Substrate processing apparatus

Abstract

The substrate processing apparatus includes: a rotary base disposed below a substrate held by a plurality of jig members and transmitting power of a rotary motor to the jig members; and a nozzle for supplying a processing fluid for processing the substrate to at least one of the upper surface and the lower surface of the substrate. An IH heating mechanism of a substrate processing apparatus includes a heat generating member disposed between a substrate and a rotating base, a heating coil disposed below the rotating base, and an IH circuit that generates an alternating magnetic field applied to the heat generating member by supplying power to the heating coil, thereby causing the heat generating member to generate heat.

Description

[0001] This application is a divisional application of a patent application with application number CN 201780053600.6, application date May 25, 2017, and invention name “Substrate Processing Device”. Technical Field

[0002] The present invention relates to a substrate processing device for processing substrates. The substrates to be processed include, for example, semiconductor wafers, substrates for liquid crystal display devices, substrates for plasma displays, substrates for FEDs (Field Emission Displays), substrates for optical disks, substrates for magnetic disks, substrates for magneto-optical disks, substrates for photomasks, ceramic substrates, and substrates for solar cells. Background Art

[0003] In the manufacturing process of a semiconductor device, a liquid crystal display device, or the like, a processing fluid may be supplied to a substrate while the substrate is rotated and heated.

[0004] Patent document 1 discloses the following technology: while rotating a rotating fixture holding a substrate by a rotation drive mechanism, an alternating magnetic field is applied to a heating plate disposed inside the rotating fixture to heat the heating plate. The substrate is held by a plurality of holding pins protruding upward from the upper surface of the rotating fixture. The rotating fixture is arranged below the substrate held by the plurality of holding pins. The substrate is heated by the heating plate disposed inside the rotating fixture.

[0005] Prior art literature

[0006] Patent Document 1: Japanese Patent Application Publication No. 2007-335709. Summary of the invention

[0007] Problems to be solved by the invention

[0008] In Patent Document 1, a substrate held by a plurality of holding pins is arranged above a rotating fixture, and a heating plate for heating the substrate is arranged inside the rotating fixture. Therefore, the distance between the substrate and the heating plate becomes longer. Therefore, the heating efficiency of the substrate is reduced.

[0009] Therefore, an object of the present invention is to improve the heating efficiency of a substrate when a processing fluid is supplied to the substrate while the substrate is rotated and heated.

[0010] Technical solutions to the problem

[0011] One embodiment of the present invention provides a substrate processing device, comprising: a plurality of clamping members, which clamp the substrate horizontally by a plurality of holding portions arranged around the substrate, thereby holding the substrate horizontally; a rotating motor, which generates power to rotate the substrate around a vertical rotation axis that passes through the central portion of the substrate held by the plurality of clamping members; a rotating base, which is arranged below the substrate held by the plurality of clamping members and transmits the power of the rotating motor to the plurality of clamping members; a processing fluid supply unit, which supplies processing fluid for processing the substrates held by the plurality of clamping members to at least one of the upper surface and the lower surface of the substrate; and an IH (induction heating) heating mechanism, which includes a heating member, a heating coil and an IH circuit, wherein the heating member is arranged between the substrate held by the plurality of clamping members and the rotating base, the heating coil is arranged below the rotating base, and the IH circuit generates an alternating magnetic field applied to the heating member by supplying power to the heating coil to cause the heating member to generate heat.

[0012] According to this structure, the substrate is held by a plurality of clamp members. The power of the rotating motor is transmitted to the plurality of clamp members via a rotating base located below the substrate. As a result, the substrate rotates around the axis of rotation. The IH circuit of the IH heating mechanism supplies power to the heating coil when the substrate rotates. As a result, an alternating magnetic field applied to the heating component is generated, and the heating component generates heat. A processing fluid for processing the substrate is supplied to the rotating substrate. As a result, the substrate can be processed uniformly.

[0013] Since the heating component is heated by induction heating, it is not necessary to connect the wiring or connector for supplying power to the heating component to the heating component. Therefore, the rotation speed of the substrate is not limited by such a structure. In addition, the heating component for heating the substrate is arranged between the substrate and the rotating base, rather than arranged inside the rotating base. Therefore, compared with the case where the heating component is arranged inside the rotating base, the interval between the substrate and the heating component can be shortened, and the heating efficiency of the substrate can be improved.

[0014] In this embodiment, at least one of the following features may be added to the substrate processing apparatus.

[0015] The distance between the heating coil and the rotating base in the vertical direction is smaller than the thickness of the heating coil. The thickness of the heating coil refers to the length of the heating coil in the vertical direction.

[0016] According to this structure, the heating coil is arranged near the rotating base. That is, the interval between the heating coil and the rotating base in the up and down direction is smaller than the thickness of the heating coil. The heating coil is arranged below the rotating base, and the heating component is arranged above the rotating base. When the heating coil is brought close to the rotating base, the distance from the heating coil to the heating component is shortened. As a result, since the alternating magnetic field applied to the heating component becomes stronger, the power supplied to the heating coil can be effectively converted into heat of the heating component.

[0017] The thickness of the rotating base is smaller than the thickness of the heating coil.

[0018] According to this structure, the thickness of the rotating base is reduced. That is, the thickness of the rotating base is smaller than the thickness of the heating coil. If the rotating base is thicker, not only the distance from the heating coil to the heating component increases, but also the alternating magnetic field applied to the heating component becomes weaker. Therefore, by reducing the thickness of the rotating base, the temperature of the heating component can be effectively increased.

[0019] The thickness of the rotating base refers to the length of the rotating base in the vertical direction. The thickness of the rotating base refers to the thickness of the rotating base in the area between the heat generating component and the heating coil. The thickness of the rotating base in other areas can be equal to the thickness of the heating coil, or can be greater or less than the thickness of the heating coil.

[0020] The heat generating member directly faces the substrate held by the plurality of clamp members.

[0021] According to this structure, no other components are installed between the substrate and the heat generating component, but the heat generating component and the substrate are directly facing each other. Therefore, the heat energy of the heat generating component is effectively transferred to the substrate, thereby improving the heating efficiency of the substrate.

[0022] The substrate processing apparatus further includes: a spacing changing mechanism for changing the spacing in the vertical direction between the substrates gripped by the plurality of clamp members and the heat generating member by moving the plurality of clamp members or the heat generating member in the vertical direction.

[0023] According to this structure, the interval changing mechanism makes the plurality of clamp members and the heating member move relative to each other in the vertical direction. Thus, the interval between the substrate held by the plurality of clamp members and the heating member in the vertical direction is changed. Therefore, the distance from the heating member to the substrate can be changed as needed.

[0024] The substrate processing device further comprises: a transport robot that supports the substrate by a hand disposed below the substrate and transports the substrate to the plurality of clamp members, wherein the interval changing mechanism moves the plurality of clamp members or the heat generating member in the vertical direction between a retreat position and an approach position, wherein the retreat position is a position where the interval between the substrate held by the plurality of clamp members and the heat generating member in the vertical direction is greater than the thickness of the hand, and the approach position is a position where the interval is less than the thickness of the hand. The thickness of the hand refers to the length of the hand in the vertical direction.

[0025] According to this structure, in a retracted state where a plurality of clamp components or a heating component are located at a retracted position, the transport robot places a substrate supported on a hand on a plurality of clamp components. Next, the transport robot lowers the hand and separates it from the substrate. Then, the transport robot retracts the hand from between the substrate and the heating component. When taking the substrate out of the plurality of clamp components, the hand is inserted between the substrate and the heating component in the retracted state. Then, the transport robot raises the hand. As a result, the substrate is separated from the plurality of clamp components and supported by the hand.

[0026] From the viewpoint of heating efficiency, the heating component is preferably arranged near the substrate. However, if the heating component is too close to the substrate, the hand cannot be inserted between the substrate and the heating component, and thus the substrate cannot be placed in or taken out of a plurality of clamp components. As described above, the transfer of the substrate is performed in a retreated state. On the other hand, the heating of the substrate is performed in a close state where a plurality of clamp components or the heating component are located in close positions. Therefore, the transfer of the substrate can be performed without reducing the heating efficiency of the substrate.

[0027] The interval changing mechanism enables the plurality of clamp members to move in the up-down direction relative to the rotating base, and the plurality of clamp members include: a movable clamp capable of moving relative to the rotating base between a closed position pressed against the outer periphery of the substrate and an open position in which the pressure against the outer periphery of the substrate is released.

[0028] According to this structure, the plurality of clamp members include a movable clamp that can move between a closed position and an open position relative to a rotating base. The interval between the substrate and the heat generating component in the up-down direction is changed by moving the plurality of clamp members in the up-down direction relative to the rotating base. Therefore, the movable clamp can not only move relative to the rotating base between the closed position and the open position, but also move relative to the rotating base in the up-down direction. In this way, since there is no need to move the heat generating component in the up-down direction in order to change the interval between the substrate and the heat generating component in the up-down direction, the structure of the heat generating component can be supported.

[0029] The interval changing mechanism moves the heat generating member in a vertical direction relative to the rotating base.

[0030] According to this structure, the distance between the substrate and the heating component in the vertical direction is changed by moving the heating component in the vertical direction relative to the rotating base. In this way, since it is not necessary to move multiple clamp components in the vertical direction in order to change the distance between the substrate and the heating component in the vertical direction, the structure supporting multiple clamp components can be simplified.

[0031] The substrate processing apparatus further includes a magnetic shielding member including a cylindrical outer wall portion surrounding the heating coil and a lower wall portion located below the heating coil, and shielding an alternating magnetic field generated by supplying power to the heating coil.

[0032] According to this structure, the outer wall of the magnetic shielding member that absorbs magnetism surrounds the heating coil. In addition, the lower wall of the magnetic shielding member that absorbs magnetism is located below the heating coil. Therefore, it is possible to suppress or eliminate the influence of the alternating magnetic field on the components located around the heating coil. Similarly, it is possible to suppress or eliminate the influence of the alternating magnetic field on the components located below the heating coil.

[0033] The substrate processing apparatus further includes: a thermometer for detecting a temperature of the heat generating member; and a control device for controlling the IH heating mechanism based on a detection value of the thermometer.

[0034] According to this configuration, the detection value of the thermometer for detecting the temperature of the heat generating member is input to the control device. The control device controls the power supplied to the heating coil based on the detection value. Thus, the temperature of the heat generating member can be brought close to the target temperature with high accuracy.

[0035] The thermometer is preferably a non-contact thermometer that detects the temperature of the heat generating member without contacting the heat generating member. An example of such a thermometer is a radiation thermometer that detects the temperature of an object by detecting the intensity of infrared rays or visible light radiated from the object.

[0036] The fluid supply unit includes a lower surface nozzle disposed in a through hole that penetrates the heat generating member in a vertical direction in a plan view, and sprays the processing fluid toward the lower surface of the substrate held by the plurality of clamp members.

[0037] According to this structure, the lower surface nozzle sprays the processing fluid toward the lower surface of the substrate. The lower surface nozzle is arranged in a through hole that penetrates the central part of the heating component in the vertical direction when viewed from above. Therefore, it is possible to suppress or prevent the processing fluid sprayed from the lower surface nozzle from interfering with the heating component. Thus, the processing fluid can be fully supplied to the lower surface of the substrate.

[0038] As long as the lower surface nozzle is arranged in the through hole of the heat generating component in a plan view, the nozzle of the lower surface nozzle for spraying the processing fluid can be arranged at the same height as the upper surface of the heat generating component, or at a position higher or lower than the upper surface of the heat generating component.

[0039] The plurality of clamp members include a movable clamp that can move relative to the rotating base about a vertical clamp rotation axis between a closed position pressed against the outer periphery of the substrate and an open position in which the clamp is released from the outer periphery of the substrate. The clamp rotation axis can be a center line of the movable clamp or a straight line different from the center line of the movable clamp.

[0040] According to this structure, the movable clamp rotates around the vertical clamp rotation axis. In this case, it is easy to reduce the volume of the space through which the movable clamp passes, compared with the case where the clamp rotation axis is a horizontal straight line. In particular, when the clamp rotation axis coincides with the center line of the movable clamp, the volume of the passing space can be made consistent or approximately consistent with the volume of the movable clamp.

[0041] The plurality of clamp members include a movable clamp movable relative to the rotation base about a horizontal clamp rotation axis between a closed position pressed against an outer periphery of the substrate and an open position released from the pressing against the outer periphery of the substrate.

[0042] The substrate processing device also has: a clamp opening and closing mechanism, which switches the multiple clamp members between a closed state in which the multiple holding parts are pressed against the outer periphery of the substrate and an open state in which the pressure of the multiple holding parts relative to the substrate is released by moving the movable clamp between the closed position and the open position, and the clamp opening and closing mechanism includes: a pressing part, which moves the movable clamp to the open position by pressing the movable clamp upward or downward, and the movable clamp includes a pressed part pressed by the pressing part.

[0043] According to this configuration, since the pressing portion of the clamp opening and closing mechanism comes into contact with the pressed portion of the movable clamp and presses the pressed portion, the movable clamp can be opened and closed reliably.

[0044] The clamp opening and closing mechanism further includes an opening and closing actuator that moves the pressing portion in a vertical direction between an upper position where the pressing portion contacts the pressed portion and a lower position where the pressing portion moves downwardly away from the pressed portion.

[0045] According to this structure, when the opening and closing actuator of the clamp opening and closing mechanism causes the pressing portion to rise to the upper position, the pressing portion contacts the pressed portion of the movable clamp, and the pressed portion is pressed upward. Thus, the movable clamp is arranged in the open position. Then, when the opening and closing actuator causes the pressing portion to descend from the upper position, the pressing portion separates downward from the pressed portion, and the movable clamp returns to the closed position. Thus, the movable clamp can be moved between the closed position and the open position.

[0046] The substrate processing device also has: a spacing changing mechanism, which changes the spacing in the vertical direction between the substrate held by the plurality of clamp members and the heat generating member by moving the plurality of clamp members in the vertical direction relative to the rotating base, the pressing portion is connected to the rotating base in a manner of being located above the pressed portion, and the spacing changing mechanism includes: a lifting actuator, which moves the plurality of clamp members in the vertical direction relative to the rotating base between an upper position where the pressed portion contacts the pressing portion and a lower position where the pressed portion separates downward from the pressing portion.

[0047] According to this structure, when the lifting actuator raises the plurality of clamp members to the upper position, the pressed portion of the movable clamp contacts the pressing portion connected to the rotating base and is pressed downward. As a result, the movable clamp is arranged in the open position. Then, when the lifting actuator lowers the plurality of clamp members from the upper position, the pressed portion separates downward from the pressing portion, and the movable clamp returns to the closed position. In this way, since the lifting actuator that raises and lowers the plurality of clamp members relative to the rotating base also serves as an opening and closing actuator that moves the movable clamp, a dedicated opening and closing actuator is not required.

[0048] The above and other objects, features and effects of the present invention will become more apparent from the following description of the embodiments with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0049] Figure 1 It is a schematic diagram of horizontally viewing the interior of a chamber included in the substrate processing apparatus according to the first embodiment of the present invention.

[0050] Figure 2 It is shown along Figure 3 Schematic diagram of the vertical cross section of the rotating fixture along line II-II is shown.

[0051] Figure 3 is a schematic top view of the rotating fixture.

[0052] Figure 4 It is shown along Figure 2 Schematic diagram of a horizontal section of the rotation fixture along line IV-IV is shown.

[0053] Figure 5It is a schematic diagram showing a vertical cross section for explaining a clamp opening and closing mechanism provided in a rotary clamp.

[0054] Fig. 6A This is a schematic diagram for explaining the transfer of the substrate.

[0055] Figure 6B This is a schematic diagram for explaining the transfer of the substrate.

[0056] Figure 7 It is a schematic diagram showing a vertical cross section for explaining the IH heating mechanism provided in the rotating jig.

[0057] Figure 8 This is a schematic plan view for explaining the arrangement of the heating coil.

[0058] Fig. 9 This is a flowchart for explaining an example of processing of a substrate executed by the substrate processing apparatus.

[0059] Fig. 10A It is shown in Fig. 9 FIG. 1 is a schematic diagram showing a state where SPM is supplied to a substrate in an example of substrate processing shown.

[0060] Fig. 10B It is shown in Fig. 9 FIG. 1 is a schematic diagram showing a state where pure water is supplied to a substrate in an example of substrate processing shown.

[0061] Fig. 10C It is shown in Fig. 9 FIG. 1 is a schematic diagram showing a state in which SC1 is supplied to a substrate in an example of processing of the substrate shown.

[0062] Fig. 10D It is shown in Fig. 9 FIG. 1 is a schematic diagram of a state where IPA is supplied to a substrate in an example of substrate processing shown.

[0063] Fig. 10E It is shown in Fig. 9 FIG. 1 is a schematic diagram showing a state where IPA is removed from a substrate in an example of substrate processing shown.

[0064] Fig.10F It is shown in Fig. 9 FIG. 1 is a schematic diagram of a state where a substrate is dried in one example of substrate processing shown.

[0065] Fig.11 It is a schematic diagram showing a vertical cross section including a movable jig according to a second embodiment of the present invention.

[0066] Fig.12 It is shown along Fig.11A schematic diagram of a horizontal section taken along line XII-XII is shown.

[0067] Fig.13 It is a schematic diagram showing a vertical cross section including a movable jig according to a third embodiment of the present invention.

[0068] Fig.14 It is shown Fig.13 A schematic diagram of a horizontal section taken along line XIV-XIV is shown.

[0069] Fig.15 It is a schematic diagram showing a vertical cross section of a rotation jig according to a fourth embodiment of the present invention.

[0070] Description of Reference Numerals

[0071] 1Substrate processing device

[0072] 3. Control Device

[0073] 5First liquid medicine nozzle (treatment fluid supply unit)

[0074] 9 Second liquid medicine nozzle (treatment fluid supply unit)

[0075] 13 Rinsing liquid nozzle (processing fluid supply unit)

[0076] 16 Lower surface nozzle (processing fluid supply unit)

[0077] 19Solvent nozzle (processing fluid supply unit)

[0078] 22 Gas nozzle (processing fluid supply unit)

[0079] 32 Fixture components

[0080] 32a Movable clamp

[0081] 32b Fixing fixture

[0082] 33 Rotating base

[0083] 34 Clamp opening and closing mechanism

[0084] 35 Rotation axis

[0085] 36 Rotating motor

[0086] 38a Grip

[0087] 38b Supporting part

[0088] 51 Coil Spring

[0089] 55 driven magnet

[0090] 56 driving magnet

[0091] 57 Open / Close Actuator

[0092] 61 interval change mechanism

[0093] 62 lifting components

[0094] 66 lifting drive unit

[0095] 67 driven magnet

[0096] 68 driving magnet

[0097] 69 lifting actuator

[0098] 71IH heating mechanism

[0099] 72Heating components

[0100] 72a plate-shaped part

[0101] 72b Foot

[0102] 73 Heating coil

[0103] 74IH Circuit

[0104] 75 Thermometer

[0105] 76 Transparent components

[0106] 77 Magnetic shielding components

[0107] 77a Outer wall

[0108] 77b Lower wall

[0109] 283 inner protrusion (pressed portion)

[0110] 284 push rod (pressing part)

[0111] 384 push rod (pressing part)

[0112] 386 Outer protrusion (pressed portion)

[0113] A1 Rotation axis

[0114] A2 fixture rotation axis

[0115] D1 is the distance from the heating element to the substrate

[0116] D2 The distance between the heating coil and the rotating base in the vertical direction

[0117] H1 Hand

[0118] R1 Transfer Robot

[0119] T1 Hand thickness

[0120] Thickness of T2 heating coil

[0121] Thickness of T3 rotating base

[0122] W substrate DETAILED DESCRIPTION

[0123] Figure 1 It is a schematic diagram of horizontally viewing the interior of the chamber 4 included in the substrate processing apparatus 1 according to the first embodiment of the present invention.

[0124] The substrate processing device 1 is a single-sheet device that processes disc-shaped substrates W such as semiconductor wafers one by one. The substrate processing device 1 includes: a processing unit 2 that processes the substrate W using a processing fluid such as a processing liquid or a processing gas; a transport robot R1 (see Figure 3 ), transporting the substrate W to the processing unit 2; and a control device 3, controlling the substrate processing device 1. The control device 3 is a computer including a memory and a processor, the memory storing information such as programs, and the processor controlling the substrate processing device 1 according to the information stored in the memory.

[0125] The processing unit 2 includes: a box-shaped chamber 4 having an internal space; a rotating clamp 31 that holds a substrate W horizontally in the chamber 4 while rotating the substrate W around a vertical rotation axis A1 passing through the center of the substrate W; a plurality of nozzles that spray various fluids toward the substrate W held by the rotating clamp 31; and a cylindrical cup portion 26 that surrounds the rotating clamp 31.

[0126] The plurality of nozzles include a first liquid nozzle 5 and a second liquid nozzle 9 for spraying liquid onto the upper surface of the substrate W. The first liquid nozzle 5 is connected to a first liquid pipe 6 equipped with a first liquid valve 7. Similarly, the second liquid nozzle 9 is connected to a second liquid pipe 10 equipped with a second liquid valve 11. When the first liquid valve 7 is opened, liquid is supplied from the first liquid pipe 6 to the first liquid nozzle 5, and the liquid is sprayed from the first liquid nozzle 5. When the first liquid valve 7 is closed, the spraying of liquid from the first liquid nozzle 5 is stopped. The same is true for the second liquid nozzle 11.

[0127] A specific example of the liquid medicine (first liquid medicine) sprayed from the first liquid medicine nozzle 5 is SPM (a mixture of sulfuric acid and hydrogen peroxide). A specific example of the liquid medicine (second liquid medicine) sprayed from the second liquid medicine nozzle 9 is SC1 (a mixture of ammonia water, hydrogen peroxide and water). The first liquid medicine may also be phosphoric acid. In addition to SPM and phosphoric acid, the first liquid medicine may also be a liquid containing at least one of sulfuric acid, nitric acid, hydrochloric acid, fluoric acid, phosphoric acid, acetic acid, ammonia water, hydrogen peroxide, an organic acid (e.g., citric acid, oxalic acid, etc.), an organic base (e.g., TMAH: tetramethylammonium hydroxide, etc.), a surfactant and a preservative. The same is true for the second liquid medicine.

[0128] The first chemical liquid nozzle 5 is connected to a first nozzle moving mechanism 8 that moves the first chemical liquid nozzle 5. The second chemical liquid nozzle 9 is connected to a second nozzle moving mechanism 12 that moves the second chemical liquid nozzle 9. The first nozzle moving mechanism 8 moves the first chemical liquid nozzle 5 between a processing position and a standby position, wherein the processing position refers to a position where the first chemical liquid lands on the upper surface of the substrate W, and the standby position refers to a position where the first chemical liquid nozzle 5 is located around the cup portion 26 in a top view. In addition, the first nozzle moving mechanism 8 moves the landing position of the first chemical liquid within the upper surface of the substrate W by moving the first chemical liquid nozzle 5 horizontally. The same is true for the second nozzle moving mechanism 12.

[0129] The plurality of nozzles include a rinse liquid nozzle 13 that sprays the rinse liquid downward toward the center of the upper surface of the substrate W. The rinse liquid nozzle 13 is fixed to the chamber 4. The rinse liquid nozzle 13 can be connected to a third nozzle moving mechanism that moves the rinse liquid nozzle 13. The rinse liquid nozzle 13 is connected to a first rinse liquid pipe 14 on which a first rinse liquid valve 15 is installed. A specific example of the rinse liquid sprayed from the rinse liquid nozzle 13 is pure water (deionized water). The rinse liquid may also be a rinse liquid other than pure water, such as carbonated water, electrolytic ion water, hydrogen water, ozone water, and hydrochloric acid water with a diluted concentration (for example, about 10 to 100 ppm).

[0130] The plurality of nozzles include a lower surface nozzle 16 that sprays the rinsing liquid upward toward the center of the lower surface of the substrate W. The lower surface nozzle 16 is fixed to the chamber 4. The lower surface nozzle 16 is connected to a second rinsing liquid pipe 17 equipped with a second rinsing liquid valve 18. A specific example of the rinsing liquid sprayed from the lower surface nozzle 16 is pure water. The rinsing liquid may also be a rinsing liquid other than the above-mentioned pure water. In addition, the liquid sprayed from the lower surface nozzle 16 may also be a processing liquid other than the rinsing liquid.

[0131] The lower surface nozzle 16 includes: a circular plate portion 16a, which is horizontally maintained at a height between the upper surface of the rotating base 33 and the lower surface of the substrate W; and a cylindrical portion 16b, which extends downward from the circular plate portion 16a along the rotation axis A1. The circular plate portion 16a is annular and surrounds the rotation axis A1, and has an outer diameter smaller than the diameter of the substrate W. The outer diameter of the cylindrical portion 16b is smaller than the outer diameter of the circular plate portion 16a. The cylindrical portion 16b is inserted into a through hole opened in the central portion of the upper surface of the rotating base 33. The nozzle of the lower surface nozzle 16 opens in the central portion of the upper surface of the circular plate portion 16a. The nozzle of the lower surface nozzle 16 faces the central portion of the lower surface of the substrate W in the up and down direction.

[0132] The plurality of nozzles include: a solvent nozzle 19 for spraying IPA (liquid) onto the upper surface of the substrate W; and a gas nozzle 22 for spraying gas onto the upper surface of the substrate W. The solvent nozzle 19 is connected to a solvent pipe 20 equipped with a solvent valve 21. IPA (isopropyl alcohol) has a lower boiling point than water, is more volatile than water, and has a smaller surface tension than water. The gas nozzle 22 is connected to a gas pipe 23 equipped with a gas valve 24. A specific example of the gas sprayed from the gas nozzle 22 is nitrogen. The gas may be an inert gas other than nitrogen, or a gas other than an inert gas.

[0133] The solvent nozzle 19 is connected to a fourth nozzle moving mechanism 25 that moves the solvent nozzle 19 between a processing position and a standby position. The gas nozzle 22 is also connected to the fourth nozzle moving mechanism 25. The gas nozzle 22 may be connected to a fifth nozzle moving mechanism that is different from the fourth nozzle moving mechanism 25. The fourth nozzle moving mechanism 25 moves the solvent nozzle 19 and the gas nozzle 22 up and down between a processing position where the solvent nozzle 19 and the gas nozzle 22 are close to the upper surface of the substrate W and a standby position above the processing position. The fourth nozzle moving mechanism 25 may also be a mechanism that moves the solvent nozzle 19 and the gas nozzle 22 horizontally.

[0134] The cup portion 26 includes: a plurality of splash shields 28 for catching the liquid discharged from the substrate W to the outside; and a plurality of annular trays 27 for catching the liquid guided downward by the splash shields 28. The plurality of splash shields 28 surround the rotating fixture 31. The splash shield 28 includes: a cylindrical inclined portion 28a extending obliquely upward toward the rotation axis A1; and a cylindrical guide portion 28b extending downward from the lower end portion (outer end portion) of the inclined portion 28a. The inclined portion 28a includes an annular upper end having an inner diameter larger than that of the substrate W and the rotating base 33. The upper end of the inclined portion 28a is equivalent to the upper end of the cup portion 26. The plurality of guide portions 28b are respectively arranged above the plurality of annular trays 27.

[0135] The cover lifting unit (not shown) lifts the splash cover 28 vertically between an upper position where the upper end of the inclined portion 28a is located above the holding position where the plurality of clamp members 32 hold the substrate W, and a lower position where the upper end of the inclined portion 28a is located below the holding position. When liquid such as a chemical solution or a rinse liquid is supplied to the substrate W, the splash cover 28 is arranged in the upper position. The liquid that flies outward from the substrate W is caught by the inclined portion 28a and then collected in the ring tray 27 by the guide portion 28b. The control device 3 controls the cover lifting unit to make any one of the splash cover 28 selected according to the type of liquid supplied to the substrate W face the outer peripheral surface of the substrate W.

[0136] Next, the rotating jig 31 will be described.

[0137] Figure 2 It is shown along Figure 3 FIG. 1 is a schematic diagram of a vertical cross section of the rotating fixture 31 taken along line II-II. Figure 3 3 is a schematic top view of the rotating jig 31 . Figure 4 It is shown along Figure 2 FIG. 1 is a schematic diagram of a horizontal cross section of the rotating fixture 31 taken along line IV-IV. Figure 5 It is a schematic diagram showing a vertical cross section for explaining the clamp opening and closing mechanism 34 provided in the rotating clamp 31 . Figure 4 The exposed portions of the driving magnet 56 and the driving magnet 68 are painted black. Figure 5 The movable clamp 32a is shown in a state where it is located at the open position.

[0138] like Figure 2 As shown, the rotating clamp 31 includes: a disk-shaped rotating base 33, which is held horizontally; a plurality of clamp members 32, which horizontally hold the substrate W above the rotating base 33; a clamp opening and closing mechanism 34, which opens and closes the plurality of clamp members 32; and a rotating motor 36, which rotates the rotating base 33 and the clamp members 32 around the rotation axis A1 to rotate the substrate W held by the plurality of clamp members 32. The rotating base 33 is, for example, a solid disk having an outer diameter larger than the diameter of the substrate W.

[0139] The rotating motor 36 is a servo motor including a rotor 36b and a stator 36a. The rotor 36b is connected to the rotating base 33 via a rotating shaft 35 extending downward from the rotating base 33. The stator 36a surrounds the rotor 36b. The rotor 36b and the stator 36a are arranged in a fixture housing 37. The rotating motor 36 and the fixture housing 37 are arranged below the rotating base 33. The fixture housing 37 includes: a cylindrical lower cylindrical portion 37a extending upward from the bottom 4a of the chamber 4; an annular portion 37b extending inward from the upper end of the lower cylindrical portion 37a; and an upper cylindrical portion 37c extending upward from the inner end of the annular portion 37b.

[0140] The clamp member 32 protrudes upward from the upper surface of the rotating base 33. Figure 3 As shown, the plurality of clamp members 32 are arranged at intervals around the rotation axis A1. The plurality of clamp members 32 include: a plurality of movable clamps 32a, which can move relative to the lifting member 62 described later; and a plurality of fixed clamps 32b, which are fixed to the lifting member 62. The plurality of movable clamps 32a are arranged in the circumferential direction without sandwiching the fixed clamps 32b between these clamps. The movable clamps 32a can rotate relative to the rotating base 33 and the lifting member 62 around the vertical clamp rotation axis A2 between the closed position where the holding portion 38a is pressed against the outer peripheral surface of the substrate W and the open position where the holding portion 38a is separated from the outer peripheral portion of the substrate W.

[0141] like Figure 5 As shown, the movable clamp 32a includes: a clamp head 38, which contacts the substrate W; and a base shaft 39, which extends downward from the clamp head 38. The fixed clamp 32b is also similar (see Fig. 6A ). The clamp head 38 and the base shaft 39 can be either separate components or an integrated component. The clamp head 38 includes: a support portion 38b that supports the substrate W from below; and a holding portion 38a that presses against the outer periphery of the substrate W. The holding portion 38a includes two groove inner surfaces that form a V-shaped receiving groove that opens inward. The support portion 38b includes an inclined surface that extends obliquely downward from the holding portion 38a toward the rotation axis A1. The support portion 38b and the holding portion 38a are arranged above the rotating base 33. The holding portion 38a is arranged around the substrate W. The support portion 38b is arranged below the substrate W.

[0142] The base shaft 39 is cylindrical and extends in the vertical direction. The base shaft 39 is inserted into the through-portion 33p that penetrates the rotating base 33 in the vertical direction. The annular seal 41 surrounding the clamp member 32 can prevent liquid from entering the through-portion 33p. The base shaft 39 is supported by the rotating base 33 via a sliding bearing 42 arranged in the through-portion 33p. Any base shaft 39 of the movable clamp 32a and the fixed clamp 32b can also move in the vertical direction relative to the rotating base 33. The base shaft 39 of the fixed clamp 32b is fixed to the lifting member 62. The base shaft 39 of the movable clamp 32a can rotate around the clamp rotation axis A2 relative to the lifting member 62.

[0143] The base shaft 39 of the movable clamp 32a is inserted into the through-portion 62p that penetrates the lifting member 62 in the vertical direction. The base shaft 39 of the movable clamp 32a protrudes downward from the lifting member 62. The base shaft 39 of the movable clamp 32a is supported by the lifting member 62 via a rolling bearing 44 disposed in the through-portion 62p. The movable clamp 32a can rotate relative to the lifting member 62 around the center line of the base shaft 39 corresponding to the clamp rotation axis A2. The force that moves the lifting member 62 in the vertical direction is transmitted to the movable clamp 32a via the rolling bearing 44. The movable clamp 32a moves in the vertical direction together with the lifting member 62.

[0144] In a state where each movable clamp 32a is located in the open position, the transport robot R1 places the substrate W on the hand H1 on the supporting portion 38b of each clamp member 32. In this state, when the clamp opening and closing mechanism 34 moves each movable clamp 32a to the closed position, the substrate W is supported upward by the multiple supporting portions 38b, while the multiple holding portions 38a are brought close to the outer periphery of the substrate W. As a result, the supporting portions 38b of all the clamp members 32 are separated from the substrate W, and the holding portions 38a of all the clamp members 32 are pressed against the outer periphery of the substrate W. In this state, when the clamp opening and closing mechanism 34 moves each movable clamp 32a to the open position, the holding portions 38a of all the clamp members 32 are separated from the substrate W, and the supporting portions 38b of all the clamp members 32 are in contact with the outer periphery of the substrate W.

[0145] like Figure 5 As shown, the clamp opening and closing mechanism 34 includes: an opening mechanism that moves the plurality of movable clamps 32a to the open position; and a closing mechanism that moves the plurality of movable clamps 32a to the closed position. The closing mechanism includes a plurality of coil springs 51 that are respectively wound around the plurality of movable clamps 32a. The opening mechanism includes: a plurality of driven magnets 55 that are respectively fixed to the plurality of movable clamps 32a; and a driving magnet 56 that moves the plurality of driven magnets 55 to move the plurality of movable clamps 32a to the open position.

[0146] The coil spring 51 is wound around the base shaft 39 of the movable clamp 32a. The coil spring 51 is arranged below the lifting member 62. The coil spring 51 is accommodated in a housing 52 mounted on the lifting member 62. One end of the coil spring 51 is inserted into an insertion hole of a retaining portion 53 fixed to the lifting member 62. The other end of the coil spring 51 is inserted into a retaining hole 54 opened on the outer peripheral surface of the movable clamp 32a. One end of the coil spring 51 restricts movement relative to the lifting member 62. The other end of the coil spring 51 restricts movement relative to the movable clamp 32a.

[0147] The coil spring 51 holds the movable jig 32a at the original position. Figure 5 The state in which the movable clamp 32a is located in the open position is shown. The origin position, the open position, and the closed position are positions with different rotation angles around the clamp rotation axis A2. The closed position is a position between the origin position and the open position in the rotation direction of the movable clamp 32a. When the movable clamp 32a is rotated from the origin position to the open position, the coil spring 51 is elastically deformed, generating a restoring force that returns the movable clamp 32a to the origin position. As a result, a force is generated to move the movable clamp 32a to the closed position.

[0148] The plurality of driven magnets 55 are respectively arranged in the plurality of housings 52. The driving magnet 56 is arranged in the fixture housing 37. The driving magnet 56 is separated from the driven magnet 55 by the housing 52 and the fixture housing 37. The driving magnet 56 is arranged further inside the driven magnet 55. The driving magnet 56 is arranged further outside the rotating motor 36. The driving magnet 56 may also be arranged directly below the driven magnet 55.

[0149] like Figure 4 As shown, the driving magnet 56 is arranged along a circle surrounding the rotation axis A1. In a plan view, the driving magnet 56 is radially opposite to any driven magnet 55. The driving magnet 56 is annular in a plan view. The driving magnet 56 can be a ring continuous around the entire circumference, or can include a plurality of magnets arranged on the circumference surrounding the rotation axis A1.

[0150] like Figure 2 As shown, in addition to the driving magnet 56 and the driven magnet 55, the opening mechanism of the clamp opening and closing mechanism 34 also includes: an opening and closing actuator 57, which changes the interval between the driven magnet 55 and the driving magnet 56 by moving the driving magnet 56. The strength of the magnetic force acting between the driven magnet 55 and the driving magnet 56 changes according to the interval between the driven magnet 55 and the driving magnet 56.

[0151] The opening and closing actuator 57 is disposed in the fixture housing 37. The opening and closing actuator 57 causes the driving magnet 56 to be in the upper position ( Figure 2 The position indicated by the double-dashed line in the figure) and the lower position ( Figure 2 The upper position is a position where the magnetic force (attractive force or repulsive force) acting between the driving magnet 56 and the driven magnet 55 is greater than the restoring force of the coil spring 51, and the movable clamp 32a is configured in the open position. The lower position is a position where the magnetic force (attractive force or repulsive force) acting between the driving magnet 56 and the driven magnet 55 is less than the restoring force of the coil spring 51, and the movable clamp 32a is configured in the closed position.

[0152] The opening and closing actuator 57 is a cylinder. Instead of the cylinder, the opening and closing actuator 57 may have a motor and a ball screw and a ball nut that convert the rotation of the motor into the movement of the drive magnet 56 in the up-down direction. The opening and closing actuator 57 includes: a rod extending in the axial direction of the cylinder; a piston connected to the rod; and a cylindrical cylinder tube surrounding the rod and the piston. The drive magnet 56 is connected to the rod of the cylinder. The drive magnet 56 moves in the up-down direction together with the rod of the cylinder.

[0153] like Figure 2As shown, the rotating clamp 31 includes: an interval changing mechanism 61, which changes the interval between the substrate W held by the plurality of clamp members 32 and the heat generating member 72 described later in the vertical direction by lifting the plurality of clamp members 32 relative to the rotating base 33. The interval changing mechanism 61 includes: an elevating member 62, which supports the plurality of clamp members 32; a plurality of guide members 64, which guide the elevating member 62 in the vertical direction; and an elevating drive unit 66, which generates power to move the elevating member 62 in the vertical direction.

[0154] The lifting member 62 is annular and surrounds the rotation axis A1. The lifting member 62 surrounds the fixture housing 37. The lifting member 62 is arranged below the rotating base 33. The lifting member 62 is surrounded by a cylindrical skirt 63 fixed on the rotating base 33. The lifting member 62 is arranged above the annular portion 37b of the fixture housing. A plurality of fixture members 32 protrude upward from the upper surface of the lifting member 62. When the lifting member 62 moves in the up-down direction, all the fixture members 32 move in the up-down direction together with the lifting member 62.

[0155] like Figure 4 As shown, a plurality of guide members 64 are arranged at intervals in the circumferential direction. The guide member 64 includes: a guide shaft 64a extending in the up-down direction; and a guide stopper 64b, which is larger than the guide shaft 64a in a plan view. The guide shaft 64a is inserted into a through hole 65 that penetrates the lifting member 62 in the up-down direction. The guide stopper 64b is arranged below the lifting member 62. The guide stopper 64b is larger than the through hole 65 of the lifting member 62 in a plan view.

[0156] like Figure 2 As shown, the guide shaft 64a extends downward from the rotating base 33. The guide shaft 64a is fixed to the rotating base 33. The guide stopper 64b is fixed to the guide shaft 64a. The lifting member 62 is arranged between the rotating base 33 and the guide stopper 64b. The lifting member 62 can move in the vertical direction relative to the rotating base 33 between a lower position and an upper position, the lower position is a position where the lower surface of the lifting member 62 contacts the guide stopper 64b, and the upper position is a position where the lifting member 62 leaves the guide stopper 64b at the top.

[0157] The lifting drive unit 66 is, for example, a magnetic force generating unit that uses magnetic force to lift the lifting member 62. The magnetic force generating unit includes: a driven magnet 67 fixed to the lifting member 62; a driving magnet 68 that lifts the lifting member 62 by lifting the driven magnet 67; and a lifting actuator 69 that changes the strength of the magnetic force acting between the driven magnet 67 and the driving magnet 68 by moving the driving magnet 68 in the up-down direction.

[0158] The driven magnet 67 is fixed to the lifting member 62. The driven magnet 67 moves in the up-down direction together with the lifting member 62. The driven magnet 67 is arranged outside the clamp housing 37. The driving magnet 68 and the lifting actuator 69 are arranged in the clamp housing 37. The driving magnet 68 is separated from the driven magnet 67 by the clamp housing 37.

[0159] The driving magnet 68 is arranged outside the rotating motor 36. The driving magnet 68 is arranged below the driven magnet 67. The driving magnet 68 faces the driven magnet 67 in the vertical direction via the fixture housing 37. The driving magnet 68 overlaps at least a portion of the driven magnet 67 in a plan view. The driving magnet 68 may not overlap the driven magnet 67 in a plan view.

[0160] like Figure 4 As shown, the driven magnet 67 and the driving magnet 68 are both arranged along a circle surrounding the rotation axis A1. The driven magnet 67 is arc-shaped when viewed from above. The driving magnet 68 is ring-shaped when viewed from above. The driving magnet 68 can be a ring that is continuous around the entire circumference, or it can include a plurality of magnets arranged on the circumference surrounding the rotation axis A1. The driving magnet 68 of the interval changing mechanism 61 and the driving magnet 56 of the clamp opening and closing mechanism 34 are arranged at separate positions with different distances from the rotation axis A1.

[0161] like Figure 2 As shown, the lifting actuator 69 is a cylinder. The lifting actuator 69 may also have a motor and a ball screw and a ball nut that convert the rotation of the motor into the movement of the drive magnet 68 in the up-down direction, instead of the cylinder. The lifting actuator 69 includes: a rod extending in the axial direction of the cylinder; a piston connected to the rod; and a cylindrical cylinder tube surrounding the rod and the piston. The drive magnet 68 is connected to the rod of the cylinder. The drive magnet 68 moves in the up-down direction together with the rod of the cylinder.

[0162] The lifting actuator 69 causes the driving magnet 68 to be in the upper position ( Figure 2 The position indicated by the double-dashed line in the figure) and the lower position ( Figure 2 The guide members 64 move in the up-down direction between the positions shown by the solid lines in the figure. When the driving magnet 68 rises to the upper position, the driven magnet 67 is supported upward by the magnetic force (reaction force) acting between the driven magnet 67 and the driving magnet 68. Thus, the lifting member 62 rises. When the driving magnet 68 reaches the upper position, the lifting member 62 is arranged in the upper position. When the driving magnet 68 descends from the upper position to the lower position, the guide stoppers 64b of each guide member 64 contact the lifting member 62, and the lifting member 62 is arranged in the lower position.

[0163] All the clamp members 32 move between the upper position and the lower position as the lifting member 62 is lifted or lowered. The heat generating member 72 described later is arranged below the substrate W supported by the supporting portion 38b of the plurality of clamp members 32. The upper position of the clamp member 32 is a retreat position where the substrate W and the heat generating member 72 are separated from each other. The lower position of the clamp member 32 is a close position where the substrate W and the heat generating member 72 are close to each other.

[0164] When the plurality of clamp members 32 are located at the lower position corresponding to the close position, the distance D1 (see Figure 7 ) is smaller than the thickness T1 of the hand H1 of the transport robot R1 that supports the substrate W from below the substrate W. The distance D1 is, for example, 0.1 to 10 mm. Therefore, the transport robot R1 cannot place the substrate W on the plurality of clamp members 32, nor can it take the substrate W out of the plurality of clamp members 32.

[0165] Figure 6A to Figure 6B This is a schematic diagram for explaining the transfer of the substrate W between the rotary clamp 31 and the transport robot R1 .

[0166] like Fig. 6A As shown in FIG. 1 , when the transport robot R1 places the substrate W on the plurality of clamp members 32, the lifting actuator 69 places the plurality of clamp members 32 in the upper position, and the opening and closing actuator 57 places the movable clamp 32a in the open position. Figure 6B As shown, in this state, the substrate W supported by the hand H1 is placed on the supporting portion 38b of the plurality of clamps 32. Then, the transport robot R1 moves the hand H1 downward by a movement amount that does not allow the hand H1 to contact the heating element 72. As a result, the hand H1 is separated from the substrate W. Next, the transport robot R1 withdraws the hand H1 from between the substrate W and the heating element 72.

[0167] After the hand H1 of the transport robot R1 retreats from below the substrate W, the opening and closing actuator 57 moves the movable clamp 32a to the origin position. At this time, the movable clamp 32a does not reach the origin position, but stops at the front position of the origin position, that is, the closed position. As a result, the gripping portion 38a of the movable clamp 32a is pressed against the outer periphery of the substrate W by the restoring force of the coil spring 51. Then, the gripping portion 38a of the fixed clamp 32b is also pressed against the outer periphery of the substrate W. As a result, the substrate W is gripped by the plurality of clamp members 32.

[0168] When the transport robot R1 takes out the substrate W from the plurality of clamp members 32, the lifting actuator 69 moves the plurality of clamp members 32 to the upper position. Then, the opening and closing actuator 57 moves the movable clamp 32a to the open position. Figure 6BAs shown in FIG. 1 , the gripping portions 38a of all the clamp members 32 are separated from the outer periphery of the substrate W, while the supporting portions 38b of all the clamp members 32 are in contact with the outer periphery of the substrate W. In this state, the transport robot R1 inserts the hand H1 between the substrate W and the heat generating member 72 and moves the hand H1 upward. Fig. 6A As shown, during this process, the substrate W is separated from the supporting portions 38 b of all the gripper members 32 and is supported by the hand H1 of the transfer robot R1 .

[0169] Next, the IH heating mechanism 71 for heating the substrate W from below will be described.

[0170] Figure 7 It is a schematic diagram showing a vertical cross section for explaining the IH heating mechanism 71 provided in the rotating jig 31 . Figure 8 It is a schematic plan view for explaining the arrangement of the heating coil 73 .

[0171] like Figure 7 As shown, the rotating clamp 31 includes: an IH heating mechanism 71, which heats the substrate W held by the plurality of clamp members 32. The IH heating mechanism 71 includes: a heating member 72, which heats the substrate W; a heating coil 73, which supplies power; and an IH circuit 74, which generates an alternating magnetic field applied to the heating member 72 by supplying power to the heating coil 73, so that the heating member 72 generates heat. The IH heating mechanism 71 also includes: a magnetic shielding member 77, which protects members other than the heating member 72 from the alternating magnetic field; and a supporting member 78, which supports the heating coil 73.

[0172] The heating component 72 is a conductor that generates Joule heat due to the generation of eddy currents caused by the alternating magnetic field. The heating component 72 is also called a heating table. At least the surface of the heating component 72 is formed of a material that is resistant to chemicals. Similarly, at least the surface of the rotating base 33 is formed of a material that is resistant to chemicals. That is, all parts that come into contact with the drug solution are formed of a material that is resistant to chemicals. This is also true for components other than the heating component 72 and the rotating base 33, such as the fixture component 32.

[0173] The heating component 72 may be a plurality of integrated components or a single integrated component. For example, the heating component 72 may include a core material made of carbon and a coating layer made of silicon carbide (SiC) covering the surface of the core material, or may be formed of glassy carbon. The heating component 72 may also be formed of materials other than those mentioned above, such as metal. In addition, in order to prevent the alternating magnetic field from affecting the elements formed on the surface of the substrate W, at least a portion of the heating component 72 may be formed of a soft magnetic material such as iron that shields the magnetic field.

[0174] The heat generating component 72 includes a plate-like portion 72a disposed between the substrate W and the rotating base 33. The plate-like portion 72a is, for example, in the shape of a ring surrounding the rotation axis A1. The thickness (length in the vertical direction) of the plate-like portion 72a is smaller than the thickness T3 of the rotating base 33. The upper surface and the lower surface of the plate-like portion 72a are parallel to the upper surface and the lower surface of the substrate W. The lower surface of the plate-like portion 72a is parallel to the upper surface of the rotating base 33 across a space and faces each other. The distance from the upper surface of the rotating base 33 to the lower surface of the plate-like portion 72a can be equal to the distance D1 from the upper surface of the plate-like portion 72a to the lower surface of the substrate W, or can be longer or shorter than the distance D1.

[0175] When the plurality of clamp members 32 hold the substrate W and are located in the lower position, the upper surface of the plate-shaped portion 72a is close to the lower surface of the substrate W. At this time, the distance D1 in the vertical direction from the upper surface of the plate-shaped portion 72a to the lower surface of the substrate W is shorter than the thickness T1 of the hand H1 of the transport robot R1. On the other hand, when the plurality of clamp members 32 hold the substrate W and are located in the upper position, the distance D1 in the vertical direction from the upper surface of the plate-shaped portion 72a to the lower surface of the substrate W is longer than the thickness T1 of the hand H1 of the transport robot R1. Therefore, as long as the plurality of clamp members 32 are located in the upper position, the transport robot R1 can place the substrate W on the plurality of clamp members 32 or remove the substrate W from the plurality of clamp members 32.

[0176] The heat generating component 72 includes a plurality of legs 72b extending downward from the plate-like portion 72a. The legs 72b may also be a part of the rotating base 33. That is, the rotating base 33 may also include: a circular plate portion having an outer diameter larger than the diameter of the substrate W; and a plurality of legs 72b extending upward from the horizontal upper surface of the circular plate portion. The legs 72b extend from the lower surface of the plate-like portion 72a to the upper surface of the rotating base 33. The plate-like portion 72a is supported by the plurality of legs 72b. The heat generating component 72 is fixed to the rotating base 33. The heat generating component 72 rotates around the rotation axis A1 together with the rotating base 33.

[0177] like Figure 3 As shown, a plurality of clamp members 32 are respectively inserted into a plurality of through portions 72p of the heat generating member 72. The through portions 72p penetrate the outer periphery of the heat generating member 72 in the up and down directions. The through portion 72p may be a notch opened on the outer periphery of the plate-like portion 72a, or a through hole closed all around. The outer periphery of the plate-like portion 72a is located further outside the inner end of the clamp member 32. The outer diameter of the plate-like portion 72a, that is, the outer diameter of the heat generating member 72 is smaller than the outer diameter of the rotating base 33, and larger than the outer diameter of the substrate W. The outer diameter of the heat generating member 72 may be equal to the outer diameter of the substrate W, or may be smaller than the outer diameter of the substrate W.

[0178] like Figure 7As shown, the heating coil 73 is arranged between the supporting member 78 and the rotating base 33. The heating coil 73 is separated from the lower surface of the rotating base 33 at the bottom. The heating coil 73 is arranged in a manner overlapping with the heat generating component 72 when viewed from above. The heating coil 73 is separated from the heat generating component 72 and is not physically connected to the heat generating component 72. The heating coil 73 surrounds the rotating shaft 35 at intervals in the radial direction. A plurality of clamp members 32 are arranged around the heating coil 73. The heating coil 73 is separated from the clamp member 32 in the radial direction. The outer end of the heating coil 73 is arranged outside the outer peripheral surface of the rotating motor 36.

[0179] like Figure 8 As shown, the heating coil 73 is arranged in an annular region surrounding the rotation axis A1. Figure 8 An example is shown in which two heating coils 73 are independent of each other and are respectively arranged in two annular regions. The two heating coils 73 include: an inner coil 73I, which is arranged in an inner annular region RI surrounding the rotation axis A1; and an outer coil 73O, which is arranged in an outer annular region RO concentrically including the inner annular region RI. The two heating coils 73 are connected to two IH circuits 74, respectively. The frequency of the alternating current flowing through the two heating coils 73 is changed by the two IH circuits 74.

[0180] The heating component 72 is arranged in the alternating magnetic field generated near the heating coil 73. The frequency of the alternating current flowing through the heating coil 73 is changed by the IH circuit 74. The temperature of the heating component 72 is changed by the frequency of the alternating current flowing through the heating coil 73. The IH circuit 74 is controlled by the control device 3. Since two heating coils 73 are provided independently of each other, the control device 3 can make the heating component 72 heat in a manner that the temperature of the heating component 72 is uniform, or can make the heating component 72 heat in a manner that a radial temperature gradient is generated on the heating component 72.

[0181] The temperature of the heat generating member 72 is detected by a thermometer 75 . Figure 8 An example is shown in which two thermometers 75 are provided at two positions at different distances from the rotation axis A1 to detect the temperature of the heat generating component 72. The number of the thermometers 75 may be one or more than three. The detection value of the thermometer 75 is input to the control device 3. The control device 3 controls the IH circuit 74 based on the detection value of the thermometer 75, thereby making the temperature of the heat generating component 72 close to the target temperature. As a result, the heat generating component 72 can be maintained at the target temperature with high accuracy.

[0182] like Figure 7As shown, the thermometer 75 is arranged below the heating coil 73. The thermometer 75 faces the rotating base 33 across the gap of the heating coil 73. The thermometer 75 is a radiation thermometer that detects the temperature of an object by detecting the intensity of infrared rays or visible light radiated from the object. The thermometer 75 is a non-contact thermometer that detects the temperature of the heating component 72 without contacting the heating component 72. The thermometer 75 detects the temperature of the heating component 72 through a plurality of detection windows of the rotating base 33 blocked by a plurality of transparent members 76. The detection windows penetrate the rotating base 33 in the up and down directions. The transparent member 76 is formed of a transparent material that allows light containing infrared rays to pass through.

[0183] The thermometer 75 is supported by the support member 78. Even if the heat generating member 72 rotates together with the rotating base 33, the thermometer 75 does not rotate. On the other hand, when the rotating base 33 rotates, the plurality of detection windows provided on the rotating base 33 also rotate. Figure 8 As shown, the plurality of detection windows of the rotating base 33 are arranged in the circumferential direction on the circumference surrounding the rotation axis A1. Therefore, during almost the entire period of rotation of the rotating base 33, any one of the plurality of detection windows faces the thermometer 75. Therefore, even when the rotating base 33 rotates, the thermometer 75 can detect the temperature of the heat generating member 72.

[0184] like Figure 7 As shown, the magnetic shielding member 77 includes: a cylindrical outer wall portion 77a, which surrounds the heating coil 73; and a lower wall portion 77b, which is located below the heating coil 73. The magnetic shielding member 77 is formed of a soft magnetic material such as iron. The lower wall portion 77b is located between the heating coil 73 and the supporting member 78 in the up and down directions. The lower wall portion 77b is annular and surrounds the rotation axis A1. The outer wall portion 77a extends upward from the outer periphery of the lower wall portion 77b. The outer wall portion 77a is located between the heating coil 73 and the clamp member 32 in the radial direction. The components located near the heating coil 73, such as the clamp member 32, shield the alternating magnetic field by the magnetic shielding member 77.

[0185] The supporting member 78 is fixed to the bottom 4 a of the chamber 4 . Figure 7 The example in which the support member 78 is supported by the stator 36a of the rotary motor 36 is shown. The support member 78 is arranged above the rotary motor 36. The support member 78 is annular and surrounds the rotation axis A1. The outer diameter of the support member 78 is larger than the outer diameter of the rotary motor 36. The outer peripheral portion of the support member 78 is located above the upper cylindrical portion 37c of the clamp housing 37. The rotary shaft 35 is inserted into the through hole that penetrates the central portion of the support member 78 in the up-down direction. The support member 78 surrounds the rotary shaft 35 at intervals in the radial direction.

[0186] When the control device 3 starts to supply power to the heating coil 73, an alternating magnetic field is generated near the heating coil 73, and the heating element 72 generates heat. As a result, the temperature of the heating element 72 rises rapidly and is maintained at or near the target temperature of the heating element 72. As a result, the temperature of the substrate W rises rapidly and is maintained at or near the target temperature of the substrate W. The rotation of the rotating motor 36 is transmitted to the heating element 72 via the rotating shaft 35 and the rotating base 33. Therefore, when the control device 3 causes the heating element 72 to generate heat, the heating element 72 rotates together with the substrate W while heating the substrate W when the rotating motor 36 rotates.

[0187] As described above, the thickness T1 of the plate-like portion 72a of the heat generating component 72 is smaller than the thickness T3 of the rotating base 33. In this way, since the heat generating component 72 is thinner, the volume of the heat generating component 72 can be reduced, and the heat capacity of the heat generating component 72 can be reduced. As a result, the heat generating component 72 can reach the target temperature immediately. In addition, when at least a portion of the heat generating component 72 is formed of a material having a high thermal conductivity such as carbon, the time for the heat generating component 72 to reach the target temperature can be further shortened. In addition, the unevenness of the temperature of the heat generating component 72 can also be reduced.

[0188] Next, an example of processing of the substrate W performed by the substrate processing apparatus 1 will be described.

[0189] Fig. 9 This is a flowchart for explaining an example of processing of the substrate W executed by the substrate processing apparatus 1 . Figures 10A to 10F It is shown that in the execution Fig. 9 Schematic diagrams of the states of the substrate W during each process included in an example of processing of the substrate W are shown. The following processes are executed by the control device 3 controlling the substrate processing apparatus 1. In other words, the control device 3 is programmed to execute the following processes.

[0190] When the substrate W is processed by the substrate processing apparatus 1, a loading step ( Fig. 9 Step S1).

[0191] Specifically, before the substrate W is carried into the chamber 4, all the splash shields 28 are arranged in the lower position, and all the movable nozzles including the first liquid medicine nozzle 5 are arranged in the standby position. In addition, all the clamp members 32 are arranged in the upper position, and all the movable clamps 32a are arranged in the open position. In this state, the transport robot R1 causes the hand H1 to enter the chamber 4, and places the substrate W on the hand H1 on the plurality of clamp members 32. Thus, the substrate W is carried into the chamber 4, and is supported by the supporting parts 38b of the plurality of clamp members 32.

[0192] Then, the transport robot R1 withdraws the hand H1 from the interior of the chamber 4. In addition, the opening and closing actuator 57 moves all the movable clamps 32a to the closed position. As a result, the substrate W is separated from the supporting parts 38b of the multiple clamp members 32 and is gripped by the gripping parts 38a of the multiple clamp members 32. Then, the lifting actuator 69 moves all the clamp members 32 to the lower position. Next, the rotating motor 36 starts to rotate. The rotation of the rotating motor 36 is transmitted to the substrate W via the rotating base 33 and the clamp member 32. As a result, the substrate W rotates around the rotation axis A1.

[0193] Then, if Fig. 10A As shown in FIG. 1 , a first chemical liquid supplying step ( SPM ) is simultaneously performed to supply the upper surface of the substrate W as an example of a chemical liquid. Fig. 9 and a first heating step (step S2) of heating the substrate W and the SPM on the substrate W. Fig. 9 Step S3).

[0194] In the first liquid medicine supply process, the first nozzle moving mechanism 8 moves the first liquid medicine nozzle 5 from the standby position to the processing position, and the cover lifting unit makes any one of the splash shields 28 face the outer periphery of the substrate W. Then, the first liquid medicine valve 7 is opened, and the first liquid medicine nozzle 5 starts to spray SPM. The first liquid medicine nozzle 5 sprays SPM at a temperature higher than room temperature (for example, 140°C) onto the upper surface of the rotating substrate W. In this state, the first nozzle moving mechanism 8 moves the first liquid medicine nozzle 5 to move the landing position of the SPM on the upper surface of the substrate W between the central part and the periphery. When a specified time has passed since the first liquid medicine valve 7 was opened, the first liquid medicine valve 7 is closed and the spraying of SPM is stopped. Then, the first nozzle moving mechanism 8 retreats the first liquid medicine nozzle 5 to the standby position.

[0195] After the SPM sprayed from the first liquid medicine nozzle 5 lands on the upper surface of the substrate W, it flows outward along the upper surface of the substrate W due to the centrifugal force. Therefore, the SPM is supplied to the entire upper surface of the substrate W, and a liquid film of the SPM covering the entire upper surface of the substrate W is formed on the substrate W. As a result, foreign matter such as the anti-etching film is removed from the substrate W by the SPM. In addition, since the first nozzle moving mechanism 8 moves the landing position of the SPM on the upper surface of the substrate W between the central part and the peripheral part when the substrate W is rotating, the landing position of the SPM passes through the entire upper surface of the substrate W and scans the entire upper surface of the substrate W. Therefore, the SPM is directly sprayed onto the entire upper surface of the substrate W, and the entire upper surface of the substrate W is evenly processed.

[0196] In the first heating process, the control device 3 starts to supply power to the heating coil 73. As long as the substrate W and the SPM on the substrate W are heated by the heating component 72, the start of power supply can be performed at the same time as the opening of the first chemical liquid valve 7, or before or after the opening of the first chemical liquid valve 7. When power is started to be supplied to the heating coil 73, an alternating magnetic field is generated near the heating coil 73, and the heating component 72 generates heat. Then, when a specified time has passed since the start of power supply, the power supply to the heating coil 73 is stopped. The stop of power supply can be performed at the same time as the closing of the first chemical liquid valve 7, or before or after the closing of the first chemical liquid valve 7.

[0197] When power starts to be supplied to the heating coil 73, the heating component 72 immediately reaches a predetermined high temperature. The heating component 72 is maintained at a high temperature higher than the boiling point of the first chemical solution (SPM), for example. Although the upper surface of the heating component 72 is separated from the lower surface of the substrate W at the bottom, the upper surface of the heating component 72 is brought close to the lower surface of the substrate W to such an extent that the hand H1 of the transport robot R1 cannot enter between the substrate W and the heating component 72. In addition, the entire or almost the entire substrate W overlaps with the heating component 72 when viewed from above. Therefore, the substrate W and the SPM on the substrate W are uniformly heated, thereby improving the processing capacity of the SPM. As a result, the substrate W is efficiently processed by the SPM.

[0198] Then, if Fig. 10B As shown in FIG. 1 , a first rinsing liquid supplying step ( FIG. 10 ) is performed to supply pure water as an example of a rinsing liquid to both the upper surface and the lower surface of the substrate W. Fig. 9 Step S4).

[0199] Specifically, the first rinse liquid valve 15 is opened, and the rinse liquid nozzle 13 starts to spray pure water. Thus, pure water is sprayed from the rinse liquid nozzle 13 toward the central portion of the upper surface of the rotating substrate W. The pure water landed on the upper surface of the substrate W flows outward along the upper surface of the substrate W. The SPM on the substrate W is washed away by the pure water sprayed from the rinse liquid nozzle 13. Thus, a liquid film of pure water covering the entire upper surface of the substrate W is formed. When a specified time has passed after the first rinse liquid valve 15 is opened, the first rinse liquid valve 15 is closed, and the spraying of pure water stops.

[0200] On the other hand, the second rinsing liquid valve 18 is opened, and the lower surface nozzle 16 starts to spray pure water. As a result, pure water is sprayed from the lower surface nozzle 16 toward the central portion of the lower surface of the rotating substrate W. The second rinsing liquid valve 18 can be opened simultaneously with the first rinsing liquid valve 15, or before or after the first rinsing liquid valve 15 is opened. The pure water that has landed on the lower surface of the substrate W flows outward along the lower surface of the substrate W. The mist of the SPM attached to the lower surface of the substrate W is washed away by the pure water sprayed from the lower surface nozzle 16. When a specified time has passed since the second rinsing liquid valve 18 was opened, the second rinsing liquid valve 18 is closed, and the spraying of pure water stops.

[0201] Then, if Fig. 10C As shown in FIG. 1 , a second chemical liquid supplying step ( SC1 ) is performed to supply a chemical liquid as an example to the upper surface of the substrate W. Fig. 9 Step S5).

[0202] Specifically, the second nozzle moving mechanism 12 moves the second liquid medicine nozzle 9 from the standby position to the processing position, and the cover lifting unit makes the splash shield 28 face the outer periphery of the substrate W, which is different from the first liquid medicine supply process. Then, the second liquid medicine valve 11 is opened, and the second liquid medicine nozzle 9 starts to spray SC1. In this state, the second nozzle moving mechanism 12 moves the second liquid medicine nozzle 9 to move the landing position of SC1 on the upper surface of the substrate W between the central part and the outer periphery. When a specified time has passed after the second liquid medicine valve 11 is opened, the second liquid medicine valve 11 is closed and the spraying of SC1 is stopped. Then, the second nozzle moving mechanism 12 retreats the second liquid medicine nozzle 9 to the standby position.

[0203] After the SC1 sprayed from the second liquid medicine nozzle 9 lands on the upper surface of the substrate W, it flows outward along the upper surface of the substrate W due to the centrifugal force. Therefore, the SC1 is supplied to the entire upper surface of the substrate W, and a liquid film of the SC1 covering the entire upper surface of the substrate W is formed on the substrate W. As a result, foreign matter such as particles is removed from the substrate W by the SC1. In addition, since the second nozzle moving mechanism 12 moves the landing position of the SC1 on the upper surface of the substrate W between the central part and the peripheral part while the substrate W is rotating, the landing position of the SC1 passes through the entire upper surface of the substrate W and scans the entire upper surface of the substrate W. Therefore, the SC1 is directly sprayed onto the entire upper surface of the substrate W, and the entire upper surface of the substrate W is evenly processed.

[0204] Then, if Fig. 10B As shown in FIG. 1 , a second rinsing liquid supplying step ( FIG. 10 ) is performed to supply pure water as an example of a rinsing liquid to both the upper surface and the lower surface of the substrate W. Fig. 9 Step S6).

[0205] Specifically, the first rinse liquid valve 15 is opened, and the rinse liquid nozzle 13 starts to spray pure water. Thus, pure water is sprayed from the rinse liquid nozzle 13 toward the central portion of the upper surface of the rotating substrate W. The pure water landed on the upper surface of the substrate W flows outward along the upper surface of the substrate W. The SC1 on the substrate W is washed away by the pure water sprayed from the rinse liquid nozzle 13. Thus, a liquid film of pure water covering the entire upper surface of the substrate W is formed. When a specified time has passed since the first rinse liquid valve 15 was opened, the first rinse liquid valve 15 is closed, and the spraying of pure water stops.

[0206] On the other hand, the second rinsing liquid valve 18 is opened, and the lower surface nozzle 16 starts to spray pure water. As a result, pure water is sprayed from the lower surface nozzle 16 toward the central portion of the lower surface of the rotating substrate W. The second rinsing liquid valve 18 can be opened simultaneously with the first rinsing liquid valve 15, or before or after the first rinsing liquid valve 15 is opened. The pure water that has landed on the lower surface of the substrate W flows outward along the lower surface of the substrate W. The mist of SC1 and the like attached to the lower surface of the substrate W is washed away by the pure water sprayed from the lower surface nozzle 16. When a predetermined time has passed since the second rinsing liquid valve 18 was opened, the second rinsing liquid valve 18 is closed, and the spraying of pure water stops.

[0207] Then, if Fig. 10D As shown in FIG. 1 , a solvent supply process ( Fig. 9 Step S7) and a second heating step ( Fig. 9 Step S8).

[0208] In the solvent supply process, the fourth nozzle moving mechanism 25 moves the solvent nozzle 19 from the standby position to the processing position, and the cover lifting unit makes the splash shield 28 face the outer periphery of the substrate W, which is different from the first liquid supply process and the second liquid supply process. Then, the solvent valve 21 is opened, and the solvent nozzle 19 starts to spray IPA. As a result, IPA is sprayed from the solvent nozzle 19 to the central part of the upper surface of the rotating substrate W. The IPA landed on the upper surface of the substrate W flows outward along the upper surface of the substrate W. The liquid film of pure water on the substrate W is replaced by a liquid film of IPA covering the entire upper surface of the substrate W. When a specified time has passed after the solvent valve 21 is opened, the solvent valve 21 is closed and the spraying of the solvent stops.

[0209] In the second heating process, the control device 3 starts to supply power to the heating coil 73. As long as the substrate W and the IPA on the substrate W are heated by the heating component 72, the start of power supply can be performed at the same time as the opening of the solvent valve 21, or before or after the opening of the solvent valve 21. When power is started to be supplied to the heating coil 73, an alternating magnetic field is generated near the heating coil 73, and the heating component 72 generates heat. Thus, the substrate W starts to be heated. Then, when a predetermined time has passed since the start of power supply, the power supply to the heating coil 73 is stopped. The power supply to the heating coil 73 continues, for example, until the substrate W is dried in the drying process described later.

[0210] When power starts to be supplied to the heating coil 73, the heating component 72 immediately reaches a specified high temperature. Each part of the heating component 72 is maintained at a temperature above the boiling point of IPA. The temperature of the substrate W reaches a value above the boiling point of IPA when the entire upper surface of the substrate W is covered by the liquid film of IPA. As a result, IPA evaporates at the interface between IPA and the upper surface of the substrate W, and a gas layer is formed between the liquid film of IPA and the upper surface of the substrate W. At this time, since the liquid film of IPA floats from the upper surface of the substrate W, the frictional resistance of the liquid film of IPA acting on the substrate W is so small that it can be regarded as zero. Therefore, the liquid film of IPA is in a state of easy sliding along the upper surface of the substrate W. The liquid film of IPA is removed from the substrate W in the IPA removal process described below.

[0211] After the solvent supply process is performed, Fig. 10E As shown, an IPA removal step of removing IPA from the substrate W is performed ( Fig. 9 Step S9).

[0212] Specifically, the gas nozzle 22 is already arranged at the processing position in the solvent supply process. In this state, the gas valve 24 is opened, and the gas nozzle 22 starts to spray nitrogen. The gas nozzle 22 sprays nitrogen toward the upper surface of the substrate W covered with the liquid film of IPA. In addition, the rotary motor 36 accelerates the substrate W in the rotation direction, so that the substrate W rotates at a larger removal speed than during the IPA supply process. When the gas nozzle 22 sprays nitrogen, as long as the substrate W rotates at the removal speed, the acceleration of the substrate W can be performed simultaneously with the opening of the gas valve 24, or before or after the opening of the gas valve 24. The spraying of nitrogen continues until the substrate W is dried in the drying process described later.

[0213] In a state where a gas layer is formed between the liquid film of IPA and the upper surface of the substrate W, the gas nozzle 22 sprays nitrogen gas toward the spraying position in the upper surface of the substrate W. The IPA located at the spraying position is pushed toward its surroundings by the supply of nitrogen gas. Thus, a dry area is formed at the spraying position. In addition, since the IPA pushed away by the nitrogen gas moves from the spraying position to its surroundings, an outward flow toward the outer periphery of the substrate W is formed on the liquid film of IPA starting from the supply of nitrogen gas. In addition, since the substrate W is accelerated in the rotation direction simultaneously with the supply of nitrogen gas, the centrifugal force promotes the flow. Thus, the liquid film of IPA on the substrate W will not split into a large number of small droplets and can be removed from the substrate W in a block state. Therefore, the liquid film of IPA floating from the substrate W can be quickly removed from the substrate W in a short time.

[0214] Then, if Fig.10F As shown in FIG. 1 , a drying step is performed to dry the substrate W by spinning off the liquid attached to the substrate W by centrifugal force ( Fig. 9 Step S10).

[0215] Specifically, the rotating motor 36 accelerates the substrate W in the rotation direction, so that the substrate W rotates at a high speed (for example, several thousand rpm) that is greater than the removal speed. As a result, a large centrifugal force is applied to the liquid attached to the substrate W, and the liquid is thrown away from the substrate W to its surroundings. In addition, since the heating component 72 continues to generate heat, the evaporation of the liquid on the substrate W is promoted. Similarly, since the gas nozzle 22 continues to spray nitrogen, the evaporation of the liquid on the substrate W is promoted. As a result, the substrate W is dried in a short time. When a specified time has passed after the substrate W starts to rotate at high speed, the rotating motor 36 stops rotating. In addition, the power supply to the heating coil 73 is stopped, and the gas valve 24 is closed.

[0216] Next, a carrying-out process ( Fig. 9 Step S11).

[0217] Specifically, all the splash shields 28 are arranged in the lower position, and all the movable nozzles including the first liquid medicine nozzle 5 are arranged in the standby position. In addition, all the clamp members 32 are arranged in the upper position, and all the movable clamps 32a are arranged in the open position. When the movable clamp 32a moves to the open position, the substrate W is separated from the gripping portion 38a of the clamp member 32 and supported by the supporting portion 38b of the clamp member 32. In this state, the transport robot R1 causes the hand H1 to enter between the substrate W and the heating component 72 and to raise the hand H1. During the process of the hand H1 rising, the substrate W is separated from the supporting portions 38b of all the clamp members 32 and supported by the hand H1 of the transport robot R1. Then, the transport robot R1 supports the substrate W with the hand H1 while retreating the hand H1 from the inside of the chamber 4. Thus, the substrate W is carried out of the chamber 4.

[0218] As described above, in the present embodiment, the substrate W is gripped by a plurality of clamp members 32. The power of the rotating motor 36 is transmitted to the plurality of clamp members 32 via the rotating base 33 located below the substrate W. As a result, the substrate W rotates around the rotation axis A1. The IH circuit 74 of the IH heating mechanism 71 supplies power to the heating coil 73 when the substrate W rotates. As a result, an alternating magnetic field applied to the heating component 72 is generated, and the heating component 72 generates heat. A processing fluid for processing the substrate W is supplied to the rotating substrate W. As a result, the substrate W can be processed uniformly.

[0219] Since the heat generating component 72 is heated by induction heating, it is not necessary to connect the wiring or connector for supplying power to the heat generating component 72 to the heat generating component 72. Therefore, the rotation speed of the substrate W is not limited by such a structure. In addition, the heat generating component 72 for heating the substrate W is arranged between the substrate W and the rotating base 33, rather than being arranged inside the rotating base 33. Therefore, compared with the case where the heat generating component 72 is arranged inside the rotating base 33, the interval between the substrate W and the heat generating component 72 can be shortened, thereby improving the heating efficiency of the substrate W.

[0220] In this embodiment, the heating coil 73 is arranged near the rotating base 33. Figure 7 As shown, the interval D2 between the heating coil 73 and the rotating base 33 in the vertical direction is smaller than the thickness T2 of the heating coil 73. The heating coil 73 is arranged below the rotating base 33, and the heating component 72 is arranged above the rotating base 33. When the heating coil 73 is brought close to the rotating base 33, the distance from the heating coil 73 to the heating component 72 is shortened. As a result, since the alternating magnetic field applied to the heating component 72 becomes stronger, the power supplied to the heating coil 73 can be effectively converted into heat of the heating component 72.

[0221] In this embodiment, the thickness T3 of the rotating base 33 is reduced. That is, the thickness T3 of the rotating base 33 is smaller than the thickness T2 of the heating coil 73. If the rotating base 33 is thicker, not only the distance from the heating coil 73 to the heating component 72 will increase, but also the alternating magnetic field applied to the heating component 72 will weaken. Therefore, by reducing the thickness T3 of the rotating base 33, the temperature of the heating component 72 can be effectively increased.

[0222] In the present embodiment, no other member is installed between the substrate W and the heat generating member 72, and the heat generating member 72 directly faces the substrate W. Therefore, the heat of the heat generating member 72 is effectively transferred to the substrate W. Thus, the heating efficiency of the substrate W can be improved.

[0223] In this embodiment, the interval changing mechanism 61 moves the plurality of clamp members 32 and the heating member 72 relative to each other in the vertical direction. Thus, the interval in the vertical direction between the substrate W held by the plurality of clamp members 32 and the heating member 72 is changed. Therefore, the distance from the heating member 72 to the substrate W can be changed as needed.

[0224] In the present embodiment, in the retreat state where the plurality of clamp members 32 are located at the upper position as the retreat position, the transport robot R1 places the substrate W supported on the hand H1 on the plurality of clamp members 32. Next, the transport robot R1 lowers the hand H1 and separates it from the substrate W. Then, the transport robot R1 retreats the hand H1 from between the substrate W and the heat generating component 72. When taking the substrate W out of the plurality of clamp members 32, the hand H1 is inserted between the substrate W and the heat generating component 72 in the retreat state. Then, the transport robot R1 raises the hand H1. As a result, the substrate W is separated from the plurality of clamp members 32 and supported by the hand H1.

[0225] From the viewpoint of heating efficiency, it is preferred that the heating member 72 is disposed near the substrate W. However, if the heating member 72 is too close to the substrate W, the hand H1 cannot enter between the substrate W and the heating member 72, and thus the substrate W cannot be placed on or taken out of the plurality of clamp members 32. As described above, the transfer of the substrate W is performed in a retracted state. On the other hand, the heating of the substrate W is performed in a proximate state in which the plurality of clamp members 32 are located at a lower position as a proximate position. Therefore, the transfer of the substrate W can be performed without reducing the heating efficiency of the substrate W.

[0226] In the present embodiment, the plurality of clamp members 32 include a movable clamp 32a that can move between a closed position and an open position relative to the rotating base 33. The interval between the substrate W and the heat generating component 72 in the vertical direction is changed by moving the plurality of clamp members 32 in the vertical direction relative to the rotating base 33. Therefore, the movable clamp 32a can not only move relative to the rotating base 33 between the closed position and the open position, but also move relative to the rotating base 33 in the vertical direction. In this way, since it is not necessary to move the heat generating component 72 in the vertical direction in order to change the interval between the substrate W and the heat generating component 72 in the vertical direction, the structure for supporting the heat generating component 72 can be simplified.

[0227] In the present embodiment, the outer wall portion 77a of the magnetic shielding member 77 for absorbing magnetism surrounds the heating coil 73. In addition, the lower wall portion 77b of the magnetic shielding member 77 for absorbing magnetism is located below the heating coil 73. Therefore, the influence of the alternating magnetic field generated by the components located around the heating coil 73 can be suppressed or eliminated. Similarly, the influence of the alternating magnetic field generated by the components located below the heating coil 73 can be suppressed or eliminated.

[0228] In this embodiment, the detection value of the thermometer 75 for detecting the temperature of the heat generating member 72 is input to the control device 3. Based on the detection value, the control device 3 controls the power supplied to the heating coil 73. Thus, the temperature of the heat generating member 72 can be brought close to the target temperature with high accuracy.

[0229] In the present embodiment, the lower surface nozzle 16 ejects the processing fluid toward the lower surface of the substrate W. The lower surface nozzle 16 is disposed in a through hole 72c that penetrates the central portion of the heat generating component 72 in the vertical direction when viewed from above. Therefore, it is possible to suppress or prevent the processing fluid ejected from the lower surface nozzle 16 from interfering with the heat generating component 72. Thus, the processing fluid can be sufficiently supplied to the lower surface of the substrate W.

[0230] In this embodiment, the movable clamp 32a rotates around the vertical clamp rotation axis A2. In this case, it is easy to reduce the volume of the passage space through which the movable clamp 32a passes, compared with the case where the clamp rotation axis A2 is a horizontal straight line. In particular, when the clamp rotation axis A2 is consistent with the center line of the movable clamp 32a, the volume of the passage space can be made consistent or approximately consistent with the volume of the movable clamp 32a.

[0231] Second embodiment

[0232] The second embodiment of the present invention is described below. The main difference between the second embodiment and the first embodiment is that the clamp opening and closing mechanism 34 is provided with a push rod 284 for pushing the movable clamp 32 a to the open position instead of the driven magnet 55 and the driving magnet 56 .

[0233] Fig.11 It is a schematic diagram showing a vertical cross section including a movable jig 32a according to the second embodiment of the present invention. Fig.12 It is shown along Fig.11 A schematic diagram of a horizontal section taken along line XII-XII is shown. Figure 11-12 For the above Figure 1 to Figure 10F The same components as shown are marked with Figure 1 The same figure numbers are used and their descriptions are omitted. Fig.11 The movable clamp 32a is shown in a state where it is arranged in the closed position and the upper position.

[0234] The movable clamp 32a is supported by the lifting member 62 via a horizontally extending support shaft 281 and a support hole 282 into which the support shaft 281 is inserted. The support shaft 281 is provided on the movable clamp 32a, and the support hole 282 is provided on the lifting member 62. The support shaft 281 may be provided on the lifting member 62, and the support hole 282 may be provided on the movable clamp 32a.

[0235] The pair of support shafts 281 extend from the movable clamp 32a in opposite directions. The pair of support shafts 281 are located on the same straight line. The support shafts 281 surround the rotation axis A1 (see Figure 2 ) extends horizontally in the tangential direction of the circle. The support hole 282 is recessed from the inner surface of the through portion 62p provided in the lifting member 62. A pair of support shafts 281 are respectively inserted into the pair of support holes 282.

[0236] The movable clamp 32a can move relative to the lifting member 62 around a horizontal clamp rotation axis A2 corresponding to the center line of the support shaft 281. The upper end of the movable clamp 32a moves radially as the movable clamp 32a rotates around the clamp rotation axis A2. The through portion 62p of the lifting member 62 is a notch extending inward from the outer peripheral surface of the lifting member 62. Similarly, the through portion 33p of the rotating base 33 is a notch extending inward from the outer peripheral surface of the rotating base 33. The through portion 62p and the through portion 33p may also be a through hole that is fully closed.

[0237] The movable clamp 32a includes an inner protrusion 283 extending inward from the base shaft 39. The coil spring 51 of the clamp opening and closing mechanism 34 is arranged above the inner protrusion 283. One end of the coil spring 51 is held by a holding portion 53 fixed to the lifting member 62. The other end of the coil spring 51 is held by the inner protrusion 283. The coil spring 51 holds the movable clamp 32a at the origin position. When the movable clamp 32a rotates from the origin position to the open position (at Fig.11 When the coil spring 51 is elastically deformed, a restoring force is generated to return the movable clamp 32a to the original position. Thus, a force is generated to move the movable clamp 32a to the closed position.

[0238] The clamp opening and closing mechanism 34 includes a plurality of push rods 284 for pressing the plurality of movable clamps 32a to the open position. The push rods 284 are arranged below the inner protrusion 283. The push rods 284 are inserted into the through hole that penetrates the clamp housing 37. The gap between the outer peripheral surface of the push rod 284 and the inner peripheral surface of the through hole is sealed by an annular seal 285 that surrounds the push rod 284. The front end surface of the push rod 284 is arranged outside the clamp housing 37. The front end surface of the push rod 284 faces upward. Fig.11 The example in which the front end surface of the push rod 284 is hemispherical is shown. The front end surface of the push rod 284 may also be a flat surface.

[0239] The plurality of push rods 284 are connected to the opening and closing actuator 57. The opening and closing actuator 57 moves the plurality of push rods 284 in the up-down direction between an upper position and a lower position. Fig.11The state in which the push rod 284 is arranged in the lower position is shown. When the rotation angle of the rotating base 33 is the transfer angle, the plurality of push rods 284 overlap with the plurality of inner protrusions 283 in a top view. In this state, when the opening and closing actuator 57 moves the push rod 284 to the upper position, the front end of the push rod 284 contacts the lower surface of the inner protrusion 283, and the inner protrusion 283 is pressed upward. As a result, the movable clamp 32a rotates to the open position and is arranged in the open position. When the opening and closing actuator 57 moves the push rod 284 from the upper position to the lower position, the push rod 284 separates from the movable clamp 32a, and the movable clamp 32a rotates to the origin position by the restoring force of the coil spring 51.

[0240] In the transport robot R1 (refer to Figure 3 ) When the substrate W is placed on the plurality of clamp members 32, the lifting actuator 69 (refer to Figure 2 ) so that all the clamp members 32 are located in the upper position. The rotating base 33 is arranged at the transfer position where the rotation angle of the rotating base 33 is the transfer angle. In this state, the opening and closing actuator 57 moves the push rod 284 to the upper position. Thus, all the movable clamps 32a are arranged in the open position.

[0241] In a state where all the clamp members 32 are located at the upper position and all the movable clamps 32a are arranged at the open position, the transport robot R1 places the substrate W supported by the hand H1 on the supporting parts 38b of the plurality of clamp members 32. Then, the opening and closing actuator 57 moves the push rod 284 to the lower position. The movable clamp 32a is pressed against the outer periphery of the substrate W on the way back to the origin position by the restoring force of the coil spring 51. Thus, the movable clamp 32a is arranged at the closed position between the open position and the origin position, and the substrate W is gripped by the gripping parts 38a of the plurality of clamps.

[0242] As described above, in this embodiment, when the opening and closing actuator 57 of the clamp opening and closing mechanism 34 raises the push rod 284 as an example of a pressing portion to the upper position, the push rod 284 contacts the inner protrusion 283 as an example of a pressed portion, and presses the inner protrusion 283 upward. As a result, the movable clamp 32a is configured in the open position. Then, when the opening and closing actuator 57 lowers the push rod 284 from the upper position, the push rod 284 separates from the inner protrusion 283 at the bottom, and the movable clamp 32a returns to the closed position. As a result, the movable clamp 32a can be moved between the closed position and the open position.

[0243] Third embodiment

[0244] Next, a third embodiment of the present invention will be described. The third embodiment is different from the second embodiment mainly in that the lifting actuator 69 also serves as the opening and closing actuator 57 .

[0245] Fig.13 1 is a schematic diagram showing a vertical cross section including a movable jig 32 a according to a third embodiment of the present invention. Fig.14 It is shown along Fig.13 A schematic diagram of a horizontal section of line XIV-XIV is shown. Figure 13-14 For the above Figures 1 to 12 The same components as shown are marked with Figure 1 The same figure numbers are used and their descriptions are omitted. Fig.13 The movable clamp 32a is shown in a state where it is arranged in the closed position and the lower position.

[0246] like Fig.13 As shown, the push rod 384 of the clamp opening and closing mechanism 34 extends downward from the lower surface of the rotating base 33. The push rod 384 is fixed to the rotating base 33. The front end of the push rod 384 faces downward. The push rod 384 is located around the through portion 33p of the rotating base 33. The through portion 33p is a through hole that is fully closed. The push rod 384 is located above the outer protrusion 386 extending outward from the base shaft 39. Fig.14 As shown, even when the movable clamp 32a is located at any position around the clamp rotation axis A2, the push rod 384 overlaps with the outer protrusion 386 in a plan view. The plurality of push rods 384 face the plurality of outer protrusions 386 in the vertical direction.

[0247] In the transport robot R1 (refer to Figure 3 ) When the substrate W is placed on the plurality of clamp members 32, the lifting actuator 69 (refer to Figure 2 ) causes the lifting member 62 and the movable clamp 32a to rise to the upper position. During this process, the outer protrusion 386 of the movable clamp 32a is pressed downward by the push rod 384, and the movable clamp 32a rotates to the open position. When the movable clamp 32a reaches the upper position, the movable clamp 32a is configured in the open position. In this state, the transport robot R1 places the substrate W supported by the hand H1 on the supporting portion 38b of the plurality of clamp members 32.

[0248] After the substrate W is placed on the plurality of clamp members 32, the lifting actuator 69 lowers the lifting member 62 and the movable clamp 32a to the lower position. As a result, the outer protrusion 386 and the push rod 384 separate downward, and the movable clamp 32a rotates toward the origin position by the restoring force of the coil spring 51. The movable clamp 32a is pressed against the outer periphery of the substrate W on the way back to the origin position. As a result, the movable clamp 32a is configured in the closed position between the open position and the origin position, and the substrate W is gripped by the gripping portions 38a of the plurality of clamps.

[0249] As described above, in the present embodiment, when the lifting actuator 69 raises the plurality of clamp members 32 to the upper position, the outer protrusion 386, which is an example of a pressed portion, contacts the push rod 384, which is an example of a pressing portion, and is pressed downward. As a result, the movable clamp 32a is configured in the open position. Then, when the lifting actuator 69 lowers the plurality of clamp members 32 from the upper position, the outer protrusion 386 and the push rod 384 separate downward, and the movable clamp 32a returns to the closed position. In this way, since the lifting actuator 69 that raises and lowers the plurality of clamp members 32 relative to the rotating base 33 also serves as the opening and closing actuator 57 that moves the movable clamp 32a (see Figure 2 ), so no dedicated opening and closing actuator 57 is required.

[0250] Fourth embodiment

[0251] Next, a fourth embodiment of the present invention will be described. The fourth embodiment differs from the first embodiment mainly in that the plurality of clamp members 32 are provided and the heat reduction structure 72 is raised and lowered.

[0252] Fig.15 FIG. 4 is a schematic diagram showing a vertical cross section of a rotating jig 31 according to a fourth embodiment of the present invention. Fig.15 For the above Figure 1 to Figure 14 The same components as shown are marked with Figure 1 The same figure numbers are used and their descriptions are omitted.

[0253] The movable clamp 32a is held on the rotating base 33. The movable clamp 32a can rotate relative to the rotating base 33 around the clamp rotation axis A2, but cannot move in the vertical direction relative to the rotating base 33. The housing 52 that accommodates the coil spring 51 and the driven magnet 55 is installed on the rotating base 33. The holding portion 53 that holds one end of the coil spring 51 is fixed to the rotating base 33. The fixed clamp 32b (see FIG. 2 ) is not shown in the figure. Figure 3 ) is fixed to the rotating base 33.

[0254] The lifting member 62 is arranged below the housing 52. The upper position of the lifting member 62 is a position separated downward from the housing 52. The lifting member 62 is lifted and lowered together with a plurality of guide members 64. A guide stopper 64b extends upward from the upper surface of the lifting member 62, and a guide shaft 64a extends upward from the guide stopper 64b. The guide shaft 64a is inserted into a through hole that penetrates the rotating base 33 in the vertical direction. The guide stopper 64b is arranged below the rotating base 33. The upward movement of the lifting member 62 relative to the rotating base 33 is limited by the contact between the guide stopper 64b and the rotating base 33.

[0255] The heating member 72 is supported by the guide shaft 64a. The heating member 72 is fixed to the upper end of the guide shaft 64a. The heating member 72 is lifted and lowered together with the lifting member 62. The foot portion 72b (see FIG. 1 ) installed between the plate-shaped portion 72a of the heating member 72 and the rotating base 33 is omitted from the heating member 72. Figure 2 The lifting member 62 , the guide member 64 , and the heat generating member 72 are movable in the up-down direction relative to the rotating base 33 .

[0256] The heating member 72 is moved in the upper position ( Fig.15 The position indicated by the double-dashed line in the figure) and the lower position ( Fig.15 When the heating element 72 is in the upper position, the distance D1 from the upper surface of the heating element 72 to the lower surface of the substrate W held by the holding portion 38a of the plurality of clamping members 32 is smaller than the thickness T1 of the hand H1 of the transport robot R1 (refer to Figure 7 ). In contrast, when the heat generating member 72 is located at the lower position, the distance D1 is greater than the thickness T1 of the hand H1.

[0257] When the transport robot R1 places the substrate W on the multiple clamp members 32, the lifting actuator 69 places the heat generating component 72 in the lower position as the retreat position. In addition, the opening and closing actuator 57 places all the movable clamps 32a in the open position. In this state, the transport robot R1 places the substrate W supported by the hand H1 on the supporting parts 38b of the multiple clamp members 32. Then, the opening and closing actuator 57 moves all the movable clamps 32a to the closed position. As a result, the substrate W is gripped by the gripping parts 38a of the multiple clamp members 32. After the hand H1 of the transport robot R1 retreats from above the heat generating component 72, the lifting actuator 69 moves the heat generating component 72 to the upper position as the approach position.

[0258] As described above, in the present embodiment, the plurality of clamp members 32 include a movable clamp 32a that can move between a closed position and an open position relative to the rotating base 33. The interval between the substrate W and the heat generating component 72 in the vertical direction is changed by moving the heat generating component 72 downward relative to the rotating base 33. In this way, since it is not necessary to move the plurality of clamp members 32 in the vertical direction in order to change the interval between the substrate W and the heat generating component 72 in the vertical direction, the structure for supporting the plurality of clamp members 32 can be simplified.

[0259] Other Implementations

[0260] The present invention is not limited to the contents of the above-described embodiment, and various modifications can be made.

[0261] For example, the interval D2 between the heating coil 73 and the rotating base 33 in the vertical direction may be equal to the thickness T2 of the heating coil 73 or may be greater than the thickness T2 of the heating coil 73 .

[0262] The thickness T3 of the rotating base 33 may be equal to the thickness T2 of the heating coil 73 or greater than the thickness T2 of the heating coil 73 .

[0263] The thickness of the plate-shaped portion 72 a of the heat generating member 72 may be equal to the thickness T3 of the rotating base 33 , or may be greater than the thickness T3 of the rotating base 33 .

[0264] The heat generating member 72 may indirectly face the substrate W held by the plurality of clamp members 32. That is, another member may be disposed between the heat generating member 72 and the substrate W.

[0265] The interval changing mechanism 61 for changing the interval between the substrate W and the heat generating member 72 may be omitted. That is, the interval between the holding positions where the substrates W held by the plurality of clamp members 32 are arranged and the heat generating member 72 may be fixed.

[0266] As long as components other than the heating coil 73 such as the clamp opening and closing mechanism 34 are not affected, the magnetic shielding member 77 for shielding the alternating magnetic field may be omitted.

[0267] In order to control the temperature of the heat generating member 72 to be lower than the target temperature, the control device 3 may change the command value of the AC current flowing through the heating coil 73 without referring to the detection value of the thermometer 75. That is, the thermometer 75 may be omitted.

[0268] The lower surface nozzle 16 may be omitted as long as there is no need to supply the processing fluid to the lower surface of the substrate W. In this case, the through hole that vertically penetrates the central portion of the heat generating member 72 may be omitted. Similarly, the through hole that vertically penetrates the central portion of the spin base 33 may be omitted.

[0269] The driving magnet 56 of the clamp opening and closing mechanism 34 may also be arc-shaped in a plan view. In this case, the movable clamp 32a is opened and closed when the rotating base 33 is located at a transfer position (transfer angle), which is a position where the driving magnet 56 is radially opposite to any driven magnet 55 in a plan view.

[0270] The driving magnet 68 of the lifting drive unit 66 may also be arc-shaped in a plan view. In this case, the lifting member 62 is lifted and lowered when the rotating base 33 is located at the transfer position (transfer angle) where the driving magnet 68 is located below the driven magnet 67 .

[0271] In one example of the processing of the substrate W, the first heating step ( Fig. 9Step S3) and the second heating step ( Fig. 9 Although the case of both sides of step S8) is described, the first heating step or the second heating step may be omitted.

[0272] Instead of the coil spring 51 for moving the movable clamp 32a to the closed position, a closing magnet for moving the movable clamp 32a to the closed position by applying a magnetic field to the driven magnet 55 may be used. In this case, the closing magnet is disposed in the housing 52 .

[0273] The substrate processing apparatus 1 may be an apparatus for processing a polygonal substrate W.

[0274] Two or more of the above structures may be combined.

[0275] This application corresponds to Japanese Patent Application No. 2016-186148 filed with the Japan Patent Office on September 23, 2016, and the entire disclosure of the present application is incorporated herein by reference.

[0276] Although the embodiments of the present invention have been described in detail, the above are only specific examples used to clarify the technical content of the present invention, and the present invention should not be construed as being limited to the above specific examples. The spirit and scope of the present invention are limited only by the attached claims.

Claims

1. A substrate processing device, comprising: A plurality of clamp members for holding the substrate in a horizontal state by clamping the substrate in a horizontal state with a plurality of holding portions arranged around the substrate, thereby holding the substrate in a horizontal state; a rotary motor generating power for rotating the substrate around a vertical rotation axis penetrating a central portion of the substrate held by the plurality of clamp members; A rotating base is disposed below the substrate held by the plurality of clamp members and transmits power of the rotating motor to the plurality of clamp members; as well as a processing fluid supply unit for supplying a processing fluid for processing the substrates held by the plurality of the clamp members to at least one of the upper surface and the lower surface of the substrate; The plurality of clamp members include: a movable clamp capable of moving relative to the rotating base about a vertical or horizontal clamp rotation axis between a closed position pressed against the outer periphery of the substrate and an open position released from the pressing against the outer periphery of the substrate, When the movable clamp is rotated toward the open position, the elastic member is elastically deformed to generate a restoring force for returning the movable clamp.

2. The substrate processing apparatus according to claim 1, wherein: The substrate processing apparatus includes a heat generating member disposed between the substrate gripped by the plurality of chuck members and the spin base.

3. The substrate processing apparatus according to claim 2, wherein: The substrate processing apparatus further includes a spacing changing mechanism for changing the spacing in the vertical direction between the substrates gripped by the plurality of clamp members and the heat generating member by moving the plurality of clamp members or the heat generating member in the vertical direction.

4. The substrate processing apparatus according to claim 3, wherein: The substrate processing apparatus further comprises: a transport robot that supports the substrate with a hand disposed below the substrate and transports the substrate to the plurality of clamp members. The spacing changing mechanism enables the plurality of the clamp members or the heat generating members to move in the up-down direction between a retreat position and an approach position, wherein the retreat position is a position where the spacing in the up-down direction between the substrate held by the plurality of the clamp members and the heat generating member is greater than the thickness of the hand, and the approach position is a position where the spacing is less than the thickness of the hand.

5. The substrate processing apparatus according to claim 3, wherein: The interval changing mechanism moves the plurality of clamp members in a vertical direction relative to the rotation base.

6. The substrate processing apparatus according to claim 2, wherein: The processing fluid supply unit includes a lower surface nozzle disposed in a through hole that penetrates the heat generating member in a vertical direction in a plan view, and sprays the processing fluid toward the lower surface of the substrate held by the plurality of clamp members.

7. The substrate processing apparatus according to claim 1, wherein: The movable clamp is movable relative to the rotating base about a horizontal clamp rotation axis, The substrate processing device further comprises: a clamp opening and closing mechanism, which switches the plurality of clamp members between a closed state in which the plurality of gripping parts are pressed against the outer peripheral portion of the substrate and an open state in which the plurality of gripping parts are released from pressing against the substrate, by moving the movable clamp between the closed position and the open position. The clamp opening and closing mechanism includes: a pressing portion, which moves the movable clamp to the open position by pressing the movable clamp upward or downward, The movable jig includes a pressed portion that is pressed by the pressing portion.

8. The substrate processing apparatus according to claim 7, wherein: The clamp opening and closing mechanism further includes an opening and closing actuator that moves the pressing portion in a vertical direction between an upper position where the pressing portion contacts the pressed portion and a lower position where the pressing portion moves downwardly away from the pressed portion.

9. The substrate processing apparatus according to claim 7, wherein: The substrate processing device further comprises: A heat generating member is disposed between the substrate held by the plurality of the clamp members and the rotating base; as well as The interval changing mechanism changes the interval between the substrate held by the plurality of clamp members and the heat generating member in the vertical direction by moving the plurality of clamp members in the vertical direction relative to the rotating base. The pressing portion is connected to the rotating base in such a manner as to be located above the pressed portion. The interval changing mechanism includes a lifting actuator that moves the plurality of clamp members in a vertical direction relative to the rotating base between an upper position where the pressed portion contacts the pressing portion and a lower position where the pressed portion moves downwardly away from the pressing portion.

10. The substrate processing apparatus according to claim 2, wherein: The heat generating member directly faces the substrate held by the plurality of clamp members.

11. The substrate processing apparatus according to claim 2, wherein: The heat generating member rotates together with the rotating base about the rotating axis.

12. The substrate processing apparatus according to claim 1, wherein: The elastic member includes a coil spring.

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