Dry film width compensation method and system for PCB

Abstract

The invention relates to a dry film width compensation method and system for a PCB, and the method comprises the steps: pasting a dry film on a copper-clad plate, carrying out the exposure operation of a region needing to be exposed in the dry film, carrying out the development operation of a region which is not exposed, and obtaining a plurality of pattern units which are set in advance and have different dry film widths and dry film intervals; etching the copper surface of the copper-clad plate exposed after the developing operation area at different etching speeds, removing the dry film of the exposed area on the etched copper-clad plate, and measuring the distance between the adjacent copper wires exposed after the film removal of the exposed area in the pattern unit; the distance between the adjacent copper wires is used as the wire spacing; and constructing a compensation model according to the dry film spacing of the pattern units and the corresponding line spacing, and obtaining the dry film width compensation amount for the PCB according to the compensation model. According to the invention, the dry film width of the PCB can be effectively compensated.

Description

Technical Field

[0001] The invention relates to the technical field of printed circuit board manufacturing, and in particular to a dry film width compensation method and system for a PCB board. Background Art

[0002] In PCB manufacturing, the etching process has a direct impact on the accuracy and stability of the circuit pattern. The circuit pattern is formed by removing the unprotected copper layer through etching. Common etching methods include acid etching and alkaline etching. Acid etching mainly uses hydrochloric acid and hydrogen peroxide. The oxidizing property of copper dissolves copper; while alkaline etching is based on the complex reaction between ammonia and copper to form copper-ammonia complex.

[0003] The key factors affecting the etching effect include the concentration, temperature, uniformity, etching time of the etching solution, and the size and contact area of ​​the copper surface. Due to the side etching phenomenon, the actual copper line width after etching is often smaller than the designed value. In order to ensure the accuracy of different line widths and spacings, the traditional method usually uses test boards to verify and optimize etching compensation, which is particularly time-consuming in high-density and fine line designs. The research of Peng Jinghui et al. shows that the line width compensation amount is quadratically related to the etching factor and line spacing, and logarithmically related to the copper thickness, but its conditions are not suitable for fine lines and low copper thickness under the trend of modern thinness.

[0004] There is no in-depth research on the dry film width compensation method for thin circuits and copper clad laminates (thin surface copper). Therefore, it is necessary to find a dry film width compensation method suitable for thin circuits and thin copper clad laminates under the trend of modern thinness to reduce the production cost of PCB boards. Summary of the invention

[0005] Therefore, the technical problem to be solved by the present invention is to overcome the problem that the dry film width compensation method for thin circuits and copper-clad laminates (thin surface copper) has not been deeply studied in the prior art.

[0006] In order to solve the above technical problems, the present invention provides a dry film width compensation method for a PCB board, comprising:

[0007] Step S1: selecting a copper clad laminate, pasting a dry film on the copper clad laminate, performing an exposure operation on the area to be exposed in the dry film, and performing a developing operation on the unexposed area, to obtain a plurality of pre-set graphic units with different dry film widths and dry film spacings, wherein each graphic unit includes a plurality of identical and exposed areas, and the width of a single exposed area is set as the dry film width, and the distance between the plurality of adjacent exposed areas is set as the dry film spacing, and the dry film spacing is the width of the copper surface of the copper clad laminate exposed in the developing area of ​​the dry film;

[0008] Step S2: etching the copper surface of the copper clad laminate exposed after the development operation area is subjected to different etching speeds, removing the dry film of the exposed area on the copper clad laminate after etching, measuring the distance between adjacent copper lines exposed after the exposed area in the graphic unit is removed, and taking the distance between adjacent copper lines as the line spacing;

[0009] Step S3: constructing a compensation model according to the dry film spacing of the graphic unit and its corresponding line spacing, and obtaining a dry film width compensation amount for the PCB board according to the compensation model.

[0010] In one embodiment of the present invention, the compensation model constructed in step S3 according to the dry film pitch of the graphic unit and its corresponding line pitch satisfies a linear function relationship that as the dry film pitch increases, the line pitch also increases.

[0011] In one embodiment of the present invention, the thickness of the copper layer on the copper clad plate is 12 microns;

[0012] Get the dry film spacing of each graphic unit that is set in advance;

[0013] The copper surface of the copper clad laminate exposed after the development operation is etched at an etching speed of 4.5 m / min and 5 m / min, the dry film left on the copper clad laminate after etching is removed, and the line spacing between adjacent copper lines exposed after each graphic unit on the copper clad laminate is measured;

[0014] The thickness of the copper layer is 12 microns, and the linear function relationship between the dry film spacing and the corresponding line spacing at an etching speed of 4.5 m / min is: ,in, is the dry film spacing, is the line spacing corresponding to the dry film spacing;

[0015] Or the thickness of the copper layer is 12 microns, and the linear function relationship between the dry film spacing and the corresponding line spacing at an etching speed of 5m / min is: .

[0016] In one embodiment of the present invention, the thickness of the copper layer on the copper clad plate is 15 microns;

[0017] Get the dry film spacing of each graphic unit that is set in advance;

[0018] The copper surface of the copper clad laminate exposed after the development operation is etched at an etching speed of 3.5 m / min, 4.5 m / min, and 5 m / min, the dry film left on the copper clad laminate after etching is removed, and the line spacing between adjacent copper lines exposed after each graphic unit on the copper clad laminate is measured;

[0019] The thickness of the copper layer is 15 microns, and the linear function relationship between the dry film spacing and the corresponding line spacing at an etching speed of 3.5 m / min is: ,in, is the dry film spacing, is the line spacing corresponding to the dry film spacing;

[0020] Or the thickness of the copper layer is 15 microns, and the linear function relationship between the dry film spacing and the corresponding line spacing at an etching speed of 4.5 m / min is: ;

[0021] Or the thickness of the copper layer is 15 microns, and the linear function relationship between the dry film spacing and the corresponding line spacing at an etching speed of 5m / min is: .

[0022] In one embodiment of the present invention, the thickness of the copper layer on the copper clad plate is 18 microns;

[0023] Assume that the thickness of the copper layer on the copper clad board is 18 microns;

[0024] Get the dry film spacing of each graphic unit that is set in advance;

[0025] The copper surface of the copper clad laminate exposed after the development operation is etched at an etching speed of 3 m / min, 3.5 m / min, and 4 m / min, the dry film left on the copper clad laminate after etching is removed, and the line spacing between adjacent copper lines exposed after each graphic unit on the copper clad laminate is measured;

[0026] The thickness of the copper layer is 18 microns, and the linear function relationship between the dry film spacing and the corresponding line spacing at an etching speed of 3m / min is: ,in, is the dry film spacing, is the line spacing corresponding to the dry film spacing;

[0027] Or the thickness of the copper layer is 18 microns, and the linear function relationship between the dry film spacing and the corresponding line spacing at an etching speed of 3.5 m / min is: ;

[0028] Or the thickness of the copper layer is 18 microns, and the linear function relationship between the dry film spacing and the corresponding line spacing at an etching speed of 4m / min is: .

[0029] In one embodiment of the present invention, since the compensation models obtained at different copper layer thicknesses and different etching speeds on the copper-clad board all satisfy a linear function relationship, the slopes of all linear function relationships are fitted to obtain the final linear function relationship: , among which, among which, is the dry film spacing, is the line spacing corresponding to the dry film spacing, is a constant and is affected by copper thickness and etching speed.

[0030] In one embodiment of the present invention, for two graphic units having the same dry film pitch and different pitches, the line pitches of the two graphic units are consistent after etching, wherein the pitch is the sum of a dry film pitch and a dry film width in the graphic unit.

[0031] In order to solve the above technical problems, the present invention provides a dry film spacing compensation system for a PCB board, comprising:

[0032] The first measuring unit is used to select a copper clad laminate, attach a dry film on the copper clad laminate, perform an exposure operation on the area to be exposed in the dry film, and perform a development operation on the unexposed area, to obtain a number of pre-set graphic units with different dry film widths and dry film spacings, wherein each graphic unit includes a number of identical and exposed areas, and the width of a single exposed area is set as the dry film width, and the distance between the adjacent exposed areas is used as the dry film spacing, and the dry film spacing is the width of the copper surface of the copper clad laminate exposed in the area of ​​the dry film that has been developed;

[0033] The second measuring unit is used to etch the copper surface of the copper clad laminate exposed after the development operation area has been carried out at different etching speeds, remove the dry film of the exposed area on the copper clad laminate after etching, measure the distance between adjacent copper lines exposed after the exposure area in the graphic unit is removed, and use the distance between adjacent copper lines as the line spacing;

[0034] Construction and compensation unit: used to construct a compensation model according to the dry film spacing of the graphic unit and its corresponding line spacing, and obtain the dry film width compensation amount for the PCB board according to the compensation model.

[0035] To solve the above technical problems, the present invention provides an electronic device, including a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor implements the steps of the dry film width compensation method for a PCB board as described above when executing the computer program.

[0036] In order to solve the above technical problems, the present invention provides a computer-readable storage medium on which a computer program is stored. When the computer program is executed by a processor, the steps of the dry film width compensation method for a PCB board as described above are implemented.

[0037] The above technical solution of the present invention has the following advantages compared with the prior art:

[0038] The dry film width compensation method for PCB board of the present invention tests the line spacing corresponding to different dry film spacings and constructs a compensation model (satisfying a linear function relationship), determines the dry film spacing through the compensation model, and quickly determines the required dry film width compensation according to the dry film spacing, which is suitable for designs of different line levels;

[0039] The present invention is applicable to dry film width compensation (equivalent to line width compensation of copper wire) under new etching line bodies, exposure equipment and dry film conditions, meeting the requirements of modern fine line design and thin copper clad laminates;

[0040] The present invention can obtain compensation values ​​of different dry film widths without multiple test plate verifications, thus significantly shortening the optimization cycle and test costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0041] In order to make the contents of the present invention more clearly understood, the present invention is further described in detail below based on specific embodiments of the present invention in conjunction with the accompanying drawings.

[0042] Figure 1 is a flow chart of a method in an embodiment of the present invention;

[0043] FIG. 2 (a) is a graphic unit with different pitches and compensations in an embodiment of the present invention;

[0044] FIG2( b ) is a schematic diagram of a single graphic unit in an embodiment of the present invention;

[0045] Figure 3 1 is a schematic diagram of the relationship between the line spacing and the line spacing of different line speed drying film spacings under the 12 micron surface copper in the embodiment of the present invention;

[0046] Figure 4 1 is a schematic diagram of the relationship between the line spacing and the line spacing of different line speed drying film spacings under the 15 micron surface copper in the embodiment of the present invention;

[0047] Figure 5 1 is a schematic diagram of the relationship between the line spacing and the line spacing of different line speed drying film spacings under the 18 micron copper surface in the embodiment of the present invention;

[0048] Figure 6 1 is a schematic diagram of a curve showing the relationship between the dry film spacing and the line spacing at different line speeds on different copper surfaces in an embodiment of the present invention. DETAILED DESCRIPTION

[0049] The present invention is further described below in conjunction with the accompanying drawings and specific embodiments so that those skilled in the art can better understand the present invention and implement it, but the embodiments are not intended to limit the present invention.

[0050] Embodiment 1

[0051] Reference Figure 1As shown, the present invention relates to a dry film width compensation method for a PCB board, comprising:

[0052] Step S1: selecting a copper clad laminate, pasting a dry film on the copper clad laminate, performing an exposure operation on the area to be exposed in the dry film, and performing a development operation on the unexposed area, to obtain a plurality of pre-set graphic units with different dry film widths and dry film spacings (the dry film width and the dry film spacing are known quantities), wherein each graphic unit includes a plurality of identical and exposed areas, and the width of a single exposed area is set as the dry film width, and the distance between the plurality of adjacent exposed areas is set as the dry film spacing, and the dry film spacing is the width of the copper surface of the copper clad laminate exposed in the area of ​​the dry film that has been developed;

[0053] It should be noted that, for each graphic unit in FIG. 2 , this embodiment only shows the area that has not been exposed and has the same dry film width (i.e., the area where the three black strips are located). In practice, the number of black strips in the area can be more than 20, so that the experimental results can be more accurate.

[0054] Step S2: etching the copper surface of the copper clad laminate exposed after the development operation area is subjected to different etching speeds, removing the dry film of the exposed area on the copper clad laminate after etching, measuring the distance between adjacent copper lines exposed after the exposed area in the graphic unit is removed, and taking the distance between adjacent copper lines as the line spacing;

[0055] Step S3: construct a compensation model according to the dry film pitch of the graphic unit and its corresponding line pitch, and obtain the dry film width compensation amount for the PCB board according to the compensation model (equivalent to obtaining the dry film width by subtracting the dry film pitch calculated by the compensation model from the Pitch).

[0056] The following is a detailed introduction to this embodiment:

[0057] 1. Design of graphic unit: Please refer to FIG. 2 (a) and FIG. 2 (b). In order to study the relationship between the dry film pitch and the line pitch in this embodiment, graphic units (units) with different pitches (70, 60, 50 μm) and compensation amounts are first designed. Each graphic unit (unit) contains a compensation amount starting from 0 and increasing by 2 μm (2 μm is selected in this embodiment because of the problem of data collection. In other embodiments, it can also be 1 μm), where pitch is the sum of a dry film pitch and a dry film width in a graphic unit.

[0058] For example, in FIG2( a ), Pitch 70 corresponds to 37 / 33, where 37 represents the dry film width and 33 represents the dry film spacing.

[0059] 2. Graphic exposure and development: Perform film lamination, exposure and development operations on the copper clad laminate to obtain graphic units with different dry film widths and dry film spacing.

[0060] 3. Etching process: Etch the graphics at different etching speeds, and measure the line width and line spacing of the graphic unit through a three-dimensional measuring instrument. The purpose of measuring the line width is that the line width is the data that is really needed in actual production. At the same time, the sum of the line width and the line spacing Pitch (equivalent to the sum of a dry film spacing and a dry film width Pitch) can also quickly determine whether there is a problem with the measurement system. Although the subsequent embodiment obtains the dry film spacing compensation amount through a linear function relationship, the purpose is to obtain the desired line width in practice through the dry film spacing compensation amount to ensure that the final PCB board meets the requirements.

[0061] 4. Confirmation of linear relationship: By designing different graphic units, the dry film spacing and line spacing before and after etching are compared to establish a compensation model. The results show that under the same spacing conditions, the dry film spacing is the main factor affecting the line spacing. By quickly confirming the dry film spacing required by the design, time can be saved.

[0062] Implementation Case 1

[0063] 1. Cutting: Choose copper clad laminate with surface copper of 3 microns and size of 510*610mm;

[0064] 2. Electroplating: Electroplating the copper layer on the surface of the copper clad laminate to 25 microns;

[0065] 3. Thinning copper: Thinning the copper layer after electroplating to 12 microns;

[0066] 4. Pre-treatment of film lamination: remove foreign matter on the surface of copper clad laminate and roughen the copper surface;

[0067] 5. Film laminating: The temperature of the film laminating machine is 115℃, the speed is 2m / min, and the pressure is 3.5kg / cm 2 Next, apply XX-1215 dry film;

[0068] 6. Exposure: Use 33MJ energy to transfer the pattern to the copper clad board;

[0069] 7. Development: remove the unexposed dry film and reveal the "dry film spacing" (i.e. the width of the exposed copper surface to be etched);

[0070] 8. Etching: At an etching speed of 4.5m / min and 5m / min, the etching liquid etches away the exposed copper surface;

[0071] 9. De-filming: Use alkaline de-filming solution to remove the exposed dry film, and the distance between adjacent copper wires exposed is recorded as "line spacing" (i.e. the distance between adjacent copper wires exposed after the graphic unit is de-filmed);

[0072] 10. Data processing: draw a scatter plot and perform linear fitting.

[0073] When the thickness of the copper layer is 12 microns and the etching speed is 4.5 m / min, the linear function relationship between the dry film spacing and the line spacing is: ,in, is the dry film spacing, is the line spacing corresponding to the dry film spacing;

[0074] When the thickness of the copper layer is 12 microns and the etching speed is 5 m / min, the linear function relationship between the dry film spacing and the line spacing is: .

[0075] like Figure 3 This is the relationship curve between the dry film spacing and the line spacing under different line speeds under 12 micron copper surface. It can be seen that under different line speeds, the dry film spacing and the line spacing are in a linear function relationship, and under the same dry film spacing and different pitches, such as 50 and 70 microns, the line spacing after etching is basically the same. Take the 40 / 40 line as an example (the first 40 represents the line width, that is, the exposed copper line width; the second 40 represents the line spacing). For 12 micron copper surface, the final line spacing after etching is required to be 40 microns. According to Figure 3 For the linear equation, when the line speed is 5.0m / min, the dry film spacing is about 19 microns, that is, the LDI exposure machine data compensation is 21 microns (equivalent to the dry film width compensation of 21 microns).

[0076] Implementation Case 2

[0077] 1. Cutting: Choose copper clad laminate with surface copper of 3 microns and size of 510*610mm;

[0078] 2. Electroplating: Electroplating the 3-micron copper-clad laminate to 25 microns of surface copper;

[0079] 3. Thinning copper: reduce the copper on the copper-clad board after electroplating to 15 microns;

[0080] 4. Pre-treatment of film lamination: remove foreign matter on the surface of copper clad laminate and roughen the copper surface;

[0081] 5. Film laminating: The temperature of the film laminating machine is 115℃, the speed is 2m / min, and the pressure is 3.5kg / cm 2 Next, apply XX-1215 dry film;

[0082] 6. Exposure: Use 33MJ energy to transfer different designs of graphics onto the copper clad board;

[0083] 7. Development: Remove the unexposed dry film to expose the copper surface to be etched. The width of the copper surface is recorded as the "dry film spacing";

[0084] 8. Etching: At the etching speeds of 3.5m / min, 4.0m / min, and 4.5m / min respectively, the etching liquid etches away the exposed copper surface;

[0085] 9. Film removal: Use alkaline film removal solution to remove the exposed dry film, and the distance between adjacent copper wires is recorded as "line spacing";

[0086] 10. Data processing: draw a scatter plot and perform linear fitting.

[0087] When the thickness of the copper layer is 15 microns and the etching speed is 3.5 m / min, the linear function relationship between the dry film spacing and the line spacing is: ,in, is the dry film spacing, is the line spacing corresponding to the dry film spacing;

[0088] When the thickness of the copper layer is 15 microns and the etching speed is 4.5 m / min, the linear function relationship between the dry film spacing and the line spacing is: ;

[0089] When the thickness of the copper layer is 15 microns and the etching speed is 5 m / min, the linear function relationship between the dry film spacing and the line spacing is: .

[0090] like Figure 4 This is the relationship curve between dry film spacing and line spacing at different line speeds under 15 micron copper surface. It can be seen that under different line speeds, the dry film spacing and line spacing are in a linear function relationship, and under the same dry film spacing and different pitches, such as 50 and 70 microns, the line spacing after etching is basically the same. Taking the 40 / 40 line as an example (the first 40 represents the line width, that is, the exposed copper line width; the second 40 represents the line spacing), for 15 micron copper surface, the final line spacing after etching is required to be 40 microns. Figure 3 For the linear equation, the dry film spacing is 17 microns at a line speed of 4.0 m / min, that is, the data compensation of the LDI exposure machine is 23 microns (equivalent to a dry film width compensation of 23 microns).

[0091] Implementation Case 3

[0092] 1. Cutting: Choose copper clad laminate with surface copper of 3 microns and size of 510*610mm;

[0093] 2. Electroplating: Electroplating the 3-micron copper-clad laminate to 25 microns of surface copper;

[0094] 3. Thinning copper: reduce the copper on the copper-clad board after electroplating to 18 microns;

[0095] 4. Pre-treatment of film lamination: remove foreign matter on the surface of copper clad laminate and roughen the copper surface;

[0096] 5. Film laminating: The temperature of the film laminating machine is 115℃, the speed is 2m / min, and the pressure is 3.5kg / cm 2 Next, apply XX-1215 dry film;

[0097] 6. Exposure: Use 33MJ energy to transfer different designs of graphics onto the copper clad board;

[0098] 7. Development: Remove the unexposed dry film to expose the copper surface to be etched. The width of the copper surface is recorded as the "dry film spacing";

[0099] 8. Etching: At etching speeds of 3.0 m / min, 3.5 m / min, and 4.0 m / min, the etching solution etches away the exposed copper surface;

[0100] 9. Film removal: Use alkaline film removal solution to remove the exposed dry film, and the distance between adjacent copper wires is recorded as "line spacing";

[0101] 10. Data processing: draw a scatter plot and perform linear fitting.

[0102] When the thickness of the copper layer is 18 microns and the etching speed is 3m / min, the linear function relationship between the dry film spacing and the line spacing is: ,in, is the dry film spacing, is the line spacing corresponding to the dry film spacing;

[0103] When the thickness of the copper layer is 18 microns and the etching speed is 3.5 m / min, the linear function relationship between the dry film spacing and the line spacing is: ;

[0104] When the thickness of the copper layer is 18 microns and the etching speed is 4 m / min, the linear function relationship between the dry film spacing and the line spacing is: .

[0105] like Figure 5 This is the relationship curve between dry film spacing and line spacing at different line speeds under 18-micron copper surface. It can be seen that under different line speeds, the dry film spacing and line spacing are in a linear function relationship, and under the same dry film spacing and different pitches, such as 50 and 70 microns, the line spacing after etching is basically the same. Taking the 40 / 40 line as an example (the first 40 represents the line width, that is, the exposed copper line width; the second 40 represents the line spacing), for 18-micron copper surface, the final line spacing after etching is required to be 40 microns. Figure 3 For the linear equation, the dry film spacing can be 19 microns at a line speed of 4.0 m / min, that is, the data compensation of the LDI exposure machine is 21 microns (equivalent to a dry film width compensation of 21 microns).

[0106] like Figure 6This is the relationship curve between the spacing between different line speed drying films and line spacing under 12, 15, and 18 micron copper surfaces. Figure 3 , Figure 4 , Figure 5 It can be seen that the linear function inclination, i.e. the slope, has a high coincidence (basically the same) under the above different parameter conditions, so the fixed slope can be obtained , Affected by copper thickness, etching speed, etc.

[0107] Embodiment 2

[0108] This embodiment provides a dry film spacing compensation system for a PCB board, including:

[0109] The first measuring unit is used to select a copper clad laminate, attach a dry film on the copper clad laminate, perform an exposure operation on the area to be exposed in the dry film, and perform a development operation on the unexposed area, to obtain a number of pre-set graphic units with different dry film widths and dry film spacings, wherein each graphic unit includes a number of identical and exposed areas, and the width of a single exposed area is set as the dry film width, and the distance between the adjacent exposed areas is used as the dry film spacing, and the dry film spacing is the width of the copper surface of the copper clad laminate exposed in the area of ​​the dry film that has been developed;

[0110] The second measuring unit is used to etch the copper surface of the copper clad laminate exposed after the development operation area has been carried out at different etching speeds, remove the dry film of the exposed area on the copper clad laminate after etching, measure the distance between adjacent copper lines exposed after the exposure area in the graphic unit is removed, and use the distance between adjacent copper lines as the line spacing;

[0111] Construction and compensation unit: used to construct a compensation model according to the dry film spacing of the graphic unit and its corresponding line spacing, and obtain the dry film width compensation amount for the PCB board according to the compensation model.

[0112] Embodiment 3

[0113] This embodiment provides an electronic device, including a memory, a processor, and a computer program stored in the memory and executable on the processor. When the processor executes the computer program, the steps of the dry film width compensation method for a PCB board described in Embodiment 1 are implemented.

[0114] Embodiment 4

[0115] This embodiment provides a computer-readable storage medium on which a computer program is stored. When the computer program is executed by a processor, the steps of the dry film width compensation method for a PCB board described in the first embodiment are implemented.

[0116] Those skilled in the art will appreciate that the embodiments of the present application may be provided as methods, systems, or computer program products. Therefore, the present application may adopt the form of a complete hardware embodiment, a complete software embodiment, or an embodiment combining software and hardware. Moreover, the present application may adopt the form of a computer program product implemented on one or more computer-usable storage media (including but not limited to disk storage, CD-ROM, optical storage, etc.) containing computer-usable program codes. The schemes in the embodiments of the present application may be implemented in various computer languages, for example, object-oriented programming language Java and literal scripting language JavaScript, etc.

[0117] The present application is described with reference to the flowcharts and / or block diagrams of the methods, devices (systems), and computer program products according to the embodiments of the present application. It should be understood that each process and / or box in the flowchart and / or block diagram, as well as the combination of the processes and / or boxes in the flowchart and / or block diagram, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, a special-purpose computer, an embedded processor, or other programmable data processing device to generate a machine, so that the instructions executed by the processor of the computer or other programmable data processing device generate instructions for implementing the processes in the flowchart and / or block diagram. Figure 1 A process or multiple processes and / or boxes Figure 1 A device that provides the functions specified in a block or multiple blocks.

[0118] These computer program instructions may also be stored in a computer-readable memory capable of directing a computer or other programmable data processing device to operate in a specific manner, so that the instructions stored in the computer-readable memory produce an article of manufacture comprising an instruction device, which implements the process Figure 1 A process or multiple processes and / or boxes Figure 1 A function specified in one or more boxes.

[0119] These computer program instructions can also be loaded onto a computer or other programmable data processing device so that a series of operating steps are executed on the computer or other programmable device to produce a computer-implemented process, thereby providing instructions for implementing the process. Figure 1 A process or multiple processes and / or boxes Figure 1 The steps for the functions specified in one or more boxes.

[0120] Although the preferred embodiments of the present application have been described, those skilled in the art may make other changes and modifications to these embodiments once they have learned the basic creative concept. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments and all changes and modifications falling within the scope of the present application.

[0121] Obviously, the above embodiments are merely examples for clear explanation and are not intended to limit the implementation methods. For those skilled in the art, other different forms of changes or modifications can be made based on the above description. It is not necessary and impossible to list all the implementation methods here. The obvious changes or modifications derived from these are still within the protection scope of the invention.

Claims

1. A dry film width compensation method for a PCB board, characterized in that: include: Step S1: selecting a copper clad laminate, pasting a dry film on the copper clad laminate, performing an exposure operation on the area to be exposed in the dry film, and performing a developing operation on the unexposed area, to obtain a plurality of pre-set graphic units with different dry film widths and dry film spacings, wherein each graphic unit includes a plurality of identical and exposed areas, and the width of a single exposed area is set as the dry film width, and the distance between the plurality of adjacent exposed areas is set as the dry film spacing, and the dry film spacing is the width of the copper surface of the copper clad laminate exposed in the developing area of ​​the dry film; Step S2: etching the copper surface of the copper clad laminate exposed after the development operation area is subjected to different etching speeds, removing the dry film of the exposed area on the copper clad laminate after etching, measuring the distance between adjacent copper lines exposed after the exposed area in the graphic unit is removed, and taking the distance between adjacent copper lines as the line spacing; Step S3: constructing a compensation model according to the dry film spacing of the graphic unit and its corresponding line spacing, and obtaining a dry film width compensation amount for the PCB board according to the compensation model.

2. The dry film width compensation method for PCB board according to claim 1, characterized in that: In step S3, a compensation model is constructed according to the dry film spacing of the graphic unit and its corresponding line spacing to satisfy a linear function relationship that as the dry film spacing increases, the line spacing also increases.

3. The dry film width compensation method for PCB board according to claim 2, characterized in that: Assume that the thickness of the copper layer on the copper clad board is 12 microns; Get the dry film spacing of each graphic unit that is set in advance; The copper surface of the copper clad laminate exposed after the development operation is etched at an etching speed of 4.5 m / min and 5 m / min, the dry film left on the copper clad laminate after etching is removed, and the line spacing between adjacent copper lines exposed after each graphic unit on the copper clad laminate is measured; The thickness of the copper layer is 12 microns, and the linear function relationship between the dry film spacing and the corresponding line spacing at an etching speed of 4.5 m / min is: ,in, is the dry film spacing, is the line spacing corresponding to the dry film spacing; Or the thickness of the copper layer is 12 microns, and the linear function relationship between the dry film spacing and the corresponding line spacing at an etching speed of 5m / min is: .

4. The dry film width compensation method for PCB board according to claim 2, characterized in that: Assume that the thickness of the copper layer on the copper clad board is 15 microns; Get the dry film spacing of each graphic unit that is set in advance; The copper surface of the copper clad laminate exposed after the development operation is etched at an etching speed of 3.5 m / min, 4.5 m / min, and 5 m / min, the dry film left on the copper clad laminate after etching is removed, and the line spacing between adjacent copper lines exposed after each graphic unit on the copper clad laminate is measured; The thickness of the copper layer is 15 microns, and the linear function relationship between the dry film spacing and the corresponding line spacing at an etching speed of 3.5 m / min is: ,in, is the dry film spacing, is the line spacing corresponding to the dry film spacing; Or the thickness of the copper layer is 15 microns, and the linear function relationship between the dry film spacing and the corresponding line spacing at an etching speed of 4.5 m / min is: ; Or the thickness of the copper layer is 15 microns, and the linear function relationship between the dry film spacing and the corresponding line spacing at an etching speed of 5m / min is: .

5. The dry film width compensation method for PCB board according to claim 2, characterized in that: Assume that the thickness of the copper layer on the copper clad board is 18 microns; Get the dry film spacing of each graphic unit that is set in advance; The copper surface of the copper clad laminate exposed after the development operation is etched at an etching speed of 3 m / min, 3.5 m / min, and 4 m / min, the dry film left on the copper clad laminate after etching is removed, and the line spacing between adjacent copper lines exposed after each graphic unit on the copper clad laminate is measured; The thickness of the copper layer is 18 microns, and the linear function relationship between the dry film spacing and the corresponding line spacing at an etching speed of 3m / min is: ,in, is the dry film spacing, is the line spacing corresponding to the dry film spacing; Or the thickness of the copper layer is 18 microns, and the linear function relationship between the dry film spacing and the corresponding line spacing at an etching speed of 3.5 m / min is: ; Or the thickness of the copper layer is 18 microns, and the linear function relationship between the dry film spacing and the corresponding line spacing at an etching speed of 4m / min is: .

6. The dry film width compensation method for PCB board according to claim 1, characterized in that: Since the compensation models obtained on the copper-clad board with different copper layer thicknesses and different etching speeds all satisfy a linear function relationship, the slopes of all linear function relationships are fitted to obtain the final linear function relationship: , Among them, among them, is the dry film spacing, is the line spacing corresponding to the dry film spacing, is a constant and is affected by copper thickness and etching speed.

7. The dry film width compensation method for PCB board according to claim 1, characterized in that: For two graphic units with the same dry film pitch and different pitches, the line pitches of the two graphic units are consistent after etching, wherein the pitch is the sum of a dry film pitch and a dry film width in the graphic unit.

8. A dry film spacing compensation system for PCB boards, characterized in that: include: The first measuring unit is used to select a copper clad laminate, attach a dry film on the copper clad laminate, perform an exposure operation on the area to be exposed in the dry film, and perform a development operation on the unexposed area, to obtain a number of pre-set graphic units with different dry film widths and dry film spacings, wherein each graphic unit includes a number of identical and exposed areas, and the width of a single exposed area is set as the dry film width, and the distance between the adjacent exposed areas is used as the dry film spacing, and the dry film spacing is the width of the copper surface of the copper clad laminate exposed in the area of ​​the dry film that has been developed; The second measuring unit is used to etch the copper surface of the copper clad laminate exposed after the development operation area has been carried out at different etching speeds, remove the dry film of the exposed area on the copper clad laminate after etching, measure the distance between adjacent copper lines exposed after the exposure area in the graphic unit is removed, and use the distance between adjacent copper lines as the line spacing; Construction and compensation unit: used to construct a compensation model according to the dry film spacing of the graphic unit and its corresponding line spacing, and obtain the dry film width compensation amount for the PCB board according to the compensation model.

9. An electronic device comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein: When the processor executes the computer program, the steps of the dry film width compensation method for a PCB board as claimed in any one of claims 1 to 7 are implemented.

10. A computer-readable storage medium having a computer program stored thereon, characterized in that: When the computer program is executed by a processor, the steps of the dry film width compensation method for a PCB board as claimed in any one of claims 1 to 7 are implemented.

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