High-speed high-precision intelligent chip mounter

Abstract

The invention discloses a high-speed high-precision intelligent chip mounter which comprises a working platform, and a conveying line assembly for conveying a substrate in the X direction is arranged in the middle of the working platform. Automatic feeding, adjusting and pasting devices are symmetrically arranged on the two sides of the working platform, and elements are pasted on the base plates on the conveying line assembly from the two sides through the automatic feeding, adjusting and pasting devices; the single-side automatic feeding, adjusting and pasting device comprises a material box feeding mechanism, a first transfer table, a material taking and transferring mechanism, a second transfer table and a pasting mechanism, an external sheet taking mechanism transfers elements to the first transfer table from the material box feeding mechanism, the first transfer table conducts fine adjustment in the horizontal plane, the material taking and transferring mechanism transfers the elements to the second transfer table from the first transfer table, and the pasting mechanism conducts pasting on the elements. A plurality of elements are orderly arranged on the double-station transfer table II, and the surface mounting mechanism transfers and attaches the plurality of elements on the transfer table II to the substrate, so that the elements are accurately and efficiently attached to the substrate at a high speed, and the surface mounting device is particularly suitable for attaching the elements with multiple specifications and shapes.

Description

Technical Field

[0001] The present invention relates to the technical field of chip placement equipment, in particular to a high-speed and high-precision intelligent chip placement machine. Background Art

[0002] With the rapid development of electronic technology, especially the surging demand for high-performance circuit boards in emerging fields such as artificial intelligence, 5G, smart driving, AR / VR, high-performance computing (HPC), and the Internet of Things, traditional patch processing has been unable to meet the efficiency and precision requirements of modern production.

[0003] Although existing placement machines have achieved automation to a certain extent, there is still room for improvement in terms of bonding accuracy, production efficiency and equipment stability during high-speed operation.

[0004] Therefore, it is particularly important to develop a fully automatic high-speed placement machine that can maintain high bonding accuracy during high-speed operation and has multiple placement modes to accommodate components of various specifications and shapes. Summary of the invention

[0005] To solve the above problems, the present invention provides a high-speed and high-precision intelligent placement machine with a reasonable structure, so as to realize accurate, efficient and high-speed bonding of components to a substrate, which is particularly suitable for the attachment of components of various specifications and shapes.

[0006] The technical solution adopted by the present invention is as follows:

[0007] A high-speed and high-precision intelligent placement machine, comprising a working platform, a conveyor line assembly is arranged in the middle of the working platform along the X direction, and the conveyor line assembly conveys the substrate along the X direction; automatic feeding adjustment and placement devices are symmetrically arranged on the working platforms on both sides of the conveyor line assembly, and the automatic feeding adjustment and placement devices place components on the substrate on the conveyor line assembly from both sides;

[0008] The structure of the single-sided automatic loading, adjustment and pasting device is as follows: it includes a material box loading mechanism, a transfer table one, a material picking and transferring mechanism, a transfer table two, and a patch mechanism. The external chip picking mechanism transfers the components from the material box loading mechanism to the transfer table one, and the transfer table one performs fine adjustments in the horizontal plane. The material picking and transferring mechanism transfers the components from the transfer table one to the transfer table two. Multiple components are arranged in order on the double-station transfer table two, and the patch mechanism transfers multiple components on the transfer table two and attaches them to the substrate.

[0009] As a further improvement of the above technical solution:

[0010] A substrate platform is arranged in the middle of the conveyor line assembly, and the substrate platform is installed on the lifting mechanism. The lifting mechanism is operated to lift the substrate located in the conveyor line assembly upwards through the substrate platform.

[0011] The material box loading mechanism includes a loading platform installed on the lifting mechanism, and multiple material sheets are stacked up and down on the top surface of the loading platform. The external sheet taking mechanism transfers the material sheets to the transfer table one in an orderly manner.

[0012] The transfer table is installed on the working platform via an X-axis moving module and a Y-axis moving module. The transfer table rotates in a horizontal plane with its own axis as the center through a rotary motor, and the components are supported on the top surface of the transfer table.

[0013] A plurality of components are attached to the cutting film and supported on the first transfer table via the cutting film; a clamping member for flattening and fixing the circumferential edge of the cutting film is installed on the first transfer table.

[0014] The invention also includes a visual component one installed on one side of the transfer table facing outwards, and the visual component one takes an image and makes judgment on a component on the transfer table one, so as to drive the transfer table one to drive the component to adjust in a horizontal plane.

[0015] The material picking and transferring mechanism is located above the interval between transfer table one and transfer table two. The material picking and transferring mechanism is a turret structure. A plurality of suction nozzles are installed circumferentially on the bottom surface of the material picking and transferring mechanism. As the turret structure rotates, each suction nozzle successively picks up components from transfer table one and places them in order on transfer table two according to a preset quantity.

[0016] The second transfer platform is installed on the working platform via the X-direction moving module three, and the second transfer platform rotates in a horizontal plane with its own axis as the center of a circle via a rotary motor.

[0017] The patch mechanism is installed on the working platform via the X-axis moving module 2 and the Y-axis moving module 2, forming a gantry structure erected above the transfer table 2; a single-group patch mechanism includes a plurality of patch units arranged along the length direction of the X-axis moving module 2, the plurality of patch units are independently driven by corresponding driving units, and the plurality of patch units jointly take components from the transfer table 2 and attach them to the substrate.

[0018] A visual component three arranged upward is installed on the working platform located between the transfer table two and the conveyor line component, and a visual component two arranged downward is installed on the outside of the patch mechanism; after the patch unit grabs the component, the visual component three performs pre-patch inspection, and the visual component two performs post-patch inspection on the component on the substrate.

[0019] Compared with the prior art, the present invention has the following beneficial effects:

[0020] The present invention forms a symmetrical feeding mode through the symmetrical arrangement of the automatic loading and adjustment placement devices on both sides of the working platform, which effectively improves the placement speed; through the arrangement and coordinated use of the transfer table one, the transfer table two and the material picking and transferring mechanism, the precise position adjustment of the components can be achieved, and the placement mechanism can realize the simultaneous independent attachment of multiple components, thereby realizing the precise, efficient and high-speed attachment of the components to the substrate, and is particularly suitable for the attachment of components of multiple specifications and shapes. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a structural schematic diagram of the present invention.

[0022] Figure 2 It is a schematic diagram of the arrangement of the material box feeding mechanism of the present invention on the lifting mechanism.

[0023] Figure 3 It is a schematic diagram of the layout of the transfer station 1 of the present invention.

[0024] Figure 4 It is a schematic diagram of the layout of the material taking and transferring mechanism above the transfer table 1 and the transfer table 2 of the present invention.

[0025] Figure 5 It is a schematic diagram of the layout of the patch mechanism of the present invention.

[0026] Figure 6 It is a schematic diagram of the layout of the substrate platform at the conveyor line assembly of the present invention.

[0027] Among them: 1. Working platform; 2. Material box loading mechanism; 3. Transfer table 1; 4. Material picking and transferring mechanism; 5. SMT mechanism; 6. Transfer table 2; 7. Substrate platform;

[0028] 21. Lifting mechanism;

[0029] 31. Y-axis moving module 1; 32. Visual component 1; 33. X-axis moving module 1;

[0030] 51. Y-axis moving module 2; 52. X-axis moving module 2; 53. Visual component 2; 54. Visual component 3;

[0031] 61. X-axis moving module three;

[0032] 71. Conveyor line components. DETAILED DESCRIPTION

[0033] The specific implementation of the present invention will be described below in conjunction with the accompanying drawings.

[0034] like Figure 1As shown, the high-speed and high-precision intelligent placement machine of this embodiment includes a working platform 1, a conveyor line assembly 71 is arranged in the middle of the working platform 1 along the X direction, and the conveyor line assembly 71 conveys the substrate along the X direction; automatic feeding adjustment and placement devices are symmetrically arranged on the working platform 1 on both sides of the conveyor line assembly 71, and the automatic feeding adjustment and placement devices place components on the substrate on the conveyor line assembly 71 from both sides;

[0035] The structure of the single-sided automatic loading, adjustment and pasting device is as follows: it includes a material box loading mechanism 2, a transfer table 3, a material picking and transferring mechanism 4, a transfer table 6, and a patch mechanism 5. The external chip picking mechanism transfers the components from the material box loading mechanism 2 to the transfer table 3, and the transfer table 3 performs fine adjustments in the horizontal plane. The material picking and transferring mechanism 4 transfers the components from the transfer table 3 to the transfer table 2 6. Multiple components are arranged in order on the double-station transfer table 2 6, and the patch mechanism 5 transfers multiple components on the transfer table 2 6 and attaches them to the substrate.

[0036] In this embodiment, the symmetrical arrangement of the automatic loading and adjustment mounting devices on both sides of the working platform 1 is used to form a symmetrical feeding mode, which effectively improves the mounting speed; through the arrangement and coordinated use of the transfer table 1 3, the transfer table 2 6 and the material picking and transferring mechanism 4, the precise position adjustment of the components is achieved, and the mounting mechanism 5 can realize the simultaneous independent attachment of multiple components, thereby realizing the precise, efficient and high-speed mounting of the components on the substrate.

[0037] like Figure 2 As shown, the material box loading mechanism 2 includes a loading platform installed on the lifting mechanism 21, and multiple sheets of material are stacked on the top of the loading platform. The external sheet-taking mechanism transfers the sheets to the transfer table 3 in an orderly manner.

[0038] In this embodiment, the external film-taking mechanism can be a grasping mechanism such as a manipulator, a robot, a truss, etc., as long as it can realize the transfer of components.

[0039] In this embodiment, a plurality of components can be attached to a single sheet, and the components are transferred from the material box loading mechanism 2 to the transfer table 3 by sheet.

[0040] like Figure 3 As shown, the turntable 3 is installed on the working platform 1 via an X-axis moving module 33 and a Y-axis moving module 31. The turntable 3 rotates in a horizontal plane with its own axial direction as the center through a rotary motor, and the components are supported on the top surface of the turntable 3.

[0041] In this embodiment, the turntable 3 can rotate in the circumferential direction through the action of the rotary motor, move in the X direction through the action of the X-direction moving module 33, and move in the Y direction through the action of the Y-direction moving module 31, thereby realizing the movement and adjustment of the components thereon in the horizontal plane, especially the circumferential adjustment, through the turntable 3.

[0042] A plurality of components are attached to the cutting film to form a material sheet, and the material sheet is supported on a transfer table 3 via the cutting film; a clamping member for flattening and fixing the circumferential edge of the cutting film is installed on the transfer table 3.

[0043] In this embodiment, the cut film of the material sheet is flattened and clamped by the clamping member on the transfer table 3, thereby effectively ensuring the adjustment of each component in the horizontal plane and the accuracy of each component when the material picking and transferring mechanism 4 is used.

[0044] In this embodiment, the clamping member may adopt an existing conventional structure, such as a clamping member arranged along the circumferential direction.

[0045] It also includes a visual component 32 installed on the outside of the side of the transfer table 3. The visual component 32 takes an image of the component on the transfer table 3 and drives the transfer table 3 to drive the component to adjust in the horizontal plane, effectively ensuring the angle of the component in the horizontal plane.

[0046] like Figure 4 As shown, the material picking and transferring mechanism 4 is located above the interval between the transfer table 1 3 and the transfer table 2 6. The material picking and transferring mechanism 4 is a turret structure. A plurality of suction nozzles are installed circumferentially on the bottom surface of the material picking and transferring mechanism 4. As the turret structure rotates, each suction nozzle successively picks up components from the transfer table 1 3 and places them in order on the transfer table 2 6 according to a preset quantity.

[0047] In this embodiment, each component is sequentially taken from the transfer table 1 3 by the material picking and transferring mechanism 4 and arranged in order on the transfer table 2 6 . For example, a preset number of components are arranged in order along the X direction on the transfer table 2 6 , which is convenient for the patch mechanism 5 to pick up and attach.

[0048] The second transfer table 6 is installed on the working platform 1 via the X-direction moving module 3 61 , and the second transfer table 6 rotates in a horizontal plane with its own axial direction as the center of a circle via a rotary motor.

[0049] In this embodiment, the second transfer table 6 can move in the X direction through the action of the third X-direction moving module 61, so as to facilitate the arrangement of multiple components in the X direction on the second transfer table 6 in combination with the rotation of the material picking and transferring mechanism 4.

[0050] In this embodiment, the second transfer table 6 can be rotated and switched between the double stations by the action of the rotary motor, corresponding to the first transfer table 3 and the conveyor line assembly 71 on both sides.

[0051] like Figure 5As shown, the patch mechanism 5 is installed on the working platform 1 via the X-axis moving module 2 52 and the Y-axis moving module 2 51, forming a gantry structure mounted above the transfer table 2 6; the single-group patch mechanism 5 includes a plurality of patch units arranged along the length direction of the X-axis moving module 2 52, and the plurality of patch units are independently driven by corresponding driving units, and the plurality of patch units jointly take components from the transfer table 2 6 and attach them to the substrate.

[0052] In this embodiment, a single patch unit may include lifting power, circumferential rotation power, and an adsorbent located below, so that after the single patch unit adsorbs the component from the turntable 2 6, it can independently act to attach the component to a preset position on the substrate.

[0053] In this embodiment, each patch unit can act independently, which is convenient and meets the needs of attaching small batches and multiple varieties of components on the substrate.

[0054] A visual component three 54 arranged upward is installed on the working platform 1 located between the transfer table two 6 and the conveyor line component 71, and a visual component two 53 arranged downward is installed on the outer side of the patch mechanism 5; after the patch unit grabs the component, the visual component three 54 performs pre-patch inspection, and the visual component two 53 performs post-patch inspection on the component on the substrate, thereby effectively ensuring the attachment accuracy and precision of the component on the substrate.

[0055] like Figure 6 As shown, a substrate platform 7 is provided in the middle of the conveyor line assembly 71 , and the substrate platform 7 is installed on a lifting mechanism. The lifting mechanism operates to lift the substrate located on the conveyor line assembly 71 upwards through the substrate platform 7 .

[0056] In actual use, the substrate is transported in the X direction via the conveyor line assembly 71. When the substrate reaches the substrate platform 7, the lifting mechanism lifts the substrate upward via the substrate platform 7, making it convenient for the patch mechanisms 5 on both sides to attach components.

[0057] In this embodiment, the principle of multi-head simultaneous picking and simultaneous patching + high-definition camera + precise motion control is used, and its theoretical accuracy can reach ±5um@3σ and UPH can reach up to 45K.

[0058] The present invention realizes accurate, efficient and high-speed bonding of components to a substrate, and is particularly suitable for bonding components of various specifications and shapes.

[0059] The various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referenced to each other.

[0060] The above description is an explanation of the present invention, not a limitation of the present invention. The scope of the present invention is defined in the claims. Any form of modification may be made within the scope of protection of the present invention.

Claims

1. A high-speed and high-precision intelligent placement machine, comprising a working platform (1), characterized in that: A conveyor line assembly (71) is arranged in the middle of the working platform (1) along the X direction, and the conveyor line assembly (71) conveys the substrate along the X direction; automatic loading, adjusting and pasting devices are symmetrically arranged on the working platform (1) at both sides of the conveyor line assembly (71), and the automatic loading, adjusting and pasting devices paste components on the substrate on the conveyor line assembly (71) from both sides; The structure of the single-sided automatic loading, adjusting and pasting device is as follows: it includes a material box loading mechanism (2), a transfer table one (3), a material picking and transferring mechanism (4), a transfer table two (6), and a chip pasting mechanism (5); an external chip picking mechanism transfers components from the material box loading mechanism (2) to the transfer table one (3); the transfer table one (3) performs fine adjustment in a horizontal plane; the material picking and transferring mechanism (4) transfers components from the transfer table one (3) to the transfer table two (6); multiple components are arranged in order on the double-station transfer table two (6); and the chip pasting mechanism (5) transfers multiple components on the transfer table two (6) and pastes them onto a substrate.

2. The high-speed and high-precision intelligent placement machine according to claim 1, characterized in that: A substrate platform (7) is provided in the middle of the conveyor line assembly (71), and the substrate platform (7) is installed on a lifting mechanism. The lifting mechanism is operated to lift the substrate located on the conveyor line assembly (71) upwards through the substrate platform (7).

3. The high-speed and high-precision intelligent placement machine according to claim 1, characterized in that: The material box loading mechanism (2) includes a loading platform installed on a lifting mechanism (21), and multiple material sheets are stacked on the top of the loading platform. The external sheet removal mechanism transfers the material sheets to the transfer table (3) in an orderly manner.

4. The high-speed and high-precision intelligent placement machine according to claim 1, characterized in that: The transfer table (3) is installed on the working platform (1) via an X-axis moving module (33) and a Y-axis moving module (31). The transfer table (3) rotates in a horizontal plane with its own axis as the center through a rotary motor, and the components are supported on the top surface of the transfer table (3).

5. The high-speed and high-precision intelligent placement machine according to claim 1, characterized in that: A plurality of components are attached to the cutting film and supported on a transfer table (3) via the cutting film; a clamping member for flattening and fixing the circumferential edge of the cutting film is installed on the transfer table (3).

6. The high-speed and high-precision intelligent placement machine according to claim 1, characterized in that: It also includes a visual component (32) installed on the outside of the lateral side of the transfer table (3), and the visual component (32) takes an image of the components on the transfer table (3) to drive the transfer table (3) to adjust the components in the horizontal plane.

7. The high-speed and high-precision intelligent placement machine according to claim 1, characterized in that: The material picking and transferring mechanism (4) is located above the interval between the transfer table one (3) and the transfer table two (6). The material picking and transferring mechanism (4) is a turret structure. A plurality of suction nozzles are installed circumferentially on the bottom surface of the material picking and transferring mechanism (4). As the turret structure rotates, each suction nozzle successively picks up components from the transfer table one (3) and places them on the transfer table two (6) in an orderly manner according to a preset number.

8. The high-speed and high-precision intelligent placement machine according to claim 1, characterized in that: The second transfer table (6) is installed on the working platform (1) via the X-direction moving module (61), and the second transfer table (6) rotates in a horizontal plane with its own axial direction as the center of the circle via a rotary motor.

9. The high-speed and high-precision intelligent placement machine according to claim 1, characterized in that: The patch mechanism (5) is installed on the working platform (1) via the second X-axis moving module (52) and the second Y-axis moving module (51), forming a gantry structure erected above the second transfer table (6); a single-group patch mechanism (5) includes a plurality of patch units arranged along the length direction of the second X-axis moving module (52), the plurality of patch units are independently driven by corresponding driving units, and the plurality of patch units jointly take components from the second transfer table (6) and attach them to a substrate.

10. The high-speed and high-precision intelligent placement machine according to claim 1, characterized in that: A visual component three (54) arranged upward is installed on the working platform (1) between the transfer table two (6) and the conveyor line component (71), and a visual component two (53) arranged downward is installed on the outer side of the patch mechanism (5); after the patch unit grabs the component, it is subjected to pre-patch inspection by the visual component three (54), and the visual component two (53) performs post-patch inspection on the component on the substrate.

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