshing teeth, and the meshing teeth on the second synchronous belt 83 mesh with the outer periphery of the toothed disc 84. The synchronous pulley 82 is mounted on the mounting plate 1 and is connected to the toothed disc 84 through the second synchronous belt 83. The second drive unit 81 is arranged on the mounting plate 1, and the second drive unit 81 is used to drive the synchronous pulley 82 to rotate, so as to drive the toothed disc 84 and the tensioning seat 2 to rotate in a horizontal plane.

[0122] The second synchronous belt 83 cooperates with the toothed disc 84 to drive the tensioning seat 2 in rotation, thereby improving the driving stability of the tensioning seat 2 and thus improving the angle adjustment accuracy of the wafer. Of course, other existing rotation drive mechanisms can also be used to drive the tensioning seat 2 to rotate.

[0123] The second driving part 81 can adopt various existing driving parts that can drive the synchronous pulley 82 to rotate. For example, the second driving part 81 is a driving motor that is connected to the synchronous pulley 82 through a synchronous belt.

[0124] like Figures 1 to 3As shown, optionally, the wafer feeding device in the embodiment of the present application further includes a translation drive mechanism 9, and the mounting plate 1 is horizontally arranged on the movable part of the translation drive mechanism 9. The translation drive mechanism 9 is used to drive the mounting plate 1 to translate in the horizontal plane, so as to drive the wafer ring to translate in the horizontal plane.

[0125] By setting the translation drive mechanism 9, the position of the wafer ring in the horizontal direction is adjusted, thereby realizing the position adjustment of the wafer on it. In this way, before each crystal retrieval, the wafer to be picked up can be adjusted to the predetermined crystal retrieval position, so that the crystal retrieval device can pick up the wafer from the crystal retrieval position each time, thereby improving the crystal retrieval efficiency. In addition, the translation drive mechanism 9 can also realize the switching of the driving mounting plate 1 between the loading position and the wafer retrieval position, which is convenient for manual material replacement.

[0126] like Figure 1 As shown, optionally, the translation drive mechanism 9 includes a base plate 91, an X-axis translation drive member (not shown in the figure), a sliding plate 92 and a Y-axis translation drive member (not shown in the figure), wherein: the sliding plate 92 is slidably connected to the base plate 91, the X-axis translation drive member is arranged on the base plate 91 and is transmission-connected to the sliding plate 92, and the X-axis translation drive member is used to drive the sliding plate 92 to slide along the X-axis. The mounting plate 1 is slidably connected to the sliding plate 92, the Y-axis translation drive member is arranged on the sliding plate and is transmission-connected to the mounting plate, and the Y-axis translation drive member is used to drive the mounting plate to slide along the Y-axis.

[0127] The X-axis translation drive component and the Y-axis translation drive component can both adopt various existing translation drive components, such as a cylinder, a screw motor, etc.

[0128] The present application is described in sufficient detail above with certain particularity. It should be understood by those skilled in the art that the description in the embodiments is merely exemplary, and all changes made without departing from the true spirit and scope of the present application should fall within the scope of protection of the present application. The scope of protection claimed in the present application is defined by the claims, rather than by the above description in the embodiments.

Claims

1. A wafer feeding device, characterized in that: The wafer feeding device is used to fix the wafer ring, and a carrier film carrying chips is tensioned inside the wafer ring. The wafer feeding device includes a mounting plate, a tensioning seat, a support ring, a lifting ring, a pressing plate, a lifting drive mechanism and an auxiliary pressing mechanism, wherein: The tensioning seat is arranged on the mounting plate, and the supporting ring is arranged on the tensioning seat; The lifting ring is liftably arranged on the tensioning seat and surrounds the outer side of the supporting ring, the pressing plate is fixedly connected to the top of the lifting ring, a pressing groove is formed between the pressing plate and the lifting ring, the pressing plate has a suspended section, and an insertion port is formed between the suspended section and the lifting ring; The lifting drive mechanism is at least partially disposed on the mounting plate and is in transmission connection with the lifting ring, and the lifting drive mechanism is used to drive the lifting ring to lift and switch between a first height and a second height, wherein the first height is higher than the second height; When the lifting ring rises to the first height, the insertion port and the clamping groove are higher than the upper end of the support ring, the wafer ring can be inserted into the clamping groove through the insertion port, and the carrier film covers the support ring; When the lifting ring is lowered to the second height, the peripheral part of the carrier film is driven by the pressing plate and the lifting ring to be lowered to a position lower than the upper surface of the support ring, and the middle part of the carrier film is tensioned on the upper surface of the support ring; The auxiliary clamping mechanism is arranged on the tensioning seat and is located outside the suspended section. The auxiliary clamping mechanism is in transmission connection with the lifting ring. When the lifting ring descends to the second height, the auxiliary clamping mechanism is configured to press the suspended section downward under the drive of the lifting ring, so that the suspended section presses the wafer ring. When the lifting ring rises to the first height, the auxiliary clamping mechanism is configured to release the suspended section driven by the lifting ring.

2. The wafer feeding device according to claim 1, characterized in that: The auxiliary clamping mechanism includes a rack, a connecting rod, a gear and a pressing claw, wherein: The rack is arranged on the tensioning seat along the vertical direction; The connecting rod is rotatably mounted on the lifting ring, the connecting rod extends in the horizontal direction, the gear is sleeved on the connecting rod and meshes with the rack, and the pressing claw is connected to the connecting rod; When the lifting ring descends from the first height toward the second height, the rack drives the connecting rod to rotate in a first clockwise direction via the gear, and the connecting rod drives the pressing claw to rotate toward the suspended section, so that the pressing claw presses the suspended section downward; When the lifting ring rises from the second height toward the first height, the rack drives the connecting rod to rotate along the second clockwise direction via the gear, and the connecting rod drives the pressing claw to rotate away from the suspended section, so that the pressing claw releases the suspended section. The first clockwise direction is opposite to the second clockwise direction.

3. The wafer feeding device according to claim 2, characterized in that: The gear has a tooth-missing area, and the tooth-missing area lacks at least one tooth; When the lifting ring is at the first height, the tooth vacant area is offset from the rack, and the teeth on the gear mesh with the rack; When the lifting ring is at the second height, the tooth vacant area abuts against the rack, and the teeth on the gear are disengaged from the rack; When the lifting ring descends from the first height to the third height, the pressing claw rotates downward to press the suspended section, the tooth vacant area abuts against the rack, and the teeth on the gear are disengaged from the rack; when the lifting ring continues to descend to the second height, the tooth vacant area slides on the rack; When the lifting ring rises from the second height to the third height, the tooth vacant area slides on the rack, and the teeth on the gear mesh with the rack; when the lifting ring continues to rise to the first height, the tooth vacant area is offset from the rack, and the pressing claw rotates upward away from the suspended section; Wherein, the third height is located between the first height and the second height.

4. The wafer feeding device according to claim 2, characterized in that: The middle part of the suspended section has a notch, and the notch divides the suspended section into a first suspended section and a second suspended section; The auxiliary pressing mechanism comprises a first pressing claw and a second pressing claw connected to the connecting rod at intervals, wherein the first pressing claw is used to press and release the first suspended section, and the second pressing claw is used to press and release the second suspended section.

5. The wafer feeding device according to claim 4, characterized in that: The first suspended section is provided with a first pressure-bearing tongue extending outward from the first suspended section, and the first pressing claw presses and releases the first suspended section via the first pressure-bearing tongue; The second suspended section is provided with a second pressure-bearing tongue extending outward from the second suspended section, and the second pressing claw presses and releases the second suspended section via the second pressure-bearing tongue.

6. The wafer feeding device according to claim 1, characterized in that: The lifting drive mechanism includes a first driving part, N first gears, a first synchronous belt and a second gear, wherein: N first gears are arranged on the tensioning seat along the circumferential direction, each of the first gears is installed on the tensioning seat via a first rotating shaft, and the first synchronous belt is sleeved on the N first gears and meshed with each of the first gears; The bottom of the lifting ring is provided with lifting screws corresponding to the 1st to N-1th first gears respectively, and the lower end of each lifting screw is screwed into the corresponding shaft hole of the first rotating shaft; The second gear is coaxially mounted on the tensioning seat with the Nth first gear via a second rotating shaft, and the second gear is located outside the first synchronous belt; The first driving part is arranged on the mounting plate, and the first driving part can be connected with the second gear to drive the second gear to rotate. When the second gear rotates, the first gear and the first synchronous belt installed coaxially drive the first gears to rotate synchronously. When the first gears rotate synchronously, they drive the lifting screws to rise and fall, so as to drive the lifting ring to rise and fall.

7. The wafer feeding device according to claim 6, characterized in that: The first driving part includes a mounting seat, a translation driving module, a rotation driving module and a driving gear, wherein: The mounting seat is arranged on the mounting plate and is located at the side of the tensioning seat, and the translation driving module is arranged on the mounting seat; The rotary drive module is slidably connected to the mounting seat and is transmission-connected to the translation drive module, and the driving gear is connected to the movable part of the rotary drive module; The translation drive module is used to drive the driving gear to translate toward or away from the second gear so that the driving gear engages with or disengages from the second gear. When the driving gear engages with the second gear, the rotation drive module drives the driving gear to rotate, thereby driving the second gear to rotate.

8. The wafer feeding device according to claim 7, characterized in that: The rotary drive module includes a driving member, a turbine, a worm, a photoelectric baffle and a photoelectric sensor, wherein: The worm is mounted on the driving end of the driving member and meshes with the turbine for transmission; the turbine and the driving gear are coaxially mounted on the connecting member; the connecting member is slidably mounted on the mounting seat and connected to the driving end of the translation driving module; The photoelectric baffle is installed at the driving end of the driving member, and a tooth groove is opened around the periphery of the photoelectric baffle. The photoelectric sensor is fixedly installed on the side of the photoelectric baffle and arranged corresponding to the tooth groove. The photoelectric sensor is configured to cooperate with the photoelectric baffle to implement detection of the moving position of the driving member.

9. The wafer feeding device according to claim 7, characterized in that: The first driving part further comprises a locking pin, and the locking pin is connected to the movable part of the translation driving module; When the translation drive module drives the driving gear to engage with the second gear, the locking pin is inserted into the locking hole on the tensioning seat that matches the locking pin; When the translation drive module drives the driving gear to separate from the locking pin, the locking pin is withdrawn from the locking hole.

10. The wafer feeding device according to claim 1, characterized in that: The tensioning seat is rotatably mounted on the mounting plate, and the wafer feeding device further comprises a rotation driving mechanism disposed on the mounting plate, the rotation driving mechanism being used to drive the tensioning seat to rotate in a horizontal plane, so as to drive the wafer ring to rotate in a horizontal plane; The rotary drive mechanism comprises a second drive unit, a synchronous pulley, a second synchronous belt and a toothed disc, wherein: The toothed disc is rotatably mounted on the mounting plate, and the tensioning seat is fixedly mounted above the toothed disc; The second synchronous belt is provided with meshing teeth, the meshing teeth on the second synchronous belt mesh with the outer periphery of the toothed disc, the synchronous belt wheel is mounted on the mounting plate and is connected to the toothed disc through the second synchronous belt; The second driving part is arranged on the mounting plate, and the second driving part is used for driving the synchronous pulley to rotate, so as to drive the toothed disc and the tensioning seat to rotate in a horizontal plane.

11. The wafer feeding device according to claim 1, characterized in that: The wafer feeding device further comprises a translation driving mechanism, and the mounting plate is horizontally arranged on a movable part of the translation driving mechanism; The translation drive mechanism is used to drive the mounting plate to translate in a horizontal plane, so as to drive the wafer ring to translate in a horizontal plane; The translation drive mechanism comprises a base plate, an X-axis translation drive member, a sliding plate and a Y-axis translation drive member, wherein: The sliding plate is slidably connected to the bottom plate, the X-axis translation driver is arranged on the bottom plate and is transmission-connected to the sliding plate, and the X-axis translation driver is used to drive the sliding plate to slide along the X-axis; The mounting plate is slidably connected to the sliding plate, the Y-axis translation driver is arranged on the sliding plate and is drivingly connected to the mounting plate, and the Y-axis translation driver is used to drive the mounting plate to slide along the Y-axis.

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