Power module radiator

Abstract

The invention relates to the technical field of power modules, in particular to a power module radiator which comprises a radiator substrate and fins. The fins are located on one side of the exterior of the radiator substrate. An embedded heat pipe is arranged in the radiator substrate, and the interior of the embedded heat pipe is filled with condensate. A first capillary channel extending from the heat source end of the radiator substrate to the cold end is arranged on the inner wall of the side, away from the fins, in the embedded heat pipe, and the first capillary channel is used for enabling condensate, close to the cold end, in the embedded heat pipe to flow to the hot end faster; the fins have preset bending angles, and the surfaces of the fins are wavy; the side, away from the fins, of the outer portion of the radiator substrate is connected with a power module. The heat dissipation efficiency of the power module radiator can be remarkably improved, the service life of the power module is prolonged, and the heat dissipation requirement in a high-power-density environment is met.

Description

Technical Field

[0001] The present invention relates to the technical field of power modules, and in particular to a power module radiator. Background Art

[0002] In the prior art, there is a common problem in the design of heat sinks for power modules: the size of the heat sink is usually much larger than the actual size of the power module, especially when the power module is located in the center of the heat sink, the edges around the heat sink often cannot effectively participate in the heat dissipation. Since the power module will generate a lot of heat when operating at high power, the heat sink needs to undertake the task of quickly conducting and diffusing the heat from the module area to a larger area. However, most traditional heat sinks currently transfer heat through direct contact or external air cooling, but the edge area of ​​the heat sink is far away from the power module and is usually not fully utilized, resulting in low heat conduction efficiency. Traditional heat sink designs can only work effectively within a certain area, especially when it is necessary to quickly transfer heat from the center of the power module to the surrounding areas of the heat sink, the efficiency is still low. In addition, the design of the heat sink generally does not consider how to optimize the heat transfer through a more reasonable airflow path. The fins of traditional heat sinks are straight, such as Figure 1 As shown, the heat dissipation performance is difficult to meet the requirements of high-power modules in practical applications. The design of the heat sink is too dependent on the synergy of external air cooling, and does not give full play to the structural advantages of the heat sink itself. It often requires a larger heat sink and more air cooling power to solve the heat dissipation problem. Overall, the existing heat sink still has major defects in improving heat dissipation efficiency and is difficult to meet the needs of modern power modules for efficient heat dissipation. Summary of the invention

[0003] The present invention proposes a power module heat sink to solve the problem that the traditional heat sink has low heat dissipation efficiency and cannot fully utilize the entire surface area of ​​the heat sink for heat diffusion; the contact area between the heat sink surface and the airflow is small, resulting in unsatisfactory heat dissipation effect and cannot meet the power module's demand for efficient heat dissipation.

[0004] According to one aspect of the present invention, there is provided a power module heat sink, comprising: a heat sink substrate and fins; The fin is located on one side of the outside of the heat sink substrate; An embedded heat pipe is arranged inside the radiator substrate, and the embedded heat pipe is filled with condensate; A first capillary channel extending from the heat source end of the radiator substrate to the cold end is provided on the inner wall of the embedded heat pipe away from the fin, and the first capillary channel is used to make the condensate near the cold end inside the embedded heat pipe flow to the hot end faster; The fin has a predetermined bending angle, and the surface of the fin is wavy; The outer side of the heat sink substrate away from the fins is connected to a power module.

[0005] Preferably, a bolt hole for connecting the power module is provided on the heat sink substrate, the bolt hole passes through the embedded heat pipe, and the inside of the bolt hole and the corresponding part of the embedded heat pipe are a closed structure; A second capillary channel is provided in the same direction as both ends of the first capillary channel and inside the embedded heat pipe at a portion corresponding to the position of the bolt hole and away from the fin; The second capillary channel and the first capillary channel are perpendicular to each other; Both ends of the second capillary channel are connected to the adjacent first capillary channel.

[0006] Preferably, the width and depth of the first capillary channel and / or the second capillary channel are designed according to the maximum temperature generated when the power module is working. The higher the maximum temperature, the greater the width and depth of the first capillary channel and the second capillary channel. Wherein, the width of the first capillary channel and / or the second capillary channel ranges from 0.1 to 0.3 mm; Wherein, the distance between two adjacent first capillary channels and / or second capillary channels ranges from 0.3 to 0.5 mm.

[0007] Preferably, one side of the fin is connected to the heat sink substrate, and the fin has a predetermined bending angle so as to form a bending arc between one end and the other end thereof; The predetermined bending angle ranges from 25 to 35 degrees.

[0008] Preferably, the direction of the wave crest line on the wavy surface of the fin is consistent with the direction of the two ends of the fin.

[0009] Preferably, if the material of the heat sink substrate and / or the fins is aluminum alloy, the surface of the heat sink substrate and / or the fins is provided with an anodized layer; If the material of the heat sink substrate and / or the fins is copper, an electroplating layer is provided on the surface of the heat sink substrate and / or the fins; The surface of the radiator substrate and / or fins is also provided with a nano coating.

[0010] Preferably, an interface material with high thermal conductivity is provided between the power module and the heat sink substrate; Wherein, the interface material with high thermal conductivity is thermal grease or thermal gasket.

[0011] Preferably, the embedded heat pipe is a cavity structure arranged inside the radiator substrate.

[0012] Preferably, the heat sink substrate is connected to the power module via bolts and gaskets.

[0013] Preferably, it also includes: an air cooling device; A plurality of the fins are evenly distributed on the heat sink substrate at equal distances; After the air cooling device is started, the wind blown out is blown in from one end of the fin, and blown out from the other end after passing through the fin.

[0014] The present invention has at least the following beneficial effects: The present invention proposes a power module heat sink, which realizes the heat pipe effect by arranging an embedded heat pipe structure inside the heat sink substrate and filling it with condensate; the fins of the heat sink are designed to be a curved structure to optimize the airflow path, and a wavy surface is processed on the fins to increase the heat dissipation surface area, which can significantly improve the heat dissipation efficiency of the power module heat sink, extend the service life of the power module, and adapt to the heat dissipation needs in a high power density environment. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] The accompanying drawings herein are incorporated into and constitute a part of the specification. These drawings illustrate embodiments consistent with the present invention and, together with the specification, are used to explain the technical solutions of the present invention.

[0016] Figure 1 A schematic diagram of the structure of an existing radiator in the background technology is shown; Figure 2 A schematic structural diagram of a heat sink according to an embodiment of the present invention is shown; Figure 3 A cross-sectional view showing a capillary channel of a heat sink according to an embodiment of the present invention; Figure 4 The embodiment of the present invention is shown Figure 3 The enlarged image at point I in the middle; Figure 5 A cross-sectional view showing a heat pipe embedded in a heat sink according to an embodiment of the present invention; Figure 6 The embodiment of the present invention is shown Figure 5 The enlarged image at point I in the middle; Figure 7 A schematic diagram showing heat transfer of a heat sink according to an embodiment of the present invention is shown; Figure 8 A schematic diagram showing the connection between a heat sink and a power module according to an embodiment of the present invention; Fig. 9 The embodiment of the present invention is shown Figure 8 Enlarged view of point I in the middle.

[0017] In the figure, 1-bolt, 2-gasket, 3-power module, 4-heat sink substrate, 5-interface material, 6-fin, 7-1-first capillary channel, 7-2-second capillary channel, 8-cavity, 9-bolt hole. DETAILED DESCRIPTION

[0018] Various exemplary embodiments, features and aspects of the present invention will be described in detail below with reference to the accompanying drawings. The same reference numerals in the accompanying drawings represent elements with the same or similar functions. Although various aspects of the embodiments are shown in the accompanying drawings, the drawings are not necessarily drawn to scale unless otherwise specified.

[0019] The word “exemplary” is used exclusively herein to mean “serving as an example, example, or illustration.” Any embodiment described herein as “exemplary” is not necessarily to be construed as preferred or advantageous over other embodiments.

[0020] The term "and / or" herein is only a description of the association relationship of the associated objects, indicating that there may be three relationships. For example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone. In addition, the term "at least one" herein represents any combination of at least two of any one or more of a plurality of. For example, including at least one of A, B, and C can represent including any one or more elements selected from the set consisting of A, B, and C.

[0021] In addition, in order to better illustrate the present invention, numerous specific details are provided in the following specific embodiments. It should be understood by those skilled in the art that the present invention can be implemented without certain specific details. In some examples, methods, means, components and circuits well known to those skilled in the art are not described in detail in order to highlight the subject matter of the present invention.

[0022] Figure 2 A schematic structural diagram of a heat sink according to an embodiment of the present invention is shown; Figure 3 A cross-sectional view showing a capillary channel of a heat sink according to an embodiment of the present invention; Figure 4 The embodiment of the present invention is shown Figure 3 The enlarged image at point I in the middle; Figure 5 A cross-sectional view showing a heat pipe embedded in a heat sink according to an embodiment of the present invention; Figure 6 The embodiment of the present invention is shown Figure 5 The enlarged image at point I in the middle; Figure 7 A schematic diagram showing heat transfer of a heat sink according to an embodiment of the present invention is shown; Figure 8 A schematic diagram showing the connection between a heat sink and a power module according to an embodiment of the present invention; Fig. 9 The embodiment of the present invention is shown Figure 8 The enlarged picture at point I in the middle. Figure 2-9As shown, a power module heat sink comprises: a heat sink substrate 4 and fins 6; the fins 6 are located on one side of the outside of the heat sink substrate 4; an embedded heat pipe is arranged inside the heat sink substrate 4, and the inside of the embedded heat pipe is filled with condensate; the inside of the embedded heat pipe, on the inner wall on the side away from the fins 6, is provided with a first capillary channel 7-1 extending from the heat source end of the heat sink substrate 4 to the cold end, and the first capillary channel 7-1 is used to make the condensate inside the embedded heat pipe close to the cold end flow to the hot end faster; the fins 6 have a predetermined bending angle, and the surface of the fins 6 is wavy; the side of the outside of the heat sink substrate 4 away from the fins 6 is connected to the power module 3.

[0023] In the present invention, the heat sink substrate 4 is connected to the power module 3 via bolts 1 and gaskets 2 .

[0024] In the embodiment of the present invention, Figure 2 As shown, the power module 3 is fixed on a side of the heat sink substrate 4 away from the fins 6 , and is located in the middle of the heat sink substrate 4 .

[0025] The portion of the heat sink substrate 4 corresponding to the power module 3, i.e., the middle portion, is the hot end, and the portion away from the power module 3, i.e., the surrounding portion, is the cold end. The capillary channel is a wire groove arranged on the inner wall of the embedded heat pipe, located on the side opposite to the fin 6, and a plurality of capillary channels are evenly distributed on the inner wall of the embedded heat pipe.

[0026] The heat generated during the operation of the power module 3 after startup is transferred to the inside of the embedded heat pipe through the metal heat sink substrate 4. When the temperature reaches a predetermined value, the condensate inside the embedded heat pipe absorbs heat, liquefies and evaporates, and gradually diffuses from the middle hot end to the surroundings, bringing the heat to the far end of the heat sink, that is, diffusing from the hot end to the cold end. In this process, the condensate diffused to the far end of the heat sink returns to the evaporation end (hot end) through capillary force with the help of the capillary channel. The condensate circulation process is as follows: Figure 7 As shown, Figure 7 A is the cold end and B is the hot end.

[0027] Compared with traditional radiators, the structure of the present invention can achieve rapid heat transfer in a shorter time, avoid heat concentration in the center of the radiator, and enhance the heat dissipation capacity around the edges of the radiator. By embedding the heat pipe structure in the metal substrate, the radiator can achieve more efficient heat conduction in a smaller volume and size.

[0028] The heat of the radiator substrate 4 will be transferred to the fins 6 at the same time, and the heat dissipation effect can be improved through the fins 6. The surface of the fins 6 is set to be wavy, which can further increase the heat dissipation area.

[0029] In the present invention, a bolt hole 9 for connecting the power module 3 is provided on the radiator substrate 4, and the bolt hole 9 passes through the embedded heat pipe. The interior of the bolt hole 9 and the corresponding part of the embedded heat pipe are a closed structure; a second capillary channel 7-2 is provided on the side away from the fin 6 in the same direction as the two ends of the first capillary channel 7-1 and inside the embedded heat pipe corresponding to the position of the bolt hole 9; the second capillary channel 7-2 is perpendicular to the first capillary channel 7-1; the two ends of the second capillary channel 7-2 are connected to the adjacent first capillary channel 7-1.

[0030] In the embodiment of the present invention, with the continuous development of electronic equipment, the design and layout of the circuit board are also constantly optimized. However, the forward placement of the circuit board is prone to dust accumulation, and long-term dust accumulation may cause the circuit board to short-circuit, overheat or damage, affecting the normal use and reliability of the equipment. Therefore, in order to reduce the accumulation and influence of dust, more and more circuit boards are placed sideways or in reverse. Although this placement method can reduce the interference of dust on the circuit board, it also brings new problems, especially in the installation of the radiator connected to the power module 3. Due to the change in the placement of the circuit board, the traditional radiator installation method may not meet the new requirements. In particular, the connection between the radiator and the power module 3 needs to be more firm and stable. Therefore, appropriate bolt holes 9 need to be designed around the radiator for tight fixation with other components. The design of these bolt holes 9 not only ensures good contact and heat dissipation effect between the radiator and the power module 3, but also improves the fixity and structural stability of the radiator to prevent the radiator from loosening due to changes in the external environment or vibration during long-term use, thereby affecting the heat dissipation performance. The bolt holes 9 on the radiator are precisely processed to ensure that their apertures are completely matched with the size of the bolts 1, thereby providing a stable positioning basis for the installation of the bolts 1.

[0031] like Figure 3 and Figure 4 As shown, the position of the bolt hole 9 corresponds to the installation position of the power module 3, that is, the middle part of the substrate. Since the area covered by the capillary channel passes through the position of the bolt hole 9 reserved for fixing the power module 3, the capillary channel on both sides of the bolt hole 9 and the first capillary channel 7-1 in the same direction cannot be designed as a channel in the same direction as the first capillary channel 7-1, that is, arranged left and right, but is designed to be connected to the first capillary channel 7-1 and perpendicular to each other, that is, arranged up and down, The second capillary channel 7-2 is designed so that the condensate on both sides of the bolt 1 is discharged to the first capillary channel 7-1 and then flows back to the heat source end.

[0032] During installation, the bolt 1 passes through the screw holes on the intelligent power module 3 and the heat sink substrate 4, and uses the auxiliary effect of the spring washer to complete a high-strength connection.

[0033] In the present invention, the width and depth of the first capillary channel 7-1 and / or the second capillary channel 7-2 are designed according to the maximum temperature generated when the power module 3 is working. The higher the maximum temperature, the greater the width and depth of the first capillary channel 7-1 and the second capillary channel 7-2; wherein, the width of the first capillary channel 7-1 and / or the second capillary channel 7-2 ranges from 0.1 to 0.3 mm; wherein, the distance between two adjacent first capillary channels 7-1 and / or the second capillary channels 7-2 ranges from 0.3 to 0.5 mm.

[0034] In the embodiment of the present invention, the capillary channel is usually processed by laser drilling or micro milling to ensure that the condensate can flow smoothly and effectively flow back to the evaporation end (hot end). The higher the temperature, the greater the amount of reflux required, and the greater the width and depth of the designed capillary channel. However, if the capillary channel is designed to be too deep or too wide, the capillary force will be reduced. Therefore, the optimal width of the capillary channel is 0.2mm; the depth is designed according to the actual substrate thickness; the optimal interval between two capillary channels is 0.4mm.

[0035] The present invention also includes: an air cooling device; a plurality of fins 6 are evenly distributed on the radiator substrate 4 at equal distances; after the air cooling device is started, the wind blown out is blown in from one end of the fin 6, and blown out from the other end after passing through the fin 6.

[0036] In the embodiment of the present invention, the heat of the power module 3 is transferred to the fins 6 through the substrate, and the air cooling device is started to dissipate the heat of the fins 6 by means of the cold air blown out by the air cooling device.

[0037] The cold air from the air cooling device can fully utilize all the fins 6 for heat dissipation, thereby avoiding the problem that the fins 6 far from the heat source are difficult to participate in the heat dissipation process, thereby improving the heat dissipation efficiency.

[0038] In the present invention, one side of the fin 6 is connected to the heat sink substrate 4, and the fin 6 has a predetermined bending angle to form a bending arc between one end and the other end thereof; wherein the value range of the predetermined bending angle is 25-35°.

[0039] In an embodiment of the present invention, the fin 6 of the heat sink is designed to have a curved structure in cross section to optimize the airflow path and improve the heat dissipation effect. Most of the traditional heat sink fins 6 are simple linear structures, and stagnation often occurs when the airflow blown out by the air cooling device flows, affecting the heat dissipation effect. In the present invention, the fin 6 is designed as a curved structure, which can better guide the airflow to flow through the surface of the fin 6. The curved surface design can reduce the turbulence in the airflow and increase the contact area between the airflow and the surface of the fin 6, thereby improving the heat exchange efficiency. The airflow on the curved fin 6 flows more evenly, so that the heat can be more effectively transferred from the metal heat sink substrate 4 of the heat sink to the fin 6, and then the heat is taken away by the air. This optimized airflow path can significantly improve the overall heat dissipation performance of the heat sink, and is particularly suitable for the heat dissipation requirements of high-power modules 3.

[0040] In the present invention, the direction of the wave crest line on the surface of the fin 6 is consistent with the direction of the two ends of the fin 6.

[0041] In the embodiment of the present invention, a wavy surface is provided on the heat sink fin 6, which can further increase the heat dissipation surface area. Although the traditional flat fin 6 design can provide a certain surface area, its efficiency is usually limited by the contact between the surface and the airflow. In order to maximize the heat exchange effect of the heat sink, the present invention designs a wavy surface on the surface of the fin 6, so that the surface area of ​​the fin 6 can be increased.

[0042] When dissipating heat, the cold air blown out by the air cooling device is blown in from one end of the fin 6, and blows along the curved surface of the fin 6 and the direction of the wave crest. The wavy structure can effectively increase the contact area between the airflow and the surface of the fin 6, and at the same time can also avoid excessive stagnation of the airflow and reduce the phenomenon of heat accumulation. Through this wavy structure, the radiator can provide more surface area for air to exchange heat, thereby increasing the heat dissipation speed and improving the heat dissipation efficiency. This design not only helps to improve the heat dissipation performance, but also enables the radiator to achieve more efficient heat transfer in a limited space, meeting the needs of high-density heat dissipation of the power module 3.

[0043] In the present invention, if the material of the radiator substrate 4 and / or the fin 6 is aluminum alloy, the surface of the radiator substrate 4 and / or the fin 6 is provided with an anodized layer; if the material of the radiator substrate 4 and / or the fin 6 is copper, the surface of the radiator substrate 4 and / or the fin 6 is provided with an electroplating layer; the surface of the radiator substrate 4 and / or the fin 6 is also provided with a nano coating.

[0044] In the embodiment of the present invention, the heat sink is usually made of aluminum alloy or copper with high thermal conductivity as a base material. These materials have excellent thermal conductivity and can effectively dissipate the heat generated by the power module 3 to the external environment.

[0045] During production, the selected metal material will undergo preliminary cutting and shaping to achieve the required size and shape. This process is processed with high precision by CNC machine tools to ensure the accuracy of the metal substrate and prepare for subsequent processing.

[0046] The surfaces of the substrate and fins 6 need to be further precision-processed so that they can accommodate structures related to air flow optimization. At this time, the preset fin 6 area on the metal substrate is processed into a curved cross-section through rolling, stamping or laser cutting. This type of curved surface design can optimize the airflow path, ensure that the air forms a lower aerodynamic resistance when flowing inside the radiator, and improve the heat dissipation efficiency. During the entire processing of the fins 6, it is necessary to ensure the accuracy of the curved surface morphology in order to effectively expand the heat dissipation surface area and improve the heat dissipation effect.

[0047] In order to further improve the heat dissipation performance, the surface of the fin 6 needs to be specially processed. This includes processing of a wavy structure, and processing the edge of the heat dissipation fin 6 into a wavy shape through a special stamping or rolling process. The wavy surface helps to increase the surface area of ​​the fin 6, and effectively disrupts the airflow, increasing the turbulence of the air flow, thereby improving the overall heat dissipation capacity of the radiator. During the processing, the amplitude, wavelength and shape of the wave shape are ensured to be consistent by adjusting the parameters of the mold or equipment to avoid material stress concentration or deformation.

[0048] The power module 3 mounting area on the heat sink substrate 4 also needs to be precisely machined. CNC machine tools are usually used for drilling to machine bolt holes 9 at appropriate locations on the heat sink and fix the heat sink. After drilling, the bolt holes 9 are deburred to ensure the finish and accuracy of the threads so that the power module 3 can be smoothly installed on the heat sink and the heat sink can be fixed.

[0049] The final stage of manufacturing is surface treatment. The surface treatment of the heat sink can be done by anodizing, electroplating or nano-coating to improve its corrosion resistance and durability. The anodizing process is mainly applicable to aluminum alloy materials. It can form an oxide film on the metal surface, improve the corrosion resistance of the heat sink, and increase the hardness of the surface. For copper heat sinks, electroplating is used to avoid oxidation and corrosion. Nano-coating can provide a thin and uniform thermal conductive coating on the surface of the heat sink, further improving the heat dissipation efficiency and thermal radiation performance.

[0050] After all processing and surface treatment are completed, the final product of each heat sink will undergo strict quality inspection to ensure that the size, surface finish and processing accuracy meet the design requirements. In addition, to verify the performance of the heat sink, thermal performance tests and mechanical strength tests will also be carried out to ensure its heat dissipation efficiency and durability in actual use. The entire manufacturing process strictly controls every detail to ensure that the final product can effectively improve the heat dissipation performance of the power module 3 and has good long-term reliability.

[0051] In the present invention, an interface material 5 with high thermal conductivity is provided between the power module 3 and the heat sink substrate 4; wherein the interface material 5 with high thermal conductivity is thermal grease or a thermal gasket.

[0052] In the embodiment of the present invention, Figure 8 , Fig. 9 As shown, between the contact surfaces of the intelligent power module 3 and the heat sink substrate 4, an interface material 5 with high thermal conductivity, namely, thermal grease or thermal pad, is used to enhance the heat transfer efficiency.

[0053] In the present invention, the embedded heat pipe is a cavity 8 structure arranged inside the radiator substrate 4.

[0054] In the embodiment of the present invention, a cavity 8 structure is manufactured in the metal substrate of the heat sink, and the heat pipe effect is achieved by filling condensate, forming an "embedded heat pipe" structure, such as Figure 5 , Figure 6 The cavity 8 and capillary channel shown are heat pipe structures. By utilizing the efficient heat conduction characteristics of the embedded heat pipe, the condensate is filled into the cavity 8 of the metal heat sink substrate 4 itself, simulating the working principle of the heat pipe, without the need to re-set the heat pipe inside, and reducing the manufacturing cost.

[0055] In the manufacturing process, in order to form the overall structure of the heat sink, the metal substrate is first processed into a predetermined shape, and an area on its surface is designed to accommodate the cavity 8. The design of the cavity 8 needs to ensure that it has sufficient area and depth on the substrate surface to allow subsequent filling of condensate and to ensure capillary reflux of the liquid. In order to process this cavity 8, precise milling technology or laser processing technology can be used.

[0056] It can be understood that the above-mentioned various embodiments mentioned in the present invention can be combined with each other to form a combined embodiment without violating the principle logic. Due to space limitations, the present invention will not go into details.

[0057] The present invention effectively solves the problem of mismatch between the size of the traditional radiator and the power module by manufacturing a cavity in the metal substrate of the radiator and filling it with condensate to form an "embedded heat pipe" structure. Through this design, the condensate can quickly flow back from the condensation end to the evaporation end under the action of the capillary channel, ensuring efficient conduction and uniform distribution of heat. Compared with the traditional radiator design, the present invention can extend the heat dissipation effect of the radiator from the central area to the surrounding area, greatly improving the heat dissipation efficiency. In addition, the fin design with a curved cross-section effectively optimizes the air flow path, reduces the resistance of the air flow, and improves the convection efficiency of the air flow. Compared with traditional flat fins, this curved surface structure can better adapt to air flow, reduce thermal resistance, and improve heat exchange capacity. Combined with the processing of the wavy surface on the fin surface, the surface area of ​​the fin is further increased, and the turbulence effect is increased by disturbing the air flow, thereby greatly improving the heat dissipation performance. In general, the present invention effectively improves the heat dissipation performance of the power module 3 through an innovative radiator structure, solves the problems of excessive heat dissipation and uneven heat dissipation in the prior art, and provides a new solution for efficient heat dissipation of the power module 3.

[0058] The embodiments of the present invention have been described above, and the above description is exemplary, not exhaustive, and is not limited to the disclosed embodiments. Many modifications and variations will be apparent to those of ordinary skill in the art without departing from the scope and spirit of the described embodiments. The selection of terms used herein is intended to best explain the principles of the embodiments, practical applications, or technical improvements in the market, or to enable other persons of ordinary skill in the art to understand the embodiments disclosed herein.

Claims

1. A power module heat sink, characterized in that: include: A heat sink substrate (4) and fins (6); The fin (6) is located on one side of the outside of the heat sink substrate (4); An embedded heat pipe is arranged inside the radiator substrate (4), and the embedded heat pipe is filled with condensate; A first capillary channel (7-1) extending from the heat source end of the heat sink substrate (4) to the cold end is provided on the inner wall of the embedded heat pipe on the side away from the fin (6), wherein the first capillary channel (7-1) is used to enable condensate near the cold end inside the embedded heat pipe to flow to the hot end more quickly; The fin (6) has a predetermined bending angle, and the surface of the fin (6) is wavy; The side of the outside of the heat sink substrate (4) away from the fins (6) is connected to the power module (3).

2. The power module heat sink according to claim 1, characterized in that: The heat sink substrate (4) is provided with a bolt hole (9) for connecting the power module (3), the bolt hole (9) passes through the embedded heat pipe, and the interior of the bolt hole (9) and the corresponding part of the embedded heat pipe are a closed structure; A second capillary channel (7-2) is provided in the same direction as both ends of the first capillary channel (7-1) and inside the embedded heat pipe at a portion corresponding to the position of the bolt hole (9) and away from the fin (6); The second capillary channel (7-2) and the first capillary channel (7-1) are perpendicular to each other; Both ends of the second capillary channel (7-2) are connected to the adjacent first capillary channel (7-1).

3. The power module heat sink according to claim 1, characterized in that: The width and depth of the first capillary channel (7-1) and / or the second capillary channel (7-2) are designed according to the maximum temperature generated when the power module (3) is in operation; the higher the maximum temperature, the greater the width and depth of the first capillary channel (7-1) and the second capillary channel (7-2); Wherein, the width of the first capillary channel (7-1) and / or the second capillary channel (7-2) ranges from 0.1 to 0.3 mm; Wherein, the distance between two adjacent first capillary channels (7-1) and / or second capillary channels (7-2) is in the range of 0.3 to 0.5 mm.

4. The power module heat sink according to claim 1, characterized in that: One side of the fin (6) is connected to the heat sink substrate (4), and the fin (6) has a predetermined bending angle so that a bending arc is formed between one end and the other end thereof; The predetermined bending angle ranges from 25 to 35 degrees.

5. The power module heat sink according to claim 4, characterized in that: The direction of the wave crest line on the surface of the fin (6) is consistent with the direction of the two ends of the fin (6).

6. The power module heat sink according to claim 1, characterized in that: If the material of the heat sink substrate (4) and / or the fins (6) is an aluminum alloy, the surface of the heat sink substrate (4) and / or the fins (6) is provided with an anodized layer; If the material of the heat sink substrate (4) and / or the fins (6) is copper, an electroplating layer is provided on the surface of the heat sink substrate (4) and / or the fins (6); The surface of the heat sink substrate (4) and / or the fins (6) is also provided with a nano coating.

7. The power module heat sink according to claim 1, characterized in that: An interface material (5) with high thermal conductivity is provided between the power module (3) and the heat sink substrate (4); Wherein, the high thermal conductivity interface material (5) is thermal conductive silicone grease or a thermal conductive gasket.

8. The power module heat sink according to claim 1, characterized in that: The embedded heat pipe is a cavity (8) structure arranged inside the radiator substrate (4).

9. The power module heat sink according to claim 1, characterized in that: The heat sink substrate (4) is connected to the power module (3) via bolts (1) and gaskets (2).

10. The power module heat sink according to claim 1, characterized in that: Also includes: Air cooling device; A plurality of fins (6) are evenly distributed at equal distances on the heat sink substrate (4); After the air cooling device is started, the air blown out is blown in from one end of the fin (6), and blown out from the other end after passing through the fin (6).

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