Surface etching device for printed circuit board production and use method thereof

Abstract

The invention discloses a surface etching device for printed circuit board production and a use method thereof, and belongs to the technical field of circuit board production. A surface etching device for printed circuit board production comprises a processing box, two ends of the processing box are respectively provided with a feed port and a discharge port, the surface etching device further comprises a conveying part, the conveying part is used for conveying a circuit board body in the processing box, and two ends of the conveying part are arranged on the outer side of the processing box; the positioning assemblies are uniformly arranged on the conveying part and are used for limiting and positioning the circuit board body; the displacement assemblies are arranged on the conveying part and are in one-to-one correspondence with the positioning assemblies; according to the invention, each part of the circuit board can be subjected to an etching reaction, the reacted etching liquid is thrown away or washed away by the subsequent non-reacted etching liquid, the reacted solution is prevented from remaining on the circuit board, the etching speed of the circuit board is accelerated, and the processing quality and processing efficiency of the circuit board are further improved.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit board production, and in particular to a surface etching device for producing a printed circuit board and a use method thereof. Background Art

[0002] Printed circuit boards, also known as printed circuit boards, are providers of electrical connections for electronic components. They have a history of more than 100 years; their design is mainly layout design; the main advantage of using circuit boards is that they greatly reduce wiring and assembly errors, improve the level of automation and production labor rate, and printed circuit boards need to be etched before use.

[0003] There are two existing methods for etching circuit boards. One is to directly immerse the circuit board in an etching solution for etching, but this easily results in a waste of etching solution. At the same time, when the etched circuit board is taken out of the etching solution, waste generated when the previous circuit board is etched will adhere to it. The other is to spray the etching solution on the circuit board through a nozzle for etching reaction. However, since the nozzle is generally fixed, waste generated when the circuit board is etched is not easily washed away by the sprayed etching solution, which increases the subsequent cleaning workload and reduces the etching efficiency. At the same time, since a part of the surface of the circuit board is covered when it is transported for etching, the surface of the circuit board cannot be completely in contact with the etching solution, resulting in incomplete etching and poor etching effect of the circuit board. Summary of the invention

[0004] The purpose of the present invention is to solve the problems existing in the prior art and to propose a surface etching device for printed circuit board production and a method of using the same.

[0005] In order to achieve the above object, the present invention adopts the following technical solutions:

[0006] A surface etching device for producing a printed circuit board comprises a processing box, wherein both ends of the processing box are respectively provided with a feed inlet and a discharge outlet, and further comprises:

[0007] A conveying part, the conveying part is used to convey the circuit board body in the processing box, and both ends of the conveying part are placed outside the processing box;

[0008] A positioning assembly, wherein the positioning assembly is provided in multiple groups and is evenly arranged on the conveying portion, and is used to limit the positioning of the circuit board body;

[0009] A displacement assembly, which is arranged on the conveying portion and corresponds to the positioning assembly one by one, and is used to drive the circuit board body to move on the positioning assembly;

[0010] An etching liquid spray assembly, the etching liquid spray assembly is arranged on the processing box and is used for etching the circuit board body transported by the transport part in the processing box;

[0011] Wherein, an angle adjustment component for adjusting the spray angle of the etching spray component is arranged in the processing box.

[0012] Preferably, the conveying part includes support plates fixedly mounted on both ends of the processing box, a plurality of rotating shafts rotatably connected to the support plates, sprockets arranged on the rotating shafts, chains arranged between the plurality of sprockets, and a plurality of steel plate belts arranged on the chains. The support plates are also fixedly provided with a conveying motor for driving one of the rotating shafts to rotate. The steel plate belt is provided with a through hole for the etching liquid to fall. The processing box is provided with a material receiving trough for receiving the etching liquid between the upper and lower groups of steel plate belts of the conveying part, and the material receiving trough is connected to the inner wall of the processing box through a support rod.

[0013] Preferably, the positioning assembly includes a rotating rod rotatably connected to the steel plate strip, a placement seat fixed on the top of the rotating rod, and a placement groove opened on the placement seat, and the circuit board body is placed in the placement groove.

[0014] Preferably, the displacement assembly includes two supports fixed at the bottom of the steel plate strip, a reciprocating screw rotatably connected to the supports, a sleeve threadedly connected to the reciprocating screw, and a push rod fixed to the sleeve, the reciprocating screw is provided with a secondary bevel gear, and the rotating rod is provided with a main bevel gear meshing with the secondary bevel gear.

[0015] Preferably, a driven gear is provided at the bottom of the rotating rod, and a rack plate meshing with the driven gear is connected to the inner wall of the processing box through a supporting rod.

[0016] Preferably, the etching spray assembly includes a liquid storage tank fixed on the processing box, a water pump arranged on the liquid storage tank, a connecting hose connected to the water pump, a connecting pipe connected to the connecting hose, and a plurality of nozzles equidistantly arranged along the axial direction of the connecting pipe, wherein the nozzle is connected to the connecting pipe through a hose, and the connecting pipe is placed in the processing box.

[0017] Preferably, the angle adjustment assembly includes a plurality of mounting seats fixed to the inner wall of the processing box, each of the mounting seats is rotatably connected with a sleeve, a torsion spring for driving the sleeve to reset and rotate is provided in the mounting seat, a plurality of the nozzles are arranged in the sleeve, a ball groove matching the nozzle is provided on the sleeve, and a pin shaft connected to the nozzle for rotation is provided in the ball groove.

[0018] Preferably, a rotating rod is rotatably connected inside the processing box, a first synchronous wheel is provided on the rotating rod and the rotating shaft, a first synchronous belt is provided between the two first synchronous wheels, an incomplete bevel gear is provided on the rotating rod, a driven bevel gear meshing with the incomplete bevel gear is provided at the bottom of the sleeve, a second synchronous wheel is provided on each of the two adjacent sleeves, and a second synchronous belt is provided between the two second synchronous wheels.

[0019] Preferably, a slide rod is slidably connected to the bottom of the sleeve, and the top of the slide rod is fixedly connected to the bottom of the connecting pipe through a connecting plate. An abutment block is fixedly provided on the inner wall of the processing box, and a slope is provided on the top of the abutment block for movably abutting against the bottom of the slide rod.

[0020] The present invention also discloses a method for using a surface etching device for producing a printed circuit board, comprising the following steps:

[0021] S1: placing the circuit board body to be etched at the feed port of the processing box so that the circuit board body is placed in the placement groove of the placement seat;

[0022] S2: When the conveying motor is working, it drives the rotating shaft to rotate, and the sprocket on the rotating shaft cooperates with the chain, so that the steel plate belt on the chain drives the placement seat to transmit, and then the circuit board body to be etched is conveyed to the processing box;

[0023] S3: When the steel plate belt conveying the circuit board body moves to the working area of ​​the etching spray assembly, the driven gear at the bottom of the rotating rod on the steel plate belt meshes with the rack plate for transmission, and the rotating rod drives the placement seat to rotate, so that the placement seat drives the circuit board body being conveyed to rotate, so that both sides of the circuit board body can contact with the etching liquid;

[0024] When the rotating rod rotates, the main bevel gear meshes with the auxiliary bevel gears on the reciprocating screws on both sides for transmission. The auxiliary bevel gear drives the reciprocating screw to rotate, and the sleeve moves along the axial direction of the reciprocating screw. The sleeve pushes the circuit board body to slide in the placement groove through the push rod, so that the placement seat will not always cover a certain part of the circuit board body, so that all parts of the surface of the circuit board body can work with the etching liquid;

[0025] S4: When the water pump is running, the etching liquid in the liquid storage tank is introduced into each nozzle connected to the connecting pipe through the connecting hose, and the nozzle sprays the liquid to etch the circuit board body which is continuously moving;

[0026] S5: When the rotating shaft of the conveying part rotates, the rotating rod is driven to rotate through the first synchronous wheel and the first synchronous belt. When the rotating rod rotates, the incomplete bevel gear and the driven bevel gear on the lower side of the sleeve are intermittently meshed and transmitted. When the incomplete bevel gear and the driven bevel gear of the sleeve are meshed, the sleeve drives the nozzle to swing. When the incomplete bevel gear is no longer meshed with the driven bevel gear, the sleeve is reset and rotated under the action of the torsion spring, so that the nozzle swings left and right, thereby increasing the etching spraying working range of the nozzle.

[0027] When the sleeve rotates, the slide bar is driven to rotate synchronously. When the slide bar rotates, the bottom of the slide bar abuts against the inclined surface of the abutment block, so that the slide bar can reciprocate up and down when it rotates. When the slide bar reciprocates up and down, the connecting pipe is driven to reciprocate up and down through the connecting plate, so that the nozzle swings up and down with the ball groove pin as the center, further increasing the etching spraying working range of the nozzle;

[0028] S6: During the etching spray process, the etching liquid that has reacted on the surface of the circuit board body is thrown away or washed away by the subsequent etching liquid that has not reacted. The etching liquid that has reacted passes through the through holes of the steel plate belt and falls into the receiving trough. After the conveying part moves the circuit board body after the etching reaction out of the working range of the etching spray assembly, the circuit board body that continues to move on the steel plate belt throws off the etching liquid adhered to the surface. Then the staff removes the circuit board body in the trough at the outlet of the processing box for the next processing step.

[0029] Compared with the prior art, the present invention provides a surface etching device for printed circuit board production and a method of using the same, which has the following beneficial effects:

[0030] 1. The surface etching device for printed circuit board production and the use method thereof limit and position the circuit board body through the positioning component. After the conveying part conveys the circuit board body to the processing box, the displacement component and the etching spray component work automatically. The displacement component drives the circuit board body to rotate continuously during the etching liquid spraying and reciprocate left and right along the length direction of the positioning component, so that every part of the circuit board body can contact with the etching liquid and undergo etching reaction. The etching liquid that has reacted is thrown away or washed away by the subsequent etching liquid that has not reacted, so as to avoid the reacted solution from remaining on the circuit board, accelerate the etching speed of the circuit board, and thus improve the processing quality and processing efficiency of the circuit board.

[0031] 2. The surface etching device for printed circuit board production and its use method are characterized in that the driven gear at the bottom of the rotating rod on the steel plate belt is meshed with the rack plate for transmission, the rotating rod drives the placement seat to rotate, and the placement seat drives the circuit board body being conveyed to rotate, so that both sides of the circuit board body can contact with the etching liquid, and double-sided etching processing of the circuit board body is realized when a nozzle is set on one side.

[0032] 3. The surface etching device for printed circuit board production and the use method thereof are as follows: when the rotating rod rotates, the main bevel gear meshes with the auxiliary bevel gears on the reciprocating screws on both sides for transmission, the auxiliary bevel gears drive the reciprocating screws to rotate, and the sleeve moves along the axial direction of the reciprocating screw. The sleeve pushes the circuit board body to slide in the placement groove through the push rod, so that the placement seat will not always block or cover a certain part of the circuit board body, so that all parts of the surface of the circuit board body can work with the etching liquid, thereby ensuring the processing quality of etching the circuit board body.

[0033] 4. The surface etching device for printed circuit board production and its use method adjust the spraying working range of the nozzle by setting an angle adjustment component, so that the nozzle can spray liquid to etch the circuit board body from all angles, avoiding spraying dead angles and ensuring the etching processing effect of the circuit board body. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] Figure 1The structure of the present invention is schematically shown Figure 1 ;

[0035] Figure 2 The structure of the present invention is schematically shown Figure 2 ;

[0036] Figure 3 It is a partial structural schematic diagram of the conveying part of the present invention;

[0037] Figure 4 It is a schematic diagram of the structure of the chain and the steel strip of the present invention;

[0038] Figure 5 It is a schematic cross-sectional structure diagram of the processing box of the present invention;

[0039] Figure 6 For the present invention Figure 5 A partial enlarged structural diagram of the middle part;

[0040] Figure 7 For the present invention Figure 5 A schematic diagram of the partially enlarged structure of the middle B part;

[0041] Figure 8 It is a structural schematic diagram of the positioning assembly of the present invention;

[0042] Fig. 9 It is a schematic diagram of the external structure of the sleeve of the present invention;

[0043] Fig.10 For the present invention Fig. 9 A schematic diagram of the partially enlarged structure of the middle C part;

[0044] Fig.11 For the present invention Fig. 9 Schematic diagram of the partial enlarged structure of part D in the middle.

[0045] In the figure: 1, processing box; 101, mounting seat; 2, conveying part; 3, circuit board body; 4, support plate; 401, rotating shaft; 402, sprocket; 403, chain; 404, steel plate belt; 405, conveying motor; 5, rotating rod; 501, placement seat; 502, placement slot; 503, main bevel gear; 6, support; 601, reciprocating screw rod; 6011, auxiliary bevel gear; 602, sleeve; 603, Push rod; 7, driven gear; 701, rack plate; 8, liquid storage tank; 801, water pump; 802, connecting hose; 803, connecting pipe; 804, nozzle; 9, sleeve; 901, ball groove; 902, pin shaft; 10, rotating rod; 1001, incomplete bevel gear; 1002, driven bevel gear; 11, first synchronous wheel; 12, sliding rod; 13, abutment block; 14, second synchronous wheel; 15, receiving trough. DETAILED DESCRIPTION

[0046] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0047] In the description of the present invention, it is necessary to understand that the terms "upper", "lower", "front", "back", "left", "right", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0048] Example 1: Reference Figure 1 , Figure 2 , Figure 3 , Figure 5 and Figure 8 A surface etching device for producing printed circuit boards comprises a processing box 1, wherein both ends of the processing box 1 are respectively provided with a feed inlet and a discharge outlet, and further comprises:

[0049] The conveying part 2 is used to convey the circuit board body 3 in the processing box 1, and both ends of the conveying part 2 are placed outside the processing box 1;

[0050] Positioning components, multiple groups of positioning components are provided and are evenly arranged on the conveying part 2, and are used to limit the positioning of the circuit board body 3;

[0051] A displacement component, which is arranged on the conveying part 2 and corresponds to the positioning component one by one, and is used to drive the circuit board body 3 to move on the positioning component;

[0052] An etching liquid spray assembly, which is arranged on the processing box 1 and is used for etching the circuit board body 3 transported by the transport part 2 in the processing box 1;

[0053] Among them, an angle adjustment component for adjusting the spray angle of the etching spray component is arranged in the processing box 1.

[0054] Specifically, the circuit board body 3 to be etched is placed at the feed port of the processing box 1, so that the positioning component on the conveying part 2 positions and restricts the circuit board body 3, and the conveying part 2 conveys the circuit board body 3 from the feed port to the inside of the processing box 1, and the displacement component and the etching spray component work automatically. The displacement component drives the circuit board body 3 to rotate continuously during the etching liquid spraying and reciprocate left and right along the length direction of the positioning component, so that every part of the circuit board body 3 can contact the etching liquid and undergo an etching reaction. The etching liquid that has reacted is thrown away or washed away by the subsequent etching liquid that has not reacted, so as to avoid the reacted solution from remaining on the circuit board body 3, accelerate the etching speed of the circuit board body 3, and thus improve the circuit board processing quality and processing efficiency.

[0055] Example 2: Reference Figure 1 , Figure 2 , Figure 3 , Figure 4 and Figure 5 , a surface etching device for printed circuit board production, based on Example 1, further, the conveying part 2 includes support plates 4 fixedly mounted on both ends of the processing box 1, a plurality of rotating shafts 401 rotatably connected to the support plates 4, sprockets 402 arranged on the rotating shafts 401, chains 403 arranged between the plurality of sprockets 402, and a plurality of steel plate belts 404 arranged on the chains 403, a conveying motor 405 for driving one of the rotating shafts 401 to rotate is also fixedly mounted on the support plates 4, a through hole for the etching liquid to fall is opened on the steel plate belt 404, and the processing box 1 is provided with a receiving trough 15 for receiving the etching liquid between the upper and lower groups of steel plate belts 404 of the conveying part 2, and the receiving trough 15 is connected to the inner wall of the processing box 1 through a support rod.

[0056] Specifically, when the conveying motor 405 is working, it drives the rotating shaft 401 to rotate, and the sprocket 402 on the rotating shaft 401 cooperates with the chain 403, so that the steel plate belt 404 on the chain 403 drives the placement seat 501 to transmit, and then the circuit board body 3 to be etched is conveyed to the processing box 1. When the steel plate belt 404 conveying the circuit board body 3 moves to the working area of ​​the etching spray assembly, the etching spray assembly works and sprays the etching liquid on the circuit board body 3. During the etching spray process, the etching liquid that has reacted on the surface of the circuit board body 3 is thrown away or washed away by the subsequent etching liquid that has not reacted, and the etching liquid that has reacted passes through the through hole of the steel plate belt 404 and falls into the receiving trough 15.

[0057] Example 3: Reference Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 7 and Figure 8A surface etching device for printed circuit board production, based on Example 2, further, the positioning component includes a rotating rod 5 rotatably connected to the steel plate belt 404, a placement seat 501 fixed on the top of the rotating rod 5, and a placement groove 502 opened on the placement seat 501, and the circuit board body 3 is placed in the placement groove 502.

[0058] Furthermore, the displacement assembly includes two supports 6 fixedly mounted at the bottom of the steel plate belt 404, a reciprocating screw 601 rotatably connected to the supports 6, a sleeve 602 threadedly connected to the reciprocating screw 601, and a push rod 603 fixedly connected to the sleeve 602, a secondary bevel gear 6011 is arranged on the reciprocating screw 601, and a main bevel gear 503 meshing with the secondary bevel gear 6011 is arranged on the rotating rod 5.

[0059] Furthermore, a driven gear 7 is provided at the bottom of the rotating rod 5 , and a rack plate 701 meshingly connected with the driven gear 7 is connected to the inner wall of the processing box 1 through a supporting rod.

[0060] Specifically, when the steel plate belt 404 conveying the circuit board body 3 moves to the working area of ​​the etching spray assembly, the driven gear 7 at the bottom of the rotating rod 5 on the steel plate belt 404 meshes with the rack plate 701 for transmission, and the rotating rod 5 drives the placement seat 501 to rotate, so that the placement seat 501 drives the circuit board body 3 being conveyed to rotate, so that both sides of the circuit board body 3 can contact the etching liquid; when the rotating rod 5 rotates, the main bevel gear 503 simultaneously meshes with the secondary bevel gears 6011 on the reciprocating screw rods 601 on both sides for transmission, and the secondary bevel gear 6011 drives the reciprocating screw rods 601 to rotate, and the sleeve 602 moves axially along the reciprocating screw rod 601, and the sleeve 602 pushes the circuit board body 3 to slide in the placement groove 502 through the push rod 603. , so that the placement seat 501 will not always block and cover a certain part of the circuit board body 3, so that all parts of the surface of the circuit board body 3 can work with the etching liquid, and during the etching spray process, the etching liquid that has reacted on the surface of the circuit board body 3 is thrown away or washed away by the subsequent etching liquid that has not reacted, thereby accelerating the etching speed of the circuit board, thereby improving the processing quality and processing efficiency of the circuit board; after the conveying part 2 moves the circuit board body 3 after the etching reaction out of the working range of the etching spray assembly, the circuit board body 3 that continues to move on the steel plate belt 404 throws off the etching liquid adhered to the surface, and then the staff removes the circuit board body 3 in the placement slot 502 at the discharge port of the processing box 1 for the next processing step.

[0061] Example 4: Reference Figure 1 , Figure 2 , Figure 5 and Fig. 9A surface etching device for printed circuit board production, based on Example 3, further, the etching spray assembly includes a liquid storage tank 8 fixedly mounted on the processing box 1, a water pump 801 arranged on the liquid storage tank 8, a connecting hose 802 connected to the water pump 801, a connecting pipe 803 connected to the connecting hose 802, and a plurality of nozzles 804 equidistantly arranged along the axial direction of the connecting pipe 803, the nozzle 804 is connected to the connecting pipe 803 through a hose, and the connecting pipe 803 is placed in the processing box 1.

[0062] Specifically, when the etching spray assembly is working, it controls the water pump 801 to run, and the water pump 801 introduces the etching liquid in the liquid storage tank 8 to each nozzle 804 connected to the connecting pipe 803 through the connecting hose 802, and the nozzle 804 sprays the etching liquid to the circuit board body 3 which is continuously moving.

[0063] Example 5: Reference Figure 2 , Figure 5 , Figure 6 , Fig. 9 , Fig.10 and Fig.11 , a surface etching device for printed circuit board production, based on Example 4, further, the angle adjustment component includes a plurality of mounting seats 101 fixedly mounted on the inner wall of the processing box 1, each mounting seat 101 is rotatably connected with a sleeve 9, a torsion spring for driving the sleeve 9 to reset and rotate is arranged in the mounting seat 101, a plurality of nozzles 804 are arranged in the sleeve 9, a ball groove 901 matching with the nozzle 804 is opened on the sleeve 9, and a pin shaft 902 rotatably connected with the nozzle 804 is arranged in the ball groove 901.

[0064] Furthermore, a rotating rod 10 is rotatably connected in the processing box 1, and a first synchronous wheel 11 is provided on the rotating rod 10 and the rotating shaft 401, a first synchronous belt is provided between the two first synchronous wheels 11, an incomplete bevel gear 1001 is provided on the rotating rod 10, a driven bevel gear 1002 meshingly connected to the incomplete bevel gear 1001 is provided at the bottom of the sleeve 9, a second synchronous wheel 14 is provided on each of the two adjacent sleeves 9, and a second synchronous belt is provided between the two second synchronous wheels 14.

[0065] Furthermore, a slide rod 12 is slidably connected to the bottom of the sleeve 9, and the top of the slide rod 12 is fixedly connected to the bottom of the connecting pipe 803 through a connecting plate. An abutment block 13 is fixedly provided on the inner wall of the processing box 1, and a slope is provided on the top of the abutment block 13 to movably abut against the bottom of the slide rod 12.

[0066] Specifically, the rotating shaft 401 of the conveying part 2 drives the rotating rod 10 to rotate through the first synchronous wheel 11 and the first synchronous belt when rotating. When the rotating rod 10 rotates, the incomplete bevel gear 1001 and the driven bevel gear 1002 on the lower side of the sleeve 9 are intermittently meshed and transmitted. When the incomplete bevel gear 1001 and the driven bevel gear 1002 of the sleeve 9 are meshed, the sleeve 9 drives the nozzle 804 to swing. When the incomplete bevel gear 1001 is no longer meshed with the driven bevel gear 1002, the sleeve 9 is reset and rotated under the action of the torsion spring, so that the nozzle 804 swings left and right, increasing the etching spraying work of the nozzle 804. When the sleeve 9 rotates, it drives the slide bar 12 to rotate synchronously. When the slide bar 12 rotates, the bottom of the slide bar 12 abuts against the inclined surface of the abutment block 13, so that the slide bar 12 can move back and forth up and down when it rotates. When the slide bar 12 moves back and forth up and down, it drives the connecting pipe 803 to move back and forth up and down through the connecting plate, so that the nozzle 804 swings up and down with the pin shaft 902 of the ball groove 901 as the center, further increasing the etching spraying working range of the nozzle 804, so that the nozzle 804 can spray and etch the circuit board body 3 from all angles, avoiding the occurrence of spraying dead angles, and ensuring the etching processing effect of the circuit board body 3.

[0067] The present invention also discloses a method for using a surface etching device for producing a printed circuit board, comprising the following steps:

[0068] S1: placing the circuit board body 3 to be etched at the feed port of the processing box 1, so that the circuit board body 3 is placed in the placement groove 502 of the placement seat 501;

[0069] S2: When the conveying motor 405 is working, it drives the rotating shaft 401 to rotate, and the sprocket 402 on the rotating shaft 401 cooperates with the chain 403, so that the steel plate belt 404 on the chain 403 drives the placement seat 501 to transmit, and then the circuit board body 3 to be etched is conveyed to the processing box 1;

[0070] S3: When the steel plate belt 404 conveying the circuit board body 3 moves to the working area of ​​the etching spray assembly, the driven gear 7 at the bottom of the rotating rod 5 on the steel plate belt 404 is meshed with the rack plate 701 for transmission, and the rotating rod 5 drives the placement seat 501 to rotate, so that the placement seat 501 drives the circuit board body 3 being conveyed to rotate, so that both sides of the circuit board body 3 can contact with the etching liquid;

[0071] When the rotating rod 5 rotates, the main bevel gear 503 is meshed with the auxiliary bevel gears 6011 on the reciprocating screws 601 on both sides for transmission. The auxiliary bevel gears 6011 drive the reciprocating screws 601 to rotate, and the sleeve 602 moves axially along the reciprocating screw 601. The sleeve 602 pushes the circuit board body 3 to slide in the placement groove 502 through the push rod 603, so that the placement seat 501 will not always cover a certain part of the circuit board body 3, so that all parts of the surface of the circuit board body 3 can work with the etching liquid;

[0072] S4: When the water pump 801 is running, the etching liquid in the liquid storage tank 8 is introduced to each nozzle 804 connected to the connecting pipe 803 through the connecting hose 802, and the nozzle 804 sprays the liquid to etch the circuit board body 3 which is continuously moving;

[0073] S5: When the rotating shaft 401 of the conveying part 2 rotates, the rotating rod 10 is driven to rotate through the first synchronous wheel 11 and the first synchronous belt. When the rotating rod 10 rotates, the incomplete bevel gear 1001 and the driven bevel gear 1002 on the lower side of the sleeve 9 are intermittently meshed and transmitted. When the incomplete bevel gear 1001 and the driven bevel gear 1002 of the sleeve 9 are meshed, the sleeve 9 drives the nozzle 804 to swing. When the incomplete bevel gear 1001 is no longer meshed with the driven bevel gear 1002, the sleeve 9 is reset and rotated under the action of the torsion spring, so that the nozzle 804 swings left and right, thereby increasing the etching spraying working range of the nozzle 804.

[0074] When the sleeve 9 rotates, the slide bar 12 is driven to rotate synchronously. When the slide bar 12 rotates, the bottom of the slide bar 12 abuts against the inclined surface of the abutment block 13, so that the slide bar 12 can reciprocate up and down when it rotates. When the slide bar 12 reciprocates up and down, the connecting pipe 803 is driven to reciprocate up and down through the connecting plate, so that the nozzle 804 swings up and down with the pin 902 of the ball groove 901 as the center, further increasing the etching spraying working range of the nozzle 804;

[0075] S6: During the etching spray process, the etching liquid that has reacted on the surface of the circuit board body 3 is thrown away or washed away by the subsequent etching liquid that has not reacted, and the etching liquid that has reacted passes through the through holes of the steel plate belt 404 and falls into the receiving trough 15. After the conveying part 2 moves the circuit board body 3 after the etching reaction out of the working range of the etching spray assembly, the circuit board body 3 that continues to move on the steel plate belt 404 throws off the etching liquid adhered to the surface, and then the staff removes the circuit board body 3 in the placement groove 502 at the discharge port of the processing box 1 for the next processing step.

[0076] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical scheme and inventive concept of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A surface etching device for producing printed circuit boards, comprising a processing box (1), wherein both ends of the processing box (1) are respectively provided with a feed inlet and a discharge outlet, wherein: Also includes: A conveying portion (2), the conveying portion (2) being used to convey the circuit board body (3) in the processing box (1), and both ends of the conveying portion (2) being placed outside the processing box (1); Positioning components, the positioning components are provided in multiple groups and are evenly arranged on the conveying part (2), and are used to limit the positioning of the circuit board body (3); A displacement component, the displacement component being arranged on the conveying portion (2) and corresponding one-to-one with the positioning component, and being used to drive the circuit board body (3) to move on the positioning component; An etching liquid spraying assembly, the etching liquid spraying assembly being arranged on a processing box (1) and being used for etching a circuit board body (3) transported by a transporting part (2) in the processing box (1); Wherein, an angle adjustment component for adjusting the liquid spraying angle of the etching liquid spraying component is arranged in the processing box (1).

2. A surface etching device for printed circuit board production according to claim 1, characterized in that: The conveying part (2) comprises support plates (4) fixedly arranged at both ends of the processing box (1), a plurality of rotating shafts (401) rotatably connected to the support plates (4), sprockets (402) arranged on the rotating shafts (401), chains (403) arranged between the plurality of sprockets (402), and a plurality of steel plate belts (404) arranged on the chains (403); a conveying motor (405) for driving one of the rotating shafts (401) to rotate is also fixedly arranged on the support plates (4); a through hole for the etching liquid to fall is opened on the steel plate belt (404); and a material receiving trough (15) for receiving the etching liquid is arranged between the upper and lower groups of steel plate belts (404) of the conveying part (2) of the processing box (1); and the material receiving trough (15) is connected to the inner wall of the processing box (1) through a support rod.

3. A surface etching device for printed circuit board production according to claim 2, characterized in that: The positioning assembly comprises a rotating rod (5) rotatably connected to a steel plate belt (404), a placement seat (501) fixedly arranged on the top of the rotating rod (5), and a placement groove (502) provided on the placement seat (501), wherein the circuit board body (3) is placed in the placement groove (502).

4. A surface etching device for printed circuit board production according to claim 3, characterized in that: The displacement assembly comprises two supports (6) fixedly mounted at the bottom of the steel plate belt (404), a reciprocating screw (601) rotatably connected to the supports (6), a sleeve (602) threadedly connected to the reciprocating screw (601), and a push rod (603) fixedly connected to the sleeve (602); the reciprocating screw (601) is provided with a secondary bevel gear (6011), and the rotating rod (5) is provided with a main bevel gear (503) meshing with the secondary bevel gear (6011).

5. A surface etching device for printed circuit board production according to claim 4, characterized in that: A driven gear (7) is provided at the bottom of the rotating rod (5), and a rack plate (701) meshingly connected with the driven gear (7) is connected to the inner wall of the processing box (1) via a supporting rod.

6. A surface etching device for printed circuit board production according to claim 5, characterized in that: The etching liquid spray assembly comprises a liquid storage tank (8) fixedly mounted on a processing box (1), a water pump (801) arranged on the liquid storage tank (8), a connecting hose (802) connected to the water pump (801), a connecting pipe (803) connected to the connecting hose (802), and a plurality of nozzles (804) equidistantly arranged along the axial direction of the connecting pipe (803), wherein the nozzles (804) are connected to the connecting pipe (803) via a hose, and the connecting pipe (803) is placed in the processing box (1).

7. A surface etching device for printed circuit board production according to claim 6, characterized in that: The angle adjustment assembly comprises a plurality of mounting seats (101) fixedly mounted on the inner wall of the processing box (1), each of the mounting seats (101) being rotatably connected to a sleeve (9), a torsion spring for driving the sleeve (9) to return and rotate is arranged in the mounting seat (101), a plurality of the nozzles (804) are arranged in the sleeve (9), a ball groove (901) matching with the nozzle (804) is provided on the sleeve (9), and a pin shaft (902) rotatably connected to the nozzle (804) is arranged in the ball groove (901).

8. A surface etching device for printed circuit board production according to claim 7, characterized in that: A rotating rod (10) is rotatably connected inside the processing box (1), a first synchronous wheel (11) is provided on the rotating rod (10) and the rotating shaft (401), a first synchronous belt is provided between the two first synchronous wheels (11), an incomplete bevel gear (1001) is provided on the rotating rod (10), a driven bevel gear (1002) meshingly connected to the incomplete bevel gear (1001) is provided at the bottom of the sleeve (9), a second synchronous wheel (14) is provided on two adjacent sleeves (9), and a second synchronous belt is provided between the two second synchronous wheels (14).

9. A surface etching device for printed circuit board production according to claim 8, characterized in that: The bottom of the sleeve (9) is slidably connected to a slide rod (12), and the top of the slide rod (12) is fixedly connected to the bottom of the connecting pipe (803) through a connecting plate. An abutment block (13) is fixedly provided on the inner wall of the processing box (1), and the top of the abutment block (13) is provided with an inclined surface that movably abuts against the bottom of the slide rod (12).

10. A method for using the surface etching device for printed circuit board production according to claim 9, characterized in that: The following steps are involved: S1: placing the circuit board body (3) to be etched at the feed port of the processing box (1), so that the circuit board body (3) is placed in the placement groove (502) of the placement seat (501); S2: When the conveying motor (405) is working, it drives the rotating shaft (401) to rotate, and the sprocket (402) on the rotating shaft (401) cooperates with the chain (403), so that the steel plate belt (404) on the chain (403) drives the placement seat (501) to transmit, thereby conveying the circuit board body (3) to be etched into the processing box (1); S3: When the steel plate belt (404) conveying the circuit board body (3) moves to the working area of ​​the etching spray assembly, the driven gear (7) at the bottom of the rotating rod (5) on the steel plate belt (404) meshes with the rack plate (701) for transmission, and the rotating rod (5) drives the placement seat (501) to rotate, so that the placement seat (501) drives the circuit board body (3) being conveyed to rotate, so that both sides of the circuit board body (3) can contact with the etching liquid; When the rotating rod (5) rotates, the main bevel gear (503) is meshed with the auxiliary bevel gears (6011) on the reciprocating screws (601) on both sides for transmission, the auxiliary bevel gears (6011) drive the reciprocating screws (601) to rotate, the sleeve (602) moves along the axial direction of the reciprocating screw (601), and the sleeve (602) pushes the circuit board body (3) to slide in the placement groove (502) through the push rod (603), so that the placement seat (501) will not always cover a certain part of the circuit board body (3), so that all parts of the surface of the circuit board body (3) can work with the etching liquid; S4: When the water pump (801) is in operation, the etching liquid in the liquid storage tank (8) is introduced to each nozzle (804) connected to the connecting pipe (803) through the connecting hose (802), and the nozzle (804) sprays the liquid to etch the circuit board body (3) which is continuously moving; S5: When the rotating shaft (401) of the conveying part (2) rotates, the rotating rod (10) is driven to rotate through the first synchronous wheel (11) and the first synchronous belt. When the rotating rod (10) rotates, the incomplete bevel gear (1001) and the driven bevel gear (1002) on the lower side of the sleeve (9) are intermittently meshed and transmitted. When the incomplete bevel gear (1001) and the driven bevel gear (1002) of the sleeve (9) are meshed, the sleeve (9) drives the nozzle (804) to swing. When the incomplete bevel gear (1001) is no longer meshed with the driven bevel gear (1002), the sleeve (9) is reset and rotated under the action of the torsion spring, so that the nozzle (804) swings left and right, thereby increasing the etching spraying working range of the nozzle (804); When the sleeve (9) rotates, the slide bar (12) is driven to rotate synchronously. When the slide bar (12) rotates, the bottom of the slide bar (12) abuts against the inclined surface of the abutment block (13), so that the slide bar (12) can move up and down reciprocatingly when rotating. When the slide bar (12) moves up and down reciprocatingly, the connecting pipe (803) is driven to move up and down reciprocatingly through the connecting plate, so that the nozzle (804) swings up and down with the pin shaft (902) of the ball groove (901) as the center, further increasing the etching spraying working range of the nozzle (804); S6: During the etching spraying process, the etching liquid that has reacted on the surface of the circuit board body (3) is thrown away or washed away by the subsequent etching liquid that has not reacted, and the etching liquid that has reacted passes through the through hole of the steel plate belt (404) and falls into the receiving trough (15). After the conveying part (2) moves the circuit board body (3) that has completed the etching reaction out of the working range of the etching spraying component, the circuit board body (3) that continues to move on the steel plate belt (404) throws off the etching liquid adhered to the surface, and then the staff removes the circuit board body (3) in the placement trough (502) at the discharge port of the processing box (1) to carry out the next processing step.

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